IK Semicon IN74HC4051AN Analog multiplexer demultiplexer high-performance silicon-gate cmo Datasheet

TECHNICAL DATA
IN74HC4051A
Analog Multiplexer Demultiplexer
High-Performance Silicon-Gate CMOS
The IN74HC4051A utilize silicon-gate CMOS technology to achieve
fast propagation delays, low ON resistances, and low OFF leakage
currents. These analog multiplexers/demultiplexers control analog
voltages that may vary across the complete power supply range (from VCC
to VEE).
The Channel-Select inputs determine which one of the Analog
Inputs/Outputs is to be connected, by means of an analog switch, to the
Common Output/Input.When the Enable pin is high, all analog switches
are turned off.
The Channel-Select and Enable inputs are compatible with standard
CMOS outputs; with pullup resistors, they are compatible with
LS/ALSTTL outputs.
• Fast Switching and Propagation Speeds
• Low Crosstalk Between Switches
• Diode Protection on All Inputs/Outputs
• Analog Power Supply Range (VCC-VEE)=2.0 to 12.0 V
• Digital (Control) Power Supply Range (VCC-GND)=2.0 to 6.0 V
• Low Noise
ORDERING INFORMATION
IN74HC4051AN Plastic
IN74HC4051ADW SOIC
TA = -55° to 125° C for all packages
PIN ASSIGNMENT
LOGIC DIAGRAM
Single-Pole, 8-Position Plus Common Off
FUNCTION TABLE
Control Inputs
Enable
PIN 16 =VCC
PIN 7 = VEE
PIN 8 = GND
ON
Select
Channels
C
B
A
L
L
L
L
X0
L
L
L
H
X1
L
L
H
L
X2
L
L
H
H
X3
L
H
L
L
X4
L
H
L
H
X5
L
H
H
L
X6
L
H
H
H
X7
H
X
X = don’t care
X
X
None
Rev. 00
IN74HC4051A
MAXIMUM RATINGS*
Symbol
Parameter
Value
Unit
VCC
Positive DC Supply Voltage (Referenced to GND)
(Referenced to VEE)
-0.5 to +7.0
-0.5 to +14.0
V
VEE
Negative DC Supply Voltage (Referenced to GND)
-7.0 to +0.5
V
VIS
Analog Input Voltage
VEE - 0.5 to VCC+0.5
V
VIN
Digital Input Voltage (Referenced to GND)
-1.5 to VCC +1.5
V
DC Input Current Into or Out of Any Pin
±25
mA
Power Dissipation in Still Air, Plastic DIP+
SOIC Package+
750
500
mW
-65 to +150
°C
260
°C
I
PD
Tstg
Storage Temperature
TL
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic DIP or SOIC Package)
*
Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
+Derating - Plastic DIP: - 10 mW/°C from 65° to 125°C
SOIC Package: : - 7 mW/°C from 65° to 125°C
RECOMMENDED OPERATING CONDITIONS
Symbol
Min
Max
Unit
VCC
Positive Supply Voltage (Referenced to GND)
(Referenced to VEE)
2.0
2.0
6.0
12.0
V
VEE
Negative DC Supply Voltage (Referenced to GND)
- 6.0
GND
V
VIS
Analog Input Voltage
VEE
VCC
V
VIN
Digital Input Voltage (Referenced to GND)
GND
VCC
V
-
1.2
V
-55
+125
°C
0
0
0
1000
500
400
ns
VIO
*
Parameter
*
Static or Dynamic Voltage Across Switch
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time (Channel Select
or Enable Inputs)
VCC =2.0 V
VCC =4.5 V
VCC =6.0 V
For voltage drops across the switch greater than 1.2 V (switch on), excessive VCC current may be drawn;
i. e., the current out of the switch may contain both VCC and switch input components. The reliability of the device
will be unaffected unless the Maximum Ratings are exceeded.
This device contains protection circuitry to guard against damage due to high static voltages or electric fields.
However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this
high-impedance circuit. For proper operation, VIN and VOUT should be constrained to the range indicated in the
Recommended Operating Conditions..
Unused digital input pins must always be tied to an appropriate logic voltage level (e.g., either GND or VCC).
Unused Analog I/O pins may be left open or terminated.
Rev. 00
IN74HC4051A
DC ELECTRICAL CHARACTERISTICS Digital Section (Voltages Referenced to GND) VEE=GND,
Except Where Noted
VCC
Symbol
Parameter
Test Conditions
Guaranteed Limit
V
25 °C to
-55°C
≤85
°C
≤125
°C
Unit
VIH
Minimum High-Level
Input Voltage,
Channel-Select or
Enable Inputs
RON = Per Spec
2.0
4.5
6.0
1.5
3.15
4.2
1.5
3.15
4.2
1.5
3.15
4.2
V
VIL
Maximum Low -Level
Input Voltage,
Channel-Select or
Enable Inputs
RON = Per Spec
2.0
4.5
6.0
0.3
0.9
1.2
0.3
0.9
1.2
0.3
0.9
1.2
V
IIN
Maximum Input
Leakage Current,
Channel-Select or
Enable Inputs
VIN=VCC or GND,
VEE=-6.0 V
6.0
±0.1
±1.0
±1.0
μA
ICC
Maximum Quiescent
Supply Current (per
Package)
Channel Select = VCC or GND
Enable = VCC or GND
VIS = VCC or GND
VEE = GND
VIO= 0 V
VEE = - 6.0
μA
6.0
6.0
2
8
20
80
40
160
DC ELECTRICAL CHARACTERISTICS Analog Section
Symbol
Parameter
RON
Maximum “ON” Resistance
VCC
VEE
V
V
25 °C to
-55°C
VIN=VIL or VIH
VIS = VCC or VEE
IS ≤ 2.0 mA(Figure 1)
4.5
4.5
6.0
0.0
-4.5
-6.0
190
120
100
240
150
125
280
170
140
VIN=VIL or VIH
VIS = VCC or VEE
(Endpoints)
IS ≤ 2.0 mA(Figure 1)
4.5
4.5
0.0
-4.5
150
100
190
125
230
140
6.0
-6.0
80
100
115
Test Conditions
Guaranteed Limit
≤85 ≤125 Unit
°C
°C
Ω
ΔRON
Maximum Difference in
“ON” Resistance Between
Any Two Channels in the
Same Package
VIN=VIL or VIH
VIS = 1/2 (VCC- VEE)
IS ≤ 2.0 mA
4.5
4.5
6.0
0.0
-4.5
-6.0
30
12
10
35
15
12
40
18
14
Ω
IOFF
Maximum Off- Channel
Leakage Current, Any One
Channel
VIN=VIL or VIH
VIO= VCC- VEE
Switch Off (Figure 2)
6.0
-6.0
0.1
0.5
1.0
μA
Maximum Off- Channel
Leakage Current, Common
Channel
VIN=VIL or VIH
VIO = VCC- VEE
Switch Off (Figure 3)
6.0
-6.0
0.2
2.0
4.0
Maximum On- Channel
Leakage Current, Channel to
Channel
VIN=VIL or VIH
Switch to Switch =
VCC- VEE (Figure 4)
6.0
-6.0
0.2
2.0
4.0
ION
μA
Rev. 00
IN74HC4051A
AC ELECTRICAL CHARACTERISTICS (CL=50pF,Input tr=tf=6.0 ns)
Guaranteed Limit
VCC
Symbol
Parameter
V
25 °C
to
-55°C
≤85°C
≤125°C
Unit
tPLH, tPHL
Maximum Propagation Delay, Channel-Select to
Analog Output (Figures 8 and 9)
2.0
4.5
6.0
370
74
63
465
93
79
550
110
94
ns
tPLH, tPHL
Maximum Propagation Delay , Analog Input to
Analog Output (Figures 10 and 11)
2.0
4.5
6.0
60
12
10
75
15
13
90
18
15
ns
tPLZ, tPHZ
Maximum Propagation Delay , Enable to Analog
Output (Figures 12 and 13)
2.0
4.5
6.0
290
58
49
364
73
62
430
86
73
ns
tPZL, tPZH
Maximum Propagation Delay , Enable to Analog
Output (Figures 12 and 13)
2.0
4.5
6.0
345
69
59
435
87
74
515
103
87
ns
CIN
Maximum Input Capacitance, Channel-Select or
Enable Inputs
-
10
10
10
pF
CI/O
Maximum Capacitance
Analog I/O
-
35
35
35
pF
Common O/I
-
130
130
130
Feedthrough
-
1.0
1.0
1.0
CPD
All Switches Off
Power Dissipation Capacitance (Per Package)
(Figure 14)
Typical @25°C,VCC=5.0 V, VEE=0
V
Used to determine the no-load dynamic power
consumption:
PD=CPDVCC2f+ICCVCC
45
pF
Rev. 00
IN74HC4051A
ADDITIONAL APPLICATION CHARACTERISTICS (GND = 0.0 V)
Symbol
BW
-
Parameter
Test Conditions
Maximum OnChannel
Bandwidth or
Minimum
Frequency
Response
(Figure 5)
fin=1 MHz Sine Wave
Adjust fin Voltage to Obtain 0 dBm at VOS
Increase fin Frequence Until dB Meter
Reads -3 dB
RL =50 Ω, CL=10 pF
Off-Channel
Feedthrough
Isolation
(Figure 6)
fin= Sine Wave
Adjust fin Voltage to Obtain 0 dBm at VIS
fin = 10 kHz, RL =600 Ω, CL=50 pF
fin = 1.0 MHz, RL =50 Ω, CL=10 pF
-
Feedthrough
Noise, Channel
Select Input to
Common O/I
(Figure 7)
VIN≤ 1 Mhz Square Wave (tr = tf = 6 ns)
Adjust RL at Setup so that IS= 0 A Enable =
GND
RL =600 Ω, CL=50 pF
RL =10 Ω, CL=10 pF
THD
Total Harmonic
Distortion
(Figure 15)
fin= 1 kHz, RL =10 kΩ, CL=50 pF
THD = THDMeasured - THDSource
VIS =4.0 VPP sine wave
VIS =8.0 VPP sine wave
VIS =11.0 VPP sine wave
VCC
VEE
Limit*
V
V
25 °C
Unit
MHz
2.25
4.50
6.00
-2.25
-4.50
-6.00
80
80
80
dB
2.25
4.50
6.00
-2.25
-4.50
-6.00
-50
-50
-50
2.25
4.50
6.00
-2.25
-4.50
-6.00
-40
-40
-40
mVPP
2.25
4.50
6.00
-2.25
-4.50
-6.00
25
105
135
2.25
4.50
6.00
-2.25
-4.50
-6.00
35
145
190
%
2.25
4.50
6.00
-2.25
-4.50
-6.00
0.10
0.08
0.05
* Limits not tested. Determined by design and verified by qualification.
Figure 1. On Resistance Test Set-Up
Rev. 00
IN74HC4051A
Figure 2. Maximum Off Channel Leakage
Current, Any One Channel, Test Set-UP
Figure 3. Maximum Off Channel Leakage Current,
Common Channel, Test Set-UP
* Includes all probe and jig capacitance.
Figure 4. Maximum On Channel Leakage
Current, Channel to Channel, Test Set-UP
Figure 5. Maximum On Channel Bandwidth,
Test Set-UP
* Includes all probe and jig capacitance.
* Includes all probe and jig capacitance.
Figure 6. Off Channel Feedthrough Isolation,
Test Set-UP
Figure 7.Feedthrough Noise, Channel Select to Common
Out, Test Set-UP
Rev. 00
IN74HC4051A
* Includes all probe and jig capacitance.
Figure 8. Switching Weveforms
Figure 9. Test Set-UP, Channel Select to Analog Out
Figure 10. Switching Weveforms
Figure 11. Test Set-UP, Analog In to Analog Out
Figure 12. Switching Weveforms
Figure 13. Test Set-UP, Enable to Analog Out
* Includes all probe and jig capacitance.
Rev. 00
IN74HC4051A
Figure 14. Power Dissipation Capacitance,
Test Set-Up
* Includes all probe and jig capacitance
Figure 15. Total Harmonic Distortion, Test Set-UP
EXPANDED LOGIC DIAGRAM
Rev. 00
IN74HC4051A
N SUFFIX PLASTIC DIP
(MS - 001BB)
A
Dimension, mm
9
16
Symbol
MIN
MAX
A
18.67
19.69
B
6.1
7.11
B
1
8
5.33
C
F
L
C
D
0.36
0.56
F
1.14
1.78
G
2.54
H
7.62
-T- SEATING
PLANE
N
G
K
M
H
D
J
0.25 (0.010) M T
NOTES:
1. Dimensions “A”, “B” do not include mold flash or protrusions.
Maximum mold flash or protrusions 0.25 mm (0.010) per side.
J
0°
10°
K
2.92
3.81
L
7.62
8.26
M
0.2
0.36
N
0.38
D SUFFIX SOIC
(MS - 012AC)
Dimension, mm
A
16
9
H
B
1
G
P
8
R x 45
C
-TK
D
SEATING
PLANE
J
0.25 (0.010) M T C M
NOTES:
1. Dimensions A and B do not include mold flash or protrusion.
2. Maximum mold flash or protrusion 0.15 mm (0.006) per side
for A; for B ‑ 0.25 mm (0.010) per side.
F
M
Symbol
MIN
MAX
A
9.8
10
B
3.8
4
C
1.35
1.75
D
0.33
0.51
F
0.4
1.27
G
1.27
H
5.72
J
0°
8°
K
0.1
0.25
M
0.19
0.25
P
5.8
6.2
R
0.25
0.5
Rev. 00
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