ON NCP2890AFCT2 1.0 watt audio power amplifier Datasheet

NCP2890, NCV2890
1.0 Watt Audio Power
Amplifier
The NCP2890 is an audio power amplifier designed for portable
communication device applications such as mobile phone
applications. The NCP2890 is capable of delivering 1.0 W of
continuous average power to an 8.0 BTL load from a 5.0 V power
supply, and 320 mW to a 4.0 BTL load from a 2.6 V power supply.
The NCP2890 provides high quality audio while requiring few
external components and minimal power consumption. It features a
low−power consumption shutdown mode, which is achieved by
driving the SHUTDOWN pin with logic low.
The NCP2890 contains circuitry to prevent from “pop and click”
noise that would otherwise occur during turn−on and turn−off
transitions.
For maximum flexibility, the NCP2890 provides an externally
controlled gain (with resistors), as well as an externally controlled
turn−on time (with the bypass capacitor).
Due to its excellent PSRR, it can be directly connected to the
battery, saving the use of an LDO.
This device is available in a 9−Pin Flip−Chip CSP (standard
Tin−Lead and Lead−Free versions) and a Micro8t package.
Features
•
•
•
•
•
•
•
•
•
•
•
•
1.0 W to an 8.0 BTL Load from a 5.0 V Power Supply
Excellent PSRR: Direct Connection to the Battery
“Pop and Click” Noise Protection Circuit
Ultra Low Current Shutdown Mode
2.2 V−5.5 V Operation
External Gain Configuration Capability
External Turn−on Time Configuration Capability
Up to 1.0 nF Capacitive Load Driving Capability
Thermal Overload Protection Circuitry
AEC−Q100 Qualified Part Available
Pb−Free Packages are Available
NCV Prefix for Automotive and Other Applications Requiring Site
and Control Changes
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MARKING
DIAGRAMS
1
9−Pin Flip−Chip CSP
FC SUFFIX
CASE 499E
A3
XXX
AYWWG
C1
A1
8
Micro8
DM SUFFIX
CASE 846A
8
XXX
RYWG
G
1
1
XXX
A, R
Y
WW, W
G
= Specific Device Code,
= Assembly Location
= Year
= Work Week
= Pb−Free Package
PIN CONNECTIONS
9−Pin Flip−Chip CSP
A1
A2
A3
INM
OUTA
INP
B1
B2
B3
VM_P
VM
Vp
C1
C2
C3
BYPASS
OUTB SHUTDOWN
(Top View)
Micro8
Typical Applications
• Portable Electronic Devices
• PDAs
• Wireless Phones
SHUTDOWN
1
8
OUTB
BYPASS
2
7
VM
INP
3
6
Vp
INM
4
5
OUTA
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 14 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
November, 2006 − Rev. 10
1
Publication Order Number:
NCP2890/D
NCP2890, NCV2890
Rf
20 k
Vp
1 F
Cs
AUDIO
INPUT
Ci
Ri
INM
390 nF
20 k
INP
−
+
Vp
OUTA
R1
20 k
Vp
300 k
−
+
BYPASS
Cbypass
1 F
OUTB
300 k
SHUTDOWN
VIH
8
R2
20 k
SHUTDOWN
CONTROL
VM_P
VM
VIL
Figure 1. Typical Audio Amplifier Application Circuit with Single Ended Input
Rf
20 k
Vp
1 F
Cs
Ci
Ri
390 nF
20 k
+
AUDIO
INPUT
INM
−
+
INP
Ci
Ri
Vp
Vp
−
390 nF
20 k
20 k
Rf
300 k
−
+
BYPASS
Cbypass
1 F
R1
20 k
8
R2
20 k
OUTB
300 k
SHUTDOWN
VIH
OUTA
SHUTDOWN
CONTROL
VM_P
VM
VIL
Figure 2. Typical Audio Amplifier Application Circuit with a Differential Input
This device contains 671 active transistors and 1899 MOS gates.
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2
NCP2890, NCV2890
PIN DESCRIPTION
9−Pin Flip−Chip
CSP
Micro8
Type
Symbol
Description
A1
4
I
INM
Negative input of the first amplifier, receives the audio input signal. Connected to
the feedback resistor Rf and to the input resistor Rin.
A2
5
O
OUTA
A3
3
I
INP
B1
NA
I
VM_P
B2
7
I
VM
Core Analog Ground.
B3
6
I
Vp
Positive analog supply of the cell. Range: 2.2 V−5.5 V.
C1
2
I
BYPASS
C2
8
O
OUTB
C3
1
I
SHUTDOWN
Negative output of the NCP2890. Connected to the load and to the feedback
resistor Rf.
Positive input of the first amplifier, receives the common mode voltage.
Power Analog Ground.
Bypass capacitor pin which provides the common mode voltage (Vp/2).
Positive output of the NCP2890. Connected to the load.
The device enters in shutdown mode when a low level is applied on this pin.
MAXIMUM RATINGS (Note 1)
Rating
Symbol
Value
Unit
Vp
6.0
V
Op Vp
2.2 to 5.5 V
2.0 V = Functional Only
−
Input Voltage
Vin
−0.3 to Vcc +0.3
V
Max Output Current
Iout
500
mA
Power Dissipation (Note 2)
Pd
Internally Limited
−
Operating Ambient Temperature
TA
−40 to +85
°C
Max Junction Temperature
TJ
150
°C
Tstg
−65 to +150
°C
RJA
230
(Note 3)
°C/W
−
8000
>250
V
Supply Voltage
Operating Supply Voltage
Storage Temperature Range
Thermal Resistance Junction−to−Air
ESD Protection
Micro8
9−Pin Flip−Chip CSP
Human Body Model (HBM) (Note 4)
Machine Model (MM) (Note 5)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Maximum electrical ratings are defined as those values beyond which damage to the device may occur at TA = +25°C.
2. The thermal shutdown set to 160°C (typical) avoids irreversible damage on the device due to power dissipation. For further information see
page 10.
3. For the 9−Pin Flip−Chip CSP package, the RJA is highly dependent of the PCB Heatsink area. For example, RJA can equal 195°C/W with
50 mm2 total area and also 135°C/W with 500 mm2. For further information see page 10. The bumps have the same thermal resistance and
all need to be connected to optimize the power dissipation.
4. Human Body Model, 100 pF discharge through a 1.5 k resistor following specification JESD22/A114.
5. Machine Model, 200 pF discharged through all pins following specification JESD22/A115.
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3
NCP2890, NCV2890
ELECTRICAL CHARACTERISTICS Limits apply for TA between −40°C to +85°C (Unless otherwise noted).
Characteristic
Supply Quiescent Current
Symbol
Conditions
Min
(Note 6)
Typ
Max
(Note 6)
Unit
Idd
Vp = 2.6 V, No Load
Vp = 5.0 V, No Load
−
−
1.5
1.7
4
mA
Vp = 2.6 V, 8 Vp = 5.0 V, 8 −
−
1.7
1.9
5.5
Common Mode Voltage
Vcm
−
−
Vp/2
−
V
Shutdown Current
ISD
−
−
10
600
nA
Shutdown Voltage High
VSDIH
−
1.2
−
−
V
Shutdown Voltage Low
VSDIL
−
−
−
0.4
V
Turning On Time (Note 8)
TWU
Cby = 1 F
−
285
−
ms
Vloadpeak
Vp = 2.6 V, RL = 8.0 Vp = 5.0 V, RL = 8.0 (Note 7)
2.0
4.0
2.12
4.15
−
−
V
PO
Vp = 2.6 V, RL = 4.0 THD + N < 0.1%
Vp = 2.6 V, RL = 8.0 THD + N < 0.1%
Vp = 5.0 V, RL = 8.0 THD + N < 0.1%
−
0.36
−
W
Output Swing
Rms Output Power
0.28
−
PDmax
Vp = 5.0 V, RL = 8.0 −
Output Offset Voltage
VOS
Vp = 2.6 V
Vp = 5.0 V
−30
Signal−to−Noise Ratio
SNR
Vp = 2.6 V, G = 2.0
10 Hz < F < 20 kHz
−
Vp = 5.0 V, G = 10
10 Hz < F < 20 kHz
−
Maximum Power Dissipation (Note 8)
Positive Supply Rejection Ratio
Efficiency
Thermal Shutdown Temperature (Note 9)
Total Harmonic Distortion
6.
7.
8.
9.
PSRR V+
−
0.65
W
30
mV
84
−
dB
77
−
G = 2.0, RL = 8.0 Vpripple_pp = 200 mV
Cby = 1.0 F
Input Terminated with 10 dB
F = 217 Hz
Vp = 5.0 V
Vp = 3.0 V
Vp = 2.6 V
−
−
−
−64
−72
−73
−
−
−
F = 1.0 kHz
Vp = 5.0 V
Vp = 3.0 V
Vp = 2.6 V
−
−
−
−64
−74
−75
−
−
−
Vp = 2.6 V, Porms = 320 mW
Vp = 5.0 V, Porms = 1.0 W
−
−
48
63
−
−
%
140
160
180
°C
Vp = 2.6, F = 1.0 kHz
RL = 4.0 AV = 2.0
PO = 0.32 W
−
−
−
−
0.04
−
−
−
−
%
Vp = 5.0 V, F = 1.0 kHz
RL = 8.0 AV = 2.0
PO = 1.0 W
−
−
−
−
0.02
−
−
−
−
Tsd
THD
−
1.08
Min/Max limits are guaranteed by design, test or statistical analysis.
This parameter is not tested in production for 9−Pin Flip−Chip CSP package in case of a 5.0 V power supply.
See page 11 for a theoretical approach of this parameter.
For this parameter, the Min/Max values are given for information.
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NCP2890, NCV2890
TYPICAL PERFORMANCE CHARACTERISTICS
1
Vp = 5 V
RL = 8 Pout = 250 mW
AV = 2
0.1
THD + N (%)
THD + N (%)
1
0.01
0.001
Vp = 3.3 V
RL = 8 Pout = 150 mW
AV = 2
0.1
0.01
0.001
10
100
1000
10,000
100,000
10
100
FREQUENCY (Hz)
Figure 1. THD + N versus Frequency
100,000
1
Vp = 3 V
RL = 8 Pout = 250 mW
AV = 2
0.1
THD + N (%)
THD + N (%)
10,000
Figure 2. THD + N versus Frequency
1
0.01
0.001
Vp = 2.6 V
RL = 8 Pout = 100 mW
AV = 2
0.1
0.01
0.001
10
100
1000
10,000
100,000
10
100
FREQUENCY (Hz)
1000
10,000
100,000
FREQUENCY (Hz)
Figure 3. THD + N versus Frequency
Figure 4. THD + N versus Frequency
1
10
Vp = 2.6 V
RL = 4 Pout = 100 mW
AV = 2
0.1
Vp = 5 V
RL = 8 1 kHz
AV = 2
1
THD + N (%)
THD + N (%)
1000
FREQUENCY (Hz)
0.01
0.1
0.01
0.001
0.001
10
100
1000
10,000
100,000
0
FREQUENCY (Hz)
200
400
600
800
1000
1200
Pout, POWER OUT (mW)
Figure 5. THD + N versus Frequency
Figure 6. THD + N versus Power Out
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5
1400
NCP2890, NCV2890
TYPICAL PERFORMANCE CHARACTERISTICS
10
10
Vp = 3.3 V
RL = 8 1 kHz
AV = 2
1
THD + N (%)
THD + N (%)
1
Vp = 3 V
RL = 8 1 kHz
AV = 2
0.1
0.1
0.01
0.01
0.001
0.001
0
100
200
300
400
500
0
600
100
Pout, POWER OUT (mW)
Figure 7. THD + N versus Power Out
300
400
500
Figure 8. THD + N versus Power Out
10
10
Vp = 2.6 V
RL = 8 1 kHz
AV = 2
THD + N (%)
1
THD + N (%)
200
Pout, POWER OUT (mW)
0.1
Vp = 2.6 V
RL = 4 1 kHz
AV = 2
1
0.1
0.01
0.001
0.01
0
100
200
300
400
0
Pout, POWER OUT (mW)
200
300
400
500
Pout, POWER OUT (mW)
Figure 9. THD + N versus Power Out
Figure 10. THD + N versus Power Out
−30
1700
f = 1 kHz
RL = 8 1500
Vp = 5 V
RL = 8 Rin = 10 AV = 2
Vripple = 200 mVpk−pk
Cbypass = 1 F
−35
1300
−40
THD+N = 10%
1100
PSRR (dB)
OUTPUT POWER (mW)
100
900
THD+N = 1%
700
−45
−50
−55
500
−60
300
−65
100
−70
2.0
2.5
3.0
3.5
4.0
4.5
5.0
10
POWER SUPPLY (V)
100
1000
10,000
FREQUENCY (Hz)
Figure 11. Output Power versus Power Supply
Figure 12. PSRR @ Vp = 5 V
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100,000
NCP2890, NCV2890
TYPICAL PERFORMANCE CHARACTERISTICS
−20
−25
Vp = 5 V
RL = 8 Rin = Float
AV = 2
Vripple = 200 mVpk−pk
Cbypass = 1 F
PSRR (dB)
−40
−50
−35
−60
−70
−50
−90
−60
100
1000
10,000
−65
100,000
10
1000
100
10,000
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 13. PSRR @ Vp = 5 V
Figure 14. PSRR @ Vp = 5 V
−10
100,000
−30
Vp = 5 V
RL = 8 Rin = Float
AV = 4
Vripple = 200 mVpk−pk
Cbypass = 1 F
−30
−40
−50
−35
Vp = 3 V
RL = 8 Rin = 10 AV = 2
Vripple = 200 mVpk−pk
Cbypass = 1 F
−40
−45
PSRR (dB)
−20
PSRR (dB)
−45
−55
−100
−60
−70
−50
−55
−60
−65
−80
−70
−90
−75
−80
10
−100
10
100
1000
10,000
100,000
100
1000
10,000
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 15. PSRR @ Vp = 5 V
Figure 16. PSRR @ Vp = 3 V
−20
100,000
−25
Vp = 3 V
RL = 8 Rin = Float
AV = 2
Vripple = 200 mVpk−pk
Cbypass = 1 F
−40
−50
Vp = 3 V
RL = 8 Rin = 10 AV = 4
Vripple = 200 mVpk−pk
Cbypass = 1 F
−30
−35
−40
PSRR (dB)
−30
PSRR (dB)
−40
−80
10
Vp = 5 V
RL = 8 Rin = 10 AV = 4
Vripple = 200 mVpk−pk
Cbypass = 1 F
−30
PSRR (dB)
−30
−60
−70
−45
−50
−55
−80
−60
−90
−65
−100
−70
10
100
1000
10,000
100,000
10
100
1000
10,000
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 17. PSRR @ Vp = 3 V
Figure 18. PSRR @ Vp = 3 V
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100,000
NCP2890, NCV2890
TYPICAL PERFORMANCE CHARACTERISTICS
−30
−10
−30
PSRR (dB)
−40
−50
−40
−45
−60
−50
−55
−70
−60
−80
−65
−90
−70
−100
10
Vp = 3.3 V
RL = 8 Rin = 10 AV = 2
Vripple = 200 mVpk−pk
Cbypass = 1 F
−35
PSRR (dB)
−20
Vp = 3 V
RL = 8 Rin = Float
AV = 4
Vripple = 200 mVpk−pk
Cbypass = 1 F
−75
100
1000
10,000
10
100,000
100
Figure 19. PSRR @ Vp = 3 V
10,000
100,000
Figure 20. PSRR @ Vp = 3.3 V
−20
−30
Vp = 3.3 V
RL = 8 Rin = Float
AV = 2
Vripple = 200 mVpk−pk
Cbypass = 1 F
−40
−50
−35
Vp = 2.6 V
RL = 8 Rin = 10 AV = 2
Vripple = 200 mVpk−pk
Cbypass = 1 F
−40
−45
PSRR (dB)
−30
PSRR (dB)
1000
FREQUENCY (Hz)
FREQUENCY (Hz)
−60
−70
−50
−55
−60
−65
−80
−70
−90
−75
−80
10
−100
10
100
1000
10,000
100,000
1000
10,000
FREQUENCY (Hz)
Figure 21. PSRR @ Vp = 3.3 V
Figure 22. PSRR @ Vp = 2.6 V
−20
100,000
−30
Vp = 2.6 V
RL = 8 Rin = Float
AV = 2
Vripple = 200 mVpk−pk
Cbypass = 1 F
−40
−50
−40
−60
−70
−45
−50
−55
−80
−60
−90
−65
−100
−70
10
100
Vp = 5 V
RL = 8 Rin = 10 AV = 2
Vripple = 200 mVpk−pk
−35
PSRR (dB)
−30
PSRR (dB)
100
FREQUENCY (Hz)
1000
10,000
100,000
1 F
2.2 F
10
100
1000
10,000
100,000
FREQUENCY (Hz)
FREQUENCY (Hz)
Figure 23. PSRR @ Vp = 2.6 V
Figure 24. PSRR versus Cbypass @ Vp = 5 V
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NCP2890, NCV2890
TYPICAL PERFORMANCE CHARACTERISTICS
−30
0
Vp = 3 V
RL = 8 Rin = 10 AV = 2
Vripple = 200 mVpk−pk
−40
PSRR (dB)
−45
−50
−20
−55
1 F
−60
Vp = 5 V
RL = 8 F = 217 Hz
AV = 2
Vripple = 200 mVpk−pk
Cbypass = 1 F
−10
PSRR (dB)
−35
−30
−40
−50
−65
−70
−75
−60
2.2 F
−80
10
−70
100
1000
10,000
−80
−5
100,000
FREQUENCY (Hz)
−3
−2
−1
0
1
2
3
4
5
DC OUTPUT VOLTAGE (V)
Figure 26. PSRR @ DC Output Voltage
Figure 25. PSRR versus Cbypass @ Vp = 3 V
0
0
Vp = 3 V
RL = 8 F = 217 Hz
AV = 2
Vripple = 200 mVpk−pk
Cbypass = 1 F
−20
−30
−40
−20
−50
−60
−30
−40
−50
−70
−60
−80
−70
−90
−2.5 −2 −1.5
−1
−0.5
0
0.5
Vp = 2.6 V
RL = 8 F = 217 Hz
AV = 2
Vripple = 200 mVpk−pk
Cbypass = 1 F
−10
PSRR (dB)
−10
PSRR (dB)
−4
1
1.5
2
−80
−2.5 −2 −1.5 −1
2.5
DC OUTPUT VOLTAGE (V)
−0.5
0
0.5
1
1.5
DC OUTPUT VOLTAGE (V)
Figure 27. PSRR @ DC Output Voltage
Figure 28. PSRR @ DC Output Voltage
Figure 29. Turning On Time − Vp = 5 V
Figure 30. Turning Off Time − Vp = 5 V
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9
2
2.5
NCP2890, NCV2890
TYPICAL PERFORMANCE CHARACTERISTICS
0.3
PD, POWER DISSIPATION (W)
PD, POWER DISSIPATION (W)
0.7
0.6
0.5
0.4
Vp = 5 V
RL = 8 F = 1 kHz
THD + N < 0.1%
0.3
0.2
0.1
0
0.25
0.2
0.15
Vp = 3.3 V
RL = 8 F = 1 kHz
THD + N < 0.1%
0.1
0.05
0
0
0.2
0.4
0.6
0.8
1
1.2
0
0.1
Pout, OUTPUT POWER (W)
Figure 31. Power Dissipation versus Output
Power
0.4
0.5
0.4
PD, POWER DISSIPATION (W)
PD, POWER DISSIPATION (W)
0.3
Figure 32. Power Dissipation versus Output
Power
0.25
0.2
0.15
Vp = 3 V
RL = 8 F = 1 kHz
THD + N < 0.1%
0.1
0.05
0
0.35
RL = 4 0.3
0.25
0.2
RL = 8 0.15
0.1
Vp = 2.6 V
F = 1 kHz
THD + N < 0.1%
0.05
0
0
0.1
0.2
0.3
0.4
0
0.05
0.1
Pout, OUTPUT POWER (W)
0.15
0.2
0.25
0.3
0.35
0.4
Pout, OUTPUT POWER (W)
Figure 33. Power Dissipation versus Output
Power
Figure 34. Power Dissipation versus Output
Power
180
DIE TEMPERATURE (°C) @
AMBIENT TEMPERATURE 25°C
700
PD, POWER DISSIPATION (mW)
0.2
Pout, OUTPUT POWER (W)
PCB Heatsink Area
600
200 mm2
500
50 mm2
500 mm2
400
300
200
PDmax = 633 mW
for Vp = 5 V,
RL = 8 100
0
0
20
40
140
80
100
120
140
160
Vp = 5 V
120
Vp = 4.2 V
100
80
Vp = 3.3 V
60
40
60
Maximum Die Temperature 150°C
RL = 8 160
Vp = 2.6 V
50
100
150
200
250
PCB HEATSINK AREA (mm2)
TA, AMBIENT TEMPERATURE (°C)
Figure 35. Power Derating − 9−Pin Flip−Chip CSP
Figure 36. Maximum Die Temperature versus
PCB Heatsink Area
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10
300
NCP2890, NCV2890
APPLICATION INFORMATION
Detailed Description
Shutdown Function
The NCP2890 audio amplifier can operate under 2.6 V
until 5.5 V power supply. It delivers 320 mW rms output
power to 4.0 load (Vp = 2.6 V) and 1.0 W rms output
power to 8.0 load (Vp = 5.0 V).
The structure of the NCP2890 is basically composed of
two identical internal power amplifiers; the first one is
externally configurable with gain−setting resistors Rin and
Rf (the closed−loop gain is fixed by the ratios of these
resistors) and the second is internally fixed in an inverting
unity−gain configuration by two resistors of 20 k. So the
load is driven differentially through OUTA and OUTB
outputs. This configuration eliminates the need for an
output coupling capacitor.
The device enters shutdown mode when shutdown signal
is low. During the shutdown mode, the DC quiescent
current of the circuit does not exceed 100 nA.
Current Limit Circuit
The maximum output power of the circuit (Porms =
1.0 W, Vp = 5.0 V, RL = 8.0 ) requires a peak current in
the load of 500 mA.
In order to limit the excessive power dissipation in the
load when a short−circuit occurs, the current limit in the
load is fixed to 800 mA. The current in the four output MOS
transistors are real−time controlled, and when one current
exceeds 800 mA, the gate voltage of the MOS transistor is
clipped and no more current can be delivered.
Internal Power Amplifier
Thermal Overload Protection
The output PMOS and NMOS transistors of the amplifier
were designed to deliver the output power of the
specifications without clipping. The channel resistance
(Ron) of the NMOS and PMOS transistors does not exceed
0.6 when they drive current.
The structure of the internal power amplifier is
composed of three symmetrical gain stages, first and
medium gain stages are transconductance gain stages to
obtain maximum bandwidth and DC gain.
Internal amplifiers are switched off when the
temperature exceeds 160°C, and will be switched on again
only when the temperature decreases fewer than 140°C.
The NCP2890 is unity−gain stable and requires no
external components besides gain−setting resistors, an
input coupling capacitor and a proper bypassing capacitor
in the typical application.
The first amplifier is externally configurable (Rf and
Rin), while the second is fixed in an inverting unity gain
configuration.
The differential−ended amplifier presents two major
advantages:
− The possible output power is four times larger (the
output swing is doubled) as compared to a single−ended
amplifier under the same conditions.
− Output pins (OUTA and OUTB) are biased at the same
potential Vp/2, this eliminates the need for an output
coupling capacitor required with a single−ended
amplifier configuration.
The differential closed loop−gain of the amplifier is
Turn−On and Turn−Off Transitions
A cycle with a turn−on and turn−off transition is
illustrated with plots that show both single ended signals on
the previous page.
In order to eliminate “pop and click” noises during
transitions, output power in the load must be slowly
established or cut. When logic high is applied to the
shutdown pin, the bypass voltage begins to rise
exponentially and once the output DC level is around the
common mode voltage, the gain is established slowly
(50 ms). This way to turn−on the device is optimized in
terms of rejection of “pop and click” noises.
The device has the same behavior when it is turned−off
by a logic low on the shutdown pin. During the shutdown
mode, amplifier outputs are connected to the ground.
When a shutdown low level is applied, it takes 350 ms
before the DC output level is tied to Ground. However, as
shown on Figure 30, the turn off time of the audio signal is
40 ms.
A theoretical value of turn−on time at 25°C is given by
the following formula.
Cby: bypass capacitor
R: internal 300 k resistor with a 25% accuracy
Ton = 0.95 * R * Cby (285 ms with Cby = 1 F)
If a faster turn on time is required then a lower bypass
capacitor can be used. The other option is to use NCP2892
which offers 100 ms with 1 F bypass capacitor.
given by Avd + 2 *
V
Rf
+ orms .
Rin
Vinrms
Output power delivered to the load is given by
Porms +
(Vopeak)2
(Vopeak is the peak differential
2 * RL
output voltage).
When choosing gain configuration to obtain the desired
output power, check that the amplifier is not current limited
or clipped.
The maximum current which can be delivered to the load
is 500 mA Iopeak +
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11
Vopeak
.
RL
NCP2890, NCV2890
Gain−Setting Resistor Selection (Rin and Rf)
The size of the capacitor must be large enough to couple
in low frequencies without severe attenuation. However a
large input coupling capacitor requires more time to reach
its quiescent DC voltage (Vp/2) and can increase the
turn−on pops.
An input capacitor value between 0.1 and 0.39 F
performs well in many applications (With Rin = 22 K).
Rin and Rf set the closed−loop gain of the amplifier.
In order to optimize device and system performance, the
NCP2890 should be used in low gain configurations.
The low gain configuration minimizes THD + noise
values and maximizes the signal to noise ratio, and the
amplifier can still be used without running into the
bandwidth limitations.
A closed loop gain in the range from 2 to 5 is
recommended to optimize overall system performance.
An input resistor (Rin) value of 22 k is realistic in most
of applications, and doesn’t require the use of a too large
capacitor Cin.
Bypass Capacitor Selection (Cby)
The bypass capacitor Cby provides half−supply filtering
and determines how fast the NCP2890 turns on.
This capacitor is a critical component to minimize the
turn−on pop. A 1.0 F bypass capacitor value
(Cin = < 0.39 F) should produce clickless and popless
shutdown transitions. The amplifier is still functional with
a 0.1 F capacitor value but is more susceptible to “pop and
click” noises.
Thus, a 1.0 F bypassing capacitor is recommended.
Input Capacitor Selection (Cin)
The input coupling capacitor blocks the DC voltage at
the amplifier input terminal. This capacitor creates a
high−pass filter with Rin, the cut−off frequency is given by
fc +
1
.
2 * * Rin * Cin
AUDIO
INPUT
C2
390 nF
Vp
R3
20 k
C4*
1 F
R2
INM
20 k
INP
C1
−
+
Vp
20 k
Vp
300 k
BYPASS
Vp
C3
100 k
1 F
R1
8
−
+
20 k
OUTB
300 k
SHUTDOWN
R4*
OUTA
SHUTDOWN
CONTROL
VM_P
VM
* R4, C4: Not Mounted
Figure 37. Schematic of the Demonstration Board of the 9−Pin Flip−Chip CSP Device
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12
NCP2890, NCV2890
Silkscreen Layer
Top Layer
Bottom Layer
Figure 38. Demonstration Board for 9−Pin Flip−Chip CSP Device − PCB Layers
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13
NCP2890, NCV2890
BILL OF MATERIAL
Item
Part Description
Ref.
PCB
Footprint
Manufacturer
Manufacturer
Reference
1
NCP2890 Audio Amplifier
−
−
ON Semiconductor
NCP2890
2
SMD Resistor 100 K
R1
0805
Vishay−Draloric
D12CRCW Series
3
SMD Resistor 20 K
R2, R3
0805
Vishay−Draloric
CRCW0805 Series
4
Ceramic Capacitor 1.0 F 16 V X7R
C1
1206
Murata
GRM42−6X7R105K16
5
Ceramic Capacitor 390 nF 50 V Z5U
C2
1812
Kemet
C1812C394M5UAC
6
Ceramic Capacitor 1.0 F 16 V X7R
C3
1206
Murata
GRM42−6X7R105K16
7
Not Mounted
R4, C4
−
−
−
8
BNC Connector
J3
−
Telegartner
JO1001A1948
9
I/O Connector. It can be plugged by BLZ5.08/2
(Weidmüller Reference)
J4, J5
−
Weidmüller
SL5.08/2/90B
ORDERING INFORMATION
Marking
Package
Shipping†
NCP2890AFCT2
MAG
9−Pin Flip−Chip CSP
3000/Tape and Reel
NCP2890AFCT2G
MAH
9−Pin Flip−Chip CSP
(Pb−Free)
3000/Tape and Reel
NCP2890DMR2
MAB
Micro8
4000/Tape and Reel
NCP2890DMR2G
MAB
Micro8
(Pb−Free)
4000/Tape and Reel
NCV2890DMR2G
MBZ
Micro8
(Pb−Free)
4000/Tape and Reel
Device
NOTE: This product is offered with either eutectic (SnPb−tin/lead) or lead−free solder bumps (G suffix) depending on the PCB assembly
process. The NCP2890AFCT2G version requires a lead−free solder paste and should not be used with a SnPb solder paste.
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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14
NCP2890, NCV2890
PACKAGE DIMENSIONS
9 PIN FLIP−CHIP
CASE 499E−01
ISSUE A
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
−A−
4X
D
0.10 C
−B−
DIM
A
A1
A2
D
E
b
e
D1
E1
E
TOP VIEW
A
0.10 C
0.05 C
−C−
MILLIMETERS
MIN
MAX
0.540
0.660
0.210
0.270
0.330
0.390
1.450 BSC
1.450 BSC
0.290
0.340
0.500 BSC
1.000 BSC
1.000 BSC
A2
A1
SIDE VIEW
SEATING
PLANE
D1
e
C
B
e
E1
A
9X
b
1
2
3
0.05 C A B
0.03 C
BOTTOM VIEW
SOLDERING FOOTPRINT*
0.50
0.0197
0.50
0.0197
0.265
0.01
SCALE 20:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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15
NCP2890, NCV2890
PACKAGE DIMENSIONS
Micro8t
CASE 846A−02
ISSUE G
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER
SIDE.
5. 846A−01 OBSOLETE, NEW STANDARD 846A−02.
MILLIMETERS
INCHES
DIM
MIN
NOM
MAX
MIN
NOM
MAX
A
−−
−−
1.10
−−
−−
0.043
A1
0.05
0.08
0.15
0.002
0.003
0.006
b
0.25
0.33
0.40
0.010
0.013
0.016
c
0.13
0.18
0.23
0.005
0.007
0.009
D
2.90
3.00
3.10
0.114
0.118
0.122
E
2.90
3.00
3.10
0.114
0.118
0.122
e
0.65 BSC
0.026 BSC
L
0.40
0.55
0.70
0.016
0.021
0.028
HE
4.75
4.90
5.05
0.187
0.193
0.199
D
HE
PIN 1 ID
E
e
b 8 PL
0.08 (0.003)
T B
M
S
A
S
SEATING
−T− PLANE
0.038 (0.0015)
A
A1
L
c
SOLDERING FOOTPRINT*
8X
1.04
0.041
0.38
0.015
3.20
0.126
6X
8X
4.24
0.167
0.65
0.0256
5.28
0.208
SCALE 8:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
Micro8 is a trademark of International Rectifier Corporation.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body,
or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death
may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of
personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part.
SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
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Phone: 81−3−5773−3850
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16
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NCP2890/D