MJE13002DG1 Rev.E Mar.-2016 描述 / DATA SHEET Descriptions TO-92 塑封封装 NPN 半导体三极管。Silicon NPN transistor in a TO-92 Plastic Package. 特征 / Features 耐压高，快速转换。 High Voltage Capability High Speed Switching. 用途 / Applications 主要用于节能灯、日光灯电子镇流器及其它开关、振荡电路。 High frequency electronic lighting ballast applications, converters, inverters, switching regulators, etc. 内部等效电路 引脚排列 12 / Equivalent Circuit / Pinning 3 PIN1：Base PIN 2：Collector PIN 3：Emitter 放大及印章代码 / hFE Classifications & Marking 见印章说明。See Marking Instructions. http://www.fsbrec.com 1/6 MJE13002DG1 Rev.E Mar.-2016 极限参数 / DATA SHEET Absolute Maximum Ratings(Ta=25℃) 参数 Parameter 符号 Symbol 数值 Rating 单位 Unit Collector to Base Voltage VCBO 600 V Collector to Emitter Voltage VCEO 400 V Emitter to Base Voltage VEBO 9.0 V Collector Current - Continuous IC 1.3 A Collector Power Dissipation PC 1.0 W Junction Temperature Tj 150 ℃ Tsag -55～150 ℃ Storage Temperature Range 电性能参数 / Electrical Characteristics(Ta=25℃) 参数 Parameter Collector to Base Breakdown Voltage Collector to Emitter Breakdown Voltage Emitter to Base Breakdown Voltage 符号 Symbol 测试条件 Test Conditions 最小值 典型值 最大值 单位 Min Typ Max Unit VCBO IC=1mA IE=0 600 V VCEO IC=10mA IB=0 400 V VEBO IE=1mA IC=0 9.0 V Collector Cut-Off Current ICBO VCB=600V IE=0 0.1 mA Collector cut-off current ICEO VCE=400V IB=0 0.1 mA Emitter Base Cut-Off Current IEBO VEB=9.0V IC=0 0.1 mA hFE(1) VCE=5V IC=200mA 10 hFE(2) VCE=5V IC=1mA 7 hFE(3) VCE=5V IC=1.2A 5 VCE(sat)(1) IC=500mA IB=100mA 0.5 V VCE(sat)(2) IC=1.0A IB=500mA 0.6 V IC=500mA IB=100mA 1.2 V VCE=5V (UI9600) IC=0.25A 0.8 μS 3.5 μS VCE=10V f=1MHz IC=0.1A DC Current Gain Collector to Emitter Saturation Voltage Base to Emitter Saturation Voltage VBE(sat) Fall time tf Storage time ts Transition Frequency fT http://www.fsbrec.com 5 40 MHz 2/6 MJE13002DG1 Rev.E Mar.-2016 电参数曲线图 DATA SHEET / Electrical Characteristic Curve SOA(DC) http://www.fsbrec.com PC-TC hFE-Ic hFE-Ic Vces-IC Vbes-IC tS-Ta hFE-Ta 3/6 MJE13002DG1 Rev.E Mar.-2016 外形尺寸图 DATA SHEET / Package Dimensions http://www.fsbrec.com 4/6 MJE13002DG1 Rev.E Mar.-2016 印章说明 / DATA SHEET Marking Instructions BR 13002D G1 **** 说明： BR: 为公司代码 13002D： 为型号代码 G1: 规格代码 ****： 为生产批号代码，随生产批号变化。 Note: BR: Company Code. 13002D: Product Type. G1: Specification Code. ****: Lot No. Code,code change with Lot No. http://www.fsbrec.com 5/6 MJE13002DG1 Rev.E Mar.-2016 DATA SHEET 波峰焊温度曲线图(无铅) / Temperature Profile for Dip Soldering(Pb-Free) 说明： Note: 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150℃, Time:60~90sec. 2、峰值温度 255±5℃，时间持续为 5±0.5sec; 2.Peak Temp.:255±5℃, Duration:5±0.5sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：270±5℃ 包装规格 散件包装 Units 包装数量 Units/Bag 只/袋 Bags/Inner Box 袋/盒 Units/Inner Box 只/盒 Dimension Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Bag 袋 包装尺寸 Inner Box 盒 (unit：mm3) Outer Box 箱 1,000 10 10,000 5 50,000 135×190 237×172×102 560×245×195 1,000 10 10,000 10 100,000 135×190 237×172×102 560×245×375 Units/tape 只/纸带 Tape/Inner Box 纸带/盒 Rows/Inner Box 纸带层/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Inner Box 盒 3,000 1 120 10 30,000 328×230×42 / AMMO Package Type 封装形式 使用说明 Time:10±1 sec / BULK TO-92 TO-92 Temp:270±5℃ / Packaging SPEC. Package Type 封装形式 编带包装 时间：10±1 sec. Units 包装数量 Dimension 包装尺寸 (unit：mm3) Outer Box 箱 小箱 480×346×235， 大箱 547×407×268 / Notices http://www.fsbrec.com 6/6