ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 14-/12-Bit, 160/250MSPS, Ultralow-Power ADC Check for Samples: ADS4126, ADS4129, ADS4146, ADS4149 FEATURES DESCRIPTION • • The ADS414x/2x are a family of 14-bit/12-bit analog-to-digital converters (ADCs) with sampling rates up to 250MSPS. These devices use innovative design techniques to achieve high dynamic performance, while consuming extremely low power at 1.8V supply. The devices are well-suited for multi-carrier, wide bandwidth communications applications. 1 23 • • • • • • • Maximum Sample Rate: 250MSPS Ultralow Power with 1.8V Single Supply: – 201mW Total Power at 160MSPS – 265mW Total Power at 250MSPS High Dynamic Performance: – SNR: 70.6dBFS at 170MHz – SFDR: 84dBc at 170MHz Dynamic Power Scaling with Sample Rate Output Interface: – Double Data Rate (DDR) LVDS with Programmable Swing and Strength – Standard Swing: 350mV – Low Swing: 200mV – Default Strength: 100Ω Termination – 2x Strength: 50Ω Termination – 1.8V Parallel CMOS Interface Also Supported Programmable Gain up to 6dB for SNR/SFDR Trade-Off DC Offset Correction Supports Low Input Clock Amplitude Down To 200mVPP Package: QFN-48 (7mm × 7mm) The ADS414x/2x have fine gain options that can be used to improve SFDR performance at lower full-scale input ranges, especially at high input frequencies. They include a dc offset correction loop that can be used to cancel the ADC offset. At lower sampling rates, the ADC automatically operates at scaled down power with no loss in performance. The ADS414x/2x are available in a compact QFN-48 package and are specified over the industrial temperature range (–40°C to +85°C) ADS412x/ADS414x Family Comparison WITH ANALOG INPUT BUFFERS FAMILY 250MSPS 160MSPS 250MSPS 200MSPS ADS414x 14-Bit Family ADS4149 ADS4146 ADS41B49 — ADS412x 12-Bit Family ADS4129 ADS4126 ADS41B29 — 11-Bit — — — ADS58B18 9-Bit — — ADS58B19 — 1 2 3 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments Incorporated. All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2009–2010, Texas Instruments Incorporated ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. FUNCTIONAL BLOCK DIAGRAM AVDD AGND DRVDD DDR LVDS Interface DRGND CLKP CLKOUTP CLOCKGEN CLKOUTM CLKM D0_D1_P D0_D1_M D2_D3_P D2_D3_M Low-Latency Mode (Default After Reset) INP INM 12-Bit ADC Sampling Circuit Common Digital Functions D4_D5_P DDR Serializer D4_D5_M D6_D7_P D6_D7_M D8_D9_P D8_D9_M Control Interface Reference VCM D10_D11_P D10_D11_M OVR_SDOUT DFS SEN SDATA SCLK RESET ADS4129 OE Figure 1. ADS412x Block Diagram 2 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 AVDD AGND DRVDD DDR LVDS Interface DRGND CLKOUTP CLKP CLOCKGEN CLKOUTM CLKM D0_D1_P D0_D1_M D2_D3_P D2_D3_M D4_D5_P D4_D5_M Low-Latency Mode (Default After Reset) INP INM 14-Bit ADC Sampling Circuit Common Digital Functions D6_D7_P DDR Serializer D6_D7_M D8_D9_P D8_D9_M D10_D11_P D10_D11_M Control Interface Reference VCM D12_D13_P D12_D13_M OVR_SDOUT DFS SEN SDATA SCLK RESET ADS4149 OE Figure 2. ADS414x Block Diagram Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 3 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com ORDERING INFORMATION (1) PRODUCT PACKAGELEAD PACKAGE DESIGNATOR SPECIFIED TEMPERATURE RANGE ADS4126 QFN-48 RGZ –40°C to +85°C ADS4129 QFN-48 ADS4146 QFN-48 ADS4149 (1) (2) QFN-48 RGZ –40°C to +85°C RGZ –40°C to +85°C RGZ –40°C to +85°C ECO PLAN (2) LEAD/BALL FINISH PACKAGE MARKING GREEN (RoHS, no Sb/Br) Cu/NiPdAu AZ4126 GREEN (RoHS, no Sb/Br) Cu/NiPdAu GREEN (RoHS, no Sb/Br) Cu/NiPdAu GREEN (RoHS, no Sb/Br) Cu/NiPdAu AZ4129 AZ4146 AZ4149 ORDERING NUMBER TRANSPORT MEDIA, QUANTITY ADS4126IRGZR Tape and reel, 2500 ADS4126IRGZT Tape and reel, 250 ADS4129IRGZR Tape and reel, 2500 ADS4129IRGZT Tape and reel, 250 ADS4146IRGZR Tape and reel, 2500 ADS4146IRGZT Tape and reel, 250 ADS4149IRGZR Tape and reel, 2500 ADS4149IRGZT Tape and reel, 250 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the device product folder at www.ti.com. Eco Plan is the planned eco-friendly classification. Green (RoHS, no Sb/Br): TI defines Green to mean Pb-Free (RoHS compatible) and free of Bromine- (Br) and Antimony- (Sb) based flame retardants. Refer to the Quality and Lead-Free (Pb-Free) Data web site for more information. The ADS414x/2x family is pin-compatible with the previous generation ADS6149 family; this architecture enables easy migration. However, there are some important differences between the generations, summarized in Table 1. Table 1. MIGRATING FROM THE ADS6149 FAMILY ADS6149 FAMILY ADS4149 FAMILY PINS Pin 21 is NC (not connected) Pin 21 is NC (not connected) Pin 23 is MODE Pin 23 is RESERVED in the ADS4149 family. It is reserved as a digital control pin for an (as yet) undefined function in the next-generation ADC series. SUPPLY AVDD is 3.3V AVDD is 1.8V DRVDD is 1.8V No change INPUT COMMON-MODE VOLTAGE VCM is 1.5V VCM is 0.95V SERIAL INTERFACE Protocol: 8-bit register address and 8-bit register data No change in protocol New serial register map EXTERNAL REFERENCE MODE Supported Not supported ADS61B49 FAMILY ADS41B29/B49/ADS58B18 FAMILY PINS Pin 21 is NC (not connected) Pin 21 is 3.3V AVDD_BUF (supply for the analog input buffers) Pin 23 is MODE Pin 23 is a digital control pin for the RESERVED function. Pin 23 functions as SNR Boost enable (B18 only). SUPPLY AVDD is 3.3V AVDD is 1.8V, AVDD_BUF is 3.3V DRVDD is 1.8V No change INPUT COMMON-MODE VOLTAGE VCM is 1.5V VCM is 1.7V SERIAL INTERFACE Protocol: 8-bit register address and 8-bit register data No change in protocol New serial register map EXTERNAL REFERENCE MODE Supported 4 Not supported Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 ABSOLUTE MAXIMUM RATINGS (1) Over operating free-air temperature range, unless otherwise noted. VALUE UNIT Supply voltage range, AVDD –0.3 to 2.1 V Supply voltage range, DRVDD –0.3 to 2.1 V Voltage between AGND and DRGND –0.3 to 0.3 V Voltage between AVDD to DRVDD (when AVDD leads DRVDD) 0 to 2.1 V Voltage between DRVDD to AVDD (when DRVDD leads AVDD) 0 to 2.1 V –0.3 to minimum (1.9, AVDD + 0.3) V –0.3 to AVDD + 0.3 V –0.3 to 3.9 V Operating free-air temperature range, TA –40 to +85 °C Operating junction temperature range, TJ +125 °C Storage temperature range, Tstg –65 to +150 °C ESD, human body model (HBM) 2 kV INP, INM Voltage applied to input pins CLKP, CLKM (2), DFS, OE RESET, SCLK, SDATA, SEN (1) (2) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not implied. When AVDD is turned off, it is recommended to switch off the input clock (or ensure the voltage on CLKP, CLKM is less than |0.3V|. This prevents the ESD protection diodes at the clock input pins from turning on. THERMAL INFORMATION ADS4126, ADS4129, ADS4146, ADS4149 THERMAL METRIC (1) UNITS RGZ 48 PINS qJA Junction-to-ambient thermal resistance qJCtop Junction-to-case (top) thermal resistance qJB Junction-to-board thermal resistance 10 yJT Junction-to-top characterization parameter 0.3 yJB Junction-to-board characterization parameter 9 qJCbot Junction-to-case (bottom) thermal resistance 1.13 (1) 29 °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 5 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com RECOMMENDED OPERATING CONDITIONS Over operating free-air temperature range, unless otherwise noted. ADS412x, ADS414x MIN TYP MAX UNIT SUPPLIES AVDD Analog supply voltage 1.7 1.8 1.9 V DRVDD Digital supply voltage 1.7 1.8 1.9 V ANALOG INPUTS Differential input voltage range (1) 2 Input common-mode voltage VPP VCM ± 0.05 V Maximum analog input frequency with 2VPP input amplitude (2) 400 MHz Maximum analog input frequency with 1VPP input amplitude (2) 800 MHz CLOCK INPUT Input clock sample rate ADS4129/ADS4149 Low-speed mode enabled (3) 1 80 MSPS Low-speed mode disabled (3) > 80 250 MSPS ADS4126/ADS4146 Low-speed mode enabled (3) 1 80 MSPS Low-speed mode disabled (3) > 80 160 MSPS Input clock amplitude differential (VCLKP – VCLKM) Sine wave, ac-coupled 1.5 VPP LVPECL, ac-coupled 0.2 1.6 VPP LVDS, ac-coupled 0.7 VPP LVCMOS, single-ended, ac-coupled 1.8 V Input clock duty cycle Low-speed mode enabled 40 50 60 % Low-speed mode disabled 35 50 65 % DIGITAL OUTPUTS CLOAD Maximum external load capacitance from each output pin to DRGND RLOAD Differential load resistance between the LVDS output pairs (LVDS mode) TA Operating free-air temperature –40 5 pF 100 Ω +85 °C HIGH PERFORMANCE MODES (4) (5) (6) Mode 1 Set the MODE 1 register bits to get best performance across sample clock and input signal frequencies. Register address = 03h, register data = 03h Mode 2 Set the MODE 2 register bit to get best performance at high input signal frequencies. Register address = 4Ah, register data = 01h (1) (2) (3) (4) (5) (6) 6 With 0dB gain. See the Fine Gain section in the Application Information for relation between input voltage range and gain. See the Theory of Operation section in the Application Information. See the Serial Interface section for details on low-speed mode. It is recommended to use these modes to get best performance. These modes can be set using the serial interface only. See the Serial Interface section for details on register programming. Note that these modes cannot be set when the serial interface is not used (when the RESET pin is tied high); see the Device Configuration section. Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 ELECTRICAL CHARACTERISTICS: ADS4146/ADS4149 Typical values are at +25°C, AVDD = 1.8V, DRVDD = 1.8V, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, and DDR LVDS interface, unless otherwise noted. Minimum and maximum values are across the full temperature range: TMIN = –40°C to TMAX = +85°C, AVDD = 1.8V, and DRVDD = 1.8V. Note that after reset, the device is in 0dB gain mode. ADS4146 (160MSPS) PARAMETER TEST CONDITIONS MIN TYP Resolution SNR (signal-to-noise ratio), LVDS SINAD (signal-to-noise and distortion ratio), LVDS SFDR THD 72 71.4 dBFS 71.4 dBFS 70.6 dBFS IMD Input overload recovery 68.5 70.8 67.5 fIN = 300MHz 69 69 dBFS fIN = 10MHz 72 71.6 dBFS fIN = 70MHz 71.8 71 dBFS fIN = 100MHz 71.4 70.9 dBFS 69.4 dBFS 67.5 70.4 66 fIN = 300MHz 68.2 67.4 dBFS fIN = 10MHz 88 87 dBc fIN = 70MHz 87 82 dBc fIN = 100MHz 86 81 dBc 84 dBc 74.5 82 72 fIN = 300MHz 77 75 dBc fIN = 10MHz 86.5 85 dBc fIN = 70MHz 85 80 dBc fIN = 100MHz 84 79 dBc 80.5 dBc fIN = 300MHz 74.5 71.5 dBc fIN = 10MHz 91 89 dBc fIN = 70MHz 90 85 dBc fIN = 100MHz 88 84 dBc 84 72 dBc 74.5 81 71 88 72 fIN = 300MHz 79 75 dBc fIN = 10MHz 88 87 dBc fIN = 70MHz 87 82 dBc fIN = 100MHz 86 81 dBc 82 dBc 74.5 82 72 fIN = 300MHz 77 75 dBc fIN = 10MHz 91 90 dBc fIN = 70MHz 90 88 dBc fIN = 100MHz 90 90 dBc 88 dBc fIN = 170MHz Two-tone intermodulation distortion Bits 71.5 fIN = 170MHz Worst spur (other than second and third harmonics) UNIT fIN = 70MHz fIN = 170MHz HD3 14 fIN = 100MHz fIN = 170MHz HD2 MAX dBFS fIN = 170MHz Third-harmonic distortion TYP 71.9 fIN = 170MHz Second-harmonic distortion MIN 72.2 fIN = 170MHz Total harmonic distortion MAX 14 fIN = 10MHz Spurious-free dynamic range ADS4149 (250MSPS) 78 90 77 fIN = 300MHz 88 88 dBc f1 = 46MHz, f2 = 50MHz, each tone at –7dBFS –88 –88 dBFS f1 = 185MHz, f2 = 190MHz, each tone at –7dBFS –86 –86 dBFS Recovery to within 1% (of final value) for 6dB overload with sine-wave input 1 1 Clock cycles > 30 > 30 dB 11.3 LSBs AC power-supply rejection ratio PSRR For 100mVPP signal on AVDD supply, up to 10MHz Effective number of bits ENOB fIN = 170MHz Differential nonlinearity DNL fIN = 170MHz Integrated nonlinearity INL fIN = 170MHz Copyright © 2009–2010, Texas Instruments Incorporated 11.5 –0.95 ±0.5 ±2 –0.95 ±4.5 ±0.5 ±2 LSBs ±5 Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 LSBs 7 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com ELECTRICAL CHARACTERISTICS: ADS4126/ADS4129 Typical values are at +25°C, AVDD = 1.8V, DRVDD = 1.8V, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, and DDR LVDS interface, unless otherwise noted. Minimum and maximum values are across the full temperature range: TMIN = –40°C to TMAX = +85°C, AVDD = 1.8V, and DRVDD = 1.8V. Note that after reset, the device is in 0dB gain mode. ADS4126 (160MSPS) PARAMETER TEST CONDITIONS MIN TYP Resolution SNR (signal-to-noise ratio), LVDS SINAD (signal-to-noise and distortion ratio), LVDS SFDR HD3 70 69.7 dBFS 69.7 69.6 dBFS 69 dBFS IMD Input overload recovery dBFS fIN = 10MHz 70.1 69.7 dBFS fIN = 70MHz 70 69.4 dBFS fIN = 100MHz 69.5 69.3 dBFS 68.7 dBFS 65.5 68.7 65.5 fIN = 300MHz 67.3 66.8 dBFS fIN = 10MHz 88 87 dBc fIN = 70MHz 87 82 dBc fIN = 100MHz 86.3 81 dBc 80 dBc 72.5 82 70 fIN = 300MHz 77.5 75 dBc fIN = 10MHz 87 85 dBc fIN = 70MHz 85 80 dBc fIN = 100MHz 84 79 dBc 79 dBc fIN = 300MHz 74.5 71.5 dBc fIN = 10MHz 92 90 dBc fIN = 70MHz 90 85 dBc fIN = 100MHz 88 84 dBc 84 70 dBc 72.5 81 69 88 70 fIN = 300MHz 78 74 dBc fIN = 10MHz 88 87 dBc fIN = 70MHz 87 82 dBc fIN = 100MHz 86 81 dBc 80 dBc 72.5 82 70 fIN = 300MHz 77 75 dBc fIN = 10MHz 92 90 dBc fIN = 70MHz 91 88 dBc fIN = 100MHz 90 90 dBc 88 dBc 76 90 75 fIN = 300MHz 88 88 dBc f1 = 46MHz, f2 = 50MHz, each tone at –7dBFS –88 –88 dBFS f1 = 185MHz, f2 = 190MHz, each tone at –7dBFS –86 –86 dBFS Recovery to within 1% (of final value) for 6dB overload with sine-wave input 1 1 Clock cycles > 30 > 30 dB PSRR For 100mVPP signal on AVDD supply, up to 10MHz Effective number of bits ENOB fIN = 170MHz Differential nonlinearity DNL fIN = 170MHz Integrated nonlinearity INL fIN = 170MHz Submit Documentation Feedback 65.8 68 AC power-supply rejection ratio 8 69 68 fIN = 170MHz Two-tone intermodulation distortion 66.5 fIN = 300MHz fIN = 170MHz Worst spur (other than second and third harmonics) Bits fIN = 70MHz fIN = 170MHz Third-harmonic distortion UNIT fIN = 100MHz fIN = 170MHz HD2 12 dBFS fIN = 170MHz THD MAX 69.8 fIN = 170MHz Second-harmonic distortion TYP 70.2 fIN = 170MHz Total harmonic distortion MIN 12 fIN = 10MHz Spurious-free dynamic range MAX ADS4129 (250MSPS) 11.2 –0.85 11.2 ±0.2 2.5 ±0.25 3.5 –0.95 LSBs ±0.2 2.5 LSBs ±0.5 5 LSBs Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 ELECTRICAL CHARACTERISTICS: GENERAL Typical values are at +25°C, AVDD = 1.8V, DRVDD = 1.8V, 50% clock duty cycle, and 0dB gain, unless otherwise noted. Minimum and maximum values are across the full temperature range: TMIN = –40°C to TMAX = +85°C, AVDD = 1.8V, and DRVDD = 1.8V. PARAMETER ADS4126/ADS4146 (160MSPS) ADS4129/ADS4149 (250MSPS) MIN MIN TYP MAX TYP MAX UNIT ANALOG INPUTS Differential input voltage range Differential input resistance (at dc); see Figure 114 Differential input capacitance; see Figure 115 Analog input bandwidth Analog input common-mode current (per input pin) Common-mode output voltage VCM VCM output current capability 2 2 VPP >1 >1 MΩ 4 4 pF 550 550 MHz µA/MSPS 0.6 0.6 0.95 0.95 V 4 4 mA DC ACCURACY Offset error –15 Temperature coefficient of offset error 2.5 15 –15 2.5 0.003 Gain error as a result of internal reference inaccuracy alone EGREF Gain error of channel alone EGCHAN Temperature coefficient of EGCHAN –2 15 0.003 2 –2 2 –0.2 –0.2 0.001 0.001 mV mV/°C –1 %FS %FS Δ%/°C POWER SUPPLY IAVDD Analog supply current 72 83 99 IDRVDD (1) Output buffer supply current LVDS interface with 100Ω external termination Low LVDS swing (200mV) 39.5 51 47 IDRVDD Output buffer supply current LVDS interface with 100Ω external termination Standard LVDS swing (350mV) 51 63 59 IDRVDD output buffer supply current (1) (2) CMOS interface (2) 8pF external load capacitance fIN = 2.5MHz 26 113 mA mA 72 mA 35 mA Analog power 130 179 mW LVDS interface, low LVDS swing 71.1 84.6 mW 47 63 mW Digital power CMOS interface (2) 8pF external load capacitance fIN = 2.5MHz Global power-down 10 Standby 185 (1) (2) 25 10 25 185 mW mW The maximum DRVDD current with CMOS interface depends on the actual load capacitance on the digital output lines. Note that the maximum recommended load capacitance on each digital output line is 10pF. In CMOS mode, the DRVDD current scales with the sampling frequency, the load capacitance on output pins, input frequency, and the supply voltage (see the CMOS Interface Power Dissipation section in the Application Information). Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 9 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com DIGITAL CHARACTERISTICS Typical values are at +25°C, AVDD = 1.8V, DRVDD = 1.8V, and 50% clock duty cycle, unless otherwise noted. Minimum and maximum values are across the full temperature range: TMIN = –40°C to TMAX = +85°C, AVDD = 1.8V, and DRVDD = 1.8V. ADS4126, ADS4129, ADS4146, ADS4149 PARAMETER TEST CONDITIONS MIN RESET, SCLK, SDATA, and SEN support 1.8V and 3.3V CMOS logic levels 1.3 OE only supports 1.8V CMOS logic levels 1.3 TYP MAX UNIT DIGITAL INPUTS (RESET, SCLK, SDATA, SEN, OE) High-level input voltage Low-level input voltage High-level input voltage Low-level input voltage V 0.4 V V 0.4 V High-level input current: SDATA, SCLK (1) VHIGH = 1.8V 10 µA High-level input current: SEN VHIGH = 1.8V 0 µA Low-level input current: SDATA, SCLK VLOW = 0V 0 µA Low-level input current: SEN VLOW = 0V 10 µA DIGITAL OUTPUTS (CMOS INTERFACE: D0 TO D13, OVR_SDOUT) High-level output voltage DRVDD – 0.1 DRVDD Low-level output voltage 0 V 0.1 V DIGITAL OUTPUTS (LVDS INTERFACE: DA0P/M TO DA13P/M, DB0P/M TO DB13P/M, CLKOUTP/M) High-level output voltage (2) VODH Standard swing LVDS 270 +350 430 mV Low-level output voltage (2) VODL Standard swing LVDS –430 –350 –270 mV High-level output voltage (2) VODH Low swing LVDS +200 Low-level output voltage (2) VODL Low swing LVDS –200 Output common-mode voltage VOCM (1) (2) 10 0.85 1.05 mV mV 1.25 V SDATA and SCLK have an internal 180kΩ pull-down resistor. With an external 100Ω termination. Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 TIMING CHARACTERISTICS Dn_Dn + 1_P Logic 0 VODL Logic 1 VODH Dn_Dn + 1_M VOCM GND (1) With external 100Ω termination. Figure 3. LVDS Output Voltage Levels TIMING REQUIREMENTS: LVDS and CMOS Modes (1) Typical values are at +25°C, AVDD = 1.8V, DRVDD = 1.8V, sampling frequency = 250 MSPS, sine wave input clock, CLOAD = 5pF (2), and RLOAD = 100Ω (3), unless otherwise noted. Minimum and maximum values are across the full temperature range: TMIN = –40°C to TMAX = +85°C, AVDD = 1.8V, and DRVDD = 1.7V to 1.9V. PARAMETER tA CONDITIONS Aperture delay Variation of aperture delay tJ MIN TYP MAX UNIT 0.6 0.8 1.2 ns Between two devices at the same temperature and DRVDD supply Aperture jitter Wakeup time ADC latency (4) ±100 ps 100 fS rms Time to valid data after coming out of STANDBY mode 5 25 µs Time to valid data after coming out of PDN GLOBAL mode 100 500 µs Low-latency mode (default after reset) 10 Clock cycles Low-latency mode disabled (gain enabled, offset correction disabled) 16 Clock cycles Low-latency mode disabled (gain and offset correction enabled) 17 Clock cycles DDR LVDS MODE (5) (6) tSU Data setup time (3) (3) tH Data hold time tPDI Clock propagation delay Variation of tPDI (1) (2) (3) (4) (5) (6) (7) Data valid (7) to zero-crossing of CLKOUTP 0.75 1.1 ns Zero-crossing of CLKOUTP to data becoming invalid (7) 0.35 0.6 ns Input clock rising edge cross-over to output clock rising edge cross-over 1MSPS ≤ sampling frequency ≤ 250MSPS 3 4.2 Between two devices at the same temperature and DRVDD supply 5.4 ±0.6 ns ns Timing parameters are ensured by design and characterization but are not production tested. CLOAD is the effective external single-ended load capacitance between each output pin and ground. RLOAD is the differential load resistance between the LVDS output pair. At higher frequencies, tPDI is greater than one clock period and overall latency = ADC latency + 1. Measurements are done with a transmission line of 100Ω characteristic impedance between the device and the load. Setup and hold time specifications take into account the effect of jitter on the output data and clock. The LVDS timings are unchanged for low latency disabled and enabled. Data valid refers to a logic high of 1.26V and a logic low of 0.54V. Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 11 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com TIMING REQUIREMENTS: LVDS and CMOS Modes(1) (continued) Typical values are at +25°C, AVDD = 1.8V, DRVDD = 1.8V, sampling frequency = 250 MSPS, sine wave input clock, CLOAD = 5pF(2), and RLOAD = 100Ω(3), unless otherwise noted. Minimum and maximum values are across the full temperature range: TMIN = –40°C to TMAX = +85°C, AVDD = 1.8V, and DRVDD = 1.7V to 1.9V. PARAMETER CONDITIONS MIN TYP MAX UNIT Duty cycle of differential clock, (CLKOUTP – CLKOUTM) 1MSPS ≤ sampling frequency ≤ 250MSPS 42 48 54 % DDR LVDS MODE (continued) LVDS bit clock duty cycle tRISE, tFALL Data rise time, Data fall time Rise time measured from –100mV to +100mV Fall time measured from +100mV to –100mV 1MSPS ≤ sampling frequency ≤ 250MSPS 0.14 ns tCLKRISE, tCLKFALL Output clock rise time, Output clock fall time Rise time measured from –100mV to +100mV Fall time measured from +100mV to –100mV 1MSPS ≤ sampling frequency ≤ 250MSPS 0.14 ns tOE Output enable (OE) to data delay Time to valid data after OE becomes active 50 PARALLEL CMOS MODE tSTART Input clock to data delay tDV Data valid time tPDI 100 ns 1.1 ns (8) (9) Input clock rising edge cross-over to start of data valid (10) Time interval of valid data (10) 2.5 3.2 Clock propagation delay Input clock rising edge cross-over to output clock rising edge cross-over 1MSPS ≤ sampling frequency ≤ 200MSPS 4 5.5 Output clock duty cycle Duty cycle of output clock, CLKOUT 1MSPS ≤ sampling frequency ≤ 200MSPS 47 % ns 7 ns tRISE, tFALL Data rise time, Data fall time Rise time measured from 20% to 80% of DRVDD Fall time measured from 80% to 20% of DRVDD 1 ≤ sampling frequency ≤ 250MSPS 0.35 ns tCLKRISE, tCLKFALL Output clock rise time, Output clock fall time Rise time measured from 20% to 80% of DRVDD Fall time measured from 80% to 20% of DRVDD 1 ≤ sampling frequency ≤ 200MSPS 0.35 ns tOE Output enable (OE) to data delay Time to valid data after OE becomes active 20 40 ns (8) For fS > 200MSPS, it is recommended to use an external clock for data capture instead of the device output clock signal (CLKOUT). (9) Low latency mode enabled. (10) Data valid refers to a logic high of 1.26V and a logic low of 0.54V. 12 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 Table 2. LVDS Timing Across Sampling Frequencies SAMPLING FREQUENCY (MSPS) SETUP TIME (ns) MIN TYP 230 0.85 200 1.05 185 HOLD TIME (ns) MAX MIN TYP 1.25 0.35 0.6 1.55 0.35 0.6 1.1 1.7 0.35 0.6 160 1.6 2.1 0.35 0.6 125 2.3 3 0.35 0.6 80 4.5 5.2 0.35 0.6 MAX Table 3. CMOS Timing Across Sampling Frequencies (Low Latency Enabled) TIMING SPECIFIED WITH RESPECT TO OUTPUT CLOCK SAMPLING FREQUENCY (MSPS) MIN TYP 200 1.6 185 160 tSETUP (ns) tHOLD (ns) MAX MIN TYP 2.2 1.8 1.8 2.4 2.3 2.9 125 3.1 80 5.4 tPDI (ns) MAX MIN TYP MAX 2.5 4 5.5 7 1.9 2.7 4 5.5 7 2.2 3 4 5.5 7 3.7 3.2 4 4 5.5 7 6 5.4 6 4 5.5 7 Table 4. CMOS Timing Across Sampling Frequencies (Low Latency Disabled) TIMING SPECIFIED WITH RESPECT TO OUTPUT CLOCK SAMPLING FREQUENCY (MSPS) MIN TYP MIN TYP MIN TYP MAX 200 1 1.6 2 2.8 4 5.5 7 185 1.3 2 2.2 3 4 5.5 7 160 1.8 2.5 2.5 3.3 4 5.5 7 125 2.5 3.2 3.5 4.3 4 5.5 7 80 4.8 5.5 5.7 6.5 4 5.5 7 tSETUP (ns) tHOLD (ns) MAX tPDI (ns) MAX Table 5. CMOS Timing Across Sampling Frequencies (Low Latency Enabled) TIMING SPECIFIED WITH RESPECT TO INPUT CLOCK SAMPLING FREQUENCY (MSPS) tSTART (ns) MIN tDV (ns) MAX MIN TYP 1.1 2.5 3.2 230 0.7 2.9 3.5 200 –0.3 3.5 4.2 185 –1 3.9 4.5 170 –1.5 4.3 5 250 Copyright © 2009–2010, Texas Instruments Incorporated TYP MAX Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 13 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com Table 6. CMOS Timing Across Sampling Frequencies (Low Latency Disabled) TIMING SPECIFIED WITH RESPECT TO INPUT CLOCK SAMPLING FREQUENCY (MSPS) tSTART (ns) MIN tDV (ns) MAX MIN TYP 250 TYP 1.6 2.5 3.2 230 1.1 2.9 3.5 200 0.3 3.5 4.2 185 0 3.9 4.5 170 –1.3 4.3 5 Sample N N+3 N+2 N+1 N+4 MAX N + 12 N + 11 N + 10 Input Signal tA CLKP Input Clock CLKM CLKOUTM CLKOUTP tPDI tH 10 Clock Cycles DDR LVDS (1) tSU (2) Output Data (DXP, DXM) E O N - 10 E O N-9 E O E N-8 O N-7 O E E O O E N-6 E O N+1 N E O E O N+2 tPDI CLKOUT tSU Parallel CMOS 10 Clock Cycles Output Data N - 10 N-9 N-8 (1) N-7 tH N-1 N N+1 (1) ADC latency in low-latency mode. At higher sampling frequencies, tDPI is greater than one clock cycle which then makes the overall latency = ADC latency + 1. (2) E = Even bits (D0, D2, D4, etc). O = Odd bits (D1, D3, D5, etc). Figure 4. Latency Diagram 14 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 CLKM Input Clock CLKP tPDI CLKOUTP Output Clock CLKOUTM tSU Output Dn_Dn + 1_P Data Pair Dn_Dn + 1_M tSU tH Dn (1) Dn + 1 tH (1) (1) Dn = bits D0, D2, D4, etc. Dn + 1 = Bits D1, D3, D5, etc. Figure 5. LVDS Mode Timing CLKM Input Clock CLKP tPDI Output Clock CLKOUT tSU Output Data Dn tH Dn (1) CLKM Input Clock CLKP tSTART tDV Output Data Dn Dn (1) Dn = bits D0, D1, D2, etc. Figure 6. CMOS Mode Timing Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 15 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com DEVICE CONFIGURATION The ADS414x/2x have several modes that can be configured using a serial programming interface, as described in Table 7, Table 8, and Table 9. In addition, the devices have two dedicated parallel pins for quickly configuring commonly used functions. The parallel pins are DFS (analog 4-level control pin) and OE (digital control pin). The analog control pins can be easily configured using a simple resistor divider (with 10% tolerance resistors). Table 7. DFS: Analog Control Pin VOLTAGE APPLIED ON DFS DESCRIPTION (Data Format/Output Interface) 0, +100mV/–0mV Twos complement/DDR LVDS (3/8) AVDD ± 100mV Twos complement/parallel CMOS (5/8) AVDD ± 100mV Offset binary/parallel CMOS AVDD, +0mV/–100mV Offset binary/DDR LVDS Table 8. OE: Digital Control Pin VOLTAGE APPLIED ON OE DESCRIPTION 0 Output data buffers disabled AVDD Output data buffers enabled When the serial interface is not used, the SDATA pin can also be used as a digital control pin to place the device in standby mode. To enable this, the RESET pin must be tied high. In this mode, SEN and SCLK do not have any alternative functions. Keep SEN tied high and SCLK tied low on the board. Table 9. SDATA: Digital Control Pin VOLTAGE APPLIED ON SDATA DESCRIPTION 0 Normal operation Logic high Device enters standby AVDD (5/8) AVDD 3R (5/8) AVDD GND AVDD 2R (3/8) AVDD 3R (3/8) AVDD To Parallel Pin Figure 7. Simplified Diagram to Configure DFS Pin 16 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 SERIAL INTERFACE The analog-to-digital converter (ADC) has a set of internal registers that can be accessed by the serial interface formed by the SEN (serial interface enable), SCLK (serial interface clock), and SDATA (serial interface data) pins. Serial shift of bits into the device is enabled when SEN is low. Serial data SDATA are latched at every falling edge of SCLK when SEN is active (low). The serial data are loaded into the register at every 16th SCLK falling edge when SEN is low. In case the word length exceeds a multiple of 16 bits, the excess bits are ignored. Data can be loaded in multiples of 16-bit words within a single active SEN pulse. The first eight bits form the register address and the remaining eight bits are the register data. The interface can work with SCLK frequency from 20MHz down to very low speeds (a few Hertz) and also with non-50% SCLK duty cycle. Register Initialization After power-up, the internal registers must be initialized to the default values. This initialization can be accomplished in one of two ways: 1. Either through hardware reset by applying a high pulse on RESET pin (of width greater than 10ns), as shown in Figure 8; or 2. By applying a software reset. When using the serial interface, set the RESET bit (D7 in register 00h) high. This setting initializes the internal registers to the default values and then self-resets the RESET bit low. In this case, the RESET pin is kept low. Register Address SDATA A7 A6 A5 A3 A4 Register Data A2 A1 A0 D7 D6 D5 tSCLK D4 tDSU D3 D2 D1 D0 tDH SCLK tSLOADS tSLOADH SEN RESET Figure 8. Serial Interface Timing SERIAL INTERFACE TIMING CHARACTERISTICS Typical values at +25°C, minimum and maximum values across the full temperature range: TMIN = –40°C to TMAX = +85°C, AVDD = 1.8V, and DRVDD = 1.8V, unless otherwise noted. PARAMETER MIN TYP UNIT 20 MHz SCLK frequency (equal to 1/tSCLK) tSLOADS SEN to SCLK setup time 25 ns tSLOADH SCLK to SEN hold time 25 ns tDSU SDATA setup time 25 ns tDH SDATA hold time 25 ns Copyright © 2009–2010, Texas Instruments Incorporated > dc MAX fSCLK Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 17 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com Serial Register Readout The serial register readout function allows the contents of the internal registers to be read back on the OVR_SDOUT pin. This readback may be useful as a diagnostic check to verify the serial interface communication between the external controller and the ADC. After power-up and device reset, the OVR_SDOUT pin functions as an over-range indicator pin by default. When the readout mode is enabled, OVR_SDOUT outputs the contents of the selected register serially: 1. Set the READOUT register bit to '1'. This setting puts the device in serial readout mode and disables any further writes to the internal registers except the register at address 0. Note that the READOUT bit itself is also located in register 0. The device can exit readout mode by writing READOUT = 0. Only the contents of the register at address 0 cannot be read in the register readout mode. 2. Initiate a serial interface cycle specifying the address of the register (A7 to A0) whose content has to be read. 3. The device serially outputs the contents (D7 to D0) of the selected register on the OVR_SDOUT pin. 4. The external controller can latch the contents at the falling edge of SCLK. 5. To exit the serial readout mode, the reset register bit READOUT = 0 enables writes into all registers of the device. At this point, the OVR_SDOUT pin becomes an over-range indicator pin. Register Address A[7:0] = 0x00 SDATA 0 0 0 0 0 0 Register Data D[7:0] = 0x01 0 0 0 0 0 0 0 0 0 1 SCLK SEN OVR_SDOUT (1) a) Enable Serial Readout (READOUT = 1) Register Address A[7:0] = 0x43 SDATA A7 A6 A5 A4 A3 A2 Register Data D[7:0] = XX (don’t care) A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 0 1 0 0 0 0 0 0 SCLK SEN OVR_SDOUT (2) b) Read Contents of Register 0x43. This Register Has Been Initialized with 0x40 (device is put in global power-down mode). (1) The OVR_SDOUT pin functions as OVR (READOUT = 0). (2) The OVR_SDOUT pin functions as a serial readout (READOUT = 1). Figure 9. Serial Readout Timing Diagram 18 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 RESET TIMING CHARACTERISTICS Power Supply AVDD, DRVDD t1 RESET t3 t2 SEN NOTE: A high pulse on the RESET pin is required in the serial interface mode in case of initialization through hardware reset. For parallel interface operation, RESET must be permanently tied high. Figure 10. Reset Timing Diagram RESET TIMING REQUIREMENTS Typical values at +25°C and minimum and maximum values across the full temperature range: TMIN = –40°C to TMAX = +85°C, unless otherwise noted. PARAMETER t1 Power-on delay t2 Reset pulse width t3 (1) TEST CONDITIONS MIN Delay from power-up of AVDD and DRVDD to RESET pulse active 1 Pulse width of active RESET signal that resets the serial registers 10 Delay from RESET disable to SEN active 100 TYP MAX UNIT ms ns 1 (1) µs ns The reset pulse is needed only when using the serial interface configuration. If the pulse width is greater than 1µs, the device could enter the parallel configuration mode briefly and then return back to serial interface mode. Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 19 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com SERIAL REGISTER MAP Table 10 summarizes the functions supported by the serial interface. Table 10. Serial Interface Register Map (1) (1) REGISTER ADDRESS DEFAULT VALUE AFTER RESET A[7:0] (Hex) D[7:0] (Hex) D7 D6 D5 D4 D3 D2 D1 D0 00 00 0 0 0 0 0 0 RESET READOUT 01 00 0 0 03 00 0 0 0 0 0 HIGH PERF MODE 1 25 00 26 00 0 3D 00 DATA FORMAT 3F 00 40 00 REGISTER DATA LVDS SWING 0 DISABLE GAIN GAIN 0 TEST PATTERNS 0 0 0 0 EN OFFSET CORR 0 0 0 LVDS LVDS DATA CLKOUT STRENGTH STRENGTH 0 0 CUSTOM PATTERN HIGH D[13:6] CUSTOM PATTERN D[5:0] 0 CMOS CLKOUT STRENGTH EN CLKOUT RISE CLKOUT FALL POSN 0 0 DIS LOW LATENCY STBY 0 PDN GLOBAL 0 PDN OBUF 0 0 0 0 0 0 0 0 41 00 LVDS CMOS 42 00 43 00 4A 00 BF 00 CLKOUT RISE POSN 0 CF 00 DB 00 0 0 0 OFFSET CORR TIME CONSTANT 0 0 0 0 EN LVDS SWING OFFSET PEDESTAL FREEZE OFFSET CORR 0 EN CLKOUT FALL 0 0 HIGH PERF MODE 2 0 0 0 0 0 LOW SPEED Multiple functions in a register can be programmed in a single write operation. DESCRIPTION OF SERIAL REGISTERS For best performance, two special mode register bits must be enabled: HI PERF MODE 1 and HI PERF MODE 2. Register Address 00h (Default = 00h) 7 6 5 4 3 2 1 0 0 0 0 0 0 0 RESET READOUT Bits[7:2] Always write '0' Bit 1 RESET: Software reset applied This bit resets all internal registers to the default values and self-clears to 0 (default = 1). Bit 0 READOUT: Serial readout This bit sets the serial readout of the registers. 0 = Serial readout of registers disabled; the OVR_SDOUT pin functions as an over-voltage indicator. 1 = Serial readout enabled; the OVR_SDOUT pin functions as a serial data readout. 20 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 Register Address 01h (Default = 00h) 7 6 5 4 3 2 LVDS SWING Bits[7:2] (1) 0 0 0 0 LVDS SWING: LVDS swing programmability (1) 000000 = 011011 = 110010 = 010100 = 111110 = 001111 = Bits[1:0] 1 Default LVDS swing; ±350mV with external 100Ω termination LVDS swing increases to ±410mV LVDS swing increases to ±465mV LVDS swing increases to ±570mV LVDS swing decreases to ±200mV LVDS swing decreases to ±125mV Always write '0' The EN LVDS SWING register bits must be set to enable LVDS swing control. Register Address 03h (Default = 00h) 7 6 5 4 3 2 1 0 0 0 0 0 0 HI PERF MODE 1 Bits[7:2] Always write '0' Bits[1:0] HI PERF MODE 1: High performance mode 1 00 = Default performance after reset 01 = Do not use 10 = Do not use 11 = For best performance across sampling clock and input signal frequencies, set the HIGH PERF MODE 1 bits Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 21 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com Register Address 25h (Default = 00h) 7 6 5 4 GAIN Bits[7:4] 3 2 DISABLE GAIN 1 0 TEST PATTERNS GAIN: Gain programmability These bits set the gain programmability in 0.5dB steps. 0000 0001 0010 0011 0100 0101 0110 Bit 3 = = = = = = = 0dB gain (default after reset) 0.5dB gain 1.0dB gain 1.5dB gain 2.0dB gain 2.5dB gain 3.0dB gain 0111 1000 1001 1010 1011 1100 = = = = = = 3.5dB gain 4.0dB gain 4.5dB gain 5.0dB gain 5.5dB gain 6dB gain DISABLE GAIN: Gain setting This bit sets the gain. 0 = Gain enabled; gain is set by the GAIN bits only if low-latency mode is disabled 1 = Gain disabled Bits[2:0] TEST PATTERNS: Data capture These bits verify data capture. 000 = Normal operation 001 = Outputs all 0s 010 = Outputs all 1s 011 = Outputs toggle pattern In the ADS4146/49, output data D[13:0] is an alternating sequence of 01010101010101 and 10101010101010. In the ADS4126/29, output data D[11:0] is an alternating sequence of 010101010101 and 101010101010. 100 = Outputs digital ramp In ADS4149/46, output data increments by one LSB (14-bit) every clock cycle from code 0 to code 16383 In ADS4129/26, output data increments by one LSB (12-bit) every 4th clock cycle from code 0 to code 4095 101 = Output custom pattern (use registers 3Fh and 40h for setting the custom pattern) 110 = Unused 111 = Unused 22 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 Register Address 26h (Default = 00h) 7 6 0 5 0 4 0 3 0 0 2 1 0 0 LVDS CLKOUT STRENGTH LVDS DATA STRENGTH Bits[7:2] Always write '0' Bit 1 LVDS CLKOUT STRENGTH: LVDS output clock buffer strength This bit determines the external termination to be used with the LVDS output clock buffer. 0 = 100Ω external termination (default strength) 1 = 50Ω external termination (2x strength) Bit 0 LVDS DATA STRENGTH: LVDS data buffer strength This bit determines the external termination to be used with all of the LVDS data buffers. 0 = 100Ω external termination (default strength) 1 = 50Ω external termination (2x strength) Register Address 3Dh (Default = 00h) 7 6 DATA FORMAT Bits[7:6] 5 4 3 2 1 0 EN OFFSET CORR 0 0 0 0 0 DATA FORMAT: Data format selection These bits selects the data format. 00 = The DFS pin controls data format selection 10 = Twos complement 11 = Offset binary Bit 5 ENABLE OFFSET CORR: Offset correction setting This bit sets the offset correction. 0 = Offset correction disabled 1 = Offset correction enabled Bits[4:0] Always write '0' Register Address 3Fh (Default = 00h) 7 6 5 4 3 2 1 0 CUSTOM PATTERN D13 CUSTOM PATTERN D12 CUSTOM PATTERN D11 CUSTOM PATTERN D10 CUSTOM PATTERN D9 CUSTOM PATTERN D8 CUSTOM PATTERN D7 CUSTOM PATTERN D6 Bits[7:0] CUSTOM PATTERN (1) These bits set the custom pattern. (1) For the ADS414x, output data bits 13 to 0 are CUSTOM PATTERN D[13:0]. For the ADS412x, output data bits 11 to 0 are CUSTOM PATTERN D[13:2]. Register Address 40h (Default = 00h) 7 6 5 4 3 2 1 0 CUSTOM PATTERN D5 CUSTOM PATTERN D4 CUSTOM PATTERN D3 CUSTOM PATTERN D2 CUSTOM PATTERN D1 CUSTOM PATTERN D0 0 0 Bits[7:2] CUSTOM PATTERN (1) These bits set the custom pattern. Bits[1:0] (1) Always write '0' For the ADS414x, output data bits 13 to 0 are CUSTOM PATTERN D[13:0]. For the ADS412x, output data bits 11 to 0 are CUSTOM PATTERN D[13:2]. Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 23 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com Register Address 41h (Default = 00h) 7 6 LVDS CMOS Bits[7:6] 5 4 CMOS CLKOUT STRENGTH 3 EN CLKOUT RISE 2 1 CLKOUT RISE POSN 0 EN CLKOUT FALL LVDS CMOS: Interface selection These bits select the interface. 00 = The DFS pin controls the selection of either LVDS or CMOS interface 10 = The DFS pin controls the selection of either LVDS or CMOS interface 01 = DDR LVDS interface 11 = Parallel CMOS interface Bits[5:4] CMOS CLKOUT STRENGTH Controls strength of CMOS output clock only. 00 = Maximum strength (recommended and used for specified timings) 01 = Medium strength 10 = Low strength 11 = Very low strength Bit 3 ENABLE CLKOUT RISE 0 = Disables control of output clock rising edge 1 = Enables control of output clock rising edge Bits[2:1] CLKOUT RISE POSN: CLKOUT rise control Controls position of output clock rising edge LVDS interface: 00 = Default position (timings are specified in this condition) 01 = Setup reduces by 500ps, hold increases by 500ps 10 = Data transition is aligned with rising edge 11 = Setup reduces by 200ps, hold increases by 200ps CMOS interface: 00 = Default position (timings are specified in this condition) 01 = Setup reduces by 100ps, hold increases by 100ps 10 = Setup reduces by 200ps, hold increases by 200ps 11 = Setup reduces by 1.5ns, hold increases by 1.5ns Bit 0 ENABLE CLKOUT FALL 0 = Disables control of output clock fall edge 1 = Enables control of output clock fall edge Register Address 42h (Default = 00h) 7 6 5 CLKOUT FALL CTRL Bits[7:6] 0 4 3 2 1 0 0 DIS LOW LATENCY STBY 0 0 CLKOUT FALL CTRL Controls position of output clock falling edge LVDS interface: 00 = Default position (timings are specified in this condition) 01 = Setup reduces by 400ps, hold increases by 400ps 10 = Data transition is aligned with rising edge 11 = Setup reduces by 200ps, hold increases by 200ps 24 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 CMOS interface: 00 = Default position (timings are specified in this condition) 01 = Falling edge is advanced by 100ps 10 = Falling edge is advanced by 200ps 11 = Falling edge is advanced by 1.5ns Bits[5:4] Always write '0' Bit 3 DIS LOW LATENCY: Disable low latency This bit disables low-latency mode, 0 = Low latency mode is enabled. Digital functions such as gain, test patterns and offset correction are disabled 1 = Low-latency mode is disabled. This setting enables the digital functions. See the Digital Functions and Low Latency Mode section. Bit 2 STBY: Standby mode This bit sets the standby mode. 0 = Normal operation 1 = Only the ADC and output buffers are powered down; internal reference is active; wake-up time from standby is fast Bits[1:0] Always write '0' Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 25 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com Register Address 43h (Default = 00h) 7 6 5 4 3 2 1 0 PDN GLOBAL 0 PDN OBUF 0 0 EN LVDS SWING Bit 0 Always write '0' Bit 6 PDN GLOBAL: Power-down 0 This bit sets the state of operation. 0 = Normal operation 1 = Total power down; the ADC, internal references, and output buffers are powered down; slow wake-up time. Bit 5 Always write '0' Bit 4 PDN OBUF: Power-down output buffer This bit set the output data and clock pins. 0 = Output data and clock pins enabled 1 = Output data and clock pins powered down and put in high- impedance state Bits[3:2] Always write '0' Bits[1:0] EN LVDS SWING: LVDS swing control 00 01 10 11 = = = = LVDS swing control using LVDS SWING register bits is disabled Do not use Do not use LVDS swing control using LVDS SWING register bits is enabled Register Address 4Ah (Default = 00h) 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 HI PERF MODE 2 Bits[7:1] Always write '0' Bit[0] HI PERF MODE 2: High performance mode 2 This bit is recommended for high input signal frequencies greater than 230MHz. 0 = Default performance after reset 1 = For best performance with high-frequency input signals, set the HIGH PERF MODE 2 bit 26 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 Register Address BFh (Default = 00h) 7 6 5 4 3 2 OFFSET PEDESTAL Bits[7:2] 1 0 0 0 OFFSET PEDESTAL These bits set the offset pedestal. When the offset correction is enabled, the final converged value after the offset is corrected is the ADC mid-code value. A pedestal can be added to the final converged value by programming these bits. Bits[1:0] ADS414x VALUE PEDESTAL 011111 011110 011101 — 000000 — 111111 111110 — 100000 31LSB 30LSB 29LSB — 0LSB — –1LSB –2LSB — –32LSB Always write '0' Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 27 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com Register Address CFh (Default = 00h) 7 6 FREEZE OFFSET CORR BYPASS OFFSET CORR Bit 7 5 4 3 2 OFFSET CORR TIME CONSTANT 1 0 0 0 FREEZE OFFSET CORR This bit sets the freeze offset correction. 0 = Estimation of offset correction is not frozen (bit EN OFFSET CORR must be set) 1 = Estimation of offset correction is frozen (bit EN OFFSET CORR must be set). When frozen, the last estimated value is used for offset correction every clock cycle. See OFFSET CORRECTION, Offset Correction. Bit 6 Always write '0' Bits[5:2] OFFSET CORR TIME CONSTANT These bits set the offset correction time constant for the correction loop time constant in number of clock cycles. Bits[1:0] VALUE TIME CONSTANT (Number of Clock Cycles) 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1M 2M 4M 8M 16M 32M 64M 128M 256M 512M 1G 2G Always write '0' Register Address DBh (Default = 00h) 7 6 5 4 3 2 1 0 0 0 0 0 0 0 0 LOW SPEED Bits[7:1] Always write '0' Bit 0 LOW SPEED: Low-speed mode 0 = Low-speed mode disabled (default state after reset); this setting is recommended for sampling rates greater than 80MSPS. 1 = Low-speed mode enabled; this setting is recommended for sampling rates less than or equal to 80MSPS. 28 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 PIN CONFIGURATION (LVDS MODE) D8_D9_M D6_D7_P D6_D7_M 45 44 43 42 41 D2_D3_M D8_D9_P 46 D2_D3_P D10_D11_M 47 D4_D5_P D10_D11_P 48 D4_D5_M D12_D13_P D12_D13_M RGZ PACKAGE(1) QFN-48 (TOP VIEW) 40 39 38 37 DRGND 1 36 DRGND NC 31 NC OE 7 30 RESET AVDD 8 29 SCLK AGND 9 28 SDATA CLKP 10 27 SEN CLKM 11 26 AVDD AGND 12 25 AGND 13 14 15 16 17 18 19 20 21 22 23 24 AVDD 32 6 RESERVED 5 DFS NC CLKOUTP AVDD D0_D1_M AVDD 33 AVDD 4 AGND CLKOUTM INM D0_D1_P AGND DRVDD 34 INP 35 3 VCM 2 AGND DRVDD OVR_SDOUT (1) The PowerPAD™ is connected to DRGND. Figure 11. ADS414x LVDS Pinout Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 29 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com D10_D11_P D10_D11_M D8_D9_P D8_D9_M D6_D7_P D6_D7_M D4_D5_P D4_D5_M D2_D3_P D2_D3_M D0_D1_P D0_D1_M RGZ PACKAGE(2) QFN-48 (TOP VIEW) 48 47 46 45 44 43 42 41 40 39 38 37 NC CLKOUTP 5 32 NC DFS 6 31 NC OE 7 30 RESET AVDD 8 29 SCLK AGND 9 28 SDATA CLKP 10 27 SEN CLKM 11 26 AVDD AGND 12 25 AGND 13 14 15 16 17 18 19 20 21 22 23 24 AVDD NC 33 RESERVED 34 4 AVDD 3 CLKOUTM NC OVR_SDOUT AVDD DRVDD AVDD 35 AGND 2 AGND DRVDD INP DRGND INM 36 AGND 1 VCM DRGND (2) The PowerPAD is connected to DRGND. Figure 12. ADS412x LVDS Pinout ADS414x, ADS412x Pin Assignments (LVDS Mode) 30 PIN NAME PIN NUMBER # OF PINS FUNCTION AVDD 8, 18, 20, 22, 24, 26 6 I 1.8V analog power supply AGND 9, 12, 14, 17, 19, 25 6 I Analog ground CLKP 10 1 I Differential clock input, positive CLKM 11 1 I Differential clock input, negative INP 15 1 I Differential analog input, positive INM 16 1 I Differential analog input, negative VCM 13 1 O Outputs the common-mode voltage (0.95V) that can be used externally to bias the analog input pins. DESCRIPTION RESET 30 1 I Serial interface RESET input. When using the serial interface mode, the internal registers must initialize through hardware RESET by applying a high pulse on this pin or by using the software reset option; refer to the Serial Interface section. When RESET is tied high, the internal registers are reset to the default values. In this condition, SEN can be used as an analog control pin. RESET has an internal 180kΩ pull-down resistor. SCLK 29 1 I This pin functions as a serial interface clock input when RESET is low. When RESET is high, SCLK has no function and should be tied to ground. This pin has an internal 180kΩ pull-down resistor. SDATA 28 1 I This pin functions as a serial interface data input when RESET is low. When RESET is high, SDATA functions as a STANDBY control pin (see Table 9). This pin has an internal 180kΩ pull-down resistor. SEN 27 1 I This pin functions as a serial interface enable input when RESET is low. When RESET is high, SEN has no function and should be tied to AVDD. This pin has an internal 180kΩ pull-up resistor to AVDD. Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 ADS414x, ADS412x Pin Assignments (LVDS Mode) (continued) PIN NAME PIN NUMBER # OF PINS FUNCTION DESCRIPTION OE 7 1 I Output buffer enable input, active high; this pin has an internal 180kΩ pull-up resistor to DRVDD. DFS 6 1 I Data format select input. This pin sets the DATA FORMAT (twos complement or offset binary) and the LVDS/CMOS output interface type. See Table 7 for detailed information. RESERVED 23 1 I Digital control pin, reserved for future use CLKOUTP 5 1 O Differential output clock, true CLKOUTM 4 1 O Differential output clock, complement D0_D1_P Refer to Figure 11 and Figure 12 1 O Differential output data D0 and D1 multiplexed, true D0_D1_M Refer to Figure 11 and Figure 12 1 O Differential output data D0 and D1 multiplexed, complement D2_D3_P Refer to Figure 11 and Figure 12 1 O Differential output data D2 and D3 multiplexed, true D2_D3_M Refer to Figure 11 and Figure 12 1 O Differential output data D2 and D3 multiplexed, complement D4_D5_P Refer to Figure 11 and Figure 12 1 O Differential output data D4 and D5 multiplexed, true D4_D5_M Refer to Figure 11 and Figure 12 1 O Differential output data D4 and D5 multiplexed, complement D6_D7_P Refer to Figure 11 and Figure 12 1 O Differential output data D6 and D7 multiplexed, true D6_D7_M Refer to Figure 11 and Figure 12 1 O Differential output data D6 and D7 multiplexed, complement D8_D9_P Refer to Figure 11 and Figure 12 1 O Differential output data D8 and D9 multiplexed, true D8_D9_M Refer to Figure 11 and Figure 12 1 O Differential output data D8 and D9 multiplexed, complement D10_D11_P Refer to Figure 11 and Figure 12 1 O Differential output data D10 and D11 multiplexed, true D10_D11_M Refer to Figure 11 and Figure 12 1 O Differential output data D10 and D11 multiplexed, complement D12_D13_P Refer to Figure 11 and Figure 12 1 O Differential output data D12 and D13 multiplexed, true D12_D13_M Refer to Figure 11 and Figure 12 1 O Differential output data D12 and D13 multiplexed, complement OVR_SDOUT 3 1 O This pin functions as an out-of-range indicator after reset, when register bit READOUT = 0, and functions as a serial register readout pin when READOUT = 1. DRVDD 2, 35 2 I 1.8V digital and output buffer supply DRGND 1, 36, PAD 2 I Digital and output buffer ground NC Refer to Figure 11 and Figure 12 — — Copyright © 2009–2010, Texas Instruments Incorporated Do not connect Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 31 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com PIN CONFIGURATION (CMOS MODE) D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 RGZ PACKAGE(3) QFN-48 (TOP VIEW) 48 47 46 45 44 43 42 41 40 39 38 37 DRGND 1 36 DRGND NC 31 NC OE 7 30 RESET AVDD 8 29 SCLK AGND 9 28 SDATA CLKP 10 27 SEN CLKM 11 26 AVDD AGND 12 25 AGND 13 14 15 16 17 18 19 20 21 22 23 24 AVDD 32 6 RESERVED 5 DFS AVDD CLKOUT NC D0 AVDD 33 AVDD 4 AGND UNUSED AGND D1 INP DRVDD 34 INM 35 3 AGND 2 VCM DRVDD OVR_SDOUT (3) The PowerPAD is connected to DRGND. Figure 13. ADS414x CMOS Pinout 32 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0 RGZ PACKAGE(4) QFN-48 (TOP VIEW) 48 47 46 45 44 43 42 41 40 39 38 37 DRGND 1 36 DRGND NC 31 NC OE 7 30 RESET AVDD 8 29 SCLK AGND 9 28 SDATA CLKP 10 27 SEN CLKM 11 26 AVDD AGND 12 25 AGND 13 14 15 16 17 18 19 20 21 22 23 24 AVDD 32 6 RESERVED 5 DFS AVDD CLKOUT NC NC AVDD 33 AVDD 4 AGND UNUSED AGND NC INP DRVDD 34 INM 35 3 AGND 2 VCM DRVDD OVR_SDOUT (4) The PowerPAD is connected to DRGND. Figure 14. ADS412x CMOS Pinout ADS414x, ADS412x Pin Assignments (CMOS Mode) PIN NAME PIN NUMBER # OF PINS FUNCTION AVDD 8, 18, 20, 22, 24, 26 6 I 1.8V analog power supply AGND 9, 12, 14, 17, 19, 25 6 I Analog ground CLKP 10 1 I Differential clock input, positive CLKM 11 1 I Differential clock input, negative INP 15 1 I Differential analog input, positive INM 16 1 I Differential analog input, negative VCM 13 1 O Outputs the common-mode voltage (0.95V) that can be used externally to bias the analog input pins. DESCRIPTION RESET 30 1 I Serial interface RESET input. When using the serial interface mode, the internal registers must initialize through hardware RESET by applying a high pulse on this pin or by using the software reset option; refer to the Serial Interface section. When RESET is tied high, the internal registers are reset to the default values. In this condition, SEN can be used as an analog control pin. RESET has an internal 180kΩ pull-down resistor. SCLK 29 1 I This pin functions as a serial interface clock input when RESET is low. When RESET is high, SCLK has no function and should be tied to ground. This pin has an internal 180kΩ pull-down resistor. SDATA 28 1 I This pin functions as a serial interface data input when RESET is low. When RESET is high, SDATA functions as a STANDBY control pin (see Table 9). This pin has an internal 180kΩ pull-down resistor. SEN 27 1 I This pin functions as a serial interface enable input when RESET is low. When RESET is high, SEN has no function and should be tied to AVDD. This pin has an internal 180kΩ pull-up resistor to AVDD. OE 7 1 I Output buffer enable input, active high; this pin has an internal 180kΩ pull-up resistor to DRVDD. Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 33 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com ADS414x, ADS412x Pin Assignments (CMOS Mode) (continued) PIN NAME PIN NUMBER # OF PINS FUNCTION DESCRIPTION I Data format select input. This pin sets the DATA FORMAT (twos complement or offset binary) and the LVDS/CMOS output interface type. See Table 7 for detailed information. DFS 6 1 RESERVED 23 1 I Digital control pin, reserved for future use CLKOUT 5 1 O CMOS output clock D0 Refer to Figure 13 and Figure 14 1 O 14-bit/12-bit CMOS output data D1 Refer to Figure 13 and Figure 14 1 O 14-bit/12-bit CMOS output data D2 Refer to Figure 13 and Figure 14 1 O 14-bit/12-bit CMOS output data D3 Refer to Figure 13 and Figure 14 1 O 14-bit/12-bit CMOS output data D4 Refer to Figure 13 and Figure 14 1 O 14-bit/12-bit CMOS output data D5 Refer to Figure 13 and Figure 14 1 O 14-bit/12-bit CMOS output data D6 Refer to Figure 13 and Figure 14 1 O 14-bit/12-bit CMOS output data D7 Refer to Figure 13 and Figure 14 1 O 14-bit/12-bit CMOS output data D8 Refer to Figure 13 and Figure 14 1 O 14-bit/12-bit CMOS output data D9 Refer to Figure 13 and Figure 14 1 O D10 Refer to Figure 13 and Figure 14 1 O 14-bit/12-bit CMOS output data D11 Refer to Figure 13 and Figure 14 1 O 14-bit/12-bit CMOS output data D12 Refer to Figure 13 and Figure 14 1 O 14-bit/12-bit CMOS output data D13 Refer to Figure 13 and Figure 14 1 O 14-bit/12-bit CMOS output data OVR_SDOUT 3 1 O This pin functions as an out-of-range indicator after reset, when register bit READOUT = 0, and functions as a serial register readout pin when READOUT = 1. 34 14-bit/12-bit CMOS output data DRVDD 2, 35 2 I 1.8V digital and output buffer supply DRGND 1, 36, PAD 2 I Digital and output buffer ground UNUSED 4 1 — Unused pin in CMOS mode NC Refer to Figure 13 and Figure 14 — — Do not connect Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 TYPICAL CHARACTERISTICS: ADS4149 At +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, low-latency mode, DDR LVDS output interface, and 32k-point FFT, unless otherwise noted. Note that after reset, the device is in 0dB gain mode. FFT FOR 10MHz INPUT SIGNAL 0 SFDR = 88.3dBc SNR = 72.4dBFS SINAD = 72.2dBFS THD = 84dBc -20 -40 -60 -80 SFDR = 87.2dBc SNR = 71.3dBFS SINAD = 71.2dBFS THD = 84.7dBc -20 Amplitude (dB) Amplitude (dB) FFT FOR 170MHz INPUT SIGNAL 0 -100 -40 -60 -80 -100 -120 -120 0 25 100 75 50 125 0 25 Frequency (MHz) Figure 15. FFT FOR 300MHz INPUT SIGNAL -20 Amplitude (dB) Amplitude (dB) -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 75 50 125 FFT FOR TWO-TONE INPUT SIGNAL SFDR = 78.9dBc SNR = 68.8dBFS SINAD = 68.3dBFS THD = 76.6dBc -10 25 100 Figure 16. 0 0 75 50 Frequency (MHz) 100 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 -130 -140 125 Each Tone at -7dBFS Amplitude fIN1 = 185MHz fIN2 = 190MHz Two-Tone IMD = 89.5dBFS SFDR = 95dBFS 0 25 Frequency (MHz) 50 75 100 125 Frequency (MHz) Figure 17. Figure 18. SFDR vs INPUT FREQUENCY SNR vs INPUT FREQUENCY 74 90 73 86 SNR (dBFS) SFDR (dBc) 72 82 78 74 -2dBFS Input, 0dB Gain 71 70 69 -1dBFS Input, 1dB Gain 68 70 -1dBFS Input, 1dB Gain -2dBFS Input, 0dB Gain 66 0 50 100 150 200 250 300 350 400 450 500 67 66 0 50 100 150 200 250 300 350 400 450 500 Input Frequency (MHz) Input Frequency (MHz) Figure 19. Figure 20. Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 35 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com TYPICAL CHARACTERISTICS: ADS4149 (continued) At +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, low-latency mode, DDR LVDS output interface, and 32k-point FFT, unless otherwise noted. Note that after reset, the device is in 0dB gain mode. SFDR vs INPUT FREQUENCY ACROSS INPUT AMPLITUDES (CMOS) SNR vs INPUT FREQUENCY ACROSS INPUT AMPLITUDES (CMOS) 74 90 73 86 SNR (dBFS) SFDR (dBc) 72 82 78 71 70 69 74 68 67 70 0 50 100 150 200 250 350 300 0 150 250 Figure 22. 170MHz 150MHz 72 86 170MHz 71 SINAD (dBFS) 82 220MHz 78 350 300 SINAD ACROSS GAIN AND INPUT FREQUENCY 73 150MHz 300MHz 74 70 220MHz 69 68 300MHz 67 66 400MHz 400MHz 65 70 64 500MHz 66 500MHz 63 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Gain (dB) Gain (dB) Figure 23. Figure 24. PERFORMANCE ACROSS INPUT AMPLITUDE (Single Tone) PERFORMANCE ACROSS INPUT AMPLITUDE (Single Tone) 90 75 90 80 74 80 70 73 60 72 SNR (dBFS) 50 71 SFDR (dBc) 40 30 20 -60 Input Frequency = 40.1MHz -50 -40 -30 -20 Input Amplitude (dBFS) -10 0 76 74 70 73 SNR (dBFS) 60 72 50 71 SFDR (dBc) 70 40 69 30 68 20 -60 70 69 Input Frequency = 170.1MHz 68 -50 -40 -30 -20 -10 0 Input Amplitude (dBFS) Figure 25. Submit Documentation Feedback 75 SFDR (dBFS) SNR (dBFS) 100 SNR (dBFS) 76 SFDR (dBFS) SFDR (dBc, dBFS) 100 36 200 Figure 21. SFDR ACROSS GAIN AND INPUT FREQUENCY SFDR (dBc) 100 Input Frequency (MHz) 90 SFDR (dBc, dBFS) 50 Input Frequency (MHz) Figure 26. Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 TYPICAL CHARACTERISTICS: ADS4149 (continued) At +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, low-latency mode, DDR LVDS output interface, and 32k-point FFT, unless otherwise noted. Note that after reset, the device is in 0dB gain mode. PERFORMANCE vs INPUT COMMON-MODE VOLTAGE 92 SFDR ACROSS TEMPERATURE vs AVDD SUPPLY 75.0 88 74.5 87 74.0 86 Input Frequency = 40MHz AVDD = 1.8V 90 86 73.5 84 73.0 82 72.5 SNR 80 SNR (dBFS) SFDR (dBc) SFDR SFDR (dBc) AVDD = 1.9V 88 85 AVDD = 1.75V 84 AVDD = 1.85V 83 72.0 82 71.5 81 71.0 1.10 80 AVDD = 1.7V 78 76 0.80 0.90 0.85 0.95 1.00 1.05 fIN = 40MHz -40 35 10 -15 Input Common-Mode Voltage (V) 85 60 Temperature (°C) Figure 27. Figure 28. SNR ACROSS TEMPERATURE vs AVDD SUPPLY PERFORMANCE ACROSS DRVDD SUPPLY VOLTAGE 74.0 73.5 89 75.0 88 74.5 SFDR (dBc) 73.0 AVDD = 1.8V, 1.9V 72.5 AVDD = 1.75V 72.0 AVDD = 1.7V SFDR 73.5 86 SNR 73.0 85 72.5 84 71.5 71.0 74.0 87 fIN = 40MHz fIN = 40MHz -40 -15 35 10 60 72.0 83 1.70 85 1.75 1.80 Figure 29. Figure 30. PERFORMANCE ACROSS DRVDD SUPPLY VOLTAGE (CMOS) PERFORMANCE ACROSS INPUT CLOCK AMPLITUDE 90 75.0 89 74 88 74.5 88 73.0 85 SNR 72.5 84 SFDR (dBc) 73.5 86 72 84 71 82 70 SNR (dBFS) 80 69 78 68 76 67 74 66 72 1.80 1.85 DRVDD Supply (V) 72.0 1.90 70 0.15 Input Frequency = 170MHz 0.37 0.75 1.00 1.25 1.60 1.90 2.20 2.40 65 64 2.60 Differential Clock Amplitude (VPP) Figure 31. Copyright © 2009–2010, Texas Instruments Incorporated 73 SFDR (dBc) 86 SNR (dBFS) 74.0 87 SNR (dBFS) SFDR (dBc) SFDR 1.75 1.90 1.85 DRVDD Supply (V) Temperature (°C) 83 1.70 SNR (dBFS) SNR (dBFS) AVDD = 1.85V Figure 32. Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 37 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com TYPICAL CHARACTERISTICS: ADS4149 (continued) At +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, low-latency mode, DDR LVDS output interface, and 32k-point FFT, unless otherwise noted. Note that after reset, the device is in 0dB gain mode. PERFORMANCE ACROSS INPUT CLOCK DUTY CYCLE 88 74.0 87 73.5 86 73.0 INTEGRAL NONLINEARITY 1.5 1.0 72.0 84 THD 83 71.5 0.5 INL (LSB) 72.5 SNR (dBFS) THD (dBc) SNR 85 0 -0.5 71.0 82 -1.0 70.5 81 Input Frequency = 10MHz -1.5 70.0 80 60 65 70 75 0 2k 4k Input Clock Duty Cycle (%) 6k Figure 33. DIFFERENTIAL NONLINEARITY 40 0.3 36 20 16 -0.5 0 10k 12k 14k 16k 6.0 3.8 0.2 1.4 0.7 8239 4 8237 8 -0.4 8238 -0.3 Output Code (LSB) 12.6 12 8229 -0.2 24 8227 -0.1 39.7 28 8228 0 8k 16k 32 8225 0.1 6k 14k 35.7 8226 DNL (LSB) 0.2 RMS = 0.999LSB 8224 Code Occurrence (%) 0.4 4k 12k OUTPUT HISTOGRAM WITH INPUTS SHORTED 44 2k 10k Figure 34. 0.5 0 8k Output Code (LSB) 8235 55 8236 50 8233 45 8234 40 8231 35 8232 30 8230 25 Output Code (LSB) Figure 35. 38 Submit Documentation Feedback Figure 36. Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 TYPICAL CHARACTERISTICS: ADS4146 At +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, low-latency mode, DDR LVDS output interface, and 32k-point FFT, unless otherwise noted. Note that after reset, the device is in 0dB gain mode. FFT FOR 10MHz INPUT SIGNAL 0 SFDR = 94dBc SNR = 72.25dBFS SINAD = 72.20dBFS THD = 91.29dBc -10 -20 -40 -50 -60 -70 -80 SFDR = 82.5dBc SNR = 70.8dBFS SINAD = 70.4dBFS THD = 80.6dBc -10 -20 -30 Amplitude (dB) -30 Amplitude (dB) FFT FOR 170MHz INPUT SIGNAL 0 -40 -50 -60 -70 -80 -90 -90 -100 -100 -110 -110 -120 -120 0 10 20 30 40 60 50 70 80 0 -20 Amplitude (dB) Amplitude (dB) -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 30 40 50 60 70 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 -130 -140 60 80 70 80 Each Tone at -7dBFS Amplitude fIN1 = 185MHz fIN2 = 190MHz Two-Tone IMD = 89.5dBFS SFDR = 95dBFS 0 25 50 Figure 39. SNR vs INPUT FREQUENCY -2dBFS Input, 0dB Gain 73 -1dBFS Input, 1dB Gain -2dBFS Input, 0dB Gain 72 SNR (dBFS) 85 70 125 74 90 75 100 Figure 40. SFDR vs INPUT FREQUENCY 80 75 Frequency (MHz) Frequency (MHz) SFDR (dBc) 50 FFT FOR TWO-TONE INPUT SIGNAL SFDR = 78.1dBc SNR = 68.4dBFS SINAD = 67.8dBFS THD = 75.2dBc 95 40 Figure 38. -10 20 30 Figure 37. FFT FOR 300MHz INPUT SIGNAL 10 20 Frequency (MHz) 0 0 10 Frequency (MHz) 71 70 -1dBFS Input, 1dB Gain 69 68 67 65 66 60 65 0 50 100 150 200 250 300 350 400 450 500 0 100 200 300 400 Input Frequency (MHz) Input Frequency (MHz) Figure 41. Figure 42. Copyright © 2009–2010, Texas Instruments Incorporated 500 Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 600 39 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com TYPICAL CHARACTERISTICS: ADS4146 (continued) At +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, low-latency mode, DDR LVDS output interface, and 32k-point FFT, unless otherwise noted. Note that after reset, the device is in 0dB gain mode. SFDR vs INPUT FREQUENCY ACROSS INPUT AMPLITUDES (CMOS) SNR vs INPUT FREQUENCY ACROSS INPUT AMPLITUDES (CMOS) 74 90 88 73 86 SNR (dBFS) 84 SFDR (dBc) 82 80 78 76 72 71 70 74 72 69 70 68 68 0 50 100 150 200 250 350 300 0 50 100 150 250 200 Input Frequency (MHz) Input Frequency (MHz) Figure 43. Figure 44. SFDR ACROSS GAIN AND INPUT FREQUENCY 88 170MHz SINAD ACROSS GAIN AND INPUT FREQUENCY 73 150MHz 170MHz 84 71 80 69 SINAD (dBFS) SFDR (dBc) 220MHz 220MHz 300MHz 350 300 76 72 150MHz 300MHz 67 400MHz 65 400MHz 68 63 500MHz 500MHz 64 61 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Gain (dB) Figure 45. Figure 46. PERFORMANCE ACROSS INPUT AMPLITUDE (Single Tone) PERFORMANCE ACROSS INPUT AMPLITUDE (Single Tone) 100 76 SFDR (dBFS) 76 105 SFDR (dBFS) 95 75 80 74 85 74 70 73 75 73 60 72 SNR (dBFS) 71 50 70 40 SFDR (dBc, dBFS) 75 65 72 SFDR (dBc) 55 71 SNR (dBFS) SNR (dBFS) 90 SNR (dBFS) SFDR (dBc, dBFS) 0 Gain (dB) 70 45 SFDR (dBc) 69 30 69 35 Input Frequency = 40.1MHz 20 -60 Input Frequency = 170.1MHz 68 -50 -40 -30 -20 Input Amplitude (dBFS) -10 0 25 -60 68 -50 -40 Submit Documentation Feedback -20 -10 0 Input Amplitude (dBFS) Figure 47. 40 -30 Figure 48. Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 TYPICAL CHARACTERISTICS: ADS4146 (continued) At +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, low-latency mode, DDR LVDS output interface, and 32k-point FFT, unless otherwise noted. Note that after reset, the device is in 0dB gain mode. PERFORMANCE vs INPUT COMMON-MODE VOLTAGE 90 SFDR ACROSS TEMPERATURE vs AVDD SUPPLY 75.5 88 75.0 87 74.5 86 Input Frequency = 40MHz 88 84 74.0 82 73.5 80 73.0 SNR SNR (dBFS) SFDR (dBc) SFDR SFDR (dBc) AVDD = 1.85V 86 84 83 AVDD = 1.75V 72.5 82 76 72.0 81 71.5 1.10 80 0.90 0.85 0.95 AVDD = 1.9V 85 78 74 0.80 AVDD = 1.8V 1.00 1.05 AVDD = 1.7V fIN = 40MHz -40 Figure 50. SNR ACROSS TEMPERATURE vs AVDD SUPPLY PERFORMANCE ACROSS DRVDD SUPPLY VOLTAGE 75.5 88 75.0 74.5 SFDR SFDR (dBc) AVDD = 1.75V, 1.85V 73.5 73.0 75.0 87 AVDD = 1.8V AVDD = 1.7V AVDD = 1.9V 72.5 74.5 86 SNR (dBFS) SNR (dBFS) 85 60 Temperature (°C) Figure 49. 74.0 35 10 -15 Input Common-Mode Voltage (V) 74.0 85 SNR 73.5 84 72.0 71.0 73.0 83 71.5 fIN = 40MHz fIN = 40MHz -40 -15 35 10 60 72.5 82 1.70 85 1.75 1.80 DRVDD Supply (V) Temperature (°C) Figure 51. Figure 52. PERFORMANCE ACROSS DRVDD SUPPLY VOLTAGE (CMOS) 89 75.0 88 74.5 PERFORMANCE ACROSS INPUT CLOCK AMPLITUDE 90 85 73.0 SNR 72.5 SFDR (dBc) SFDR (dBc) 73.5 74 78 72 74 70 70 68 SNR (dBFS) 66 66 62 64 58 83 1.70 1.75 1.80 1.85 DRVDD Supply (V) 72.0 1.90 Input Frequency = 170MHz 54 62 60 0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 Differential Clock Amplitude (VPP) Figure 53. Copyright © 2009–2010, Texas Instruments Incorporated 76 SFDR (dBc) 82 SNR (dBFS) 86 SNR (dBFS) 74.0 87 78 86 SFDR 84 1.90 1.85 Figure 54. Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 41 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com TYPICAL CHARACTERISTICS: ADS4146 (continued) At +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, low-latency mode, DDR LVDS output interface, and 32k-point FFT, unless otherwise noted. Note that after reset, the device is in 0dB gain mode. INTEGRAL NONLINEARITY 75.0 1.0 87 74.5 0.8 86 74.0 85 73.5 73.0 72.5 83 0.4 INL (LSB) SNR 84 0.6 SNR (dBFS) THD (dBc) PERFORMANCE ACROSS INPUT CLOCK DUTY CYCLE 88 THD 82 72.0 81 71.5 0.2 0 -0.2 -0.4 -0.6 -0.8 Input Frequency = 10MHz 71.0 80 60 65 70 -1.0 75 0 2k 6k 4k Input Clock Duty Cycle (%) Figure 55. 10k 36 0.4 32 Code Occurrence (%) 0.3 0.2 0.1 0 -0.1 -0.2 31.1 27.5 23.1 24 20 16 12.2 12 8 -0.4 4 -0.5 0 4.8 1.0 8230 8228 16k 8226 14k 8227 12k 8224 10k 8225 8k 8222 6k Output Code (LSB) 8223 0.3 4k 16k RMS = 1.137LSB 28 -0.3 2k 14k OUTPUT HISTOGRAM WITH INPUTS SHORTED 0.5 0 12k Figure 56. DIFFERENTIAL NONLINEARITY DNL (LSB) 8k Output Code (LSB) 8236 55 8234 50 8235 45 8232 40 8233 35 8231 30 8229 25 Output Code (LSB) Figure 57. 42 Submit Documentation Feedback Figure 58. Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 TYPICAL CHARACTERISTICS: ADS4129 At +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, low-latency mode, DDR LVDS output interface, and 32k-point FFT, unless otherwise noted. Note that after reset, the device is in 0dB gain mode. FFT FOR 10MHz INPUT SIGNAL 0 SFDR = 87.7dBc SNR = 70.3dBFS SINAD = 70.2dBFS THD = 83.5dBc -20 -40 -60 -80 SFDR = 87.2dBc SNR = 69.6dBFS SINAD = 69.4dBFS THD = 83.9dBc -20 Amplitude (dB) Amplitude (dB) FFT FOR 170MHz INPUT SIGNAL 0 -100 -40 -60 -80 -100 -120 -120 0 25 100 75 50 125 0 25 Frequency (MHz) 50 Figure 59. FFT FOR 300MHz INPUT SIGNAL -40 Amplitude (dB) Amplitude (dB) -20 -60 -80 -100 -120 75 50 100 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 -130 -140 125 Each Tone at -7dBFS Amplitude fIN1 = 185MHz fIN2 = 190MHz Two-Tone IMD = 90dBFS SFDR = 94dBFS 0 25 Frequency (MHz) 50 75 100 125 Frequency (GHz) Figure 61. Figure 62. SFDR vs INPUT FREQUENCY SNR vs INPUT FREQUENCY 71.0 95 70.5 90 -2dBFS Input, 0dB Gain 70.0 -1dBFS Input, 1dB Gain 69.5 SNR (dBFS) 85 SFDR (dBc) 125 FFT FOR TWO-TONE INPUT SIGNAL SFDR = 79.3dBc SNR = 68dBFS SINAD = 67.5dBFS THD = 76.3dBc 25 100 Figure 60. 0 0 75 Frequency (MHz) 80 -2dBFS Input, 0dB Gain 75 70 69.0 68.5 -1dBFS Input, 1dB Gain 68.0 67.5 67.0 66.5 65 66.0 60 65.5 0 50 100 150 200 250 300 350 400 450 500 Input Frequency (MHz) 0 50 100 150 200 250 300 350 400 450 500 Input Frequency (MHz) Figure 63. Copyright © 2009–2010, Texas Instruments Incorporated Figure 64. Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 43 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com TYPICAL CHARACTERISTICS: ADS4129 (continued) At +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, low-latency mode, DDR LVDS output interface, and 32k-point FFT, unless otherwise noted. Note that after reset, the device is in 0dB gain mode. SFDR vs INPUT FREQUENCY ACROSS INPUT AMPLITUDES (CMOS) SNR vs INPUT FREQUENCY ACROSS INPUT AMPLITUDES (CMOS) 71.0 90 70.5 70.0 SNR (dBFS) SFDR (dBc) 86 82 78 69.5 69.0 68.5 68.0 74 67.5 67.0 70 0 50 100 150 200 250 350 300 0 50 100 150 250 200 350 300 Input Frequency (MHz) Input Frequency (MHz) Figure 65. Figure 66. SFDR ACROSS GAIN AND INPUT FREQUENCY SINAD ACROSS GAIN AND INPUT FREQUENCY 90 71 170MHz 150MHz 70 86 150MHz 82 SINAD (dBFS) SFDR (dBc) 69 220MHz 78 300MHz 74 68 300MHz 66 65 400MHz 400MHz 70 64 500MHz 500MHz 66 63 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Gain (dB) Gain (dB) Figure 67. Figure 68. PERFORMANCE ACROSS INPUT AMPLITUDE (Single Tone) PERFORMANCE ACROSS INPUT AMPLITUDE (Single Tone) 105 105 72.0 74 SFDR (dBFS) SFDR (dBFS) 85 71.0 75 70.5 65 70.0 55 69.5 95 73 85 72 75 71 65 70 SFDR (dBc) 55 69 SNR (dBFS) SFDR (dBc) 45 69.0 45 68 Input Frequency = 170.1MHz Input Frequency = 40.1MHz 35 -50 68.5 -40 -30 SNR (dBFS) SNR (dBFS) SFDR (dBc, dBFS) 71.5 SNR (dBFS) SFDR (dBc, dBFS) 95 -20 Input Amplitude (dBFS) -10 0 35 -50 67 -40 -30 Submit Documentation Feedback -20 -10 0 Input Amplitude (dBFS) Figure 69. 44 170MHz 220MHz 67 Figure 70. Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 TYPICAL CHARACTERISTICS: ADS4129 (continued) At +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, low-latency mode, DDR LVDS output interface, and 32k-point FFT, unless otherwise noted. Note that after reset, the device is in 0dB gain mode. PERFORMANCE vs INPUT COMMON-MODE VOLTAGE SFDR ACROSS TEMPERATURE vs AVDD SUPPLY 72.0 87 92 71.5 86 90 71.0 88 70.5 94 AVDD = 1.8V 86 70.0 84 69.5 SFDR 82 0.90 0.85 0.95 1.00 1.05 AVDD = 1.9V 84 AVDD = 1.85V 83 AVDD = 1.75V 82 69.0 80 78 0.80 SFDR (dBc) SNR 85 SNR (dBFS) SFDR (dBc) Input Frequency = 40MHz 68.5 81 68.0 1.10 80 AVDD = 1.7V fIN = 40MHz -40 Figure 72. SNR ACROSS TEMPERATURE vs AVDD SUPPLY PERFORMANCE ACROSS DRVDD SUPPLY VOLTAGE 72.0 88 72.0 fIN = 40MHz 71.5 87 SFDR SFDR (dBc) 70.5 70.0 69.5 AVDD = 1.7V AVDD = 1.75V AVDD = 1.8V AVDD = 1.85V AVDD = 1.9V 69.0 68.5 -15 SNR 85 70.5 84 70.0 69.5 83 fIN = 40MHz 35 10 60 69.0 82 1.70 68.0 -40 71.0 86 85 1.75 1.80 Figure 73. Figure 74. PERFORMANCE ACROSS DRVDD SUPPLY VOLTAGE (CMOS) PERFORMANCE ACROSS INPUT CLOCK AMPLITUDE 90 72.0 88 74 88 70.5 85 SNR 70.0 84 69.5 83 72 84 71 82 70 80 69 78 68 SNR (dBFS) 76 67 74 66 72 1.80 1.85 DRVDD Supply (V) 69.0 1.90 70 0.15 Input Frequency = 170MHz 0.37 0.75 1.00 1.25 1.60 1.90 2.20 2.40 65 64 2.60 Differential Clock Amplitude (VPP) Figure 75. Copyright © 2009–2010, Texas Instruments Incorporated 73 SFDR (dBc) 86 SNR (dBFS) 71.0 86 SFDR (dBc) SFDR SNR (dBFS) SFDR (dBc) 71.5 1.75 1.90 1.85 DRVDD Supply (V) Temperature (°C) 82 1.70 SNR (dBFS) SNR (dBFS) 71.0 87 85 60 Temperature (°C) Figure 71. 71.5 35 10 -15 Input Common-Mode Voltage (V) Figure 76. Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 45 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com TYPICAL CHARACTERISTICS: ADS4129 (continued) At +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, low-latency mode, DDR LVDS output interface, and 32k-point FFT, unless otherwise noted. Note that after reset, the device is in 0dB gain mode. 85 72.5 84 72.0 83 71.5 THD 82 71.0 70.5 81 SNR 80 INTEGRAL NONLINEARITY 0.3 0.2 0.1 INL (LSB) 73.0 SNR (dBFS) THD (dBc) PERFORMANCE ACROSS INPUT CLOCK DUTY CYCLE 86 0 -0.1 70.0 -0.2 69.5 79 Input Frequency = 10MHz -0.3 69.0 78 25 30 35 40 45 50 55 60 65 70 75 0 500 1000 Input Clock Duty Cycle (%) 1500 2000 2500 3000 3500 4000 Output Code (LSB) Figure 77. Figure 78. DIFFERENTIAL NONLINEARITY 0.3 DNL (LSB) 0.2 0.1 0 -0.1 -0.2 -0.3 0 500 1000 1500 2000 2500 3000 3500 4000 Output Code (LSB) Figure 79. 46 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 TYPICAL CHARACTERISTICS: ADS4126 At +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, low-latency mode, DDR LVDS output interface, and 32k-point FFT, unless otherwise noted. Note that after reset, the device is in 0dB gain mode. FFT FOR 10MHz INPUT SIGNAL 0 SFDR = 94dBc SNR = 70dBFS SINAD = 70dBFS THD = 93dBc -20 SFDR = 82.5dBc SNR = 69.2dBFS SINAD = 68.9dBFS THD = 80.7dBc -20 -40 Amplitude (dB) Amplitude (dB) FFT FOR 170MHz INPUT SIGNAL 0 -60 -80 -100 -40 -60 -80 -100 -120 -120 0 10 20 30 40 60 50 70 80 0 50 -40 -60 -80 -100 -120 30 40 50 60 60 70 80 FFT FOR TWO-TONE INPUT SIGNAL Amplitude (dB) Amplitude (dB) -20 70 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 -130 -140 80 Each Tone at -7dBFS Amplitude fIN1 = 185MHz fIN2 = 190MHz Two-Tone IMD = 89dBFS SFDR = 93dBFS 0 10 20 30 40 50 Frequency (MHz) Frequency (MHz) Figure 82. Figure 83. SFDR vs INPUT FREQUENCY 60 70 80 SNR vs INPUT FREQUENCY 71.0 95 70.5 90 -2dBFS Input, 0dB Gain 70.0 69.5 SNR (dBFS) 85 SFDR (dBc) 40 Figure 81. SFDR = 78.3dBc SNR = 67.6dBFS SINAD = 67dBFS THD = 75.3dBc 20 30 Figure 80. FFT FOR 300MHz INPUT SIGNAL 10 20 Frequency (MHz) 0 0 10 Frequency (MHz) 80 75 70 69.0 68.5 68.0 -1dBFS Input, 1dB Gain 67.5 67.0 66.5 -1dBFS Input, 1dB Gain -2dBFS Input, 0dB Gain 65 60 66.0 65.5 65.0 0 50 100 150 200 250 300 350 400 450 500 Input Frequency (MHz) 0 50 100 150 200 250 300 350 400 450 500 Input Frequency (MHz) Figure 84. Copyright © 2009–2010, Texas Instruments Incorporated Figure 85. Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 47 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com TYPICAL CHARACTERISTICS: ADS4126 (continued) At +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, low-latency mode, DDR LVDS output interface, and 32k-point FFT, unless otherwise noted. Note that after reset, the device is in 0dB gain mode. SFDR vs INPUT FREQUENCY ACROSS INPUT AMPLITUDES (CMOS) SNR vs INPUT FREQUENCY ACROSS INPUT AMPLITUDES (CMOS) 90 71.5 88 71.0 86 70.5 82 70.0 SNR (dBFS) SFDR (dBc) 84 80 78 76 69.5 69.0 68.5 74 68.0 72 67.5 70 68 67.0 0 50 100 150 200 250 350 300 0 50 100 Input Frequency (MHz) 150 Figure 86. 170MHz 250 350 300 Figure 87. SFDR ACROSS GAIN AND INPUT FREQUENCY 88 200 Input Frequency (MHz) SINAD ACROSS GAIN AND INPUT FREQUENCY 71 150MHz 170MHz 70 84 69 SINAD (dBFS) SFDR (dBc) 80 220MHz 300MHz 76 72 400MHz 150MHz 68 67 220MHz 66 400MHz 300MHz 65 64 68 63 500MHz 64 500MHz 62 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 Gain (dB) Gain (dB) Figure 88. Figure 89. PERFORMANCE ACROSS INPUT AMPLITUDE (Single Tone) PERFORMANCE ACROSS INPUT AMPLITUDE (Single Tone) 105 105 74 74 SFDR (dBFS) 73 85 72 65 71 SNR (dBFS) 55 70 69 SFDR (dBc) 95 73 85 72 75 71 65 70 SNR (dBFS) 55 69 SFDR (dBc) 45 68 45 68 Input Frequency = 40.1MHz 35 -50 Input Frequency = 170.1MHz 67 -40 -30 -20 Input Amplitude (dBFS) -10 0 35 -50 67 -40 -30 Submit Documentation Feedback -20 -10 0 Input Amplitude (dBFS) Figure 90. 48 SNR (dBFS) 75 SFDR (dBc, dBFS) 95 SNR (dBFS) SFDR (dBc, dBFS) SFDR (dBFS) Figure 91. Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 TYPICAL CHARACTERISTICS: ADS4126 (continued) At +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, low-latency mode, DDR LVDS output interface, and 32k-point FFT, unless otherwise noted. Note that after reset, the device is in 0dB gain mode. PERFORMANCE vs INPUT COMMON-MODE VOLTAGE SFDR ACROSS TEMPERATURE vs AVDD SUPPLY 71.0 90 88 SNR 88 70.5 86 70.0 87 69.5 82 69.0 SFDR (dBc) SFDR 84 SNR (dBFS) SFDR (dBc) 86 AVDD = 1.8V 84 83 AVDD = 1.75V AVDD = 1.7V 82 68.5 80 81 Input Frequency = 40MHz 78 0.80 0.90 0.85 0.95 1.00 1.05 AVDD = 1.85V AVDD = 1.9V 85 68.0 1.10 80 fIN = 40MHz -40 35 10 -15 Input Common-Mode Voltage (V) 85 60 Temperature (°C) Figure 92. Figure 93. SNR ACROSS TEMPERATURE vs AVDD SUPPLY PERFORMANCE ACROSS DRVDD SUPPLY VOLTAGE 73.0 87 72.0 fIN = 40MHz 72.5 86 71.5 SFDR SFDR (dBc) 70.5 AVDD = 1.75V, 1.8V, 1.9V 70.0 85 72.0 84 71.5 SNR (dBFS) SNR (dBFS) AVDD = 1.7V, 1.85V 71.0 71.0 83 SNR 70.5 82 69.5 fIN = 40MHz -40 35 10 -15 60 70.0 81 1.70 69.0 85 1.75 1.80 DRVDD Supply (V) Temperature (°C) Figure 94. Figure 95. PERFORMANCE ACROSS DRVDD SUPPLY VOLTAGE (CMOS) 87 73.0 86 72.5 PERFORMANCE ACROSS INPUT CLOCK AMPLITUDE 78 86 76 71.0 83 SNR 70.5 82 SFDR (dBc) 71.5 84 78 72 74 70 70 68 SNR (dBFS) 66 66 62 64 58 1.75 1.80 1.85 DRVDD Supply (V) 70.0 1.90 54 0.1 Input Frequency = 170MHz 62 60 0.3 0.5 0.7 0.9 1.1 1.3 1.5 1.7 1.9 2.1 2.3 Differential Clock Amplitude (VPP) Figure 96. Copyright © 2009–2010, Texas Instruments Incorporated 74 SFDR (dBc) SNR (dBFS) 72.0 85 SNR (dBFS) SFDR (dBc) 90 82 SFDR 81 1.70 1.90 1.85 Figure 97. Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 49 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com TYPICAL CHARACTERISTICS: ADS4126 (continued) At +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, low-latency mode, DDR LVDS output interface, and 32k-point FFT, unless otherwise noted. Note that after reset, the device is in 0dB gain mode. PERFORMANCE ACROSS INPUT CLOCK DUTY CYCLE 85 71.5 0.2 71.0 0.1 SNR 70.5 83 THD 70.0 82 81 INL (LSB) 0.3 SNR (dBFS) 72.0 84 THD (dBc) INTEGRAL NONLINEARITY 86 0 -0.1 69.5 -0.2 69.0 -0.3 Input Frequency = 10MHz 80 25 30 35 40 45 50 55 60 65 70 75 0 500 1000 Input Clock Duty Cycle (%) 1500 2000 2500 3000 3500 4000 Output Code (LSB) Figure 98. Figure 99. DIFFERENTIAL NONLINEARITY 0.20 0.15 DNL (LSB) 0.10 0.05 0 -0.05 -0.10 -0.15 -0.20 0 500 1000 1500 2000 2500 3000 3500 4000 Output Code (LSB) Figure 100. 50 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 TYPICAL CHARACTERISTICS: COMMON At +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, low-latency mode, DDR LVDS output interface, and 32k-point FFT, unless otherwise noted. Note that after reset, the device is in 0dB gain mode. CMRR ACROSS FREQUENCY -20 Input Frequency = 70MHz 50mVPP Signal Superimposed on Input Common-Mode Voltage (0.95V) -25 fIN = 70MHz fCM = 10MHz, 100mVPP SFDR = 81dBc Amplitude (fIN) = -1dBFS Amplitude (fCM) = -74dBFS Amplitude (fIN + fCM) = -87dBFS Amplitude (fIN - fCM) = -86dBFS -20 Amplitude (dB) -30 CMRR (dB) CMRR SPECTRUM 0 -35 -40 -45 -40 -60 -80 fIN + fCM = 80MHz fCM = 10MHz -120 -55 -140 -60 50 0 100 150 200 250 300 0 25 75 50 Frequency of Input Common-Mode Signal (MHz) 125 100 Frequency (MHz) Figure 101. Figure 102. PSRR ACROSS FREQUENCY ZOOMED VIEW OF SPECTRUM WITH PSRR SIGNAL 0 -20 Input Frequency = 10MHz 50mVPP Signal Applied on AVDD -25 -35 -40 PSRR (dB) on AVDD Supply fIN = 10MHz fPSRR = 1MHz Amplitude (fIN) = -1dBFS Amplitude (fPSRR) = -81dBFS Amplitude (fIN + fPSRR) = -67.7dBFS Amplitude (fIN - fPSRR) = -68.8dBFS fIN -20 Amplitude (dB) -30 PSRR (dB) fIN - fCM = 60MHz -100 -50 -40 fIN - fPSRR -60 fIN + fPSRR -80 -45 -100 -50 -120 fPSRR -140 -55 0 10 20 30 40 50 60 70 80 90 100 0 5 10 15 Frequency of Signal on AVDD (MHz) 20 25 30 35 40 45 50 Frequency (MHz) Figure 103. Figure 104. POWER ACROSS SAMPLING FREQUENCY DRVDD CURRENT ACROSS SAMPLING FREQUENCY 70 200 180 AVDD Power (mW) 140 120 100 80 DRVDD Power 200mV LVDS 60 40 DRVDD Power 350mV LVDS 20 60 DRVDD Current (mA) 160 Power (mW) fIN = 70MHz LVDS, 350mV Swing 50 LVDS, 200mV Swing 40 30 20 CMOS, 8pF Load Capacitor 10 CMOS, 6pF Load Capacitor 0 0 0 25 50 75 100 125 150 175 200 225 250 0 25 50 75 100 125 150 175 200 225 250 Sampling Frequency (MSPS) Sampling Frequency (MSPS) Figure 105. Figure 106. Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 51 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com TYPICAL CHARACTERISTICS: CONTOUR At +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, low-latency mode, DDR LVDS output interface, and 32k-point FFT, unless otherwise noted. Note that after reset, the device is in 0dB gain mode. SFDR ACROSS INPUT AND SAMPLING FREQUENCIES (1dB Gain) Applies to ADS414x and ADS412x 250 240 88 86 fS - Sampling Frequency - MSPS 220 78 82 84 82 84 70 84 200 180 84 82 74 86 84 84 86 66 78 88 160 82 82 140 74 70 86 88 78 84 120 74 66 84 100 88 88 80 70 82 74 88 65 10 50 100 70 78 86 150 62 66 200 250 300 350 400 450 500 fIN - Input Frequency - MHz 60 65 70 75 80 85 90 SFDR - dBFS Figure 107. 52 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 TYPICAL CHARACTERISTICS: CONTOUR (continued) At +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, low-latency mode, DDR LVDS output interface, and 32k-point FFT, unless otherwise noted. Note that after reset, the device is in 0dB gain mode. SFDR ACROSS INPUT AND SAMPLING FREQUENCIES (6dB Gain) Applies to ADS414x and ADS412x 250 240 86 84 72 82 86 fS - Sampling Frequency - MSPS 220 76 80 84 84 68 200 82 84 72 82 82 180 80 76 84 86 88 160 84 140 82 86 86 86 76 80 120 72 88 88 100 72 84 88 76 80 86 82 84 72 65 10 50 100 150 64 80 200 250 300 350 400 450 500 fIN - Input Frequency - MHz 60 65 70 75 80 85 90 SFDR - dBFS Figure 108. Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 53 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com TYPICAL CHARACTERISTICS: CONTOUR (continued) At +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, low-latency mode, DDR LVDS output interface, and 32k-point FFT, unless otherwise noted. Note that after reset, the device is in 0dB gain mode. ADS414x: SNR ACROSS INPUT AND SAMPLING FREQUENCIES (1dB Gain) 250 240 68 71 69 70 71.5 fS - Sampling Frequency - MSPS 220 70.5 67 200 180 71 160 68 70 71.5 72 69 140 70.5 67 120 70 66 68 100 71 72 80 69 71.5 70 72.5 70.5 10 50 100 67 150 200 65 66 68 65 250 300 64 350 400 450 500 70 71 72 73 fIN - Input Frequency - MHz 63 64 65 66 67 68 69 SNR - dBFS Figure 109. 54 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 TYPICAL CHARACTERISTICS: CONTOUR (continued) At +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, low-latency mode, DDR LVDS output interface, and 32k-point FFT, unless otherwise noted. Note that after reset, the device is in 0dB gain mode. ADS414x: SNR ACROSS INPUT AND SAMPLING FREQUENCIES (6dB Gain) 250 240 66 67 65 66.5 65.5 fS - Sampling Frequency - MSPS 220 200 66.5 180 67 65 66 67.5 160 65.5 67 140 66.5 120 65 66.5 100 66 67.5 65.5 67 80 66 10 50 100 150 200 64.5 65 65.5 65 250 300 350 64 400 63.5 450 500 fIN - Input Frequency - MHz 62 63 64 65 66 67 68 SNR - dBFS Figure 110. Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 55 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com TYPICAL CHARACTERISTICS: CONTOUR (continued) At +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, low-latency mode, DDR LVDS output interface, and 32k-point FFT, unless otherwise noted. Note that after reset, the device is in 0dB gain mode. ADS412x SNR ACROSS INPUT AND SAMPLING FREQUENCIES (1dB Gain) 250 240 69.5 68.5 67 69 fS - Sampling Frequency - MSPS 220 200 68 180 68.5 69.5 70 160 66 69 67 140 68 120 68.5 100 66 69.5 70 67 69 80 68.5 68 10 50 100 66 67 65 150 200 250 300 350 65 400 64 450 500 fIN - Input Frequency - MHz 62 63 64 65 66 67 68 69 70 71 SNR - dBFS Figure 111. 56 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 TYPICAL CHARACTERISTICS: CONTOUR (continued) At +25°C, AVDD = 1.8V, DRVDD = 1.8V, maximum rated sampling frequency, sine wave input clock, 1.5VPP differential clock amplitude, 50% clock duty cycle, –1dBFS differential analog input, 1dB gain, low-latency mode, DDR LVDS output interface, and 32k-point FFT, unless otherwise noted. Note that after reset, the device is in 0dB gain mode. ADS412x SNR ACROSS INPUT AND SAMPLING FREQUENCIES (6dB Gain) 250 240 66 65 65.5 64.5 fS - Sampling Frequency - MSPS 220 200 180 66 66.5 65.5 65 160 64.5 66 140 66.5 67 120 65.5 100 65 66 65.5 80 67 65 65 10 50 100 64 63.5 64.5 66 150 200 250 63 300 350 400 450 500 fIN - Input Frequency - MHz 62 63 64 65 66 67 68 SNR - dBFS Figure 112. Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 57 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com APPLICATION INFORMATION THEORY OF OPERATION The ADS414x/2x is a family of high-performance and low-power 12-bit and 14-bit ADCs with maximum sampling rates up to 250MSPS. The conversion process is initiated by a rising edge of the external input clock and the analog input signal is sampled. The sampled signal is sequentially converted by a series of small resolution stages, with the outputs combined in a digital correction logic block. At every clock edge the sample propagates through the pipeline, resulting in a data latency of 10 clock cycles. The output is available as 14-bit data or 12-bit data, in DDR LVDS mode or CMOS mode, and coded in either straight offset binary or binary twos complement format. ANALOG INPUT The analog input consists of a switched-capacitor-based, differential, sample-and-hold architecture. This differential topology results in very good ac performance even for high input frequencies at high sampling rates. The INP and INM pins must be externally biased around a common-mode voltage of 0.95V, available on the VCM pin. For a full-scale differential input, each input INP and INM pin must swing symmetrically between (VCM + 0.5V) and (VCM – 0.5V), resulting in a 2VPP differential input swing. The input sampling circuit has a high 3dB bandwidth that extends up to 550MHz (measured from the input pins to the sampled voltage). Figure 113 shows an equivalent circuit for the analog input. Sampling Switch LPKG 2nH INP 10W CBOND 1pF RESR 200W 100W INM CPAR2 1pF RESR 200W CSAMP 2pF CPAR1 0.5pF RON 15W 100W CBOND 1pF RON 15W 3pF 3pF LPKG 2nH Sampling Capacitor RCR Filter RON 15W CPAR2 1pF CSAMP 2pF Sampling Capacitor Sampling Switch Figure 113. Analog Input Equivalent Circuit Drive Circuit Requirements For optimum performance, the analog inputs must be driven differentially. This technique improves the common-mode noise immunity and even-order harmonic rejection. A 5Ω to 15Ω resistor in series with each input pin is recommended to damp out ringing caused by package parasitics. It is also necessary to present low impedance (less than 50Ω) for the common-mode switching currents. This impedance can be achieved by using two resistors from each input terminated to the common-mode voltage (VCM). Note that the device includes an internal R-C filter from each input to ground. The purpose of this filter is to absorb the glitches caused by the opening and closing of the sampling capacitors. The cutoff frequency of the R-C filter involves a trade-off. A lower cutoff frequency (larger C) absorbs glitches better, but also reduces the input bandwidth and the maximum input frequency that can be supported. On the other hand, with no internal R-C filter, high input frequency can be supported but now the sampling glitches must be supplied by the external driving circuit. The inductance of the package bond wires limits the ability of the external driving circuit to support the sampling glitches. 58 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 In the ADS414x/2x, the R-C component values have been optimized while supporting high input bandwidth (550MHz). However, in applications where very high input frequency support is not required, filtering of the glitches can be improved further with an external R-C-R filter; see Figure 116 and Figure 117). In addition, the drive circuit may have to be designed to provide a low insertion loss over the desired frequency range and matched impedance to the source. While designing the drive circuit, the ADC impedance must be considered. Figure 114 and Figure 115 show the impedance (ZIN = RIN || CIN) looking into the ADC input pins. Differential Input Resistance (kW) 100.00 10.00 1.00 0.10 0.01 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Input Frequency (GHz) Figure 114. ADC Analog Input Resistance (RIN) Across Frequency Differential Input Capacitance (pF) 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 Input Frequency (GHz) Figure 115. ADC Analog Input Capacitance (CIN) Across Frequency Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 59 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com Driving Circuit Two example driving circuit configurations are shown in Figure 116 and Figure 117—one optimized for low bandwidth and the other one for high bandwidth to support higher input frequencies. In Figure 116, an external R-C-R filter with 3.3pF is used to help absorb sampling glitches. The R-C-R filter limits the bandwidth of the drive circuit, making it suitable for low input frequencies (up to 250MHz). Transformers such as ADT1-1WT or WBC1-1 can be used up to 250MHz. For higher input frequencies, the R-C-R filter can be dropped. Together with the lower series resistors (5Ω to 10Ω), this drive circuit provides higher bandwidth to support frequencies up to 500MHz (as shown in Figure 117). A transmission line transformer such as ADTL2-18 can be used. Note that both the drive circuits have been terminated by 50Ω near the ADC side. The termination is accomplished by a 25Ω resistor from each input to the 0.95V common-mode (VCM) from the device. This termination allows the analog inputs to be biased around the required common-mode voltage. 10W to 15W T2 3.6nH INP T1 0.1mF 0.1mF 25W 50W RIN 3.3pF 25W CIN 50W INM 1:1 1:1 10W to 15W 3.6nH VCM ADS41xx Figure 116. Drive Circuit with Low Bandwidth (for Low Input Frequencies) 5W to 10W T2 T1 INP 0.1mF 0.1mF 25W RIN CIN 25W INM 1:1 1:1 5W to 10W VCM ADS41xx Figure 117. Drive Circuit with High Bandwidth (for High Input Frequencies) 60 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 The mismatch in the transformer parasitic capacitance (between the windings) results in degraded even-order harmonic performance. Connecting two identical RF transformers back-to-back helps minimize this mismatch and good performance is obtained for high-frequency input signals. An additional termination resistor pair may be required between the two transformers, as shown in Figure 116 and Figure 117. The center point of this termination is connected to ground to improve the balance between the P (positive) and M (negative) sides. The values of the terminations between the transformers and on the secondary side must be chosen to obtain an effective 50Ω (for a 50Ω source impedance). Figure 116 and Figure 117 use 1:1 transformers with a 50Ω source. As explained in the Drive Circuit Requirements section, this architecture helps to present a low source impedance to absorb sampling glitches. With a 1:4 transformer, the source impedance is 200Ω. The higher source impedance is unable to absorb the sampling glitches effectively and can lead to degradation in performance (compared to using 1:1 transformers). In almost all cases, either a bandpass or low-pass filter is needed to get the desired dynamic performance, as shown in Figure 118. Such a filter presents low source impedance at the high frequencies corresponding to the sampling glitch and helps avoid the performance loss with the high source impedance. 10W Bandpass or Low-Pass Filter Differential Input Signal 0.1mF INP 100W ADS41xx 100W INM 10W VCM Figure 118. Drive Circuit with 1:4 Transformer Input Common-Mode To ensure a low-noise, common-mode reference, the VCM pin is filtered with a 0.1µF low-inductance capacitor connected to ground. The VCM pin is designed to directly drive the ADC inputs. Each ADC input pin sinks a common-mode current of approximately 0.6µA per MSPS of clock frequency. Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 61 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com CLOCK INPUT The ADS414x/2x clock inputs can be driven differentially (sine, LVPECL, or LVDS) or single-ended (LVCMOS), with little or no difference in performance between them. The common-mode voltage of the clock inputs is set to VCM using internal 5kΩ resistors. This setting allows the use of transformer-coupled drive circuits for sine-wave clock or ac-coupling for LVPECL and LVDS clock sources. Figure 119 shows an equivalent circuit for the input clock. Clock Buffer LPKG 1nH 20W CLKP CBOND 1pF RESR 100W LPKG 1nH 5kW 2pF 20W CEQ CEQ VCM 5kW CLKM CBOND 1pF RESR 100W NOTE: CEQ is 1pF to 3pF and is the equivalent input capacitance of the clock buffer. Figure 119. Input Clock Equivalent Circuit A single-ended CMOS clock can be ac-coupled to the CLKP input, with CLKM connected to ground with a 0.1mF capacitor, as shown in Figure 120. For best performance, the clock inputs must be driven differentially, reducing susceptibility to common-mode noise. For high input frequency sampling, it is recommended to use a clock source with very low jitter. Band-pass filtering of the clock source can help reduce the effects of jitter. There is no change in performance with a non-50% duty cycle clock input. Figure 121 shows a differential circuit. CMOS Clock Input 0.1mF 0.1mF CLKP CLKP VCM 0.1mF Differential Sine-Wave, PECL, or LVDS Clock Input 0.1mF CLKM CLKM Figure 120. Single-Ended Clock Driving Circuit 62 Submit Documentation Feedback Figure 121. Differential Clock Driving Circuit Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 DIGITAL FUNCTIONS AND LOW LATENCY MODE The device has several useful digital functions such as test patterns, gain, and offset correction. All of these functions require extra clock cycles for operation and increase the overall latency and power of the device. Alternately, the device has a low-latency mode in which the raw ADC output is routed to the output data pins with a latency of 10 clock cycles. In this mode, the digital functions are bypassed. Figure 122 shows more details of the processing after the ADC. The device is in low-latency mode after reset. In order to use any of the digital functions, first the low-latency mode must be disabled by setting the DIS LOW LATENCY register bit to '1'. After this, the respective register bits must be programmed as described in the following sections and in the Serial Register Map section. Output Interface 14-Bit ADC 14b 14b Digital Functions (Gain, Offset Correction, Test Patterns) DDR LVDS or CMOS DIS LOW LATENCY Pin Figure 122. Digital Processing Block Diagram GAIN FOR SFDR/SNR TRADE-OFF The ADS414x/2x include gain settings that can be used to get improved SFDR performance. The gain is programmable from 0dB to 6dB (in 0.5dB steps) using the GAIN register bits. For each gain setting, the analog input full-scale range scales proportionally, as shown in Table 11. The SFDR improvement is achieved at the expense of SNR; for each gain setting, the SNR degrades approximately between 0.5dB and 1dB. The SNR degradation is reduced at high input frequencies. As a result, the gain is very useful at high input frequencies because the SFDR improvement is significant with marginal degradation in SNR. Therefore, the gain can be used to trade-off between SFDR and SNR. After a reset, the device is in low-latency mode and gain function is disabled. To use gain: • First, disable the low-latency mode (DIS LOW LATENCY = 1). • This setting enables the gain and puts the device in a 0dB gain mode. • For other gain settings, program the GAIN bits. Table 11. Full-Scale Range Across Gains GAIN (dB) TYPE FULL-SCALE (VPP) 0 Default after reset 2 1 Fine, programmable 1.78 2 Fine, programmable 1.59 3 Fine, programmable 1.42 4 Fine, programmable 1.26 5 Fine, programmable 1.12 6 Fine, programmable 1.00 Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 63 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com OFFSET CORRECTION The ADS414x/2x has an internal offset corretion algorithm that estimates and corrects dc offset up to ±10mV. The correction can be enabled using the EN OFFSET CORR serial register bit. Once enabled, the algorithm estimates the channel offset and applies the correction every clock cycle. The time constant of the correction loop is a function of the sampling clock frequency. The time constant can be controlled using the OFFSET CORR TIME CONSTANT register bits, as described in Table 12. Table 12. Time Constant of Offset Correction Loop (1) OFFSET CORR TIME CONSTANT TIME CONSTANT, TCCLK (Number of Clock Cycles) TIME CONSTANT, TCCLK × 1/fS (sec) (1) 0000 1M 4ms 0001 2M 8ms 0010 4M 16.7ms 0011 8M 33.5ms 0100 16M 67ms 0101 32M 134ms 0110 64M 268ms 0111 128M 537ms 1000 256M 1.1s 1001 512M 2.15s 1010 1G 4.3s 1011 2G 8.6s 1100 Reserved — 1101 Reserved — 1110 Reserved — 1111 Reserved — Sampling frequency, fS = 250MSPS. After the offset is estimated, the correction can be frozen by setting FREEZE OFFSET CORR = 1. Once frozen, the last estimated value is used for the offset correction of every clock cycle. Note that offset correction is disabled by a default after reset. After a reset, the device is in low-latency mode and offset correction is disabled. To use offset correction: • First, disable the low-latency mode (DIS LOW LATENCY = 1). • Then set EN OFFSET CORR to '1' and program the required time constant. Figure 123 shows the time response of the offset correction algorithm after it is enabled. Output Code (LSB) OFFSET CORRECTION Time Response 8200 8190 8180 8170 8160 8150 8140 8130 8120 8110 8100 8090 8080 8070 8060 8050 8181 Offset of 10 LSBs 8192 Final converged value Offset correction converges to output code of 8192 Offset correction begins -5 5 15 25 35 45 55 65 75 85 95 105 Time (ms) Figure 123. Time Response of Offset Correction 64 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 POWER DOWN The ADS414x/2x has three power-down modes: power-down global, standby, and output buffer disable. Power-Down Global In this mode, the entire chip (including the ADC, internal reference, and the output buffers) are powered down, resulting in reduced total power dissipation of about 10mW. The output buffers are in a high-impedance state. The wake-up time from the global power-down to data becoming valid in normal mode is typically 100µs. To enter the global power-down mode, set the PDN GLOBAL register bit. Standby In this mode, only the ADC is powered down and the internal references are active, resulting in a fast wake-up time of 5µs. The total power dissipation in standby mode is approximately 185mW. To enter the standby mode, set the STBY register bit. Output Buffer Disable The output buffers can be disabled and put in a high-impedance state; wakeup time from this mode is fast, approximately 100ns. This can be controlled using the PDN OBUF register bit or using the OE pin. Input Clock Stop In addition, the converter enters a low-power mode when the input clock frequency falls below 1MSPS. The power dissipation is approximately 80mW. POWER-SUPPLY SEQUENCE During power-up, the AVDD and DRVDD supplies can come up in any sequence. The two supplies are separated in the device. Externally, they can be driven from separate supplies or from a single supply. DIGITAL OUTPUT INFORMATION The ADS414x/2x provide either 14-bit data or 12-bit data, respectively, and an output clock synchronized with the data. Output Interface Two output interface options are available: double data rate (DDR) LVDS and parallel CMOS. They can be selected using the LVDS CMOS serial interface register bit or using the DFS pin. DDR LVDS Outputs In this mode, the data bits and clock are output using low voltage differential signal (LVDS) levels. Two data bits are multiplexed and output on each LVDS differential pair, as shown in Figure 124 and Figure 125. Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 65 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com Pins Pins CLKOUTP Output Clock CLKOUTP CLKOUTM Output Clock CLKOUTM D0_D1_P Data Bits D0, D1 D0_D1_P Data Bits D0, D1 D0_D1_M LVDS Buffers LVDS Buffers D0_D1_M D2_D3_P Data Bits D2, D3 D2_D3_M D2_D3_P Data Bits D2, D3 D2_D3_M D4_D5_P 12-Bit ADC Data Data Bits D4, D5 D4_D5_M D4_D5_P Data Bits D4, D5 14-Bit ADC Data D4_D5_M D6_D7_P Data Bits D6, D7 D6_D7_P Data Bits D6, D7 D6_D7_M D6_D7_M D8_D9_P Data Bits D8, D9 D8_D9_P Data Bits D8, D9 D8_D9_M D8_D9_M D10_D11_P D10_D11_P Data Bits D10, D11 Data Bits D10, D11 D10_D11_M D10_D11_M ADS4129 D12_D13_P Data Bits D12, D13 Figure 124. ADS412x LVDS Data Outputs D12_D13_M ADS4149 Figure 125. ADS414x LVDS Data Outputs 66 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 Even data bits (D0, D2, D4, etc.) are output at the falling edge of CLKOUTP and the odd data bits (D1, D3, D5, etc.) are output at the rising edge of CLKOUTP. Both the rising and falling edges of CLKOUTP must be used to capture all 14 data bits, as shown in Figure 126. CLKOUTP CLKOUTM D0_D1_P, D0_D1_M D0 D1 D0 D1 D2_D3_P, D2_D3_M D2 D3 D2 D3 D4_D5_P, D4_D5_M D4 D5 D4 D5 D6_D7_P, D6_D7_M D6 D7 D6 D7 D8_D9_P, D8_D9_M D8 D9 D8 D9 D10_D11_P, D10_D11_M D10 D11 D10 D11 D12_D13_P, D12_D13_M D12 D13 D12 D13 Sample N Sample N + 1 Figure 126. DDR LVDS Interface Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 67 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com LVDS Output Data and Clock Buffers The equivalent circuit of each LVDS output buffer is shown in Figure 127. After reset, the buffer presents an output impedance of 100Ω to match with the external 100Ω termination. The VDIFF voltage is nominally 350mV, resulting in an output swing of ±350mV with 100Ω external termination. The VDIFF voltage is programmable using the LVDS SWING register bits from ±125mV to ±570mV. Additionally, a mode exists to double the strength of the LVDS buffer to support 50Ω differential termination. This mode can be used when the output LVDS signal is routed to two separate receiver chips, each using a 100Ω termination. The mode can be enabled using the LVDS DATA STRENGTH and LVDS CLKOUT STRENGTH register bits for data and output clock buffers, respectively. The buffer output impedance behaves in the same way as a source-side series termination. By absorbing reflections from the receiver end, it helps to improve signal integrity. VDIFF High Low OUTP External 100W Load OUTM 1.1V ROUT VDIFF Low High NOTE: Use the default buffer strength to match 100Ω external termination (ROUT = 100Ω). To match with a 50Ω external termination, set the LVDS STRENGTH bit (ROUT = 50Ω). Figure 127. LVDS Buffer Equivalent Circuit Parallel CMOS Interface In CMOS mode, each data bit is output on a separate pin as the CMOS voltage level, for every clock cycle. The rising edge of the output clock CLKOUT can be used to latch data in the receiver. Figure 128 depicts the CMOS output interface. Switching noise (caused by CMOS output data transitions) can couple into the analog inputs and degrade SNR. The coupling and SNR degradation increases as the output buffer drive is made stronger. To minimize this degradation, the CMOS output buffers are designed with controlled drive strength. The default drive strength ensures a wide data stable window (even at 250MSPS) is provided so the data outputs have minimal load capacitance. It is recommended to use short traces (one to two inches or 2,54cm to 5,08cm) terminated with less than 5pF load capacitance, as shown in Figure 129. For sampling frequencies greater than 200MSPS, it is recommended to use an external clock to capture data. The delay from input clock to output data and the data valid times are specified for higher sampling frequencies. These timings can be used to delay the input clock appropriately and use it to capture data. 68 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 Pins OVR CLKOUT CMOS Output Buffers D0 D1 D2 D3 ¼ ¼ 14-Bit ADC Data D11 D12 D13 ADS4149 Figure 128. CMOS Output Interface Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 69 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com Use External Clock Buffer (> 200MSPS) Input Clock Receiver (FPGA, ASIC, etc.) Flip-Flops CLKOUT CMOS Output Buffers D0 D1 D2 CLKIN D0_In D1_In D2_In 14-Bit ADC Data D12 D13 D12_In D13_In ADS4149 Use short traces between ADC output and receiver pins (1 to 2 inches). Figure 129. Using the CMOS Data Outputs CMOS Interface Power Dissipation With CMOS outputs, the DRVDD current scales with the sampling frequency and the load capacitance on every output pin. The maximum DRVDD current occurs when each output bit toggles between '0' and '1' every clock cycle. In actual applications, this condition is unlikely to occur. The actual DRVDD current would be determined by the average number of output bits switching, which is a function of the sampling frequency and the nature of the analog input signal. Digital Current as a Result of CMOS Output Switching = CL × DRVDD × (N × fAVG) where: CL = load capacitance, N × FAVG = average number of output bits switching. (1) Figure 106 shows the current across sampling frequencies at 2 MHz analog input frequency. Input Over-Voltage Indication (OVR Pin) The device has an OVR pin that provides information about analog input overload. At any clock cycle, if the sampled input voltage exceeds the positive or negative full-scale range, the OVR pin goes high. The OVR remains high as long as the overload condition persists. The OVR pin is a CMOS output buffer (running off DRVDD supply), independent of the type of output data interface (DDR LVDS or CMOS). 70 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 For a positive overload, the D[13:0] output data bits are 3FFFh in offset binary output format and 1FFFh in twos complement output format. For a negative input overload, the output code is 0000h in offset binary output format and 2000h in twos complement output format. Output Data Format Two output data formats are supported: twos complement and offset binary. They can be selected using the DATA FORMAT serial interface register bit or controlling the DFS pin in parallel configuration mode. In the event of an input voltage overdrive, the digital outputs go to the appropriate full-scale level. BOARD DESIGN CONSIDERATIONS Grounding A single ground plane is sufficient to give good performance, provided the analog, digital, and clock sections of the board are cleanly partitioned. See the ADS414x, ADS412x EVM User Guide (SLWU067) for details on layout and grounding. Supply Decoupling Because the ADS414x/2x already include internal decoupling, minimal external decoupling can be used without loss in performance. Note that decoupling capacitors can help filter external power-supply noise, so the optimum number of capacitors depends on the actual application. The decoupling capacitors should be placed very close to the converter supply pins. Exposed Pad In addition to providing a path for heat dissipation, the PowerPAD is also electrically internally connected to the digital ground. Therefore, it is necessary to solder the exposed pad to the ground plane for best thermal and electrical performance. For detailed information, see application notes QFN Layout Guidelines (SLOA122) and QFN/SON PCB Attachment (SLUA271), both available for download at the TI web site (www.ti.com). Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 71 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com DEFINITION OF SPECIFICATIONS Analog Bandwidth – The analog input frequency at which the power of the fundamental is reduced by 3 dB with respect to the low-frequency value. Aperture Delay – The delay in time between the rising edge of the input sampling clock and the actual time at which the sampling occurs. This delay is different across channels. The maximum variation is specified as aperture delay variation (channel-to-channel). Aperture Uncertainty (Jitter) – The sample-to-sample variation in aperture delay. Clock Pulse Width/Duty Cycle – The duty cycle of a clock signal is the ratio of the time the clock signal remains at a logic high (clock pulse width) to the period of the clock signal. Duty cycle is typically expressed as a percentage. A perfect differential sine-wave clock results in a 50% duty cycle. Maximum Conversion Rate – The maximum sampling rate at which specified operation is given. All parametric testing is performed at this sampling rate unless otherwise noted. Minimum Conversion Rate – The minimum sampling rate at which the ADC functions. Differential Nonlinearity (DNL) – An ideal ADC exhibits code transitions at analog input values spaced exactly 1 LSB apart. The DNL is the deviation of any single step from this ideal value, measured in units of LSBs. Integral Nonlinearity (INL) – The INL is the deviation of the ADC transfer function from a best fit line determined by a least squares curve fit of that transfer function, measured in units of LSBs. Gain Error – Gain error is the deviation of the ADC actual input full-scale range from its ideal value. The gain error is given as a percentage of the ideal input full-scale range. Gain error has two components: error as a result of reference inaccuracy and error as a result of the channel. Both errors are specified independently as EGREF and EGCHAN. To a first-order approximation, the total gain error is ETOTAL ~ EGREF + EGCHAN. For example, if ETOTAL = ±0.5%, the full-scale input varies from (1 – 0.5/100) x FSideal to (1 + 0.5/100) x FSideal. Offset Error – The offset error is the difference, given in number of LSBs, between the ADC actual average idle channel output code and the ideal average idle channel output code. This quantity is often mapped into millivolts. Temperature Drift – The temperature drift coefficient (with respect to gain error and offset error) specifies the change per degree Celsius of the parameter from TMIN to TMAX. It is calculated by dividing the maximum deviation of the parameter across the TMIN to TMAX range by the difference TMAX – TMIN. Signal-to-Noise Ratio – SNR is the ratio of the power of the fundamental (PS) to the noise floor power (PN), excluding the power at dc and the first nine harmonics. SNR = 10Log10 PS PN (2) SNR is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full-scale) when the power of the fundamental is extrapolated to the converter full-scale range. Signal-to-Noise and Distortion (SINAD) – SINAD is the ratio of the power of the fundamental (PS) to the power of all the other spectral components including noise (PN) and distortion (PD), but excluding dc. SINAD = 10Log10 PS PN + PD (3) SINAD is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full-scale) when the power of the fundamental is extrapolated to the converter full-scale range. 72 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 ADS4126, ADS4129 ADS4146, ADS4149 www.ti.com SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 Effective Number of Bits (ENOB) – ENOB is a measure of the converter performance as compared to the theoretical limit based on quantization noise. ENOB = SINAD - 1.76 6.02 (4) Total Harmonic Distortion (THD) – THD is the ratio of the power of the fundamental (PS) to the power of the first nine harmonics (PD). THD = 10Log10 PS PN (5) THD is typically given in units of dBc (dB to carrier). Spurious-Free Dynamic Range (SFDR) – The ratio of the power of the fundamental to the highest other spectral component (either spur or harmonic). SFDR is typically given in units of dBc (dB to carrier). Two-Tone Intermodulation Distortion – IMD3 is the ratio of the power of the fundamental (at frequencies f1 and f2) to the power of the worst spectral component at either frequency 2f1 – f2 or 2f2 – f1. IMD3 is either given in units of dBc (dB to carrier) when the absolute power of the fundamental is used as the reference, or dBFS (dB to full-scale) when the power of the fundamental is extrapolated to the converter full-scale range. DC Power-Supply Rejection Ratio (DC PSRR) – DC PSSR is the ratio of the change in offset error to a change in analog supply voltage. The dc PSRR is typically given in units of mV/V. AC Power-Supply Rejection Ratio (AC PSRR) – AC PSRR is the measure of rejection of variations in the supply voltage by the ADC. If ΔVSUP is the change in supply voltage and ΔVOUT is the resultant change of the ADC output code (referred to the input), then: DVOUT PSRR = 20Log 10 (Expressed in dBc) DVSUP (6) Voltage Overload Recovery – The number of clock cycles taken to recover to less than 1% error after an overload on the analog inputs. This is tested by separately applying a sine wave signal with 6dB positive and negative overload. The deviation of the first few samples after the overload (from the expected values) is noted. Common-Mode Rejection Ratio (CMRR) – CMRR is the measure of rejection of variation in the analog input common-mode by the ADC. If ΔVCM_IN is the change in the common-mode voltage of the input pins and ΔVOUT is the resulting change of the ADC output code (referred to the input), then: DVOUT CMRR = 20Log10 (Expressed in dBc) DVCM (7) Crosstalk (only for multi-channel ADCs) – This is a measure of the internal coupling of a signal from an adjacent channel into the channel of interest. It is specified separately for coupling from the immediate neighboring channel (near-channel) and for coupling from channel across the package (far-channel). It is usually measured by applying a full-scale signal in the adjacent channel. Crosstalk is the ratio of the power of the coupling signal (as measured at the output of the channel of interest) to the power of the signal applied at the adjacent channel input. It is typically expressed in dBc. Copyright © 2009–2010, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 73 ADS4126, ADS4129 ADS4146, ADS4149 SBAS483F – NOVEMBER 2009 – REVISED OCTOBER 2010 www.ti.com REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision E (September 2010) to Revision F Page • Changed status of ADS4129 throughout document ............................................................................................................. 1 • Changed ADS4129 SNR, SINAD, SFDR, THD, and HD3 fIN = 170MHz typical specifications in Electrical Characteristics table ............................................................................................................................................................. 8 • Added ADS4129 SNR, SINAD, SFDR, THD, HD2, HD3, and Worst spur fIN = 170MHz minimum specifications in Electrical Characteristics table .............................................................................................................................................. 8 • Added ADS4129 DNL minimum and maximum specifications in Electrical Characteristics table ........................................ 8 • Added ADS4129 INL maximum specification in Electrical Characteristics table .................................................................. 8 • Changed ADS4129 INL typical specification in Electrical Characteristics table ................................................................... 8 Changes from Revision D (April 2010) to Revision E Page • Changed specification of 160MSPS total power for second Features bullet ........................................................................ 1 • Changed status of ADS4126 and ADS4146 to production data throughout document ....................................................... 4 • Added ADS4126/29/46/49 low-speed mode rows to Clock Input section of Recommended Operating Conditions table ...................................................................................................................................................................................... 6 • Added footnote 3 to Recommended Operating Conditions table ......................................................................................... 6 • Changed ADS4146 SNR fIN = 170MHz typical specification in Electrical Characteristics table ........................................... 7 • Added ADS4146 SNR, SINAD, SFDR, THD, HD2, HD3, Worst spur, and DNL fIN = 170MHz minimum specifications in Electrical Characteristics table .......................................................................................................................................... 7 • Added ADS4146 DNL minimum specification in Electrical Characteristics table ................................................................. 7 • Added ADS4146 INL maximum specification in Electrical Characteristics table .................................................................. 7 • Changed ADS4126 SFDR and HD3 fIN = 170MHz typical specifications in Electrical Characteristics table ....................... 8 • Added ADS4126 SNR, SINAD, SFDR, THD, HD2, HD3, and Worst spur fIN = 170MHz minimum specifications in Electrical Characteristics table .............................................................................................................................................. 8 • Added ADS4126 DNL minimum and maximum specifications in Electrical Characteristics table ........................................ 8 • Added ADS4126 INL maximum specification in Electrical Characteristics table .................................................................. 8 • Added ADS4126/4146 DC Accuracy, Offset error minimum and maximum specifications to General Electrical Characteristics table ............................................................................................................................................................. 9 • Changed ADS4126/4146 Power Supply section in General Electrical Characteristics table ............................................... 9 • Added DB register address to Table 10 ............................................................................................................................. 20 • Added Register Address DBh section ................................................................................................................................ 28 • Changed fine gain to gain in Gain for SFDR/SNR Trade-Off section ................................................................................ 63 74 Submit Documentation Feedback Copyright © 2009–2010, Texas Instruments Incorporated Product Folder Link(s): ADS4126 ADS4129 ADS4146 ADS4149 PACKAGE OPTION ADDENDUM www.ti.com 11-Dec-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty ADS4126IRGZ25 PREVIEW VQFN RGZ 48 ADS4126IRGZR ACTIVE VQFN RGZ 48 2500 ADS4126IRGZT ACTIVE VQFN RGZ 48 ADS4129IRGZ25 PREVIEW VQFN RGZ ADS4129IRGZR ACTIVE VQFN RGZ Eco Plan (2) TBD Lead/ Ball Finish Call TI MSL Peak Temp (3) Samples (Requires Login) Call TI Samples Not Available Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Call Local Sales Office 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Call Local Sales Office 48 25 TBD Call TI Call TI Samples Not Available 48 2500 TBD Call TI Call TI Call Local Sales Office 250 TBD Call TI Call TI Call Local Sales Office TBD Call TI Call TI Samples Not Available ADS4129IRGZT ACTIVE VQFN RGZ 48 ADS4146IRGZ25 PREVIEW VQFN RGZ 48 ADS4146IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Call Local Sales Office ADS4146IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Call Local Sales Office ADS4149IRGZ25 ACTIVE VQFN RGZ 48 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Purchase Samples ADS4149IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Purchase Samples ADS4149IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Request Free Samples ADS58B18IRGZR ACTIVE VQFN RGZ 48 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Call Local Sales Office ADS58B18IRGZT ACTIVE VQFN RGZ 48 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-3-260C-168 HR Call Local Sales Office (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 11-Dec-2010 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 10-Dec-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing ADS4126IRGZR VQFN RGZ 48 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 ADS4126IRGZT VQFN RGZ 48 250 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 ADS4129IRGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 ADS4129IRGZT VQFN RGZ 48 250 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 ADS4146IRGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 ADS4146IRGZT VQFN RGZ 48 250 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 ADS4149IRGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 ADS4149IRGZT VQFN RGZ 48 250 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 ADS58B18IRGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 ADS58B18IRGZT VQFN RGZ 48 250 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 10-Dec-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) ADS4126IRGZR VQFN RGZ 48 2500 333.2 345.9 28.6 ADS4126IRGZT VQFN RGZ 48 250 333.2 345.9 28.6 ADS4129IRGZR VQFN RGZ 48 2500 333.2 345.9 28.6 ADS4129IRGZT VQFN RGZ 48 250 333.2 345.9 28.6 ADS4146IRGZR VQFN RGZ 48 2500 333.2 345.9 28.6 ADS4146IRGZT VQFN RGZ 48 250 333.2 345.9 28.6 ADS4149IRGZR VQFN RGZ 48 2500 333.2 345.9 28.6 ADS4149IRGZT VQFN RGZ 48 250 333.2 345.9 28.6 ADS58B18IRGZR VQFN RGZ 48 2500 333.2 345.9 28.6 ADS58B18IRGZT VQFN RGZ 48 250 333.2 345.9 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DLP® Products www.dlp.com Communications and Telecom www.ti.com/communications DSP dsp.ti.com Computers and Peripherals www.ti.com/computers Clocks and Timers www.ti.com/clocks Consumer Electronics www.ti.com/consumer-apps Interface interface.ti.com Energy www.ti.com/energy Logic logic.ti.com Industrial www.ti.com/industrial Power Mgmt power.ti.com Medical www.ti.com/medical Microcontrollers microcontroller.ti.com Security www.ti.com/security RFID www.ti-rfid.com Space, Avionics & Defense www.ti.com/space-avionics-defense RF/IF and ZigBee® Solutions www.ti.com/lprf Video and Imaging www.ti.com/video Wireless www.ti.com/wireless-apps Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2010, Texas Instruments Incorporated