Material Content Data Sheet Sales Product Name ICE3BR1065J MA# MA001118930 Package PG-DIP-8-13 Issued 29. August 2013 Weight* 557.44 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver epoxy resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 4.412 0.79 0.054 0.01 0.215 0.04 385 4.297 0.77 7708 174.475 31.30 32.12 312995 321184 0.297 0.05 0.05 532 532 1.090 0.20 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.79 7914 7914 96 1956 35.254 6.32 327.098 58.69 65.21 586789 651988 7.496 1.34 1.34 13447 13447 0.796 0.14 0.14 1428 1428 0.293 0.05 1.662 0.30 63243 526 0.35 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 2981 3507 1000000