ESDARF03-1BF3 Ultralow capacitance ESD protection for antenna Features ■ ultralow diode capacitance 0.6 pF ■ Single line, protected against 15 kV ESD ■ breakdown voltage VBR = 6.0 V min. ■ Flip Chip 400 µm pitch, lead-free ■ very low leakage current ■ very small PCB area ■ RoHS compliant Flip Chip (4 bumps) Figure 1. Pin layout (bump side) Benefits ■ minimized impact on rise and fall times for maximum data integrity ■ low PCB space occupation ■ higher reliability through monolithic integration A B 1 2 Complies with the following standards ■ ■ IEC 61000-4-2 level 4: – 15 kV (air discharge) – 8 kV (contact discharge) Figure 2. Device configuration A1 (RFIN) B1 (NC) MIL STD 883G - Method 3015.7: – 25 kV (human body model) Applications ■ antenna protection ■ DVB - H ■ GPS B1 A1 B2 A2 50 Ω line Top view A2 (GND) B2 (NC) Description The ESDARF03-1BF3 is a monolithic, application specific discrete device dedicated to ESD protection of antennas. Note: Bumps B1 and B2 must be connected together on the PCB. Its ultralow line capacitance secures a high level of signal integrity without compromising the protection of sensitive chips against the most stringently characterized ESD strikes. TM: IPAD is a trademark of STMicroelectronics. November 2010 Doc ID 16078 Rev 1 1/7 www.st.com 7 Characteristics 1 ESDARF03-1BF3 Characteristics Table 1. Absolute maximum ratings (Tamb = 25 °C) Symbol Parameter Unit VPP ESD discharge IEC 61000-4-2, air discharge ESD discharge IEC 61000-4-2, contact discharge 15 8 kV PPP Peak pulse power dissipation (8/20 µs) 60 W Maximum junction temperature 125 °C Tj Top Operating temperature range -30 to + 85 °C Tstg Storage temperature range -55 to +150 °C Figure 3. Symbol VBR = IRM = VRM = VCL = Rd = Ipp = αT = VF = Table 2. Electrical characteristics (definitions) Parameter Breakdown voltage Leakage current @ VRM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Voltage temperature coefficient Line capacitance Electrical characteristics (Tamb = 25 °C) Symbol Test conditions VBR IR = 1 mA IRM VRM = 3 V Rd Exponential wave form 8/20 µs, Ipp = 1 to 5 A αT Cline 2/7 Value Min. Typ. 6 9 Max. V 100 5 VLINE = 0 V, VOSC = 30 mV, F = 1 MHz Doc ID 16078 Rev 1 0.6 nA Ω 2.6 IR = 1 mA Unit 0.8 10-4/ pF °C ESDARF03-1BF3 Figure 4. Characteristics ESD response to IEC 61000-4-2 (+8 kV contact discharge) Figure 5. ESD response to IEC 61000-4-2 (-8 kV contact discharge) X: 20 ns/division Y: 50 V/division X: 20 ns/division Y: 50 V/division Figure 6. 0.6 Junction capacitance versus frequency (typical values) Figure 7. dB 0 -1 -2 -3 Frequency IL -4 1.45GHz -5 0.15dB 1.492GHz -6 <1GHz <0.1dB -7 -8 -9 F (Hz) -10 10M 30M 100M 300M 1G S21 C(pF) VOSC=30 mVRMS Tj=25 °C 0.5 0.4 0.3 0.2 0.1 F(Hz) 0.0 1.E+07 Figure 8. 1.E+08 S21 attenuation measurement 1.E+09 3G 10G Relative variation of leakage current versus junction temperature (typical values) 1.E+02 IR[Tj] / IR[Tj = 25 °C] VR = 3 V I/O-I/O 1.E+01 Tj (°C) 1.E+00 25 40 55 70 85 Doc ID 16078 Rev 1 100 115 3/7 Ordering information scheme 2 ESDARF03-1BF3 Ordering information scheme Figure 9. Ordering information scheme ESDA RF 03 - 1 B F3 ESD protection device Application RF Antenna Version Number of lines Directional B = Bi-directional Package F = Flip Chip 3 = Lead-free, pitch = 400 µm, bump = 255 µm 4/7 Doc ID 16078 Rev 1 ESDARF03-1BF3 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 10. Package dimensions 210 µm 605 µm ± 55 0.82 mm ± 30µm 400 µm ± 40 400 µm ± 40 3 Package information 210 µm 0.82 mm ± 30 µm 255 µm ± 40 Figure 11. Footprint recommendations Copper pad Diameter: 220 µm recommended 260 µm maximum Solder mask opening: 300 µm minimum Solder stencil opening : 220 µm recommended Figure 12. Marking Dot xx = marking z = manufacturing location yww = datecode (y = year ww = week) Doc ID 16078 Rev 1 x x z y ww 5/7 Ordering information ESDARF03-1BF3 Figure 13. Flip Chip tape and reel specifications Ø 1.55 ± 0.05 4.0 ± 0.1 2.0 ± 0.05 1.75 ± 0.1 Dot identifying Pin A1 location 3.5 ±- 0.05 0.92 ± 0.05 xxz yww 0.92 ± 0.05 xxz yww xxz yww xxz yww xxz yww xxz yww 8.0 ± 0.3 0.20 ± 0.05 2.0 ± 0.1 0.69 ± 0.1 User direction of unreeling All dimensions in mm Note: More information is available in the application notes: AN2348: “400 µm Flip Chip: Package description and recommendations for use” AN1751: “EMI Filters: Recommendations and measurements” 4 Ordering information Table 3. 5 Order code Marking Package Weight Base qty Delivery mode ESDARF03-1BF3 R3 Flip Chip 0.91 mg 5000 Tape and reel (7”) Revision history Table 4. 6/7 Ordering information Document revision history Date Revision 15-Nov-2010 1 Changes Initial release. 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