MC10ELT22, MC100ELT22 5.0 V Dual TTL to Differential PECL Translator The MC10ELT/100ELT22 is a dual TTL to differential PECL translator. Because PECL (Positive ECL) levels are used only +5 V and ground are required. The small outline 8-lead package and the low skew, dual gate design of the ELT22 makes it ideal for applications which require the translation of a clock and a data signal. http://onsemi.com MARKING DIAGRAMS* Features • • • • • • • 1.2 ns Typical Propagation Delay 8 8 < 300 ps Typical Output to Output Skew 8 HLT22 ALYW G 1 PNP TTL Inputs for Minimal Loading Flow Through Pinouts Operating Range: VCC = 4.75 V to 5.25 V with GND = 0 V SO−8 D SUFFIX CASE 751 No Internal Input Pulldown Resistors 8 8 Pb−Free Packages are Available 1 1 TSSOP−8 DT SUFFIX CASE 948R KLT22 ALYW G 1 8 HT22 ALYWG G 1 1 KT22 ALYWG G H = MC10 K = MC100 A = Assembly Location L = Wafer Lot Y = Year W = Work Week G = Pb−Free Package (Note: Microdot may be in either location) *For additional information, see Application Note AND8002/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. © Semiconductor Components Industries, LLC, 2006 November, 2006 − Rev. 9 1 Publication Order Number: MC10ELT22/D MC10ELT22, MC100ELT22 Table 1. PIN DESCRIPTION Q0 Q0 1 8 2 7 PECL VCC Pin D0 TTL Function Qn, Qn PECL Differential Outputs* Dn TTL Inputs VCC Positive Supply GND Ground *Output state undetermined when inputs are open. Q1 3 6 D1 Q1 4 5 GND Figure 1. Logic Diagram and Pinout Assignment Table 2. ATTRIBUTES Characteristics Value Internal Input Pulldown Resistor N/A Internal Input Pullup Resistor N/A ESD Protection Human Body Model Machine Model Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Flammability Rating Oxygen Index: 28 to 34 Transistor Count > 2 kV > 200 V Level 1 UL 94 V−0 @ 0.125 in 51 Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see Application Note AND8003/D. http://onsemi.com 2 MC10ELT22, MC100ELT22 Table 3. MAXIMUM RATINGS Rating Units VCC Symbol Positive Power Supply Parameter GND = 0 V Condition 1 Condition 2 7 V VIN Input Voltage GND = 0 V GND + 0.025 v VI v VCC − 0.025 V Iout Output Current Continuous Surge 50 100 mA mA TA Operating Temperature Range −40 to +85 °C Tstg Storage Temperature Range −65 to +150 °C qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm 8 SOIC 8 SOIC 190 130 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board 8 SOIC 41 to 44 °C/W qJA Thermal Resistance (Junction−to−Ambient) 0 lfpm 500 lfpm 8 TSSOP 8 TSSOP 185 140 °C/W °C/W qJC Thermal Resistance (Junction−to−Case) Standard Board 8 TSSOP 41 to 44 ± 5% °C/W Tsol Wave Solder <2 to 3 sec @ 248°C 265 °C Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Table 4. 10ELT SERIES PECL DC CHARACTERISTICS VCC = 5.0 V; GND = 0.0 V (Note 2) −40°C Symbol Characteristic Min Typ 25°C Max Min Typ 22 85°C Max Min Typ 22 Max Unit 22 mA ICC Power Supply Current VOH Output HIGH Voltage (Note 3) 3920 4010 4110 4020 4105 4190 4090 4185 4280 mV VOL Output LOW Voltage (Note 3) 3050 3200 3350 3050 3210 3370 3050 3227 3405 mV NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 2. Output parameters vary 1:1 with VCC. VCC can vary ± 0.25 V. 3. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. Table 5. 100ELT SERIES PECL DC CHARACTERISTICS VCC = 5.0 V; GND = 0.0 V (Note 4) −40°C Symbol Characteristic Min Typ 25°C Max Min Typ 22 85°C Max Min Typ 22 Max Unit 22 mA ICC Power Supply Current VOH Output HIGH Voltage (Note 5) 3915 3995 4120 3975 4045 4120 3975 4050 4120 mV VOL Output LOW Voltage (Note 5) 3170 3305 3445 3190 3295 3380 3190 3295 3380 mV NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 4. Output parameters vary 1:1 with VCC. VCC can vary ± 0.25 V. 5. Outputs are terminated through a 50 W resistor to VCC − 2.0 V. http://onsemi.com 3 MC10ELT22, MC100ELT22 Table 6. TTL INPUT DC CHARACTERISTICS VCC = 4.75 V to 5.25 V; TA = −40°C to 85°C Symbol Characteristic Condition Min Typ Max Unit 20 mA IIH Input HIGH Current VIN = 2.7 V; VIN = (VCC − 0.025) V IIHH Input HIGH Current VIN = 7.0 V 100 mA IIL Input LOW Current VIN = 0.5 V; VIN = (GND + 0.025) V −0.6 mA VIK Input Clamp Diode Voltage IIN = −18 mA −1.2 V VIH Input HIGH Voltage 2.0 VCC − 0.025 V V VIL Input LOW Voltage GND + 0.025 V 0.8 V NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. Table 7. AC CHARACTERISTICS VCC= 4.75 V to 5.25 V; GND= 0.0 V −40°C Symbol Characteristic Min Typ 25°C Max Min Typ 85°C Max Min Typ Max 500 Unit fMAX Maximum Input Frequency tPLH Propagation Delay (Note 6) 1.5 V to 50% 0.6 1.2 0.9 1.2 1.5 0.6 1.35 ns tPHL Propagation Delay (Note 6) 1.5 V to 50% 0.4 1.0 0.5 0.8 1.1 0.7 1.30 ns tskew Within−Device Skew (Note 7) Device−to−Device Skew (Note 8) 50 300 100 600 100 750 ps tJITTER CLOCK Random Jitter (RMS) tr/tf Output Rise/Fall Time (20−80%) 50 300 100 600 MHz 50 350 0.5 0.4 1.6 0.4 ps 1.6 0.4 1.6 ns NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit values are applied individually under normal operating conditions and not valid simultaneously. 6. Specifications for standard TTL input signal. 7. Skew is measured between outputs under identical transitions and conditions on any one device. 8. Device−to−Device Skew for identical transitions at identical VCC levels. http://onsemi.com 4 MC10ELT22, MC100ELT22 Q Zo = 50 W D Receiver Device Driver Device Q D Zo = 50 W 50 W 50 W VTT VTT = VCC − 2.0 V Figure 2. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) ORDERING INFORMATION Device MC10ELT22D Package Shipping † SO−8 98 Units / Rail MC10ELT22DG SO−8 (Pb−Free) 98 Units / Rail MC10ELT22DR2 SO−8 2500 Tape & Reel MC10ELT22DR2G SO−8 (Pb−Free) 2500 Tape & Reel MC10ELT22DT TSSOP−8 100 Units / Rail MC10ELT22DTG TSSOP−8 (Pb−Free) 100 Units / Rail MC10ELT22DTR2 TSSOP−8 2500 Tape & Reel MC10ELT22DTR2G TSSOP−8 (Pb−Free) 2500 Tape & Reel SO−8 98 Units / Rail MC100ELT22DG SO−8 (Pb−Free) 98 Units / Rail MC100ELT22DR2 SO−8 2500 Tape & Reel MC100ELT22DR2G SO−8 (Pb−Free) 2500 Tape & Reel MC100ELT22DT TSSOP−8 100 Units / Rail MC100ELT22DTG TSSOP−8 (Pb−Free) 100 Units / Rail MC100ELT22DTR2 TSSOP−8 2500 Tape & Reel MC100ELT22DTR2G TSSOP−8 (Pb−Free) 2500 Tape & Reel MC100ELT22D †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. http://onsemi.com 5 MC10ELT22, MC100ELT22 Resource Reference of Application Notes AN1405/D − ECL Clock Distribution Techniques AN1406/D − Designing with PECL (ECL at +5.0 V) AN1503/D − ECLinPSt I/O SPiCE Modeling Kit AN1504/D − Metastability and the ECLinPS Family AN1568/D − Interfacing Between LVDS and ECL AN1672/D − The ECL Translator Guide AND8001/D − Odd Number Counters Design AND8002/D − Marking and Date Codes AND8020/D − Termination of ECL Logic Devices AND8066/D − Interfacing with ECLinPS AND8090/D − AC Characteristics of ECL Devices http://onsemi.com 6 MC10ELT22, MC100ELT22 PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE AH −X− NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07. A 8 5 S B 1 0.25 (0.010) M Y M 4 −Y− K G C N DIM A B C D G H J K M N S X 45 _ SEATING PLANE −Z− H 0.10 (0.004) D 0.25 (0.010) M Z Y S X M J S SOLDERING FOOTPRINT* 1.52 0.060 7.0 0.275 4.0 0.155 0.6 0.024 1.270 0.050 SCALE 6:1 mm Ǔ ǒinches *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 MILLIMETERS MIN MAX 4.80 5.00 3.80 4.00 1.35 1.75 0.33 0.51 1.27 BSC 0.10 0.25 0.19 0.25 0.40 1.27 0_ 8 _ 0.25 0.50 5.80 6.20 INCHES MIN MAX 0.189 0.197 0.150 0.157 0.053 0.069 0.013 0.020 0.050 BSC 0.004 0.010 0.007 0.010 0.016 0.050 0 _ 8 _ 0.010 0.020 0.228 0.244 MC10ELT22, MC100ELT22 PACKAGE DIMENSIONS TSSOP−8 DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948R−02 ISSUE A 8x 0.15 (0.006) T U 0.10 (0.004) S 2X L/2 L 8 5 1 PIN 1 IDENT 0.15 (0.006) T U K REF S M T U S V 0.25 (0.010) B −U− 4 NOTES: 1. DIMENSIONS AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. S M A −V− F DETAIL E C 0.10 (0.004) −T− SEATING PLANE D −W− G DETAIL E DIM A B C D F G K L M MILLIMETERS MIN MAX 2.90 3.10 2.90 3.10 0.80 1.10 0.05 0.15 0.40 0.70 0.65 BSC 0.25 0.40 4.90 BSC 0_ 6_ INCHES MIN MAX 0.114 0.122 0.114 0.122 0.031 0.043 0.002 0.006 0.016 0.028 0.026 BSC 0.010 0.016 0.193 BSC 0_ 6_ ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC). ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. 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