BELLING BL24C128A Single supply voltage and high speed Datasheet

BL24C128A 128K bits (16,384×8)
Features
Compatible with all data transfer protocol

High-reliability

– 1 MHz
– Endurance: 1 Million Write Cycles
– 400 kHz
– Data Retention: 100 Years
– 100 kHz
Internally Organized:

Memory array:

– BL24C128A, 16,384 X 8 (128K bits)
– 128 Kbit (16 Kbytes) of EEPROM

Two-wire Serial Interface
– Page size: 64 bytes

Schmitt Trigger, Filtered Inputs for Noise
– Additional Write lockable page
Suppression
Single supply voltage and high speed:

Bidirectional Data Transfer Protocol
– 1 MHz

Write Protect Pin for Hardware Data

Write:


Protection
– Byte Write within 3 ms

Partial Page Writes Allowed
– Page Write within 3 ms

Self-timed Write Cycle (5 ms max)
Operating Ambient Temperature:

8-lead PDIP/SOP/TSSOP/UDFN/WLCSP4
– From -40 °C up to +85 °C
packages
Description
The BL24C128A provides 131,072 bits of serial electrically erasable and programmable read-only
memory (EEPROM), organized as 16,384 words of 8 bits each. The device is optimized for use in
many industrial and commercial applications where low-power and low-voltage operation are
essential. The BL24C128A is available in space-saving 8-lead PDIP, 8-lead SOP, and 8-lead
TSSOP ,WLCSP4 packages and is accessed via a two-wire serial interface. In addition, the
BL24C128A is available in 1.7V (1.7V to 5.5V) version.
Pin Configuration
8-lead PDIP
8-lead SOP
8-lead TSSOP
8-pad DFN
WLCSP4
1
A0
1
5
VCC
A0
1
5
VCC
A0
1
5
VCC
VCC
1
5 A0
A1
2
6
WP
A1
2
6
WP
A1
2
6
WP
WP
2
6 A1
A2
3
7
SCL
A2
3
7
SCL
A2
3
7
SCL
SCL 3
7 A2
GND
4
8
SDA
GND
4
8
SDA
GND
4
8
SDA
SDA 4
8
Bottem view
GND
A
Vcc
Vss
B
SCL
SDA
Marking side
(top view)
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BL24C128A 128K bits (16,384×8)
Pin Descriptions
Pin Name
Type
Functions
A0-A2
I
Address Inputs
SDA
I/O&Open-drain
Serial Data
SCL
I
Serial Clock Input
WP
I
Write Protect
GND
P
Ground
Vcc
P
Power Supply
Table 1
Block Diagram
Vcc
GND
WP
SCL
START STOP
LOGIC
SDA
EN
SERIAL CONTROL
LOGIC
HIGH VOLTAGE
PUMP/TIMING
LOAD
DATA RECOVERY
CCMP
DEVICE ADDRESS
COMPARATOR
LOAD
INC
DATA WORD
ADRESS COUNTER
A1
A2
Y DECODER
DIN
X DECODER
A0
EEPROM
SERIAL MUX
DOUT/ACKNOWLEDGE
DOUT
DEVICE/PAGE ADDRESSES (A2, A1 and A0): The A2, A1 and A0 pins are device address inputs that are
hard wire for the BL24C128A. Eight 128K devices may be addressed on a single bus system (device
addressing is discussed in detail under the Device Addressing section).
SERIAL DATA (SDA): The SDA pin is bi-directional for serial data transfer. This pin is open-drain driven
and may be wire-ORed with any number of other open-drain or open- collector devices.
SERIAL CLOCK (SCL): The SCL input is used to positive edge clock data into each EEPROM device and
negative edge clock data out of each device.
WRITE PROTECT (WP): The BL24C128A has a Write Protect pin that provides hardware data protection.
The Write Protect pin allows normal read/write operations when connected to ground (GND). When
the Write Protection pin is connected to Vcc, the write protection feature is enabled and operates as
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BL24C128A 128K bits (16,384×8)
shown in the following Table 2.
WP Pin Status
BL24C128A
At VCC
Full(128K)Array
At GND
Normal Read/Write Operations
Table2
Functional Description
1. Memory Organization
BL24C128A, 128K SERIAL EEPROM: Internally organized with 256 pages of 64 bytes each, the 128K
requires a 14-bit data word address for random word addressing.
2. Device Operation
CLOCK and DATA TRANSITIONS: The SDA pin is normally pulled high with an external device. Data on
the SDA pin may change only during SCL low time periods (see Figure 1). Data changes during SCL
high periods will indicate a start or stop condition as defined below.
START CONDITION: A high-to-low transition of SDA with SCL high is a start condition which must
precede any other command (see Figure 2).
STOP CONDITION: A low-to-high transition of SDA with SCL high is a stop condition. After a read
sequence, the stop command will place the EEPROM in a standby power mode (see Figure 2).
ACKNOWLEDGE: All addresses and data words are serially transmitted to and from the EEPROM in 8-bit
words. The EEPROM sends a "0" to acknowledge that it has received each word. This happens during
the ninth clock cycle.
STANDBY MODE: The BL24C128A features a low-power standby mode which is enabled: (a) upon
power-up and (b) afer the receipt of the STOP bit and the completion of any internal operations.
MEMORY RESET: After an interruption in protocol, power loss or system reset, any two-wire part can
be reset by following these steps:
1. Clock up to 9 cycles.
2. Look for SDA high in each cycle while SCL is high.
3. Create a start condition
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BL24C128A 128K bits (16,384×8)
Figure 1. Data Validity
SDA
SCL
DATA STABLE
DATA CHANGE
DATA STABLE
Figure 2. Start and Stop Definition
SDA
SCL
START
STOP
Figure 3. Output Acknowledge
SCL
1
8
9
DATA IN
DATA OUT
START
ACKNOWLEDGE
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BL24C128A 128K bits (16,384×8)
3. Device Addressing
The 128K EEPROM devices all require an 8-bit device address word following a start condition to
enable the chip for a read or write operation (see Figure 4)
The device address word consists of a mandatory "1", "0" sequence for the first four most
significant bits as shown. This is common to all the Serial EEPROM devices.
The 128K EEPROM uses A2, A1 and A0 device address bits to allow as much as eight devices on the
same bus. These 3 bits must be compared to their corresonding hardwired input pins. The A2, A1
and A0 pins use an internal proprietary circuit that biases them to a logic low condition if the pins
are allowed to float.
The eighth bit of the device address is the read/write operation select bit. A read operation is
initiated if this bit is high and a write operation is initiated if this bit is low.
Upon a compare of the device address, the EEPROM will output a "0". If a compare is not made, the
chip will return to a standby state.
DATA SECURITY: The BL24C128A has a hardware data protection scheme that allows the user
to
write protect the entire memory when the WP pin is at VCC.
4. Write Operations
BYTE WRITE: A write operation requires an 8-bit data word address following the device address
word and acknowledgment. Upon receipt of this address, the EEPROM will again respond with a "0"
and then clock in the first 8-bit data word. Following receipt of the 8-bit data word, the EEPROM
will output a "0" and the addressing device, such as a microcontroller, must terminate the write
sequence with a stop condition. At this time the EEPROM enters an internally timed write cycle, tWR,
to the nonvolatile memory. All inputs are disabled during this write cycle and the EEPROM will not
respond until the write is complete (see Figure 5).
PAGE WRITE: The 128K EEPROM is capable of an 64-byte page writes. A page write is initiated the
same as a byte write, but the microcontroller does not send a stop condition after the first data
word is clocked in. Instead, after the EEPROM acknowledges receipt of the first data word, the
microcontroller can transmit up to 63 more data words. The EEPROM will respond with a “0” after
each data word received. The microcontroller must terminate the page write sequence with a stop
condition (see Figure 6).
The data word address lower six bits are internally incremented following the receipt of each data
word. The higher data word address bits are not incremented, retaining the memory page row
location. When the word address, internally generated, reaches the page boundary, the following
byte is placed at the beginning of the same page. If more than 64data words are transmitted to the
EEPROM, the data word address will “roll over” and previous data will be overwritten.
ACKNOWLEDGE POLLING: Once the internally timed write cycle has started and the EEPROM inputs
are disabled, acknowledge polling can be initiated. This involves sending a start condition followed
by the device address word. The read/write bit is representative of the operation desired. Only if the
internal write cycle has completed will the EEPROM respond with a "0", allowing the read or write
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BL24C128A 128K bits (16,384×8)
sequence to continue.
5. Read Operations
Read operations are initiated the same way as write operations with the exception that the
read/write select bit in the device address word is set to "1". There are three read operations:
current address read, random address read and sequential read.
CURRENT ADDRESS READ: The internal data word address counter maintains the last address
accessed during the last read or write operation, incremented by one. This address stays valid
between operations as long as the chip power is maintained. The address "roll over" during read is
from the last byte of the last memory page to the first byte of the first page. The address "roll
over" during write is from the last byte of the current page to the first byte of the same page.
Once the device address with the read/write select bit set to "1" is clocked in and acknowledged by
the EEPROM, the current address data word is serially clocked out. The microcontroller does not
respond with an input "0" but does generate a following stop condition (see Figure 7).
RANDOM READ: A random read requires a "dummy" byte write sequence to load in the data word
address. Once the device address word and data word address are clocked in and acknowledged by
the EEPROM, the microcontroller must generate another start condition. The microcontroller now
initiates a current address read by sending a device address with the read/write select bit high. The
EEPROM acknowledges the device address and serially clocks out the data word. The
microcontroller does not respond with a "0" but does generate a following stop condition (see
Figure 8)
SEQUENTIAL READ: Sequential reads are initiated by either a current address read or a random
address read. After the microcontroller receives a data word, it responds with an acknowledge. As
long as the EEPROM receives an acknowledge, it will continue to increment the data word address
and serially clock out sequential data words. When the memory address limit is reached, the data
word address will "roll over" and the sequential read will continue. The sequential read operation is
terminated when the microcontroller does not respond with a "0" but does generate a following
stop condition (see Figure 9).
Figure 4: Device Address
MSB
1
LSB
0
1
0
0
0
0
R/W
Figure 5: Byte Write
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BL24C128A 128K bits (16,384×8)
S
T
A
R
T
DEVICE
ADDRESS
W
R
I
T
E
FIRST WORD
ADDRESS
SECOND WORD
ADDRESS
S
T
O
P
DATA
SDA
LINE
M
S
B
L R A
S / C
BWK
L A
S C
B K
L A
S C
B K
L A
S C
B K
Note.1*=DON'T’T CARE bits
Figure 6: Page Write
S
T
A
R
T
DEVICE
ADDRESS
W
R
I
T
E
FIRST WORD
ADDRESS
SECOND WORD
ADDRESS
DATA(n)
DATA(n+1)
S
T
O
P
DATA(n+1)
SDA
LINE
M
S
B
L R A
S / C
BWK
L A
S C
B K
L A
S C
B K
A
C
K
A
C
K
A
C
K
Note.1*=DON'T CARE bits
Figure 7: Current Address Read
S
T
A
R
T
DEVICE
ADDRESS
R
E
A
D
S
T
O
P
DATA
SDA
LINE
M
S
B
L R A
S / C
BWK
NO
ACK
Figure 8: Random Read
S
T
A
R
T
DEVICE
ADDRESS
W
R
I
T
E
S
T
A
R
T
1st,2nd WORD
ADDRESS
DEVICE
ADDRESS
R
E
A
D
DATA(n)
S
T
O
P
SDA
LINE
M
S
B
L R A
S / C
BWK
L A
S C
B K
A
C
K
NO
ACK
DUMMY WRITE
Note.1*=DON'T CARE bits
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BL24C128A 128K bits (16,384×8)
Figure 9: Sequential Read
DEVICE
ADDRESS
R
E
A
D
DATA(n)
DATA(n+1)
DATA(n+2)
S
T
O
P
DATA(n+x)
SDA
LINE
R A
/ C
WK
A
C
K
A
C
K
A
C
K
NO
ACK
Electrical Characteristics
Absolute Maximum Stress Ratings:
 Comments:
 DC Supply Voltage . . . . . . .-0.3V to +6.5V
Stresses above those listed under "Absolute
 Input / Output Voltage. . . . . . .GND-0.3V to
Maximum
VCC+0.3V
Ratings"
may
cause
permanent
damage to this device. These are stress ratings
 Operating Ambient Temperature……-40 ℃ to
+85℃
only. Functional operation of this device at
these or any other conditions above those
 Storage Temperature . . . . . .-65℃ to +150℃
indicated in the operational sections of this
specification
is
not
implied
or
intended.
Exposure to the absolute maximum rating
conditions for extended periods may affect
device reliability.
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BL24C128A 128K bits (16,384×8)
DC Electrical Characteristics
Applicable over recommended operating range from: TA = -40℃ to +85℃, VCC = +1.7V to +5.5V
(unless otherwise noted)
Parameter
Symbol
Min
Typ
Max
Unit
Condition
Supply Voltage
VCC1
1.7
-
5.5
V
-
Supply Voltage
VCC2
2.5
-
5.5
V
-
Supply Voltage
VCC3
2.7
-
5.5
V
-
Supply Voltage
VCC4
4.5
-
5.5
V
-
Supply Current VCC=5.0V
ICC1
-
0.4
1.0
mA
READ at 400KHZ
Supply Current VCC=5.0V
ICC2
-
2.0
3.0
mA
WRITE at 400KHZ
Supply Current VCC=1.7V
ISB1
-
0.6
1.0
μA
VIN=VCC or VSS
Supply Current VCC=2.5V
ISB2
-
1.0
2.0
μA
VIN=VCC or VSS
Supply Current VCC=2.7V
ISB3
-
1.0
2.0
μA
VIN=VCC or VSS
Supply Current VCC=5.0V
ISB4
-
2.0
5.0
μA
VIN=VCC or VSS
Input Leakage Current
IL1
-
0.10
3.0
μA
VIN=VCC or VSS
Output Leakage Current
ILO
-
0.05
3.0
μA
VOUT=VCC or VSS
Input Low Level
VIL1
-0.3
-
VCC×0.3
V
VCC=1.8V to 5.5V
Input High Level
VIH1
VCC×0.7
-
VCC+0.3
V
VCC=1.8V to 5.5V
Input Low Level
VIL2
-0.3
-
VCC×0.2
V
VCC=1.7V
Input High Level
VIH2
VCC×0.7
-
VCC+0.3
V
VCC=1.7V
Output Low Level VCC=5.0V
VOL3
-
-
0.4
V
IOL=3.0mA
Output Low Level VCC=3.0V
VOL2
-
-
0.4
V
IOL=2.1mA
Output Low Level VCC=1.7V
VOL1
-
-
0.2
V
IOL=0.15mA
Pin Capacitance
Applicable over recommended operating range from TA = 25℃, f = 1.0 MHz, VCC = +1.7V
Parameter
Symbol
Min
Typ
Max
Unit
Condition
Input/Output Capacitance(SDA)
CI/O
-
-
8
pF
VIO=0V
Input Capacitance(A0,A1,A2,SCL)
CIN
-
-
6
pF
VIN=0V
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BL24C128A 128K bits (16,384×8)
AC Electrical Characteristics
Applicable over recommended operating range from TA = -40℃ to +85℃, VCC = +1.7V to +5.5V, CL
= 1 TTL Gate and 100 pF (unless otherwise noted)
Parameter
Symbol
1.7V≤VCC﹤2.5V
2.5V≤VCC﹤5.5V
Min
Typ
Max
Min
Typ
Max
Units
Clock Frequency,SCL
fSCL
-
-
400
-
-
1000
KHZ
Clock Pulse Width Low
tLOW
1.2
-
-
0.6
-
-
μs
Clock Pulse Width High
tHIGH
0.6
-
-
0.4
-
-
μs
Noise Suppression Time
tI
-
-
50
-
-
50
ns
Clock Low to Data Out Valid
tAA
0.1
-
0.9
0.05
-
0.9
μs
Time the bus must be free before a
new transmission can start
tBUF
1.2
-
-
0.5
-
-
μs
Start Hold Time
tHD:STA
0.6
-
-
0.25
-
-
μs
Start Setup Time
tSU:DAT
0.6
-
-
0.25
-
-
μs
Data In Hold Time
tHD:DAT
0
-
-
0
-
-
μs
Data in Setup Time
tSU:DAT
100
-
-
100
-
-
ns
Input Rise Time(1)
tR
-
-
0.3
-
-
0.3
μs
Input Fall Time(1)
tF
-
-
300
-
-
300
μs
Stop Setup Time
tSu:STO
0.6
-
-
0.25
-
-
μs
Data Out Hold Time
tDH
50
-
-
50
-
-
ns
Write Cycle Time
twR
-
3.3
5
-
3.3
5
ms
Endurance
1M
-
-
-
-
-
Write Cycle
5.0V,25℃,Byte Mode(1)
Note:
1. This parameter is characterized and is not 100% tested.
2. AC measurement conditions:
RL (connects to VCC): 1.3 k (2.5V, 5V), 10 k (1.7V) Input pulse voltages: 0.3 VCC to 0.7 VCC
Input rise and fall time: 50 ns
Input and output timing reference voltages: 0.5 VCC
The value of RL should be concerned according to the actual loading on the user's system.
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BL24C128A 128K bits (16,384×8)
Bus Timing
Figure 10: SCL: Serial Clock, SDA: Serial Data I/O
tF
tHIGH
tR
tLOW
tLOW
SCL
tSU.DAT
tHD.DAT
tHD.STA
tSU.STA
tSU.STO
SDA_IN
tAA
t BUF
tDH
SDA_OUT
Write Cycle Timing
Figure 11: SCL: Serial Clock, SDA: Serial Data I/O
SCL
ACK
SDA
Word n
tWR(1)
STOP
CONDITION
START
CONDITION
Note:
The write cycle time tWR is the time from a valid stop condition of a write sequence to the end of the internal
clear/write cycle.
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BL24C128A 128K bits (16,384×8)
Package Information
PDIP Outline Dimensions
E
E1
C
eA
Top View
End View
COMMON DIMENSIONS
(Unit of Measure=inches)
D
D1
e
B3
4PLCS
A2 A
b2
b
Side View
L
SYMBOL
A
A2
b
b2
b3
c
D
D1
E
E1
e
eA
L
MIN
NOM
0.115
0.014
0.045
0.030
0.008
0.355
0.005
0.300
0.240
0.130
0.018
0.060
0.039
0.010
0.365
0.115
0.310
0.250
0.100BSC
0.300BSC
0.130
MAX
0.210
0.195
0.022
0.070
0.045
0.014
0.400
NOTE
2
5
6
6
0.325
0.280
3
3
4
3
0.150
4
2
Note:
1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional
information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not
exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed
0.010 (0.25 mm).
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BL24C128A 128K bits (16,384×8)
SOP
1
E
E1
N
L
Φ
COMMON DIMENSIONS
(Unit of Measure=mm)
B
e
D
A
A1
SYMBOL
A
A1
b
C
D
E1
E
e
L
Φ
MIN
1.35
0.10
0.31
0.17
4.80
3.81
5.79
0.40
0"
NOM
1.27BSC
-
MAX
1.75
0.25
0.51
0.25
5.00
3.99
6.20
NOTE
1.27
8"
Note:
These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper
dimensions, tolerances, datums, etc.
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BL24C128A 128K bits (16,384×8)
TSSOP
3
2
1
E1
E
L1
End View
N
L
COMMON DIMENSIONS
Unit of Measure=mm
Top View
A
b
e
A2
D
Side View
SYMBOL
D
E
E1
A
A2
b
e
L
L1
MIN
2.90
4.30
0.80
0.19
0.45
NOM
MAX
3.00
3.10
6.40BSC
4.40
4.50
1.20
1.00
1.05
0.30
0.65BSC
0.60
0.75
1.00REF
NOTE
2,5
3,5
4
Note:
1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper
dimensions, tolerances, datums, etc.
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs
shall not exceed 0.15 mm (0.006 in) per side.
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not
exceed 0.25 mm (0.010 in) per side.
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in
excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the
foot. Minimum space between protrusion and adjacent lead is 0.07 mm.
5. Dimension D and E1 to be determined at Datum Plane H.
BL24C128A 128Kbits (16,384×8) Belling Proprietary Information. Unauthorized Photocopy and Duplication Prohibited
© 2016 Belling All Rights Reserved www.belling.com.cn
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BL24C128A 128K bits (16,384×8)
UDFN
D
D2
L
PIN 1 DOT
BY MARKING
E
E2
PIN #1 IDENTIFICATION
CHAMFER
TOP VIEW
A
b
e
BOTTOM VIEW
A3
A1
SIDE VIEW
PKG
REF
A
A1
A3
D
E
b
L
D2
E2
e
COMMON DIMENSION(MM)
UT:ULTRA THIN
MIN
NOM
MAX
>0.50
0.55
0.60
0.00
0.05
0.15REF
1.95
2.00
2.05
2.95
3.00
3.05
0.20
0.25
0.30
0.20
0.30
0.40
1.25
1.40
1.50
1.15
1.30
1.40
0.50BSC
BL24C128A 128Kbits (16,384×8) Belling Proprietary Information. Unauthorized Photocopy and Duplication Prohibited
© 2016 Belling All Rights Reserved www.belling.com.cn
15-16
BL24C128A 128K bits (16,384×8)
WLCSP
X1
E1
X2
E
Y1
b
D1
D
PIN1
Y2
TOP VIEW
(MARK SIDE)
BOTTOM VIEW
(BALL SIDE)
25μm Backside Tape
COMMON DIMENSIONS
(UNITS OF MEASURE=MILLIMETER)
A2
A
A1
SIDE VIEW
SYMBOL
A
A1
A2
D
D1
E
E1
b
x1
x2
y1
y2
MIN
0.270
0.045
0.215
0.798
0.862
0.140
NOM
0.290
0.055
0.235
0.818
0.400BSC
0.882
0.500BSC
0.160
0.191 REF
0.191 REF
0.209 REF
0.209 REF
MAX
0.310
0.065
0.255
0.838
0.902
0.180
NOTES:
All wafer orientation notch down
Ordering Information
BL24C128A 1
Code
2
3
Description
Package type
PA: SOP-8L
SF: TSSOP-8L
DA: PDIP-8L
1
NT: UDFN-8L
TC: SOT23-5L
RR: TSOT23-5L
MA: M2.2
MB: M3.2
Packing type
2
R: Tape and Reel
T: Tube
Feature
3
S: Standard (default, Pb Free RoHS Std.)
C: Green (Halogen Free)
BL24C128A 128Kbits (16,384×8) Belling Proprietary Information. Unauthorized Photocopy and Duplication Prohibited
© 2016 Belling All Rights Reserved www.belling.com.cn
16-16
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