MC74LVX257 Quad 2−Channel Multiplexer with 3−State Outputs The MC74LVX257 is an advanced high speed CMOS quad 2−channel multiplexer fabricated with silicon gate CMOS technology. It consists of four 2−input digital multiplexers with common select (S) and enable (OE) inputs. When (OE) is held High, selection of data is inhibited and all the outputs go Low. The select decoding determines whether the A or B inputs get routed to the corresponding Y outputs. The inputs tolerate voltages up to 7.0 V, allowing the interface of 5.0 V systems to 3.0 V systems. http://onsemi.com MARKING DIAGRAMS 16 Features • • • • • • • • • • • • SOIC−16 D SUFFIX CASE 751B High Speed: tPD = 4.5 ns (Typ) at VCC = 3.3 V Low Power Dissipation: ICC = 4 A (Max) at TA = 25°C LVX257 AWLYWW 1 High Noise Immunity: VNIH = VNIL = 28% VCC Power Down Protection Provided on Inputs 16 Balanced Propagation Delays LVX 257 ALYW TSSOP−16 DT SUFFIX CASE 948F Designed for 2.0 V to 5.5 V Operating Range Low Noise: VOLP = 0.8 V (Max) 1 Pin and Function Compatible with Other Standard Logic Families Latchup Performance Exceeds 300 mA Chip Complexity: FETs = 100; Equivalent Gates = 25 ESD Performance: Human Body Model > 2000 V; Machine Model > 200 V Pb−Free Packages are Available* 16 SOEIAJ−16 M SUFFIX CASE 966 LVX257 ALYW 1 A WL or L Y WW or W = = = = Assembly Location Wafer Lot Year Work Week ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2005 March, 2005 − Rev. 3 1 Publication Order Number: MC74LVX257/D MC74LVX257 I0a S 1 16 VCC I1a A0 2 15 OE I0b B0 3 14 A3 Y0 4 13 B3 A1 5 12 Y3 B1 6 11 A2 Y1 7 10 B2 GND 8 9 Y2 I1b I0c I1c I0d I1d OE 2 4 Za 3 5 7 Zb 6 14 12 Zc 13 11 9 Zd 10 15 Figure 1. Pin Assignment S 1 Figure 2. Expanded Logic Diagram OE S A0 B0 A1 B1 A2 B2 A3 B3 15 1 2 3 5 6 EN G1 1 1 MUX 4 7 11 10 14 13 9 12 Y0 FUNCTION TABLE Y1 Inputs OE Y2 S Outputs Y0 − Y3 H X Z L L A0 −A3 L H B0 −B3 A0 − A3, B0 − B3 = the levels of the respective Data−Word Inputs. Y3 Figure 3. IEC Logic Symbol ORDERING INFORMATION Package Shipping† MC74LVX257D SOIC−16 48 Units / Rail MC74LVX257DG SOIC−16 (Pb−Free) 48 Units / Rail MC74LVX257DR2 SOIC−16 2500 Tape & Reel MC74LVX257DR2G SOIC−16 (Pb−Free) 2500 Tape & Reel MC74LVX257DT TSSOP−16* 96 Units / Rail MC74LVX257DTR2 TSSOP−16* 2500 Tape & Reel MC74LVX257M SOEIAJ−16 50 Units / Rail MC74LVX257MEL SOEIAJ−16 2000 Tape & Reel MC74LVX257MELG SOEIAJ−16 (Pb−Free) 2000 Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. *This package is inherently Pb−Free. http://onsemi.com 2 MC74LVX257 MAXIMUM RATINGS Symbol Parameter Value Unit VCC Positive DC Supply Voltage −0.5 to +7.0 V VIN Digital Input Voltage −0.5 to +7.0 V VOUT DC Output Voltage −0.5 to VCC +0.5 V IIK Input Diode Current −20 mA IOK Output Diode Current 20 mA IOUT DC Output Current, per Pin 25 mA ICC DC Supply Current, VCC and GND Pins 75 mA PD Power Dissipation in Still Air 200 180 mW TSTG Storage Temperature Range VESD ESD Withstand Voltage ILATCHU Latchup Performance SOIC Package TSSOP −65 to +150 °C Human Body Model (Note 1) Machine Model (Note 2) Charged Device Model (Note 3) >2000 >200 >2000 V Above VCC and Below GND at 125°C (Note 4) 300 mA 143 164 °C/W P JA Thermal Resistance, Junction−to−Ambient SOIC Package TSSOP Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. Tested to EIA/JESD22−A114−A 2. Tested to EIA/JESD22−A115−A 3. Tested to JESD22−C101−A 4. Tested to EIA/JESD78 RECOMMENDED OPERATING CONDITIONS Symbol Characteristics Min Max Unit 2.0 3.6 V VCC DC Supply Voltage VIN DC Input Voltage 0 5.5 V DC Output Voltage 0 VCC V −40 85 °C 0 100 ns/V VOUT TA Operating Temperature Range, all Package Types tr, tf Input Rise or Fall Time VCC = 3.3 V + 0.3 V http://onsemi.com 3 This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However, precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high−impedance circuit. For proper operation, Vin and Vout should be constrained to the range GND (Vin or Vout) VCC. Unused inputs must always be tied to an appropriate logic voltage level (e.g., either GND or V CC ). Unused outputs must be left open. MC74LVX257 DC CHARACTERISTICS (Voltages Referenced to GND) VCC Symbol Parameter Condition (V) Min 0.75 VCC 0.7 VCC 0.7 VCC VIH Minimum High−Level Input Voltage 2.0 3.0 3.6 VIL Maximum Low−Level Input Voltage 2.0 3.0 3.6 VOH High−Level Output Voltage IOH = −50 A IOH = −50 A IOH = −4 mA 2.0 3.0 3.0 VOL Low−Level Output Voltage IOL = 50 A IOL = 50 A IOL = 4 mA 2.0 3.0 3.0 IOZ Maximum 3−State Leakage Current VIN = VIH or VIL VOUT = VCC or GND IIN Input Leakage Current ICC Maximum Quiescent Supply Current (per package) −40°C ≤ TA ≤ 85°C TA = 25°C Typ Max Min 0.75 VCC 0.7 VCC 0.7 VCC 0.25 VCC 0.3 VCC 0.3 VCC 1.9 2.9 2.58 Max 2.0 3.0 0.0 0.0 Unit V 0.25 VCC 0.3 VCC 0.3 VCC 1.9 2.9 2.48 V V 0.1 0.1 0.36 0.1 0.1 0.44 V 3.6 ±0.1 ±1.0 A VIN = 5.5 V or GND 0 to 3.6 ±0.1 ±1.0 A VIN = VCC or GND 3.6 2.0 40 A 1.0 1.0 ÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎ ÎÎÎÎ ÎÎÎÎÎÎÎ ÎÎÎÎÎÎÎÎÎÎ ÎÎÎ ÎÎÎ ÎÎÎÎ ÎÎÎÎ ÎÎÎÎÎÎ AC ELECTRICAL CHARACTERISTICS Input tr = tf = 3.0 ns −40°C ≤ TA ≤ 85°C TA = 25°C Symbol tPLH, tPHL tPLH, tPHL tPZL, tPZH tPLZ, tPHZ CIN Parameter Maximum Propagation Delay, A or B to Y Maximum Propagation Delay, S to Y Maximum Output Enable, Time, OE to Y Maximum Output Disable, Time, OE to Y Min Test Conditions Typ Max Min Max Unit ns VCC = 2.7 V CL = 15pF CL = 50pF 6.5 9.5 10.0 14.0 1.0 1.0 15.0 18.5 VCC = 3.3 V ± 0.3 V CL = 15pF CL = 50pF 4.5 7.5 8.0 12.0 1.0 1.0 10.0 13.5 VCC = 2.7 V CL = 15pF CL = 50pF 8.0 10.5 12.0 15.5 1.0 1.0 17.0 20.0 VCC = 3.3 V ± 0.3 V CL = 15pF CL = 50pF 6.0 8.5 10.0 13.5 1.0 1.0 12.0 15.5 VCC = 2.7 V RL = 1 k CL = 15pF CL = 50pF 7.5 10.5 11.5 15.0 1.0 1.0 16.5 18.0 VCC = 3.3 V ± 0.3 V RL = 1 k CL = 15pF CL = 50pF 5.5 8.5 9.5 13.0 1.0 1.0 11.5 15.0 VCC = 2.7 RL = 1 k CL = 50pF 13.0 17.0 1.0 18.0 VCC = 3.3 V ± 0.3 V RL = 1 k CL = 50pF 12 17.0 1.0 18.0 4 10 Maximum Input Capacitance 10 ns ns ns pF Typical @ 25°C, VCC = 3.3 V CPD 20 Power Dissipation Capacitance (Note 5) pF 5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load. Average operating current can be obtained by the equation: ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic power consumption; PD = CPD VCC2 fin + ICC VCC. http://onsemi.com 4 MC74LVX257 NOISE CHARACTERISTICS Input tr = tf = 3.0 ns, CL = 50 pF, VCC = 3.3 V TA = 25°C Symbol Characteristic Typ Max Unit VOLP Quiet Output Maximum Dynamic VOL 0.3 0.5 V VOLV Quiet Output Minimum Dynamic VOL −0.3 −0.5 V VIHD Minimum High Level Dynamic Input Voltage 2.0 V VILD Maximum Low Level Dynamic Input Voltage 0.8 V OE VCC 50% GND VCC A, B or S 50% tPLH Y tPZL GND tPHL tPLZ 50% VCC Y tPZH 50% VCC VOH − 0.3V HIGH IMPEDANCE Figure 5. Switching Waveform TEST POINT TEST POINT OUTPUT DEVICE UNDER TEST VOL + 0.3V tPHZ 50% VCC Y Figure 4. Switching Waveform HIGH IMPEDANCE DEVICE UNDER TEST CL* *Includes all probe and jig capacitance OUTPUT 1 k CL * CONNECT TO VCC WHEN TESTING tPLZ AND tPZL. CONNECT TO GND WHEN TESTING tPHZ AND tPZH. *Includes all probe and jig capacitance Figure 6. Test Circuit Figure 7. Test Circuit INPUT Figure 8. Input Equivalent Circuit http://onsemi.com 5 MC74LVX257 PACKAGE DIMENSIONS SOIC−16 D SUFFIX CASE 751B−05 ISSUE J NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. −A− 16 9 −B− 1 P 8 PL 0.25 (0.010) 8 M B S G R K F X 45 C −T− SEATING PLANE J M D 16 PL 0.25 (0.010) M T B S A DIM A B C D F G J K M P R MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0 7 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0 7 0.229 0.244 0.010 0.019 S TSSOP−16 DT SUFFIX CASE 948F−01 ISSUE A 16X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S S K ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K1 2X L/2 16 9 J1 B −U− L SECTION J PIN 1 IDENT. 8 1 N 0.15 (0.006) T U S 0.25 (0.010) A −V− M N F DETAIL E C 0.10 (0.004) −T− SEATING PLANE H D DETAIL E G http://onsemi.com 6 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE N−N DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−. MILLIMETERS INCHES DIM MIN MAX MIN MAX A 4.90 5.10 0.193 0.200 B 4.30 4.50 0.169 0.177 C −−− 1.20 −−− 0.047 D 0.05 0.15 0.002 0.006 F 0.50 0.75 0.020 0.030 G 0.65 BSC 0.026 BSC H 0.18 0.28 0.007 0.011 J 0.09 0.20 0.004 0.008 J1 0.09 0.16 0.004 0.006 K 0.19 0.30 0.007 0.012 K1 0.19 0.25 0.007 0.010 L 6.40 BSC 0.252 BSC −W− M 0 8 0 8 MC74LVX257 SOEIAJ−16 M SUFFIX CASE 966−01 ISSUE O 16 LE 9 Q1 M E HE 1 8 L DETAIL P Z D e VIEW P A DIM A A1 b c D E e HE L LE M Q1 Z A1 b 0.13 (0.005) c M NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5. THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). 0.10 (0.004) http://onsemi.com 7 MILLIMETERS MIN MAX −−− 2.05 0.05 0.20 0.35 0.50 0.18 0.27 9.90 10.50 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 0 0.70 0.90 −−− 0.78 INCHES MIN MAX −−− 0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.390 0.413 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 0 0.028 0.035 −−− 0.031 MC74LVX257 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 61312, Phoenix, Arizona 85082−1312 USA Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada Email: [email protected] N. American Technical Support: 800−282−9855 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com Order Literature: http://www.onsemi.com/litorder Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 8 For additional information, please contact your local Sales Representative. MC74LVX257/D