TI1 LP5951 Micropower, 150ma low-dropout cmos voltage regulator Datasheet

LP5951
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SNVS345E – JUNE 2006 – REVISED JANUARY 2011
LP5951 Micropower, 150mA Low-Dropout CMOS Voltage Regulator
Check for Samples: LP5951
FEATURES
1
•
•
•
•
•
•
•
•
•
2
•
•
Excellent Line Transient Response: ±2mV typ.
Excellent PSRR: -60dB at 1kHz typ.
Low Quiescent Current of 29µA typ.
1.8 to 5.5V Input Voltage Range
Small SC70-5 and SOT-23-5 Packages
Fast Turn-on Time of 30µs typ.
Typ. < 1nA Quiescent Current in Shutdown
Guaranteed 150mA Output Current
Output Voltage Range: 1.3V to 3.7V
•
•
Logic Controlled Enable 0.4V/0.9V
Good Load Transient Response of 50mVpp
typ.
Thermal-overload and Short-circuit Protection
-40°C to +125°C Junction Temperature Range
APPLICATIONS
•
General Purpose
DESCRIPTION
The LP5951 regulator is designed to meet the requirements of portable, battery-powered systems providing a
regulated output voltage and low quiescent current. When switched to shutdown mode via a logic signal at the
Enable pin, the power consumption is reduced to virtually zero.
The LP5951 is designed to be stable with small 1µF ceramic capacitors.
The LP5951 also features internal protection against short-circuit currents and over-temperature conditions.
Performance is specified for a -40°C to 125°C temperature range.
The device is available in SOT-23-5 and SC70-5 package.
The device is available in fixed output voltages in the range of 1.3V to 3.7V. For availability, please contact your
local TI sales office.
Typical Application Circuit
LP5951
1
VIN
VIN
1 PF
VOUT 5
1 PF
Enable Control,
active high
3
NC
4
Load
VEN
GND
2
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
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LP5951
SNVS345E – JUNE 2006 – REVISED JANUARY 2011
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Connection Diagram
Vout
5
Vout
5
NC
4
1
Vin
2
GND
1
Vin
3
EN
Figure 1. 5-Lead SOT-23 Package – Top View
See Package Number DBV
NC
4
2
GND
3
EN
Figure 2. 5-Lead SC70 Package – Top View
See Package Number DCK
PIN DESCRIPTIONS
Pin Number
Pin Name
Description
1
VIN
Input Voltage. Input range: 1.8V to 5.5V
2
GND
Ground
3
EN
Enable pin logic input: Low = shutdown, High = normal operation. This pin should not be left floating.
4
NC
No internal connection
5
VOUT
Regulated output voltage
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2)
VIN pin: Voltage to GND
-0.3V to 6.5V
EN pin: Voltage to GND
-0.3V to (VIN+0.3V) with 6.5V max
Continuous Power Dissipation (3)
Internally Limited
Junction Temperature (TJ-MAX )
150°C
Storage Temperature Range
-65°C to + 150°C
Package Peak Reflow Temperature (10-20 sec.)
240°C
Package Peak Reflow Temperature (Pb-free, 10-20 sec.)
260°C
ESD Rating (4)
Human Body Model:
2.0kV
Machine Model
200V
(1)
(2)
(3)
(4)
2
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics tables.
All voltages are with respect to the potential at the GND pin.
Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ = 160°C (typ.) and
disengages at TJ = 140°C (typ.).
The Human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. The machine model is a 200pF
capacitor discharged directly into each pin. (MIL-STD-883 3015.7)
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Operating Ratings (1) (2)
Input Voltage Range (VIN)
1.8V to 5.5V
VEN Input Voltage
0 to (VIN + 0.3V)
Junction Temperature (TJ) Range
-40°C to + 125°C
Ambient Temperature (TA) Range
(1)
(2)
(3)
See
(3)
Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under
which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed
performance limits and associated test conditions, see the Electrical Characteristics tables.
All voltages are with respect to the potential at the GND pin.
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).
Thermal Properties
Junction-to-Ambient Thermal Resistance (θJA) (1)
SOT-23-5 Package
220°C/W
SC70-5 Package
415°C/W
(1)
Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power
dissipation exists, special attention must be paid to thermal dissipation issues in board design.
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LP5951
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Electrical Characteristics (1)
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(2)
Typical values and limits appearing in standard typeface are for TA = 25°C. Limits appearing in boldface type apply over the
full operating temperature range: -40°C ≤ TJ ≤ +125°C. Unless otherwise noted, VIN = VOUT(NOM) + 1V, CIN = 1µF, COUT = 1µF,
VEN = 0.9V.
Symbol
VIN
ΔVOUT
VDO
Parameter
Condition
Typ
Limit
Units
Min
Max
Input Voltage
VIN ≥ VOUT(NOM) + VDO
1.8
5.5
V
Output Voltage Tolerance
IOUT = 1mA
-30°C ≤ TJ ≤ +125°C
-2.0
-3.5
2.0
3.5
%
%
Line Regulation Error
VIN = VOUT(NOM) + 1V to 5.5V
IOUT = 1mA
Load Regulation Error
IOUT = 1mA to 150mA
Output Voltage Dropout
IOUT = 150mA
VOUT ≥ 2.5V
VOUT < 2.5V
(3)
0.1
%/V
-0.01
%/mA
200
250
350
mV
mV
29
33
0.005
55
70
1
µA
µA
µA
IQ
Quiescent Current
VEN = 0.9V, ILOAD = 0
VEN = 0.9V, ILOAD = 150mA
VEN = 0V
ISC
Output Current
(short circuit)
VIN = VOUT(NOM) + 1V
400
PSRR
Power Supply
Rejection Ratio
Sine modulated VIN
f = 100Hz
f = 1kHz
f = 10kHz
60
60
50
dB
dB
dB
EN
Output Noise
BW = 10Hz - 100kHz
125
µVRMS
TSD
Thermal Shutdown
160
°C
Temperature Hysteresis
20
°C
(1)
(2)
150
mA
All voltages are with respect to the potential at the GND pin.
Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the
most likely norm.
Dropout voltage is defined as the input to output voltage differential at which the output voltage falls to 100mV below the nominal output
voltage. This specification does not apply for output voltages below 1.8V.
(3)
Enable Control Characteristics
Symbol
Parameter
Conditions
IEN
Maximum Input Current at 0V ≤ VEN ≤ VIN, VIN = 5.5V
VEN Input
VIL
Low Input Threshold
(shutdown)
VIN = 1.8..5.5V
VIH
High Input Threshold
(enable)
VIN = 1.8..5.5V
Typical
Limit
Units
Min
Max
-1
1
µA
0.4
V
0.9
V
Transient Characteristics
Symbol
Parameter
Conditions
Typical
Limit
Min
Units
Max
ΔVOUT
Dynamic Line Transient VIN = VOUT(NOM) + 1V to
VOUT(NOM) + 1V + 0.6V in 30µs, no load
±2
mV
ΔVOUT
Dynamic Load
Transient
IOUT = 0mA to 150mA in 10µs
IOUT = 150mA to 0mA in 10µs
IOUT = 1mA to 150mA in 1µs
IOUT = 150mA to 1mA in 1µs
-30
20
-50
40
mV
mV
mV
mV
ΔVOUT
Overshoot on Startup
Nominal conditions
10
mV
TON
Turn on time
IOUT = 1mA
30
µs
4
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Output Capacitor, Recommended Specification
Symbol
Parameter
Conditions
Value
Limit
Min
COUT
Output Capacitance
Capacitance (2)
IOUT = 150mA, VIN = 5.0V
1.0
ESR
(1)
(2)
(1)
Units
Max
0.7
47
µF
0.003
0.300
Ω
Min and Max limits are guaranteed by design
The capacitor tolerance should be 30% or better over temperature. The full operating conditions for the application should be considered
when selecting a suitable capacitor to ensure that the minimum value of capacitance is always met. Recommended capacitor type is
X7R. However, dependent on application, X5R, Y5V, and Z5U can also be used. The shown minimum limit represents real minimum
capacitance, including all tolerances and must be maintained over temperature and dc bias voltage (See capacitor section in
Applications Hints)
Output Current Derating
Maximum Load Current vs VIN - VOUT, TA = 85°C, VOUT = 1.5V
Block Diagram
VIN
Bias
Generator
EN
LDO Core
and
Reference
VOUT
Enable
Controller
Over
Current and
Thermal
Protection
GND
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Typical Performance Characteristics
Unless otherwise specified, CIN = 1µF ceramic, COUT = 1µF ceramic, VIN = VOUT(NOM) + 1V, TA = 25°C, Enable pin is tied to VIN.
0
ÂVOUT
150
0
TIME (50 µs/DIV)
Figure 3.
Figure 4.
Line Transient Response
Line Transient Response
LP5951-3.3
VIN
CIN, COUT = 1.0 µF
IL = 150 mA
(1V/DIV)
2.9
CIN = 1.0 µF
COUT = 1.5 µF
4.9
4.3
IL = 150 mA
ÂVOUT
2.3
TIME (100 µs/DIV)
TIME (100 µs/DIV)
Figure 5.
Figure 6.
Enable Start-up Time
Enable Start-up Time
IL = 150 mA
VEN
(500 mV/DIV)
(1V/DIV)
(500 mV/DIV)
(500 mV/DIV)
IL = 150 mA
LP5951-3.3
VOUT
VEN
LP5951-1.3
VOUT
CIN = 1.0 µF
COUT = 1.5 µF
(2 mV/DIV)
VIN
LP5951-3.3
TIME (50 µs/DIV)
(2 mV/DIV)
(500 mV/DIV)
LOAD CURRENT (mA)
150
LP5951-1.3
ÂVOUT
CIN, COUT = 1.0 µF
(20 mV/DIV)
LP5951-1.3
Load Transient Response
(20 mV/DIV)
ÂVOUT
LOAD CURRENT (mA)
Load Transient Response
TIME (10 µs/DIV)
TIME (10 µs/DIV)
Figure 7.
6
Figure 8.
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Typical Performance Characteristics (continued)
Unless otherwise specified, CIN = 1µF ceramic, COUT = 1µF ceramic, VIN = VOUT(NOM) + 1V, TA = 25°C, Enable pin is tied to VIN.
1.0
Output Voltage Change
vs
Temperature
Ground Current
vs
VIN
40.0
LP5951-1.3
IL = 1 mA
IL = 1 mA
LP5951-1.3
38.0
0.8
TA = 125oC
34.0
32.0
0.4
IGND (PA)
VOUT CHANGE (%)
36.0
0.6
0.2
30.0
TA = 25oC
28.0
26.0
0.0
24.0
22.0
-0.2
TA = -40oC
20.0
-0.4
-40 -20
0
20
40
60
18.0
1.5
80 100 120
2.0
TEMPERATURE (oC)
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VIN (V)
Figure 9.
Figure 10.
Power Supply Rejection Ratio
0
LP5951-3.3
RIPPLE REJECTION (dB)
VIN = 3.8V,
IL = 1 mA
-20
-40
VIN = 5.5V,
IL = 1 mA
-60
-80
10
VIN = 5.5V,
VIN = 3.8V,
IL = 0 mA
IL = 0 mA
100
1k
10k
100k
1M
FREQUENCY (Hz)
Figure 11.
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APPLICATION HINTS
POWER DISSIPATION AND DEVICE OPERATION
The permissible power dissipation for any package is a measure of the capability of the device to pass heat from
the power source, the junctions of the IC, to the ultimate heat sink, the ambient environment. Thus the power
dissipation is dependent on the ambient temperature and the thermal resistance across the various interfaces
between the die and ambient air.
As stated (see below (1)) in the electrical specification section, the allowable power dissipation for the device in a
given package can be calculated using the equation:
PD = (TJ(MAX) - TA) / θJA
(1)
With a θJA = 220°C/W, the device in the SOT-23-5 package returns a value of 454 mW with a maximum junction
temperature of 125°C at TA of 25°C.
The actual power dissipation across the device can be estimated by the following equation:
PD ≈ (VIN - VOUT) * IOUT
(2)
This establishes the relationship between the power dissipation allowed due to thermal consideration, the voltage
drop across the device, and the continuous current capability of the device. These two equations should be used
to determine the optimum operating conditions for the device in the application.
EXTERNAL CAPACITORS
As is common with most regulators, the LP5951 requires external capacitors to ensure stable operation. The
LP5951 is specifically designed for portable applications requiring minimum board space and the smallest size
components. These capacitors must be correctly selected for good performance.
INPUT CAPACITOR
An input capacitor is required for stability. It is recommended that a 1.0µF capacitor be connected between the
LP5951 input pin and ground (this capacitance value may be increased without limit).
This capacitor must be located a distance of not more than 1 cm from the input pin and returned to a clean
analogue ground. Any good quality ceramic, tantalum, or film capacitor may be used at the input.
Important: Tantalum capacitors can suffer catastrophic failures due to surge current when connected to a lowimpedance source of power (like a battery or a very large capacitor). If a tantalum capacitor is used at the input,
it must be guaranteed by the manufacturer to have a surge current rating sufficient for the application.
There are no requirements for the ESR (Equivalent Series Resistance) on the input capacitor, but tolerance and
temperature coefficient must be considered when selecting the capacitor to ensure the capacitance will remain
≥0.7µF over the entire operating temperature range.
OUTPUT CAPACITOR
The LP5951 is designed specifically to work with very small ceramic output capacitors. A ceramic capacitor
(dielectric types X7R, Z5U, or Y5V) in the 1.0µF range (up to 47µF) and with ESR between 3 mΩ to 500 mΩ is
suitable in the LP5951 application circuit.
This capacitor must be located a distance of not more than 1cm from the VOUT pin and returned to a clean
analogue ground.
It is also possible to use tantalum or film capacitors at the device output, VOUT, but these are not as attractive for
reasons of size and cost (see the section CAPACITOR CHARACTERISTICS).
(1)
8
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP =
125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the
part/package in the application (θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).
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CAPACITOR CHARACTERISTICS
The LP5951 is designed to work with ceramic capacitors on the output to take advantage of the benefits they
offer. For capacitance values in the range of 1µF to 4.7µF, ceramic capacitors are the smallest, least expensive
and have the lowest ESR values, thus making them best for eliminating high frequency noise. The ESR of a
typical 1µF ceramic capacitor is in the range of 3mΩ to 40mΩ, which easily meets the ESR requirement for
stability for the LP5951.
For both input and output capacitors, careful interpretation of the capacitor specification is required to ensure
correct device operation. The capacitor value can change greatly, depending on the operating conditions and
capacitor type.
CAP VALUE (% of Nom. 1 PF)
In particular, the output capacitor selection should take account of all the capacitor parameters, to ensure that the
specification is met within the application. The capacitance can vary with DC bias conditions as well as
temperature and frequency of operation. Capacitor values will also show some decrease over time due to aging.
The capacitor parameters are also dependant on the particular case size, with smaller sizes giving poorer
performance figures in general. As an example, Figure 12 shows a typical graph comparing different capacitor
case sizes in a Capacitance vs. DC Bias plot. As shown in the graph, increasing the DC Bias condition can result
in the capacitance value falling below the minimum value given in the recommended capacitor specifications
table (0.7µF in this case). Note that the graph shows the capacitance out of spec for the 0402 case size
capacitor at higher bias voltages. It is therefore recommended that the capacitor manufacturers’ specifications for
the nominal value capacitor are consulted for all conditions, as some capacitor sizes (e.g. 0402) may not be
suitable in the actual application.
0603, 10V, X5R
100%
80%
60%
0402, 6.3V, X5R
40%
20%
0
1.0
2.0
3.0
4.0
5.0
DC BIAS (V)
Figure 12. Graph Showing A Typical Variation In Capacitance vs DC Bias
The ceramic capacitor’s capacitance can vary with temperature. The capacitor type X7R, which operates over a
temperature range of -55°C to +125°C, will only vary the capacitance to within ±15%. The capacitor type X5R
has a similar tolerance over a reduced temperature range of -55°C to +85°C. Many large value ceramic
capacitors, larger than 1µF are manufactured with Z5U or Y5V temperature characteristics. Their capacitance
can drop by more than 50% as the temperature varies from 25°C to 85°C. Therefore X7R is recommended over
Z5U and Y5V in applications where the ambient temperature will change significantly above or below 25°C.
Tantalum capacitors are less desirable than ceramic for use as output capacitors because they are more
expensive when comparing equivalent capacitance and voltage ratings in the 1µF to 4.7µF range.
Another important consideration is that tantalum capacitors have higher ESR values than equivalent size
ceramics. This means that while it may be possible to find a tantalum capacitor with an ESR value within the
stable range, it would have to be larger in capacitance (which means bigger and more costly) than a ceramic
capacitor with the same ESR value. It should also be noted that the ESR of a typical tantalum will increase about
2:1 as the temperature goes from 25°C down to -40°C, so some guard band must be allowed.
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NO-LOAD STABILITY
The LP5951 will remain stable and in regulation with no external load. This is an important consideration in some
circuits, for example CMOS RAM keep-alive applications.
ENABLE OPERATION
The LP5951 may be switched ON or OFF by a logic input at the Enable pin, VEN. A logic high at this pin will turn
the device on. When the enable pin is low, the regulator output is off and the device typically consumes 5nA.
If the application does not require the Enable switching feature, the VEN pin should be tied to VIN to keep the
regulator output permanently on.
To ensure proper operation, the signal source used to drive the VEN input must be able to swing above and
below the specified turn-on/off voltage thresholds listed in the Electrical Characteristics section under Enable
Control Characteristics, VIL and VIH.
FAST TURN OFF AND ON
The controlled switch-off feature of the device provides a fast turn off by discharging the output capacitor via an
internal FET device. This discharge is current limited by the RDSon of this switch.
Fast turn-on is guaranteed by an optimized architecture allowing a very fast ramp of the output voltage to reach
the target voltage.
SHORT-CIRCUIT PROTECTION
The LP5951 is short circuit protected and in the event of a peak over-current condition, the output current
through the PMOS will be limited.
If the over-current condition exists for a longer time, the average power dissipation will increase depending on
the input to output voltage difference until the thermal shutdown circuitry will turn off the PMOS.
Please refer to the Thermal Properties section for power dissipation calculations.
THERMAL-OVERLOAD PROTECTION
Thermal-Overload Protection limits the total power dissipation in the LP5951. When the junction temperature
exceeds TJ = 160°C typ., the shutdown logic is triggered and the PMOS is turned off, allowing the device to cool
down. After the junction temperature dropped by 20°C (temperature hysteresis), the PMOS is activated again.
This results in a pulsed output voltage during continuous thermal-overload conditions.
The Thermal-Overload Protection is designed to protect the LP5951 in the event of a fault condition. For normal,
continuous operation, do not exceed the absolute maximum junction temperature rating of TJ = +150°C (see
Absolute Maximum Ratings).
REVERSE CURRENT PATH
The internal PFET pass device in LP5951 has an inherent parasitic body diode. During normal operation, the
input voltage is higher than the output voltage and the parasitic diode is reverse biased. However, if the output is
pulled above the input in an application, then current flows from the output to the input as the parasitic diode gets
forward biased. The output can be pulled above the input as long as the current in the parasitic diode is limited to
50mA.
For currents above this limit an external Schottky diode must be connected from VOUT to VIN (cathode on VIN,
anode on VOUT).
EVALUATION BOARDS
For availability of evaluation boards, see the LP5951 product folder. For information regarding evaluation boards,
see the TI AN-1486 Application Report (SNVA169).
10
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SUGGESTED CAPACITORS AND THEIR SUPPLIERS
Capacitance / µF
Model
Vendor
Type
Case Size / Inch (mm)
1.0
C1608X5R1A105K
TDK
Ceramic, X5R
0603 (1608)
1.0
C1005X5R1A105K
TDK
Ceramic, X5R
0402 (1005)
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PACKAGE OPTION ADDENDUM
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9-Mar-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LP5951MF-1.3
ACTIVE
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
-40 to 125
LKRB
LP5951MF-1.3/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LKRB
LP5951MF-1.5
ACTIVE
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
-40 to 125
LKAB
LP5951MF-1.5/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LKAB
LP5951MF-1.8
ACTIVE
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
-40 to 125
LKBB
LP5951MF-1.8/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LKBB
LP5951MF-2.0
ACTIVE
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
-40 to 125
LKCB
LP5951MF-2.0/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LKCB
LP5951MF-2.5
ACTIVE
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
-40 to 125
LKEB
LP5951MF-2.5/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LKEB
LP5951MF-2.8
ACTIVE
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
-40 to 125
LKFB
LP5951MF-2.8/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LKFB
LP5951MF-3.0
ACTIVE
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
-40 to 125
LKGB
LP5951MF-3.0/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LKGB
LP5951MF-3.3
ACTIVE
SOT-23
DBV
5
1000
TBD
Call TI
Call TI
-40 to 125
LKHB
LP5951MF-3.3/NOPB
ACTIVE
SOT-23
DBV
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LKHB
LP5951MFX-1.3
ACTIVE
SOT-23
DBV
5
3000
TBD
Call TI
Call TI
-40 to 125
LKRB
LP5951MFX-1.3/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LKRB
LP5951MFX-1.5
ACTIVE
SOT-23
DBV
5
3000
TBD
Call TI
Call TI
-40 to 125
LKAB
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
9-Mar-2013
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LP5951MFX-1.5/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LKAB
LP5951MFX-1.8
ACTIVE
SOT-23
DBV
5
3000
TBD
Call TI
Call TI
-40 to 125
LKBB
LP5951MFX-1.8/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LKBB
LP5951MFX-2.0
ACTIVE
SOT-23
DBV
5
3000
TBD
Call TI
Call TI
-40 to 125
LKCB
LP5951MFX-2.0/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LKCB
LP5951MFX-2.5
ACTIVE
SOT-23
DBV
5
3000
TBD
Call TI
Call TI
-40 to 125
LKEB
LP5951MFX-2.5/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LKEB
LP5951MFX-2.8
ACTIVE
SOT-23
DBV
5
3000
TBD
Call TI
Call TI
-40 to 125
LKFB
LP5951MFX-2.8/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LKFB
LP5951MFX-3.0
ACTIVE
SOT-23
DBV
5
3000
TBD
Call TI
Call TI
-40 to 125
LKGB
LP5951MFX-3.0/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LKGB
LP5951MFX-3.3
ACTIVE
SOT-23
DBV
5
3000
TBD
Call TI
Call TI
-40 to 125
LKHB
LP5951MFX-3.3/NOPB
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LKHB
LP5951MG-1.3
ACTIVE
SC70
DCK
5
1000
TBD
Call TI
Call TI
-40 to 125
L23
LP5951MG-1.3/NOPB
ACTIVE
SC70
DCK
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L23
LP5951MG-1.5
ACTIVE
SC70
DCK
5
1000
TBD
Call TI
Call TI
-40 to 125
L2B
LP5951MG-1.5/NOPB
ACTIVE
SC70
DCK
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L2B
LP5951MG-1.8
ACTIVE
SC70
DCK
5
1000
TBD
Call TI
Call TI
L3B
LP5951MG-1.8/NOPB
ACTIVE
SC70
DCK
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
L3B
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
9-Mar-2013
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LP5951MG-2.0
ACTIVE
SC70
DCK
5
1000
TBD
Call TI
Call TI
L4B
LP5951MG-2.0/NOPB
ACTIVE
SC70
DCK
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
L4B
LP5951MG-2.5
ACTIVE
SC70
DCK
5
1000
TBD
Call TI
Call TI
L5B
LP5951MG-2.5/NOPB
ACTIVE
SC70
DCK
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
L5B
LP5951MG-2.8
ACTIVE
SC70
DCK
5
1000
TBD
Call TI
Call TI
L6B
LP5951MG-2.8/NOPB
ACTIVE
SC70
DCK
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
L6B
LP5951MG-3.0
ACTIVE
SC70
DCK
5
1000
TBD
Call TI
Call TI
L7B
LP5951MG-3.0/NOPB
ACTIVE
SC70
DCK
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
L7B
LP5951MG-3.3
ACTIVE
SC70
DCK
5
1000
TBD
Call TI
Call TI
LAB
LP5951MG-3.3/NOPB
ACTIVE
SC70
DCK
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
LAB
LP5951MG-3.7/NOPB
ACTIVE
SC70
DCK
5
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
L44
LP5951MGX-1.3
ACTIVE
SC70
DCK
5
3000
TBD
Call TI
Call TI
-40 to 125
L23
LP5951MGX-1.3/NOPB
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L23
LP5951MGX-1.5
ACTIVE
SC70
DCK
5
3000
TBD
Call TI
Call TI
-40 to 125
L2B
LP5951MGX-1.5/NOPB
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L2B
LP5951MGX-1.8
ACTIVE
SC70
DCK
5
3000
TBD
Call TI
Call TI
L3B
LP5951MGX-1.8/NOPB
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
L3B
LP5951MGX-2.0
ACTIVE
SC70
DCK
5
3000
TBD
Call TI
Call TI
L4B
LP5951MGX-2.0/NOPB
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
L4B
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
9-Mar-2013
Status
(1)
Package Type Package Pins Package Qty
Drawing
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LP5951MGX-2.5
ACTIVE
SC70
DCK
5
3000
TBD
Call TI
Call TI
L5B
LP5951MGX-2.5/NOPB
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
L5B
LP5951MGX-2.8
ACTIVE
SC70
DCK
5
3000
TBD
Call TI
Call TI
L6B
LP5951MGX-2.8/NOPB
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
L6B
LP5951MGX-3.0
ACTIVE
SC70
DCK
5
3000
TBD
Call TI
Call TI
L7B
LP5951MGX-3.0/NOPB
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
L7B
LP5951MGX-3.3
ACTIVE
SC70
DCK
5
3000
TBD
Call TI
Call TI
LAB
LP5951MGX-3.3/NOPB
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
LAB
LP5951MGX-3.7/NOPB
ACTIVE
SC70
DCK
5
3000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
L44
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Only one of markings shown within the brackets will appear on the physical device.
Addendum-Page 4
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
9-Mar-2013
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 5
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Nov-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
LP5951MF-1.3
SOT-23
DBV
5
1000
178.0
8.4
LP5951MF-1.3/NOPB
SOT-23
DBV
5
1000
178.0
LP5951MF-1.5
SOT-23
DBV
5
1000
178.0
LP5951MF-1.5/NOPB
SOT-23
DBV
5
1000
LP5951MF-1.8
SOT-23
DBV
5
LP5951MF-1.8/NOPB
SOT-23
DBV
LP5951MF-2.0
SOT-23
DBV
LP5951MF-2.0/NOPB
SOT-23
W
Pin1
(mm) Quadrant
3.2
3.2
1.4
4.0
8.0
Q3
8.4
3.2
3.2
1.4
4.0
8.0
Q3
8.4
3.2
3.2
1.4
4.0
8.0
Q3
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
DBV
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MF-2.5
SOT-23
DBV
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MF-2.5/NOPB
SOT-23
DBV
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MF-2.8
SOT-23
DBV
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MF-2.8/NOPB
SOT-23
DBV
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MF-3.0
SOT-23
DBV
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MF-3.0/NOPB
SOT-23
DBV
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MF-3.3
SOT-23
DBV
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MF-3.3/NOPB
SOT-23
DBV
5
1000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MFX-1.3
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MFX-1.3/NOPB
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Nov-2012
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LP5951MFX-1.5
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MFX-1.5/NOPB
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MFX-1.8
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MFX-1.8/NOPB
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MFX-2.0
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MFX-2.0/NOPB
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MFX-2.5
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MFX-2.5/NOPB
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MFX-2.8
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MFX-2.8/NOPB
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MFX-3.0
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MFX-3.0/NOPB
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MFX-3.3
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MFX-3.3/NOPB
SOT-23
DBV
5
3000
178.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
LP5951MG-1.3
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MG-1.3/NOPB
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MG-1.5
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MG-1.5/NOPB
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MG-1.8
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MG-1.8/NOPB
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MG-2.0
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MG-2.0/NOPB
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MG-2.5
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MG-2.5/NOPB
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MG-2.8
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MG-2.8/NOPB
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MG-3.0
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MG-3.0/NOPB
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MG-3.3
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MG-3.3/NOPB
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MG-3.7/NOPB
SC70
DCK
5
1000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MGX-1.3
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MGX-1.3/NOPB
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MGX-1.5
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MGX-1.5/NOPB
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MGX-1.8
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MGX-1.8/NOPB
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MGX-2.0
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MGX-2.0/NOPB
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MGX-2.5
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MGX-2.5/NOPB
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MGX-2.8
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MGX-2.8/NOPB
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Nov-2012
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LP5951MGX-3.0
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MGX-3.0/NOPB
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MGX-3.3
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MGX-3.3/NOPB
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
LP5951MGX-3.7/NOPB
SC70
DCK
5
3000
178.0
8.4
2.25
2.45
1.2
4.0
8.0
Q3
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LP5951MF-1.3
SOT-23
DBV
5
1000
203.0
190.0
41.0
LP5951MF-1.3/NOPB
SOT-23
DBV
5
1000
203.0
190.0
41.0
LP5951MF-1.5
SOT-23
DBV
5
1000
203.0
190.0
41.0
LP5951MF-1.5/NOPB
SOT-23
DBV
5
1000
203.0
190.0
41.0
LP5951MF-1.8
SOT-23
DBV
5
1000
203.0
190.0
41.0
LP5951MF-1.8/NOPB
SOT-23
DBV
5
1000
203.0
190.0
41.0
LP5951MF-2.0
SOT-23
DBV
5
1000
203.0
190.0
41.0
LP5951MF-2.0/NOPB
SOT-23
DBV
5
1000
203.0
190.0
41.0
LP5951MF-2.5
SOT-23
DBV
5
1000
203.0
190.0
41.0
LP5951MF-2.5/NOPB
SOT-23
DBV
5
1000
203.0
190.0
41.0
LP5951MF-2.8
SOT-23
DBV
5
1000
203.0
190.0
41.0
LP5951MF-2.8/NOPB
SOT-23
DBV
5
1000
203.0
190.0
41.0
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Nov-2012
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LP5951MF-3.0
SOT-23
DBV
5
1000
203.0
190.0
41.0
LP5951MF-3.0/NOPB
SOT-23
DBV
5
1000
203.0
190.0
41.0
LP5951MF-3.3
SOT-23
DBV
5
1000
203.0
190.0
41.0
LP5951MF-3.3/NOPB
SOT-23
DBV
5
1000
203.0
190.0
41.0
LP5951MFX-1.3
SOT-23
DBV
5
3000
206.0
191.0
90.0
LP5951MFX-1.3/NOPB
SOT-23
DBV
5
3000
206.0
191.0
90.0
LP5951MFX-1.5
SOT-23
DBV
5
3000
206.0
191.0
90.0
LP5951MFX-1.5/NOPB
SOT-23
DBV
5
3000
206.0
191.0
90.0
LP5951MFX-1.8
SOT-23
DBV
5
3000
206.0
191.0
90.0
LP5951MFX-1.8/NOPB
SOT-23
DBV
5
3000
206.0
191.0
90.0
LP5951MFX-2.0
SOT-23
DBV
5
3000
206.0
191.0
90.0
LP5951MFX-2.0/NOPB
SOT-23
DBV
5
3000
206.0
191.0
90.0
LP5951MFX-2.5
SOT-23
DBV
5
3000
206.0
191.0
90.0
LP5951MFX-2.5/NOPB
SOT-23
DBV
5
3000
206.0
191.0
90.0
LP5951MFX-2.8
SOT-23
DBV
5
3000
206.0
191.0
90.0
LP5951MFX-2.8/NOPB
SOT-23
DBV
5
3000
206.0
191.0
90.0
LP5951MFX-3.0
SOT-23
DBV
5
3000
206.0
191.0
90.0
LP5951MFX-3.0/NOPB
SOT-23
DBV
5
3000
206.0
191.0
90.0
LP5951MFX-3.3
SOT-23
DBV
5
3000
206.0
191.0
90.0
LP5951MFX-3.3/NOPB
SOT-23
DBV
5
3000
206.0
191.0
90.0
LP5951MG-1.3
SC70
DCK
5
1000
203.0
190.0
41.0
LP5951MG-1.3/NOPB
SC70
DCK
5
1000
203.0
190.0
41.0
LP5951MG-1.5
SC70
DCK
5
1000
203.0
190.0
41.0
LP5951MG-1.5/NOPB
SC70
DCK
5
1000
203.0
190.0
41.0
LP5951MG-1.8
SC70
DCK
5
1000
203.0
190.0
41.0
LP5951MG-1.8/NOPB
SC70
DCK
5
1000
203.0
190.0
41.0
LP5951MG-2.0
SC70
DCK
5
1000
203.0
190.0
41.0
LP5951MG-2.0/NOPB
SC70
DCK
5
1000
203.0
190.0
41.0
LP5951MG-2.5
SC70
DCK
5
1000
203.0
190.0
41.0
LP5951MG-2.5/NOPB
SC70
DCK
5
1000
203.0
190.0
41.0
LP5951MG-2.8
SC70
DCK
5
1000
203.0
190.0
41.0
LP5951MG-2.8/NOPB
SC70
DCK
5
1000
203.0
190.0
41.0
LP5951MG-3.0
SC70
DCK
5
1000
203.0
190.0
41.0
LP5951MG-3.0/NOPB
SC70
DCK
5
1000
203.0
190.0
41.0
LP5951MG-3.3
SC70
DCK
5
1000
203.0
190.0
41.0
LP5951MG-3.3/NOPB
SC70
DCK
5
1000
203.0
190.0
41.0
LP5951MG-3.7/NOPB
SC70
DCK
5
1000
203.0
190.0
41.0
LP5951MGX-1.3
SC70
DCK
5
3000
206.0
191.0
90.0
LP5951MGX-1.3/NOPB
SC70
DCK
5
3000
206.0
191.0
90.0
LP5951MGX-1.5
SC70
DCK
5
3000
206.0
191.0
90.0
LP5951MGX-1.5/NOPB
SC70
DCK
5
3000
206.0
191.0
90.0
LP5951MGX-1.8
SC70
DCK
5
3000
206.0
191.0
90.0
LP5951MGX-1.8/NOPB
SC70
DCK
5
3000
206.0
191.0
90.0
LP5951MGX-2.0
SC70
DCK
5
3000
206.0
191.0
90.0
Pack Materials-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Nov-2012
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LP5951MGX-2.0/NOPB
SC70
DCK
5
3000
206.0
191.0
90.0
LP5951MGX-2.5
SC70
DCK
5
3000
206.0
191.0
90.0
LP5951MGX-2.5/NOPB
SC70
DCK
5
3000
206.0
191.0
90.0
LP5951MGX-2.8
SC70
DCK
5
3000
206.0
191.0
90.0
LP5951MGX-2.8/NOPB
SC70
DCK
5
3000
206.0
191.0
90.0
LP5951MGX-3.0
SC70
DCK
5
3000
206.0
191.0
90.0
LP5951MGX-3.0/NOPB
SC70
DCK
5
3000
206.0
191.0
90.0
LP5951MGX-3.3
SC70
DCK
5
3000
206.0
191.0
90.0
LP5951MGX-3.3/NOPB
SC70
DCK
5
3000
206.0
191.0
90.0
LP5951MGX-3.7/NOPB
SC70
DCK
5
3000
206.0
191.0
90.0
Pack Materials-Page 5
IMPORTANT NOTICE
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changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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www.ti.com/audio
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amplifier.ti.com
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Click to View Pricing, Inventory, Delivery & Lifecycle Information:
Texas Instruments:
LP5951MF-1.3 LP5951MF-1.5 LP5951MF-1.8 LP5951MF-1.8EV LP5951MF-2.0 LP5951MF-2.5 LP5951MF-2.5EV
LP5951MF-2.8 LP5951MFX-1.3 LP5951MFX-1.5 LP5951MFX-1.8 LP5951MFX-2.0 LP5951MFX-2.5 LP5951MFX2.8 LP5951MFX-3.0 LP5951MFX-3.3 LP5951MG-1.3 LP5951MG-1.8 LP5951MG-2.0 LP5951MG-2.5 LP5951MG2.8 LP5951MG-3.0 LP5951MG-3.3 LP5951MGX-1.3 LP5951MGX-1.5 LP5951MGX-1.8 LP5951MGX-2.0
LP5951MGX-2.5 LP5951MGX-2.8 LP5951MGX-3.0 LP5951MGX-3.3