Microchip C1412CUA713 2a high-speed mosfet driver Datasheet

M
TC1412/TC1412N
2A High-Speed MOSFET Drivers
Features
General Description
• Latch-Up Protected: Will Withstand 500 mA
Reverse Current
• Input Will Withstand Negative Inputs Up to 5V
• ESD Protected: 4 kV
• High Peak Output Current: 2A
• Wide Input Supply Voltage Operating Range:
- 4.5V to 16V
• High Capacitive Load Drive Capability:
- 1000 pF in 18 nsec
• Short Delay Time: 35 nsec Typ.
• Matched Delay Times
• Low Supply Current:
- With Logic ‘1’ Input: 500 µA
- With Logic ‘0’ Input: 100 µA
• Low Output Impedance: 4Ω
• Available in Space-Saving 8-pin MSOP Package
• Pinout Same as TC1410/TC1411/TC1413
The TC1412/TC1412N are 2A CMOS buffers/drivers.
They will not latch-up under any conditions within their
power and voltage ratings. They are not subject to
damage when up to 5V of noise spiking of either
polarity occurs on the ground pin. They can accept,
without damage or logic upset, up to 500 mA of current
of either polarity being forced back into their output. All
terminals are fully protected against up to 4 kV of
electrostatic discharge.
As MOSFET drivers, the TC1412/TC1412N can easily
charge a 1000 pF gate capacitance in 18 nsec with
matched rise and fall times, and provide low enough
impedance in both the ON and the OFF states to
ensure the MOSFET’s intended state will not be
affected, even by large transients. The leading and
trailing edge propagation delay times are also matched
to allow driving short-duration inputs with greater
accuracy.
Applications
•
•
•
•
Switch Mode Power Supplies
Pulse Transformer Drive
Line Drivers
Relay Driver
Package Type
8-Pin MSOP/PDIP/SOIC
VDD 1
8 VDD
IN 2
OUT
TC1412 7
NC 3
GND 4
2
VDD 1
IN 2
6 OUT
NC 3
5 GND
GND 4
6,7
Inverting
8 VDD
TC1412N
7 OUT
6 OUT
5 GND
2
6,7
Non-Inverting
NC = No Internal Connection
NOTE: Duplicate pins must be connected together
for proper operation.
 2003 Microchip Technology Inc.
DS21391C-page 1
TC1412/TC1412N
Functional Block Diagram
TC1412
VDD
Inverting
Outputs
300 mV
Output
Non-Inverting
Outputs
Input
Effective
Input C = 10 pF
4.7V
TC1412N
GND
DS21391C-page 2
 2003 Microchip Technology Inc.
TC1412/TC1412N
1.0
ELECTRICAL
CHARACTERISTICS
PIN FUNCTION TABLE
Symbol
Absolute Maximum Ratings †
Description
VDD
Supply input, 4.5V to 16V
Control input
INPUT
Supply Voltage ..................................................... +20V
Input Voltage ...................... VDD + 0.3V to GND – 5.0V
Power Dissipation (TA ≤ 70°C)
MSOP .......................................................... 340 mW
PDIP ............................................................ 730 mW
SOIC............................................................ 470 mW
Storage Temperature Range.............. -65°C to +150°C
Maximum Junction Temperature ...................... +150ºC
NC
No connection
GND
Ground
GND
Ground
OUTPUT
CMOS push-pull output,
common to pin 7
OUTPUT
CMOS push-pull output,
common to pin 6
† Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
Supply input, 4.5V to 16V
VDD
DC ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 16V.
Typical values are measured at TA = +25°C, VDD = 16V.
Parameters
Sym
Min
Typ
Max
Units
Logic ‘1’, High Input Voltage
VIH
2.0
—
—
V
Logic ‘0’, Low Input Voltage
VIL
—
—
0.8
V
Input Current
IIN
-1.0
—
1.0
µA
-10
—
10
Conditions
Input
0V ≤ VIN ≤ VDD, TA = +25°C
-40°C ≤ TA ≤ +85°C
Output
High Output Voltage
VOH
VDD – 0.025
—
—
Low Output Voltage
VOL
—
—
Output Resistance
RO
—
4
—
5
7
V
DC Test
0.025
V
DC Test
6
Ω
VDD = 16V, IO = 10 mA, TA = +25°C
0°C ≤ TA ≤ +70°C
-40°C ≤ TA ≤ +85°C
—
5
7
2.0
—
A
VDD = 16V
Duty cycle ≤ 2%, t ≤ 300 µsec,
VDD = 16V
Peak Output Current
IPK
—
Latch-Up Protection
Withstand Reverse Current
IREV
—
0.5
—
A
tR
—
18
26
nsec
—
20
31
Switching Time (Note 1)
Rise Time
Fall Time
tF
TA = +25°C
0°C ≤ TA ≤ +70°C
-40°C ≤ TA ≤ +85°C, Figure 4-1
—
22
31
—
18
26
—
20
31
0°C ≤ TA ≤ +70°C
—
22
31
-40°C ≤ TA ≤ +85°C, Figure 4-1
nsec
TA = +25°C
Note 1: Switching times ensured by design.
 2003 Microchip Technology Inc.
DS21391C-page 3
TC1412/TC1412N
DC ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 16V.
Typical values are measured at TA = +25°C, VDD = 16V.
Parameters
Delay Time
Delay Time
Sym
Min
Typ
Max
Units
tD1
—
35
45
nsec
—
40
50
0°C ≤ TA ≤ +70°C
—
40
50
—
35
45
-40°C ≤ TA ≤ +85°C, Figure 4-1
TA = +25°C
—
40
50
—
40
50
—
0.5
1.0
—
0.1
0.15
tD2
nsec
Conditions
TA = +25°C,
0°C ≤ TA ≤ +70°C
-40°C ≤ TA ≤ +85°C, Figure 4-1
Power Supply
Power Supply Current
IS
mA
VIN = 3V, VDD = 16V
VIN = 0V
Note 1: Switching times ensured by design.
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 18V.
Parameters
Sym
Min
Typ
Max
Units
Specified Temperature Range (C)
TA
0
—
+70
ºC
Specified Temperature Range (E)
TA
-40
—
+85
ºC
Maximum Junction Temperature
TJ
—
—
+150
ºC
Storage Temperature Range
TA
-65
—
+150
ºC
Thermal Resistance, 8L-MSOP
θJA
—
206
—
ºC/W
Thermal Resistance, 8L-PDIP
θJA
—
125
—
ºC/W
Thermal Resistance, 8L-SOIC
θJA
—
155
—
ºC/W
Conditions
Temperature Ranges
Package Thermal Resistances
DS21391C-page 4
 2003 Microchip Technology Inc.
TC1412/TC1412N
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V.
500
500
TA = +25°C
400
VIN = 3V
ISUPPLY (µA)
ISUPPLY (µA)
400
300
200
100
0
VSUPPLY = 16V
VIN = 3V
6
8
10
12
14
200
100
VIN = 0V
4
300
0
16
VIN = 0V
-40
-20
VDD (V)
FIGURE 2-1:
Quiescent Supply Current
vs. Supply Voltage.
FIGURE 2-4:
vs. Temperature.
1.6
1.6
TA = +25°C
20
40
60
80
Quiescent Supply Current
VSUPPLY = 16V
1.5
VIH
VTHRESHOLD (V)
VTHRESHOLD (V)
1.5
1.4
1.3
1.2
4
6
VIH
1.4
1.3
VIL
1.2
VIL
1.1
8
10
12
14
16
1.1
-40
-20
FIGURE 2-2:
Voltage.
Input Threshold vs. Supply
FIGURE 2-5:
Temperature.
13
13
11
11
RDS-ON (Ohms)
TA = +85°C
9
TA = +25°C
7
5
TA = -40°C
3
0
20
40
60
80
TEMPERATURE (°C)
VDD (V)
RDS-ON (Ohms)
0
TEMPERATURE (°C)
Input Threshold vs.
TA = +85°C
9
7
TA = +25°C
5
3
TA = -40°C
1
1
4
6
8
10
VDD (V)
12
14
FIGURE 2-3:
High-State Output
Resistance vs. Supply Voltage.
 2003 Microchip Technology Inc.
16
4
6
8
10
VDD (V)
12
14
16
FIGURE 2-6:
Low-State Output
Resistance vs. Supply Voltage.
DS21391C-page 5
TC1412/TC1412N
Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 16V.
70
CLOAD = 1000 pF
60
60
50
50
40
tFALL (nsec)
tRISE (nsec)
70
TA = +85°C
30
TA = +25°C
CLOAD = 1000 pF
40
TA = +85°C
30
TA = +25°C
20
20
TA = -40°C
10
4
6
TA = -40°C
8
10
12
14
10
16
4
6
8
10
VDD (V)
FIGURE 2-7:
Voltage.
100
Rise Time vs. Supply
FIGURE 2-10:
Voltage.
100
CLOAD = 1000 pF
70
60
tD2 (nsec)
tD1 (nsec)
TA = +85°C
TA = +25°C
50
Fall Time vs. Supply
CLOAD = 1000 pF
TA = +85°C
70
60
TA = +25°C
50
40
40
TA = -40°C
30
4
6
8
30
10
12
14
TA = -40°C
20
16
4
6
8
10
VDD (V)
FIGURE 2-8:
Supply Voltage.
12
14
16
VDD (V)
Propagation Delay vs.
FIGURE 2-11:
Supply Voltage.
Propagation Delay vs.
39
TA = +25°C
VDD = 16V
50
tRISE
40
tFALL
30
20
10
Propagation Delays (nsec)
60
tRISE, tFALL (nsec)
16
80
80
0
14
90
90
20
12
VDD (V)
TA = +25°C
VDD = 16V
38
tD2
37
36
tD1
35
34
33
32
0
1000
2000
3000
4000
5000
0
1000
CLOAD (pF)
FIGURE 2-9:
Capacitive Load.
DS21391C-page 6
Rise and Fall Times vs.
2000
3000
4000
5000
CLOAD (pF)
FIGURE 2-12:
Capacitive Load.
Propagation Delays vs.
 2003 Microchip Technology Inc.
TC1412/TC1412N
3.0
PIN DESCRIPTIONS
3.3
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
Pin
No.
Symbol
1
VDD
2
INPUT
PIN FUNCTION TABLE
Description
Supply input, 4.5V to 16V
Control input
3
NC
4
GND
No connection
Ground
5
GND
Ground
6
OUTPUT CMOS push-pull output,
common to pin 7
7
OUTPUT CMOS push-pull output,
common to pin 6
8
3.1
VDD
CMOS Push-Pull Output
(OUTPUT)
The MOSFET driver output is a low-impedance, CMOS
push-pull style output, capable of driving a capacitive
load with 2A peak currents.
3.4
Ground (GND)
The ground pins are the return path for the bias current
and for the high peak currents that discharge the load
capacitor. The ground pins should be tied into a ground
plane or have very short traces to the bias supply
source return.
3.5
No Connect (NC)
No internal connection.
Supply input, 4.5V to 16V
Supply Input (VDD)
The VDD input is the bias supply for the MOSFET driver
and is rated for 4.5V to 16V with respect to the ground
pin. The VDD input should be bypassed to ground with
a local ceramic capacitor. The value of the capacitor
should be chosen based on the capacitive load that is
being driven. A value of 1.0 µF is suggested.
3.2
Control Input (INPUT)
The MOSFET driver input is a high-impedance,
TTL/CMOS-compatible input. The input has 300 mV of
hysteresis between the high and low thresholds which
prevents output glitching even when the rise and fall
time of the input signal is very slow.
 2003 Microchip Technology Inc.
DS21391C-page 7
TC1412/TC1412N
4.0
APPLICATION INFORMATION
+5V
90%
Input
VDD = 16V
0V
1.0 µF
0.1 µF
1, 8
Input
10%
tD1
tD2
tF
VDD
tR
90%
90%
Output
2
6, 7
Output
10%
10%
0V
CL = 1000 pF
Inverting Driver
TC1412
TC1412N
TC1412
+5V
90%
Input
4, 5
Input: 100 kHz,
square wave,
tRISE = tFALL ≤ 10 nsec
0V
VDD
10%
tD1 90%
tR
Output
0V
10%
90%
tD2
tF
10%
Non-Inverting Driver
TC1412N
FIGURE 4-1:
DS21391C-page 8
Switching Time Test Circuit.
 2003 Microchip Technology Inc.
TC1412/TC1412N
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
8-Lead PDIP (300 mil)
XXXXXXXX
XXXXXNNN
YYWW
8-Lead SOIC (150 mil)
XXXXXXXX
XXXXYYWW
Example:
1412NE
347057
XXXXXXX
YWWNNN
Note:
*
Example:
057
8-Lead MSOP
XX...X
YY
WW
NNN
TC1412
CPA057
0347
TC1412
COA0347
NNN
Legend:
Example:
Customer specific information*
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line thus limiting the number of available characters
for customer specific information.
Standard marking consists of Microchip part number, year code, week code, traceability code (facility
code, mask rev#, and assembly code). For marking beyond this, certain price adders apply. Please
check with your Microchip Sales Office.
 2003 Microchip Technology Inc.
DS21391C-page 9
TC1412/TC1412N
8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)
E1
D
2
n
1
α
E
A2
A
L
c
A1
β
B1
p
eB
B
Units
Dimension Limits
n
p
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
L
c
§
B1
B
eB
α
β
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
MAX
8
.100
.155
.130
.170
.145
.313
.250
.373
.130
.012
.058
.018
.370
10
10
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MILLIMETERS
NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5
10
5
10
MIN
MAX
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
DS21391C-page 10
 2003 Microchip Technology Inc.
TC1412/TC1412N
8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
h
α
45°
c
A2
A
φ
β
L
Units
Dimension Limits
n
p
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer Distance
Foot Length
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
A
A2
A1
E
E1
D
h
L
φ
c
B
α
β
MIN
.053
.052
.004
.228
.146
.189
.010
.019
0
.008
.013
0
0
A1
INCHES*
NOM
8
.050
.061
.056
.007
.237
.154
.193
.015
.025
4
.009
.017
12
12
MAX
.069
.061
.010
.244
.157
.197
.020
.030
8
.010
.020
15
15
MILLIMETERS
NOM
8
1.27
1.35
1.55
1.32
1.42
0.10
0.18
5.79
6.02
3.71
3.91
4.80
4.90
0.25
0.38
0.48
0.62
0
4
0.20
0.23
0.33
0.42
0
12
0
12
MIN
MAX
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
0.25
0.51
15
15
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
 2003 Microchip Technology Inc.
DS21391C-page 11
TC1412/TC1412N
8-Lead Plastic Micro Small Outline Package (UA) (MSOP)
E
E1
p
D
2
B
n
1
A2
A
c
A1
(F )
L
Units
Dimens ion Limits
n
p
MIN
INC HE S
NOM
MAX
MILLIME T E R S *
NOM
8
0.65 B S C
0.75
0.85
0.00
4.90 B S C
3.00 B S C
3.00 B S C
0.40
0.60
0.95 R E F
0˚
0.08
0.22
5˚
5˚
-
MIN
Number of P ins
8
P itch
.026 B S C
Overall Height
A
.043
.030
.033
.037
Molded P ackage T hicknes s
A2
.000
.006
S tandoff
A1
Overall Width
.193 B S C
E
Molded P ackage Width
E1
.118 B S C
Overall Length
.118 B S C
D
.016
.024
.031
F oot Length
L
F ootprint (R eference)
F
.037 R E F
F oot Angle
0˚
8˚
c
Lead T hicknes s
.003
.006
.009
B
Lead Width
.009
.012
.016
Mold Draft Angle T op
5˚
15˚
Mold Draft Angle B ottom
5˚
15˚
*C ontrolling P arameter
Notes :
Dimens ions D and E 1 do not include mold flas h or protrus ions . Mold flas h or protrus ions s hall not
exceed .010" (0.254mm) per s ide.
MAX
1.10
0.95
0.15
0.80
8˚
0.23
0.40
15˚
15˚
J E DE C E quivalent: MO-187
Drawing No. C 04-111
DS21391C-page 12
 2003 Microchip Technology Inc.
TC1412/TC1412N
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
X
/XX
Temperature
Range
Package
Device:
TC1412: 2 A Single MOSFET Driver, Inverting
TC1412N: 2 A Single MOSFET Driver, Non-Inverting
Temperature Range:
C
E
Package:
=
=
0°C to +70°C
-40°C to +85°C
OA
= Plastic SOIC, (150 mil Body), 8-lead
OA713 = Plastic SOIC, (150 mil Body), 8-lead
(Tape and Reel)
UA
= Plastic Micro Small Outline (MSOP), 8-lead *
UA713 = Plastic Micro Small Outline (MSOP), 8-lead *
(Tape and Reel)
PA
= Plastic DIP (300 mil Body), 8-lead
Examples:
a)
b)
c)
a)
b)
c)
TC1412COA: 2A Single MOSFET driver,
SOIC package, 0°C to +70°C.
TC1412CPA: 2A Single MOSFET driver,
PDIP package, 0°C to +70°C.
TC1412EUA713: Tape and Reel, 2A
Single MOSFET driver, MSOP package,
-40°C to +85°C.
TC1412NCPA: 2A Single MOSFET
driver, PDIP package, 0°C to +70°C.
TC1412NEPA: 2A Single MOSFET
driver, PDIP package, -40°C to +85°C.
TC1412NEUA: 2A Single MOSFET
driver, MSOP package, -40°C to +85°C.
* MSOP package is only available in E-Temp.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
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Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
 2003 Microchip Technology Inc.
DS21391C-page 13
TC1412/TC1412N
NOTES:
DS21391C-page 14
 2003 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.
Trademarks
The Microchip name and logo, the Microchip logo, KEELOQ,
MPLAB, PIC, PICmicro, PICSTART, PRO MATE and
PowerSmart are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Accuron, Application Maestro, dsPIC, dsPICDEM,
dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM,
fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC,
microPort, Migratable Memory, MPASM, MPLIB, MPLINK,
MPSIM, PICC, PICkit, PICDEM, PICDEM.net, PowerCal,
PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC, Select
Mode, SmartSensor, SmartShunt, SmartTel and Total
Endurance are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2003, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro® 8-bit MCUs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systems is ISO 9001 certified.
 2003 Microchip Technology Inc.
DS21391C-page 15
M
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
Corporate Office
Australia
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200 Fax: 480-792-7277
Technical Support: 480-792-7627
Web Address: http://www.microchip.com
Microchip Technology Australia Pty Ltd
Marketing Support Division
Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
Atlanta
3780 Mansell Road, Suite 130
Alpharetta, GA 30022
Tel: 770-640-0034 Fax: 770-640-0307
China - Beijing
2 Lan Drive, Suite 120
Westford, MA 01886
Tel: 978-692-3848 Fax: 978-692-3821
Microchip Technology Consulting (Shanghai)
Co., Ltd., Beijing Liaison Office
Unit 915
Bei Hai Wan Tai Bldg.
No. 6 Chaoyangmen Beidajie
Beijing, 100027, No. China
Tel: 86-10-85282100 Fax: 86-10-85282104
Chicago
China - Chengdu
333 Pierce Road, Suite 180
Itasca, IL 60143
Tel: 630-285-0071 Fax: 630-285-0075
Microchip Technology Consulting (Shanghai)
Co., Ltd., Chengdu Liaison Office
Rm. 2401-2402, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: 86-28-86766200 Fax: 86-28-86766599
Boston
Dallas
4570 Westgrove Drive, Suite 160
Addison, TX 75001
Tel: 972-818-7423 Fax: 972-818-2924
Detroit
Tri-Atria Office Building
32255 Northwestern Highway, Suite 190
Farmington Hills, MI 48334
Tel: 248-538-2250 Fax: 248-538-2260
Kokomo
2767 S. Albright Road
Kokomo, IN 46902
Tel: 765-864-8360 Fax: 765-864-8387
Los Angeles
18201 Von Karman, Suite 1090
Irvine, CA 92612
Tel: 949-263-1888 Fax: 949-263-1338
Phoenix
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7966 Fax: 480-792-4338
San Jose
Microchip Technology Inc.
2107 North First Street, Suite 590
San Jose, CA 95131
Tel: 408-436-7950 Fax: 408-436-7955
Toronto
6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Canada
Tel: 905-673-0699 Fax: 905-673-6509
China - Fuzhou
Microchip Technology Consulting (Shanghai)
Co., Ltd., Fuzhou Liaison Office
Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: 86-591-7503506 Fax: 86-591-7503521
China - Hong Kong SAR
Microchip Technology Hongkong Ltd.
Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: 852-2401-1200 Fax: 852-2401-3431
China - Shanghai
Microchip Technology Consulting (Shanghai)
Co., Ltd.
Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
China - Shenzhen
Microchip Technology Consulting (Shanghai)
Co., Ltd., Shenzhen Liaison Office
Rm. 1812, 18/F, Building A, United Plaza
No. 5022 Binhe Road, Futian District
Shenzhen 518033, China
Tel: 86-755-82901380 Fax: 86-755-82966626
China - Qingdao
Rm. B505A, Fullhope Plaza,
No. 12 Hong Kong Central Rd.
Qingdao 266071, China
Tel: 86-532-5027355 Fax: 86-532-5027205
India
Microchip Technology Inc.
India Liaison Office
Marketing Support Division
Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
Japan
Microchip Technology Japan K.K.
Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Korea
Microchip Technology Korea
168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd.
200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Microchip Technology (Barbados) Inc.,
Taiwan Branch
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Austria
Microchip Technology Austria GmbH
Durisolstrasse 2
A-4600 Wels
Austria
Tel: 43-7242-2244-399
Fax: 43-7242-2244-393
Denmark
Microchip Technology Nordic ApS
Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: 45-4420-9895 Fax: 45-4420-9910
France
Microchip Technology SARL
Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH
Steinheilstrasse 10
D-85737 Ismaning, Germany
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy
Microchip Technology SRL
Via Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
Tel: 39-0331-742611 Fax: 39-0331-466781
United Kingdom
Microchip Ltd.
505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshire, England RG41 5TU
Tel: 44-118-921-5869 Fax: 44-118-921-5820
03/25/03
DS21391C-page 16
 2003 Microchip Technology Inc.