AVAGO AMMC-6241 26â 43 ghz low noise amplifier Datasheet

AMMC-6241
26–43 GHz Low Noise Amplifier
Data Sheet
Chip Size: 1900 x 800 mm (74.8 x 31.5 mils)
Chip Size Tolerance: ± 10 mm (± 0.4 mils)
Chip Thickness: 100 ± 10 mm (4 ± 0.4 mils)
RF Pad Dimensions: 110 x 90 mm (4.3 x 3.5 mils)
DC Pad Dimensions: 100 x 100 mm (3.9 x 3.9 mils)
Description
Features
Avago Technologies AMMC-6241 is a high gain, low-noise
amplifier that operates from 26 GHz to 43 GHz. This LNA
provides a wide-band solution for system design since
it covers several bands, thus, reduces part inventory.
The device has input / output match to 50 Ohm, is unconditionally stable and can be used as either primary
or sub-sequential low noise gain stage. By eliminating
the complex tuning and assembly processes typically
required by hybrid (discrete-FET) amplifiers, the AMMC6241 is a cost-effective alternative in the 26 - 43 GHz communications receivers. The backside of the chip is both RF
and DC ground. This helps simplify the assembly process
and reduces assembly related performance variations
and costs. It is fabricated in a PHEMT process to provide
exceptional noise and gain performance. For improved
reliability and moisture protection, the die is passivated
at the active areas.
• Wide frequency range: 26 - 43 GHz
• High gain: 20 dB
• Low 50 Ω Noise Figure: 2.7 dB
• 50 Ω Input and Output Match
• Flat Gain Response
• Single 3V Supply Bias
Applications
• Microwave Radio systems
• Satellite VSAT, DBS Up/Down Link
• LMDS & Pt-Pt mmW Long Haul
• Broadband Wireless Access
(including 802.16 and 802.20 WiMax)
• WLL and MMDS loops
AMMC-6241 Absolute Maximum Ratings [1]
Symbol
Parameters/Conditions
Units
Min.
Vd
Positive Drain Voltage
V
7
Vg
Gate Supply Voltage
V
NA
Id
Drain Current
mA
100
Pin
CW Input Power
dBm
15
Tch
Operating Channel Temp.
°C
+150
Tstg
Storage Case Temp.
°C
Tmax
Maximum Assembly
Temp (60 sec max)
°C
-65
Max.
+150
+300
Note: Operation in excess of any one of these conditions may result in
permanent damage to this device.
Note: These devices are ESD sensitive. The following precautions are strongly recommended.
Ensure that an ESD approved carrier is used
when dice are transported from one destination
to another. Personal grounding is to be worn at
all times when handling these devices.
For more details, refer to Avago Technologies
Application Note A004R:
Electrostatic Discharge Damage and Control.
ESD Machine Model (Class A)
ESD Human Body Model (Class 0)
AMMC-6241 DC Specifications/Physical Properties [1]
Symbol
Parameters and Test Conditions
Units
Typ.
Max.
Id
Drain Supply Current (under any RF power drive and temperature) (Vd=3.0 V)
mA
Min.
60
80
qch-b
Thermal Resistance[2] (Backside temperature, Tb = 25°C)
°C/W
25
AMMC-6241 RF Specifications [3, 4, 5]
TA= 25°C, Vd=3.0 V, Id(Q)=60 mA, Zin=Zo=50 Ω
Symbol
Parameters andTest Conditions
Units
Minimum
Typical
Gain
Small-signal Gain[6]
Maximum
dB
26-35 GHz = 20
35-40 GHz = 18.5
26-37 GHz = 21
37-40 GHz = 19.5
NF
Noise Figure into 50W
dB
26-37 GHz = 2.7
37-40 GHz = 3.0
P-1dB
Output Power at 1dBGain Compression
dBm
+10
OIP3
Third Order Intercept Point;
Df=100MHz; Pin=-35dBm
dBm
+20
RLin
Input Return Loss[6]
dB
RLout
Output Return Loss[6]
Isol
Reverse Isolation[6]
Sigma
1.0
26-37 GHz = 3.0
37-40 GHz = 3.3
0.05
-13
-11
0.40
dB
-16
-12
0.50
dB
-40
0.50
Notes:
1. Ambient operational temperature TA=25°C unless otherwise noted.
2. Channel-to-backside Thermal Resistance (θch-b) = 26°C/W at Tchannel (Tc) = 34°C as measured using infrared microscopy. Thermal Resistance at
backside temperature (Tb) = 25°C calculated from measured data.
3. Small/Large -signal data measured in wafer form TA = 25°C.
4. 100% on-wafer RF test is done at frequency =30, 32, and 38 GHz.
5. Specifications are derived from measurements in a 50 Ω test environment. Aspects of the amplifier performance may be improved over a
more narrow bandwidth by application of additional conjugate, linearity, or low noise (Gopt) matching.
6. As derived from measured s-parameters
USL
2.6
2.7
Noise Figure at 32 GHz
2.8
2.9
USL
LSL
19
Gain at 38 GHz
20
2.8
2.9
3
3.1
3.2
3.3
Noise Figure at 38GHz
Typical distribution of Small Signal Gain, Noise Figure, and Return Loss. Based on 1500 part sampled over several
production lots.
AMMC-6241 Typical Performances
(TA = 25°C, Vd1 = Vd2 =3.0 V, Itotal = 60 mA, Zin = Zout = 50 Ω unless otherwise stated)
NOTE: These measurements are in a 50 Ω test environment. Aspects of the amplifier performance may be improved
over a narrower bandwidth by application of additional conjugate, linearity, or low noise (Gopt) matching.
25
0
0
-10
20
-5
10
-30
S11 (dB)
15
S12 (dB)
S21 (dB)
-20
-10
-40
-50
5
0
-70
25
29
33
37
41
Frequency (GHz)
45
Figure 1. Typical Gain
25
29
33
37
41
Frequency (GHz)
-5
3.0
20
-10
2.5
OIP3 & OP1dB (dBm)
25
-15
29
33
37
Frequency (GHz)
41
45
Figure 3 Typical Input Return Loss
3.5
2.0
1.5
15
10
OIP3
5
OP-1dB
-25
25
29
33
37
41
Frequency (GHz)
45
0
1.0
26
28
30 32 34 36
Frequency (GHz)
38
40
0
30
-20
25C
-40C
+85C
5
25
29
33
37
Frequency (GHz)
Figure 7. Gain Over Temperature
41
45
43
25C
-40C
+85C
-5
-40
-10
-60
0
35
39
Frequency (GHz)
S11 (dB)
S12 (dB)
20
10
31
0
25C
-40C
+85C
25
15
27
Figure 6. Typical Output P-1dB and 3rd Order
Intercept Point.
Figure 5. Typical Noise Figure into a 50 Ω load.
Figure 4. Typical Output Return Loss
S21 (dB)
25
0
-20
-20
45
Figure 2. Typical Isolation
NF (dB)
S22 (dB)
-15
-60
-15
-80
25
29
33
37
41
Frequency (GHz)
Figure 8. Isolation Over Temperature
45
-20
25
29
33
37
Frequency (GHz)
41
Figure 9. Input Return Loss Over Temperature
45
AMMC-6241 Typical Performances
(TA = 25°C, Vd1= Vd2 =3.0 V, Itotal =60 mA, Zin = Zout = 50 Ω unless otherwise stated)
NOTE: These measurements are in a 50 W test environment. Aspects of the amplifier performance may be improved
over a narrower bandwidth by application of additional conjugate, linearity, or low noise (Gopt) matching.
0
4.5
25C
-40C
+85C
4.0
3.5
NF (dB)
-15
3.0
2.5
-20
2.0
-25
1.5
-30
25
1.0
29
33
37
41
Frequency (GHz)
45
Figure 10. Output Return Loss Over Temperature
0
15
10
3V
4V
5V
5
0
25
30
35
40
Frequency (GHz)
Figure 13. Gain over Vdd
30
35
40
Frequency (GHz)
OIP3 (dBm)
19
14
-20
3V
4V
5V
9
-25
25
30
35
40
Frequency (GHz)
Figure 16. Output RL Over Vdd
45
4.5
5
3V
4V
5V
-10
4
27
31
35
39
Frequency (GHz)
Figure 17. Output IP3 Over Vdd
-20
25
30
35
40
Frequency (GHz)
Figure 15. Input RL Over Vdd
24
-15
45
Figure 14. Isolation Over Vdd
-10
4
Vdd (V)
-15
29
-5
S22 (dB)
-40
25
3V
4V
5V
3.5
-5
-80
0
3
0
-60
45
-40C
+25C
+85C
Figure 12. Typical Total Idd over Temperature
3V
4V
5V
-20
S12 (dB)
S21 (dB)
20
60
56
26 28 30 32 34 36 38 40
Frequency (GHz)
Figure 11. Noise Figure Over Temperature
25
62
58
S11 (dB)
S22 (dB)
-10
64
Idd (mA)
-5
66
+25C
-40C
+85C
43
45
AMMC-6241 Typical Scattering Parameters[1]
(Tc=25°C, VD1=VD2= 3 V, Itotal= 60 mA ,Zin = Zout = 50 Ω) Note: Data obtained from on-wafer measurements
S11
S21
S12
S22
Freq
GHz
dB
Mag
Phase
dB
Mag
Phase
dB
Mag
Phase
dB
Mag
Phase
15.0
17.0
19.0
22.0
24.0
25.0
26.0
26.5
27.0
27.5
28.0
28.5
29.0
29.5
30.0
30.5
31.0
31.5
32.0
32.5
33.0
33.5
34.0
34.5
35.0
35.5
36.0
36.5
37.0
37.5
38.0
38.5
39.0
39.5
40.0
40.5
41.0
41.5
42.0
42.5
43.0
44.0
45.0
46.0
47.0
48.0
49.0
50.0
-1.013
-1.306
-1.528
-2.642
-5.557
-8.397
-11.117
-11.627
-11.731
-11.805
-11.787
-12.038
-12.076
-12.070
-12.259
-12.339
-12.699
-12.988
-13.131
-13.159
-13.040
-12.824
-12.498
-12.573
-12.710
-12.792
-13.029
-13.389
-13.752
-13.599
-13.511
-13.392
-13.449
-13.713
-13.892
-13.822
-13.857
-13.578
-13.775
-13.188
-13.131
-11.798
-10.167
-8.784
-7.425
-6.079
-4.403
-2.878
0.890
0.860
0.839
0.738
0.527
0.380
0.278
0.262
0.259
0.257
0.257
0.250
0.249
0.249
0.244
0.242
0.232
0.224
0.221
0.220
0.223
0.228
0.237
0.235
0.231
0.229
0.223
0.214
0.205
0.209
0.211
0.214
0.213
0.206
0.202
0.204
0.203
0.209
0.205
0.219
0.221
0.257
0.310
0.364
0.425
0.497
0.602
0.718
173.506
152.019
127.230
74.942
13.805
-29.421
-81.009
-106.817
-129.432
-149.942
-165.515
-176.581
173.456
165.646
159.454
154.710
150.567
148.382
146.592
145.349
145.137
143.097
140.155
138.158
134.590
131.388
130.988
129.322
130.820
130.535
131.737
130.598
130.777
130.341
130.693
131.722
133.603
134.336
136.724
139.343
142.382
146.033
147.240
144.663
139.414
135.513
128.030
120.056
-7.637
5.022
9.344
15.740
19.561
20.760
21.155
21.214
21.239
21.203
21.113
21.023
21.060
21.058
21.007
21.043
21.040
21.078
21.104
21.192
21.308
21.302
21.296
21.182
21.024
20.813
20.678
20.494
20.310
20.239
20.142
19.955
19.742
19.463
19.274
19.016
18.830
18.631
18.429
18.218
18.030
17.887
17.877
17.791
17.680
17.700
17.793
17.615
0.415
1.783
2.932
6.123
9.507
10.915
11.422
11.501
11.533
11.485
11.367
11.250
11.297
11.296
11.229
11.276
11.272
11.322
11.355
11.471
11.625
11.617
11.609
11.458
11.251
10.981
10.811
10.585
10.364
10.279
10.165
9.948
9.708
9.400
9.198
8.929
8.740
8.542
8.346
8.145
7.970
7.841
7.831
7.755
7.656
7.673
7.756
7.599
-94.306
163.635
75.144
-29.058
-103.326
-143.267
178.829
160.796
143.152
126.214
110.350
95.138
80.037
65.449
51.326
37.629
23.753
10.265
-3.075
-16.397
-30.578
-44.533
-58.173
-72.363
-85.797
-98.385
-111.390
-123.674
-136.026
-147.683
-160.235
-172.253
175.463
164.088
152.397
141.026
129.648
118.871
107.881
97.768
87.333
67.235
45.991
24.481
2.691
-19.090
-43.456
-66.790
-59.891
-74.194
-58.181
-71.353
-69.197
-73.597
-69.288
-58.793
-59.928
-58.475
-58.768
-57.465
-57.267
-55.391
-52.903
-55.427
-55.992
-53.178
-61.593
-56.515
-58.069
-54.981
-56.012
-54.348
-55.336
-57.651
-54.494
-54.425
-52.515
-52.954
-52.864
-53.785
-51.373
-54.373
-56.900
-60.282
-54.278
-51.010
-54.346
-52.144
-58.236
-59.155
-52.882
-52.831
-50.765
-53.926
-52.746
-49.370
0.001
0.000
0.001
0.000
0.000
0.000
0.000
0.001
0.001
0.001
0.001
0.001
0.001
0.002
0.002
0.002
0.002
0.002
0.001
0.001
0.001
0.002
0.002
0.002
0.002
0.001
0.002
0.002
0.002
0.002
0.002
0.002
0.003
0.002
0.001
0.001
0.002
0.003
0.002
0.002
0.001
0.001
0.002
0.002
0.003
0.002
0.002
0.003
132.755
57.784
46.460
-129.404
139.800
-65.707
169.237
-110.455
-142.525
-171.775
-162.445
158.458
169.607
168.814
134.843
92.750
109.517
109.357
76.010
131.534
100.560
85.525
113.052
84.952
50.316
106.642
104.628
83.500
90.790
67.823
57.307
81.931
54.256
53.324
27.630
22.819
32.324
-8.926
41.468
19.887
-38.809
-43.306
162.395
-14.230
-17.966
-12.616
110.943
18.237
-10.443
-14.828
-20.040
-27.825
-28.011
-24.449
-23.448
-22.500
-22.260
-21.694
-21.715
-21.674
-21.093
-21.180
-21.033
-19.948
-19.390
-18.631
-18.449
-18.461
-17.807
-18.223
-18.033
-17.550
-17.667
-17.466
-17.225
-16.978
-17.004
-16.551
-16.813
-17.019
-17.453
-17.967
-18.409
-18.887
-19.364
-19.483
-19.835
-19.299
-19.365
-17.525
-17.185
-17.248
-16.593
-15.788
-15.204
-14.953
0.301
0.181
0.100
0.041
0.040
0.060
0.067
0.075
0.077
0.082
0.082
0.082
0.088
0.087
0.089
0.101
0.107
0.117
0.120
0.119
0.129
0.123
0.125
0.133
0.131
0.134
0.138
0.142
0.141
0.149
0.144
0.141
0.134
0.126
0.120
0.114
0.108
0.106
0.102
0.108
0.108
0.133
0.138
0.137
0.148
0.162
0.174
0.179
129.202
102.094
80.180
4.390
-90.859
-110.024
-127.918
-137.132
-143.296
-148.929
-157.855
-156.390
-165.820
-168.128
-165.016
-169.860
-174.803
-177.679
173.486
168.589
164.643
157.797
155.542
150.830
145.841
143.100
137.833
131.310
127.335
120.618
113.724
107.173
100.864
97.791
94.365
92.964
92.290
92.508
94.045
94.187
93.694
90.759
81.030
74.975
69.936
60.992
57.597
47.450
AMMC-6241 Typical Scattering Parameters[1]
(Tc=25°C, VD1=VD2= 5 V, Itotal= 65 mA, Zin = Zout = 50 Ω) Note: Data obtained from on-wafer measurements
S11
S21
S12
S22
Freq
GHz
dB
Mag
Phase
dB
Mag
Phase
dB
Mag
Phase
dB
Mag
Phase
15.0
17.0
19.0
22.0
24.0
25.0
26.0
26.5
27.0
27.5
28.0
28.5
29.0
29.5
30.0
30.5
31.0
31.5
32.0
32.5
33.0
33.5
34.0
34.5
35.0
35.5
36.0
36.5
37.0
37.5
38.0
38.5
39.0
39.5
40.0
40.5
41.0
41.5
42.0
42.5
43.0
44.0
45.0
46.0
47.0
48.0
49.0
50.0
-0.954
-1.228
-1.693
-4.463
-10.804
-15.616
-15.749
-14.388
-13.469
-12.672
-12.138
-11.933
-11.570
-11.350
-11.555
-11.254
-11.283
-11.322
-11.104
-10.807
-10.496
-10.547
-10.404
-10.415
-10.362
-10.429
-10.496
-10.552
-10.420
-10.278
-10.279
-10.249
-10.210
-10.178
-10.306
-10.258
-10.127
-10.264
-10.032
-10.283
-10.126
-10.167
-9.783
-9.264
-8.307
-7.300
-5.323
-2.732
0.896
0.868
0.823
0.598
0.288
0.166
0.163
0.191
0.212
0.232
0.247
0.253
0.264
0.271
0.264
0.274
0.273
0.272
0.278
0.288
0.299
0.297
0.302
0.301
0.303
0.301
0.299
0.297
0.301
0.306
0.306
0.307
0.309
0.310
0.305
0.307
0.312
0.307
0.315
0.306
0.312
0.310
0.324
0.344
0.384
0.432
0.542
0.730
175.370
153.538
127.796
72.488
7.846
-49.454
-118.695
-142.095
-157.405
-168.987
-179.012
175.281
168.288
163.120
160.007
157.772
155.500
152.983
151.391
149.758
147.850
145.153
143.126
140.889
138.559
136.295
134.946
133.658
132.618
132.713
130.938
128.628
128.373
126.565
125.591
125.375
124.344
124.574
123.150
124.307
121.899
124.109
125.766
127.464
129.119
129.338
131.169
130.750
-8.236
4.910
9.038
14.671
17.336
17.926
18.185
18.195
18.134
18.081
18.015
17.898
17.844
17.735
17.591
17.515
17.405
17.327
17.244
17.048
16.850
16.638
16.371
16.064
15.807
15.574
15.279
15.017
14.810
14.595
14.400
14.210
14.060
13.885
13.784
13.652
13.606
13.621
13.524
13.509
13.579
13.792
14.185
14.828
15.605
16.576
17.761
18.988
0.387
1.760
2.831
5.415
7.359
7.876
8.114
8.123
8.067
8.018
7.957
7.850
7.802
7.704
7.578
7.512
7.417
7.351
7.281
7.118
6.959
6.790
6.585
6.356
6.171
6.008
5.807
5.635
5.502
5.367
5.248
5.134
5.047
4.946
4.889
4.815
4.790
4.798
4.745
4.736
4.775
4.893
5.120
5.513
6.029
6.742
7.727
8.900
-97.484
149.468
54.112
-60.910
-139.132
-177.892
145.637
127.785
111.019
94.474
78.323
63.047
47.754
32.835
18.567
4.174
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Biasing and Operation
The AMMC-6241 is normally biased with a positive supply connected to both VD1 and VD2 bond pads through
the 100pF bypass capacitor as shown in Figure 21. The
recommended supply voltage is 3 V. It is important to
place the bypass capacitor as close to the die as possible.
No negative gate bias voltage is needed for the AMMC6241. Input and output matching are achieved on-die,
therefore no other external component is required
besides one 100pF bypass capacitor for the main supply. The input and output are DC-blocked with internal
coupling capacitors.
No ground wires are needed because all ground connections are made with plated through-holes to the backside
of the device.
Refer the Absolute Maximum Ratings table for allowed
DC and thermal conditions.
Assembly Techniques
The backside of the MMIC chip is RF ground. For microstrip applications the chip should be attached directly
to the ground plane (e.g. circuit carrier or heatsink) using
electrically conductive epoxy [1,2].
For best performance, the topside of the MMIC should be
brought up to the same height as the circuit surrounding
it. This can be accomplished by mounting a gold plate
metal shim (same length and width as the MMIC) under
the chip which is of correct thickness to make the chip
and adjacent circuit the same height. The amount of
epoxy used for the chip and/or shim attachment should
VD1
be just enough to provide a thin fillet around the bottom
perimeter of the chip or shim. The ground plan should
be free of any residue that may jeopardize electrical or
mechanical attachment.
The location of the RF bond pads is shown in Figure
12. Note that all the RF input and output ports are in a
Ground-Signal-Ground configuration.
RF connections should be kept as short as reasonable
to minimize performance degradation due to undesirable series inductance. A single bond wire is normally
sufficient for signal connections, however double bonding with 0.7 mil gold wire or use of gold mesh is recommended for best performance, especially near the high
end of the frequency band.
Thermosonic wedge bonding is preferred method for
wire attachment to the bond pads. Gold mesh can be attached using a 2 mil round tracking tool and a tool force
of approximately 22 grams and a ultrasonic power of
roughly 55 dB for a duration of 76 +/- 8 mS. The guided
wedge at an untrasonic power level of 64 dB can be used
for 0.7 mil wire. The recommended wire bond stage temperature is 150 +/- 2C.
Caution should be taken to not exceed the Absolute
Maximum
Notes:
1. Ablebond 84-1 LM1 silver epoxy is recommended.
2. Eutectic attach is not recommended and may jeopardize reliability
of the device.
VD2
RFout
RFin
Figure 18. AMMC-6241 Simplified Schematic
VD2
VD1
790
800
1110
1445
705
350
350
RFin
0
RFout
0
90
1810
Figure 19. AMMC-6241 Bonding pad locations
To VDD DC supply
100 pF Capacitor
V D1
RF INPUT
V D2
AMMC-6241
RF OUTPUT
Gold Plated Shim (Optional)
Figure 20. AMMC-6241 Assembly diagram
Ordering Information:
AMMC-6241-W10 = 10 devices per tray
AMMC-6241-W50 = 50 devices per tray
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 2005-2008 Avago Technologies Limited. All rights reserved. Obsoletes AV01-0231EN
AV02-13xxEN - June 23, 2008
1900