TI1 OPA137N/250 Low cost fet-input operational amplifiers microamplifier sery Datasheet

OPA137
OPA2137
OPA4137
®
OPA
413
7
OPA
137
OPA
413
7
OPA
213
7
LOW COST
FET-INPUT OPERATIONAL AMPLIFIERS
MicroAmplifier ™ Series
FEATURES
DESCRIPTION
●
●
●
●
●
●
●
●
OPA137 series FET-input operational amplifiers are designed
for low cost and miniature applications. In addition to small
size (SOT-23-5 and MSOP-8 packages), they provide low
input bias current (5pA), low quiescent currrent (220µA/
channel), and high open-loop gain (94dB).
Either single (+4.5V to +36V) or dual (±2.25 to ±18V)
supplies can be used. The input common-mode voltage range
includes the positive supply—suitable for many single-supply
applications. Single, dual, and quad versions have identical
specifications for maximum design flexibility.
OPA137 op amps are easy to use and free from phase
inversion and overload problems found in some FET-input
amplifiers. High performance, including linearity, is maintained as the amplifiers swing to their specified limits. In
addition, the combination of high slew rate (3.5V/µs) and
wide bandwidth (1MHz) provide fast settling time assuring
good dynamic response. Dual and quad designs feature completely independent circuitry for lowest crosstalk and freedom
from interaction.
The single (OPA137) packages are the tiny 5-lead SOT-23-5
surface mount, SO-8 surface mount, and 8-pin DIP. The dual
(OPA2137) comes in the miniature MSOP-8 surface mount,
SO-8 surface mount, and 8-pin DIP packages. The quad
(OPA4137) packages are the SO-14 surface mount and the
14-pin DIP. All are specified from –40°C to +85°C and operate
from –55°C to +125°C. A SPICE macromodel is available for
design analysis.
FET INPUT: IB = 5pA
LOW OFFSET VOLTAGE: 1.5mV
WIDE SUPPLY RANGE: ±2.25V to ±18V
LOW QUIESCENT CURRENT: 220µA/channel
EXCELLENT SPEED/POWER: 1MHz
INPUT TO POSITIVE SUPPLY
MicroSIZE PACKAGES: SOT-23-5, MSOP-8
SINGLE, DUAL, AND QUAD
APPLICATIONS
● STRAIN GAGE AMPLIFIER
● PHOTODETECTOR AMPLIFIER
● PRECISION INTEGRATOR
● BATTERY-POWERED INSTRUMENTS
● TEST EQUIPMENT
● ACTIVE FILTERS
OPA137
NC
1
8
NC
–In
2
7
V+
+In
3
6
Output
V–
4
5
NC
OPA4137
OPA2137
Out A
1
14
Out D
–In A
2
13
–In D
+In A
3
12
+In D
V+
4
11
V–
+In B
5
10
+In C
A
OPA137
8-Pin DIP, SO-8
Out 1
5
V+
V– 2
+In 3
4
–In
SOT-23-5
Out A
1
–In A
2
+In A
3
V–
4
A
B
8
V+
7
Out B
6
–In B
5
+In B
8-Pin DIP, SO-8, MSOP-8
D
B
C
–In B
6
9
–In C
Out B
7
8
Out C
14-Pin DIP
SO-14
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111
Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
© 1998 Burr-Brown Corporation
SBOS089
PDS-1438A
Printed in U.S.A. August, 1998
SPECIFICATIONS: VS = ±15V
At TA = +25°C, RL = 10kΩ connected to ground, unless otherwise noted.
Boldface limits apply over the specified temperature range, TA = –40°C to +85°C.
OPA137N, U, P
OPA2137E, U, P
OPA4137U, P
PARAMETER
CONDITION
OFFSET VOLTAGE
Input Offset Voltage
TA = –40°C to +85°C
vs Temperature
vs Power Supply
TA = –40°C to +85°C
Channel Separation (dual, quad)
dVOS/dT
PSRR
TA = –40°C to +85°C
VS = ±3V to ±18V
dc
0.6
VCM = 0V
IOS
FREQUENCY RESPONSE
Gain-Bandwidth Product
Slew Rate
Settling Time, 0.1%
0.01%
Overload Recovery Time
Total Harmonic Distortion + Noise
OUTPUT
Voltage Output
TA = –40°C to +85°C
Short-Circuit Current
Capacitive Load Drive
POWER SUPPLY
Specified Operating Range
Operating Voltage Range
Dual Supplies
Single Supply
Quiescent Current
TA = –40°C to +85°C
TEMPERATURE RANGE
Specified Range
Operating Range
Storage Range
Thermal Resistance
SOT-23-5 Surface Mount
MSOP-8 Surface Mount
SO-8 Surface Mount
8-Pin DIP
SO-14 Surface Mount
14-Pin DIP
±3
(V–) + 3
TYP
±2.5
±3.5
✻
✻
±7
±250
±250
MAX
UNITS
±10
mV
mV
µV/°C
µV/V
µV/V
µV/V
±15
✻
✻
✻
✻
✻
✻
✻
pA
✻
pA
µVp-p
nV/√Hz
fA/√Hz
✻
✻
✻
(V+)
✻
✻
V
VCM = –12V to 15V
76
74
84
84
70
70
✻
✻
dB
dB
VCM = –12V to 15V
72
70
INPUT IMPEDANCE
Differential
Common-Mode
OPEN-LOOP GAIN
Open-Loop Voltage Gain
TA = –40°C to +85°C
MIN
2
45
1.2
en
in
VCM
CMRR
MAX
±5
±100
See Typical Curve
±2
±50
IB
NOISE
Input Voltage Noise, f = 0.1 to 10Hz
Input Voltage Noise Density, f = 1kHz
Current Noise Density, f = 1kHz
TYP
±1.5
±2.5
±15
±90
VOS
INPUT BIAS CURRENT
Input Bias Current
vs Temperature
Input Offset Current
INPUT VOLTAGE RANGE
Common-Mode Voltage Range
Common-Mode Rejection Ratio
OPA137, OPA2137
OPA4137
TA = –40°C to +85°C
OPA137, OPA2137
OPA4137
MIN
OPA137NA, UA, PA
OPA2137EA, UA, PA
OPA4137UA, PA
70
70
1010 || 1
1012 || 2
AOL
GBW
SR
THD+N
VO = –13.8V to 13.9V
VO = –13.8V to 13.9V
86
86
1
3.5
8
10
1
0.05
G=1
G = 1, 10V Step, CL = 100pF
G = 1, 10V Step, CL = 100pF
VIN • G = VS
G = 1, f = 1kHz, 3.5Vrms
VOUT
(V–) + 1.2
(V–) + 1.2
ISC
CLOAD
VS
(V+) – 1.1
(V+) – 1.1
Ω || pF
Ω || pF
✻
dB
dB
✻
✻
✻
✻
✻
✻
MHz
V/µs
µs
µs
µs
%
✻
✻
✻
✻
–25/+60
1000
✻
✻
±15
✻
V
±220
IO = 0
IO = 0
✻
✻
V
V
mA
pF
±2.25(1)
+4.5
IQ
✻
✻
94
dB
dB
–40
–55
–55
±18
+36
±270
±375
✻
✻
+85
+125
+125
✻
✻
✻
✻
θJA
200
150
150
100
100
80
✻
✻
✻
✻
✻
✻
✻
✻
✻
✻
V
V
µA
µA
✻
✻
✻
°C
°C
°C
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
✻ Specifications the same as OPA137N, U, P.
NOTE: (1) At minimum power supply voltage inputs must be biased above ground in accordance with common-mode voltage range restrictions—see “Operating
Voltage” discussion.
®
OPA137, 2137, 4137
2
ABSOLUTE MAXIMUM RATINGS(1)
ELECTROSTATIC
DISCHARGE SENSITIVITY
Supply Voltage, V+ to V– ..................................................................... 36V
Input Voltage ....................................................... (V–) –0.7V to (V+) +0.7V
Input Current ....................................................................................... 2mA
Output Short-Circuit(2) .............................................................. Continuous
Operating Temperature .................................................. –55°C to +125°C
Storage Temperature ...................................................... –55°C to +125°C
Junction Temperature .................................................................... +150°C
Lead Temperature (soldering, 10s) ................................................. 300°C
This integrated circuit can be damaged by ESD. Burr-Brown
recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling
and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits
may be more susceptible to damage because very small
parametric changes could cause the device not to meet its
published specifications.
NOTE: (1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum ratings for extended periods may affact device
reliability. (2) Short circuit to ground, one amplifier per package.
PACKAGE/ORDERING INFORMATION
PRODUCT
PACKAGE
PACKAGE
DRAWING
NUMBER(1)
SPECIFIED
TEMPERATURE
RANGE
PACKAGE
MARKING
ORDERING
NUMBER(2)
TRANSPORT
MEDIA
Single
OPA137N
5-Lead SOT-23-5 Surface Mount
331
–40°C to +85°C
E37(3)
"
"
"
"
"
–40°C to +85°C
E37(3)
OPA137N/250
OPA137N/3K
OPA137NA/250
OPA137NA/3K
OPA137U
OPA137U/2K5
OPA137UA
OPA137UA/2K5
OPA137P
OPA137PA
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Rails
Tape and Reel
Rails
Tape and Reel
Rails
Rails
OPA2137E/250
OPA2137E/2K5
OPA2137EA/250
OPA2137EA/2K5
OPA2137U
OPA2137U/2K5
OPA2137UA
OPA2137UA/2K5
OPA2137P
OPA2137PA
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
Rails
Tape and Reel
Rails
Tape and Reel
Rails
Rails
OPA4137U
OPA4137U/2K5
OPA4137UA
OPA4137UA/2K5
OPA4137P
OPA4137PA
Rails
Tape and Reel
Rails
Tape and Reel
Rails
Rails
OPA137NA
5-Lead SOT-23-5 Surface Mount
331
"
"
"
"
"
OPA137U
SO-8 Surface Mount
182
–40°C to +85°C
OPA137U
"
"
"
"
"
OPA137UA
SO-8 Surface Mount
182
–40°C to +85°C
OPA137UA
"
"
"
"
"
OPA137P
OPA137PA
8-Pin DIP
8-Pin DIP
006
006
–40°C to +85°C
–40°C to +85°C
OPA137P
OPA137PA
Dual
OPA2137E
MSOP-8 Surface Mount
337
–40°C to +85°C
E37(3)
"
"
"
"
"
E37(3)
OPA2137EA
MSOP-8 Surface Mount
337
–40°C to +85°C
"
"
"
"
"
OPA2137U
SO-8 Surface Mount
182
–40°C to +85°C
OPA2137U
"
OPA2137UA
"
"
"
"
"
SO-8 Surface Mount
182
–40°C to +85°C
OPA2137UA
"
"
"
"
8-Pin DIP
8-Pin DIP
006
006
–40°C to +85°C
–40°C to +85°C
OPA2137P
OPA2137PA
Quad
OPA4137U
SO-14 Surface Mount
235
–40°C to +85°C
OPA4137U
"
"
"
"
"
SO-14 Surface Mount
235
–40°C to +85°C
OPA4137UA
"
"
"
"
14-Pin DIP
14-Pin DIP
010
010
–40°C to +85°C
–40°C to +85°C
OPA4137P
OPA4137PA
OPA2137P
OPA2137PA
OPA4137UA
"
OPA4137P
OPA4137PA
NOTES: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book. (2) Models with a slash (/) are
available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 3000 pieces of “OPA137NA/3K” will get a single
3000-piece Tape and Reel. For detailed Tape and Reel mechanical information, refer to Appendix B of Burr-Brown IC Data Book. (3) Grade information is marked
on the reel.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no
responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice.
No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product
for use in life support devices and/or systems.
®
3
OPA137, 2137, 4137
TYPICAL PERFORMANCE CURVES
At TA = +25°C, VS = ±15V, RL = 10kΩ, connected to ground, unless otherwise noted.
POWER SUPPLY AND COMMON-MODE REJECTION
vs FREQUENCY
OPEN-LOOP GAIN/PHASE vs FREQUENCY
100
100
80
0
–45
–40°C
φ
40
–90
20
–135
+85°C
0
PSRR, CMRR (dB)
Gain (dB)
60
80
Phase Shift (°)
G
CMRR
60
40
–PSRR
20
–180
+25°C
+PSRR
–20
0
1
10
100
1k
10k
100k
1M
10
10M
100
1k
Frequency (Hz)
10k
100k
1M
Frequency (Hz)
INPUT VOLTAGE AND CURRENT NOISE
SPECTRAL DENSITY vs FREQUENCY
CHANNEL SEPARATION vs FREQUENCY
1k
1
140
10
10
1
Current Noise
1
Channel Separation (dB)
Voltage Noise
100
Current Noise (fA/√Hz)
Voltage Noise (nV/√Hz)
120
0.1
0.1
1
10
100
1k
10k
100k
80
60
40
Dual and quad devices.
G = 1, all channels.
Quad measured channel
A to D or B to C—other
combinations yield improved
rejection.
20
1M
100
1k
10k
100k
1M
Frequency (Hz)
Frequency (Hz)
INPUT BIAS CURRENT vs TEMPERATURE
INPUT BIAS CURRENT
vs INPUT COMMON-MODE VOLTAGE
1n
10k
Input Bias Current (pA)
1k
Input Bias Current (pA)
100
100
10
1
0.1
Input bias current is a
function of the voltage
between the V– supply
and the inputs.
100p
10p
1p
–75
–50
–25
0
25
50
75
100
125
–15
®
OPA137, 2137, 4137
–10
–5
0
5
Common-Mode Voltage (V)
Temperature (°C)
4
10
15
TYPICAL PERFORMANCE CURVES
(CONT)
At TA = +25°C, VS = ±15V, RL = 10kΩ, connected to ground, unless otherwise noted.
TOTAL HARMONIC DISTORTION + NOISE
vs FREQUENCY
AOL, CMRR, PSRR vs TEMPERATURE
1
95
AOL, CMRR, PSRR (dB)
VO = –13.8V to +13.9V
0.1
G=1
0.01
PSRR
75
65
100
1k
10k
100k
–75
–50
–25
75
100
125
QUIESCENT CURRENT and SHORT-CIRCUIT CURRENT
vs SUPPLY VOLTAGE
(IQ Per Amplifier)
±80
±40
±150
±30
±20
–ISC
±50
0
–75
–50
–25
0
25
50
75
100
±60
±220
Quiescent Current (µA)
±50
IQ
±100
(IQ Per Amplifier)
Short-Circuit Current (mA)
+ISC
±70
±230
±70
±60
±200
±210
±40
±190
±30
–ISC
±180
±170
0
±160
0
±5
±15
±20
OUTPUT VOLTAGE SWING vs OUTPUT CURRENT
(V+)
–55°C
(V+) –1
Output Voltage Swing (V)
CL = 200pF
±10
Supply Voltage (V)
CL = 100pF
20
±20
±10
0
125
Maximum output voltage
without visible dynamic
distortion.
25
±50
±200
±10
MAXIMUM OUTPUT VOLTAGE vs FREQUENCY
VS = ±15V
±ISC
IQ
Temperature (°C)
Output Voltage (Vp-p)
50
QUIESCENT CURRENT and SHORT-CIRCUIT CURRENT
vs TEMPERATURE
±250
15
25
Temperature (°C)
±300
30
0
Frequency (Hz)
±350
Quiescent Current (µA)
80
70
VO = 3.5Vrms
±400
CMRR
85
Short-Circuit Current (mA)
THD+N (%)
G = 10
AOL
90
Without slew-rate
induced distortion
10
5
(V+) –2
+125°C
+25°C
(V+) –3
(V–) +3
+25°C
+125°C
(V–) +2
(V–) +1
VS = ±5V
0
–55°C
(V–)
10k
100k
0
1M
±2
±4
±6
±8
±10
Output Current (mA)
Frequency (Hz)
®
5
OPA137, 2137, 4137
TYPICAL PERFORMANCE CURVES
(CONT)
At TA = +25°C, VS = ±15V, RL = 10kΩ, connected to ground, unless otherwise noted.
20
20
Typical production
distribution of
packaged units.
Single, duals, and
quads included.
16
14
Typical production
distribution of
packaged units.
Single, duals, and
quads included.
18
Percent of Amplifiers (%)
18
12
10
8
6
4
16
14
12
10
8
6
4
2
0
0
0
4
8
12
16
20
24
28
32
36
40
44
48
52
56
60
64
68
82
76
80
2
–10
–9
–8
–7
–6
–5
–4
–3
–2
–1
0
1
2
3
4
5
6
7
8
9
10
Percent of Amplifiers (%)
OFFSET VOLTAGE DRIFT
PRODUCTION DISTRIBUTION
OFFSET VOLTAGE PRODUCTION DISTRIBUTION
Offset Voltage (mV)
Offset Voltage Drift (µV/°C)
SETTLING TIME vs CLOSED-LOOP GAIN
SMALL-SIGNAL OVERSHOOT
vs LOAD CAPACITANCE
60
100
10V Step
50
Overshoot (%)
10
0.1%
40
G = –1
30
20
10
G = +10
G = +1
0
1
1
10
10
100
100
SMALL-SIGNAL STEP RESPONSE
G = 1, CL = 50pF
LARGE-SIGNAL STEP RESPONSE
G = 1, CL = 50pF
5V/div
1µs/div
5µs/div
®
OPA137, 2137, 4137
1k
Load Capacitance (pF)
Closed-Loop Gain (V/V)
20mV/div
Settling Time (µs)
0.01%
6
10k
APPLICATIONS INFORMATION
HIGH-SIDE CURRENT SENSING
Many applications require the sensing of signals near the
positive supply. The common-mode input range of OPA137
op amps includes the positive rail, enabling them to be used
to sense power supply currents as shown in Figure 2.
OPA137 series op amps are unity-gain stable and suitable
for a wide range of general-purpose applications. Power
supply pins should be bypassed with 10nF ceramic capacitors or larger. All circuitry is completely independent in dual
and quad versions, assuring normal performance when one
amplifier in a package is overdriven or short circuited. Many
key parameters are guaranteed over the specified temperature range, –40°C to +85°C.
R1
0.1Ω
V+
R2
1kΩ
Load
OPERATING VOLTAGE
OPA137 op amps can be operated on power supplies as low
as ±2.25V. Performance remains excellent with power supplies ranging from ±2.25V to ±18V (+4.5V to +36V single
supply). Most parameters vary only slightly throughout this
supply voltage range. Quiescent current and short-circuit
current vs supply voltage are shown in Typical Performance
Curves.
OPA137
20pF
VO =
R1 R3
I
R2 L
Zetex
Darlington
ZTX712
Operation at very low supply voltage (VS ≤ ±3V) requires
careful attention to ensure that the common-mode voltage
remains within the linear range, VCM = (V–)+3V to (V+).
Inputs may need to be biased above ground in accordance
with the common-mode voltage range restrictions for linear
operation.
VO
OPA241
Ground-referred
output
R3
10kΩ
FIGURE 2. High-Side Current Monitor.
INPUT VOLTAGE
The input common-mode voltage range of OPA137 series
op amps extends from (V–)+3V to the positive rail, V+. For
normal operation, inputs should be limited to this range. The
inputs may go beyond the power supplies without output
phase-reversal. Many FET-input op amps (such as TL061
types) exhibit phase-reversal of the output when the input
common-mode range is exceeded. This can occur in voltagefollower circuits, causing serious problems in control loop
applications.
INPUT BIAS CURRENT
The input bias current is approximately 5pA at room temperature and increases with temperature as shown in the
typical performance curve “Input Bias Current vs Temperature.”
Input Bias current also varies with common-mode voltage
and power supply voltage. This variation is dependent on
the voltage between the negative power supply and the
common-mode input voltage. The effect is shown in the
typical performance curve “Input Bias Current vs CommonMode Voltage.”
Input terminals are diode-clamped to the power supply rails
for ESD protection. If the input voltage can exceed the
negative supply by 500mV, input current should be limited
to 2mA (or less). If the input current is not adequately
limited, you may see unpredicatable behavior in the other
amplifiers in the package. This is easily accomplished with
an input resistor as shown in Figure 1. Many input signals
are inherently current-limited, therefore, a limiting resistor
may not be required.
RF
1MΩ
3.3pF
V+
IOVERLOAD
2mA max
OPA137
λ
Photodiode
BPW34
CD = 75pF
VOUT
VIN
Inputs are internally
clamped to V+ and V–
ID
OPA137
VO = – R F I D
ID is proportional to
light intensity (radiant power)
V–
FIGURE 3. Photodetector Amplifier.
FIGURE 1. Input Current Protection for Voltages Exceeding the Supply Voltage.
®
7
OPA137, 2137, 4137
SOT-23-5
(Package Drawing #331)
MSOP-8
(Package Drawing #337)
0.19
(4.83)
0.04
(1.016)
0.035
(0.889)
0.10
(2.54)
0.075
(1.905)
0.027
(0.686)
0.0375
(0.9525)
0.0375
(0.9525)
0.016
(0.41)
Refer to end of data sheet or Appendix C of Burr-Brown
Data Book for tolerances and detailed package drawing.
For further information on solder pads for surface-mount
devices consult Application Bulletin AB-132.
FIGURE 4. Recommended SOT-23-5 and MSOP-8 Solder Footprints.
®
OPA137, 2137, 4137
8
0.0256
(0.65)
PACKAGE OPTION ADDENDUM
www.ti.com
6-Sep-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
OPA137N/250
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
E37
OPA137N/250E4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
E37
OPA137N/3K
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
E37
OPA137N/3KE4
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
E37
OPA137NA/250
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
E37
OPA137NA/250E4
ACTIVE
SOT-23
DBV
5
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
E37
OPA137NA/3K
ACTIVE
SOT-23
DBV
5
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-2-260C-1 YEAR
-40 to 85
E37
OPA137P
LIFEBUY
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU SNPB
N / A for Pkg Type
OPA137P
OPA137PA
LIFEBUY
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU SNPB
N / A for Pkg Type
OPA137P
A
OPA137U
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA
137U
OPA137UA
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA
137U
A
OPA137UA/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA
137U
A
OPA137UA/2K5G4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA
137U
A
OPA137UAG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA
137U
A
OPA137UE4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA
137U
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
6-Sep-2016
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
OPA2137E/250
ACTIVE
VSSOP
DGK
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-3-260C-168 HR
-40 to 85
E37
OPA2137E/250G4
ACTIVE
VSSOP
DGK
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
E37
OPA2137E/2K5
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-3-260C-168 HR
-40 to 85
E37
OPA2137E/2K5G4
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
E37
OPA2137EA/250
ACTIVE
VSSOP
DGK
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-3-260C-168 HR
E37
OPA2137EA/250G4
ACTIVE
VSSOP
DGK
8
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
E37
OPA2137EA/2K5
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU | Call TI
Level-3-260C-168 HR
E37
OPA2137P
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
OPA2137P
OPA2137PA
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
OPA2137P
A
OPA2137PAG4
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
OPA2137P
A
OPA2137PG4
ACTIVE
PDIP
P
8
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
OPA2137P
OPA2137U
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
OPA
2137U
OPA2137U/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
OPA
2137U
OPA2137UA
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA
2137U
A
OPA2137UA/2K5
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA
2137U
A
OPA2137UA/2K5E4
PREVIEW
SOIC
D
8
TBD
Call TI
Call TI
-40 to 85
OPA2137UAE4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
Addendum-Page 2
OPA
2137U
A
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
6-Sep-2016
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
OPA2137UE4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
OPA
2137U
OPA4137P
ACTIVE
PDIP
N
14
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
OPA4137P
OPA4137PA
ACTIVE
PDIP
N
14
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
OPA4137P
A
OPA4137PAG4
ACTIVE
PDIP
N
14
25
Green (RoHS
& no Sb/Br)
CU NIPDAU
N / A for Pkg Type
OPA4137P
A
OPA4137U
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA4137U
OPA4137U/2K5
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA4137U
OPA4137UA
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA4137U
A
OPA4137UA/2K5
ACTIVE
SOIC
D
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA4137U
A
OPA4137UAE4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA4137U
A
OPA4137UAG4
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 85
OPA4137U
A
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
6-Sep-2016
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Feb-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
OPA137N/250
SOT-23
DBV
5
250
178.0
8.4
3.3
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
3.2
1.4
4.0
8.0
Q3
OPA137N/3K
SOT-23
DBV
5
3000
178.0
8.4
3.3
3.2
1.4
4.0
8.0
Q3
OPA137NA/250
SOT-23
DBV
5
250
178.0
8.4
3.23
3.17
1.37
4.0
8.0
Q3
OPA137NA/3K
SOT-23
DBV
5
3000
178.0
8.4
3.3
3.2
1.4
4.0
8.0
Q3
OPA137UA/2K5
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA2137E/250
VSSOP
DGK
8
250
180.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA2137E/2K5
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA2137EA/250
VSSOP
DGK
8
250
180.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA2137EA/2K5
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
OPA2137U/2K5
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA2137UA/2K5
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
OPA4137U/2K5
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
OPA4137UA/2K5
SOIC
D
14
2500
330.0
16.4
6.5
9.0
2.1
8.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
15-Feb-2014
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
OPA137N/250
SOT-23
DBV
OPA137N/3K
SOT-23
DBV
5
250
565.0
140.0
75.0
5
3000
565.0
140.0
75.0
OPA137NA/250
SOT-23
DBV
OPA137NA/3K
SOT-23
DBV
5
250
565.0
140.0
75.0
5
3000
565.0
140.0
OPA137UA/2K5
SOIC
75.0
D
8
2500
367.0
367.0
35.0
OPA2137E/250
VSSOP
DGK
8
250
210.0
185.0
35.0
OPA2137E/2K5
VSSOP
DGK
8
2500
367.0
367.0
35.0
OPA2137EA/250
VSSOP
DGK
8
250
210.0
185.0
35.0
OPA2137EA/2K5
VSSOP
DGK
8
2500
367.0
367.0
35.0
OPA2137U/2K5
SOIC
D
8
2500
367.0
367.0
35.0
OPA2137UA/2K5
SOIC
D
8
2500
367.0
367.0
35.0
OPA4137U/2K5
SOIC
D
14
2500
367.0
367.0
38.0
OPA4137UA/2K5
SOIC
D
14
2500
367.0
367.0
38.0
Pack Materials-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2016, Texas Instruments Incorporated
Similar pages