Anpec APL3204A Li charger protection ic Datasheet

APL3204A/B
Li+ Charger Protection IC
Features
General Description
•
Input Over-Voltage Protection
•
Programmable Input Over-Current Protection
The APL3204A/B provide complete Li+ charger protections against over-voltage, over-current, and battery over-
•
Battery Over-Voltage Protection
•
•
Over-Temperature Protection
High Immunity of False Triggering
•
tored parameters are over the threshold, the IC removes
the power from the charging system by turning off an in-
High Accuracy Protection Thresholds
•
Fault Status Indication
ternal switch. All protections also have deglitch time
against false triggering due to voltage spikes or current
•
Enable Input
•
Available in TDFN4x3-12 Package
•
Lead Free and Green Devices Available
(RoHS Compliant)
voltage. The IC is designed to monitor input voltage, input current, and battery voltage. When any of the moni-
transients. The APL3204A/B also provide over-temperature protection, a FAULT output pin to indicate the fault
conditions, and the EN pin to allow the system to disable
the IC.
Applications
Simplified Application Circuit
5V Adapter or USB
Charger Input
IN
•
Smart Phones and PDAs
•
Digital Still Cameras
•
Potable Devices
OUT
APL3204A/B
EN
FAULT
Pin Configuration
Charger Output and
System
ILIM
BAT
GND
Li+ Battery
IN 1
12 NC
IN 2
11 OUT
GND 3
10 OUT
EP
FAULT 4
9 ILIM
NC 5
8 BAT
NC 6
7 EN
TDFN4X3-12 (Top View)
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. A,1 - Jun, 2008
1
www.anpec.com.tw
APL3204A/B
Ordering and Marking Information
Package Code
QB : TDFN4x3-12
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
L : Lead Free Device G : Halogen and Lead Free Device
APL3204A
APL3204B
Assembly Material
Handling Code
Temperature Range
Package Code
APL3204A QB:
L04A
XXXXX
XXXXX - Date Code
APL3204B QB:
L04B
XXXXX
XXXXX - Date Code
Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish;
which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant)
and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed
1500ppm by weight).
Absolute Maximum Ratings
Symbol
(Note 1)
Parameter
Rating
Unit
VIN
IN Input Voltage (IN Pin to GND)
-0.3 to 30
V
VOUT, VBAT
OUT, BAT Pins to GND Voltage
-0.3 to 7
V
ILIM, FAULT, EN, Pins to GND Voltage
-0.3 to 7
V
VILIM, VFAULT , VEN,
IOUT
TJ
OUT Output Current
2
Maximum Junction Temperature
TSTG
Storage Temperature Range
TSDR
Maximum Lead Soldering Temperature,10 Seconds
A
150
o
-65 to 150
o
260
o
C
C
C
Note 1 : Stresses beyond the absolute maximum rating may damage the device and exposure to absolute maximum rating conditions
for extended periods may affect device reliability.
Thermal Characteristics
Symbol
θJA
Parameter
Typical Value
Unit
80
°C/W
Junction to Ambient Thermal Resistance in Free Air
TDFN4x3-12
Recommended Operating Conditions
Symbol
Parameter
Range
Unit
4.5 to 5.5
V
OUT Output Current
0 to 1.5
A
TJ
Junction Temperature
-40 to 125
°C
TA
Ambient Temperature
-40 to 85
°C
VIN
IN Input Voltage
IOUT
Copyright  ANPEC Electronics Corp.
Rev. A,1 - Jun, 2008
2
www.anpec.com.tw
APL3204A/B
Electrical Characteristics
Refer to the typical application circuit. These specifications apply over VIN=5V, TA= -40~85°C, unless otherwise specified. Typical
values are at TA=25°C.
Symbol
Parameter
Test Conditions
APL3204A/B
Unit
Min.
Typ.
Max.
2.5
-
2.8
V
mV
POWER-ON-RESET (POR) AND SUPPLY CURRENT
VPOR
IN POR Threshold
VIN rising
IN POR Hysteresis
ICC
TB(IN)
IN Supply Current
Input Power-On Blanking Time
-
230
-
EN = Low
-
250
350
EN = High
-
100
150
VIN rising to VOUT rising
-
8
-
ms
µA
INTERNAL POWER SWITCH AND OUT DISCHARGE RESISTANCE
Power Switch On Resistance
IOUT = 0.5A
-
250
450
mΩ
OUT Discharge Resistance
VOUT = 3V
-
500
-
Ω
APL3204A, VIN rising
5.67
5.85
6.00
APL3204B, VIN rising
6.60
6.80
7.00
Input OVP Recovery Hysteresis
-
200
-
Input OVP Propagation Delay
-
-
1
µs
Input OVP Recovery Time
-
8
-
ms
INPUT OVER-VOLTAGE PROTECTION (OVP)
VOVP
TON(OVP)
Input OVP Threshold
V
mV
OVER-CURRENT PROTECTION (OCP)
IOCP
OCP Threshold
RILIM = 25kΩ
930
1000
1070
mA
OCP Threshold Accuracy
IOCP = 300mA to 1500mA
-10
-
+10
%
TB(OCP)
OCP Blanking Time
-
176
-
µs
TON(OCP)
OCP Recovery Time
-
64
-
ms
4.30
4.35
4.4
V
Battery OVP Hysteresis
-
270
-
mV
BAT Pin Leakage Current
-
-
20
nA
-
176
-
µs
EN Input Logic High
1.4
-
-
V
EN Input Logic Low
-
-
0.4
V
EN Internal Pull-Low Resistor
-
500
-
kΩ
BATTERY OVER-VOLTAGE PROTECTION
VBOVP
IBAT
TB(BOVP)
Battery OVP Threshold
VBAT rising
VBAT = 4.4V
Battery OVP Blanking Time
EN LOGIC LEVELS
FAULT LOGIC LEVELS AND DELAY TIME
FAULT Output Low Voltage
Sink 5mA current
-
-
0.4
V
FAULT Pin Leakage Current
VFAULT = 5V
-
-
1
µA
Over-Temperature Threshold
-
140
-
°C
Over-Temperature Hysteresis
-
20
-
°C
OVER-TEMPERATURE PROTECTION (OTP)
TOTP
Copyright  ANPEC Electronics Corp.
Rev. A,1 - Jun, 2008
3
www.anpec.com.tw
APL3204A/B
Typical Operating Characteristics
Input OVP Threshold vs. Junction
Temperature
Input OVP Threshold vs. Junction
Temperature
7.00
6.00
Input OVP Threshold , VOVP (V)
Input OVP Threshold , VOVP (V)
APL3204A
5.95
5.90
5.85
VIN Increasing
5.80
5.75
5.70
VIN Decreasing
5.65
5.60
APL3204B
6.95
6.90
6.85
VIN Increasing
6.80
6.75
6.70
6.65
VIN Decreasing
6.60
6.55
6.50
5.55
-50
-25
0
25
50
75
Junction Temperature
100
-50
125
25
50
75
100
125
OCP Threshold vs. Junction
Temperature
4.40
1200
4.35
1150
OCP Threshold, IOCP (mA)
VBAT Increasing
4.30
4.25
4.20
4.15
4.10
VBAT Decreasing
4.05
1100
1050
1000
950
900
850
4.00
-50
-25
0
25
50
75
100
800
125
-50
-25
Junction Temperature (oC)
0
25
50
75
Junction Temperature
IN Supply Current vs. Junction
Temperature
100
125
(oC)
POR Threshold vs. Junction
Temperature
150
2.80
POR Threshold, VPOR (V)
IN Supply Current, ICC (µΑ)
0
Junction Temperature (oC )
Battery OVP Threshold vs.
Junction Temperature
Battery OVP Threshold, VBOVP (V)
-25
( oC )
125
100
EN = high
75
2.70
VIN Increasing
2.60
2.50
2.40
VIN Decreasing
2.30
50
2.20
-50
-25
0
25
50
75
Junction Temperature
Copyright  ANPEC Electronics Corp.
Rev. A,1 - Jun, 2008
100
125
-50
(oC)
-25
0
25
50
75
Junction Temperature
4
100
125
(oC)
www.anpec.com.tw
APL3204A/B
Typical Operating Characteristics (Cont.)
Power Switch On Resistance vs.
Junction Temperature
Power Switch On Resistance, RDS,ON (mΩ)
Power Switch On Resistance, RDS,ON (Ω)
Power Switch On Resistance vs.
Input Voltage
0.35
0.30
0.25
0.20
0.15
0.10
3.0
3.5
4.0
4.5
5.0
5.5
6.0
350
300
250
200
150
-50
6.5
-25
0
25
50
75
100
125
o
Junction Temperature ( C)
Input Voltage, VIN (V)
Copyright  ANPEC Electronics Corp.
Rev. A,1 - Jun, 2008
400
5
www.anpec.com.tw
APL3204A/B
Operating Waveforms
Refer to the typical application circuit. The test condition is VIN=5V, TA= 25oC unless otherwise specified.
Normal Power On
OVP at Power On
VIN = 0 to 12V
VIN = 0 to 5V
VIN
VIN
VOUT
1
1
VOUT
2
2
IOUT
VFAULT
3
3
COUT =1µF, CIN =1µF, ROUT = 10Ω
CH1: VIN, 10V/Div, DC
CH2: VOUT, 2V/Div, DC
CH3: VFAULT, 5V/Div, DC
TIME: 2ms/Div
COUT =1µF, CIN =1µF, ROUT = 10Ω
CH1: VIN, 5V/Div, DC
CH2: VOUT, 2V/Div, DC
CH3: IOUT, 0.5A/Div, DC
TIME: 2ms/Div
Input Over-Voltage Pretection
Input Over-Voltage Pretection
APL3204A
APL3204B
VIN
VIN
1
1
VOUT
VOUT
3
3
2
VFAULT
2
VIN = 5V to 12V
COUT = 1µF, CIN=1µF, ROUT=50Ω
CH1: VIN, 5V/Div, AC
CH2: VOUT, 2V/Div, DC
CH3: VFAULT, 5V/Div, DC
TIME:20µs/Div
Copyright  ANPEC Electronics Corp.
Rev. A,1 - Jun, 2008
VFAULT
COUT = 1µF, CIN=1µF, ROUT=50Ω
CH1: VIN, 5V/Div, AC
CH2: VOUT, 2V/Div, DC
CH3: VFAULT, 5V/Div, DC
TIME: 20µs/Div
6
www.anpec.com.tw
APL3204A/B
Operating Waveforms (Cont.)
Refer to the typical application circuit. The test condition is VIN=5V, TA= 25oC unless otherwise specified.
Battery Over-Voltage Pretection
Recovery from Input OVP
APL3204B
VBAT
VIN
1
1
VOUT
VOUT
2
2
VFAULT
VFAULT
3
3
VIN = 12V to 5V
COUT = 1µF, CIN=1µF, ROUT=50Ω
CH1: VIN, 5V/Div, AC
CH2: VOUT, 5V/Div, DC
CH3: VFAULT, 5V/Div, DC
TIME: 2ms/Div
VBAT = 3.6V to 4.4V to 3.6V, ROUT=33.3Ω
COUT =1µF, CIN =1µF
CH1: VBAT, 2V/Div, DC
CH2: VOUT, 2V/Div, DC
CH3: VFAULT, 5V/Div, DC
TIME: 5ms/Div
Recovery from Battery OVP
Battery Over-Voltage Pretection
VBAT
VBAT
1
VOUT
1
VOUT
2
2
VFAULT
VFAULT
3
3
VBAT = 4.4V to 3.6V, ROUT=33.3Ω
COUT =1µF, CIN =1µF
CH1: VBAT, 2V/Div, DC
CH2: VOUT, 2V/Div, DC
CH3: VFAULT, 5V/Div, DC
TIME: 50µs/Div
VBAT = 3.6V to 4.4V, R OUT=33.3Ω
COUT =1µF, CIN =1µF
CH1: VBAT, 2V/Div, DC
CH2: VOUT, 2V/Div, DC
CH3: VFAULT, 5V/Div, DC
TIME: 50µs/Div
Copyright  ANPEC Electronics Corp.
Rev. A,1 - Jun, 2008
7
www.anpec.com.tw
APL3204A/B
Operating Waveforms (Cont.)
Refer to the typical application circuit. The test condition is VIN=5V, TA= 25oC unless otherwise specified.
Over-Current Pretection
Over-Current Pretection
VIN
IOUT
1
1
2
VOUT
VOUT
2
IOUT
3
VFAULT
3
VFAULT
4
COUT =1µF, CIN =1µF, ROUT = 2.5Ω
CH1: VIN, 5V/Div, DC
CH2: VOUT, 5V/Div, DC
CH3: IOUT, 0.5A/Div, DC
CH4: VFAULT, 5V/Div, DC
TIME: 200ms/Div
COUT =1µF, CIN =1µF, IOUT = 0.5A to 1.2A
CH1: IOUT, 0.5A/Div, DC
CH2: VOUT, 2V/Div, DC
CH3: VFAULT, 5V/Div, DC
TIME: 50µs/Div
Copyright  ANPEC Electronics Corp.
Rev. A,1 - Jun, 2008
8
www.anpec.com.tw
APL3204A/B
Pin Description
PIN
FUNCTION
NO.
NAME
1,2
IN
3
GND
5,6,12
NC
4
FAULT
7
EN
Enable Input. Pull this pin to high to disable the device and pull this pin to low to enable device.
8
BAT
Battery OVP Sense Pin. Connect to positive terminal of battery through a resistor.
9
ILIM
Over-current Protection Setting Pin. Connect a resistor to GND to set the over-current threshold.
10,11
OUT
Output Voltage Pin. The output voltage follows the input voltage when no fault is detected.
-
EP
Power Supply Input.
Ground.
No Connection.
Fault Indication Pin. This pin goes low when input OVP, OCP, or battery OVP is detected.
Exposed Thermal Pad. Must be electrically connected to the GND pin.
Block Diagram
OUT
IN
POR
ILIM
Charge
Pump
0.5V
Gate Driver and
Control Logic
1.2V
1V
BAT
FAULT
OTP
EN
Copyright  ANPEC Electronics Corp.
Rev. A,1 - Jun, 2008
GND
9
www.anpec.com.tw
APL3204A/B
Typical Application Circuit
5V Adapter/
USB
1, 2
IN
OUT
10, 11
1µF
Charger
1µF
APL3204A/B
FAULT
50K
4
VIO MCU
50K
7
GPIO
EN
25K
9
50K
8
ILIM
BAT
GND
100K
3
Li+
Battery
Figure 1. The Typical Protection Circuit for Charger Systems.
Copyright  ANPEC Electronics Corp.
Rev. A,1 - Jun, 2008
10
www.anpec.com.tw
APL3204A/B
Function Description
Power-Up
The APL3204A/B have a built-in power-on-reset circuit to
keep the output shuting off until internal circuitry is oper-
the internal power FET is turned off. When the BP voltage
returns below the battery OVP threshold minus the
ating properly. The POR circuit has hysteresis and a deglitch feature so that it will typically ignore undershoot
hysteresis, the FET is turned on again. The APL3204A/B
have a built-in counter. When the total count of battery
transients on the input. When input voltage exceeds the
POR threshold and after 8ms blanking time, the output
OVP fault reaches 16, the FET is turned off permanently,
requiring either a VIN POR or EN re-enable again to restart.
voltage starts a soft-start to reduce the inrush current.
Input Over-Voltage Protection (OVP)
Over-Temperature Protection
The input voltage is monitored by the internal OVP circuit.
When the junction temperature exceeds 140οC, the inter-
When the input voltage rises above the input OVP
threshold, the internal FET will be turned off within 1µs to
nal thermal sense circuit turns off the power FET and
allows the device to cool down. When the device’s junc-
protect connected system on OUT pin. When the input
voltage returns below the input OVP threshold minus the
tion temperature cools by 20οC, the internal thermal sense
circuit will enable the device, resulting in a pulsed output
hysteresis, the FET is turned on again after 8ms recovery
time. The input OVP circuit has a 200mV hysteresis and
during continuous thermal protection. Thermal protection is designed to protect the IC in the event of over tem-
a recovery time of TON(OVP) to provide noise immunity
against transient conditions.
perature conditions. For normal operation, the junction
temperature cannot exceed TJ=+125 οC.
Over-Current Protection (OCP)
FAULT Output
The output current is monitored by the internal OCP circuit.
The APL3204A/B provide an open-drain output to indi-
When the output current reaches the OCP threshold, the
device limits the output current at OCP threshold level. If
cate that a fault has occurred. When any of input OVP,
OCP, battery OVP, is detected, the FAULT goes low to
the OCP condition continues for a blanking time of TB(OCP),
the internal power FET is turned off. After the recovery
indicate that a fault has occurred. Since the FAULT pin is
an open-drain output, connecting a resistor to a pull high
time of TON(OCP), the FET will be turned on again and the
output current is monitored again. The APL3204A/B have
voltage is necessary.
a built-in counter. When the total count of OCP fault
reaches 16, the FET is turned off permanently, requiring
Enable/Shutdown
Pull the EN pin voltage above 1.4V to disable the device
either a VIN POR or EN re-enable again to restart. The
OCP threshold is programmed by a resistor RILIM con-
and pull EN pin voltage below 0.4V to enable the device.
The EN pin has an internal pull-down resistor and can be
nected from ILIM pin to GND. The OCP threshold is calculated by the following equation:
IOCP =
left floating. When the IC is latched off due to the total
count of OCP or battery OVP reaches 16, disable and re-
KILIM
RILIM
enable the device with the EN pin can clear the counter.
where
KILIM=25000AΩ
Battery Over-Voltage-Protection
The APL3204A/B monitor the BAT pin voltage for battery
over-voltage protection. The battery OVP threshold is internally set to 4.35V. When the BAT pin voltage exceeds
the battery OVP threshold for a blanking time of TB(BOVP),
Copyright  ANPEC Electronics Corp.
Rev. A,1 - Jun, 2008
11
www.anpec.com.tw
APL3204A/B
Function Description (Cont.)
VOVP
VPOR
VIN
VOUT
VFAULT
TB(IN)
TON(OVP)
Figure2. OVP Timing Chart
VOUT
OCP
Threshold
Count 13
times
IOUT
VFAULT
TB(OCP)
TON(OCP)
TB(OCP)
TB(OCP)
Total count 16
times IC is
latched off
Figure 3 OCP Timing Chart
Copyright  ANPEC Electronics Corp.
Rev. A,1 - Jun, 2008
12
www.anpec.com.tw
APL3204A/B
Function Description (Cont.)
VBAT
VBOVP
VBOVP
VBOVP
Count 13
times
VOUT
VFAULT
TB(BOVP)
TB(BOVP)
TB(BOVP)
Total count 16
times IC is
latched off
Figure 4. Battery OVP Timing Chart
Copyright  ANPEC Electronics Corp.
Rev. A,1 - Jun, 2008
13
www.anpec.com.tw
APL3204A/B
Application Information
RBAT Selection
RUP
FAULT
VIO
Connect the BAT pin to the positive terminal of battery
RFAULT
through a resistor RBAT for battery OVP function. The RBAT
limits the current flowing from BAT to battery in case of
GPIO
BAT pin is shorted to VIN pin under a failure mode. The
recommended value of RBAT is 100kΩ. In the worse case
EN
of an IC failure, the current flowing from the BAT pin to the
battery is:
BAT
REN
MCU
GPIO
RBAT
Li+
Battery
(30V-3V)/ 100kΩ =270µA
where the 30V is the maximum IN voltage and the 3V is
the minimum battery voltage. The current is so small and
can be absorbed by the charger system.
Figure 5. RUP, RFAULT, REN and RBAT
The disadvantage with the large RBAT is that the error of
the battery OVP threshold will be increased. The additional error is the voltage drop across the RBAT because
Capacitor Selection
The input capacitor is for decoupling and prevents the
of the BAT bias current. When RBAT is 100kΩ, the worsecase additional error is 100kΩx20nA=2mV, which is acceptable in most applications.
input voltage from overshooting to dangerous levels. In
the AC adapter hot plug-in applications or load current
REN Selection
step-down transient, the input voltage has a transient
spike due to the parasitic inductance of the input cable. A
For the same reason as the BAT pin case, the EN pin
25V, X5R, dielectric ceramic capacitor with a value be-
should be connected to the MCU GPIO pin through a
resistor. The value of the REN is dependent on the IO
tween 1µF and 4.7µF placed close to the IN pin is
recommended.
voltage of the MCU.
The output capacitor is for output voltage decoupling, and
also can be as the input capacitor of the charging circuit.
Since the IO voltage is divided by REN and EN internal pull
low resistor for EN voltage. It has to be ensured that the
At least, a 1µF, 10V, X5R capacitor is recommended.
EN voltage is above the EN logic high voltage when the
GPIO output of the MCU is high.
Layout Consideration
In some failure modes, a high voltage may be applied to
FAULT Output
Since the FAULT pin is an open-drain output, connecting
a resistor RUP to a pull high voltage is necessary. It is also
the device. Make sure the clearance constraint of the PCB
layout must satisfy the design rule for high voltage.
The exposed pad of the TDFN4x3-12 performs the func-
recommended that connect the FAULT to the MCU GPIO
through a resistor RFAULT. The RFAULT prevents damage to
tion of channeling heat away. It is recommended that
connect the exposed pad to a large copper ground plane
the MCU under a failure mode. The recommended value
of the resistors should be between 10kΩ to 100kΩ.
on the backside of the circuit board through several thermal vias to improve heat dissipation.
The input and output capacitors should be placed close
to the IC. RILIM also should be placed close to the IC.
The high current traces like input trace and output trace
must be wide and short.
Copyright  ANPEC Electronics Corp.
Rev. A,1 - Jun, 2008
14
www.anpec.com.tw
APL3204A/B
Package Information
TDFN4x3-12
E
b
D
A
E2
A1
Pin 1
Corner
e
D2
A3
L
S
Y
M
B
O
L
TDFN4x3-12
MILLIMETERS
INCHES
MIN.
MAX.
MIN.
MAX.
A
0.70
0.80
0.028
0.031
A1
0.00
0.05
0.000
0.002
0.30
0.007
3.70
0.118
A3
b
0.20 REF
0.18
D
D2
4.00 BSC
3.00
E
E2
0.008 REF
0.157 BSC
3.00 BSC
1.40
e
0.30
K
0.20
0.146
0.118 BSC
0.055
1.80
0.50 BSC
L
0.012
0.071
0.020 BSC
0.012
0.50
0.020
0.008
Note : Follow JEDEC MO-229 WGED-4.
Copyright  ANPEC Electronics Corp.
Rev. A,1 - Jun, 2008
15
www.anpec.com.tw
APL3204A/B
Carrier Tape & Reel Dimensions
P0
P2
P1
A
B0
W
F
E1
OD0
K0
A0
A
OD1 B
B
T
SECTION A-A
SECTION B-B
H
A
d
T1
Application
A
H
330.0±2.00 50 MIN.
TDFN3x4-12
T1
C
d
D
W
E1
12.4+2.00 13.0+0.50
-0.00
-0.20 1.5 MIN. 20.2 MIN. 12.0±0.30 1.75±0.10
P0
P1
P2
D0
D1
T
A0
4.0±0.20
8.0±0.10
2.0±0.05
1.5+0.10
-0.00
1.5 MIN.
0.6+0.00
-0.40
3.7±0.20
B0
F
5.5±0.05
K0
4.7±0.20 1.30±0.20
(mm)
Devices Per Unit
Package Type
Unit
Quantity
TDFN4x3-12
Tape & Reel
3000
Copyright  ANPEC Electronics Corp.
Rev. A,1 - Jun, 2008
16
www.anpec.com.tw
APL3204A/B
Reflow Condition
(IR/Convection or VPR Reflow)
tp
TP
Critical Zone
TL to TP
Ramp-up
Temperature
TL
tL
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25°C to Peak
Time
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B,A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
Description
245°C, 5 sec
1000 Hrs Bias @125°C
168 Hrs, 100%RH, 121°C
-65°C~150°C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms, 1tr > 100mA
Classification Reflow Profiles
Profile Feature
Average ramp-up rate
(TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classification Temperature (Tp)
Time within 5°C of actual
Peak Temperature (tp)
Ramp-down Rate
Time 25°C to Peak Temperature
Sn-Pb Eutectic Assembly
Pb-Free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
217°C
60-150 seconds
See table 1
See table 2
10-30 seconds
20-40 seconds
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Note: All temperatures refer to topside of the package. Measured on the body surface.
Copyright  ANPEC Electronics Corp.
Rev. A,1 - Jun, 2008
17
www.anpec.com.tw
APL3204A/B
Classification Reflow Profiles (Cont.)
Table 1. SnPb Eutectic Process – Package Peak Reflow Temperatures
Volume mm3
≥350
225 +0/-5°C
225 +0/-5°C
3
Package Thickness
<2.5 mm
≥2.5 mm
Volume mm
<350
240 +0/-5°C
225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Temperatures
3
3
3
Volume mm
Volume mm
Volume mm
<350
350-2000
>2000
<1.6 mm
260 +0°C*
260 +0°C*
260 +0°C*
1.6 mm – 2.5 mm
260 +0°C*
250 +0°C*
245 +0°C*
≥2.5 mm
250 +0°C*
245 +0°C*
245 +0°C*
* Tolerance: The device manufacturer/supplier shall assure process compatibility up to and including the stated
classification temperature (this means Peak reflow temperature +0°C. For example 260°C+0°C) at the rated MSL
level.
Package Thickness
Customer Service
Anpec Electronics Corp.
Head Office :
No.6, Dusing 1st Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
2F, No. 11, Lane 218, Sec 2 Jhongsing Rd.,
Sindian City, Taipei County 23146, Taiwan
Tel : 886-2-2910-3838
Fax : 886-2-2917-3838
Copyright  ANPEC Electronics Corp.
Rev. A,1 - Jun, 2008
18
www.anpec.com.tw
Similar pages