High Frequency Chip Inductor L1M SERIES 1. PART NO. EXPRESSION : (a) Series and Dimension code L1M-1N0S-10 (a) (b) (c) (d) 10 : RoHS Compliant (b) Inductance code : 1N0 = 1.0nH (d) (c) Inductance tolerance : S = ± 0.3nH , J = ± 5% , K = ± 10% 2. CONFIGURATION & DIMENSIONS : A D L H G B C PCB Pattern Unit:m/m A B C D 1.00± 0.10 0.50± 0.10 0.50± 0.10 0.25± 0.10 G H L 0.40 Ref. 0.55 Ref. 1.50 Ref. 3. MATERIALS : b a Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.) (a) Body : Ferrite (b) Termination : Ag/Ni/Sn 4. GENERAL SPECIFICATION : a) Storage temp. : -40° C to +105° C b) Operating temp. : -40° C to +105° C ( include self-temp. rise ) NOTE : Specifications subject to change without notice. Please check our website for latest information. 10.11.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 1 High Frequency Chip Inductor L1M SERIES 5. ELECTRICAL CHARACTERISTICS : DC Resistance (Ω) SRF (MHz) Rated Current ( mA ) Max. Min. Max. 5 0.10 12000 500 100 5 0.12 11500 500 1.2 100 5 0.12 11000 500 L1M-1N3S-10 1.3 100 5 0.15 10000 500 L1M-1N5S-10 1.5 100 6 0.15 9500 500 L1M-1N6S-10 1.6 100 6 0.17 9000 500 L1M-1N8S-10 1.8 100 6 0.17 8500 500 L1M-2N0S-10 2.0 100 6 0.18 8300 500 L1M-2N2S-10 2.2 100 6 0.18 8000 500 L1M-2N4S-10 2.4 100 6 0.20 7800 500 L1M-2N7S-10 2.7 100 6 0.20 7500 500 L1M-3N0S-10 3.0 100 6 0.22 7200 400 L1M-3N3S-10 3.3 100 6 0.22 7000 400 L1M-3N6S-10 3.6 100 6 0.25 6800 400 L1M-3N9S-10 3.9 100 6 0.25 6500 400 L1M-4N3S-10 4.3 100 6 0.28 6300 400 L1M-4N7S-10 4.7 100 6 0.28 6000 400 L1M-5N1S-10 5.1 100 6 0.30 5800 400 L1M-5N6S-10 5.6 100 6 0.30 5700 400 L1M-6N2S-10 6.2 100 6 0.35 5600 400 L1M-6N8□-10 6.8 100 6 0.35 5500 400 Inductance ( nH ) Test Frequency ( MHz ) Q Min. L1M-1N0S-10 1.0 100 L1M-1N1S-10 1.1 L1M-1N2S-10 Part Number L1M-7N5□-10 7.5 100 6 0.38 5000 350 L1M-8N2□-10 8.2 100 6 0.38 5000 350 L1M-9N1□-10 9.1 100 6 0.42 4800 350 L1M-10N□-10 10 100 6 0.42 4700 350 L1M-12N□-10 12 100 6 0.47 4300 350 L1M-15N□-10 15 100 6 0.50 4000 300 L1M-18N□-10 18 100 6 0.60 4000 250 L1M-22N□-10 22 100 6 0.70 3500 200 L1M-27N□-10 27 100 6 0.80 3000 200 L1M-33N□-10 33 100 6 0.90 2500 200 L1M-39N□-10 39 100 6 1.00 2000 200 L1M-47N□-10 47 100 6 1.20 1800 200 NOTE : Specifications subject to change without notice. Please check our website for latest information. 10.11.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 High Frequency Chip Inductor L1M SERIES 5. ELECTRICAL CHARACTERISTICS : DC Resistance (Ω) SRF (MHz) Rated Current ( mA ) Max. Min. Max. 6 1.30 1500 200 100 6 1.50 1400 150 82 100 6 1.80 1300 150 L1M-R10□-10 100 100 6 2.20 1100 100 L1M-R11□-10 110 100 6 2.70 1100 100 L1M-R12□-10 120 100 6 3.00 1100 100 Inductance ( nH ) Test Frequency ( MHz ) Q Min. L1M-56N□-10 56 100 L1M-68N□-10 68 L1M-82N□-10 Part Number □ : J = ±5% , K = ±10% NOTE : Specifications subject to change without notice. Please check our website for latest information. 10.11.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 High Frequency Chip Inductor L1M SERIES 6. CHARACTERISTICS CURVES : Inductance v.s. Frequency Characteristics MGI1005F L VS Freq. 1000 INDUCTANCE(nH) 100n 100 33n 10n 10 4.7n 2.2n 1 1.0n 0.1 10 100 1000 10000 FREQUENCY(MHz) Q v.s. Frequency Characteristics MGI1005F Q VS Freq. Q 100 10 33n 10n 4.7n 100n 2.2n 1.0n 1 10 100 1000 10000 FREQUENCY(MHz) NOTE : Specifications subject to change without notice. Please check our website for latest information. 10.11.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 High Frequency Chip Inductor L1M SERIES 7. RELIABILITY & TEST CONDITION : ITEM PERFORMANCE TEST CONDITION Electrical Characteristics Test Q Factor Agilent E4991 Agilent4287 Agilent16192 DC Resistance Agilent 4338 Rated Current DC Power Supply Over Rated Current requirements, there will be some risk Refer to standard electrical characteristics list Inductance (Ls) Temperature Rise Test Solder Heat Resistance Rated Current < 1A ΔT 20°C Max 1. Applied the allowed DC current. Rated Current ≧ 1A ΔT 40°C Max 2. Temperature measured by digital surface thermometer. No mechanical damage. Remaining terminal electrode : 75% min. Preheat : 150° C, 60sec. Solder : Sn-Cu0.5 Solder Temperature : 260± 5° C Flux for lead free: ROL0 Dip Time : 10± 0.5sec. Preheating Dipping 260° C 150° C Solderability 60 seconds 10± 0.5 seconds Preheat : 150° C, 60sec. Solder : Sn-Cu0.5 Solder Temperature : 245± 5° C Flux for lead free: ROL0 Dip Time : 4± 1sec. More than 95% of the terminal electrode should be covered with solder. Preheating Dipping 245° C 150° C Terminal Strength Natural cooling 60 seconds Natural cooling 4± 1.0 seconds The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. W Flexture Strength The terminal electrode & the dielectric must not be damaged by the forces applied on the right conditions. For L Series : Size Force (Kfg) 1 0.2 2 0.5 3 0.6 4 1.0 5 1.0 6 1.0 7 1.5 Time (sec) > 30 Solder a chip on a test substrate, bend the substrate by 2mm (0.079in) and return. The duration of the applied forces shall be 60 (+ 5) Sec. 20(.787) Bending 45(1.772) 45(1.772) 40(1.575) 100(3.937) NOTE : Specifications subject to change without notice. Please check our website for latest information. 10.11.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 High Frequency Chip Inductor L1M SERIES 7. RELIABILITY & TEST CONDITION : ITEM Bending Strength PERFORMANCE TEST CONDITION The ferrite should not be damaged by forces applied on the right condition. Series name mm (inches) P-Kgf 2 0.80 (0.033) 0.3 3 1.40 (0.055) 1.0 2.00 (0.079) 2.5 2.70 (0.106) 2.5 1.0(0.039) R0.5(0.02) 4 5 Chip 6 A 7 Random Vibration Test Appearance : Cracking, shipping & any other defects harmful to the characteristics should not be allowed. Frequency : 10-55-10Hz for 15 min. Amplitude : 1.52mm Directions & times : X, Y, Z directions for 15 min. This cycle shall be performed 12 times in each of three mutually perpendicular directions (Total 9hours). Life testing at High Temperature Appearance : No damage. Inductance : within± 10%of initial value. Q : within± 20%of initial value. Temperature : 105± 2° C Applied Current : rated current Duration : 1008± 12hrs Measured at room temperature after placing for 2 to 3hrs. Humidity Humidity : 90~95% RH. Temperature : 60± 2° C Duration : 504± 8hrs Measured at room temperature after placing for 2 to 3hrs. Thermal Shock Appearance : No damage. Inductance : within± 10%of initial value. Q: within± 20%of initial value. Low temperature storage test Drop Phase Temperature (° C) Times (min.) 1 -40± 2° C 30± 5 2 room temp. ≦ 0.5 3 +105± 2° C 30± 5 Measured : 500 times Drop 10 times on a concrete floor from a height of 75cm. Condition for 1 cycle Step1 : -40± 2° C 30± 5 min. Step2 : +105± 2° C 30± 5 min. Number of cycles : 500 Measured at room temperature after placing for 2 to 3hrs. Temperature : -40± 2° C Duration : 500± 8hrs Measured at room temperature after placing for 2 to 3hrs. a. No mechanical damage b. Inductance change: Within ± 30%. Derating Derating Curve For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85° C, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve. Derated Current(A) 6 5 4 3 2 1 0 6A 5A 4A 3A 2A 1.5A 1A 85 125 Operating Temperature(?C) Operating Temperature(℃) NOTE : Specifications subject to change without notice. Please check our website for latest information. 10.11.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 High Frequency Chip Inductor L1M SERIES 8. SOLDERING AND MOUNTING : 8-1. Recommended PC Board Pattern 1.50 PC board should be designed so that products are not sufficient under mechanical stress as warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. 0.55 0.40 8-2. Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. The terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Note. If Use Wave soldering is there will be some risk. Re-flow soldering temperatures below 240 degrees, there will be unwitting risk 8-2.1 Lead Free Solder Re-flow : Recommended temperature profiles for re-flow soldering in Figure 1. 8-2.3 Soldering Iron : Products attachment with soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2. Note : d) 1.0mm tip diameter (max) a) Preheat circuit and products to 150° C. e) Use a 20 watt soldering iron with tip diameter of 1.0mm b) 350° C tip temperature (max) f) Limit soldering time to 4~5sec. c) Never contact the ceramic with the iron tip Soldering Natural cooling 20~40s TP(26 0° C/40 s max.) 217 200 150 60~150s 60~180s 25 4 80s max. Preheating TEMPERATURE ° C TEMPERATURE ° C Preheating Within 4-5s Natural cooling 350 150 Time(sec.) Figure 1. Re-flow Soldering : 3 times max Soldering O ve r 1min. G rad ual Cooling Figure 2. Iron Soldering times：1 times max NOTE : Specifications subject to change without notice. Please check our website for latest information. 10.11.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 High Frequency Chip Inductor L1M SERIES 8-3. Solder Volume Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4. Minimum fillet height = soldering thickness + 25% product height Upper limit t Recommendable Figure 4 NOTE : Specifications subject to change without notice. Please check our website for latest information. 10.11.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8 High Frequency Chip Inductor L1M SERIES 9. PACKAGING INFORMATION : 9-1. Reel Dimension C(mm) D(mm) Type A(mm) B(mm) 7" x 8mm 9.0± 0.5 60.0± 2.0 13.5± 0.5 178.0± 2.0 7" x 12mm 13.5± 0.5 60.0± 2.0 13.5± 0.5 178.0± 2.0 C D B A 2± 0.5 7" x 8mm 13.5± 0.5 7" x 12mm R10.5 R1.9 R0.5 120° 9-2 Tape Dimension / 8mm Material of taping is paper Po:4± 0.1 +0.1 -0.00 t Bo P W:8.0± 0.3 D:1.50 F:3.5± 0.1 E:1.75± 0.1 P2:2± 0.1 Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) L 0 0.68± 0.05 0.38± 0.05 0.50max 2.0± 0.05 0.50max none Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 1 1.12± 0.03 0.62± 0.03 0.60± 0.03 2.0± 0.1 0.60± 0.03 none 2 1.85± 0.05 1.05± 0.05 0.95± 0.05 4.0± 0.1 0.95± 0.05 none 3(09) 2.30± 0.05 1.50± 0.05 0.95± 0.05 4.0± 0.1 0.95± 0.05 none Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 2 1.95± 0.10 1.05± 0.10 1.05± 0.10 4.0± 0.1 0.23± 0.05 none 3(09) 2.25± 0.10 1.42± 0.10 1.04± 0.10 4.0± 0.1 0.22± 0.05 1.0± 0.10 3(12) 2.35± 0.10 1.50± 0.10 1.45± 0.10 4.0± 0.1 0.22± 0.05 1.0± 0.10 4(11) 3.50± 0.10 1.88± 0.10 1.27± 0.10 4.0± 0.1 0.22± 0.05 1.0± 0.10 5 3.42± 0.10 2.77± 0.10 1.55± 0.10 4.0± 0.1 0.22± 0.05 1.0± 0.10 4(09) 3.40± 0.10 1.77± 0.10 1.04± 0.10 4.0± 0.1 0.22± 0.05 1.0± 0.10 Ko Ao Po:4± 0.1 +0.1 -0.05 t Bo P W:8.0± 0.1 D:1.56 F:3.5± 0.1 E:1.75± 0.1 P2:2± 0.1 L Ko Ao Material of taping is plastic Po:4± 0.1 D:1.5+0.1 t Series P A D1:1± 0.1 Ao Bo W:8.0± 0.1 A F:3.5± 0.05 E:1.75± 0.1 P2:2± 0.05 Ko Section A-A L NOTE : Specifications subject to change without notice. Please check our website for latest information. 10.11.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 9 High Frequency Chip Inductor L1M SERIES 9-2.1 Tape Dimension / 12mm Po:4± 0.1 P2:2± 0.05 t A P A Ao Size Bo(mm) Ao(mm) Ko(mm) P(mm) t(mm) D1(mm) 6 4.95± 0.1 1.93± 0.1 1.93± 0.1 4.0± 0.1 0.24± 0.05 1.5± 0.1 7 4.95± 0.1 3.66± 0.1 1.85± 0.1 8.0± 0.1 0.24± 0.05 1.5± 0.1 L Bo W:12.0± 0.1 Series F:5.5± 0.05 E:1.75± 0.1 D:1.5+0.1 Ko Section A-A D1:1.5± 0.1 9-3. Packaging Quantity Chip Size 7 6 5 4(11) 4(09) 3(12) 3(09) 2 1 0 Chip / Reel 1000 2000 2500 3000 3000 2000 4000 4000 10000 15000 Inner Box 4000 8000 12500 15000 15000 10000 20000 20000 50000 75000 Middle Box 20000 40000 62500 75000 75000 50000 100000 100000 250000 375000 Carton 40000 80000 125000 150000 150000 100000 200000 200000 500000 750000 Bulk (Bags) 12000 20000 30000 50000 50000 100000 150000 200000 300000 - 9-4. Tearing Off Force The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. F 165° to 180° Top cover tape Room Temp. (° C) Room Humidity (%) Room atm (hPa) Tearing Speed (mm/min) 5~35 45~85 860~1060 300 Base tape Application Notice 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : -10~ 40° C and 30~70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. 2. Transportation : a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. NOTE : Specifications subject to change without notice. Please check our website for latest information. 10.11.2011 SUPERWORLD ELECTRONICS (S) PTE LTD PG. 10