ATMEL AT25F1024 Byte mode and 256-byte page mode for program operation Datasheet

Features
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Serial Peripheral Interface (SPI) Compatible
Supports SPI Modes 0 (0,0) and 3 (1,1)
20 MHz Clock Rate
Byte Mode and 256-byte Page Mode for Program Operations
Sector Architecture:
– Two Sectors with 32K Bytes Each (512K)
– Four Sectors with 32K Bytes Each (1M)
– 128 Pages per Sector
Product Identification Mode
Low-voltage Operation
– 2.7 (VCC = 2.7V to 3.6V)
Sector Write Protection
Write Protect (WP) Pin and Write Disable Instructions for
both Hardware and Software Data Protection
Self-timed Program Cycle (60 µs/Byte Typical)
Self-timed Sector Erase Cycle (1 second/Sector Typical)
Single Cycle Reprogramming (Erase and Program) for Status Register
High Reliability
– Endurance: 10,000 Write Cycles Typical
Lead-free Devices Available
8-lead JEDEC SOIC and 8-lead SAP Packages
SPI Serial
Memory
512K (65,536 x 8)
1M (131,072 x 8)
AT25F512
AT25F1024
Description
The AT25F512/1024 provides 524,288/1,048,576 bits of serial reprogrammable Flash
memory organized as 65,536/131,072 words of 8 bits each. The device is optimized
for use in many industrial and commercial applications where low-power and low-voltage operation are essential. The AT25F512/1024 is available in a space-saving 8-lead
JEDEC SOIC and 8-lead SAP packages.
The AT25F512/1024 is enabled through the Chip Select pin (CS) and accessed via a
3-wire interface consisting of Serial Data Input (SI), Serial Data Output (SO), and
Serial Clock (SCK). All write cycles are completely self-timed.
BLOCK WRITE protection for top 1/4, top 1/2 or the entire memory array (1M) or
entire memory array (512K) is enabled by programming the status register. Separate
write enable and write disable instructions are provided for additional data protection.
Hardware data protection is provided via the WP pin to protect against inadvertent
write attempts to the status register. The HOLD pin may be used to suspend any serial
communication without resetting the serial sequence.
Pin Configurations
Pin Name
Function
CS
Chip Select
SCK
Serial Data Clock
SI
Serial Data Input
SO
Serial Data Output
GND
Ground
VCC
Power Supply
WP
Write Protect
HOLD
Suspends Serial Input
8-lead SOIC
CS
SO
WP
GND
1
2
3
4
VCC
HOLD
SCK
SI
8
7
6
5
8-lead SAP
VCC
HOLD
SCK
SI
8
7
6
5
1
2
3
4
CS
SO
WP
GND
Bottom View
Rev. 1440P–SEEPR–6/04
1
Absolute Maximum Ratings*
Operating Temperature........................................−40°C to +85°C
Storage Temperature .........................................−65°C to +150°C
Voltage on Any Pin
with Respect to Ground ........................................ −1.0V to +3.6V
Maximum Operating Voltage ............................................ 3.6V
*NOTICE:
Stresses beyond those listed under “Absolute
Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these or any
other conditions beyond those indicated in the
operational sections of this specification is not
implied. Exposure to absolute maximum rating
conditions for extended periods may affect
device reliability.
DC Output Current........................................................ 5.0 mA
Block Diagram
65,536 x 8
or
131,072 x 8
2
AT25F512/1024
1440P–SEEPR–6/04
AT25F512/1024
Pin Capacitance(1)
Applicable over recommended operating range from TA = 25°C, f = 1.0 MHz, VCC = +3.6V (unless otherwise noted).
Symbol
Test Conditions
COUT
Output Capacitance (SO)
CIN
Note:
Max
Units
Conditions
8
pF
VOUT = 0V
6
pF
VIN = 0V
Input Capacitance (CS, SCK, SI, WP, HOLD)
1. This parameter is characterized and is not 100% tested.
DC Characteristics
Applicable over recommended operating range from: TAI = -40°C to +85°C, VCC = +2.7V to +3.6V,
TAC = 0°C to +70°C, VCC = +2.7V to +3.6V (unless otherwise noted).
Symbol
Parameter
Max
Units
VCC
Supply Voltage
3.6
V
ICC1
Supply Current
VCC = 3.6V at 20 MHz, SO = Open Read
10.0
15.0
mA
ICC2
Supply Current
VCC = 3.6V at 20 MHz, SO = Open Write
15.0
30.0
mA
ISB
Standby Current
VCC = 2.7V, CS = VCC
2.0
10.0
µA
IIL
Input Leakage
VIN = 0V to VCC
-3.0
3.0
µA
IOL
Output Leakage
VIN = 0V to VCC, TAC = 0°C to 70°C
-3.0
3.0
µA
VIL(1)
Input Low Voltage
-0.6
VCC x 0.3
V
VIH(1)
Input High Voltage
VCC x 0.7
VCC + 0.5
V
VOL
Output Low Voltage
0.2
V
VOH
Output High Voltage
Note:
Test Condition
Min
Typ
2.7
2.7V ≤ VCC ≤ 3.6V
IOL = 0.15 mA
IOH = -100 µA
VCC - 0.2
V
1. VIL and VIH max are reference only and are not tested.
3
1440P–SEEPR–6/04
AC Characteristics
Applicable over recommended operating range from TAI = -40°C to +85°C, VCC = +2.7V to +3.6V
CL = 1 TTL Gate and 30 pF (unless otherwise noted).
Symbol
Parameter
fSCK
SCK Clock Frequency
tRI
Max
Units
20
MHz
Input Rise Time
20
ns
tFI
Input Fall Time
20
ns
tWH
SCK High Time
20
ns
tWL
SCK Low Time
20
ns
tCS
CS High Time
25
ns
tCSS
CS Setup Time
25
ns
tCSH
CS Hold Time
25
ns
tSU
Data In Setup Time
5
ns
tH
Data In Hold Time
5
ns
tHD
Hold Setup Time
15
ns
tCD
Hold Time
15
ns
tV
Output Valid
tHO
Output Hold Time
tLZ
Hold to Output Low Z
200
ns
tHZ
Hold to Output High Z
200
ns
tDIS
Output Disable Time
100
ns
tEC
Erase Cycle Time per Sector
1.1
s
tBPC
Byte Program Cycle Time(1)
100
µs
60
ms
tSR
Endurance
4
Typ
0
20
0
ns
ns
60
Status Register Write Cycle Time
(2)
Notes:
Min
10K
Write Cycles(3)
1. The programming time for n bytes will be equal to n x tBPC.
2. This parameter is characterized at 3.0V, 25°C and is not 100% tested.
3. One write cycle consists of erasing a sector, followed by programming the same sector.
AT25F512/1024
1440P–SEEPR–6/04
AT25F512/1024
Serial Interface
Description
MASTER: The device that generates the serial clock.
SLAVE: Because the Serial Clock pin (SCK) is always an input, the AT25F512/1024
always operates as a slave.
TRANSMITTER/RECEIVER: The AT25F512/1024 has separate pins designated for
data transmission (SO) and reception (SI).
MSB: The Most Significant Bit (MSB) is the first bit transmitted and received.
SERIAL OP-CODE: After the device is selected with CS going low, the first byte will be
received. This byte contains the op-code that defines the operations to be performed.
INVALID OP-CODE: If an invalid op-code is received, no data will be shifted into the
AT25F512/1024, and the serial output pin (SO) will remain in a high impedance state
until the falling edge of CS is detected again. This will reinitialize the serial
communication.
CHIP SELECT: The AT25F512/1024 is selected when the CS pin is low. When the
device is not selected, data will not be accepted via the SI pin, and the serial output pin
(SO) will remain in a high impedance state.
HOLD: The HOLD pin is used in conjunction with the CS pin to select the
AT25F512/1024. When the device is selected and a serial sequence is underway,
HOLD can be used to pause the serial communication with the master device without
resetting the serial sequence. To pause, the HOLD pin must be brought low while the
SCK pin is low. To resume serial communication, the HOLD pin is brought high while the
SCK pin is low (SCK may still toggle during HOLD). Inputs to the SI pin will be ignored
while the SO pin is in the high impedance state.
WRITE PROTECT: The 25F512/1024 has a write lockout feature that can be activated
by asserting the write protect pin (WP). When the lockout feature is activated, locked-out
sectors will be READ only. The write protect pin will allow normal read/write operations
when held high. When the WP is brought low and WPEN bit is “1”, all write operations to
the status register are inhibited. WP going low while CS is still low will interrupt a write to
the status register. If the internal status register write cycle has already been initiated,
WP going low will have no effect on any write operation to the status register. The WP
pin function is blocked when the WPEN bit in the status register is “0”. This will allow the
user to install the AT25F512/1024 in a system with the WP pin tied to ground and still be
able to write to the status register. All WP pin functions are enabled when the WPEN bit
is set to “1”.
5
1440P–SEEPR–6/04
SPI Serial Interface
MASTER:
MICROCONTROLLER
DATA OUT (MOSI)
DATA IN (MISO)
SERIAL CLOCK (SPI CK)
SS0
SS1
SS2
SS3
SLAVE:
AT25F512/1024
SI
SO
SCK
CS
SI
SO
SCK
CS
SI
SO
SCK
CS
SI
SO
SCK
CS
6
AT25F512/1024
1440P–SEEPR–6/04
AT25F512/1024
Functional
Description
The AT25F512/1024 is designed to interface directly with the synchronous serial peripheral interface (SPI) of the 6800 type series of microcontrollers.
The AT25F512/1024 utilizes an 8-bit instruction register. The list of instructions and their
operation codes are contained in Table 1. All instructions, addresses, and data are
transferred with the MSB first and start with a high-to-low transition.
Write is defined as program and/or erase in this specification. The following commands,
PROGRAM, SECTOR ERASE, CHIP ERASE, and WRSR are write instructions for
AT25F512/1024.
Table 1. Instruction Set for the AT25F512/1024
Instruction Name
Instruction
Format
Operation
WREN
0000 X110
Set Write Enable Latch
WRDI
0000 X100
Reset Write Enable Latch
RDSR
0000 X101
Read Status Register
WRSR
0000 X001
Write Status Register
READ
0000 X011
Read Data from Memory Array
PROGRAM
0000 X010
Program Data Into Memory Array
SECTOR ERASE
0101 X010
Erase One Sector in Memory Array
CHIP ERASE
0110 X010
Erase All Sectors in Memory Array
RDID
0001 X101
Read Manufacturer and Product ID
WRITE ENABLE (WREN): The device will power up in the write disable state when VCC
is applied. All write instructions must therefore be preceded by the WREN instruction.
WRITE DISABLE (WRDI): To protect the device against inadvertent writes, the WRDI
instruction disables all write commands. The WRDI instruction is independent of the status of the WP pin.
READ STATUS REGISTER (RDSR): The RDSR instruction provides access to the status register. The READY/BUSY and write enable status of the device can be determined
by the RDSR instruction. Similarly, the Block Write Protection bits indicate the extent of
protection employed. These bits are set by using the WRSR instruction. During internal
write cycles, all other commands will be ignored except the RDSR instruction.
Table 2. Status Register Format
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
Bit 0
WPEN
X
X
X
BP1
BP0
WEN
RDY
7
1440P–SEEPR–6/04
Table 3. Read Status Register Bit Definition
Bit
Definition
Bit 0 (RDY)
Bit 0 = 0 (RDY) indicates the device is READY. Bit 0 = 1 indicates the
write cycle is in progress.
Bit 1 (WEN)
Bit 1 = 0 indicates the device is not WRITE ENABLED. Bit 1 = 1 indicates
the device is WRITE ENABLED.
Bit 2 (BP0)
See Table 4.
Bit 3 (BP1)
See Table 4.
Bits 4-6 are 0s when device is not in an internal write cycle.
Bit 7 (WPEN)
See Table 5.
Bits 0-7 are 1s during an internal write cycle.
READ PRODUCT ID (RDID): The RDID instruction allows the user to read the manufacturer and product ID of the device. The first byte after the instruction will be the
manufacturer code (1FH = ATMEL), followed by the device code.
WRITE STATUS REGISTER (WRSR): The WRSR instruction allows the user to select
one of four levels of protection for the AT25F1024. The AT25F1024 is divided into four
sectors where the top quarter (1/4), top half (1/2), or all of the memory sectors can be
protected (locked out) from write. The AT25F512 is divided into 2 sectors where all of
the memory sectors can be protected (locked out) from write. Any of the locked-out sectors will therefore be READ only. The locked-out sector and the corresponding status
register control bits are shown in Table 4.
The three bits, BP0, BP1, and WPEN, are nonvolatile cells that have the same properties and functions as the regular memory cells (e.g., WREN, tWC, RDSR).
Table 4. Block Write Protect Bits
Status Register Bits
Level
BP1
BP0
0
0
0
1(1/4)
0
1
2(1/2)
1
0
3(All)
1
1
8
AT25F512
Array Addresses
Locked Out
None
000000 - 00FFFF
AT25F1024
Locked-out
Sector(s)
None
All sectors
(1 - 2)
Array Addresses
Locked Out
Locked-out
Sector(s)
None
None
018000 - 01FFFF
Sector 4
010000 - 01FFFF
Sector 3, 4
000000 - 01FFFF
All sectors
(1 - 4)
AT25F512/1024
1440P–SEEPR–6/04
AT25F512/1024
The WRSR instruction also allows the user to enable or disable the Write Protect (WP)
pin through the use of the Write Protect Enable (WPEN) bit. Hardware write protection is
enabled when the WP pin is low and the WPEN bit is “1”. Hardware write protection is
disabled when either the WP pin is high or the WPEN bit is “0.” When the device is hardware write protected, writes to the Status Register, including the Block Protect bits and
the WPEN bit, and the locked-out sectors in the memory array are disabled. Write is
only allowed to sectors of the memory which are not locked out. The WRSR instruction
is self-timed to automatically erase and program BP0, BP1, and WPEN bits. In order to
write the status register, the device must first be write enabled via the WREN instruction.
Then, the instruction and data for the three bits are entered. During the internal write
cycle, all instructions will be ignored except RDSR instructions. The AT25F512/1024 will
automatically return to write disable state at the completion of the WRSR cycle.
Note:
When the WPEN bit is hardware write protected, it cannot be changed back to “0”, as
long as the WP pin is held low.
Table 5. WPEN Operation
WPEN
WP
WEN
ProtectedBlocks
UnprotectedBlocks
Status Register
0
X
0
Protected
Protected
Protected
0
X
1
Protected
Writable
Writable
1
Low
0
Protected
Protected
Protected
1
Low
1
Protected
Writable
Protected
X
High
0
Protected
Protected
Protected
X
High
1
Protected
Writable
Writable
READ* (READ): Reading the AT25F512/1024 via the SO (Serial Output) pin requires
the following sequence. After the CS line is pulled low to select a device, the READ
instruction is transmitted via the SI line followed by the byte address to be read (Refer to
Table 6). Upon completion, any data on the SI line will be ignored. The data (D7-D0) at
the specified address is then shifted out onto the SO line. If only one byte is to be read,
the CS line should be driven high after the data comes out. The READ instruction can
be continued since the byte address is automatically incremented and data will continue
to be shifted out. For the AT25F1024, when the highest address is reached, the address
counter will roll over to the lowest address allowing the entire memory to be read in one
continuous READ instruction. For the AT25F512, the read command must be terminated when the highest address (00FFFF) is reached.
PROGRAM (PROGRAM): In order to program the AT25F512/1024, two separate
instructions must be executed. First, the device must be write enabled via the WREN
instruction. Then the PROGRAM instruction can be executed. Also, the address of the
memory location(s) to be programmed must be outside the protected address field location selected by the Block Write Protection Level. During an internal self-timed
programming cycle, all commands will be ignored except the RDSR instruction.
The PROGRAM instruction requires the following sequence. After the CS line is pulled
low to select the device, the PROGRAM instruction is transmitted via the SI line followed
by the byte address and the data (D7-D0) to be programmed (Refer to Table 6). Programming will start after the CS pin is brought high. The low-to-high transition of the CS
pin must occur during the SCK low time immediately after clocking in the D0 (LSB) data
bit.
9
1440P–SEEPR–6/04
The READY/BUSY status of the device can be determined by initiating a RDSR instruction. If Bit 0 = 1, the program cycle is still in progress. If Bit 0 = 0, the program cycle has
ended. Only the RDSR instruction is enabled during the program cycle.
A single PROGRAM instruction programs 1 to 256 consecutive bytes within a page if it
is not write protected. The starting byte could be anywhere within the page. When the
end of the page is reached, the address will wrap around to the beginning of the same
page. If the data to be programmed are less than a full page, the data of all other bytes
on the same page will remain unchanged. If more than 256 bytes of data are provided,
the address counter will roll over on the same page and the previous data provided will
be replaced. The same byte cannot be reprogrammed without erasing the whole sector
first. The AT25F512/1024 will automatically return to the write disable state at the completion of the PROGRAM cycle.
Note:
If the device is not write enabled (WREN), the device will ignore the Write instruction and
will return to the standby state, when CS is brought high. A new CS falling edge is
required to re-initiate the serial communication.
Table 6. Address Key
Address
AT25F512
AT25F1024
AN
A15 - A0
A16 - A0
Zeros
Don’t Care Bits
Note:
A16
(1)
A23 - A17
A23 - A17
1. For the AT25F512, A16 must be set to zero. If A16 of the AT25F512 is set to ONE,
READ data out are undetermined and PROGRAM, SECTOR ERASE and CHIP
ERASE may incur busy cycles.
SECTOR ERASE (SECTOR ERASE): Before a byte can be reprogrammed, the sector
which contains the byte must be erased. In order to erase the AT25F512/1024, two separate instructions must be executed. First, the device must be write enabled via the
WREN instruction. Then the SECTOR ERASE instruction can be executed.
Table 7. Sector Addresses
Sector Address
AT25F512 Sector
AT25F1024 Sector
000000 to 007FFF
Sector 1
Sector 1
008000 to 00FFFF
Sector 2
Sector 2
010000 to 017FFF
N/A
Sector 3
018000 to 01FFFF
N/A
Sector 4
The SECTOR ERASE instruction erases every byte in the selected sector if the sector is
not locked out. Sector address is automatically determined if any address within the sector is selected. The SECTOR ERASE instruction is internally controlled; it will
automatically be timed to completion. During this time, all commands will be ignored,
except RDSR instruction. The AT25F512/1024 will automatically return to the write disable state at the completion of the SECTOR ERASE cycle.
CHIP ERASE (CHIP ERASE): As an alternative to the SECTOR ERASE, the CHIP
ERASE instruction will erase every byte in all sectors that are not locked out. First, the
device must be write enabled via the WREN instruction. Then the CHIP ERASE instruction can be executed. The CHIP ERASE instruction is internally controlled; it will
automatically be timed to completion. The CHIP ERASE cycle time typically is 3.5 seconds. During the internal erase cycle, all instructions will be ignored except RDSR. The
AT25F512/1024 will automatically return to the write disable state at the completion of
the CHIP ERASE cycle.
10
AT25F512/1024
1440P–SEEPR–6/04
AT25F512/1024
Timing Diagrams (for SPI Mode 0 (0, 0))
Synchronous Data Timing
t CS
VIH
CS
VIL
t CSH
t CSS
VIH
t WH
SCK
t WL
VIL
tH
t SU
VIH
SI
VALID IN
VIL
tV
VOH
SO
HI-Z
t HO
t DIS
HI-Z
VOL
WREN Timing
WRDI Timing
11
1440P–SEEPR–6/04
RDSR Timing
CS
0
1
2
3
4
5
6
7
8
9
10
7
6
5
11
12
13
14
15
2
1
0
SCK
INSTRUCTION
SI
DATA OUT
HIGH IMPEDANCE
SO
4
3
MSB
WRSR Timing
READ Timing
CS
0
1
2
3
4
5
6
7
8
9 10 11 28 29 30 31 32 33 34 35 36 37 38 39
SCK
3-BYTE ADDRESS
SI
SO
12
INSTRUCTION
HIGH IMPEDANCE
23 22 21 ...
3
2
1
0
7
6
5
4
3
2
1
0
AT25F512/1024
1440P–SEEPR–6/04
AT25F512/1024
PROGRAM Timing
4
5
6
7
8
9
10 11 28 29 30 31 32 33 34
2079
3
2078
2
2077
1
2076
0
2075
CS
SCK
256th BYTE DATA-IN
1st BYTE DATA-IN
3-BYTE ADDRESS
SI
INSTRUCTION
23 22 21
3
2
1
0
7
6
5
4
3
2
1
0
HIGH IMPEDANCE
SO
HOLD Timing
CS
tCD
tCD
SCK
tHD
tHD
HOLD
tHZ
SO
tLZ
SECTOR ERASE Timing
X
X = Don’t Care bit
13
1440P–SEEPR–6/04
CHIP ERASE Timing
X
X = Don’t Care bit
RDID Timing
12 13 14 15 16 17 18 19
23
X
MANUFACTURER
CODE (ATMEL)
14
DEVICE CODE
AT25F512/1024
1440P–SEEPR–6/04
AT25F512/1024
Ordering Information
Ordering Code
Package
Operation Range
AT25F512N-10SI-2.7
8S1
Industrial
(-40°C to 85°C)
AT25F1024N-10SI-2.7
8S1
Industrial
(-40°C to 85°C)
AT25F512N-10SU-2.7
AT25F512Y4-10YU-2.7
8S1
8Y4
Lead-free/Halogen Free/Industrial Temperatures
(-40°C to 85°C)
AT25F1024N-10SU-2.7
AT25F1024Y4-10YU-2.7
8S1
8Y4
Lead-free/Halogen Free/Industrial Temperatures
(-40°C to 85°C)
Package Type
8S1
8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC)
8Y4
8-lead, 6.00 mm x 4.90 mm Body, Dual Footprint, Non-leaded, Small Array Package (SAP)
Options
-2.7
Low-voltage (2.7V to 3.6V)
15
1440P–SEEPR–6/04
Package Drawing
8S1 – JEDEC SOIC
C
1
E
E1
L
N
∅
Top View
End View
e
B
COMMON DIMENSIONS
(Unit of Measure = mm)
A
A1
D
Side View
SYMBOL
MIN
NOM
MAX
A
1.35
–
1.75
A1
0.10
–
0.25
b
0.31
–
0.51
C
0.17
–
0.25
D
4.80
–
5.00
E1
3.81
–
3.99
E
5.79
–
6.20
e
NOTE
1.27 BSC
L
0.40
–
1.27
∅
0˚
–
8˚
Note: These drawings are for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc.
10/7/03
R
16
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80906
TITLE
8S1, 8-lead (0.150" Wide Body), Plastic Gull Wing
Small Outline (JEDEC SOIC)
DRAWING NO.
8S1
REV.
B
AT25F512/1024
1440P–SEEPR–6/04
AT25F512/1024
8Y4 – SAP
PIN 1 INDEX AREA
A
D1
PIN 1 ID
D
E1
L
A1
E
e
b
e1
A
COMMON DIMENSIONS
(Unit of Measure = mm)
SYMBOL
MIN
NOM
MAX
A
–
–
0.90
A1
0.00
–
0.05
D
5.80
6.00
6.20
E
4.70
4.90
5.10
D1
2.85
3.00
3.15
E1
2.85
3.00
3.15
b
0.35
0.40
0.45
e
1.27 TYP
e1
L
NOTE
3.81 REF
0.50
0.60
0.70
5/24/04
R
1150 E. Cheyenne Mtn. Blvd.
Colorado Springs, CO 80817
TITLE
8Y4, 8-lead (6.00 x 4.90 mm Body) SOIC Array Package
(SAP) Y4
DRAWING NO.
REV.
8Y4
A
17
1440P–SEEPR–6/04
Atmel Corporation
2325 Orchard Parkway
San Jose, CA 95131, USA
Tel: 1(408) 441-0311
Fax: 1(408) 487-2600
Regional Headquarters
Europe
Atmel Sarl
Route des Arsenaux 41
Case Postale 80
CH-1705 Fribourg
Switzerland
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Fax: (41) 26-426-5500
Asia
Room 1219
Chinachem Golden Plaza
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Hong Kong
Tel: (852) 2721-9778
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