Skyworks CX77112 Pa module for cdma pcs (1850-1910 mhz) Datasheet

DATA SHEET
CX77112 PA Module for CDMA PCS (1850–1910 MHz)
Applications
Description
• Personal Communications
Services (PCS)
The CX77112 Power Amplifier Module (PAM) is a fully matched 10-pin surface mount module
developed for Personal Communications Service (PCS) and Wireless Local Loop (WLL) applications.
This small and efficient Power Amplifier packs full 1850–1910 MHz bandwidth coverage into a single
compact package. The CX77112 meets the stringent spectral linearity requirements of Code Division
Multiple Access (CDMA) PCS transmission, with high power added efficiency for power output of up to
29 dBm. A low current (VCONT) pin is provided to improve efficiency for the low RF power range of
operation.
• Wireless Local Loop (WLL)
Features
• Low voltage positive bias
supply
- 3.2 V to 4.2 V
• Low VREF
- 2.85 V, nominal
• Good linearity
• High efficiency
• Large dynamic range
• 10-pin package
- 4 mm x 4 mm x 1.5 mm
• Power down control
The single Gallium Arsenide (GaAs) Microwave Monolithic Integrated Circuit (MMIC) contains all active
circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage
matching circuits. Output match is realized off-chip within the module package to optimize efficiency
and power performance into a 50 Ω load. This device is manufactured with Skyworks’ GaAs
Heterojunction Bipolar Transistor (HBT) process that provides for all positive voltage DC supply
operation while maintaining high efficiency and good linearity. Primary bias to the CX77112 is
supplied directly from a three-cell Ni-Cd, a single-cell Li-Ion, or other suitable battery with an output
in the 3 to 4 volt range. Power down is accomplished by setting the voltage on the low current
reference pin to zero volts. No external supply side switch is needed as typical “off” leakage is a few
microamperes with full primary voltage supplied from the battery.
• Low power-state control
• InGaP
• IS95/CDMA2000
• Full U.S. PCS coverage
Figure 1. Functional Block Diagram
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DATA SHEET • CX77112
PA MODULE FOR CDMA PCS (1850–1910 MHZ)
Electrical Specifications
The following tables list the electrical characteristics of the
CX77112 Power Amplifier Module. Table 1 lists the absolute
maximum ratings, while Table 2 shows the recommended
operating conditions to achieve the performance characteristics
listed in Table 4. Table 3 presents a truth table for the power
ranges.
Table 1. Absolute Maximum Ratings (1)
Parameter
Symbol
Minimum
Nominal
Maximum
Unit
RF Input Power
PIN
—
1.0
6.0
dBm
Supply Voltage
VCC
—
3.4
6.0
Volts
Reference Voltage
VREF
—
2.85
3.1
Volts
Case Operating Temperature
TC
–30
25
+110
°C
Storage Temperature
TSTG
–55
—
+125
°C
(1) No damage assuming only one parameter is set at limit at a time with all other parameters set at nominal value.
Table 2. Recommended Operating Conditions
Parameter
Supply Voltage
Operating Frequency
Operating Temperature
Minimum
Nominal
Maximum
Unit
VCC
3.2
3.4
4.2
Volts
VREF
2.75
2.85
2.95
Volts
Low Power Mode
VCONT
2.0
2.5
3.0
Volts
High Power Mode
VCONT
0.0
0.5
1.0
Volts
FO
1850.0
1880.0
1910.0
MHz
TO
–30
+25
+85
°C
Reference Voltage
Control voltage
Symbol
Table 3. Power Range Truth Table
VREF
VCONT
Range
High Power
2.85 V
0.5 V
16 dBm to 29 dBm
Low Power
2.85 V
2.5 V
≤ 16 dBm
Shut Down
0.00 V
0.0 V
—
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PA MODULE FOR CDMA PCS (1850–1910 MHZ)
DATA SHEET • CX77112
Table 4. Electrical Specifications for CDMA Nominal Operating Conditions (1)
Characteristics
Gain conditions
Symbol
Quiescent current
Typical
Maximum
25.0
26.3
VCONT = 2.5 V
PO = 16 dB
24.0
GHIGH
VCONT = 0.5 V
PO = 29 dBm
27.0
28.5
30.0
PAELOW
VCONT = 2.5 V
PO = 16 dB
7.0
8.5
—
PAEHIGH
VCONT = 0.5 V
PO = 29 dBm
37.0
40.0
—
ICC_LOW
PO = 16 dBm
—
135
160
ICC_HIGH
PO = 29 dBm
—
580
625
IQ_LOW
VCONT = 2.5 V
35
50
65
IQ_HIGH
VCONT = 0.5 V
80
95
115
Digital Mode
Total Supply current
Minimum
GLOW
Digital Mode
Power Added Efficiency
Condition
dB
%
mA
mA
Reference current
IREF
—
6.0
10.0
mA
Control current
ICONT
VCONT = 2.5 V
—
140
250
µA
Total Supply current in Power-down Mode
IPD
VCC = 3.4 V
VREF = 0 V
—
3.0
4.0
µA
ACP1LOW
VCONT = 2.5 V
PO = 16 dB
—
–50
–48
ACP1HIGH
VCONT = 0.5 V
PO = 29 dBm
—
–51
–49
ACP3LOW
VCONT = 2.5 V
PO = 16 dB
—
–68
–60
ACP3HIGH
VCONT = 0.5 V
PO = 29 dBm
—
–60
–57
Second
FO2
PO ≤ 29 dBm
—
–35
–32
Third
FO3
PO ≤ 29 dBm
—
–55
–40
Noise Power in RX Band 1930-1990 MHz
RxBN
PO ≤ 29 dBm
—
–136
–135
Noise Figure
NF
—
—
5.5
6.0
dB
Input Voltage Standing Wave Ratio
VSWR
—
—
—
2.0:1
—
Stability (Spurious output)
S
5:1 VSWR
All phases
—
—
–65
dBc
Ruggedness – No damage (4)
Ru
PO ≤ 29 dBm
10:1
—
—
VSWR
1.25 MHz offset
Adjacent Channel Power (2)(3)
2.25 MHz offset
Harmonic Suppression
—
Unit
dBc
dBc
dBm/Hz
(1) VCC = +3.4 V, VREF = +2.85 V, Freq = 1880 MHz, TC = 25 °C, unless otherwise specified
(2) ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW.
(3) CDMA2000 is configured as DCHH = 9600, SCHO = 9600, PCH (Walsh 0) = –3.75 dB, and Peak-to-Average Ratio (CCDF = 1%) = 4.45 dB. For CDMA2000, back off output power 0.5 dB is
required.
(4) All phases, time = 10 seconds.
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DATA SHEET • CX77112
PA MODULE FOR CDMA PCS (1850–1910 MHZ)
Table 5. Electrical Specifications for CDMA Recommended Operating Conditions (1)
Characteristics
Symbol
Condition
Minimum
Maximum
29.0
Unit
GLOW
VCONT = 2.5 V
PO = 16 dBm
21.0
GHIGH
VCONT = 0.5 V
PO = 29 dBm
24.5
33.0
ACP1LOW
VCONT = 2.5 V
PO ≤ 16 dBm
—
–44
ACP1HIGH
VCONT = 0.5 V
PO ≤ 29 dBm
—
–43
ACP3LOW
VCONT = 2.5 V
PO ≤ 16 dBm
—
–56
ACP3HIGH
VCONT = 0.5 V
PO ≤ 29 dBm
—
–56
Second
FO2
PO ≤ 29 dBm
—
–30
Third
FO3
PO ≤ 29 dBm
—
–40
Noise Power in RX Band 1840-1895 MHz
RxBN
PO ≤ 29 dBm
—
–132.0
dBm/Hz
Noise Figure
NF
—
—
7.0
dB
Input Voltage Standing Wave Ratio (VSWR)
VSWR
—
—
2.5:1
—
Stability (Spurious output)
S
5:1 VSWR
All phases
—
–65.0
dBc
Ruggedness – No damage (5)
Ru
PO ≤ 29 dBm
10:1
—
VSWR
Gain conditions
Digital Mode
dB
1.25 MHz offset
Adjacent Channel Power (2)(3)(4)
2.25 MHz offset
Harmonic Suppression
dBc
dBc
(1) Per Table 2, unless otherwise specified.
(2) ACP is specified per IS95 as the ratio of the total in-band power (1.23 MHz BW) to adjacent power in a 30 kHz BW.
(3) CDMA2000 is configured as DCCH = 9600, SCHO = 9600, PCH (Walsh 0) = –3.75 dB, and Peak-to-Average Ratio (CCDF = 1%) = 4.5 dB. For CDMA2000, back off output power 0.5 dB is
required.
(4) Worst case ACPR is –43 dBc at +85 °C, VCC = 3.2 V.
(5) All phases, time = 10 seconds.
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PA MODULE FOR CDMA PCS (1850–1910 MHZ)
DATA SHEET • CX77112
Characterization Data
The following graphs illustrate the characteristics of a typical
CX77112 Power Amplifier Module designed for operation in the
PCS frequency band (1850–1910 MHz). This amplifier was
selected by characterizing a group of devices and choosing a part
with average electrical performance for both nominal and the full
range of recommended operating conditions, including worst case
limits.
Figure 2 through Figure 8 illustrate the digital signal
characteristics of the CX77112. Shown are power sweep
characteristics for key performance parameters over temperature
and frequency, up to 28.5 dBm output power. The data was taken
up to and including 16 dBm output power with the bias mode
control pin setting of VCONT = 2.5 volts. Beyond 16 dBm output
power, the VCONT was set to 0 volts.
Figure 2. Digital Mode Gain vs. Output Power
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DATA SHEET • CX77112
PA MODULE FOR CDMA PCS (1850–1910 MHZ)
Figure 3. Primary Bias Current vs. Output Power
Figure 4. Power Added Efficiency vs. Output Power
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PA MODULE FOR CDMA PCS (1850–1910 MHZ)
DATA SHEET • CX77112
Figure 5. Adjacent Channel Power for 1.25 MHz Offset vs. Output Power
Figure 6. Adjacent Channel Power for 2.25 MHz Offset vs. Output Power
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DATA SHEET • CX77112
PA MODULE FOR CDMA PCS (1850–1910 MHZ)
Figure 7. Second Harmonic Rejection vs. Output Power
Figure 8. Third Harmonic Rejection vs. Output Power
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PA MODULE FOR CDMA PCS (1850–1910 MHZ)
DATA SHEET • CX77112
Evaluation Board Description
The evaluation board is a platform for testing and interfacing
design circuitry. To accommodate the interface testing of the
CX77112, the evaluation board schematic and diagrams are
included for preliminary analysis and design. Figure 9 shows the
basic schematic of the board for the 1850 MHz to 1910 MHz
range.
Figure 9. Evaluation Board Schematic
Figure 10. Evaluation Board Assembly Diagram
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DATA SHEET • CX77112
PA MODULE FOR CDMA PCS (1850–1910 MHZ)
Package Dimensions and Pin Descriptions
The CX77112 is a multi-layer laminate base, overmold
encapsulated modular package designed for surface mount solder
attachment to a printed circuit board. Figure 11 is a mechanical
drawing of the pad layout for this package. Figure 12 provides a
recommended phone board layout footprint for the PAM to help
the designer attain optimum thermal conductivity, good
grounding, and minimum RF discontinuity for the 50-ohm
terminals. Figure 13 illustrates the pin configuration and
numbering convention, which starts with pin 1 in the upper left
and increments counter-clockwise around the package. Table 6
describes each pin function. Figure 14 shows typical case
markings.
Figure 11. CX77112 Package Drawing
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PA MODULE FOR CDMA PCS (1850–1910 MHZ)
DATA SHEET • CX77112
Figure 12. Phone PCB Layout Footprint for 4 x 4 mm, 10-Pin Package – CX77112
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DATA SHEET • CX77112
PA MODULE FOR CDMA PCS (1850–1910 MHZ)
Table 6. CX77112 Pin Configuration and Descriptions
PIN Number
Function
Description
1
VCC1 (1)
Connect to battery or DC supply
2
RF IN
RF Input
3
GND
Ground
4
VCONT
Control voltage
5
VREF
Reference voltage
6
GND
Ground
7
GND
Ground
8
RF OUT
RF Output
9
GND
Ground
10
VCC2 (1)
Connect to battery or DC supply
GND PAD
GND (2)
Ground pad on underside of package
(1)
All supply pins may be connected together at the supply.
(2)
Package underside is GND.
Package and Handling Information
Because of its sensitivity to moisture absorption, this device
package is baked and vacuum-packed prior to shipment.
Instructions on the shipping container label must be followed
regarding exposure to moisture after the container seal is broken,
otherwise, problems related to moisture absorption may occur
when the part is subjected to high temperature during solder
assembly.
The CX77112 is capable of withstanding an MSL3/240 °C solder
reflow. Care must be taken when attaching this product, whether
it is done manually or in a production solder reflow environment.
If the part is attached in a reflow oven, the temperature ramp rate
should not exceed 5 °C per second; maximum temperature
should not exceed 240 °C. If the part is manually attached,
precaution should be taken to insure that the part is not subjected
to temperatures exceeding 240 °C for more than 10 seconds. For
details on attachment techniques, precautions, and handling
procedures recommended by Skyworks, please refer to Skyworks
Application Note: PCB Design and SMT Assembly/Rework,
Document Number 101752. Additional information on standard
SMT reflow profiles can also be found in the JEDEC Standard
J-STD–020.
Production quantities of this product are shipped in the standard
tape-and-reel format. For packaging details, refer to Skyworks
Application Note: Tape and Reel Information –RF Modules,
Document Number 101568.
Electrostatic Discharge Sensitivity
Figure 13. CX77112 Pin Configuration
The CX77112 is a Class 2 device. Figure 15 lists the Electrostatic
Discharge (ESD) immunity level for each non-ground pin of the
CX77112 product. ESD testing was performed in compliance with
MIL-STD-883E Method 3015.7 using the Human Body Model. The
numbers in Figure 15 specify the ESD threshold level for each pin
where the I-V curve between the pin and ground starts to show
degradation.
Various failure criteria can be utilized when performing ESD
testing. Many vendors employ relaxed ESD failure standards that
fail devices only after “the pin fails the electrical specification
limits” or “the pin becomes completely non-functional”.
Skyworks employs most stringent criteria to fail devices as soon
as the pin begins to show any degradation on a curve tracer. If
ESD damage threshold magnitude is found to consistently exceed
2000 volts on a given pin, this so is indicated. If ESD damage
threshold below 2000 volts is measured for either polarity,
numbers are indicated that represent worst case values observed
in product characterization.
Figure 14. Typical Case Markings
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PA MODULE FOR CDMA PCS (1850–1910 MHZ)
DATA SHEET • CX77112
• Personnel Grounding
- Wrist Straps
- Conductive Smocks, Gloves and Finger Cots
- Antistatic ID Badges
• Facility
- Relative Humidity Control and Air Ionizers
- Dissipative Floors (less than 109 Ω to GND)
• Protective Workstation
- Dissipative Table Tops
- Protective Test Equipment (Properly Grounded)
- Grounded Tip Soldering Irons
- Conductive Solder Suckers
- Static Sensors
Figure 15. CX77112 ESD Sensitivity Areas (Top View)
To avoid ESD damage, both latent and visible, it is very important
that the product assembly and test areas observe these Class 2
ESD handling precautions for GaAs IC-based products
to avoid induced damage.
• Protective Packaging & Transportation
- Bags and Pouches (Faraday Shield)
- Protective Tote Boxes (Conductive Static Shielding)
- Protective Trays
- Grounded Carts
- Protective Work Order Holders
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Skyworks Ordering Information
Model Number
Manufacturing
Part Number
CX77112
CX77112
Product Revision
Package
Operating Temperature
4x4LM–10
–30 °C to +85 °C
Revision History
Revision
Level
Date
Description
A
June 17, 2003
Initial Release
B
July 14, 2003
Revise: Table 2, 3, 4, 5
Revise: Table 1
C
August 22, 2003
D
November 25, 2003
Revise: Table 5
E
May 19, 2004
Revise: Figure 1
F
June 1, 2005
Add: Figure 12
References
Application Note: PCB Design and SMT Assembly/Rework, Document Number 101752.
Application Note: Tape and Reel, Document Number 101568.
JEDEC Standard J-STD-020
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