MTCH102/5/8 2, 5 and 8-Channel Proximity/Touch Controller Data Sheet Description The Microchip mTouch® MTCH102/5/8 Proximity/Touch Controller with simple digital output provides an easy way to add proximity or touch detection to any application. This device family implements capacitive sensors with active guarding capability. The sensitivity and power mode can be configured through the MTSA and MTPM pins. The MTCH102/5/8 devices also use an advanced optimization algorithm to actively suppress noise from the signal to achieve reliable proximity/touch detection. • Flexible Low-Power mode • Brown-Out Protection • Operating Voltage Range: - 2.05V to 3.6V • Operating Temperature: - 40°C to +85°C Features • Capacitive Proximity and Touch Detection System: - High Signal to Noise Ratio (SNR) - Adjustable sensitivity with compensation for different sensor sizes - Multi-stage active noise suppression filters - Automatic environmental compensation - Support wide range of sensor shapes and sizes • Simple I/O Interface with Existing System • Smart Scan Scheduling • Threshold Hysteresis TABLE 1: Typical Application • • • • • Light Switch Portable Device Enabler White Goods and Appliance Office Equipment and Toys Display and Keypad Back-lighting Activation MTCH10X FAMILY TYPES Device Data Sheet Index Sensor Input Active Guard Digital Output MTCH101 (A) 1 N 1 MTCH102 (B) 2(1) Y(1) 2 MTCH105 (B) 5(1) Y(1) 5 (B) 8(1) Y(1) 8 MTCH108 Note 1: One of the sensor inputs can be configured as active guard output. Data Sheet Index: (Unshaded devices are described in this document.) A: B: DS-40001664 DS-40001793 MTCH101 Single-Channel Proximity Detector MTCH102/105/108 Dual-Channel Proximity/Touch Controller For other small form-factor package availability and marking information, please visit http://www.microchip.com/packaging or contact your local sales office. Note: TABLE 2: PACKAGES Packages MSOP TSSOP SSOP UDFN QFN UQFN MTCH102 X — — X — — MTCH105 — X — — X — MTCH108 — — X — — X 2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 1 MTCH102/5/8 8-LEAD MSOP, UDFN MTI0 MTCH102 VDD 1 2 MTI1/Guard 3 4 MTPM 8 VSS 7 MTO0 6 MTO1/GC 20-LEAD SSOP VDD 1 20 VSS MTI0 2 19 MTO0 18 MTO1 17 MTSA 16 MTO2/GC 15 MTO3 7 14 MTO4 8 13 MTO5 9 12 MTO6 10 11 MTO7 MTI1 3 MTPM 4 MTI2/Guard 5 MTI3 MTI4 5 MTSA MTI5 MTI6 MTI7 VSS 2 13 MTO0 MTI1 3 12 MTO1 11 MTSA MTO2/GC MTPM 4 MTCH105 MTI0 MTI2/ Guard 5 10 MTI3 6 9 MTO3 MTI4 7 8 MTO4 Note: See Table 4 for the pin allocation table. MTPM MTI2/Guard MTI3 MTI4 MTI5 1 2 3 4 5 MTCH108 15 14 13 12 11 MTO1 MTSA MTO2/GC MTO3 MTO4 Note: See Table 5 for the pin allocation table. 16 15 14 13 NC VSS 16-LEAD QFN VDD NC FIGURE 3: 20-LEAD UQFN MTI1 14 1 VDD FIGURE 5: 20 19 18 17 16 14-LEAD TSSOP Note: See Table 5 for the pin allocation table. 6 7 8 9 10 FIGURE 2: 6 MTI6 MTI7 MTO7 MTO6 MTO5 Note: See Table 3 for the pin allocation table. MTCH108 FIGURE 1: FIGURE 4: MTI0 VDD VSS MTO0 PIN DIAGRAMS 1 2 3 4 MTCH105 12 11 10 9 MTO0 MTO1 MTSA MTO2/GC MTI3 MTI4 MTO4 MTO3 5 6 7 8 MTI0 MTI1 MTPM MTI2/Guard Note: See Table 4 for the pin allocation table. DS40001793C-page 2 Preliminary 2015-2016 Microchip Technology Inc. MTCH102/5/8 PIN ALLOCATION TABLES TABLE 3: Name 8-PIN DESCRIPTION (MTCH102) 8-Lead MSOP and UDFN Description VDD 1 Power Supply Input MTI0 2 Proximity/Touch Sensor 0 Input MTI1/Guard 3 Proximity/Touch Sensor 1 Input/Active Guard MTPM 4 Low-Power Mode Select MTSA 5 Sensitivity Adjust Input MTO1/GC 6 MTI1 Detect Output (Active-Low)/Guard Control MTO0 7 MTI0 Detect Output (Active-Low) VSS 8 Ground TABLE 4: 14-/16-PIN DESCRIPTION (MTCH105) 14-Lead TSSOP 16-Lead QFN VDD 1 16 Power Supply Input MTI0 2 1 Proximity/Touch Sensor 0 Input MTI1 3 2 Proximity/Touch Sensor 1 Input MTPM 4 3 Low-Power Mode Select MTI2/Guard 5 4 Proximity/Touch Sensor 2 Input/Active Guard MTI3 6 5 Proximity/Touch Sensor 3 Input MTI4 7 6 Proximity/Touch Sensor 4 Input MTO4 8 7 MTI4 Detect Output (Active-Low) MTO3 9 8 MTI3 Detect Output (Active-Low) MTO2/GC 10 9 MTI2 Detect Output (Active-Low) /Guard Control MTSA 11 10 Sensitivity Adjust Input MTO1 12 11 MTI1 Detect Output (Active-Low) MTO0 13 12 MTI0 Detect Output (Active-Low) VSS 14 13 Ground Name 2015-2016 Microchip Technology Inc. Description Preliminary DS40001793C-page 3 MTCH102/5/8 TABLE 5: 20-PIN DESCRIPTION (MTCH108) 20-Lead SSOP 20-Lead UQFN VDD 1 18 Power Supply Input MTI0 2 19 Proximity/Touch Sensor 0 Input MTI1 3 20 Proximity/Touch Sensor 1 Input Name Description MTPM 4 1 Low-Power Mode Select MTI2/Guard 5 2 Proximity/Touch Sensor 2 Input/Active Guard MTI3 6 3 Proximity/Touch Sensor 3 Input MTI4 7 4 Proximity/Touch Sensor 4 Input MTI5 8 5 Proximity/Touch Sensor 5 Input MTI6 9 6 Proximity/Touch Sensor 6 Input MTI7 10 7 Proximity/Touch Sensor 7 Input MTO7 11 8 MTI7 Detect Output (Active-Low) MTO6 12 9 MTI6 Detect Output (Active-Low) MTO5 13 10 MTI5 Detect Output (Active-Low) MTO4 14 11 MTI4 Detect Output (Active-Low) MTO3 15 12 MTI3 Detect Output (Active-Low) MTO2/GC 16 13 MTI2 Detect Output (Active-Low)/Guard Control MTSA 17 14 Sensitivity Adjust Input MTO1 18 15 MTI1 Detect Output (Active-Low) MTO0 19 16 MTI0 Detect Output (Active-Low) VSS 20 17 Ground DS40001793C-page 4 Preliminary 2015-2016 Microchip Technology Inc. MTCH102/5/8 Table of Contents 1.0 Device Overview .......................................................................................................................................................................... 6 2.0 Typical Circuit............................................................................................................................................................................... 8 3.0 Sensitivity Adjustment .................................................................................................................................................................. 9 4.0 Power Mode and Timeout Reset................................................................................................................................................ 10 5.0 Electrical Specifications.............................................................................................................................................................. 11 6.0 Packaging Information................................................................................................................................................................ 15 Appendix .............................................................................................................................................................................................. 33 The Microchip Website......................................................................................................................................................................... 34 Product Identification System .............................................................................................................................................................. 35 Customer Change Notification Service ................................................................................................................................................ 34 Customer Support ................................................................................................................................................................................ 34 TO OUR VALUED CUSTOMERS It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced. If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at [email protected]. We welcome your feedback. Most Current Data Sheet To obtain the most up-to-date version of this data sheet, please register at our Worldwide Website at: http://www.microchip.com You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000). Errata An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies. To determine if an errata sheet exists for a particular device, please check with one of the following: • Microchip’s Worldwide Website; http://www.microchip.com • Your local Microchip sales office (see last page) When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using. Customer Notification System Register on our website at www.microchip.com to receive the most current information on all of our products. 2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 5 MTCH102/5/8 1.0 DEVICE OVERVIEW The MTCH102/5/8 provides an easy way to add proximity or touch detection to any application with human machine interface. These devices can integrate up to two, five and eight capacitive touch/proximity detection sensors which can work through plastic, wood or even metal front panels with Microchip’s proprietary Metal over Capacitive technology. It also supports a wide range of conductive materials as sensors, like copper pad on PCB, silver ink, PEDOT or carbon printing on plastic film, Indium Tin Oxide (ITO) pad, wire/cable, etc. at run-time. An active-low output will communicate the state of the sensors to a host/master MCU or drive an indication LED. The MTCH102/5/8 uses a sophisticated scan optimization algorithm to actively attenuate noise from the signal. The sensitivity adjustment and flexible power mode allow users to easily configure the device FIGURE 1-1: 1.1 MTCH102/5/8 BLOCK DIAGRAM Pin Description Guard MTIx Connect the sensor to this input. An additional resistor of at least 4.7 kΩ is recommended for best noise immunity. Sensors work best when the base capacitance is minimized. This will maximize the percentage change in capacitance when a finger is added to the circuit. The recommended sensor capacitance is 5pF to 50pF. MTOx The MTOx pin is an open-drain output which reports the touch/proximity state of the corresponding MTIx input. A pull-up resistor is required on each output. The MTOx will pull the line low when a touch/proximity event happens and release the line when the touch/ proximity is released. DS40001793C-page 6 The Guard function is multiplexed with one of the MTIx pins. If the GC pin is floating, the Guard pin will function as a standard MTIx sensor. If the GC pin is grounded, the Guard pin will output a signal in-phase with the other sensors being scanned. This has several advantages, such as providing a mutual capacitance coupling to the sensors to increase sensitivity, and providing a low-impedance trace near the sensor to absorb noise. The active guard layout should encircle the sensor and its traces so that it will shield the sensor. For more information about guarding and layout guidelines, see application notes “mTouch® Sensing Solution Acquisition Methods Capacitive Voltage Divider” (AN1478) and “Techniques for Robust Touch Sensing Design” (AN1334). Preliminary 2015-2016 Microchip Technology Inc. MTCH102/5/8 GC The GC (Guard Control) is multiplexed with one of the MTOx pins. By grounding the GC pin, the active guard signal will be enabled on the Guard pin. MTSA The MTSA pin is an input that determines the sensitivity of touch/proximity sensors. Applying VDD will give the lowest sensitivity while applying VSS will give the highest. MTPM The MTPM pin is an input that determines the power mode of MTCH10X devices. By connecting VSS to the MTPM pin, the device will operate in Low-Power mode. See Figure 5-1 for current consumption and response time specifications. When applying VDD on the MTCH10X MTPM pin, the device will scan the sensors at the fastest possible sampling rate. Host-controlled sampling rates are available using the Smart Scan Scheduling feature described in Section 4.0, Power Mode and Timeout Reset. 2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 7 MTCH102/5/8 2.0 TYPICAL CIRCUIT The MTCH102 is used as an example to show two typical circuits for MTCH10X devices in the following figures. For more information about capacitive sensor layout guidance, refer to “Techniques for Robust Touch Sensing Design” (AN1334). FIGURE 2-1: TWO SENSORS AND NO ACTIVE GUARD CIRCUIT VDD U1 1 Sensor R1 2 4.7K 3 0.1uF VDD VSS MTI0 MTO0 MTI1/Guard 4 R2 VDD C1 MTO1/GC MTPM MTSA 8 GND Sensor R7 10K 10K 7 MTO0 6 MTO1 R3 5 07&+ 4.7K R6 VDD 10K R4 MTPM R5 GND FIGURE 2-2: ONE SENSOR WITH ACTIVE GUARD CIRCUIT VDD U1 1 R1 2 4.7K 3 Sensor Active Guard R2 0 VDD C1 4 R6 0.1uF VDD VSS MTI0 MTO0 MTI1/Guard MTPM MTO1/GC MTSA 07&+ 8 10K GND 7 MTO0 6 5 R3 VDD GND 10K R4 MTPM R5 GND DS40001793C-page 8 Preliminary 2015-2016 Microchip Technology Inc. MTCH102/5/8 3.0 SENSITIVITY ADJUSTMENT FIGURE 3-3: The sensitivity of the sensor inputs determines how far it can respond to proximity or how much capacitance is required to activate a touch. The voltage on the MTCH102/5/8 MTSA pin will determine the sensitivity. VDD voltage will give the lowest sensitivity, while VSS voltage will give the highest. The device will sample the voltage on the MTSA pin after every 32nd scan, so it does not only support setting a fixed sensitivity by a resistor ladder, but it also allows adjusting the sensitivity dynamically while the device is running. A Digital-to-Analog Converter (DAC) controlled by the host or a hardware potentiometer can be used to adjust the sensitivity. Refer to the typical circuit in Figure 3-1 to Figure 3-4. FIGURE 3-1: SENSITIVITY CONTROLLED BY HOST USING DAC Host R2 DAC FIGURE 3-4: FIXED SENSITIVITY USING RESISTOR LADDER MTSA 10k SENSITIVITY CONTROLLED BY HOST USING PWM VDD R1 R3 Host MTSA R 10k R2 PWM MTSA C Note: Both R1 and R2 are recommended to be greater than 100K for lower power consumption. FIGURE 3-2: Note: HARDWARE SENSITIVITY ADJUST USING POTENTIOMETER Refer to Application Note “Using PWM to Generate Analog Output” (AN538) for details about how to choose appropriate R and C values. VDD R2 R1 MTSA 10k 2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 9 MTCH102/5/8 4.0 POWER MODE AND TIMEOUT RESET FIGURE 4-2: The MTCH102/5/8 has three power mode options to meet the needs of various applications: Normal mode, Low-Power mode and Smart-Scheduling mode. The state of the MTPM pin determines the power mode. 4.1 Burst Scan Normal Mode SMART-SCHEDULING MODE Sleep MTIx The device will run in Normal mode if the MTPM pin is connected to VDD. In this mode, the MTCH102/5/8 will scan continuously; so it will achieve the shortest response time among the three power modes, but also the power consumption is the highest. Scan Interval MTPM 4.2 Low-Power Mode The device will run in Low-Power mode if the MTPM pin is connected to VSS. The device will go to Sleep for 256 ms after each round of sensor scans; so it will achieve the lowest power consumption, but it will have the longest response time among the three power modes, as shown in Figure 4-1. 4.4 FIGURE 4-1: For the Normal and Low-Power modes, the timeout duration is 10 seconds. For the Smart-Scheduling mode, the timeout duration is 400 multiplied by the scan interval. Burst Scan LOW-POWER MODE Sleep:256ms Timeout Reset The device keeps track of the activated state duration for each MTIx input channel. The sensor state will be reset once the activated state duration exceeds the timeout duration, and the associated MTOx pin will release the line. MTIx 4.3 Smart-Scheduling Mode The MTCH102/5/8 also implements a Smart-Scheduling mode that allows a host to set the exact sampling rate by pulsing the MTPM pin, as shown in Figure 4-2. The minimum recognizable pulse width is 25 ns. If the MTPM pin is toggled during a scan cycle, the device will skip the next Sleep and immediately start a new set of scans. DS40001793C-page 10 Preliminary 2015-2016 Microchip Technology Inc. MTCH102/5/8 5.0 ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings(†) Ambient temperature under bias....................................................................................................... -40°C to +125°C Storage temperature ........................................................................................................................ -65°C to +150°C Voltage on pins with respect to VSS on VDD pin ................................................................................................................................ -0.3V to +4.0V on all other pins ............................................................................................................. -0.3V to (VDD + 0.3V) Total power dissipation(1) ............................................................................................................................... 800 mW Maximum current out of VSS pin -40°C TA +85°C for industrial .......................................................................................................... 85 mA into VDD pin -40°C TA +85°C for industrial .......................................................................................................... 80 mA Clamp current, IK (VPIN < 0 or VPIN > VDD)20 mA Maximum output current sunk by any I/O pin................................................................................................................................ 25 mA sourced by any I/O pin........................................................................................................................... 25 mA Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD – IOH} + {(VDD – VOH) x IOH} + (VOl x IOL). † NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. 5.1 DC Characteristics: MTCH102/5/8 Standard Operating Conditions (unless otherwise stated) Operating temperature -40°C ≤ TA ≥ +85°C for industrial MTCH102/5/8 Param. No. Sym. Characteristic Min. Typ.† Max. Units D001 VDD Supply Voltage 2.05 — 3.6 V D002* VDR RAM Data Retention Voltage (1) 1.5 — — V VPOR* Power-on Reset Release Voltage — 1.6 — V VPORR* Power-on Reset Rearm Voltage — 0.8 — V SVDD VDD Rise Rate to ensure internal Power-on Reset signal 0.05 — — V/ms D004* Conditions Device in Sleep mode Device in Sleep mode * † These parameters are characterized but not tested. Data in “Typ.” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data. 2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 11 MTCH102/5/8 FIGURE 5-1: MTCH10X FAMILY – POWER VS RESPONSE TIME !%" !" !" FIGURE 5-2: NPOR AND POR REARM WITH SLOW RISING VDD VDD VPOR VPORR VSS NPOR(1) POR REARM VSS TVLOW(2) TPOR(3) Note 1: 2: 3: When NPOR is low, the device is held in Reset. TPOR 1 s typical. TVLOW 2.7 s typical. DS40001793C-page 12 Preliminary 2015-2016 Microchip Technology Inc. MTCH102/5/8 5.2 DC Characteristics: MTCH102/5/8-I/E Standard Operating Conditions (unless otherwise stated) Operating temperature: -40°C TA +85°C for industrial DC CHARACTERISTICS Param. Sym. No. VIL D030A VIH D040A IIL D060 VOL D080 VOH D090 Characteristic Input Low Voltage I/O PORT: with TTL buffer Input High Voltage I/O ports: with TTL buffer Input Leakage Current(1) I/O ports Output Low I/O ports Min. Typ.† Max. Units — — 0.15 VDD V 1.8V VDD 4.5V — — — — V 1.8V VDD 4.5V — ±5 ± 125 nA — ±5 ± 1000 nA VSS VPIN VDD, Pin at high-impedance at 85°C to 125°C — — 0.6 V IOL = 6 mA, VDD = 3.3V IOL = 1.8 mA, VDD = 1.8V VDD - 0.7 — — V IOH = 3 mA, VDD = 3.3V IOH = 1 mA, VDD = 1.8V 0.25 VDD + 0.8 Conditions Voltage(2) Output High Voltage(2) I/O ports Capacitive Loading Specs on Output Pins D101A* CIO All I/O pins — — 50 pF * These parameters are characterized but not tested. † Data in “Typ.” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. Note 1: Negative current is defined as current sourced by the pin. 2: Including OSC2 in CLKOUT mode. 2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 13 MTCH102/5/8 FIGURE 5-3: BROWN-OUT RESET TIMING AND CHARACTERISTICS VDD VBOR and VHYST VBOR (Device in Brown-out Reset) (Device not in Brown-out Reset) 37 Reset 33 (due to BOR) TABLE 5-1: OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET PARAMETERS Standard Operating Conditions (unless otherwise stated) Operating Temperature -40°C TA +125°C Param. No. Sym. Characteristic Min. Typ.† Max. Units Conditions 33* TPWRT Power-up Timer Period 40 65 140 ms 34* TIOZ I/O High-impedance from RESET Low or Watchdog Timer Reset — — 2.0 s 35 VBOR Brown-out Reset Voltage 1.80 1.9 2.05 V 37* VHYST Brown-out Reset Hysteresis 0 25 50 mV -40°C to +85°C 38* TBORDC Brown-out Reset DC Response Time 0 1 40 s VDD VBOR * † BORV = 1.9V These parameters are characterized but not tested. Data in “Typ.” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not tested. DS40001793C-page 14 Preliminary 2015-2016 Microchip Technology Inc. MTCH102/5/8 6.0 PACKAGING INFORMATION 6.1 Package Marking Information 8-Lead UDFN (2x3x0.5 mm) Example 102 517 17 8-Lead MSOP (3x3 mm) Example H102 517017 14-Lead TSSOP (4.4 mm) Example XXXXXXXX YYWW NNN MTCH105 1517 017 Legend: XX...X Y YY WW NNN e3 * Note: Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC® designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 15 MTCH102/5/8 Package Marking Information (Continued) 16-Lead QFN (4x4x0.9 mm) PIN 1 Example PIN 1 MTCH 105 ML 517017 e3 20-Lead SSOP (5.30 mm) Example MTCH108 \SS e3 1517017 20-Lead UQFN (4x4x0.9 mm) PIN 1 Example PIN 1 MTCH 108 \GZ 514017 e3 Legend: XX...X Y YY WW NNN e3 * Note: DS40001793C-page 16 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC® designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Preliminary 2015-2016 Microchip Technology Inc. MTCH102/5/8 6.2 Package Details The following sections give the technical details of the packages. ' !""#$%& ! " ())$$$ ) 2015-2016 Microchip Technology Inc. # $ " % & " Preliminary ' # DS40001793C-page 17 MTCH102/5/8 ' !""#$%& ! " ())$$$ ) DS40001793C-page 18 # $ " % & " Preliminary ' # 2015-2016 Microchip Technology Inc. MTCH102/5/8 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 19 MTCH102/5/8 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS40001793C-page 20 Preliminary 2015-2016 Microchip Technology Inc. MTCH102/5/8 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 21 MTCH102/5/8 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS40001793C-page 22 Preliminary 2015-2016 Microchip Technology Inc. MTCH102/5/8 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 23 MTCH102/5/8 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS40001793C-page 24 Preliminary 2015-2016 Microchip Technology Inc. MTCH102/5/8 16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N NOTE 1 1 2 E (DATUM B) (DATUM A) 2X 0.15 C 2X TOP VIEW 0.15 C 0.10 C C A1 A SEATING PLANE 16X (A3) 0.08 C SIDE VIEW 0.10 C A B D2 0.10 C A B E2 2 e 2 1 NOTE 1 K N 0.40 16X b 0.10 e C A B BOTTOM VIEW Microchip Technology Drawing C04-127D Sheet 1 of 2 2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 25 MTCH102/5/8 16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Pins N e Pitch Overall Height A Standoff A1 A3 Contact Thickness Overall Width E Exposed Pad Width E2 Overall Length D Exposed Pad Length D2 b Contact Width Contact Length L Contact-to-Exposed Pad K MIN 0.80 0.00 2.50 2.50 0.25 0.30 0.20 MILLIMETERS NOM 16 0.65 BSC 0.90 0.02 0.20 REF 4.00 BSC 2.65 4.00 BSC 2.65 0.30 0.40 - MAX 1.00 0.05 2.80 2.80 0.35 0.50 - Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-127D Sheet 2 of 2 DS40001793C-page 26 Preliminary 2015-2016 Microchip Technology Inc. MTCH102/5/8 16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9mm Body [QFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 27 MTCH102/5/8 ' ()* +(" , +((! ""#$%((, & ! " ())$$$ ) # $ " % & " ' # D N E E1 NOTE 1 1 2 e b c A2 A φ A1 L1 A G H!8 '& L GG;; H H HJ K & L>?@ J6 N O O 5L> 5> 5*> #'' 5 > O O J6 Q# ; * * # #& " # #& " " ;5 > >< >L L > G G >> > > G5 J6 G G #" Q# 5>; O R R *R G 8 O <* #Q# > ' 5 &56 ! # 7' ! 6 %8!! 8 #$ # #;5#!# #' ! #' ! 7 < # ;=5> ?@( ? 7 6 ! $$! ;( ' %! ! $! %'' ! # # $ @ ? DS40001793C-page 28 Preliminary 2015-2016 Microchip Technology Inc. MTCH102/5/8 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 29 MTCH102/5/8 20-Lead Ultra Thin Plastic Quad Flat, No Lead Package (GZ) - 4x4x0.5 mm Body [UQFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A B N NOTE 1 1 2 E (DATUM B) (DATUM A) 2X 0.20 C 2X TOP VIEW 0.20 C 0.10 C C SEATING PLANE A1 A 20X (A3) 0.08 C SIDE VIEW 0.10 C A B D2 L 0.10 C A B E2 2 K 1 NOTE 1 N 20X b 0.10 e C A B BOTTOM VIEW Microchip Technology Drawing C04-255A Sheet 1 of 2 DS40001793C-page 30 Preliminary 2015-2016 Microchip Technology Inc. MTCH102/5/8 20-Lead Ultra Thin Plastic Quad Flat, No Lead Package (GZ) - 4x4x0.5 mm Body [UQFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Terminals N e Pitch A Overall Height Standoff A1 A3 Terminal Thickness Overall Width E E2 Exposed Pad Width D Overall Length D2 Exposed Pad Length b Terminal Width Terminal Length L K Terminal-to-Exposed-Pad MIN 0.45 0.00 2.60 2.60 0.20 0.30 0.20 MILLIMETERS NOM 20 0.50 BSC 0.50 0.02 0.127 REF 4.00 BSC 2.70 4.00 BSC 2.70 0.25 0.40 - MAX 0.55 0.05 2.80 2.80 0.30 0.50 - Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. Package is saw singulated 3. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-255A Sheet 2 of 2 2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 31 MTCH102/5/8 20-Lead Ultra Thin Plastic Quad Flat, No Lead Package (GZ) - 4x4x0.5 mm Body [UQFN] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging C1 X2 20 1 2 C2 Y2 G1 Y1 X1 E SILK SCREEN RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Optional Center Pad Width X2 Optional Center Pad Length Y2 Contact Pad Spacing C1 Contact Pad Spacing C2 Contact Pad Width (X20) X1 Contact Pad Length (X20) Y1 Contact Pad to Center Pad (X20) G1 MIN MILLIMETERS NOM 0.50 BSC MAX 2.80 2.80 4.00 4.00 0.30 0.80 0.20 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-2255A DS40001793C-page 32 Preliminary 2015-2016 Microchip Technology Inc. MTCH102/5/8 APPENDIX A: DATA SHEET REVISION HISTORY Revision A (05/2015) Initial release of this document. Revision B (01/2016) Updated Packaging Information Identification System sections. corrections. and Product Other minor Revision C (04/2016) Updated Packaging Information section. Other minor corrections. 2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 33 MTCH102/5/8 THE MICROCHIP WEBSITE CUSTOMER SUPPORT Microchip provides online support via our website at www.microchip.com. This website is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the website contains the following information: Users of Microchip products can receive assistance through several channels: • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software • General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion groups, Microchip consultant program member listing • Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives • • • • Distributor or Representative Local Sales Office Field Application Engineer (FAE) Technical Support Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document. Technical support is available through the website at: http://www.microchip.com/support CUSTOMER CHANGE NOTIFICATION SERVICE Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, access the Microchip website at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions. DS40001793C-page 34 Preliminary 2015-2016 Microchip Technology Inc. MTCH102/5/8 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. [X](1) X /XX XXX Tape and Reel Option Temperature Range Package Pattern PART NO. Device a) b) c) Device: MTCH102; MTCH105; MTCH108. Tape and Reel Option: Blank T = Standard packaging (tube or tray) = Tape and Reel(1) Temperature Range: I E = -40C to +85C = -40C to +125C Package: MS SS MU GZ ST ML = = = = = = MTCH102 - I/MS = Industrial temperature, MSOP package. MTCH105 - I/ML = Industrial temperature, QFN package. MTCH108 - I/GZ = Industrial temperature, UQFN package. (Industrial) (Extended) MSOP SSOP UDFN UQFN TSSOP QFN 2015-2016 Microchip Technology Inc. Examples: Note 1: Preliminary Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS40001793C-page 35 Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, ETHERSYNCH, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 == DS40001793C-page 36 Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2015-2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-5224-0486-6 Preliminary 2015-2016 Microchip Technology Inc. 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Preliminary DS40001793B-page 37