Microchip MCP6541-I/MF Lin transceiver with voltage regulator Datasheet

MCP201
LIN Transceiver with Voltage Regulator
Package Types
PDIP, SOIC, DFN
• Supports baud rates up to 20 Kbaud
• 40V load dump protected
• Wide supply voltage, 6.0 – 18.0V, continuous
- Maximum input voltage of 30V
• Extended Temperature Range: -40°C to +125°C
• Interface to standard USARTs
• Compatible with LIN Spec 1.3
• Local Interconnect Network (LIN) Line pin:
- Internal pull-up resistor and diode
- Protected against ground shorts (LIN pin to
ground)
- Protected against LIN pin loss of ground
- High current drive, 40 mA ≤ IOL ≤ 200 mA
• Automatic thermal shutdown
• On-board Voltage Regulator:
- Output voltage of 5V with ±5% tolerances
over temperature range
- Maximum output current of 50 mA
- Able to drive an external series-pass
transistor for increased current supply
capability
- Internal thermal overload protection
- Internal short-circuit current limit
- External components limited to filter capacitor
only and load capacitor
RXD
1
CS/WAKE
2
VREG
3
TXD
4
MCP201
Features
8
FAULT/SLPS
7
VBAT
6
LIN
5
VSS
Block Diagram
Voltage
Regulator
VREG
Internal Circuits
Wake-Up
Logic
VBAT
Ratiometric
Reference
RXD
CS/WAKE
approx.
30 kΩ
OC
TXD
LIN
FAULT/SLPS
POR
© 2007 Microchip Technology Inc.
Slope
Control
Thermal
Protection
Vss
DS21730F-page 1
MCP201
NOTES:
DS21730F-page 2
© 2007 Microchip Technology Inc.
MCP201
1.0
DEVICE OVERVIEW
1.2
Internal Protection
The MCP201 provides a physical interface between a
microcontroller and a LIN half-duplex bus. It is intended
for automotive and industrial applications with serial
bus speeds up to 20 Kbaud.
1.2.1
The MCP201 provides a half-duplex, bidirectional
communications interface between a microcontroller
and the serial network bus. This device will translate
the CMOS/TTL logic levels to LIN level logic, and vice
versa.
1.2.2
The LIN specification 1.3 requires that the transceiver
of all nodes in the system be connected via the LIN pin,
referenced to ground and with a maximum external
termination resistance of 510Ω from LIN bus to battery
supply. The 510Ω corresponds to 1 Master and 16
Slave nodes.
The MCP201 provides a +5V 50 mA regulated power
output. The regulator uses a LDO design, is shortcircuit-protected and will turn the regulator output off if
it falls below 3.5V. The MCP201 also includes thermal
shutdown protection. The regulator has been specifically designed to operate in the automotive environment and will survive reverse battery connections,
+40V load dump transients and double-battery jumps
(see Section 1.6 “Internal Voltage Regulator”).
1.1
Optional External Protection
1.1.1
TRANSIENT VOLTAGE
PROTECTION (LOAD DUMP)
An external 27V transient suppressor (TVS) diode,
between VBAT and ground, with a 50Ω resistor in series
with the battery supply and the VBAT pin, serves to protect the device from power transients (see Figure 1-2)
and ESD events. While this protection is optional, it
should be considered as good engineering practice.
1.1.2
ESD PROTECTION
For component-level ESD ratings, please refer to the
maximum operation specifications.
GROUND LOSS PROTECTION
The LIN bus specification states that the LIN pin must
transition to the recessive state when ground is
disconnected. Therefore, a loss of ground effectively
forces the LIN line to a hi-impedance level.
1.2.3
THERMAL PROTECTION
The thermal protection circuit monitors the die
temperature and is able to shut down the LIN
transmitter and voltage regulator. Refer to Table 1-1 for
details.
There are three causes for a thermal overload. A
thermal shut down can be triggered by any one, or a
combination of, the following thermal overload
conditions.
• Voltage regulator overload
• LIN bus output overload
• Increase in die temperature due to increase in
environment temperature
Driving the TXD and checking the RXD pin makes it
possible to determine whether there is a bus contention
(Rx = low, Tx = high) or a thermal overload condition
(Rx = high, Tx = low).
Note:
After recovering from a thermal, bus or
voltage regulator overload condition, the
device will be in the Ready1 mode. In order
to go into Operational mode, the CS/
WAKE pin has to be toggled.
REVERSE BATTERY PROTECTION
An external reverse-battery-blocking diode can be
used to provide polarity protection (see Figure 1-2).
This protection is optional, but should be considered as
good engineering practice.
TABLE 1-1:
SOURCES OF THERMAL OVERLOAD(1,2)
TXD
RXD
L
H
LIN transmitter shutdown, receiver and voltage regulator active, thermal overload
condition.
Comments
H
L
Regulator shutdown, receiver active, bus contention.
Legend: x = Don’t care, L = Low, H = High
Note 1: LIN transceiver overload current on the LIN pin is 200 mA.
2: Voltage regulator overload current on voltage regulator greater than 50 mA.
© 2007 Microchip Technology Inc.
DS21730F-page 3
MCP201
Modes of Operation
For an overview of all operational modes, please refer
to Table 1-2.
1.3.1
POWER-DOWN MODE
In the Power-down mode, the transmitter and the
voltage regulator are both off. Only the receiver section
and the CS/WAKE pin wake-up circuits are in
operation. This is the lowest power mode.
1.3.3
In this mode, all internal modules are operational.
The MCP201 will go into Power-down mode on the
falling edge of CS/WAKE.
FIGURE 1-1:
CS/WAKE = true
If any bus activity (e.g., a BREAK character) should
occur during Power-down mode, the device will
immediately enable the voltage regulator. Once the
output has stabilized, the device will enter Ready
mode.
OPERATIONAL MODES
STATE DIAGRAMS
Power-down
Mode
Bus Activity
FLT
CS/WAKE = false
Operation
Mode
The part will enter the Operation mode, if the CS/WAKE
pin should become active-high (‘1’).
1.3.2
OPERATION MODE
FLT
Ready
Mode
READY AND READY1 MODES
CS/WAKE = true
There are two states for the Ready mode. The only
difference between these states is the transition during
start-up. The state Ready1 mode ensures that the
transition from Ready to Operation mode (once a rising
edge of CS/WAKE) occurs without disrupting bus
traffic.
Immediately upon entering either Ready1 or Ready
mode, the voltage regulator will turn on and provide
power. The transmitter portion of the circuit is off, with
all other circuits (including the receiver) of the MCP201
being fully operational. The LIN pin is kept in a
recessive state.
If a microcontroller is being driven by the voltage
regulator output, it will go through a power-on reset and
initialization sequence. All other circuits, other than the
transmitter, are fully operational. The LIN pin is held in
the recessive state.
The device will stay in Ready mode until the CS/WAKE
pin transitions high (‘1’). After CS/WAKE is active, the
transmitter is enabled and the device enters Operation
mode.
The device may only enter Power-down mode after
going through the Operation mode step.
At power-on of the VBAT supply pin, the component is
in either Ready or Ready1 mode, waiting for a
CS/WAKE rising edge.
The MCP201 will stay in either mode for 600 µs as the
regulator powers its internal circuitry and waits until the
CS/WAKE pin transitions high. During the 600 µs
delay, the MCP201 will not recognize a CS/WAKE
event. The CS/WAKE transition from low to high should
not occur until after this delay.
• The CS input is edge, not level, sensitive.
• The CS pin is not monitored until approximately
600 µs after VREG has stabized.
• The transistion from Ready1 to Ready is made on
the falling edge of CS.
• The transition from Ready mode to Operational
mode is on the rising edge of CS.
DS21730F-page 4
CS/WAKE = false
1.3
POR
CS/WAKE = false
Ready1
Mode
Start
CS/WAKE = true
Note:
After power-on, CS will not be sampled
until VREG has stabized and an additional
600 µs has elapsed. The microcontroller
should toggle CS approximately 1mS after
RESET to ensure that CS will be recognized.
Note:
While the MCP201 is in shutdown, TXD
should not be actively driven high. If TXD
is driven high actively, it may power
internal logic.
1.3.4
DESCRIPTION OF BROWNOUT
CONDITIONS
As VBAT decreases VREG is regulated to 5.0 VDC (see
VREG in Section 2.2 “DC Specifications”) while VBAT
is greater than 5.5 - 6.0 VDC.
As VBAT decreases further VREG tracks VBAT (VREG =
VBAT - (0.5 to 1.0) VDC.
The MCP201 monitors VREG and as long as VREG does
not fall below VSD (see VSD in Section 2.2 “DC Specifications”), VREG will remain powered.
As VBAT increases VREG will continue to track VBAT
until VREG reaches 5.0 VDC.
If VREG falls below VSD, VREG is turned off and the
MCP201 powers itself down.
The MCP201 will remain powered down until VBAT
increases above VON (see VON in Section 2.2 “DC
Specifications”.
© 2007 Microchip Technology Inc.
MCP201
TABLE 1-2:
State
OVERVIEW OF OPERATIONAL MODES
Transmitter
Voltage Regulator
POR
OFF
OFF
Read CS/WAKE.
If low, then READY.
If high, READY1 mode.
Ready
OFF
ON
If CS/WAKE rising edge, then Bus Off state
Operation mode.
Ready1
OFF
ON
If CS/WAKE falling edge,
then READY mode.
Bus Off state
Operation
ON
ON
If CS/WAKE falling edge,
then Power down.
Normal Operation mode
Power-down
OFF
OFF
On LIN bus falling, go to
Low-Power mode
READY mode.
On CS/WAKE rising edge, go
to Operational mode
Note:
Operation
Comments
Sample FAULT/SLPS and
select slope
After power-on, CS will not be sampled until VREG has stabized and an additional 600 µs has elapsed. The
microcontroller should toggle CS approximately 1mS after RESET to ensure that CS will be recognized.
© 2007 Microchip Technology Inc.
DS21730F-page 5
MCP201
1.4
Typical Applications
TYPICAL MCP201 APPLICATION(1,2)
FIGURE 1-2:
+12V
+12V
Optional components(5)
10 kΩ
WAKE-UP
+5V
VDD
CF Master Node Only
10 uF
+12V
27V
CG
VBAT
VREG
TXD
TXD
1 kΩ
MCP201
PIC®
MCU RXD
I/O
(4)
D2
24V
CS/WAKE
D1(3)
FAULT/SLPS
I/O
VSS
LIN bus
LIN
RXD
Optional components
VSS
VREG or VSS
100 kΩ
Note 1: The load capacitor, CG, should be a ceramic or tantalum rated for extended temperatures and be in
the range of 1.0 - 22 µF with an ESR 0.4Ω - 5Ω..
2: CF if the filter capacitor for the external voltage supply.
3: This diode is only needed if CS/WAKE is connected to 12V supply.
4: Transient suppressor diode. Vclamp L = 40V.
5: These components are for load dump protection.
FIGURE 1-3:
TYPICAL LIN NETWORK CONFIGURATION
40m
+ Return
LIN bus
1 kΩ
VBAT
LIN bus
MCP201
LIN bus
MCP201
LIN bus
MCP201
Slave 1
µC
Slave 2
µC
LIN bus
MCP201
Slave n <16
µC
Master
µC
DS21730F-page 6
© 2007 Microchip Technology Inc.
MCP201
1.5
1.5.3
Pin Descriptions
TABLE 1-3:
MCP201 PINOUT OVERVIEW
Devices
Function
8-Pin PDIP/
SOIC/DFN
Bond Pad
Name
Normal Operation
1
RXD
Receive Data Output
(CMOS output)
2
CS/WAKE
Chip Select (TTL-HV
input)
3
VREG
Power Output
4
TXD
Transmit Data Input
(TTL)
5
VSS
Ground
6
LIN
LIN bus (bidirectionalHV)
7
VBAT
Battery
8
FAULT/SLPS Fault Detect Output,
Slope Select Input
Legend: TTL = TTL input buffer,
HV = High Voltage (VBAT)
1.5.1
RECEIVE DATA OUTPUT (RXD)
The Receive Data Output pin is a standard CMOS
output and follows the state of the LIN pin.
The LIN receiver monitors the state of the LIN pin and
generates the output signal RXD.
1.5.2
CS/WAKE
Chip Select Input pin. This pin controls whether the part
goes into READY1 or READY mode at power-up. The
internal pull-down resistor will keep the CS/WAKE pin
low. This is done to ensure that no disruptive data will
be present on the bus while the microcontroller is
executing a Power-on Reset and I/O initialization
sequence. The pin must see a low-to-high transition to
activate the transmitter.
After CS/WAKE transitions to ‘1’, the transmitter is
enabled. If CS/WAKE = ‘0’, the device is in Ready1
mode on power-up or in Low-Power mode. In LowPower mode, the voltage regulator is shut down, the
transmitter driver is disabled and the receiver logic is
enabled.
An external switch (see Figure 1-2) can then wake up
both the transceiver and the microcontroller. An
external-blocking diode and current-limiting resistor are
necessary to protect the microcontroller I/O pin.
Note:
On POR, the MCP201 enters Ready or
Ready1 mode (see Figure 1-1). In order to
enter Operational mode, the MCP201 has
to see one rising edge on CS/WAKE
600 µs after the voltage regulator reaches
5V.
© 2007 Microchip Technology Inc.
POWER OUTPUT (VREG)
Positive Supply Voltage Regulator Output pin.
1.5.4
TRANSMIT DATA INPUT (TXD)
The Transmit Data Input pin has an internal pull-up to
VREG. The LIN pin is low (dominant) when TXD is low,
and high (recessive) when TXD is high.
In case the thermal protection detects an over-temperature condition while the signal TXD is low, the
transmitter is shutdown. The recovery from the thermal
shutdown is equal to adequate cooling time.
1.5.5
GROUND (VSS)
Ground pin.
1.5.6
LIN
The bidirectional LIN bus Interface pin is the driver unit
for the LIN pin and is controlled by the signal TXD. LIN
has an open collector output with a current limitation.
To reduce EMI, the edges during the signal changes
are slope-controlled.
1.5.7
BATTERY (VBAT)
Battery Positive Supply Voltage pin. This pin is also the
input for the internal voltage regulator.
1.5.8
FAULT/SLPS
FAULT Detect Output, Slope Select Input.
This pin is usually in Output mode. Its state is defined
as shown in Table 1-5.
The state of this pin is internally sampled during poweron of VBAT. Once VBAT has reached a stable level,
(approximately 6 VDC) and VREG is stable at 4.75 to
5.25 VDC, the state of this pin selects which slew rate
profile to apply to the LIN output. It is only during this
time that the pin is used as an input (the output driver
is off during this time). The slope will stay selected until
the next VBAT power-off/power-on sequence, regardless of any power-down, wake-up or SLEEP events.
Only a VBAT rising state will cause a sampling of the
FAULT/SLPS pin. The Slope selection will be made
irrespective of the state of any other pin.
The FAULT/SLPS pin is connected to either VREG or
VSS through a resistor (approximately 100 kΩ) to make
the slope selection. This large resistance allows the
FAULT indication function to overdrive the resistor in
normal operation mode.
If the FAULT/SLPS is high (‘1’), the normal slope shaping is selected (dv/dt = 2 V/µs). If FAULT/SLPS is low
(‘0’) during this time, the alternate slope-shaping is
selected (dv/dt = 4 V/µs). This mode can be used if a
user desires to run at a faster slope. This mode is not
LIN compliant.
DS21730F-page 7
MCP201
TABLE 1-4:
FAULT / SLPS SLOPE
SELECTION DURING POR
FAULT/SLPS
Slope Shaping
H
Normal
L
Alternate(1)
Note 1:
This pin is ‘0’ whenever the internal circuits
have detected a short or thermal excursion
and have disabled the LIN output driver.
Note:
Every time TX is toggled, a Fault condition
will occur for the length of time, depending
on the bus load. The Fault time is equal to
the propagation delay.
This mode does not conform to LIN bus
specification version 1.3, but might be
used for K-line applications.
TABLE 1-5:
TXD In
Note:
FAULT / SLPS TRUTH TABLE
RXD Out
LIN Bus I/O
Thermal
Override
FAULT / SLPS Out
Comments
L
H
VBAT
OFF
L
Bus shorted to battery
H
H
VBAT
OFF
H
Bus recessive
L
L
GND
OFF
H
Bus dominant
H
L
GND
OFF
L
Bus shorted to ground
x
x
VBAT
ON
L
Thermal excursion
Legend: x = don’t care
1.6
Internal Voltage Regulator
The MCP201 has a low drop-out voltage, positive
regulator capable of supplying 5.00 VDC ±5% at up to
50 mA of load current over the entire operating
temperature range. With a load current of 50 mA, the
minimum input-to-output voltage differential required
for the output to remain in regulation is typically +0.5V
(+1V maximum over the full operating temperature
range). Quiescent current is less than 1.0 mA, with a
full 50 mA load current, when the input-to-output
voltage differential is greater than +2V.
The regulator requires an external output bypass
capacitor for stability. The capacitor should be either a
ceramic or tantalum for stable operation over the
extended temperature range. The compensation
capacitor should range from 1.0 µf – 22 µf and have a
ESR or CSR of 0.4Ω – 5.0Ω. The input capacitor, CF, in
Figure 1.4 should be on the order of 8 to 10 times larger
than the output capacitor, CG.
Designed for automotive applications, the regulator will
protect itself from reverse battery connections, doublebattery jumps and up to +40V load dump transients.
The voltage regulator has both short-circuit and
thermal shutdown protection built-in.
6.0V. The device will come up in either READY1 or
READY mode and will have to be transitioned to
Operational mode to re-enable data transmission.
In the start phase, VBAT must be at least 6.0V
(Figure 1-4) to initiate operation during power-up. In
Power-down mode, the VBAT monitor will be turned off.
The regulator has a thermal shutdown. If the thermal
protection circuit detects an overtemperature condition
caused by an overcurrent condition (Figure 1-6) of the
regulator, it will shut down.
The regulator has an overload current limiting. During
a short-circuit, VREG is monitored. If VREG is lower than
3.5V, the regulator will turn off. After a thermal recovery
time, the VREG will be checked again. If there is no
short-circuit (VREG > 3.5V), the regulator will be
switched back on. The MCP201 will come up in either
READY1 or READY mode and will have to be
transitioned to Operational mode to re-enable data
transmission.
The accuracy of the voltage regulator, when using a
pass transistor, will degrade due to the extra external
components needed. All performance characteristics
should be evaluated on every design.
Regarding the correlation between VBAT, VREG and IDD,
please refer to Figure 1-4 through 1-6. When the input
voltage (VBAT) drops below the differential needed to
provide stable regulation, the output VREG will track the
input down to approximately 3.5V, at which point the
regulator will turn off. This will allow microcontrollers
with internal POR circuits to generate a clean arming of
the Power-on Reset trip point. The MCP201 will then
monitor VBAT and turn on the regulator when VBAT is
DS21730F-page 8
© 2007 Microchip Technology Inc.
MCP201
FIGURE 1-4:
VOLTAGE REGULATOR OUTPUT ON POWER-ON RESET
V BAT
-------------V
8
6
4
2
0
t
V REG
--------------V
5.5
3.5
3
0
t
(1)
Note 1:
2:
3:
© 2007 Microchip Technology Inc.
(2)
(3)
Start-up, VBAT < 6.0V, regulator off.
VBAT > 6.0V, regulator on.
VBAT ≤ 5.5V, regulator tracks VBAT, regulator will turn
off when VREG < 3.5V.
DS21730F-page 9
MCP201
FIGURE 1-5:
VOLTAGE REGULATOR OUTPUT ON POWER DIP
V BAT
-------------V
12
8
6
4
3.5
2
0
t
V REG
--------------V
5
4
3.5
3
0
t
(1)
Note 1:
2:
3:
4:
DS21730F-page 10
(2) (3) (4)
Voltage regulator on.
VREG ≤ 5.5V, regulator tracks VBAT until VREG < 3.5V.
VREG < 3.5V, regulator is off. If the voltage regulator should shut
off due to VREG falling below 3.5V, the VBAT must rise to 6.0V to
turn VREG back on.
VREG > 4.0V, voltage regulator tracks VDD, when VREG > 4.0V.
© 2007 Microchip Technology Inc.
MCP201
FIGURE 1-6:
VOLTAGE REGULATOR OUTPUT ON OVERCURRENT SITUATION
I REG
------------mA
50
0
6
t
V REG
--------------V
5
3.5
3
0
t
(1)
Note 1:
2:
1.7
(2)
IREG less than 50 mA, regulator on.
After IREG exceeds IREGmax, voltage regulator output will be reduced
until VREGoff is reached.
ICSP™ Considerations
The following should be considered when the MCP201
is connected to pins supporting in-circuit programming:
• Power used for programming the microcontroller
should be supplied from the programmer, not from
the MCP201
• The MCP201 should be left unpowered
• The voltage on VREG should not exceed the
maximum output voltage of VREG
• The TXD pin should not be brought high during
programming
© 2007 Microchip Technology Inc.
DS21730F-page 11
MCP201
NOTES:
DS21730F-page 12
© 2007 Microchip Technology Inc.
MCP201
2.0
ELECTRICAL CHARACTERISTICS
2.1
Absolute Maximum Ratings†
VIN DC Voltage on Logic pins except CS/WAKE ................................................................................. -0.3 to VREG+0.3V
VIN DC Voltage on CS/WAKE ...............................................................................................................-0.3 to VBAT+0.3V
VBAT Battery Voltage, non-operating (LIN bus recessive, no regulator load, t < 60s)....................................-0.3 to +40V
VBAT Battery Voltage, transient (Note 1)........................................................................................................-0.3 to +40V
VBAT Battery Voltage, continuous ..................................................................................................................-0.3 to +30V
VLBUS Bus Voltage, continuous.......................................................................................................................-18 to +30V
VLBUS Bus Voltage, transient (Note 1)............................................................................................................-27 to +40V
ILBUS Bus Short Circuit Current Limit ....................................................................................................................200 mA
ESD protection on LIN, VBAT (Human Body Model) (Note 2) .................................................................................. >4 kV
ESD protection on all other pins (Human Body Model) (Note 2) ............................................................................. >2 kV
Maximum Junction Temperature ............................................................................................................................. 150°C
Storage Temperature .................................................................................................................................. -55 to +150°C
Note 1: ISO 7637/1 load dump compliant (t < 500 ms).
2: According to JESD22-A114-B.
† NOTICE: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods
may affect device reliability.
© 2007 Microchip Technology Inc.
DS21730F-page 13
MCP201
2.2
DC Specifications
Electrical Characteristics:
Unless otherwise indicated, all limits are specified for:
VBAT = 6.0V to 18.0V
TAMB = -40°C to +125°C
CLOADREG = 10 µF
DC Specifications
Sym.
Parameter
Min.
Typ.
Max.
Units
Conditions
VBAT Quiescent Operating
Current (voltage regulator
without load and transceiver)
—
0.45
1.0
mA
IVREG = 0 mA, LIN bus pin
recessive, (Note 3)
IBAT
VBAT Power-down Current
transceiver only
—
23
50
µA
CS/WAKE = High, voltage
regulator disabled
IDDQ
VREG Quiescent Operating
Current
—
500
—
µA
(Note 2)
IVREG
VREG maximum output
current
—
—
50
mA
(Note 4)
Power
IBATQ
Microcontroller Interface
VIH
High-level Input Voltage
(TXD, FAULT/SLPS)
2.0
—
VREG + 0.3
V
VIL
Low-level Input Voltage
(TXD, FAULT/SLPS)
-0.3
—
0.15 x VREG
V
IIHTXD
High-level Output Current
(TXD)
-90
—
+30
µA
Input voltage = 4V
IILTXD
Low-level Output Current
(TXD)
-150
—
-10
µA
Input voltage = 1V (though
> 50 kΩ internal pull-up)
VIHCS/
High-level Input Voltage
(CS/WAKE)
3.0
—
VBAT
V
Through an external currentlimiting resistor (10 kΩ)
Low-level Input Voltage
(CS/WAKE)
-0.3
—
1.0
V
High-level Input Current
(CS/WAKE)
-10
—
+80
µA
Input voltage = 4V (though
>100 kΩ internal pull-down)
Low-level Input Current
(CS/WAKE)
5
—
30
µA
Input voltage = 1V
WAKE
VILCS/
WAKE
IIHCS/
WAKE
IILCS/
WAKE
VOHRXD
High-level Output Voltage
(RXD)
0.8
VREG
—
—
IOH = -4 mA
VOLRXD
Low-level Output Voltage
(RXD)
—
—
0.2 VREG
IOL = 4 mA
Note 1:
2:
3:
4:
Internal current limited. 2.0 ms typical recovery time (RLBUS = 0Ω, TX = 0.4 VREG, VLBUS = VBAT, TAMB =
25C. Recovery time highly dependent on ambient temperature, package and thermal resistance).
For design guidance only, not tested.
This current is at the VBAT pin.
The maximum power dissipation is a function of TJMAX, ΘJA and ambient temperature TA. The maximum
allowable power dissipation at an ambient temperature is PD = (TJMAX - TA)ΘJA. If this dissipation is
exceeded, the die temperature will rise above 150°C and the MCP201 will go into thermal shutdown.
DS21730F-page 14
© 2007 Microchip Technology Inc.
MCP201
2.2
DC Specifications (Continued)
Electrical Characteristics:
Unless otherwise indicated, all limits are specified for:
VBAT = 6.0V to 18.0V
TAMB = -40°C to +125°C
CLOADREG = 10 µF
DC Specifications
Sym.
Parameter
Min.
Typ.
Max.
Units
Conditions
Bus Interface
VIHLBUS
High-level Input Voltage
(LBUS)
0.6 VBAT
—
18
V
Recessive state
VILLBUS
Low-level Input Voltage
(LBUS)
-8
—
0.4 VBAT
V
Dominant state
0.05
VBAT
—
0.1 VBAT
V
VIH - VIL
VHYS
Input Hysteresis
IOL
Low-level Output Current
(LBUS)
40
—
200
mA
Output voltage = 0.1 VBAT,
VBAT = 12V
IO
High-level Output Current
(LBUS)
-20
—
20
µA
VBUS ≥ VBAT, VLBUS < 40V
IP
Pull-up Current on Input
(LBUS)
-180
—
-60
µA
Approx. 30 kΩ internal pull-up
@ VIH = 0.7 VBAT
ISC
Short-circuit Current-Limit
50
—
200
mA
(Note 1)
VOH
High-level Output Voltage
(LBUS)
0.8 VBAT
—
—
V
VOL
Low-level Output Voltage
(LBUS)
—
—
0.2 VBAT
V
Voltage Regulator
VREG
Output Voltage
4.75
—
5.25
V
0 mA > IOUT > 50 mA,
7.0V < VBAT < 18V
VREG1
Output Voltage
4.4
—
5.25
V
0 mA > IOUT > 50 mA,
6.0V < VBAT < 7.0V
ΔVREG1
Line Regulation
—
10
50
mV
IOUT = 1 mA, 7.0V < VBAT < 18V
ΔVREG2
Load Regulation
—
10
50
mV
5 mA < IOUT < 50 mA,
VBAT = Constant
VN
Output Noise Voltage
—
—
400
VSD
Shutdown Voltage
(monitoring VREG)
3.5
—
4.0
V
VON
Input Voltage to Turn On
Output (monitoring VBAT)
5.5
—
6.0
V
Note 1:
2:
3:
4:
µVRMS 1 VRMS @ 10 Hz - 100 kHz
See Figure 1-4
Internal current limited. 2.0 ms typical recovery time (RLBUS = 0Ω, TX = 0.4 VREG, VLBUS = VBAT, TAMB =
25C. Recovery time highly dependent on ambient temperature, package and thermal resistance).
For design guidance only, not tested.
This current is at the VBAT pin.
The maximum power dissipation is a function of TJMAX, ΘJA and ambient temperature TA. The maximum
allowable power dissipation at an ambient temperature is PD = (TJMAX - TA)ΘJA. If this dissipation is
exceeded, the die temperature will rise above 150°C and the MCP201 will go into thermal shutdown.
© 2007 Microchip Technology Inc.
DS21730F-page 15
MCP201
2.3
AC Specifications
Electrical Characteristics:
Unless otherwise indicated, all limits are specified for:
VBAT = 6.0V to 18.0V
TAMB = -40°C to +125°C
AC Specifications
Symbol
Parameter
Min
Typical
Max
Units
Conditions
Bus Interface
|dV/dt|
Slope Rising and Falling Edges
1.0
2.0
3.0
V/µ s
(40% to 60%), No Load
|dV/dt|
Slope Rising and Falling edges
ALTERNATE
2.0
4.0
6.0
V/µ s
(Note 1), No Load
Propagation Delay of Transmitter
—
—
6.0
µs
tRECPD = max
tTRANSPD
tRECPD
—
—
6.0
µs
(tRECPDR or tRECPDF)
tRECSYM
Propagation Delay of Receiver
Symmetry of Propagation Delay of
Receiver Rising Edge with Respect
to Falling Edge
-2.0
—
2.0
µs
tRECSYM = max
tTRANSSYM
Symmetry of Propagation Delay of
Transmitter Rising Edge with
Respect to Falling Edge
-2.0
—
2.0
µs
tTRANSSYM = max
(tTRANSPDF - tRANSPDR)
Bus Activity to Voltage Regulator
Enabled
10
—
40
µs
Bus debounce time
tVEVR
Voltage Regulator Enabled to
Ready
—
50
200
µs
(Note 2)
tVREGPOR
Voltage Regulator Enabled to
Ready after POR
—
—
2.5
ms
(Note 2) CLOAD = 25 nF
tCSOR
Chip Select to Operation Ready
0
50
200
µs
(Note 2)
tCSPD
Chip Select to Power-down
0
—
40
µs
(Note 2) No CLOAD
Short-Circuit to Shutdown
—
450
—
µs
Characterized but not
tested
Short-Circuit Recovery Time
—
2.0
—
ms
Characterized but not
tested (Note 3)
Voltage Regulator
tBACTVE
tSHUTDOWN
tSCREC
Note 1:
2:
3:
The mode does not conform to LIN Bus specification version 1.3.
Time depends on external capacitance and load.
Internal current limited. 2.0 ms typical recovery time (RLBUS = 0Ω, TX = 0.4 VREG, VLBUS = VBAT, TAMB =
25C. Recovery time highly dependent on ambient temperature, package, and thermal resistance).
TABLE 2-1:
MCP201 THERMAL SPECIFICATIONS
Sym
Min
Typical
Max
Units
θRECOVERY Recovery Temperature
(junction temperature)
—
+135
—
°C
Characterized but not
tested
θSHUTDOWN Shutdown Temperature
(junction temperature)
—
+155
—
°C
Characterized but not
tested
—
2.0
—
ms
Characterized but not
tested (Note 1)
tTHERM
Note 1:
Parameter
Thermal Recovery Time
(after Fault condition removed)
Test Conditions
Internal current limited. 2.0 ms typical recovery time (RLBUS = 0Ω, TX = 0.4 VREG, VLBUS = VBAT, TAMB =
25C. Recovery time highly dependent on ambient temperature, package, and thermal resistance).
DS21730F-page 16
© 2007 Microchip Technology Inc.
MCP201
2.4
Timing Diagrams and Specifications
FIGURE 2-1:
BUS TIMING DIAGRAM
TXD
LBUS
.6 VBAT
.4 VBAT
TTRANSPDR
TTRANSPDF
TRECPDF
TRECPDR
RXD
FIGURE 2-2:
REGULATOR TIMING DIAGRAM ON CS/WAKE SIGNAL
CS/WAKE
TCSOR
Regulator Stable
VREG
TCSPD
© 2007 Microchip Technology Inc.
DS21730F-page 17
MCP201
FIGURE 2-3:
REGULATOR TIMING DIAGRAM ON BUS ACTIVITY
Regulator Stable
VREG
TVEVR
TBACTVE
LBUS
.4 VBAT
FIGURE 2-4:
POR DIAGRAM
6V
VBAT
VREG
5.0V
tVREGPOR
DS21730F-page 18
© 2007 Microchip Technology Inc.
MCP201
3.0
CHARACTERIZATION GRAPHS
FIGURE 3-1:
IDD(mA) vs. VBAT
tCSPD (µs) vs. VBAT(V)
700
tCSPD (µs) -40(C)
tCSPD (µs) 25(C)
600
tCSPD (µs) 125(C)
tCSPD (µs)
500
400
300
200
100
dap/jx 3/5/03
30 parts Y1004 B2
0
4
6
8
10
12
14
16
18
20
VBAT(v)
© 2007 Microchip Technology Inc.
DS21730F-page 19
MCP201
FIGURE 3-2:
REGULATOR VOLTAGE (V) VS. REGULATOR CURRENT
Regulator Voltage (V) vs. Regulator Current (A)
5.25
VREGOUT (V) VBAT 18(V) -40(C)
VREGOUT (V) VBAT 14.4(V) -40(C)
VREGOUT (V) VBAT 8(V) -40(C)
VREGOUT (V) VBAT 6(V) -40(C)
VREGOUT (V) VBAT 18(V) 25(C)
VREGOUT (V) VBAT 14.4(V) 25(C)
VREGOUT (V) VBAT 8(V) 25(C)
VREGOUT (V) VBAT 6(V) 25(C)
VREGOUT (V) VBAT 18(V) 125(C)
VREGOUT (V) VBAT 14.4(V) 125(C)
VREGOUT (V) VBAT 8(V) 125(C)
VREGOUT (V) VBAT 6(V) 125(C)
5.15
Regulator Voltage (V)
5.05
4.95
4.85
4.75
4.65
4.55
4.45
dap/jx
2/28/03
30 parts
Y1004 B2
4.35
4.25
0
10
20
30
40
50
60
Regulator Current (mA)
DS21730F-page 20
© 2007 Microchip Technology Inc.
MCP201
FIGURE 3-3:
REGULATOR CHANGE (V) VS. LINE VOLTAGE CHANGE
Line Regulation
Regulator Change (V) vs Line Voltage Change (mV)
5
Regulator Change (mV) -40(C) Load = 50(mA)
0
Regulator Change (mV) -40(C) Load = 25(mA)
Regulator Change (mV)
Regulator Change (mV) -40(C) Load = 5(mA)
-5
Regulator Change (mV) -40(C) Load = 1(mA)
Regulator Change (mV) 25(C) Load = 50(mA)
-10
Regulator Change (mV) 25(C) Load = 25(mA)
Regulator Change (mV) 25(C) Load = 5(mA)
-15
Regulator Change (mV) 25(C) Load = 1(mA)
Regulator Change (mV) 125(C) Load = 50(mA)
-20
Regulator Change (mV) 125(C) Load = 25(mA)
Regulator Change (mV) 125(C) Load = 5(mA)
-25
Regulator Change (mV) 125(C) Load = 1(mA)
-30
dap/jx
3/3/03
30 parts
Y1004 B2
-35
-40
0
2
4
6
8
10
12
14
Line Voltage Change (V)
© 2007 Microchip Technology Inc.
DS21730F-page 21
MCP201
FIGURE 3-4:
LOAD REGULATION REGULATOR CHANGE VS. REGULATOR LOAD CHANGE
Load Regulation
Regulator Change (mV) vs. Regulator Load Change (mA)
70
Regulator Change (mV) -40C VBAT = 18V
Regulator Change (mV) -40C VBAT = 14.4V
60
Regular Charge (mV)
Regulator Change (mV) -40C VBAT = 8.0V
Regulator Change (mV) -40C VBAT = 6.0V
50
Regulator Change (mV) 25C VBAT = 18V
Regulator Change (mV) 25C VBAT = 14.4V
40
Regulator Change (mV) 25C VBAT = 8.0V
Regulator Change (mV) 25C VBAT = 6.0V
30
Regulator Change (mV) 125C VBAT = 18V
Regulator Change (mV) 125C VBAT = 14.4V
Regulator Change (mV) 125C VBAT = 8.0V
20
Regulator Change (mV) 125C VBAT = 6.0V
10
dap/jx
3/3/03
30 parts
Y1004 B2
0
0
10
20
30
40
50
60
Regular Load Current Change (mA)
DS21730F-page 22
© 2007 Microchip Technology Inc.
MCP201
FIGURE 3-5:
FALLING EDGE NORMAL DV/DT VS. VBAT
Falling Edge Normal dVdT (V/µs) vs. VBAT(v)
2.40
Falling Edge Normal
dVdT (V/µs) -40(C)
Falling Edge Normal dVdT (V/µs)
2.35
Falling Edge Normal
dVdT (V/µs) 25(C)
Falling Edge Normal
dVdT (V/µs) 125(C)
2.30
2.25
2.20
2.15
2.10
2.05
2.00
dap/jx
3/6/03
30 parts
Y1004 B2
1.95
1.90
4
6
8
10
12
14
16
18
20
VBAT(v)
© 2007 Microchip Technology Inc.
DS21730F-page 23
MCP201
FIGURE 3-6:
RISING EDGE NORMAL DV/DT VS. VBAT
Rising Edge Normal dV/dT (V/µs) vs. VBAT(V)
2.2
Rising Edge Normal
dVdT (V/µs) -40(C)
Rising Edge Normal
dVdT (V/µs) 25(C)
Rising Edge Normal
dVdT (V/µs) 125(C)
Rising Edge Normal dV/dT (V/µs)
2.1
2.0
1.9
1.8
dap/jx 3/6/03
30 parts Y1004 B2
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
4
6
8
10
12
14
16
18
20
VBAT(V)
DS21730F-page 24
© 2007 Microchip Technology Inc.
MCP201
FIGURE 3-7:
BUS ACTIVE VS. VBAT
tBACTIVE (µs) vs. VBAT(V)
55
tBACTIVE (µs) -40(C)
tBACTIVE (µs) 25(C)
tBACTIVE (µs) 125(C)
tBACTIVE (µs)
50
45
40
35
dap/jx 3/6/03
30 parts Y1004 B2
30
4
6
8
10
12
14
16
18
20
VBAT(V)
© 2007 Microchip Technology Inc.
DS21730F-page 25
MCP201
FIGURE 3-8:
VOLTAGE REGULATOR ACTIVE TIME VS. VBAT
tVEVR (µs) vs. VBAT(V)
10000
tVEVR (µs) -40(C)
tVEVR (µs) 25(C)
tVEVR (µs) 125(C)
tVEVR (µs)
1000
100
dap/jx 3/6/03
30 parts Y1004 B2
10
10
4
6
8
10
12
14
16
18
20
VBAT(v)
DS21730F-page 26
© 2007 Microchip Technology Inc.
MCP201
FIGURE 3-9:
CHIP SELECT TO OPERATION READY
tCSOR (µs) vs. VBAT(V)
14
tCSOR (µs) -40(C)
tCSOR (µs) 25(C)
13
tCSOR (µs) 125(C)
12
tCSOR (µs)
11
10
9
8
7
6
5
dap/jx 3/5/03
30 parts Y1004 B2
4
4
6
8
10
12
14
16
18
20
VBAT(v)
© 2007 Microchip Technology Inc.
DS21730F-page 27
MCP201
FIGURE 3-10:
CHIP SELECT TO POWER DOWN
tCSPD (µs) vs. VBAT(V)
700
tCSPD (µs) -40(C)
tCSPD (µs) 25(C)
600
tCSPD (µs) 125(C)
tCSPD (µs)
500
400
300
200
100
dap/jx 3/5/03
30 parts Y1004 B2
0
4
6
8
10
12
14
16
18
20
VBAT(v)
DS21730F-page 28
© 2007 Microchip Technology Inc.
MCP201
FIGURE 3-11:
PROPAGATION DELAY OF TRANSMITTER
tTRANSPD (µs) Rising Edge Normal vs. VBAT(V)
2.5
tTRANSPD (µs) Rising Edge
Normal -40(C)
2.4
tTRANSPD (µs) Rising Edge
Normal 25(C)
tTRANSPD (µs)
Rising Edge Normal
2.3
tTRANSPD (µs) Rising Edge
Normal 125(C)
2.2
2.1
2
1.9
1.8
1.7
1.6
dap/jx 3/6/03
30 parts Y1004 B2
1.5
4
6
8
10
12
14
16
18
20
VBAT(v)
© 2007 Microchip Technology Inc.
DS21730F-page 29
MCP201
FIGURE 3-12:
PROPAGATION DELAY OF RECEIVER
tRECPD (µs) Falling Edge Normal vs. VBAT(V)
tRECPD (µs)
Falling Edge Normal
3.3
tRECPD (µs) Falling Edge
Normal -40(C)
3.1
tRECPD (µs) Falling Edge
Normal 25(C)
2.9
tRECPD (µs) Falling Edge
Normal 125(C)
2.7
dap/jx 3/6/03
30 parts Y1004 B2
2.5
2.3
2.1
1.9
1.7
1.5
4
6
8
10
12
14
16
18
20
VBAT(v)
DS21730F-page 30
© 2007 Microchip Technology Inc.
MCP201
4.0
PACKAGING INFORMATION
4.1
Package Marking Information
8-Lead DFN-S
Example:
XXXXXXXX
XXXXXXXX
YYWW
NNN
MCP201
E/MF e3
0715
256
8-Lead PDIP (300 mil)
MCP201 e3
E/P256
0715
XXXXXXXX
XXXXXNNN
YYWW
8-Lead SOIC (150 mil)
XXXXXXXX
XXXXYYWW
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Example:
Example:
MCP201 e3
E/SN0715
256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
© 2007 Microchip Technology Inc.
DS21730F-page 31
MCP201
8-Lead Plastic Dual Flat, No Lead Package (MF) – 6x5 mm Body [DFN-S]
PUNCH SINGULATED
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
D1
L
b
N
N
K
E
E2
E1
EXPOSED
PAD
NOTE 1
2
2
1
1
NOTE 1
D2
TOP VIEW
BOTTOM VIEW
φ
A2
A
A1
A3
NOTE 2
Units
Dimension Limits
Number of Pins
MILLIMETERS
MIN
N
NOM
MAX
8
Pitch
e
Overall Height
A
–
1.27 BSC
0.85
1.00
Molded Package Thickness
A2
–
0.65
0.80
Standoff
A1
0.00
0.01
0.05
Base Thickness
A3
0.20 REF
Overall Length
D
4.92 BSC
Molded Package Length
D1
Exposed Pad Length
D2
Overall Width
E
Molded Package Width
E1
Exposed Pad Width
E2
2.16
2.31
Contact Width
b
0.35
0.40
0.47
Contact Length
L
0.50
0.60
0.75
Contact-to-Exposed Pad
K
0.20
–
–
Model Draft Angle Top
φ
–
–
12°
4.67 BSC
3.85
4.00
4.15
5.99 BSC
5.74 BSC
2.46
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package may have one or more exposed tie bars at ends.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-113B
DS21730F-page 32
© 2007 Microchip Technology Inc.
MCP201
8-Lead Plastic Dual In-Line (P) – 300 mil Body [PDIP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
N
NOTE 1
E1
1
3
2
D
E
A2
A
L
A1
c
e
eB
b1
b
Units
Dimension Limits
Number of Pins
INCHES
MIN
N
NOM
MAX
8
Pitch
e
Top to Seating Plane
A
–
–
.210
Molded Package Thickness
A2
.115
.130
.195
Base to Seating Plane
A1
.015
–
–
Shoulder to Shoulder Width
E
.290
.310
.325
Molded Package Width
E1
.240
.250
.280
Overall Length
D
.348
.365
.400
Tip to Seating Plane
L
.115
.130
.150
Lead Thickness
c
.008
.010
.015
Upper Lead Width
b1
.040
.060
.070
b
.014
.018
.022
eB
–
–
Lower Lead Width
Overall Row Spacing §
.100 BSC
.430
Notes:
1. Pin 1 visual index feature may vary, but must be located with the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
© 2007 Microchip Technology Inc.
DS21730F-page 33
MCP201
8-Lead Plastic Small Outline (SN) – Narrow, 3.90 mm Body [SOIC]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
e
N
E
E1
NOTE 1
1
2
3
α
h
b
h
A2
A
c
φ
L
A1
β
L1
Units
Dimension Limits
Number of Pins
MILLMETERS
MIN
N
NOM
MAX
8
Pitch
e
Overall Height
A
–
1.27 BSC
–
Molded Package Thickness
A2
1.25
–
–
Standoff §
A1
0.10
–
0.25
Overall Width
E
Molded Package Width
E1
3.90 BSC
Overall Length
D
4.90 BSC
1.75
6.00 BSC
Chamfer (optional)
h
0.25
–
0.50
Foot Length
L
0.40
–
1.27
Footprint
L1
1.04 REF
Foot Angle
φ
0°
–
8°
Lead Thickness
c
0.17
–
0.25
Lead Width
b
0.31
–
0.51
Mold Draft Angle Top
α
5°
–
15°
Mold Draft Angle Bottom
β
5°
–
15°
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-057B
DS21730F-page 34
© 2007 Microchip Technology Inc.
MCP201
APPENDIX A:
REVISION HISTORY
Revision F (January 2007)
This revision includes updates to the packaging
diagrams.
© 2007 Microchip Technology Inc.
DS21730F-page 35
MCP201
NOTES:
DS21730F-page 36
© 2007 Microchip Technology Inc.
MCP201
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
X
/XX
Device
Temperature
Range
Package
Device:
MCP201:
MCP201T:
LIN Transceiver with Voltage Regulator
LIN Transceiver with Voltage Regulator
(Tape and Reel)
Temperature Range:
I
E
= -40°C to +85°C
= -40°C to +125°C
Package:
MF = Dual Flatpack, No-Lead (6x5 mm Body), 8-lead
P
= Plastic DIP (300 mil Body), 8-lead
SN = Plastic SOIC (150 mil Body), 8-lead
© 2007 Microchip Technology Inc.
Examples:
a)
MCP201-E/SN:
Extended Temperature,
SOIC package.
b)
MCP201-E/P:
Extended Temperature,
PDIP package.
c)
MCP201-I/SN:
Industrial Temperature,
SOIC package.
d)
MCP201-I/P:
Industrial Temperature,
PDIP package.
e)
MCP201T-I/SN:
Tape and Reel,
Industrial Temperature,
SOIC package.
f)
MCP201T-E/SN: Tape and Reel,
Extended Temperature,
SOIC package.
g)
MCP201-E/MF:
h)
MCP201T-E/MF: Tape and Reel,
Extended Temperature,
DFN package.
Extended Temperature,
DFN package.
DS21730F-page 37
MCP201
NOTES:
DS21730F-page 38
© 2007 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, KEELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,
PRO MATE, PowerSmart, rfPIC, and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
SEEVAL, SmartSensor and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Linear Active
Thermistor, Mindi, MiWi, MPASM, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB,
rfPICDEM, Select Mode, Smart Serial, SmartTel, Total
Endurance, UNI/O, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona, Gresham, Oregon and Mountain View, California. The
Company’s quality system processes and procedures are for its PIC®
MCUs and dsPIC DSCs, KEELOQ® code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
© 2007 Microchip Technology Inc.
DS21730F-page 39
WORLDWIDE SALES AND SERVICE
AMERICAS
ASIA/PACIFIC
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Corporate Office
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Technical Support:
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Web Address:
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Tel: 86-29-8833-7250
Fax: 86-29-8833-7256
12/08/06
DS21730F-page 40
© 2007 Microchip Technology Inc.