Material Content Data Sheet Sales Product Name IKA08N65H5 Issued MA# MA001030830 Package PG-TO220-3-111 29. August 2013 Weight* 2239.24 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material non noble metal noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus antimony silver tin phosphorus iron copper 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-36-0 7440-22-4 7440-31-5 7723-14-0 7439-89-6 7440-50-8 0.784 0.04 0.687 0.03 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.04 350 350 307 0.206 0.01 686.221 30.65 30.69 306454 92 306853 2.282 0.10 0.10 1019 1019 2.214 0.10 989 208.161 9.30 896.862 40.04 49.44 400521 494472 7.942 0.35 0.35 3547 3547 0.305 0.01 0.001 0.00 0.090 0.00 0.224 0.01 0.582 0.03 0.130 0.01 0.433 0.02 432.110 19.30 92961 136 0.01 1 100 0.04 260 2. 3. 193 19.33 192972 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 400 58 Important Remarks: 1. 136 40 193223 1000000