FPF2174 IntelliMAX™ Advanced Load Management Products tm Features General Description 1.8 to 5.5V Input Voltage Range The FPF2174 is a load switch which combines the functionality of the IntelliMAXTM series load switch with a very low forward voltage drop Schottky barrier rectifier and a zener clamp at the output. The integrated solution provides full protection to systems and loads which may encounter large current conditions in a very compact MLP 3x3 package. This device contain a 0.125Ω current-limited P-channel MOSFET which can operate over an input voltage range of 1.8-5.5V. The Schottky diode acts as a barrier so that no reverse current can flow when the MOSFET is off and the output voltage is higher than the input voltage. Switch control is by a logic input (ON) capable of interfacing directly with low voltage control signals. Each part contains thermal shutdown protection which shuts off the switch to prevent damage to the part when a continuous over-current condition causes excessive heating. Controlled Turn-On 200mA Current Limit Option Undervoltage Lockout Thermal Shutdown <1µA Shutdown Current Fast Current limit Response Time 3µs to Moderate Over Currents 20ns to Hard Shorts Integrated very low VF Schottky Diode for Reverse Current Blocking Integrated Zener Diode for Output Clamp Applications When the switch current reaches the current limit, the part operates in a constant-current mode to prohibit excessive currents from causing damage. If the constant current condition still persists after 10ms, these parts will shut off the switch and pull the fault signal pin (FLAGB) low. The switch will remain off until the ON pin is cycled. The minimum current limit is 200mA. PDAs Cell Phones GPS Devices MP3 Players These parts are available in a space-saving 6L MLP 3x3 package. Digital Cameras Peripheral Ports Hot Swap Supplies Typical Application Circuit TO LOAD VOUT VIN FPF2174 OFF ON ON FLAGB GND ©2006 Fairchild Semiconductor Corporation FPF2174 Rev. B1 1 www.fairchildsemi.com FPF2174 IntelliMAX™ Advanced Load Management Products May 2006 VOUT VIN UVLO CONTROL LOGIC ON CURRENT LIMIT THERMAL SHUTDOWN FLAGB GND Pin Configuration 1 8 6 3 2 7 5 4 3x3 MLP BOTTOM VIEW Pin Description Pin Name Function 1 VIN Supply Input: Input to the power switch and the supply voltage for the IC 2 NC No Connect 3, 7 VOUT Switch Output: Output of the power switch 4 GND Ground 5 FLAGB 6 ON 8 PAD1 FPF2174 Rev.B1 Fault Output: Active LO, open drain output which indicates an over current supply, under voltage or over temperature state. ON Control Input IC substrate. Can be connected to GND. Do not connect to other pins. 2 www.fairchildsemi.com FPF2174 IntelliMAX™ Advanced Load Management Products Functional Block Diagram Parameter Min. Max. Unit VIN, ON, FLAGB to GND -0.3 6 V VOUT to GND -0.3 20 V Power Dissipation @ TA = 25°C ( note 1) - 1.4 W Operating Temperature Range -40 85 °C Storage Temperature -65 150 °C - 70 °C/W HBM 4000 - V MM 400 - V Thermal Resistance, Junction to Ambient Electrostatic Discharge Protection Recommended Operating Range Parameter Min. Max. Unit VIN 1.8 5.5 V Ambient Operating Temperature, TA -40 85 °C Electrical Characteristics VIN = 1.8 to 5.5V, TA = -40 to +85°C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25°C. Parameter Symbol Conditions Min. Typ. Max Units 1.8 - 5.5 V µA Basic Operation Operating Voltage VIN Quiescent Current IQ IOUT = 0mA VIN = 1.8 to 3.3V - 95 - VON ACTIVE VIN = 3.3 to 5.5V - 110 200 Shutdown Current ISHDN VON = 0V, IOUT = 0mA - - 1 µA Latch-off Current ILATCHOFF VON =VIN, after an overcurrent fault - 50 - µA Reverse Block Leakage Current IR VOUT = 12V, VIN = VON = 0V, TA = 25°C - - 10 µA IOUT = 1mA - 15 - V TA = 25°C, IOUT = 150mA - V Reverse Breakdown Voltage Dropout Voltage VDROP TA = 85°C, IOUT = 150mA TA = -40°C, IOUT = 150mA ON Input Logic High Voltage (ON) VIH ON Input Logic Low Voltage VIL ON Input Leakage Off Switch Leakage FLAGB Output Logic Low Voltage FLAGB Output High Leakage Current FPF2174 Rev.B1 ISWOFF 0.3 0.4 0.23 - - 0.36 - VIN = 1.8V 0.75 - - VIN = 5.5V 1.3 - - VIN = 1.8V - - 0.5 VIN = 5.5V - - 1.0 VON = VIN or GND - - 1 µA V V VON = 0V, VOUT = 0V - - 1 µA VIN = 5V, ISINK = 10mA - - 0.2 V VIN = 1.8V, ISINK = 10mA - - 0.3 VIN = 5V, Switch on - - 1 3 µA www.fairchildsemi.com FPF2174 IntelliMAX™ Advanced Load Management Products Absolute Maximum Ratings VIN = 1.8 to 5.5V, TA = -40 to +85°C unless otherwise noted. Typical values are at VIN = 3.3V and TA = 25°C. Parameter Symbol Typ. Max Units 200 300 400 mA - 140 - °C Return from Shutdown - 130 - Hysteresis - 10 - 1.5 1.6 1.7 V - 47 - mV Conditions Min. Protections Current Limit ILIM Thermal Shutdown Under Voltage Shutdown VIN = 3.3V, VOUT = 2.0V Shutdown Threshold UVLO VIN Increasing Under Voltage Shutdown Hysteresis Zener Clamp Voltage VZ IZ = 1mA - 15 - V Zener Leakage IZ VZ = 12V - - 10 µA Turn on time tON RL=500Ω, CL=0.1µF - 25 50 µs Turn off time tOFF RL=500Ω, CL=0.1µF - 20 40 µs VOUT Rise Time tR RL=500Ω, CL=0.1µF - 14 30 µs VOUT Fall Time tF RL=500Ω, CL=0.1µF Over Current Blanking Time tBLANK Dynamic Short Circuit Response Time - 126 250 µs 5 10 20 ms VIN = VON = 3.3V. Moderate Over-Current Condition. - 3 - µs VIN = VON = 3.3V. Hard Short. - 20 - ns Note 1: Package power dissipation on 1 spuare inch pad, 2 oz copper board. FPF2174 Rev.B1 4 www.fairchildsemi.com FPF2174 IntelliMAX™ Advanced Load Management Products Electrical Characteristics Cont. 120 VIN = 5.5V VON = VIN 110 SUPPLY CURRENT (uA) SUPPLY CURRENT (uA) 120 100 90 80 70 60 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 110 VIN = 3.3V 100 90 VIN = 1.8V 80 70 60 -40 6.0 -15 SUPPLY VOLTAGE (V) Figure 1. Quiescent Current vs. Input Voltage 35 60 85 Figure 2. Quiescent Current vs. Temperature 0.6 2.0 SUPPLY CURRENT (uA) 1.8 SUPPLY CURRENT (uA) 10 TJ, JUNCTION TEMPERATURE(oC) 1.6 1.4 1.2 1.0 0.8 VIN = 5.5V 0.6 0.4 VIN = 3.3V 0.2 0.0 -40 -15 10 35 60 0.5 0.4 0.3 VIN = 5.5V 0.2 VIN = 3.3V 0.1 0.0 -40 85 TJ, JUNCTION TEMPERATURE(oC) Figure 3. ISHUTDOWN Current vs. Temperature -15 10 35 60 TJ, JUNCTION TEMPERATURE(oC) 85 Figure 4. ISWITCH-OFF Current vs. Temperature 1.8 60 1.6 ON THRESHOLD (V) SUPPLY CURRENT (uA) VIN = 3.3V 50 40 30 1.4 1.2 1.0 0.8 0.6 20 -40 -15 TJ, JUNCTION 10 35 60 0.4 1.5 85 Figure 5. Latchoff current vs. Temperature FPF2174 Rev.B1 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 VIN,INUT VOLTAGE (V) TEMPERATURE(oC) Figure 6. Input Voltage vs. On Threshold Voltage 5 www.fairchildsemi.com FPF2174 IntelliMAX™ Advanced Load Management Products Typical Characteristics 400 375 OUTPUT CURRENT (mA) OUTPUT CURRENT (mA) 400 350 325 300 275 250 225 200 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 350 300 250 200 -40 5.5 6.0 -15 60 85 TJ, JUNCTION TEMPERATURE ( C) Figure 7. Current Limit vs. Output Voltage Figure 8. Current Limit vs. Temperature 345 500 DROPOUT VOLTAGE (mV) IOUT = 150mA 330 315 300 285 VIN = 3.3V IOUT = 150mA 450 400 350 300 250 200 150 270 1 2 3 4 5 100 -40 6 10 35 60 85 o TJ,JUNCTION TEMPERATURE ( C) Figure 9. Drop Voltage vs. Input Voltage Figure 10. Drop Voltage vs. Temperature 16.0 40 15.9 35 15.8 15.7 15.6 30 TON 25 20 TOFF 15 15.5 15.4 -15 VIN, INPUT VOLTAGE (V) DELAY TIMES (uS) DROPOUT VOLTAGE (mV) 35 o V IN ,IN UT VOLTAG E (V) ZENER VOLTAGE (V) 10 0 5 10 15 10 -40 20 10 35 60 85 o ZENER CURRENT (mA) Figure 12. TON/TOff vs. Temperature Figure 11. Zener Voltage vs. Zener Current FPF2174 Rev.B1 -15 TJ, JUNCTION TEMPERATURE ( C) 6 www.fairchildsemi.com FPF2174 IntelliMAX™ Advanced Load Management Products Typical Characteristics 14 FLAG-BLANKING TIME (mS) DELAY TIMES (uS) 1000 TFALL 100 TRISE 10 1 -40 -15 10 35 60 13 12 11 10 9 8 -40 85 10 35 60 85 TJ, JUNCTION TEMPERATURE ( C ) TJ, JUNCTION TEMPERATURE ( C) Figure 13. TRise/TFall vs. Temperature Figure 14. TBLANK vs Temperature V DRV 2V/DIV VIN = VON =3.3V CIN=10uF CL=0.1uF VON 2V/DIV IOUT 200mA/DIV VIN=3.3V CIN=10uF CL=0.1uF RLOAD=500Ω IOUT 10mA/DIV VOUT 2V/DIV 5ms/DIV 100us/DIV Figure 15. TBLANK Response VON 2V/DIV -15 o o FLAGB 2V/DIV V IN = 3.3V Figure 16. TON Response VIN=3.3V CIN=10uF CL=0.1uF RLOAD=500Ω VOUT 2V/DIV CIN=10uF CL=0.1uF IOUT 5A/DIV IOUT 10mA/DIV VIN 2V/DIV 200ns/DIV 20us/DIV Figure 18. Short Circuit Response Time (Output Shorted to GND) Figure 17. TOFF Response FPF2174 Rev.B1 7 www.fairchildsemi.com FPF2174 IntelliMAX™ Advanced Load Management Products Typical Characteristics VIN 2V/DIV CIN=10uF CL=0.1uF VIN 2V/DIV CIN=10uF CL=0.1uF RL=4.7Ω VON 2V/DIV IOUT 200mA/DIV IOUT 200mA/DIV 50us/DIV 50uS/DIV Figure 19. Current Limit Response Time (Switch power up to hard short) FPF2174 Rev.B1 Figure 20. Current Limit Response Time (Output has a 4.7Ω load) 8 www.fairchildsemi.com FPF2174 IntelliMAX™ Advanced Load Management Products Typical Characteristics Thermal Shutdown The FPF2174 is a current limited switch that protects systems and loads which can be damaged or disrupted by the application of high currents. The core of the device is a 0.125Ω P-channel MOSFET and a controller capable of functioning over a wide input operating range of 1.8-5.5V paired with a low forward voltage drop Schottky diode for reverse blocking and a 16V zener diode for output clamp. The controller protects against system malfunctions through current limiting, undervoltage lockout and thermal shutdown. The current limit is preset for 200mA. The thermal shutdown protects the die from internally or externally generated excessive temperatures. During an over-temperature condition the FLAGB is activated and the switch is turned-off. The switch automatically turns-on again if temperature of the die drops below the threshold temperature. On/Off Control The ON pin controls the state of the switch. Activating ON continuously holds the switch in the on state so long as there is no under-voltage on VIN or a junction temperature in excess of 150°C. ON is active HI and has a low threshold making it capable of interfacing with low voltage signals. When the MOSFET is off, the Schottky diode acts as a barrier so that no reverse current can flow when VOUT is greater than VIN. Fault Reporting Upon the detection of an over-current, an input under-voltage, or an over-temperature condition, the FLAGB signals the fault mode by activating LO. The FLAGB goes LO at the end of the blanking time and is latched LO and ON must be toggled to release it. FLAGB is an open-drain MOSFET which requires a pull-up resistor between VIN and FLAGB. During shutdown, the pull-down on FLAGB is disabled to reduce current draw from the supply. Current Limiting The current limit guarantees that the current through the switch doesn't exceed a maximum value while not limiting at less than a minimum value. The minimum current is 200mA and the maximum current is 400mA. The device has a blanking time of 10ms, nominally, during which the switch will act as a constant current source. At the end of the blanking time, the switch will be turned-off and the FLAGB pin will activate to indicate that current limiting has occurred. Under-Voltage Lockout The under-voltage lockout turns-off the switch if the input voltage drops below the under-voltage lockout threshold. With the ON pin active the input voltage rising above the under-voltage lockout threshold will cause a controlled turn-on of the switch which limits current over-shoots. Ordering Information Part Current Limit [mA] Current Limit Blanking Time [ms] Auto-Restart Time [ms] ON Pin Activity Top Mark FPF2174 200 10 NA Active HI 2174 FPF2174 Rev.B1 9 www.fairchildsemi.com FPF2174 IntelliMAX™ Advanced Load Management Products Description of Operation Typical Application To Load VOUT VIN FPF2174 Battery 5.5V OFF ON C1 = 10µF ON R1 = 100KΩ FLAGB GND 5.5V MAX C2 = 0.1µF Input Capacitor To limit the voltage drop on the input supply caused by transient in-rush currents when the switch turns-on into a discharged load capacitor or a short-circuit, a capacitor needs to be placed between VIN and GND. A 0.1uF ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher values of CIN can be used to further reduce the voltage drop. Output Capacitor A 0.1uF capacitor COUT, should be placed between VOUT and GND. This capacitor will prevent parasitic board inductances from forcing VOUT below GND when the switch turns-off. Power Dissipation During normal operation as a switch, the power dissipation is small and has little effect on the operating temperature of the part. The parts with the higher current limits will dissipate the most power and that will only be typically, P = I LIM × V DROP = 0.4 × 0.4 = 160mW (2) When using the part, attention must be given to the manual resetting of the part. Continuously resetting the part at a high duty cycle when a short on the output is present can cause the temperature of the part to increase. The junction temperature will only be allowed to increase to the thermal shutdown threshold. Once this temperature has been reached, toggling ON will not turn-on the switch until the junction temperature drops. Board Layout For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal and short-circuit operation. Using wide traces for VIN, VOUT and GND will help minimize parasitic electrical effects along with minimizing the case to ambient thermal impedance. FPF2174 Rev.B1 10 www.fairchildsemi.com FPF2174 IntelliMAX™ Advanced Load Management Products Application Information FPF2174 IntelliMAX™ Advanced Load Management Products Dimensional Outline and Pad Layout Package MLP06H FPF2174 Rev.B1 11 www.fairchildsemi.com The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks. 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FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. No Identification Needed Full Production This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only. Rev. I19 FPF2174 Rev.B1 12 www.fairchildsemi.com FPF2174 IntelliMAX™ Advanced Load Management Products TRADEMARKS