Bourns CD0402-T12LC Cd0402-txxlc - tvs diode array sery Datasheet

PL
IA
NT
Features
CO
M
■
*R
oH
S
■
■
■
■
■
Applications
Lead free as standard
RoHS compliant*
Protects 1 line
Bidirectional configuration
ESD protection
Low capacitance
■
■
■
■
Cell phones
PDAs and notebooks
Digital cameras
MP3 players and GPS
CD0402-TxxLC – TVS Diode Array Series
General Information
The markets of portable communications, computing and video equipment are
challenging the semiconductor industry to develop increasingly smaller electronic
components.
Bourns offers Transient Voltage Suppressor Array diodes for surge and ESD
protection applications, in 0402 chip package size format. The Transient Voltage
Supressor Array series offers a choice of voltage types ranging from 3 V to 36 V in a
bidirectional configuration. Bourns® Chip Diodes conform to JEDEC standards, are
easy to handle on standard pick and place equipment and their flat configuration
minimizes roll away.
The Bourns® device will meet IEC 61000-4-2 (ESD), IEC 61000-4-4 (EFT) and IEC
61000-4-5 (Surge) requirements.
Electrical & Thermal Characteristics (@ TA = 25 °C Unless Otherwise Noted)
Parameter
Peak Pulse Power (tp = 8/20 µs)
1
Symbol
Value
Unit
PPP
250
W
TJ
-55 ˚C to 150 ˚C
˚C
TSTG
-55 ˚C to 150 ˚C
˚C
Operating Temperature
Storage Temperature
CD0402Parameter
Symbol
T3.3LC
T05LC
T08LC
T12LC
T15LC
T24LC
T36LC
Unit
Min. Breakdown Voltage @ 1 mA
VBR
4.0
6.0
8.5
13.3
16.7
26.7
40.0
V
Working Peak Voltage
VWM
3.3
5.0
8.0
12.0
15.0
24.0
36.0
V
Maximum Clamping Voltage @ IP2
VF
7.0
11.0
13.4
19.0
24
43
64
V
Maximum Clamping Voltage
@ 8/20 µs VC @ IPP2
VF
12.5 V
@ 16 A
Maximum Leakage Current @ VWM
ID
75
3
10
1
1
1
1
1
µA
Typical Capacitance @ 0 V, 1 MHz
C
70
35
32
30
25
20
18
pF
Notes:
1. See Peak Pulse Power vs. Pulse Time.
2. See Pulse Wave Form.
3. Max. Leakage Current <5 µA @ 2.8 V.
4. Max. Leakage Current <500 nA @ 3.3 V.
All devices are bidirectional. Electrical Characteristics apply in both directions.
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
13.5 V
18 V
26.9 V 34.5 V
@ 15 A @ 11 A @ 7.4 A @ 5.8 A
4
50.6 V 80 V
@ 5 A @ 2.5 A
V
CD0402-TxxLC – TVS Diode Array Series
Product Dimensions
Recommended Footprint
This is a 0402 package with lead free 100 % Sn plating on the
bond pads. It weighs approximately 30 mg and has a flammability
rating of UL 94V-0.
A
A
B
C
B
C
D
G
Dimensions (Nominal)
D
A
0.69
0.027
B
0.46
0.018
C
0.20
0.008
D
0.46
0.018
E
H
F
I
Dimensions
DIMENSIONS =
A
0.41 - 0.51
0.016 - 0.020
B
0.81 - 0.91
0.032 - 0.036
C
0.96 - 1.02
0.038 - 0.040
D
0.10
NOM.
0.004
E
0.35
NOM.
0.014
F
G
0.46 - 0.51
0.018 - 0.020
0.20
NOM.
0.008
H
0.076 - 0.127
0.003 - 0.005
I
0.401 - 0.411
0.014 - 0.018
DIMENSIONS =
MILLIMETERS
(INCHES)
How To Order
CD 0402 - T 05 LC
Common Code
Chip Diode
Package
• 0402 = 0402 Chip Package
Model
T = Transient Voltage Supressor
Working Peak Reverse Voltage
3.3 = 3.3 VRWM (Volts)
05 = 5 VRWM (Volts)
08 = 8 VRWM (Volts)
12 = 12 VRWM (Volts)
15 = 15 VRWM (Volts)
24 = 24 VRWM (Volts)
36 = 36 VRWM (Volts)
Suffix
LC = Low Capacitance Bidirectional Diode
MILLIMETERS
(INCHES)
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
CD0402-TxxLC – TVS Diode Array Series
Performance Graphs
Peak Pulse Power vs Pulse Time
Pulse Wave Form
120
1,000
IPP – Peak Pulse Current (% of IPP)
PPP – Peak Pulse Current (W)
10,000
250 W, 8/20 µs Waveform
100
10
0.01
1
10
100
1,000
80
et
60
40
td = t|IPP/2
20
0
10,000
0
td – Pulse Duration (µs)
5
10
15
20
25
30
t – Time (µs)
Power Derating Curve
Overshoot & Clamping Voltage
35
100
Peak Pulse Power
8/20 µs
80
5 Volts per Division
% of Rated Power
Test Waveform Parameters
tt = 8 µs
td = 20 µs
tt
100
60
40
20
Average Power
25
15
5
0
0
25
50
75
100
125
150
-5
-90.000 ns
TL – Lead Temperature (°C)
10.000 ns
ESD Test Pulse - 25 kilovolt, 1/30 ns (waveshape)
Typical Clamping Voltage vs. Peak Pulse Current
VC - Clamping Voltage - Volts
14
12
10
8
6
4
2
0
0
5
10
15
IPP – Peak Pulse Current - Amps
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
20
110.000
CD0402-TxxLC – TVS Diode Array Series
Block Diagram
Typical Part Marking
There is no part marking on the back side of the devices. The part
number for the device is located on the Tape and Reel label.
Packaging
The surface mount product is packaged in an 8 mm x 4 mm Tape and Reel format per EIA-481 standard.
TOP SIDE VIEW
(INTO COMPONENT POCKET)
DIMENSIONS =
MILLIMETERS
(INCHES)
4.0 ± 0.1
(.16 ± .004)
0.3 ± 0.05
(.01 ± .002)
1.5 ± 0.1/-0
(.06 ± .004/-0)
DIA.
2.0 ± 0.05
(.08 ± .002)
R
1.75 ± 0.1
(.07 ± .004)
0.3
MAX.
(0.01)
0.76 ± 0.1
(.03 ± .004)
8.0 ± 0.3
(.31 ± .01)
1.52 ± 0.1
(.06 ± .004)
3.5 ± 0.3
(.14 ± .01)
1.18 ± 0.1
(.05 ± .004)
4.0 ± 0.3
(.16 ± .01)
ORIENTATION
OF COMPONENT
IN POCKET
R 0.25 TYP.
(0.010)
BACKSIDE FACING UP
Reliable Electronic Solutions
Asia-Pacific:
Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116
Europe:
Tel: +41-41 768 5555 • Fax: +41-41 768 5510
The Americas:
Tel: +1-951 781-5500 • Fax: +1-951 781-5700
www.bourns.com
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
COPYRIGHT© 2005, BOURNS, INC. LITHO IN U.S.A., IPA0524 10/05
Similar pages