LMV331-Q1 SINGLE, LMV393-Q1 DUAL SLOS468D – MAY 2005 – REVISED AUGUST 2011 www.ti.com GENERAL-PURPOSE LOW-VOLTAGE COMPARATORS Check for Samples: LMV331-Q1 SINGLE, LMV393-Q1 DUAL FEATURES 1 • • • LMV393...D PACKAGE (TOP VIEW) Qualified for Automotive Applications 2.7-V and 5-V Performance Low Supply Current – LMV331 . . . 60 μA Typ – LMV393 . . . 100 μA Typ Input Common-Mode Voltage Range Includes Ground Low Output Saturation Voltage . . . 200 mV Typ Open-Collector Output for Maximum Flexibility • • • 1OUT 1IN– 1IN+ GND 1 8 2 7 3 6 4 5 VCC+ 2OUT 2IN– 2IN+ LMV331...DBV PACKAGE (TOP VIEW) IN+ 1 GND 2 IN– 3 5 VCC+ 4 OUT DESCRIPTION/ORDERING INFORMATION The LMV393-Q1 device is a low-voltage (2.7 V to 5.5 V) version of the dual and quad comparators, LM393 and LM339, which operate from 5 V to 30 V. The LMV331-Q1 is the single-comparator version. The LMV331-Q1 and LMV393-Q1 are the most cost-effective solutions for applications where low-voltage operation, low power, space saving, and price are the primary specifications in circuit design for portable consumer products. These devices offer specifications that meet or exceed the familiar LM339 and LM393 devices at a fraction of the supply current. ORDERING INFORMATION (1) TA –40°C to 125°C (1) (2) (3) PACKAGE Single Dual (2) ORDERABLE PART NUMBER TOP-SIDE MARKING (3) SOT23-5 – DBV Reel of 3000 LMV331QDBVRQ1 LADQ SOIC – D Reel of 2500 LMV393QDRQ1 V393Q1 For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. DBV: The actual top-side marking has one additional character that designates the wafer fab/assembly site. Figure 1. SYMBOL (EACH COMPARATOR) IN− − IN+ + OUT 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. UNLESS OTHERWISE NOTED this document contains PRODUCTION DATA information current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2005–2011, Texas Instruments Incorporated LMV331-Q1 SINGLE, LMV393-Q1 DUAL SLOS468D – MAY 2005 – REVISED AUGUST 2011 www.ti.com Figure 2. SIMPLIFIED SCHEMATIC VCC+ Q6 Q7 M IN+ Q1 Q2 Q3 Q4 OUT Q5 IN− R1 R2 R3 GND 2 Copyright © 2005–2011, Texas Instruments Incorporated LMV331-Q1 SINGLE, LMV393-Q1 DUAL SLOS468D – MAY 2005 – REVISED AUGUST 2011 www.ti.com Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) MIN (2) VCC+ Supply voltage VID Differential input voltage (3) VI Input voltage range (either input) 0 D (8-pin) package Package thermal impedance (4) θJA (5) Operating virtual junction temperature Tstg Storage temperature range (1) (2) (3) (4) (5) UNIT 5.5 V ±5.5 V 5.5 V 97 D (14-pin) package 86 DBV package TJ MAX °C/W 206 –65 150 °C 150 °C Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltage values (except differential voltages and VCC+ specified for the measurement of IOS) are with respect to the network GND. Differential voltages are at IN+ with respect to IN–. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Selecting the maximum of 150°C can affect reliability. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions VCC+ Supply voltage (single-supply operation) VOUT Output voltage TA Operating free-air temperature Copyright © 2005–2011, Texas Instruments Incorporated MIN MAX 2.7 5.5 –40 UNIT V VCC+ + 0.3 V 125 °C 3 LMV331-Q1 SINGLE, LMV393-Q1 DUAL SLOS468D – MAY 2005 – REVISED AUGUST 2011 www.ti.com Electrical Characteristics at specified free-air temperature, VCC+ = 2.7 V, GND = 0 V (unless otherwise noted) PARAMETER TEST CONDITIONS VIO Input offset voltage αVIO Average temperature coefficient of input offset voltage IIB Input bias current IIO Input offset current IO Output current (sinking) TA MIN 25°C MAX 1.7 7 –40°C to 125°C 5 25°C 10 –40°C to 125°C 25°C 5 VO ≤ 1.5 V 25°C 25°C Common-mode input voltage range VSAT Saturation voltage IO ≤ 1 mA 23 –0.1 to 2 25°C 200 Supply current LMV393 (both comparators) 25°C LMV339 (all four comparators) mV nA nA mA 1 25°C LMV331 50 0.003 –40°C to 125°C VICR 250 150 5 UNIT μV/°C 400 –40°C to 125°C Output leakage current ICC TYP μA V mV 40 100 70 140 140 200 μA Switching Characteristics TA = 25°C, VCC+ = 2.7 V, RL = 5.1 kΩ, GND = 0 V (unless otherwise noted) PARAMETER tPHL Propagation delay, high- to low-level output switching tPLH Propagation delay, low- to high-level output switching 4 TEST CONDITIONS TYP Input overdrive = 10 mV 1000 Input overdrive = 100 mV 350 Input overdrive = 10 mV 500 Input overdrive = 100 mV 400 UNIT ns ns Copyright © 2005–2011, Texas Instruments Incorporated LMV331-Q1 SINGLE, LMV393-Q1 DUAL SLOS468D – MAY 2005 – REVISED AUGUST 2011 www.ti.com Electrical Characteristics at specified free-air temperature, VCC+ = 5 V, GND = 0 V (unless otherwise noted) PARAMETER TEST CONDITIONS TA 25°C VIO Input offset voltage αVIO Average temperature coefficient of input offset voltage IIB Input bias current IIO Input offset current IO Output current (sinking) TYP MAX 1.7 7 –40°C to 125°C 9 25°C 5 25°C 25 –40°C to 125°C 2 –40°C to 125°C VO ≤ 1.5 V 25°C 10 Common-mode input voltage range 25°C AVD Large-signal differential voltage gain 25°C VSAT Saturation voltage 25°C IO ≤ 4 mA 84 Supply current –0.1 to 4.2 20 25°C –40°C to 125°C 25°C LMV393 (both comparators) 25°C –40°C to 125°C μA 400 mV 120 150 100 –40°C to 125°C LMV339 (all four comparators) nA V/mV 700 60 nA V 50 200 mV mA 1 –40°C to 125°C LMV331 50 0.003 –40°C to 125°C VICR 250 150 25°C UNIT μV/°C 400 25°C Output leakage current ICC MIN 200 250 170 μA 300 350 Switching Characteristics TA = 25°C, VCC+ = 5 V, RL = 5.1 kΩ, GND = 0 V (unless otherwise noted) PARAMETER tPHL Propagation delay, high- to low-level output switching tPLH Propagation delay, low- to high-level output switching Copyright © 2005–2011, Texas Instruments Incorporated TEST CONDITIONS TYP Input overdrive = 10 mV 600 Input overdrive = 100 mV 200 Input overdrive = 10 mV 450 Input overdrive = 100 mV 300 UNIT ns ns 5 PACKAGE OPTION ADDENDUM www.ti.com 9-Aug-2011 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/ Ball Finish MSL Peak Temp LMV331QDBVRQ1 ACTIVE SOT-23 DBV 5 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393QDRG4Q1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM LMV393QDRQ1 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM (3) Samples (Requires Login) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF LMV331-Q1, LMV393-Q1 : • Catalog: LMV331, LMV393 Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 9-Aug-2011 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product Addendum-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Communications and Telecom www.ti.com/communications Amplifiers amplifier.ti.com Computers and Peripherals www.ti.com/computers Data Converters dataconverter.ti.com Consumer Electronics www.ti.com/consumer-apps DLP® Products www.dlp.com Energy and Lighting www.ti.com/energy DSP dsp.ti.com Industrial www.ti.com/industrial Clocks and Timers www.ti.com/clocks Medical www.ti.com/medical Interface interface.ti.com Security www.ti.com/security Logic logic.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Power Mgmt power.ti.com Transportation and Automotive www.ti.com/automotive Microcontrollers microcontroller.ti.com Video and Imaging RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connctivity www.ti.com/wirelessconnectivity TI E2E Community Home Page www.ti.com/video e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2011, Texas Instruments Incorporated