MADS-011030-14280W
Schottky Zero Bias Detector Diode
Rev. V1
Functional Schematic
Features
P-Type Schottky Diode
Low Slope Resistance, 6.5 Ω
Can be used Without External DC Bias
Large Bondable Contact
Can be Mounted with Solder or Conductive
Epoxy
RoHS Compliant*
Top Contact
Full Area Anode
Description
The MADS-011030-14280W is a zero bias detector
diode (ZBD). This diode is a bondable die suitable
for use in microstrip or stripline detector circuits.
These chips can be used in automatic assembly
processes due to their 2.5 x 10 mil rectangular gold
contact and sturdy construction.
Chip Outline1,2
Ordering Information
Part Number
Package
MADS-011030-14280W
Waffle Pack
1. Topside metal (cathode contact) thickness:
10 microns Au (Typical)
2. Backside metal (anode contact) thickness:
0.1 micron Au (Typical)
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
1
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADS-011030-14280W
Schottky Zero Bias Detector Diode
Rev. V1
Electrical Specifications: TA = +25°C
Parameter
Test Conditions
Units
Min.
Typ.
Max.
Forward Voltage (VF)
VF @ 1 mA
mV
80
100
130
Voltage Breakdown (VB)
VB @ 1 mA
V
2.5
3.5
—
Slope Resistance (RD)
RD @ 9.5 - 10.5 mA
Ohms
—
6.5
10
Capacitance (CT)
CT @ -0.5 volts
pF
—
0.33
0.45
Absolute Maximum Ratings3,4
Parameter
Absolute Maximum
Reverse Voltage @ 25°C
2.5 Volts
Operating Temperature
-55°C to +125°C
Storage Temperature
-55°C to +150°C
3. Exceeding any one or combination of these limits may cause
permanent damage to this device.
4. MACOM does not recommend sustained operation near these
survivability limits.
Handling Procedures
Please observe the following precautions to avoid
damage:
Static Sensitivity
These electronic devices are sensitive to
electrostatic discharge (ESD) and can be damaged
by static electricity. Proper ESD control techniques
should be used when handling these HBM Class 0
devices.
Die Handling and Mounting Information
Handling: All semiconductor chips should be handled with care in order to avoid damage or contamination from
perspiration, salts, and skin oils. For individual die, the use of plastic tipped tweezers or vacuum pick up tools is
strongly recommended. Bulk handling should ensure that abrasion and mechanical shock are minimized.
Die Attach: The die have Ti-Pt-Au back metal and gold plated contact metal. Die can be mounted with a gold-tin,
eutectic solder preform or conductive silver epoxy.
Eutectic Die Attachment Using Hot Gas Die Bonder: An 80/20, gold tin eutectic solder perform is
recommended with a work surface temperature of 255°C and a tool tip temperature of 220°C. When the hot gas is
applied, the temperature at the tool tip should be approximately 290°C.
Eutectic Die Attachment Using Reflow Oven: See Application Note M541, “Bonding and Handling Procedures
for Chip Diode Devices”.
Epoxy Die Attachment: A thin, controlled amount of electrically conductive silver epoxy should be applied at
approximately a 1-2 mils thickness to minimize ohmic and thermal resistances. A thin epoxy fillet should be visible
around the perimeter of the chip after placement to ensure full area coverage. Cure conductive epoxy per
manufacturer’s schedule.
Wire Bonding: 0.001” diameter gold wire is recommended with a stage temperature of 150°C and minimal force.
Ultrasonic energy should be adjusted to the minimum required. Automatic ball bonding can also be used.
2
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
MADS-011030-14280W
Schottky Zero Bias Detector Diode
Rev. V1
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3
MACOM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support