MM5Z2V4 thru M M5Z75V SURFACE MOUNT ZENER DIODES 150mW Surface Mount Zener Diodes - 2.4V-75V SOD-523FL .051(1.50) .067(1.70) .006(0.15) .0098(0.25) .0098(0.25) .014(0.35) .043(1.10) .051(1.30) 1 2 .035(0.90) .028(0.70) .028(0.70) .028(0.50) .002(0.05) .007(0.20) Dimensions in inches and (millimeters) FEATURES MECHANICAL DATA • Epoxy : UL94-V0 rated flame retardant • Case : Molded plastic, SOD-523FL • Terminals :Plated terminals, solderable per MIL-STD-750, • Silicon epitaxial planar chip structure. • Wide zener reverse voltage range 2.40V to 75V. • Tiny package size for high density applications. • Ideally suited for automated assembly processes. • Lead-free parts meet environmental standards of . Method 2026 • Polarity : Indicated by cathode band • Mounting Position : Any • Weight : Approximated 0.002 gram MIL-STD-19500 /228 • Suffix "-H" indicates Halogen-free parts, ex. ΜΜ5Ζ2V4-H. MAXIMUM RATINGS (at TA=25 C unless otherwise noted) o PARAMETER CONDITIONS Symbol MAX. UNIT Forward voltage I F = 10 mA DC VF 0.9 V Power Dissipation Diode on FR-5 Board P TOT 150 mW Thermal Resistance Junction to the ambient 625 °C/W R θJA Operating temperature TJ Storage temperature www.paceleader.tw MIN. T STG 1 -55 -65 TYP. +150 o C +150 o C MM5Z2V4 thru M M5Z75V SURFACE MOUNT ZENER DIODES Electrical characteristics (at T =25 C unless otherwise noted) o A Zener voltage Device code Part No. Device date code see page6 Note1 Test current V Z @ I ZT I ZT Min.(V) Nom.(V) Max.(V) mA Zener impedance Z ZT @ I ZT Z ZK @ I ZK Leakage current I ZK IR VR OHMs OHMs mA µA Volts Vz (mV/k) @I ZT Min. C @VR=0 f=1MHz Max. pF MM5Z2V4 00 50 2.2 2.4 2.6 5 100 1000 1.0 50 1.0 -3.5 0 450 MM5Z2V7 01 51 2.5 2.7 2.9 5 100 1000 1.0 20 1.0 -3.5 0 450 MM5Z3V0 02 52 2.8 3.0 3.2 5 100 1000 1.0 10 1.0 -3.5 0 450 MM5Z3V3 05 53 3.1 3.3 3.5 5 95 1000 1.0 5 1.0 -3.5 0 450 54 3.4 3.6 3.8 5 90 1000 1.0 5 1.0 -3.5 0 450 MM5Z3V6 06 MM5Z3V9 07 55 3.7 3.9 4.1 5 90 1000 1.0 3 1.0 -3.5 -2.5 450 MM5Z4V3 08 56 4.0 4.3 4.6 5 90 1000 1.0 3 1.0 -3.5 0 450 MM5Z4V7 09 57 4.4 4.7 5.0 5 80 800 1.0 3 2.0 -3.5 0.2 260 MM5Z5V1 0A 58 4.8 5.1 5.4 5 60 500 1.0 2 2.0 -2.7 1.2 225 MM5Z5V6 0C 59 5.2 5.6 6.0 5 40 200 1.0 1 2.0 -2.0 2.5 200 MM5Z6V2 0E 5A 5.8 6.2 6.6 5 10 100 1.0 3 4.0 0.4 3.7 185 MM5Z6V8 0F 5B 6.4 6.8 7.2 5 15 160 1.0 2 4.0 1.2 4.5 155 MM5Z7V5 0G 5C 7.0 7.5 7.9 5 15 160 1.0 1 5.0 2.5 5.3 140 MM5Z8V2 0H 5D 7.7 8.2 8.7 5 15 160 1.0 0.7 5.0 3.2 6.2 135 MM5Z9V1 0K 5E 8.5 9.1 9.6 5 15 160 1.0 0.2 7.0 3.8 7.0 130 MM5Z10V 0L 5F 9.4 10 10.6 5 20 160 1.0 0.1 8.0 4.5 8.0 130 MM5Z11V 0M 5G 10.4 11 11.6 5 20 160 1.0 0.1 8.0 5.4 9.0 130 MM5Z12V 0N 5H 11.4 12 12.7 5 25 80 1.0 0.1 8.0 6.0 10 130 MM5Z13V 0P 5J 12.4 13 14.1 5 30 80 1.0 0.1 8.0 7.0 11 120 MM5Z15V 0T 5K 14.3 15 15.8 5 30 80 1.0 0.05 10.5 9.2 13 110 MM5Z16V 0U 5L 15.3 16 17.1 5 40 80 1.0 0.05 11.2 10.4 14 105 MM5Z18V 0W 5M 16.8 18 19.1 5 45 80 1.0 0.05 12.6 12.4 16 100 MM5Z20V 0Z 5N 18.8 20 21.2 5 55 100 1.0 0.05 14.0 14.4 18 85 MM5Z22V 10 5P 20.8 22 23.3 5 55 100 1.0 0.05 15.4 16.4 20 85 MM5Z24V 11 5R 22.8 24 25.6 5 70 120 1.0 0.05 16.8 18.4 22 80 MM5Z27V 12 5S 25.1 27 28.9 5 80 300 1.0 0.05 18.9 21.4 25.3 70 32.0 5 80 300 1.0 0.05 21.0 24.4 29.4 70 MM5Z30V 14 5T 28.0 30 MM5Z33V 18 5U 31.0 33 35.0 5 80 300 1.0 0.05 23.2 27.4 33.4 70 MM5Z36V 19 5V 34.0 36 38.0 5 90 500 1.0 0.05 25.2 30.4 37.4 70 MM5Z39V 20 5X 37.0 39 41.0 5 130 500 1.0 0.05 27.3 33.4 41.2 45 MM5Z43V 21 5Y 40.0 43 46.0 5 150 500 1.0 0.05 30.1 37.6 46.6 40 MM5Z47V 1A 5Z 44.0 47 50.0 5 170 500 1.0 0.05 32.9 42.0 51.8 40 MM5Z51V 1C 5– 48.0 51 54.0 5 180 500 1.0 0.05 35.7 46.6 57.2 40 MM5Z56V 1D 5= 52.0 56 60.0 5 200 500 1.0 0.05 39.2 52.2 63.8 40 MM5Z62V 1E 5Ξ 58.0 62 66.0 5 215 500 1.0 0.05 43.4 58.8 71.6 35 MM5Z68V 1F 5> 64.0 68 72.0 5 240 500 1.0 0.05 47.6 65.6 79.8 35 MM5Z75V 1G 5< 70.0 75 79.0 5 255 500 1.0 0.05 52.5 73.4 88.6 35 www.paceleader.tw 2 MM5Z2V4 thru M M5Z75V SURFACE MOUNT ZENER DIODES Rating and characteristic curves (MM5Z2V4 thru MM5Z75V) FIG.1-TOTAL POWER DISSIPATION VS. AMBIENT TEMPERATURE FIG. 2-TYPICAL CHANGE OF WORKING VOLTAGE o UNDER OPERATING CONDITIONS AT T A =25 C 1000 125 VOLTAGE CHANGE (mV) TOTAL POWER DISSIPATION (mW) 150 100 75 50 I Z = 5mA 100 10 25 0 0 0 40 80 120 160 200 0 5 o 20 25 FIG. 3-TYPICAL CHANGE OF WORKING VOLTAGE VS. JUNCTION TEMPERATURE FIG. 4-TEMPERATURE COEFFICIENT OF VZ VS. Z-VOLTAGE 15 -4 TEMPERATURE COEFFICIENT (10 / K) RELATIVE VOLTAGE CHANGE 15 ZENER VOLTAGE (V) 1.3 1.2 -4 10 x 10 /K -4 8 x 10 /K -4 6 x 10 /K 1.1 -4 4 x 10 /K -4 2 x 10 /K 0 -4 -2 x 10 /K -4 -4 x 10 /K 1.0 0.9 0.8 10 I Z = 5mA 5 0 -5 -60 0 60 120 180 240 0 o JUNCTION TEMPERATURE ( C) 200 150 100 50 0 0 5 10 15 20 25 ZENER VOLTAGE (V) www.paceleader.tw 10 20 30 ZENER VOLTAGE (V) FIG. 5-DIODE CAPACITANCE VS. Z-VOLTAGE DIODE CAPACITANCE (pF) 10 AMIBIENT TEMPERATURE ( C) 3 40 50 MM5Z2V4 thru M M5Z75V SURFACE MOUNT ZENER DIODES Rating and characteristic curves (MM5Z2V4 thru MM5Z75V) FIG. 7-Z-CURRENT VS. Z-VOLTAGE 100 50 10 40 ZENER CURRENT (mA) FORWARD CURRENT (mA) FIG. 6-FORWARD CURRENT VS. FORWARD VOLTAGE 1 0.1 P tot = 500mW 30 20 10 0.01 0.001 0 0 0.2 0.4 0.6 0.8 15 1.0 25 30 35 ZENER VOLTAGE (V) FIG. 8-Z-CURRENT VS. Z-VOLTAGE FIG. 9-DIFFERENTIAL Z-RESISTANCE VS. Z-VOLTAGE 1000 DIFFERENTIAL Z-RESISTANCE (ohm) 100 ZENER CURRENT (mA) 20 FORWARD VOLTAGE (V) 80 P tot = 500mW 60 40 20 0 I Z = 1mA 100 I Z = 5mA 10 I Z = 10mA 1 4 0 8 12 16 20 0 5 ZENER VOLTAGE (V) 10 15 20 ZENER VOLTAGE (V) THERMAL RESISTANCE FOR PULSE Cond. (K/W) FIG. 10-THERMAL RESPONSE 1000 t p / T= 0.5 100 t p / T= 0.2 Single Pulse t p / T= 0.01 10 t p / T= 0.1 t p / T= 0.02 t p / T= 0.05 1 0.1 1 10 PULSE LENGTH (mS) www.paceleader.tw 4 100 1000 25 MM5Z2V4 thru M M5Z75V SURFACE MOUNT ZENER DIODES Pinning information Pin Pin1 Pin2 Simplified outline cathode anode Symbol 1 2 1 2 Marking Marking MM5Z Series DEV+ Σ DEV Σ •• DEV = Device code (see page 3), Σ=Datecode Month JAN Year Example: FEB MAR APR MAY JUN JUL AUG SEP OCT NOV DEC Odd 1 2 3 4 5 6 7 8 9 T V C Even E F H J K L N P U X Y Z Suggested solder pad layout C A B Dimensions in inches and (millimeters) www.paceleader.tw PACKAGE A B C SOD-523FL 0.016 (0.40) 0.016 (0.40) 0.048 (1.20) 5 1D 4 Note 1 Type number •• MM5Z2V4 thru M M5Z75V SURFACE MOUNT ZENER DIODES Packing information P0 P1 d Cathode E F F B Product Blank A W P D2 D1 T C D unit:mm Symbol Tolerance Carrier width Carrier length Carrier depth Sprocket hole A B C d 0.1 0.1 0.1 0.1 0.90 1.40 0.76 1.50 7" Reel outside diameter 7" Reel inner diameter Feed hole diameter Sprocket hole position Punch hole position Punch hole pitch Sprocket hole pitch Embossment center Overall tape thickness Tape width Reel width D D1 D2 E F P P0 P1 T W W1 2.0 min 0.5 0.1 0.1 0.1 0.1 0.1 0.1 0.3 1.0 178.00 50.00 8.40~9.90 1.75 3.50 4.00 4.00 2.00 0.23 8.00 10.90 Item SOD-523FL Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above. www.paceleader.tw 6 W1 MM5Z2V4 thru M M5Z75V SURFACE MOUNT ZENER DIODES Reel packing PACKAGE REEL SIZE REEL (pcs) COMPONENT SPACING (m/m) 7" 3,000 4.0 SOD-523FL BOX (pcs) INNER BOX (m/m) 30,000 183*183*123 REEL DIA, (m/m) CARTON SIZE (m/m) CARTON (pcs) APPROX. GROSS WEIGHT (kg) 178 382*262*387 240,000 9.5 Suggested thermal profiles for soldering processes o o 1.Storage environment: Temperature=5 C ~40 C Humidity=55%±25% 2.Reflow soldering of surface-mount devices Critical Zone TL to TP Tp TP Ramp-up TL TL Tsmax Temperature Tsmin tS Preheat Ramp-down 25 t25o C to Peak Time 3.Reflow soldering Profile Feature Soldering Condition Average ramp-up rate(T L to T P ) o <3 C /sec Preheat -Temperature Min(Tsmin) -Temperature Max(Tsmax) -Time(min to max)(t s ) 150 oC 200 oC 60~120sec Tsmax to T L -Ramp-upRate <3 oC/sec Time maintained above: -Temperature(T L ) -Time(t L ) 217 oC 60~260sec 255 oC-0/+5 oC Peak Temperature(T P ) www.paceleader.tw Time within 5 oC of actual Peak Temperature(t P ) 10~30sec Ramp-down Rate <6 oC/sec Time 25 oC to Peak Temperature <6minutes 7