PACELEADER MM5Z47V Surface mount zener diode Datasheet

MM5Z2V4 thru M M5Z75V
SURFACE MOUNT ZENER DIODES
150mW Surface Mount Zener Diodes - 2.4V-75V
SOD-523FL
.051(1.50)
.067(1.70)
.006(0.15)
.0098(0.25)
.0098(0.25)
.014(0.35)
.043(1.10)
.051(1.30)
1
2
.035(0.90)
.028(0.70)
.028(0.70)
.028(0.50)
.002(0.05)
.007(0.20)
Dimensions in inches and (millimeters)
FEATURES
MECHANICAL DATA
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-523FL
• Terminals :Plated terminals, solderable per MIL-STD-750,
• Silicon epitaxial planar chip structure.
• Wide zener reverse voltage range 2.40V to 75V.
• Tiny package size for high density applications.
• Ideally suited for automated assembly processes.
• Lead-free parts meet environmental standards of
.
Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.002 gram
MIL-STD-19500 /228
• Suffix "-H" indicates Halogen-free parts, ex. ΜΜ5Ζ2V4-H.
MAXIMUM RATINGS (at TA=25 C unless otherwise noted)
o
PARAMETER
CONDITIONS
Symbol
MAX.
UNIT
Forward voltage
I F = 10 mA DC
VF
0.9
V
Power Dissipation
Diode on FR-5 Board
P TOT
150
mW
Thermal Resistance
Junction to the ambient
625
°C/W
R θJA
Operating temperature
TJ
Storage temperature
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MIN.
T STG
1
-55
-65
TYP.
+150
o
C
+150
o
C
MM5Z2V4 thru M M5Z75V
SURFACE MOUNT ZENER DIODES
Electrical characteristics (at T =25 C unless otherwise noted)
o
A
Zener
voltage
Device
code
Part No.
Device
date
code
see
page6
Note1
Test
current
V Z @ I ZT
I ZT
Min.(V) Nom.(V) Max.(V)
mA
Zener
impedance
Z ZT @ I ZT Z ZK @ I ZK
Leakage
current
I ZK
IR
VR
OHMs
OHMs
mA
µA
Volts
Vz
(mV/k)
@I ZT
Min.
C
@VR=0
f=1MHz
Max.
pF
MM5Z2V4
00
50
2.2
2.4
2.6
5
100
1000
1.0
50
1.0
-3.5
0
450
MM5Z2V7
01
51
2.5
2.7
2.9
5
100
1000
1.0
20
1.0
-3.5
0
450
MM5Z3V0
02
52
2.8
3.0
3.2
5
100
1000
1.0
10
1.0
-3.5
0
450
MM5Z3V3
05
53
3.1
3.3
3.5
5
95
1000
1.0
5
1.0
-3.5
0
450
54
3.4
3.6
3.8
5
90
1000
1.0
5
1.0
-3.5
0
450
MM5Z3V6
06
MM5Z3V9
07 55
3.7
3.9
4.1
5
90
1000
1.0
3
1.0
-3.5
-2.5
450
MM5Z4V3
08 56
4.0
4.3
4.6
5
90
1000
1.0
3
1.0
-3.5
0
450
MM5Z4V7
09 57
4.4
4.7
5.0
5
80
800
1.0
3
2.0
-3.5
0.2
260
MM5Z5V1
0A 58
4.8
5.1
5.4
5
60
500
1.0
2
2.0
-2.7
1.2
225
MM5Z5V6
0C 59
5.2
5.6
6.0
5
40
200
1.0
1
2.0
-2.0
2.5
200
MM5Z6V2
0E 5A
5.8
6.2
6.6
5
10
100
1.0
3
4.0
0.4
3.7
185
MM5Z6V8
0F 5B
6.4
6.8
7.2
5
15
160
1.0
2
4.0
1.2
4.5
155
MM5Z7V5
0G 5C
7.0
7.5
7.9
5
15
160
1.0
1
5.0
2.5
5.3
140
MM5Z8V2
0H 5D
7.7
8.2
8.7
5
15
160
1.0
0.7
5.0
3.2
6.2
135
MM5Z9V1
0K 5E
8.5
9.1
9.6
5
15
160
1.0
0.2
7.0
3.8
7.0
130
MM5Z10V
0L
5F
9.4
10
10.6
5
20
160
1.0
0.1
8.0
4.5
8.0
130
MM5Z11V
0M
5G
10.4
11
11.6
5
20
160
1.0
0.1
8.0
5.4
9.0
130
MM5Z12V
0N
5H
11.4
12
12.7
5
25
80
1.0
0.1
8.0
6.0
10
130
MM5Z13V
0P
5J
12.4
13
14.1
5
30
80
1.0
0.1
8.0
7.0
11
120
MM5Z15V
0T
5K
14.3
15
15.8
5
30
80
1.0
0.05
10.5
9.2
13
110
MM5Z16V
0U
5L
15.3
16
17.1
5
40
80
1.0
0.05
11.2
10.4
14
105
MM5Z18V
0W
5M
16.8
18
19.1
5
45
80
1.0
0.05
12.6
12.4
16
100
MM5Z20V
0Z
5N
18.8
20
21.2
5
55
100
1.0
0.05
14.0
14.4
18
85
MM5Z22V
10
5P
20.8
22
23.3
5
55
100
1.0
0.05
15.4
16.4
20
85
MM5Z24V
11 5R
22.8
24
25.6
5
70
120
1.0
0.05
16.8
18.4
22
80
MM5Z27V
12
5S
25.1
27
28.9
5
80
300
1.0
0.05
18.9
21.4
25.3
70
32.0
5
80
300
1.0
0.05
21.0
24.4
29.4
70
MM5Z30V
14
5T
28.0
30
MM5Z33V
18
5U
31.0
33
35.0
5
80
300
1.0
0.05
23.2
27.4
33.4
70
MM5Z36V
19
5V
34.0
36
38.0
5
90
500
1.0
0.05
25.2
30.4
37.4
70
MM5Z39V
20
5X
37.0
39
41.0
5
130
500
1.0
0.05
27.3
33.4
41.2
45
MM5Z43V
21
5Y
40.0
43
46.0
5
150
500
1.0
0.05
30.1
37.6
46.6
40
MM5Z47V
1A
5Z
44.0
47
50.0
5
170
500
1.0
0.05
32.9
42.0
51.8
40
MM5Z51V
1C
5–
48.0
51
54.0
5
180
500
1.0
0.05
35.7
46.6
57.2
40
MM5Z56V
1D
5=
52.0
56
60.0
5
200
500
1.0
0.05
39.2
52.2
63.8
40
MM5Z62V
1E
5Ξ
58.0
62
66.0
5
215
500
1.0
0.05
43.4
58.8
71.6
35
MM5Z68V
1F
5>
64.0
68
72.0
5
240
500
1.0
0.05
47.6
65.6
79.8
35
MM5Z75V
1G
5<
70.0
75
79.0
5
255
500
1.0
0.05
52.5
73.4
88.6
35
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2
MM5Z2V4 thru M M5Z75V
SURFACE MOUNT ZENER DIODES
Rating and characteristic curves (MM5Z2V4 thru MM5Z75V)
FIG.1-TOTAL POWER DISSIPATION VS.
AMBIENT TEMPERATURE
FIG. 2-TYPICAL CHANGE OF WORKING VOLTAGE
o
UNDER OPERATING CONDITIONS AT T A =25 C
1000
125
VOLTAGE CHANGE (mV)
TOTAL POWER DISSIPATION (mW)
150
100
75
50
I Z = 5mA
100
10
25
0
0
0
40
80
120
160
200
0
5
o
20
25
FIG. 3-TYPICAL CHANGE OF WORKING VOLTAGE
VS. JUNCTION TEMPERATURE
FIG. 4-TEMPERATURE COEFFICIENT OF VZ
VS. Z-VOLTAGE
15
-4
TEMPERATURE COEFFICIENT (10 / K)
RELATIVE VOLTAGE CHANGE
15
ZENER VOLTAGE (V)
1.3
1.2
-4
10 x 10 /K
-4
8 x 10 /K
-4
6 x 10 /K
1.1
-4
4 x 10 /K
-4
2 x 10 /K
0
-4
-2 x 10 /K
-4
-4 x 10 /K
1.0
0.9
0.8
10
I Z = 5mA
5
0
-5
-60
0
60
120
180
240
0
o
JUNCTION TEMPERATURE ( C)
200
150
100
50
0
0
5
10
15
20
25
ZENER VOLTAGE (V)
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10
20
30
ZENER VOLTAGE (V)
FIG. 5-DIODE CAPACITANCE VS. Z-VOLTAGE
DIODE CAPACITANCE (pF)
10
AMIBIENT TEMPERATURE ( C)
3
40
50
MM5Z2V4 thru M M5Z75V
SURFACE MOUNT ZENER DIODES
Rating and characteristic curves (MM5Z2V4 thru MM5Z75V)
FIG. 7-Z-CURRENT VS. Z-VOLTAGE
100
50
10
40
ZENER CURRENT (mA)
FORWARD CURRENT (mA)
FIG. 6-FORWARD CURRENT
VS. FORWARD VOLTAGE
1
0.1
P tot = 500mW
30
20
10
0.01
0.001
0
0
0.2
0.4
0.6
0.8
15
1.0
25
30
35
ZENER VOLTAGE (V)
FIG. 8-Z-CURRENT VS. Z-VOLTAGE
FIG. 9-DIFFERENTIAL Z-RESISTANCE VS. Z-VOLTAGE
1000
DIFFERENTIAL Z-RESISTANCE (ohm)
100
ZENER CURRENT (mA)
20
FORWARD VOLTAGE (V)
80
P tot = 500mW
60
40
20
0
I Z = 1mA
100
I Z = 5mA
10
I Z = 10mA
1
4
0
8
12
16
20
0
5
ZENER VOLTAGE (V)
10
15
20
ZENER VOLTAGE (V)
THERMAL RESISTANCE FOR PULSE Cond. (K/W)
FIG. 10-THERMAL RESPONSE
1000
t p / T= 0.5
100
t p / T= 0.2
Single Pulse
t p / T= 0.01
10
t p / T= 0.1
t p / T= 0.02
t p / T= 0.05
1
0.1
1
10
PULSE LENGTH (mS)
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4
100
1000
25
MM5Z2V4 thru M M5Z75V
SURFACE MOUNT ZENER DIODES
Pinning information
Pin
Pin1
Pin2
Simplified outline
cathode
anode
Symbol
1
2
1
2
Marking
Marking
MM5Z Series
DEV+ Σ
DEV Σ
••
DEV = Device code (see page 3), Σ=Datecode
Month JAN
Year
Example:
FEB
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
NOV
DEC
Odd
1
2
3
4
5
6
7
8
9
T
V
C
Even
E
F
H
J
K
L
N
P
U
X
Y
Z
Suggested solder pad layout
C
A
B
Dimensions in inches and (millimeters)
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PACKAGE
A
B
C
SOD-523FL
0.016 (0.40)
0.016 (0.40)
0.048 (1.20)
5
1D
4
Note 1
Type number
••
MM5Z2V4 thru M M5Z75V
SURFACE MOUNT ZENER DIODES
Packing information
P0
P1
d
Cathode
E
F
F
B
Product
Blank
A
W
P
D2
D1
T
C
D
unit:mm
Symbol
Tolerance
Carrier width
Carrier length
Carrier depth
Sprocket hole
A
B
C
d
0.1
0.1
0.1
0.1
0.90
1.40
0.76
1.50
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
D
D1
D2
E
F
P
P0
P1
T
W
W1
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
178.00
50.00
8.40~9.90
1.75
3.50
4.00
4.00
2.00
0.23
8.00
10.90
Item
SOD-523FL
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
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6
W1
MM5Z2V4 thru M M5Z75V
SURFACE MOUNT ZENER DIODES
Reel packing
PACKAGE
REEL SIZE
REEL
(pcs)
COMPONENT
SPACING
(m/m)
7"
3,000
4.0
SOD-523FL
BOX
(pcs)
INNER
BOX
(m/m)
30,000 183*183*123
REEL
DIA,
(m/m)
CARTON
SIZE
(m/m)
CARTON
(pcs)
APPROX.
GROSS WEIGHT
(kg)
178
382*262*387
240,000
9.5
Suggested thermal profiles for soldering processes
o
o
1.Storage environment: Temperature=5 C ~40 C Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
150 oC
200 oC
60~120sec
Tsmax to T L
-Ramp-upRate
<3 oC/sec
Time maintained above:
-Temperature(T L )
-Time(t L )
217 oC
60~260sec
255 oC-0/+5 oC
Peak Temperature(T P )
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Time within 5 oC of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<6 oC/sec
Time 25 oC to Peak Temperature
<6minutes
7
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