ON NCP4683DMU31TCG 300 ma, low dropout regulator Datasheet

NCP4683
300 mA, Low Dropout
Regulator
The NCP4683 is a CMOS Linear voltage regulator with 300 mA
output current capability. The device has high output voltage accuracy,
low supply current and high ripple rejection. The NCP4683 is easy to
use, with output current fold−back protection circuit included. A Chip
Enable function is included to save power by lowering supply current.
The line and load transient responses are very good, thus this regulator
is suitable for use as a power supply for communication equipment.
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MARKING
DIAGRAMS
Features
•
•
•
•
•
•
•
•
•
•
•
Operating Input Voltage Range: 1.40 V to 5.25 V
Output Voltage Range: 0.8 V to 3.6 V (available in 0.1 V steps)
Output Voltage Accuracy: ±1.0% (VOUT > 2.0 V)
Supply Current: 50 mA
Dropout Voltage: 0.25 V (IOUT = 300 mA, VOUT = 2.8 V)
High PSRR: 70 dB (f = 1 kHz)
Line Regulation: 0.02%/V Typ.
Stable with Ceramic Capacitors: 1.0 mF or more
Current Fold Back Protection
Available in UDFN4 1.0 x 1.0 mm, SC−70, SOT23 Packages
These are Pb−Free Devices
Typical Applications
•
•
•
•
Battery−powered Equipment
Networking and Communication Equipment
Cameras, DVRs, STB and Camcorders
Home Appliances
VIN
C1
1m
VOUT
VOUT
CE
GND
SOT−23−5
CASE 1212
XXX
XMM
SC−70
CASE 419A
1
UDFN4
CASE 517BR
1
XX
MM
XX, XXX, XXXX = Specific Device Code
M, MM
= Date Code
NCP4683x
VIN
XXX
M
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 18 of this data sheet.
C2
1m
Figure 1. Typical Application Schematic
© Semiconductor Components Industries, LLC, 2012
July, 2012 − Rev. 2
1
Publication Order Number:
NCP4683/D
NCP4683
VOUT VIN
VIN
VOUT
Vref
Vref
Current Limit
CE
CE
Current Limit
GND
GND
NCP4683Dxxxx
NCP4683Hxxxx
Figure 2. Simplified Schematic Block Diagram
PIN FUNCTION DESCRIPTION
Pin No.
UDFN1010*
Pin No.
SC−70
Pin No.
SOT23
Pin Name
Description
1
4
5
VOUT
Output pin
2
3
2
GND
Ground
3
1
3
CE
Chip enable pin (Active “H”)
4
5
1
VIN
Input pin
−
2
4
NC
No connection
*Tab is GND level. (They are connected to the reverse side of this IC.
The tab is better to be connected to the GND, but leaving it open is also acceptable.
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Input Voltage (Note 1)
Value
Unit
VIN
6.0
V
Output Voltage
VOUT
−0.3 to VIN + 0.3
V
Chip Enable Input
VCE
−0.3 to 6.0
V
Output Current
IOUT
400
mA
PD
400
mW
Power Dissipation UDFN1010
Power Dissipation SC−70
380
Power Dissipation SOT23
420
Junction Temperature
TJ
−40 to 150
°C
Storage Temperature
TSTG
−55 to 125
°C
ESD Capability, Human Body Model (Note 2)
ESDHBM
2000
V
ESD Capability, Machine Model (Note 2)
ESDMM
200
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
Latchup Current Maximum Rating tested per JEDEC standard: JESD78.
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2
NCP4683
THERMAL CHARACTERISTICS
Symbol
Value
Unit
Thermal Characteristics, UDFN 1.0 x 1.0 mm
Thermal Resistance, Junction−to−Air
Rating
RqJA
250
°C/W
Thermal Characteristics, SOT23
Thermal Resistance, Junction−to−Air
RqJA
238
°C/W
Thermal Characteristics, SC−70
Thermal Resistance, Junction−to−Air
RqJA
263
°C/W
ELECTRICAL CHARACTERISTICS
−40°C ≤ TA ≤ 85°C; VIN = VOUT(NOM) + 1 V or 2.5 V, whichever is greater; IOUT = 1 mA, CIN = COUT = 1.0 mF, unless otherwise noted.
Typical values are at TA = +25°C.
Parameter
Test Conditions
Operating Input Voltage
Output Voltage
TA = +25°C
VOUT ≥ 2.0 V
−40°C ≤ TA ≤ 85°C
Output Voltage Temp. Coefficient
Line Regulation
Load Regulation
Dropout Voltage
Min
VIN
VOUT
Typ
Max
Unit
1.40
5.25
V
x0.99
x1.01
V
VOUT < 2.0 V
−20
20
mV
VOUT ≥ 2.0 V
x0.97
x1.03
V
VOUT < 2.0 V
−60
60
mV
−40°C ≤ TA ≤ 85°C
DVOUT/DTA
±80
VOUT(NOM) + 0.5 V ≤ VIN ≤ 5.0 V
LineReg
0.02
IOUT = 1 mA to 300 mA
LoadReg
VDO
VOUT = 0.9 V
0.51
0.65
1.0 V ≤ VOUT < 1.2 V
0.46
0.59
1.2 V ≤ VOUT < 1.4 V
0.39
0.50
1.4 V ≤ VOUT < 1.7 V
0.35
0.44
1.7 V ≤ VOUT < 2.1 V
0.30
0.39
2.1 V ≤ VOUT < 2.5 V
0.26
0.34
2.5 V ≤ VOUT < 3.0 V
0.25
0.30
3.0 V ≤ VOUT < 3.6 V
0.22
0.29
IOUT = 300 mA
VOUT = 0.8 V
Output Current
Short Current Limit
Symbol
IOUT
VOUT = 0 V
Quiescent Current
0.10
%/V
15
40
mV
0.56
0.72
V
300
mA
ISC
60
IQ
50
75
mA
0.1
1.0
mA
Standby Current
VCE = 0 V, TA = 25°C
ISTB
CE Pin Threshold Voltage
CE Input Voltage “H”
VCEH
CE Input Voltage “L”
VCEL
CE Pull Down Current
ppm/°C
mA
V
1.0
0.4
ICEPD
0.3
mA
VIN = VOUT + 1 V or VIN = 3 V,
DVIN = 0.2 Vpk−pk,
IOUT = 30 mA, f = 1 kHz
PSRR
65
dB
Output Noise Voltage
f = 10 Hz to 100 kHz, IOUT = 30 mA,
VOUT = 1.2 V, VIN = 3.2 V
VN
65
mVrms
Low Output Nch Tr. On Resistance
VIN = 4 V, VCE = 0 V, D version only
RLOW
50
W
Power Supply Rejection Ratio
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3
NCP4683
TYPICAL CHARACTERISTICS
1.4
2.0
1.8
1.2
1.0
1.6
0.8
4.2 V
0.6
3.6 V
2.2 V
5.0 V
1.2
1.0
4.2 V
0.8
3.5 V
0.4
0.2
0.2
0
100
200
300
400
IOUT (mA)
500
600
700
0
0
100
Figure 3. Output Voltage vs. Output Current
1.2 V Version (TJ = 255C)
300
400
IOUT (mA)
500
600
700
3.5
3.0
2.0
5.0 V
2.5
1.5
4.2 V
1.0
VOUT (V)
VIN = 5.25 V
2.5
VOUT (V)
200
Figure 4. Output Voltage vs. Output Current
1.8 V Version (TJ = 255C)
3.0
3.8 V
VIN = 5.25 V
5.0 V
2.0
4.3 V
1.5
1.0
0.5
0
2.8 V
0.6
0.4
0
VIN = 5.25 V
1.4
5.0 V
VOUT (V)
VOUT (V)
2.8 V
VIN = 5.25 V
0.5
0
100
200
300
400
500
600
700
0.0
0
100
200
300
400
500
600
IOUT (mA)
IOUT (mA)
Figure 5. Output Voltage vs. Output Current
2.8 V Version (TJ = 255C)
Figure 6. Output Voltage vs. Output Current
3.3 V Version (TJ = 255C)
0.5
700
0.40
0.35
0.30
TJ = 85°C
25°C
0.3
VDO (V)
VDO (V)
0.4
0.2
−40°C
0.25
TJ = 85°C
0.20
25°C
0.15
−40°C
0.10
0.1
0.05
0
0
50
100
150
200
250
0.00
300
0
50
100
150
200
250
IOUT (mA)
IOUT (mA)
Figure 7. Dropout Voltage vs. Output Current
1.2 V Version
Figure 8. Dropout Voltage vs. Output Current
1.8 V Version
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4
300
NCP4683
0.25
0.25
0.20
0.20
TJ = 85°C
0.15
25°C
0.10
VDO (V)
VDO (V)
TYPICAL CHARACTERISTICS
−40°C
0.15
TJ = 85°C
0.10
25°C
−40°C
0.05
0
0.05
0
50
100
150
IOUT (mA)
200
250
300
0
0
Figure 9. Dropout Voltage vs. Output Current
2.8 V Version
1.25
1.82
1.21
1.81
VOUT (V)
VOUT (V)
1.22
1.17
1.77
1.16
1.76
0
20
40
1.75
−40
80
0
20
40
60
80
Figure 11. Output Voltage vs. Temperature,
1.2 V Version
Figure 12. Output Voltage vs. Temperature,
1.8 V Version
3.35
VIN = 3.8 V
2.82
3.32
2.81
3.31
VOUT (V)
3.33
2.80
2.79
3.30
3.29
2.78
3.28
2.77
3.27
2.76
3.26
−20
0
20
40
60
VIN = 4.3 V
3.34
2.83
−40
−20
TJ, JUNCTION TEMPERATURE (°C)
2.84
2.75
VIN = 2.8 V
TJ, JUNCTION TEMPERATURE (°C)
2.85
VOUT (V)
60
300
1.79
1.78
−20
250
1.80
1.18
1.15
−40
200
1.84
1.83
1.19
150
IOUT (mA)
1.85
1.23
1.20
100
Figure 10. Dropout Voltage vs. Output Current
3.3 V Version
VIN = 2.2 V
1.24
50
3.25
−40
80
−20
0
20
40
60
80
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 13. Output Voltage vs. Temperature,
2.8 V Version
Figure 14. Output Voltage vs. Temperature,
3.3 V Version
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NCP4683
70
60
60
50
50
40
30
30
20
10
10
0
1
2
3
4
0
5
2
3
4
5
VIN, INPUT VOLTAGE (V)
Figure 16. Supply Current vs. Input Voltage,
1.8 V Version
60
60
50
50
40
30
40
30
20
20
10
10
1
2
3
4
0
5
0
1
2
3
4
5
VIN, INPUT VOLTAGE (V)
VIN, INPUT VOLTAGE (V)
Figure 17. Supply Current vs. Input Voltage,
2.8 V Version
Figure 18. Supply Current vs. Input Voltage,
3.3 V Version
70
70
VIN = 2.2 V
60
VIN = 2.8 V
60
50
IGND (mA)
50
40
30
40
30
20
20
10
10
0
1
VIN, INPUT VOLTAGE (V)
70
0
0
Figure 15. Supply Current vs. Input Voltage,
1.2 V Version
70
0
IGND (mA)
40
20
0
IGND (mA)
IGND (mA)
70
IGND (mA)
IGND (mA)
TYPICAL CHARACTERISTICS
40
20
0
20
40
60
0
40
80
20
0
20
40
60
80
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 19. Supply Current vs. Temperature,
1.2 V Version
Figure 20. Supply Current vs. Temperature,
1.8 V Version
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NCP4683
TYPICAL CHARACTERISTICS
70
VIN = 3.8 V
60
60
50
50
IGND (mA)
IGND (mA)
70
40
30
10
10
40
20
0
20
40
60
0
80
0
20
40
60
80
TJ, JUNCTION TEMPERATURE (°C)
Figure 22. Supply Current vs. Temperature,
3.3 V Version
2.0
1.8
1.6
1 mA
VOUT (V)
1.4
0.8
30 mA
0.6
IOUT = 50 mA
0.4
1.2
1.0
1 mA
0.8
30 mA
0.6
IOUT = 50 mA
0.4
0.2
0.2
0
1
2
3
4
0.0
5
0
1
2
3
4
5
VIN, INPUT VOLTAGE (V)
VIN, INPUT VOLTAGE (V)
Figure 23. Output Voltage vs. Input Voltage,
1.2 V Version
Figure 24. Output Voltage vs. Input Voltage,
1.8 V Version
3.2
3.5
2.8
3.0
2.4
2.5
VOUT (V)
2.0
1.6
1.2
1 mA
0.8
1
1.5
30 mA
1 mA
0.5
IOUT = 50 mA
0
2.0
1.0
30 mA
0.4
0.0
20
TJ, JUNCTION TEMPERATURE (°C)
1.0
0.0
40
Figure 21. Supply Current vs. Temperature,
2.8 V Version
1.2
VOUT (V)
30
20
1.4
VOUT (V)
40
20
0
VIN = 4.3 V
2
3
4
0.0
5
IOUT = 50 mA
0
1
2
3
4
5
VIN, INPUT VOLTAGE (V)
VIN, INPUT VOLTAGE (V)
Figure 25. Output Voltage vs. Input Voltage,
2.8 V Version
Figure 26. Output Voltage vs. Input Voltage,
3.3 V Version
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NCP4683
TYPICAL CHARACTERISTICS
100
100
IOUT = 1 mA
90
80
80
70
70
30 mA
60
PSRR (dB)
PSRR (dB)
90
50
40
150 mA
30
40
30
10
10
10
100
0
0.1
1000
1
10
100
1000
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 27. PSRR, 1.2 V Version, VIN = 3.0 V
Figure 28. PSRR, 1.8 V Version, VIN = 3.0 V
100
100
90
90
80
80
70
70
150 mA
60
50
PSRR (dB)
PSRR (dB)
30 mA
50
20
1
150 mA
60
20
0
0.1
IOUT = 1 mA
30 mA
40
IOUT = 1 mA
30
50
10
10
10
150 mA
30
20
1
30 mA
40
20
0
0.1
IOUT = 1 mA
60
100
0
0.1
1000
1
10
100
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 29. PSRR, 2.8 V Version, VIN = 3.8 V
Figure 30. PSRR, 3.3 V Version, VIN = 4.3 V
1000
5.0
3.0
4.5
4.0
2.0
VN (mVrms/√Hz)
VN (mVrms/√Hz)
2.5
1.5
1.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.5
0
0.01
0.1
1
10
100
0
0.01
1000
0.1
1
10
100
1000
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 31. Output Voltage Noise, 1.2 V Version,
VIN = 2.2 V
Figure 32. Output Voltage Noise, 1.8 V Version,
VIN = 2.8 V
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NCP4683
TYPICAL CHARACTERISTICS
7.0
18
16
6.0
14
VN (mVrms/√Hz)
4.0
3.0
2.0
12
10
8.0
6.0
4.0
1.0
2.0
0
0.01
0.1
1
10
100
0
0.01
1000
0.1
1
10
100
1000
FREQUENCY (kHz)
FREQUENCY (kHz)
Figure 33. Output Voltage Noise, 2.8 V Version,
VIN = 3.8 V
Figure 34. Output Voltage Noise, 3.3 V Version,
VIN = 4.3 V
3.7
3.2
2.7
VIN (V)
VOUT (V)
2.2
1.210
1.205
1.200
1.195
1.190
1.185
0
40
80
120 160 200 240 280 320 360 400
t (ms)
Figure 35. Line Transients, 1.2 V Version,
tR = tF = 5 ms, IOUT = 30 mA
4.3
3.8
3.3
VIN (V)
2.8
VOUT (V)
VN (mVrms/√Hz)
5.0
1.810
1.805
1.800
1.795
1.790
1.785
0
40
80
120 160 200 240 280 320 360 400
t (ms)
Figure 36. Line Transients, 1.8 V Version,
tR = tF = 5 ms, IOUT = 30 mA
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NCP4683
TYPICAL CHARACTERISTICS
5.3
4.8
4.3
VIN (V)
VOUT (V)
3.8
2.810
2.805
2.800
2.795
2.790
2.785
0
40
80
120 160 200 240 280 320 360 400
t (ms)
Figure 37. Line Transients, 2.8 V Version,
tR = tF = 5 ms, IOUT = 30 mA
5.8
5.3
4.8
VIN (V)
VOUT (V)
4.3
3.310
3.305
3.300
3.295
3.290
3.285
0
40
80
120 160 200 240 280 320 360 400
t (ms)
Figure 38. Line Transients, 3.3 V Version,
tR = tF = 5 ms, IOUT = 30 mA
45
30
15
IOUT (mA)
VOUT (V)
0
1.22
1.21
1.20
1.19
1.18
1.17
0
40
80
120 160 200 240 280 320 360 400
t (ms)
Figure 39. Load Transients, 1.2 V Version,
IOUT = 1 – 30 mA, tR = tF = 0.5 ms, VIN = 1.8 V
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NCP4683
TYPICAL CHARACTERISTICS
45
30
15
IOUT (mA)
VOUT (V)
0
1.82
1.81
1.80
1.79
1.78
1.77
0
40
80
120 160 200 240 280 320 360 400
t (ms)
Figure 40. Load Transients, 1.8 V Version,
IOUT = 1 – 30 mA, tR = tF = 0.5 ms, VIN = 2.8 V
45
30
15
IOUT (mA)
VOUT (V)
0
2.82
2.81
2.80
2.79
2.78
2.77
0
40
80
120 160 200 240 280 320 360 400
t (ms)
Figure 41. Load Transients, 2.8 V Version,
IOUT = 1 – 30 mA, tR = tF = 0.5 ms, VIN = 3.8 V
45
30
15
IOUT (mA)
VOUT (V)
0
3.32
3.31
3.30
3.29
3.28
3.27
0
40
80
120 160 200 240 280 320 360 400
t (ms)
Figure 42. Load Transients, 3.3 V Version,
IOUT = 1 – 30 mA, tR = tF = 0.5 ms, VIN = 4.3 V
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NCP4683
TYPICAL CHARACTERISTICS
150
100
50
1.215
IOUT (mA)
VOUT (V)
0
1.210
1.205
1.200
1.195
1.190
1.185
0
40
80
120 160 200 240 280 320 360 400
t (ms)
Figure 43. Load Transients, 1.2 V Version,
IOUT = 50 – 100 mA, tR = tF = 0.5 ms, VIN = 1.8 V
150
100
50
IOUT (mA)
VOUT (V)
0
1.815
1.810
1.805
1.800
1.795
1.790
1.785
0
40
80
120 160 200 240 280 320 360 400
t (ms)
Figure 44. Load Transients, 1.8 V Version,
IOUT = 50 – 100 mA, tR = tF = 0.5 ms, VIN = 2.8 V
150
100
50
IOUT (mA)
VOUT (V)
0
2.815
2.810
2.805
2.800
2.795
2.790
2.785
0
40
80
120 160 200 240 280 320 360 400
t (ms)
Figure 45. Load Transients, 2.8 V Version,
IOUT = 50 – 100 mA, tR = tF = 0.5 ms, VIN = 3.8 V
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NCP4683
3.315
IOUT (mA)
VOUT (V)
TYPICAL CHARACTERISTICS
3.310
3.305
3.300
150
3.295
100
3.290
50
3.285
0
40
80
0
120 160 200 240 280 320 360 400
t (ms)
Figure 46. Load Transients, 3.3 V Version,
IOUT = 50 – 100 mA, tR = tF = 0.5 ms, VIN = 4.3 V
450
300
150
IOUT (mA)
VOUT (V)
0
1.30
1.25
1.20
1.15
1.10
1.05
0
40
80
120 160 200 240 280 320 360 400
t (ms)
Figure 47. Load Transients, 1.2 V Version,
IOUT = 1 – 300 mA, tR = tF = 0.5 ms, VIN = 2.2 V
450
300
150
IOUT (mA)
VOUT (V)
0
1.90
1.85
1.80
1.75
1.70
1.65
0
40
80
120 160 200 240 280 320 360 400
t (ms)
Figure 48. Load Transients, 1.8 V Version,
IOUT = 1 – 300 mA, tR = tF = 0.5 ms, VIN = 2.8 V
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NCP4683
TYPICAL CHARACTERISTICS
450
300
150
IOUT (mA)
VOUT (V)
0
2.90
2.85
2.80
2.75
2.70
2.65
0
40
80
120 160 200 240 280 320 360 400
t (ms)
Figure 49. Load Transients, 2.8 V Version,
IOUT = 1 – 300 mA, tR = tF = 0.5 ms, VIN = 3.8 V
450
300
150
IOUT (mA)
VOUT (V)
0
3.40
3.35
3.30
3.25
3.20
3.15
0
40
80
120 160 200 240 280 320 360 400
t (ms)
Figure 50. Load Transients, 3.3 V Version,
IOUT = 1 – 300 mA, tR = tF = 0.5 ms, VIN = 4.3 V
3
Chip Enable
2
1
IOUT = 300 mA
IOUT = 1 mA
1.5
1.0
0.5
IOUT = 30 mA
0
−0.5
0
20
40
60
80
100 120 140 160 180 200
t (ms)
Figure 51. Start−up, 1.2 V Version, VIN = 2.2 V
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14
VCE (V)
VOUT (V)
0
NCP4683
TYPICAL CHARACTERISTICS
3
Chip Enable
2
1
IOUT = 1 mA
VCE (V)
VOUT (V)
0
IOUT = 300 mA
1.5
1.0
IOUT = 30 mA
0.5
0
−0.5
0
20
40
60
80
100 120 140 160 180 200
t (ms)
Figure 52. Start−up, 1.8 V Version, VIN = 2.8 V
6
IOUT = 1 mA
Chip Enable
2
0
2.5
VCE (V)
VOUT (V)
3.0
4
2.0
1.5
IOUT = 300 mA
1.0
0.5
IOUT = 30 mA
0
−0.5
0
20
40
60
80
100 120 140 160 180 200
t (ms)
Figure 53. Start−up, 2.8 V Version, VIN = 3.8 V
6
Chip Enable
4
2
IOUT = 30 mA
IOUT = 1 mA
4.0
3.0
2.0
1.0
IOUT = 300 mA
0
−1.0
0
20
40
60
80
100 120 140 160 180 200
t (ms)
Figure 54. Start−up, 3.3 V Version, VIN = 4.3 V
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VCE (V)
VOUT (V)
0
NCP4683
TYPICAL CHARACTERISTICS
3
2
1
0
VCE (V)
VOUT (V)
Chip Enable
2.0
IOUT = 1 mA
1.5
IOUT = 30 mA
1.0
0.5
0
−0.5
IOUT = 300 mA
0
1
2
3
4
5
t (ms)
6
7
8
9
10
Figure 55. Shutdown, 1.2 V Version B,
VIN = 2.2 V
3
2
1
0
VCE (V)
VOUT (V)
Chip Enable
2.0
IOUT = 1 mA
1.5
1.0
IOUT = 30 mA
0.5
0
−0.5
IOUT = 300 mA
0
100 200 300 400 500 600 700 800 900 1000
t (ms)
Figure 56. Shutdown, 1.8 V Version D,
VIN = 2.8 V
6
4
4.0
0
IOUT = 1 mA
3.0
2.0
IOUT = 30 mA
1.0
0
−1.0
2
VCE (V)
VOUT (V)
Chip Enable
IOUT = 300 mA
0
100 200 300 400 500 600 700 800 900 1000
t (ms)
Figure 57. Shutdown, 2.8 V Version D,
VIN = 3.8 V
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NCP4683
TYPICAL CHARACTERISTICS
6
4
4.0
3.0
IOUT = 1 mA
2.0
0
0
IOUT = 30 mA
1.0
−1.0
0
2
VCE (V)
VOUT (V)
Chip Enable
IOUT = 300 mA
100 200 300 400 500 600 700 800 900 1000
t (ms)
Figure 58. Shutdown, 3.3 V Version D,
VIN = 4.3 V
APPLICATION INFORMATION
down current source. If the enable function is not needed
connect CE pin to VIN.
A typical application circuit for NCP4683 series is shown
in Figure 59.
NCP4683x
VIN
VIN
C1
1m
Current Limit
VOUT
This regulator includes fold−back type current limit
circuit. This type of protection doesn’t limit current up to
current capability in normal operation, but when over
current occurs, output voltage and current decrease until
over current condition ends. Typical characteristics of this
protection type can be observed in the Output Voltage vs.
Output Current graphs shown in the typical characteristics
chapter of this datasheet.
VOUT
CE
GND
C2
1m
Output Discharger
Figure 59. Typical Application Schematic
The D version includes a transistor between VOUT and
GND that is used for faster discharging of the output
capacitor. This function is activated when the IC goes into
disable mode.
Input Decoupling Capacitor (C1)
A 1 mF ceramic input decoupling capacitor should be
connected as close as possible to the input and ground pin of
the NCP4683. Higher values and lower ESR improves line
transient response.
Thermal
A 1 mF ceramic output decoupling capacitor is enough to
achieve stable operation of the IC. If a tantalum capacitor is
used, and its ESR is high, loop oscillation may result. The
capacitors should be connected as close as possible to the
output and ground pins. Larger values and lower ESR
improves dynamic parameters.
As power across the IC increase, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and also the ambient
temperature affect the rate of temperature increase for the
part. When the device has good thermal conductivity
through the PCB the junction temperature will be relatively
low in high power dissipation applications.
Enable Operation
PCB layout
Output Decoupling Capacitor (C2)
The enable pin CE may be used for turning the regulator
on and off. The IC is switched on when a high level voltage
is applied to the CE pin. The enable pin has an internal pull
Make the VIN and GND line as large as practical. If their
impedance is high, noise pickup or unstable operation may
result. Connect capacitors C1 and C2 as close as possible to
the IC, and make wiring as short as possible.
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17
NCP4683
ORDERING INFORMATION
Nominal Output
Voltage
Description
Marking
Package
Shipping†
NCP4683DMU12TCG
1.20
Auto discharge
Q4
UDFN4
(Pb−Free)
10000 / Tape & Reel
NCP4683DMU18TCG
1.80
Auto discharge
R0
UDFN4
(Pb−Free)
10000 / Tape & Reel
NCP4683DMU185TCG
1.85
Auto discharge
T0
UDFN4
(Pb−Free)
10000 / Tape & Reel
NCP4683DMU285TCG
2.85
Auto discharge
T1
UDFN4
(Pb−Free)
10000 / Tape & Reel
NCP4683DMU31TCG
3.1
Auto discharge
S3
UDFN4
(Pb−Free)
10000 / Tape & Reel
NCP4683HMU12TCG
1.20
Standard
L4
UDFN4
(Pb−Free)
10000 / Tape & Reel
NCP4683HMU185TCG
1.85
Standard
P0
UDFN4
(Pb−Free)
10000 / Tape & Reel
NCP4683DSQ18T1G
1.80
Auto discharge
AH18
SC−70
(Pb−Free)
3000 / Tape & Reel
NCP4683DSQ28T1G
2.80
Auto discharge
AH28
SC−70
(Pb−Free)
3000 / Tape & Reel
NCP4683DSQ33T1G
3.30
Auto discharge
AH33
SC−70
(Pb−Free)
3000 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
*Marking codes for XDFN0808 packages are unified.
**To order other package and voltage variants, please contact your ON Semiconductor sales representative.
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18
NCP4683
PACKAGE DIMENSIONS
SOT−23 5−LEAD
CASE 1212
ISSUE A
A
5
E
1
L1
A1
4
2
L
3
5X
e
A2
0.05 S
B
D
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DATUM C IS THE SEATING PLANE.
A
E1
b
0.10
C
M
C B
S
A
S
C
RECOMMENDED
SOLDERING FOOTPRINT*
3.30
DIM
A
A1
A2
b
c
D
E
E1
e
L
L1
5X
0.85
5X
0.95
PITCH
0.56
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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19
MILLIMETERS
MIN
MAX
--1.45
0.00
0.10
1.00
1.30
0.30
0.50
0.10
0.25
2.70
3.10
2.50
3.10
1.50
1.80
0.95 BSC
0.20
--0.45
0.75
NCP4683
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE K
A
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
G
5
4
−B−
S
1
2
DIM
A
B
C
D
G
H
J
K
N
S
3
D 5 PL
0.2 (0.008)
M
B
M
N
J
C
H
K
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INCHES
MIN
MAX
0.071
0.087
0.045
0.053
0.031
0.043
0.004
0.012
0.026 BSC
--0.004
0.004
0.010
0.004
0.012
0.008 REF
0.079
0.087
MILLIMETERS
MIN
MAX
1.80
2.20
1.15
1.35
0.80
1.10
0.10
0.30
0.65 BSC
--0.10
0.10
0.25
0.10
0.30
0.20 REF
2.00
2.20
NCP4683
PACKAGE DIMENSIONS
UDFN4 1.0x1.0, 0.65P
CASE 517BR
ISSUE O
PIN ONE
REFERENCE
2X
0.05 C
4X
A
B
D
ÉÉ
ÉÉ
typ
DETAIL A
0.05 C
2X
c 0.18
L2
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.15 AND
0.20 mm FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L3
3X
TOP VIEW
0.43
4X
0.23
(A3)
0.05 C
A
3X
0.05 C
NOTE 4
A1
SIDE VIEW
e
DETAIL A
3X
2
D2
45 5
SEATING
PLANE
L
0.65
PITCH
DETAIL B
D2
4
b
0.05
BOTTOM VIEW
2X
0.52
PACKAGE
OUTLINE
3
4X
MILLIMETERS
MIN
MAX
−−−
0.60
0.00
0.05
0.10 REF
0.20
0.30
1.00 BSC
0.43
0.53
1.00 BSC
0.65 BSC
0.20
0.30
0.27
0.37
0.02
0.12
RECOMMENDED
MOUNTING FOOTPRINT*
e/2
1
C
0.10
DETAIL B
DIM
A
A1
A3
b
D
D2
E
e
L
L2
L3
1.30
M
C A B
NOTE 3
0.53
4X
0.30
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NCP4683/D