BC401M Order Code: Gas Discharge Tube BC401M-01 Version: A0 2013-09-17 Features Exterior Small Size Design EIA 1812 4.5×3.2×2.7mm Current Handling Capability 2,000A @ 8/20μs Low Capacitance and Insertion Loss Fast Response and Long Service Life Reliable to Protect Electrostatic Surge Moisture sensitivity level：Level 1 SMD Application information Package (Top View) xDSL ` 1 Agency Approvals 2 Schematic Symbol Icon Description Compliance with 2011/65/EU 2 1 Compliance with IEC61249-2-21:2003 Mean lead free Compliance with UL497B, Certificated E232249 Electrical Parameter DC Breakdown Voltage 1)2) Impulse Spark-over Voltage 100V/s 360-560 V At 1kV/μs for 99 % of measured values 950 V At 1kV/μs Typical values of distribution 800 V Impulse Discharge Current 3) 8/20μs 2,000 A Arc Voltage At 1A ~15 V Insulation Resistance DC=100V ≥1 GΩ Capacitance at 1 MHz VDC=0.5V ≤1.0 pF Weight ~0.20 g Operating And Storage Temperature -40-90 ℃ Marking Without 1) At delivery AQL 0.65 level II GB/T 2828.1-2003 2) In ionized mode 3) Terms and waveforms in accordance with ITU-T Rec. K. 12; IEC 61643-21 1/3 www.bencent.com.cn Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications BC401M Order Code: Gas Discharge Tube Version: A0 2013-09-17 Product Characteristics Part Numbering System BC 401 M (1) (2) (3) BC401M-01 (1)Bencent Gas Discharge Tube (2) Series: DC Breakdown Voltage, e.g.：151=15×101=150V (3) Tolerance of DC Breakdown Voltage, M=+-20%, N=+-30%,the Specific tolerance is decided by the table of Lead Material Copper or iron nickel alloy Body Material Ceramics Terminal Finish 100% Matte-Tin Plated “Electrical Parameter” Environmental Reliability Characteristics Testing items Technical standards Temperature: 85℃ Time:2H Temperature: -40℃ Time:2H Frequency：10-500Hz Amplitude：0.15mm Time：45mins Temperature: 260±5℃ Time of dip soldering：10s，1time High Temperature Storage Test Low Temperature Storage Test Vibration Resistance of soldering heat Note: Up-screen program can be specified by customer’s request via contacting Bencent service Solderability test Solderability Solder Pot Temperature: 245℃±5℃ Solder Dwell Time: 4-6 seconds Product Dimensions A C REF mm inch A 4.5±0.3 0.177±0.012 B 0.5±0.2 0.020±0.008 C 2.7±0.2 0.106±0.008 D 3.2±0.2 0.126±0.008 REF mm inch A 5.5 0.217 B 3.5 0.138 C 3.5 0.138 D B Recommended Soldering Pad A B C 2/3 www.bencent.com.cn Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications BC401M Order Code: Gas Discharge Tube BC401M-01 Version: A0 2013-09-17 Reflow Profile Reflow Condition Heat Temperature Min 150°C Temperature Max 200°C Time （min to max） Average ramp up rate（Liquids）Tamp （TL） to peal TS(max) to TL - Ramp-up Rate 60 – 180 secs 3°C/second max (Liquids) - Temperature (TL) Peak Temperature (TP) 217°C Ramp-down Preheat tS 25 Time time to peak temperature Ramp-down Rate 6°C/second max Time 25°C to peak Temperature (TP) 8 minutes Max. Do not exceed 260°C 3/3 TL TS(min) 60 – 150 seconds 8 – 20 seconds Temperature (tp) Reel TS(max) 260+0/-5 °C Time within 5°C of actual peak Package Critical Zone TL to TP Ramp-up TL 3°C/second max - Temperature (TL) Reflow tP TP Temperature Pre Pb-Free assembly Information OUTLINE REEL (PCS) PER CARTON (PCS) TAPING 2,000 32,000 www.bencent.com.cn REF mm inch A 3.7±0.2 0.146±0.008 B 4.7±0.2 0.185±0.008 d Φ1.5±0.1 Φ0.059±0.004 E 1.75±0.1 0.069±0.004 F 5.5±0.1 0.217±0.002 P 8.0±0.1 0.315±0.004 P0 4.0±0.1 0.157±0.004 P1 2.0±0.1 0.079±0.004 W 12.0±0.2 0.472±0.008 D Φ330.0 Φ13.0 D1 Φ50Min Φ1.97Min D2 Φ13±0.15 0.512±0.006 W1 16.8±2.0 0.661±0.079 REEL DIAMETERS (mm) 330 CARTON SIZE(mm) L W H 360 360 380 Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications