HIN232, HIN236, HIN237,HIN238, HIN239, HIN240, HIN241 ® Data Sheet August 31, 2005 FN3138.15 +5V Powered RS-232 Transmitters/Receivers Features The HIN232-HIN241 family of RS-232 transmitters/receivers interface circuits meet all ElA RS-232E and V.28 specifications, and are particularly suited for those applications where ±12V is not available. They require a single +5V power supply (except HIN239) and feature onboard charge pump voltage converters which generate +10V and -10V supplies from the 5V supply. The family of devices offer a wide variety of RS-232 transmitter/receiver combinations to accommodate various applications (see Selection Table). • Requires Only Single +5V Power Supply - (+5V and +12V - HIN239) The drivers feature true TTL/CMOS input compatibility, slewrate-limited output, and 300Ω power-off source impedance. The receivers can handle up to ±30V, and have a 3kΩ to 7kΩ input impedance. The receivers also feature hysteresis to greatly improve noise rejection. • Multiple Drivers - ±10V Output Swing for 5V lnput - 300Ω Power-Off Source Impedance - Output Current Limiting - TTL/CMOS Compatible - 30V/µs Maximum Slew Rate • Meets All RS-232E and V.28 Specifications • High Data Rate. . . . . . . . . . . . . . . . . . . . . . . . . . . 120kbps • Onboard Voltage Doubler/Inverter • Low Power Consumption • Low Power Shutdown Function • Three-State TTL/CMOS Receiver Outputs • Multiple Receivers - ±30V Input Voltage Range - 3kΩ to 7kΩ Input Impedance - 0.5V Hysteresis to Improve Noise Rejection • Pb-Free Plus Anneal Available (RoHS Compliant) Applications • Any System Requiring RS-232 Communication Ports - Computer - Portable, Mainframe, Laptop - Peripheral - Printers and Terminals - Instrumentation - Modems Selection Table POWER SUPPLY VOLTAGE NUMBER OF RS-232 DRIVERS NUMBER OF RS-232 RECEIVERS EXTERNAL COMPONENTS LOW POWER SHUTDOWN/TTL THREE-STATE NUMBER OF LEADS HIN232 +5V 2 2 4 Capacitors No/No 16 HIN236 +5V 4 3 4 Capacitors Yes/Yes 24 HIN237 +5V 5 3 4 Capacitors No/No 24 HIN238 +5V 4 4 4 Capacitors No/No 24 HIN239 +5V and +7.5V to 13.2V 3 5 2 Capacitors No/Yes 24 HIN240 +5V 5 5 4 Capacitors Yes/Yes 44 HIN241 +5V 4 5 4 Capacitors Yes/Yes 28 PART NUMBER 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2004, 2005. All Rights Reserved. All other trademarks mentioned are the property of their respective owners. HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Pin Descriptions PIN VCC FUNCTION Power Supply Input 5V ±10%. V+ Internally generated positive supply (+10V nominal), HIN239 requires +7.5V to +13.2V. V- Internally generated negative supply (-10V nominal). GND Ground lead. Connect to 0V. C1+ External capacitor (+ terminal) is connected to this lead. C1- External capacitor (- terminal) is connected to this lead. C2+ External capacitor (+ terminal) is connected to this lead. C2- External capacitor (- terminal) is connected to this lead. TIN Transmitter Inputs. These leads accept TTL/CMOS levels. An internal 400kΩ pull-up resistor to VCC is connected to each lead. TOUT RIN ROUT Transmitter Outputs. These are RS-232 levels (nominally ±10V). Receiver Inputs. These inputs accept RS-232 input levels. An internal 5kΩ pull-down resistor to GND is connected to each input. Receiver Outputs. These are TTL/CMOS levels. EN Enable input. This is an active low input which enables the receiver outputs. With EN = 5V, the receiver outputs are placed in a high impedance state. SD Shutdown Input. With SD = 5V, the charge pump is disabled, the receiver outputs are in a high impedance state and the transmitters are shut off. NC No Connect. No connections are made to these leads. 2 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Ordering Information (Continued) Ordering Information PART NUMBER PART MARKING TEMP. RANGE (oC) PACKAGE HIN232CB 232CB 0 to 70 16 Ld SOIC HIN232CB-T 232CB 0 to 70 Tape and Reel HIN232CBZ (See Note) 232CBZ 0 to 70 16 Ld SOIC (Pb-free) PKG. DWG. # M16.3 M16.3 HIN232CBZ-T 232CBZ (See Note) 0 to 70 Tape and Reel (Pb-free) HIN232CP HIN232CP 0 to 70 16 Ld PDIP E16.3 HIN232CPZ (See Note) HIN232CPZ 0 to 70 16 Ld PDIP* (Pb-free) E16.3 M16.3 HIN232IB 232IB -40 to 85 16 Ld SOIC HIN232IB-T 232IB -40 to 85 Tape and Reel HIN232IBZ (See Note) 232IBZ -40 to 85 16 Ld SOIC (Pb-free) M16.3 HIN232IBZ-T (See Note) 232IBZ HIN232IP HIN232IP -40 to 85 16 Ld PDIP E16.3 HIN232IPZ (See Note) HIN232IPZ -40 to 85 16 Ld PDIP* (Pb-free) E16.3 HIN236CB 236CB 0 to 70 24 Ld SOIC M24.3 HIN236CBZ (See Note) 236CBZ 0 to 70 24 Ld SOIC (Pb-free) M24.3 M24.3 -40 to 85 Tape and Reel (Pb-free) HIN237CB 237CB 0 to 70 24 Ld SOIC HIN237CB-T 237CB 0 to 70 Tape and Reel HIN237CBZ (See Note) 237CBZ 0 to 70 24 Ld SOIC (Pb-free) HIN237CBZ-T 237CBZ (See Note) 0 to 70 Tape and Reel (Pb-free) HIN238CB 238CB 0 to 70 24 Ld SOIC HIN238CB-T 238CB 0 to 70 Tape and Reel HIN238CBZ (See Note) 238CBZ 0 to 70 24 Ld SOIC (Pb-free) HIN238CBZ-T 238CBZ (See Note) 0 to 70 Tape and Reel (Pb-free) M24.3 M24.3 M24.3 HIN238CP HIN238CP 0 to 70 24 Ld PDIP E24.3 HIN238CPZ (See Note) HIN238CPZ 0 to 70 24 Ld PDIP* (Pb-free) E24.3 HIN238IB 238IB -40 to 85 24 Ld SOIC M24.3 HIN238IBZ (See Note) 238IBZ -40 to 85 24 Ld SOIC (Pb-free) M24.3 HIN239CB 239CB 0 to 70 24 Ld SOIC HIN239CB-T 239CB 0 to 70 Tape and Reel HIN239CBZ (See Note) 239CBZ 0 to 70 24 Ld SOIC (Pb-free) HIN239CBZ-T 239CBZ (See Note) 0 to 70 Tape and Reel (Pb-free) HIN239CP 0 to 70 24 Ld PDIP HIN239CP 3 M24.3 M24.3 E24.3 PART NUMBER PART MARKING TEMP. RANGE (oC) HIN239CPZ (See Note) HIN239CPZ 0 to 70 24 Ld PDIP* (Pb-free) E24.3 HIN240CN HIN240CN 0 to 70 44 Ld MQFP Q44.10X10 HIN240CNZ (See Note) HIN240CNZ 0 to 70 44 Ld MQFP (Pb-free) Q44.10X10 HIN240CNZ-T HIN240CNZ (See Note) 0 to 70 44 Ld MQFP Tape and Reel (Pb-free) HIN241CA HIN241CA 0 to 70 28 Ld SSOP M28.209 HIN241CAZ (See Note) HIN241CAZ 0 to 70 28 Ld SSOP (Pb-free) M28.209 M28.3 PACKAGE PKG. DWG. # HIN241CB 241CB 0 to 70 28 Ld SOIC HIN241CB-T 241CB 0 to 70 Tape and Reel HIN241CBZ (See Note) 241CBZ 0 to 70 28 Ld SOIC (Pb-free) HIN241CBZ-T 241CBZ (See Note) 0 to 70 Tape and Reel (Pb-free) M28.3 HIN241IB 241IB -40 to 85 28 Ld SOIC M28.3 HIN241IBZ (See Note) 241IBZ -40 to 85 28 Ld SOIC (Pb-free) M28.3 NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. *Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Pinouts HIN232 (PDIP, SOIC) TOP VIEW HIN236 (SOIC) TOP VIEW T3OUT 1 24 T4OUT 15 GND T1OUT 2 23 R2IN 14 T1OUT T2OUT 3 22 R2OUT R1IN 4 21 SD R1OUT 5 20 EN T2IN 6 19 T4IN 16 VCC C1+ 1 V+ 2 C1- 3 13 R1IN C2+ 4 12 R1OUT C2- 5 6 11 T1IN T2OUT 7 10 T2IN V- 9 R2OUT R2IN 8 T1IN 7 18 T3IN GND 8 17 R3OUT VCC 9 16 R3IN C1+ 10 14 C2- C1- 12 13 C2+ +5V +5V + 1µF 16 1µF 1 NOTE 1 + 3 4 NOTE 1 T1IN + 5 11 VCC C1+ C1C2+ C2- +5V TO 10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER +5V 400kΩ V+ 2 + NOTE 1 1µF T1IN V- 6 + T2IN T1 14 T2IN 10 T1OUT T2 7 12 T2OUT T4IN R1IN T1 +5V 400kΩ T2 6 18 +5V 400kΩ T3 +5V 400kΩ 19 T4 2 3 1 24 R2OUT 8 1µF 1µF T1OUT T2OUT T3OUT T4OUT 4 R1IN 5kΩ R1 22 9 + V- 15 R1OUT 5kΩ R1 V+ 11 + +5V 400kΩ 7 5 13 R1OUT 9 10 VCC C1+ + +5V TO 10V 12 C1- VOLTAGE DOUBLER 13 C2+ + +10V TO -10V 14 VOLTAGE INVERTER C2- NOTE 1 T3IN +5V 400kΩ 15 V- V+ 11 23 R2IN R2OUT R2IN 5kΩ R2 5kΩ R2 17 16 R3IN R3OUT 15 20 5kΩ R3 SD EN NOTE: 8 1. Either 0.1µF or 1µF capacitors may be used. The V+ capacitor may be terminated to VCC or to GND. 4 21 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Pinouts (Continued) HIN237 (SOIC) TOP VIEW HIN238 (PDIP, SOIC) TOP VIEW T3OUT 1 24 T4OUT T2OUT 1 24 T3OUT T1OUT 2 23 R2IN T1OUT 2 23 R3IN T2OUT 3 22 R2OUT R2IN 3 R2OUT 4 22 R3OUT 21 T4IN T1IN 5 R1OUT 6 20 T4OUT 19 T3IN 18 T2IN 17 R4OUT R1IN 21 T5IN 4 R1OUT 5 20 T5OUT T2IN 6 19 T4IN T1IN 7 18 T3IN R1IN 7 GND 8 17 R3OUT VCC 9 16 R3IN GND 8 VCC 9 C1+ 10 C1+ 10 15 V- V+ 11 14 C2- V+ 11 14 C2- C1- 12 13 C2+ C1- 12 13 C2+ +5V +5V 9 1µF 1µF T1IN T2IN T3IN T4IN T5IN 10 C1+ + 12 C113 C2+ + 14 C2- 16 R4IN 15 V- 11 +5V TO 10V VOLTAGE DOUBLER V+ +10V TO -10V VOLTAGE INVERTER V- 15 +5V 400kΩ 7 T1 +5V 400kΩ T2 6 18 +5V 400kΩ T3 T4 +5V 400kΩ 21 T5 + 1µF 1µF 1µF + 2 3 +5V 400kΩ 19 9 1µF VCC 1 24 T1OUT T1IN T2OUT T2IN T3OUT T3IN T4OUT T4IN 10 C1+ + 12 C113 C2+ + 14 C2- 1µF VCC +5V TO 10V VOLTAGE DOUBLER V+ +10V TO -10V VOLTAGE INVERTER V- 15 5 T5OUT T1 +5V 400kΩ T2 18 19 +5V 400kΩ T3 +5V 400kΩ 21 T4 2 1 24 20 22 4 R2IN R2IN 22 23 R3IN 5kΩ R3 17 T4OUT 5kΩ R3OUT 5kΩ T3OUT 3 R2 23 R2 T2OUT R1IN R2OUT R2OUT T1OUT 5kΩ R1 R1IN 5kΩ R1 1µF 7 R1OUT 4 R1OUT + + +5V 400kΩ 5 6 20 11 16 R3IN R3OUT 5kΩ R3 17 16 R4IN R4OUT 5kΩ R4 8 5 8 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Pinouts (Continued) HIN239 (PDIP, SOIC) TOP VIEW R1OUT 1 24 T1IN R1IN 2 23 T2IN GND 3 22 R2OUT VCC 4 21 R2IN NC R5IN R5OUT T3IN T4IN R4OUT R4IN T5OUT EN SD NC HIN240 (MQFP) 44 43 42 41 40 39 38 37 36 35 34 33 2 32 NC 1 T5IN NC NC V+ 5 20 T2OUT R3OUT 3 31 NC C1+ 6 19 T1OUT R3IN 4 30 V- C1- 7 18 R3IN T4OUT 5 29 C2- 17 R3OUT T3OUT 6 28 C2+ C1- V- 8 16 T3IN T1OUT 7 27 R5OUT 10 15 NC T2OUT 8 26 V+ R4OUT 11 14 EN NC 9 25 C1+ R2IN NC NC NC NC NC VCC GND R1IN R1OUT NC T1IN 24 10 11 23 12 13 14 15 16 17 18 19 20 21 22 NC T2IN 13 T3OUT R4IN 12 R2OUT R5IN 9 +5V +7.5V TO +13.2V (NOTE) +5V 4 6 1µF + 7 (NOTE) T1IN T2IN T3IN R1OUT VCC C1+ C1- +10V TO -10V VOLTAGE INVERTER +5V 400kΩ 24 23 16 1µF +5V 400kΩ +5V 400kΩ V+ V- 5 8 1µF + T1 19 1µF T1OUT T2 20 T3 13 T2OUT T2IN T3OUT T3IN R1IN T4IN 2 1 R1 5kΩ 22 T5IN 21 R2IN R2OUT R2 5kΩ R1OUT 17 18 R3IN R3 5kΩ 11 +5V 400kΩ 37 T3 +5V 400kΩ T4 +5V 400kΩ 2 T5 38 R4IN 10 1µF 7 T1OUT T2OUT T3OUT T4OUT 41 T5OUT 17 R1IN 5kΩ 13 10 R2IN 5kΩ 3 4 R3IN R3OUT 5kΩ 40 R4IN R4OUT R4 5kΩ 5kΩ 36 EN 35 R5IN R5OUT 3 42 R5 EN NOTE: For V+ > 11V, use C1 ≤ 0.1µF. 6 1µF 30 5 39 R5IN + 6 R3 9 V- 26 8 16 5kΩ R5OUT V+ R2OUT 12 R5 T2 R2 R4OUT R4 +5V 400kΩ 14 R1 R3OUT 14 T1IN 19 25 VCC C1+ + +5V TO 10V 27 C1- VOLTAGE DOUBLER 28 C2+ +10V TO -10V + 29 VOLTAGE INVERTER C2+5V T1 400kΩ 15 18 5kΩ 43 SD HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Pinouts (Continued) HIN241 (SOIC, SSOP) TOP VIEW T3OUT 1 28 T4OUT T1OUT 2 27 R3IN T2OUT 3 26 R3OUT R2IN 4 25 SD R2OUT 5 24 EN T2IN 6 23 R4IN T1IN 7 22 R4OUT R1OUT 8 21 T4IN R1IN 9 20 T3IN GND 10 19 R5OUT VCC 11 18 R5IN C1+ 12 17 V- V+ 13 16 C2- C1- 14 15 C2+ +5V 1µF 1µF T1IN T2IN T3IN T4IN R1OUT 11 12 V CC C1+ + +5V TO 10V 14 C1- VOLTAGE DOUBLER 15 C2+ + +10V TO -10V 16 VOLTAGE INVERTER C2+5V 400kΩ 7 T1 +5V 400kΩ 6 T2 +5V 400kΩ 20 T3 +5V 400kΩ T4 21 1µF V+ 13 + V- 17 + 1µF 2 T1OUT 3 T2OUT 1 T3OUT 28 8 T4OUT 9 R1IN 5kΩ R1 5 4 R2IN R2OUT 5kΩ R2 26 27 R3IN R3OUT 5kΩ R3 22 23 R4IN R4OUT 5kΩ R4 19 18 R5IN R5OUT 24 5kΩ R5 25 EN 10 7 SD HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Absolute Maximum Ratings Thermal Information VCC to Ground. . . . . . . . . . . . . . . . . . . . . . (GND -0.3V) < VCC < 6V V+ to Ground (Note 2) . . . . . . . . . . . . . . . (VCC -0.3V) < V+ < 13.2V V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . -12V < V- < (GND +0.3V) V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24V Input Voltages TIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V < VIN < (V+ +0.3V) RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30V Output Voltages TOUT . . . . . . . . . . . . . . . . . . . .(V- -0.3V) < VTXOUT < (V+ +0.3V) ROUT . . . . . . . . . . . . . . . . . (GND -0.3V) < VRXOUT < (V+ +0.3V) Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous Thermal Resistance (Typical, Note 3) 16 Ld PDIP Package*. . . . . . . . . . . . . . . . . . . . . . . . 90 24 Ld PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . 70 16 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 100 24 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 75 28 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . 70 28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 95 44 Ld MQFP Package . . . . . . . . . . . . . . . . . . . . . . . 80 Maximum Junction Temperature (Plastic Package) . . . . . . . .150oC Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC (SOIC, SSOP, MQFP - Lead Tips Only) Operating Conditions *Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. Temperature Range HIN2XXCX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC HIN2XXIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC θJA (oC/W) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 2. Only HIN239. For V+ > 11V, C1 must be ≤0.1µF. 3. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details. Test Conditions: VCC = +5V ±10%, TA = Operating Temperature Range Electrical Specifications PARAMETER TEST CONDITIONS MIN TYP MAX UNITS HIN232 - 5 10 mA HIN236-HIN238, HIN240-HIN241 - 7 15 mA HIN239 - 0.4 1 mA HIN239 - 5.0 15 mA - 1 10 µA - - 0.8 V SUPPLY CURRENTS Power Supply Current, ICC No Load, TA = 25oC V+ Power Supply Current, ICC No Load, TA = 25oC No Load, TA = 25oC Shutdown Supply Current, ICC(SD) TA = 25oC LOGIC AND TRANSMITTER INPUTS, RECEIVER OUTPUTS Input Logic Low, VlL TIN, EN, Shutdown Input Logic High, VlH TIN 2.0 - - V EN, Shutdown 2.4 - - V Transmitter Input Pullup Current, IP TIN = 0V - 15 200 µA TTL/CMOS Receiver Output Voltage Low, VOL IOUT = 1.6mA - 0.1 0.4 V TTL/CMOS Receiver Output Voltage High, VOH IOUT = -1.0mA 3.5 4.6 - V -30 - +30 V RECEIVER INPUTS RS-232 Input Voltage Range VIN Receiver Input Impedance RIN VIN = ±3V 3.0 5.0 7.0 kΩ Receiver Input Low Threshold, VlN (H-L) VCC = 5V, TA = 25oC 0.8 1.2 - V Receiver Input High Threshold, VIN (L-H) VCC = 5V, TA = 25oC - 1.7 2.4 V 0.2 0.5 1.0 V Receiver Input Hysteresis VHYST 8 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Test Conditions: VCC = +5V ±10%, TA = Operating Temperature Range (Continued) Electrical Specifications PARAMETER TEST CONDITIONS MIN TYP MAX UNITS 120 - - kbps TIMING CHARACTERISTICS Baud Rate (1 Transmitter Switching) RL = 3kΩ Output Enable Time, tEN HIN236, HIN239, HIN240, HIN241 - 400 - ns Output Disable Time, tDIS HIN236, HIN239, HIN240, HIN241 - 250 - ns Propagation Delay, tPD RS-232 to TTL - 0.5 - µs Instantaneous Slew Rate SR CL = 10pF, RL = 3kΩ, TA = 25oC (Note 4) - - 30 V/µs Transition Region Slew Rate, SRT RL = 3kΩ, CL = 2500pF Measured from +3V to -3V or -3V to +3V, 1 Transmitter Switching - 3 - V/µs TRANSMITTER OUTPUTS Output Voltage Swing, TOUT Transmitter Outputs, 3kΩ to Ground ±5 ±9 ±10 V Output Resistance, TOUT VCC = V+ = V- = 0V, VOUT = ±2V 300 - - Ω RS-232 Output Short Circuit Current, ISC TOUT shorted to GND - ±10 - mA NOTE: 4. Guaranteed by design. VOLTAGE DOUBLER C1+ S1 VOLTAGE INVERTER S2 V+ = 2VCC S5 C2+ S6 VCC GND + - + C1 - + C3 VCC GND C1- S3 S4 GND S7 C2- + C2 - C4 V- = -(V+) S8 RC OSCILLATOR FIGURE 1. CHARGE PUMP Detailed Description The HIN232 thru HIN241 family of RS-232 transmitters/receivers are powered by a single +5V power supply (except HIN239), feature low power consumption, and meet all ElA RS-232C and V.28 specifications. The circuit is divided into three sections: The charge pump, transmitter, and receiver. Charge Pump An equivalent circuit of the charge pump is illustrated in Figure 1. The charge pump contains two sections: the voltage doubler and the voltage inverter. Each section is driven by a two phase, internally generated clock to generate +10V and -10V. The nominal clock frequency is 16kHz. During phase one of the clock, capacitor C1 is charged to VCC . During phase two, the voltage on C1 is added to VCC , producing a signal across C3 equal to twice VCC . During phase one, C2 is also charged to 2VCC , and then during phase two, it is inverted with respect to ground to produce a signal across C4 equal to -2VCC . The charge pump accepts input voltages up 9 to 5.5V. The output impedance of the voltage doubler section (V+) is approximately 200Ω, and the output impedance of the voltage inverter section (V-) is approximately 450Ω. A typical application uses 1µF capacitors for C1-C4, however, the value is not critical. Increasing the values of C1 and C2 will lower the output impedance of the voltage doubler and inverter, increasing the values of the reservoir capacitors, C3 and C4, lowers the ripple on the V+ and V- supplies. During shutdown mode (HIN236, HIN240 and HIN241), SHUTDOWN control line set to logic “1”, the charge pump is turned off, V+ is pulled down to VCC , V- is pulled up to GND, and the supply current is reduced to less than 10µA. The transmitter outputs are disabled and the receiver outputs are placed in the high impedance state. HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Transmitters Receivers The transmitters are TTL/CMOS compatible inverters which translate the inputs to RS-232 outputs. The input logic threshold is about 26% of VCC, or 1.3V for VCC = 5V. A logic 1 at the input results in a voltage of between -5V and V- at the output, and a logic 0 results in a voltage between +5V and (V+ -0.6V). Each transmitter input has an internal 400kΩ pullup resistor so any unused input can be left unconnected and its output remains in its low state. The output voltage swing meets the RS-232C specifications of ±5V minimum with the worst case conditions of: all transmitters driving 3kΩ minimum load impedance, VCC = 4.5V, and maximum allowable operating temperature. The transmitters have an internally limited output slew rate which is less than 30V/µs. The outputs are short circuit protected and can be shorted to ground indefinitely. The powered down output impedance is a minimum of 300Ω with ±2V applied to the outputs and VCC = 0V. The receiver inputs accept up to ±30V while presenting the required 3kΩ to 7kΩ input impedance even if the power is off (VCC = 0V). The receivers have a typical input threshold of 1.3V which is within the ±3V limits, known as the transition region, of the RS-232 specifications. The receiver output is 0V to VCC . The output will be low whenever the input is greater than 2.4V and high whenever the input is floating or driven between +0.8V and -30V. The receivers feature 0.5V hysteresis to improve noise rejection. The receiver Enable line EN, when set to logic “1”, (HIN236, 239, 240, and 241) disables the receiver outputs, placing them in the high impedance mode. The receiver outputs are also placed in the high impedance state when in shutdown mode. VCC RXIN -30V < RXIN < +30V V+ ROUT 5kΩ GND < VROUT < VCC GND VCC 400kΩ 300Ω TXIN TOUT GND < TXIN < VCC V- < VTOUT < V+ FIGURE 3. RECEIVER V- FIGURE 2. TRANSMITTER TIN OR RIN TOUT OR ROUT VOL VOL tPHL Average Propagation Delay = tPLH tPHL + tPLH 2 FIGURE 4. PROPAGATION DELAY DEFINITION 10 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Typical Performance Curves TA = 25oC 12 12 SUPPLY VOLTAGE (|V|) V- SUPPLY VOLTAGE 1µF 10 0.47µF 8 0.10µF 6 4 TRANSMITTER OUTPUTS OPEN CIRCUIT 10 V+ (VCC = 5V) 8 6 V+ (VCC = 4.5V) V- (VCC = 4.5V) 4 V- (VCC = 5V) 2 2 0 0 3.0 4.0 3.5 4.5 VCC 5.0 5.5 6.0 FIGURE 5. V- SUPPLY VOLTAGE vs VCC , VARYING CAPACITORS 0 5 10 15 20 |ILOAD| (mA) 25 FIGURE 6. V+, V- OUTPUT VOLTAGE vs LOAD (HIN232) Test Circuits (HIN232) +4.5V TO +5.5V INPUT - 1µF C3 1µF C1 + + - 1µF + C2 - - + 3kΩ 1µF C4 1 C1+ VCC 16 2 V+ GND 15 T1OUT 14 4 C2+ R1IN 13 RS-232 ±30V INPUT 5 C2- R1OUT 12 TTL/CMOS OUTPUT T1 OUTPUT 6 V- T1IN 11 TTL/CMOS INPUT 7 T2OUT T2IN 10 TTL/CMOS INPUT 8 R2IN R2OUT 9 1 C1+ VCC 16 2 V+ GND 15 3 C1- T1OUT 14 4 C2+ R1IN 13 5 C2- R1OUT 12 3kΩ 3 C1- TTL/CMOS OUTPUT 6 V- T1IN 11 7 T2OUT T2IN 10 8 R2IN R2OUT 9 ROUT = VIN/1 T2OUT T2 OUTPUT T1OUT VIN = ±2V RS-232 ±30V INPUT FIGURE 7. GENERAL TEST CIRCUIT 11 30 A FIGURE 8. POWER-OFF SOURCE RESISTANCE CONFIGURATION 35 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Applications +5V The HIN2XX may be used for all RS-232 data terminal and communication links. It is particularly useful in applications where ±12V power supplies are not available for conventional RS-232 interface circuits. The applications presented represent typical interface configurations. TD TTL/CMOS INPUTS AND OUTPUTS RTS 6 5 11 - RS-232 INPUTS AND OUTPUTS + T1 14 T2 10 TTL/CMOS RTS INPUTS AND 12 RD OUTPUTS R2 9 CTS 7 13 R1 8 15 TD (2) TRANSMIT DATA RTS (4) REQUEST TO SEND RD (3) RECEIVE DATA CTS (5) CLEAR TO SEND SIGNAL GROUND (7) FIGURE 9. SIMPLE DUPLEX RS-232 PORT WITH CTS/RTS HANDSHAKING - 14 T2 10 + C2 1µF 5 T1 11 12 TD (2) TRANSMIT DATA 7 RTS (4) REQUEST TO SEND 13 RD (3) RECEIVE DATA RD 9 HIN232 4 HIN232 3 CTS 3 C2 + 1µF TD DTR (20) DATA TERMINAL READY DSRS (24) DATA SIGNALING RATE SELECT 2 4 In applications requiring four RS-232 inputs and outputs (Figure 10), note that each circuit requires two charge pump capacitors (C1 and C2) but can share common reservoir capacitors (C3 and C4). The benefit of sharing common reservoir capacitors is the elimination of two capacitors and the reduction of the charge pump source impedance which effectively increases the output swing of the transmitters. 1 16 1 C1 + 1µF - A simple duplex RS-232 port with CTS/RTS handshaking is illustrated in Figure 9. Fixed output signals such as DTR (data terminal ready) and DSRS (data signaling rate select) is generated by driving them through a 5kΩ resistor connected to V+. C1 + 1µF - + R2 R1 8 CTS (5) CLEAR TO SEND 15 16 2 - C3 + + C4 6 V- V+ 2µF 6 - 2µF 2 16 +5V RS-232 INPUTS AND OUTPUTS HIN232 C1 + 1µF DTR TTL/CMOS INPUTS AND OUTPUTS DSRS 1 4 3 5 T1 11 14 T2 10 12 7 13 DCD R1 9 R2 R1 15 8 + C2 1µF - DTR (20) DATA TERMINAL READY DSRS (24) DATA SIGNALING RATE SELECT DCD (8) DATA CARRIER DETECT R1 (22) RING INDICATOR SIGNAL GROUND (7) FIGURE 10. COMBINING TWO HIN232s FOR 4 PAIRS OF RS-232 INPUTS AND OUTPUTS 12 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Die Characteristics DIE DIMENSIONS PASSIVATION 160 mils x 140 mils Type: Nitride over Silox Nitride Thickness: 8kÅ Silox Thickness: 7kÅ METALLIZATION Type: Al Thickness: 10kÅ ±1kÅ TRANSISTOR COUNT 238 SUBSTRATE POTENTIAL PROCESS V+ CMOS Metal Gate Metallization Mask Layout HIN240 T2OUT T1OUT T3OUT T4OUT R3OUT R3IN T5IN R2IN SHUTDOWN R2OUT EN T2IN T5OUT T1IN R4IN R1OUT R4OUT R1IN T4IN GND T3IN R5OUT VCC R5IN C1+ 13 V+ C1- C2+ C2- V- HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Dual-In-Line Plastic Packages (PDIP) E16.3 (JEDEC MS-001-BB ISSUE D) N 16 LEAD DUAL-IN-LINE PLASTIC PACKAGE E1 INDEX AREA 1 2 3 INCHES N/2 -B- -AE D BASE PLANE -C- A2 SEATING PLANE A L D1 e B1 D1 A1 eC B 0.010 (0.25) M C A B S MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A - 0.210 - 5.33 4 A1 0.015 - 0.39 - 4 A2 0.115 0.195 2.93 4.95 - B 0.014 0.022 0.356 0.558 - C L B1 0.045 0.070 1.15 1.77 8, 10 eA C 0.008 0.014 C D 0.735 0.775 18.66 eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 0.005 - 0.13 - 5 0.300 0.325 7.62 8.25 6 E1 0.240 0.280 6.10 7.11 5 e 0.100 BSC eA 0.300 BSC eB - 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. L 0.115 N 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 14 5 E 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 0.355 19.68 D1 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 0.204 16 2.54 BSC 7.62 BSC 0.430 - 0.150 2.93 10.92 3.81 16 6 7 4 9 Rev. 0 12/93 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Dual-In-Line Plastic Packages (PDIP) E24.3 (JEDEC MS-001-AF ISSUE D) N 24 LEAD NARROW BODY DUAL-IN-LINE PLASTIC PACKAGE E1 INDEX AREA 1 2 3 N/2 INCHES -B- SYMBOL -AD E BASE PLANE -C- A2 SEATING PLANE A L D1 e B1 D1 eA A1 eC B 0.010 (0.25) M C L C A B S C eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 15 MILLIMETERS MIN MAX MIN MAX NOTES - 5.33 4 - 4 A - 0.210 A1 0.015 - A2 0.115 0.195 2.93 4.95 - B 0.014 0.022 0.356 0.558 - B1 0.045 0.070 1.15 1.77 8 C 0.008 0.014 0.204 0.355 - D 1.230 1.280 31.24 D1 0.005 - 0.13 - 5 0.39 32.51 5 E 0.300 0.325 7.62 8.25 6 E1 0.240 0.280 6.10 7.11 5 e 0.100 BSC 2.54 BSC - eA 0.300 BSC 7.62 BSC 6 eB - 0.430 L 0.115 0.150 N 24 2.93 24 10.92 7 3.81 4 9 Rev. 0 12/93 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Small Outline Plastic Packages (SOIC) M16.3 (JEDEC MS-013-AA ISSUE C) N INDEX AREA 16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE H 0.25(0.010) M B M INCHES E -B- 1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 - A1 0.0040 0.0118 0.10 0.30 - B 0.013 0.0200 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 - D 0.3977 0.4133 10.10 10.50 3 E 0.2914 0.2992 7.40 7.60 4 e α B S 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 16 0.050 BSC 1.27 BSC - H 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 N α NOTES: MILLIMETERS 16 0° 16 8° 0° 7 8° Rev. 1 6/05 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Small Outline Plastic Packages (SOIC) M24.3 (JEDEC MS-013-AD ISSUE C) N 24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA 0.25(0.010) M H B M INCHES E -B1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 - A1 0.0040 0.0118 0.10 0.30 - B 0.013 0.020 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 - D 0.5985 0.6141 15.20 15.60 3 E 0.2914 0.2992 7.40 7.60 4 e µα B S 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 17 0.05 BSC 1.27 BSC - H 0.394 0.419 10.00 10.65 - h 0.010 0.029 0.25 0.75 5 L 0.016 0.050 0.40 N α NOTES: MILLIMETERS 24 0o 1.27 24 8o 0o 6 7 8o Rev. 0 12/93 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Small Outline Plastic Packages (SOIC) M28.3 (JEDEC MS-013-AE ISSUE C) N 28 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE INDEX AREA 0.25(0.010) M H B M INCHES E SYMBOL -B- 1 2 3 L SEATING PLANE -A- h x 45o A D -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M B S 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch) 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 18 MIN MAX NOTES A 0.0926 0.1043 2.35 2.65 - 0.0040 0.0118 0.10 0.30 - B 0.013 0.0200 0.33 0.51 9 C 0.0091 0.0125 0.23 0.32 - D 0.6969 0.7125 17.70 18.10 3 E 0.2914 0.2992 7.40 7.60 4 0.05 BSC 1.27 BSC - H 0.394 0.419 10.00 10.65 - h 0.01 0.029 0.25 0.75 5 L 0.016 0.050 0.40 1.27 6 8o 0o N α NOTES: MILLIMETERS MAX A1 e µα MIN 28 0o 28 7 8o Rev. 0 12/93 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Shrink Small Outline Plastic Packages (SSOP) M28.209 (JEDEC MO-150-AH ISSUE B) N INDEX AREA 28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE H 0.25(0.010) M 2 GAUGE PLANE 3 0.25 0.010 SEATING PLANE -A- INCHES E -B- 1 B M A D -C- α e C 0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A - 0.078 - 2.00 - A1 0.002 - 0.05 - - A2 0.065 0.072 1.65 1.85 - B 0.009 0.014 0.22 0.38 9 C 0.004 0.009 0.09 0.25 - D 0.390 0.413 9.90 10.50 3 E 0.197 0.220 5.00 5.60 4 e A2 A1 B 0.25(0.010) M L B S NOTES: 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. Dimension “B” does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimension at maximum material condition. 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 19 0.026 BSC H 0.292 L 0.022 N α 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. MILLIMETERS 0.65 BSC 0.322 7.40 0.037 0.55 28 0° - 0.95 6 28 8° 0° - 8.20 7 8° Rev. 2 6/05 HIN232, HIN236, HIN237, HIN238, HIN239, HIN240, HIN241 Metric Plastic Quad Flatpack Packages (MQFP) Q44.10x10 (JEDEC MS-022AB ISSUE B) 44 LEAD METRIC PLASTIC QUAD FLATPACK PACKAGE D D1 -D- INCHES -A- -B- E E1 e PIN 1 SEATING A PLANE -H- 0.076 0.003 -C- 12o-16o 0.40 0.016 MIN 0.20 M 0.008 C A-B S 0o MIN A2 A1 0o-7o L MIN MAX MIN MAX NOTES A - 0.096 - 2.45 - A1 0.004 0.010 0.10 0.25 - A2 0.077 0.083 1.95 2.10 - b 0.012 0.018 0.30 0.45 6 b1 0.012 0.016 0.30 0.40 - D 0.515 0.524 13.08 13.32 3 D1 0.389 0.399 9.88 10.12 4, 5 E 0.516 0.523 13.10 13.30 3 E1 0.390 0.398 9.90 10.10 4, 5 L 0.029 0.040 0.73 1.03 N 44 44 e 0.032 BSC 0.80 BSC 7 Rev. 2 4/99 NOTES: 1. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 2. All dimensions and tolerances per ANSI Y14.5M-1982. 3. Dimensions D and E to be determined at seating plane -C- . b 4. Dimensions D1 and E1 to be determined at datum plane -H- . b1 5. Dimensions D1 and E1 do not include mold protrusion. Allowable protrusion is 0.25mm (0.010 inch) per side. 6. Dimension b does not include dambar protrusion. Allowable dambar protrusion shall be 0.08mm (0.003 inch) total. 7. “N” is the number of terminal positions. BASE METAL WITH PLATING SYMBOL D S 0.13/0.17 0.005/0.007 12o-16o MILLIMETERS 0.13/0.23 0.005/0.009 All Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at website www.intersil.com/quality/iso.asp. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site www.intersil.com 20