MOTOROLA MC68HC705JP7 Hcmos microcontroller unit Datasheet

68HC05M6
HC05M68HC
5M68HC05M
Freescale Semiconductor, Inc.
MC68HC705JJ7/D
REV 4
MC68HC705JJ7
MC68HC705JP7
MC68HC705SJ7
MC68HC705SP7
MC68HRC705JJ7
MC68HRC705JP7
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HCMOS
Microcontroller Unit
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MC68HC705JJ7
MC68HC705SJ7
MC68HRC705JJ7
MC68HRC705SJ7
MC68HC705JP7
MC68HC705SP7
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Motorola reserves the right to make changes without further notice to any products
herein. Motorola makes no warranty, representation or guarantee regarding the
suitability of its products for any particular purpose, nor does Motorola assume any
liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation consequential or incidental
damages. "Typical" parameters which may be provided in Motorola data sheets and/or
specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters, including "Typicals" must be validated for
each customer application by customer's technical experts. Motorola does not convey
any license under its patent rights nor the rights of others. Motorola products are not
designed, intended, or authorized for use as components in systems intended for
surgical implant into the body, or other applications intended to support or sustain life,
or for any other application in which the failure of the Motorola product could create a
situation where personal injury or death may occur. Should Buyer purchase or use
Motorola products for any such unintended or unauthorized application, Buyer shall
indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and
distributors harmless against all claims, costs, damages, and expenses, and
reasonable attorney fees arising out of, directly or indirectly, any claim of personal
injury or death associated with such unintended or unauthorized use, even if such claim
alleges that Motorola was negligent regarding the design or manufacture of the part.
Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
Motorola and
are registered trademarks of Motorola, Inc.
DigitalDNA is a trademark of Motorola, Inc.
MC68HC705JJ7 • MC68HC705JP7 — REV 4
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© Motorola, Inc., 2001
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To provide the most up-to-date information, the revision of our
documents on the World Wide Web will be the most current. Your printed
copy may be an earlier revision. To verify you have the latest information
available, refer to:
http://www.motorola.com/mcu/
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The following revision history table summarizes changes contained in
this document. For your convenience, the page number designators
have been linked to the appropriate location.
Revision History
Date
Revision
Level
August, 2001
4
Description
General reformat to bring document up to current publication
standards
All
References to MC68HRC705SJ7 and MC68HRC705SP7 removed
throughout
All
Figure 7-9. PB4/AN4/TCMP/CMP1 Pin I/O Circuit — Change label
of register $1FF0 from mask option register to COP register
94
Table 7-2. Port B Pin Functions — PB0–PB4 — Change heading
under Comparator 1 from OPT in MOR to OPT in COPR
96
12.4 PEPROM Programming — Contact information updated
179
Figure 13-3. EPROM Security in COP and Security Register
(COPR) — Figure title change
188
13.4 EPROM Programming — Contact information updated and
corrected reference to COP register from COP to COPR
189
15.15 SIOP Timing (VDD = 5.0 Vdc) — Value change for clock
(SCK) low time
225
15.16 SIOP Timing (VDD = 3.0 Vdc) — Value change for clock
(SCK) low time
226
Section 15. Electrical Specifications — Added Figure 15-1
through Figure 15-10 and Figure 15-12
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Number(s)
213, 214,
219, 223,
and 227
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List of Sections
Section 1. General Description . . . . . . . . . . . . . . . . . . . . 23
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Section 2. Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Section 3. Central Processor Unit (CPU) . . . . . . . . . . . . 45
Section 4. Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
Section 5. Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Section 6. Operating Modes. . . . . . . . . . . . . . . . . . . . . . . 75
Section 7. Parallel Input/Output . . . . . . . . . . . . . . . . . . . . 83
Section 8. Analog Subsystem . . . . . . . . . . . . . . . . . . . . 107
Section 9. Simple Synchronous Serial Interface . . . . . 141
Section 10. Core Timer . . . . . . . . . . . . . . . . . . . . . . . . . . 151
Section 11. Programmable Timer . . . . . . . . . . . . . . . . . 159
Section 12. Personality EPROM (PEPROM) . . . . . . . . . 175
Section 13. EPROM/OTPROM . . . . . . . . . . . . . . . . . . . . 183
Section 14. Instruction Set . . . . . . . . . . . . . . . . . . . . . . . 191
Section 15. Electrical Specifications. . . . . . . . . . . . . . . 209
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List of Sections
Section 16. Mechanical Specifications . . . . . . . . . . . . . 231
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Section 17. Ordering Information . . . . . . . . . . . . . . . . . 237
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Table of Contents
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Section 1. General Description
1.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
1.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
1.3
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
1.4
Device Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
1.5
Functional Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
1.6
VDD and VSS Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
1.7
OSC1 and OSC2 Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
1.7.1
Crystal Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
1.7.2
Ceramic Resonator Oscillator . . . . . . . . . . . . . . . . . . . . . . . 30
1.7.3
RC Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
1.7.4
External Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
1.7.5
Internal Low-Power Oscillator . . . . . . . . . . . . . . . . . . . . . . . 31
1.8
RESET Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
1.9
IRQ/VPP Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
1.10
PA0–PA5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
1.11
PB0–PB7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
1.12
PC0–PC7 (MC68HC705JP7) . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Section 2. Memory
2.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
2.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
2.3
Memory Map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
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2.4
Input/Output Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
2.5
User and Interrupt Vector Mapping. . . . . . . . . . . . . . . . . . . . . . 42
2.6
Random-Access Memory (RAM) . . . . . . . . . . . . . . . . . . . . . . . 42
2.7
Erasable Programmable Read-Only Memory (EPROM) . . . . . 43
2.8
COP Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
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Section 3. Central Processor Unit (CPU)
3.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
3.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
3.3
Accumulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
3.4
Index Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
3.5
Stack Pointer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
3.6
Program Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
3.7
Condition Code Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48
3.8
Arithmetic/Logic Unit (ALU) . . . . . . . . . . . . . . . . . . . . . . . . . . .50
Section 4. Interrupts
4.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
4.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
4.3
Interrupt Vectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
4.4
Interrupt Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
4.5
Software Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
4.6
External Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
4.6.1
IRQ/VPP Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
4.6.2
PA0–PA3 Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
4.6.3
IRQ Status and Control Register (ISCR) . . . . . . . . . . . . . . . 58
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4.7
Core Timer Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
4.7.1
Core Timer Overflow Interrupt . . . . . . . . . . . . . . . . . . . . . . . 60
4.7.2
Real-Time Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
4.8
Programmable Timer Interrupts . . . . . . . . . . . . . . . . . . . . . . . . 61
4.8.1
Input Capture Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
4.8.2
Output Compare Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . 61
4.8.3
Timer Overflow Interrupt. . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
4.9
Serial Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
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4.10 Analog Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
4.10.1 Comparator Input Match Interrupt . . . . . . . . . . . . . . . . . . . .63
4.10.2 Input Capture Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
Section 5. Resets
5.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
5.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
5.3
Power-On Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
5.4
External Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
5.5
Internal Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
5.5.1
Power-On Reset (POR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
5.5.2
Computer Operating Properly (COP) Reset. . . . . . . . . . . . . 68
5.5.3
Low-Voltage Reset (LVR). . . . . . . . . . . . . . . . . . . . . . . . . . . 70
5.5.4
Illegal Address Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70
5.6
Reset States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
5.6.1
CPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
5.6.2
I/O Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
5.6.3
Core Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
5.6.4
COP Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71
5.6.5
16-Bit Programmable Timer . . . . . . . . . . . . . . . . . . . . . . . . . 72
5.6.6
Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
5.6.7
Analog Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
5.6.8
External Oscillator and Internal Low-Power Oscillator . . . . . 73
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Section 6. Operating Modes
6.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
6.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
6.3
Oscillator Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
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6.4
Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
6.4.1
Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
6.4.2
Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
6.4.3
Halt Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
6.4.4
Data-Retention Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .82
Section 7. Parallel Input/Output
7.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
7.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
7.3
Port A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
7.3.1
Port A Data Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
7.3.2
Data Direction Register A. . . . . . . . . . . . . . . . . . . . . . . . . . . 86
7.3.3
Pulldown Register A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
7.3.4
Port A External Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
7.3.5
Port A Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
7.4
Port B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
7.4.1
Port B Data Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
7.4.2
Data Direction Register B. . . . . . . . . . . . . . . . . . . . . . . . . . . 91
7.4.3
Pulldown Register B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
7.4.4
Port B Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
7.4.5
PB0, PBI, PB2, and PB3 Logic. . . . . . . . . . . . . . . . . . . . . . .93
7.4.6
PB4/AN4/TCMP/CMP1 Logic. . . . . . . . . . . . . . . . . . . . . . . . 94
7.4.7
PB5/SDO Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .96
7.4.8
PB6/SDI Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
7.4.9
PB7/SCK Logic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
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7.5
Port C (28-Pin Versions Only) . . . . . . . . . . . . . . . . . . . . . . . . 101
7.5.1
Port C Data Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
7.5.2
Data Direction Register C. . . . . . . . . . . . . . . . . . . . . . . . . . 102
7.5.3
Port C Pulldown Devices . . . . . . . . . . . . . . . . . . . . . . . . . .103
7.5.4
Port C Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
7.6
Port Transitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105
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Section 8. Analog Subsystem
8.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
8.3
Analog Multiplex Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
8.4
Analog Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
8.5
Analog Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
8.6
A/D Conversion Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
8.7
Voltage Measurement Methods . . . . . . . . . . . . . . . . . . . . . . . 132
8.7.1
Absolute Voltage Readings . . . . . . . . . . . . . . . . . . . . . . . . 133
8.7.1.1
Internal Absolute Reference . . . . . . . . . . . . . . . . . . . . . 133
8.7.1.2
External Absolute Reference . . . . . . . . . . . . . . . . . . . . . 134
8.7.2
Ratiometric Voltage Readings . . . . . . . . . . . . . . . . . . . . . . 134
8.7.2.1
Internal Ratiometric Reference . . . . . . . . . . . . . . . . . . .135
8.7.2.2
External Ratiometric Reference . . . . . . . . . . . . . . . . . . . 136
8.8
Voltage Comparator Features . . . . . . . . . . . . . . . . . . . . . . . . 136
8.8.1
Voltage Comparator 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
8.8.2
Voltage Comparator 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
8.9
Current Source Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
8.10
Internal Temperature Sensing Diode Features. . . . . . . . . . . . 138
8.11
Sample and Hold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
8.12
Port B Interaction with Analog Inputs . . . . . . . . . . . . . . . . . . .139
8.13
Port B Pins as Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
8.14
Port B Pulldowns . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
8.15
Noise Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
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Section 9. Simple Serial Interface
9.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
9.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
9.3
SIOP Signal Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
9.3.1
Serial Clock (SCK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
9.3.2
Serial Data Input (SDI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
9.3.3
Serial Data Output (SDO). . . . . . . . . . . . . . . . . . . . . . . . . . 144
Freescale Semiconductor, Inc...
9.4
SIOP Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .145
9.4.1
SIOP Control Register (SCR). . . . . . . . . . . . . . . . . . . . . . . 145
9.4.2
SIOP Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . .148
9.4.3
SIOP Data Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
Section 10. Core Timer
10.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
10.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
10.3
Core Timer Status and Control Register. . . . . . . . . . . . . . . . . 153
10.4
Core Timer Counter Register . . . . . . . . . . . . . . . . . . . . . . . . . 155
10.5
COP Watchdog. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .156
Section 11. Programmable Timer
Advance Information
12
11.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159
11.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
11.3
Timer Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
11.4
Alternate Counter Registers . . . . . . . . . . . . . . . . . . . . . . . . . . 163
11.5
Input Capture Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165
11.6
Output Compare Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
11.7
Timer Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
11.8
Timer Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171
11.9
Timer Operation during Wait Mode. . . . . . . . . . . . . . . . . . . . . 173
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11.10 Timer Operation during Stop Mode . . . . . . . . . . . . . . . . . . . . 173
11.11 Timer Operation during Halt Mode . . . . . . . . . . . . . . . . . . . . . 173
Section 12. Personality EPROM (PEPROM)
12.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
12.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
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12.3 PEPROM Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
12.3.1 PEPROM Bit Select Register . . . . . . . . . . . . . . . . . . . . . . . 177
12.3.2 PEPROM Status and Control Register. . . . . . . . . . . . . . . . 178
12.4
PEPROM Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179
12.5
PEPROM Reading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .180
12.6
PEPROM Erasing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181
Section 13. EPROM/OTPROM
13.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183
13.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183
13.3 EPROM Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .184
13.3.1 EPROM Programming Register . . . . . . . . . . . . . . . . . . . . . 184
13.3.2 Mask Option Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . .185
13.3.3 EPROM Security Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188
13.4 EPROM Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189
13.4.1 MOR Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189
13.4.2 EPMSEC Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . 190
13.5
EPROM Erasing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190
Section 14. Instruction Set
14.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
14.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
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14.3 Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .192
14.3.1 Inherent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192
14.3.2 Immediate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192
14.3.3 Direct . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
14.3.4 Extended . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
14.3.5 Indexed, No Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
14.3.6 Indexed, 8-Bit Offset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
14.3.7 Indexed, 16-Bit Offset. . . . . . . . . . . . . . . . . . . . . . . . . . . . .194
14.3.8 Relative . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194
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14.4 Instruction Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195
14.4.1 Register/Memory Instructions. . . . . . . . . . . . . . . . . . . . . . . 195
14.4.2 Read-Modify-Write Instructions . . . . . . . . . . . . . . . . . . . . . 196
14.4.3 Jump/Branch Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . 197
14.4.4 Bit Manipulation Instructions . . . . . . . . . . . . . . . . . . . . . . . 199
14.4.5 Control Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200
14.5
Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201
14.6
Opcode Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207
Section 15. Electrical Specifications
15.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 209
15.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
15.3
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
15.4
Operating Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . 211
15.5
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211
15.6
Supply Current Characteristics
(VDD = 4.5 to 5.5 Vdc) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211
15.7
Supply Current Characteristics
(VDD = 2.7 to 3.3 Vdc) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212
15.8
DC Electrical Characteristics (5.0 Vdc). . . . . . . . . . . . . . . . . . 215
15.9
DC Electrical Characteristics (3.0 Vdc). . . . . . . . . . . . . . . . . . 216
15.10 Analog Subsystem Characteristics (5.0 Vdc) . . . . . . . . . . . . . 217
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15.11 Analog Subsystem Characteristics (3.0 Vdc) . . . . . . . . . . . . . 218
15.12 Control Timing (5.0 Vdc). . . . . . . . . . . . . . . . . . . . . . . . . . . . .220
15.13 Control Timing (3.0 Vdc). . . . . . . . . . . . . . . . . . . . . . . . . . . . .221
15.14 PEPROM and EPROM Programming
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224
15.15 SIOP Timing (VDD = 5.0 Vdc) . . . . . . . . . . . . . . . . . . . . . . . . . 225
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15.16 SIOP Timing (VDD = 3.0 Vdc) . . . . . . . . . . . . . . . . . . . . . . . . . 226
15.17 Reset Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227
Section 16. Mechanical Specifications
16.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231
16.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231
16.3
20-Pin Plastic Dual In-Line Package (Case 738) . . . . . . . . . . 232
16.4
20-Pin Small Outline Integrated Circuit (Case 751D) . . . . . . . 233
16.5
28-Pin Plastic Dual In-Line Package (Case 710) . . . . . . . . . . 233
16.6
28-Pin Small Outline Integrated Circuit (Case 751F) . . . . . . . 234
16.7
20-Pin Windowed Ceramic Integrated Circuit
(Case 732) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 234
16.8
28-Pin Windowed Ceramic Integrated Circuit
(Case 733A). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .235
Section 17. Ordering Information
17.1
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237
17.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237
17.3
MC68HC705JJ7 Order Numbers . . . . . . . . . . . . . . . . . . . . . . 238
17.4
MC68HC705JP7 Order Numbers . . . . . . . . . . . . . . . . . . . . . .239
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List of Figures
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Figure
Title
1-1
1-2
1-3
User Mode Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
User Mode Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
EPO Oscillator Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2-1
2-2
2-3
2-4
2-5
Memory Map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
I/O Registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Register Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
Vector Mapping. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
COP and Security Register (COPR). . . . . . . . . . . . . . . . . . . . . 43
3-1
3-2
3-3
3-4
3-5
3-6
68HC05 Programming Model . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Accumulator (A) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Index Register (X). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Stack Pointer (SP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
Program Counter (PC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Condition Code Register (CCR) . . . . . . . . . . . . . . . . . . . . . . . . 48
4-1
4-2
4-3
4-4
Interrupt Stacking Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .53
Interrupt Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .54
External Interrupt Logic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
IRQ Status and Control Register (ISCR) . . . . . . . . . . . . . . . . . 58
5-1
5-2
Reset Sources . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
COP and Security Register (COPR). . . . . . . . . . . . . . . . . . . . . 69
6-1
6-2
IRQ Status and Control Register (ISCR) . . . . . . . . . . . . . . . . . 76
Stop/Wait/Halt Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
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Title
Page
7-1
7-2
7-3
7-4
7-5
7-6
7-7
7-8
7-9
7-10
7-11
7-12
7-13
7-14
7-15
Port A Data Register (PORTA) . . . . . . . . . . . . . . . . . . . . . . . . . 85
Data Direction Register A (DDRA) . . . . . . . . . . . . . . . . . . . . . . 86
Pulldown Register A (PDRA) . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Port A I/O Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Port B Data Register (PORTB) . . . . . . . . . . . . . . . . . . . . . . . . . 90
Data Direction Register B (DDRB) . . . . . . . . . . . . . . . . . . . . . . 91
Pulldown Register B (PDRB) . . . . . . . . . . . . . . . . . . . . . . . . . . 92
PB0–PB3 Pin I/O Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .93
PB4/AN4/TCMP/CMP1 Pin I/O Circuit . . . . . . . . . . . . . . . . . . . 94
PB5/SDO Pin I/O Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .97
PB6/SDI Pin I/O Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
PB7/SCK Pin I/O Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .99
Port C Data Register (PORTC). . . . . . . . . . . . . . . . . . . . . . . . 102
Data Direction Register C (DDRC) . . . . . . . . . . . . . . . . . . . . . 103
Port C I/O Circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
8-1
8-2
8-3
8-4
8-5
8-6
8-7
8-8
8-9
8-10
8-11
8-12
Analog Subsystem Block Diagram . . . . . . . . . . . . . . . . . . . . . 109
Analog Multiplex Register (AMUX) . . . . . . . . . . . . . . . . . . . . . 110
Comparator 2 Input Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . 111
INV Bit Action . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 113
Analog Control Register (ACR). . . . . . . . . . . . . . . . . . . . . . . . 115
Analog Status Register (ASR) . . . . . . . . . . . . . . . . . . . . . . . . 119
Single-Slope A/D Conversion Method . . . . . . . . . . . . . . . . . . 122
A/D Conversion — Full Manual Control (Mode 0) . . . . . . . . . 128
A/D Conversion — Manual/Auto Discharge
Control (Mode 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 129
A/D Conversion — TOF/ICF Control (Mode 2) . . . . . . . . . . . . 130
A/D Conversion — OCF/ICF Control (Mode 3). . . . . . . . . . . . 131
COP and Security Register (COPR). . . . . . . . . . . . . . . . . . . . 137
9-1
9-2
9-3
9-4
9-5
9-6
SIOP Block Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142
SIOP Timing Diagram (CPHA = 0) . . . . . . . . . . . . . . . . . . . . . 143
SIOP Timing Diagram (CPHA = 1) . . . . . . . . . . . . . . . . . . . . . 144
SIOP Control Register (SCR) . . . . . . . . . . . . . . . . . . . . . . . . . 145
SIOP Status Register (SSR). . . . . . . . . . . . . . . . . . . . . . . . . . 148
SIOP Data Register (SDR) . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
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Title
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10-1
10-2
10-3
10-4
Core Timer Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 152
Core Timer Status and Control Register (CTSCR). . . . . . . . . 153
Core Timer Counter Register (CTCR) . . . . . . . . . . . . . . . . . . 155
COP and Security Register (COPR). . . . . . . . . . . . . . . . . . . . 156
11-1
11-2
11-3
11-4
11-5
11-6
11-7
11-8
11-9
11-10
11-11
Programmable Timer Overall Block Diagram . . . . . . . . . . . . . 161
Programmable Timer Block Diagram . . . . . . . . . . . . . . . . . . .162
Programmable Timer Registers (TMRH and TMRL) . . . . . . . 163
Alternate Counter Block Diagram . . . . . . . . . . . . . . . . . . . . . .164
Alternate Counter Registers (ACRH and ACRL) . . . . . . . . . . 165
Timer Input Capture Block Diagram . . . . . . . . . . . . . . . . . . . . 166
Input Capture Registers (ICRH and ICRL) . . . . . . . . . . . . . . .166
Timer Output Compare Block Diagram. . . . . . . . . . . . . . . . . . 168
Output Compare Registers (OCRH and OCRL) . . . . . . . . . . . 168
Timer Control Register (TCR). . . . . . . . . . . . . . . . . . . . . . . . . 170
Timer Status Register (TSR) . . . . . . . . . . . . . . . . . . . . . . . . . 172
12-1
12-2
12-3
Personality EPROM Block Diagram . . . . . . . . . . . . . . . . . . . . 176
PEPROM Bit Select Register (PEBSR) . . . . . . . . . . . . . . . . . 177
PEPROM Status and Control Register (PESCR) . . . . . . . . . . 178
13-1
13-2
13-3
EPROM Programming Register (EPROG) . . . . . . . . . . . . . . .184
Mask Option Register (MOR) . . . . . . . . . . . . . . . . . . . . . . . . . 186
EPROM Security in COP and Security Register (COPR). . . . 188
Typical Run IDD versus Internal
Clock Frequency at 25° C . . . . . . . . . . . . . . . . . . . . . . . . . 213
15-2 Typical Wait IDD versus Internal
Clock Frequency at 25° C . . . . . . . . . . . . . . . . . . . . . . . . . 213
15-3 Typical Run IDD with External Oscillator . . . . . . . . . . . . . . . . . 214
15-4 Typical Wait IDD with External Oscillator . . . . . . . . . . . . . . . . 214
15-5 Typical Stop IDD with Analog and LVR Disabled . . . . . . . . . . 214
15-6 Typical Temperature Diode Performance. . . . . . . . . . . . . . . . 219
15-7 Typical 500 kHz External Low-Power
Oscillator Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222
15-1
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15-9
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15-11
15-12
15-13
15-14
15-15
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Title
Page
Typical 100 kHz External Low-Power
Oscillator Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222
Typical RC Oscillator Internal Operating
Frequency Range versus Resistance for High VDD
Operating Range at T = 25° C . . . . . . . . . . . . . . . . . . . . . .223
Typical RC Oscillator Internal Operating
Frequency Range versus Resistance for Low VDD
Operating Range at T = 25° C . . . . . . . . . . . . . . . . . . . . . .223
SIOP Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225
Typical Falling Low Voltage Reset . . . . . . . . . . . . . . . . . . . . . 227
Stop Recovery Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . 228
Internal Reset Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . 228
Low-Voltage Reset Timing Diagram . . . . . . . . . . . . . . . . . . . . 229
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List of Tables
Freescale Semiconductor, Inc...
Table
Title
1-1
Device Options by Part Number . . . . . . . . . . . . . . . . . . . . . . . . 26
4-1
4-2
Reset/Interrupt Vector Addresses. . . . . . . . . . . . . . . . . . . . . . .52
Oscillator Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
6-1
Oscillator Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
7-1
7-2
7-3
7-4
Port A Pin Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Port B Pin Functions — PB0–PB4 . . . . . . . . . . . . . . . . . . . . . . 96
Port B Pin Functions — PB5–PB7 . . . . . . . . . . . . . . . . . . . . . 101
Port C Pin Functions (28-Pin Versions Only) . . . . . . . . . . . . . 104
8-1
8-2
8-3
8-4
8-5
8-6
8-7
8-8
Comparator 2 Input Sources. . . . . . . . . . . . . . . . . . . . . . . . . . 111
Channel Select Bus Combinations . . . . . . . . . . . . . . . . . . . . . 114
A/D Conversion Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . .116
A/D Conversion Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . 126
Sample Conversion Timing (VDD = 5.0 Vdc) . . . . . . . . . . . . . 127
Absolute Voltage Reading Errors . . . . . . . . . . . . . . . . . . . . . .134
Ratiometric Voltage Reading Errors . . . . . . . . . . . . . . . . . . . . 135
Voltage Comparator Setup Conditions . . . . . . . . . . . . . . . . . . 136
9-1
SIOP Clock Rate Selection. . . . . . . . . . . . . . . . . . . . . . . . . . . 147
10-1
10-2
Core Timer Interrupt Rates and COP Timeout Selection . . . . 155
COP Watchdog Recommendations . . . . . . . . . . . . . . . . . . . . 157
11-1
Output Compare Initialization Example . . . . . . . . . . . . . . . . . 169
12-1
PEPROM Bit Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179
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List of Tables
Table
Page
Register/Memory Instructions . . . . . . . . . . . . . . . . . . . . . . . . . 195
Read-Modify-Write Instructions . . . . . . . . . . . . . . . . . . . . . . . 196
Jump and Branch Instructions . . . . . . . . . . . . . . . . . . . . . . . . 198
Bit Manipulation Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . 199
Control Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200
Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201
Opcode Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 208
Freescale Semiconductor, Inc...
14-1
14-2
14-3
14-4
14-5
14-6
14-7
Title
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Section 1. General Description
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1.1 Contents
1.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
1.3
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
1.4
Device Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .25
1.5
Functional Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
1.6
VDD and VSS Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
1.7
OSC1 and OSC2 Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
1.7.1
Crystal Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
1.7.2
Ceramic Resonator Oscillator . . . . . . . . . . . . . . . . . . . . . . . 30
1.7.3
RC Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
1.7.4
External Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
1.7.5
Internal Low-Power Oscillator . . . . . . . . . . . . . . . . . . . . . . . 31
1.8
RESET Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
1.9
IRQ/VPP Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
1.10
PA0–PA5 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
1.11
PB0–PB7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
1.12
PC0–PC7 (MC68HC705JP7) . . . . . . . . . . . . . . . . . . . . . . . . . . 33
1.2 Introduction
The Motorola MC68HC705JJ7 and MC68HC705JP7 are erasable
programmable read-only memory (EPROM) versions of the
MC68HC05JJ/JP Family of microcontrollers (MCU).
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1.3 Features
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Features of the two parts include:
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•
Low-cost, M68HC05 core MCU in 20-pin package
(MC68HC705JJ7) or 28-pin package (MC68HC705JP7)
•
6160 bytes of user EPROM, including 16 bytes of user vectors
•
224 bytes of low-power user random-access memory (RAM)
•
64 bits of personality EPROM (serial access)
•
16-bit programmable timer with input capture and output compare
•
15-stage core timer, including 8-bit free-running counter
and 4-stage selectable real-time interrupt generator
•
Simple serial input/output port (SIOP) with interrupt capability
•
Two voltage comparators, one of which can be combined with the
16-bit programmable timer to create a 4-channel, single-slope
analog-to-digital (A/D) converter
•
Output of voltage comparator can drive port pin PB4 directly under
software control
•
14 input/output (I/O) lines (MC68HC705JJ7) or 22 I/O lines
(MC68HC705JP7), including high-source/sink current capability
on 6 I/O pins (MC68HC705JJ7) or 14 I/O pins (MC68HC705JP7)
•
Programmable 8-bit mask option register (MOR) to select mask
options found in read-only memory (ROM) based versions
•
MOR selectable software programmable pulldowns on all I/O pins
and keyboard scan interrupt on four I/O pins
•
Software mask and request bit for IRQ interrupt with MOR
selectable sensitivity on IRQ interrupt (edge- and level-sensitive or
edge-only)
•
On-chip oscillator with device option of crystal/ceramic resonator
or resistor-capacitor (RC) operation and MOR selectable shunt
resistor, 2 MΩ by design
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General Description
Device Options
•
Internal oscillator for lower-power operation, approximately
100 kHz (500 kHz selected as device option)
•
EPROM security bit(1) to aid in locking out access to
programmable EPROM array
•
MOR selectable computer operating properly (COP) watchdog
system
•
Power-saving stop and wait mode instructions (MOR selectable
STOP conversion to halt and option for fast 16-cycle restart
and power-on reset)
•
On-chip temperature measurement diode
•
MOR selectable reset module to reset central processor unit
(CPU) in low-voltage conditions
•
Illegal address reset
•
Internal steering diode and pullup device on RESET pin to VDD
1.4 Device Options
These MC68HC705JJ7/MC68HC705JP7 device options are available:
NOTE:
•
On-chip oscillator type: crystal/ceramic resonator connections or
resistor-capacitor (RC) connections
•
Nominal frequency of internal low-power oscillator: 100 or
500 kHz
A line over a signal name indicates an active low signal. For example,
RESET is active high and RESET is active low.
Any reference to voltage, current, or frequency specified in the following
sections will refer to the nominal values. The exact values and their
tolerance or limits are specified in Section 15. Electrical
Specifications.
1. No security feature is absolutely secure. However, Motorola’s strategy is to make reading or
copying the EPROM/OTPROM difficult for unauthorized users.
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Combinations of the various device options are specified by part
number. Refer to Table 1-1 and to Section 17. Ordering Information
for specific ordering information.
Table 1-1. Device Options by Part Number
Freescale Semiconductor, Inc...
Part
Number
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26
Pin
Count
Oscillator
Type
Internal LPO Nominal
Frequency (kHz)
MC68HC705JJ7
MC68HC705JP7
20
28
Crystal/resonator
Crystal/resonator
100
100
MC68HC705SJ7
MC68HC705SP7
20
28
Crystal/resonator
Crystal/resonator
500
500
MC68HRC705JJ7
MC68HRC705JP7
20
28
Resistor-capacitor
Resistor-capacitor
100
100
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Device Options
OSC1
+
COMP1
–
TRANSFER
CONTROL
EXTERNAL
OSCILLATOR
OSC2
INTERNAL
OSCILLATOR
+
COMP2
–
VDD
CURRENT
SOURCE
÷2
VDD
LVR
16-BIT TIMER
(1) INPUT CAPTURE
(1) OUTPUT COMPARE
INT
TCAP
TCMP
COMPARATOR
CONTROL &
MULTIPLEXER
15-STAGE
CORE TIMER
SYSTEM
OCF
TEMPERATURE
DIODE
TOF
VSS
WATCHDOG &
ILLEGAL ADDR
DETECT
PB0/AN0
VSS
CPU CONTROL
RESET
ALU
INT
68HC05 CPU
IRQ/VPP
ACCUM
CPU REGISTERS
PB1/AN1
PB2/AN2
PORT B
PORT B DATA DIR. REG.
VSS
PB3/AN3/TCAP
PB4/AN4/TCMP/CMP1*
PB5/SDO
PB6/SDI
PB7/SCK
INDEX REG
0 0 0 0 0 0 0 0 1 1 STK PTR
INT
SIMPLE SERIAL
INTERFACE
(SIOP)
1 1 1H I NZC
BOOT ROM — 240 BYTES
STATIC RAM (4T) — 224 BYTES
PORT A DATA DIR. REG.
COND CODE REG
PA5*
PA4*
PORT A
PROGRAM COUNTER
* High sink current capability
* High source current capability
† IRQ interrupt capability
PA2*†
PA0*†
PC7*
PC6*
PC5*
PORT C
PERSONALITY EPROM — 64 BITS
PA3*†
PA1*†
USER EPROM — 6160 BYTES
PORT C DATA DIR. REG.
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ICF
PC4*
PC3*
PC2*
PORT C
ONLY ON
28-PIN
VERSIONS
PC1*
PC0*
Figure 1-1. User Mode Block Diagram
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General Description
1.5 Functional Pin Description
Refer to Figure 1-2 for the pinouts of the MC68HC705JJ7 and
MC68HC705JP7 in the user mode.
The following paragraphs give a description of the general function of
each pin.
Freescale Semiconductor, Inc...
MC68HC705JJ7
PB1/AN1
1
20
PB0/AN0
PB2/AN2
2
19
VDD
PB3/AN3/TCAP
3
18
VSS
*PB4/AN4/TCMP/CMP1
4
17
OSC1
PB5/SDO
5
16
OSC2
PB6/SDI
6
15
RESET
PB7/SCK
7
14
IRQ/VPP
*PA5
8
13
PA0*†
* PA4
9
12
PA1*†
†* PA3
10
11
PA2*†
MC68HC705JP7
PB1/AN1
1
28
PB0/AN0
PB2/AN2
2
27
VDD
PB3/AN3/TCAP
3
26
VSS
*PB4/AN4/TCMP/CMP1
4
25
OSC1
PB5/SDO
5
24
OSC2
* PC4
6
23
PC3*
*PC5
7
22
PC2*
* PC6
8
21
PC1*
*PC7
9
20
PC0*
PB6/SDI
10
19
RESET
PB7/SCK
11
18
IRQ/VPP
*PA5
12
17
PA0*†
* PA4
13
16
PA1*†
†* PA3
14
15
PA2*†
* Denotes 10 mA sink /5 mA source capability
† Denotes IRQ interrupt capability
Figure 1-2. User Mode Pinouts
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VDD and VSS Pins
1.6 VDD and VSS Pins
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Power is supplied to the MCU through VDD and VSS. VDD is the positive
supply, and VSS is ground. The MCU operates from a single power
supply.
Very fast signal transitions occur on the MCU pins. The short rise and fall
times place very high short-duration current demands on the power
supply. To prevent noise problems, special care should be taken to
provide good power supply bypassing at the MCU by using bypass
capacitors with good high-frequency characteristics that are positioned
as close to the MCU as possible.
1.7 OSC1 and OSC2 Pins
The OSC1 and OSC2 pins are the connections for the external pin
oscillator (EPO). The OSC1 and OSC2 pins can accept these sets of
components:
•
A crystal as shown in Figure 1-3 (a)
•
A ceramic resonator as shown in Figure 1-3 (a)
•
An external resistor as shown in Figure 1-3 (b)
•
An external clock signal as shown in Figure 1-3 (c)
The selection of the crystal/ceramic resonator or RC oscillator
configuration is done by product part number selection as described in
Section 17. Ordering Information.
The frequency, fOSC, of the EPO or external clock source is divided by
two to produce the internal operating frequency, fOP.
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General Description
MCU
MCU
MCU
2 MΩ
OSC1
OSC2
OSC1
OSC2
OSC1
OSC2
R
UNCONNECTED
Freescale Semiconductor, Inc...
EXTERNAL CLOCK
(a) Crystal or
Ceramic Resonator
Connections
(b) RC Oscillator
Connections
(c) External Clock
Source Connection
Figure 1-3. EPO Oscillator Connections
1.7.1 Crystal Oscillator
The circuit in Figure 1-3 (a) shows a typical oscillator circuit for an
AT-cut, parallel resonant crystal. The crystal manufacturer’s
recommendations should be followed, as the crystal parameters
determine the external component values required to provide maximum
stability and reliable startup. The load capacitance values used in the
oscillator circuit design should include all stray capacitances. The crystal
and components should be mounted as close as possible to the pins for
startup stabilization and to minimize output distortion. An internal startup
resistor of approximately 2 MΩ can be provided between OSC1 and
OSC2 for the crystal type oscillator by use of the OSCRES bit in the
MOR.
1.7.2 Ceramic Resonator Oscillator
In cost-sensitive applications, a ceramic resonator can be used in place
of the crystal. The circuit in Figure 1-3 (a) can be used for a ceramic
resonator. The resonator manufacturer’s recommendations should be
followed, as the resonator parameters determine the external
component values required for maximum stability and reliable starting.
The load capacitance values used in the oscillator circuit design should
include all stray capacitances. The ceramic resonator and components
should be mounted as close as possible to the pins for startup
stabilization and to minimize output distortion. An internal startup resistor
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OSC1 and OSC2 Pins
of approximately 2 MΩ can be provided between OSC1 and OSC2 for
the ceramic resonator type oscillator by use of the OSCRES bit in the
MOR.
1.7.3 RC Oscillator
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The lowest cost oscillator is the RC oscillator configuration where a
resistor is connected between the two oscillator pins as shown
in Figure 1-3 (b).
The selection of the RC oscillator configuration is done by product part
number selection as described in Section 17. Ordering Information.
NOTE:
Do not use the internal startup resistor between OSC1 and OSC2 for the
RC-type oscillator.
1.7.4 External Clock
An external clock from another CMOS-compatible device can be
connected to the OSC1 input, with the OSC2 input not connected, as
shown in Figure 1-3 (c). This oscillator can be selected via software.
This configuration is possible regardless of whether the crystal/ceramic
resonator or RC oscillator configuration is used.
NOTE:
Do not use the internal startup resistor between OSC1 and OSC2 for the
external clock.
1.7.5 Internal Low-Power Oscillator
An internal low-power oscillator (LPO) is provided which is the default
oscillator out of reset. When operating from this internal LPO, the other
oscillator can be powered down by software to further conserve power.
The selection of the LPO configuration is done by product part number
selection as described in Section 17. Ordering Information.
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1.8 RESET Pin
The RESET pin can be used as an input to reset the MCU to a known
startup state by pulling it to the low state. It also functions as an output
to indicate that an internal COP watchdog, illegal address, or low-voltage
reset has occurred. The RESET pin contains a pullup device to allow the
pin to be left disconnected without an external pullup resistor. The
RESET pin also contains a steering diode that, when the power is
removed, will discharge to VDD any charge left on an external capacitor
connected between the RESET pin and VSS. The RESET pin also
contains an internal Schmitt trigger to improve its noise immunity as an
input.
1.9 IRQ/VPP Pin
The IRQ/VPP input pin drives the asynchronous IRQ interrupt function of
the CPU. The IRQ interrupt function uses the LEVEL bit in the MOR to
provide either negative edge-sensitive triggering or both negative
edge-sensitive and low level-sensitive triggering. If the LEVEL bit is set
to enable level-sensitive triggering, the IRQ/VPP pin requires an external
resistor to VDD for “wired-OR” operation. If the IRQ/VPP pin is not used,
it must be tied to the VDD supply. The IRQ/VPP pin contains an internal
Schmitt trigger as part of its input to improve noise immunity.
The voltage on this pin may affect operation if the voltage on the
IRQ/VPP pin is above VDD when the device is released from a reset
condition. The IRQ/VPP pin should only be taken above VDD to program
an EPROM memory location or personality EPROM bit. For more
information, refer to 15.14 PEPROM and EPROM Programming
Characteristics.
NOTE:
Advance Information
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Each of the PA0–PA3 I/O pins may be connected as an OR function with
the IRQ interrupt function by the PIRQ bit in the MOR. This capability
allows keyboard scan applications where the transitions or levels on the
I/O pins will behave the same as the IRQ/VPP pin, except that active
transitions and levels are inverted. The edge or level sensitivity selected
by the LEVEL bit in the MOR for the IRQ/VPP pin also applies to the I/O
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PA0–PA5
pins that are ORed to create the IRQ signal. For more information, refer
to 4.6 External Interrupts.
1.10 PA0–PA5
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These six I/O lines comprise port A, a general-purpose bidirectional I/O
port. This port also has four pins which have keyboard interrupt
capability. All six of these pins have high current source and sink
capability.
All of these pins have software programmable pulldowns which can be
disabled by the SWPDI bit in the MOR.
1.11 PB0–PB7
These eight I/O lines comprise port B, a general-purpose bidirectional
I/O port. This port is also shared with the 16-bit programmable timer
input capture and output compare functions, with the two voltage
comparators in the analog subsystem, and with the simple serial
interface (SIOP).
The outputs of voltage comparator 1 can directly drive the PB4 pin; and
the PB4 pin has high current source and sink capability.
All of these pins have software programmable pulldowns which can be
disabled by the SWPDI bit in the MOR.
1.12 PC0–PC7 (MC68HC705JP7)
These eight I/O lines comprise port C, a general-purpose bidirectional
I/O port. This port is only available on the 28-pin MC68HC705JP7. All
eight of these pins have high current source and sink capability.
All of these pins have software programmable pulldowns which can be
disabled by the SWPDI bit in the MOR.
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Section 2. Memory
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2.1 Contents
2.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
2.3
Memory Map. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
2.4
Input/Output Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
2.5
User and Interrupt Vector Mapping. . . . . . . . . . . . . . . . . . . . . . 42
2.6
Random-Access Memory (RAM) . . . . . . . . . . . . . . . . . . . . . . . 42
2.7
Erasable Programmable Read-Only Memory (EPROM) . . . . . 43
2.8
COP Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
2.2 Introduction
This section describes the organization of the memory on the
MC68HC705JJ7/MC68HC705JP7.
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Memory
2.3 Memory Map
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The central processor unit (CPU) can address 8 kilobytes of memory
space as shown in Figure 2-1. The memory map includes:
•
The erasable programmable read-only memory (EPROM) portion
of memory holds the program instructions, fixed data,
user-defined vectors, and interrupt service routines.
•
The random-access memory (RAM) portion of memory holds
variable data.
•
Input/output (I/O) registers are memory mapped so that the CPU
can access their locations in the same way that it accesses all
other memory locations.
$1EFF
Figure 2-1. Memory Map
2.4 Input/Output Registers
Figure 2-2 and Figure 2-3 summarize:
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•
The first 32 addresses of the memory space, $0000–$001F,
containing the I/O registers section
•
One I/O register located outside the 32-byte I/O section, which is
the computer operating properly register (COPR) mapped at
$1FF0
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Memory
Input/Output Registers
Address
Register Name
$0000
Port A Data Register
$0001
Port B Data Register
$0002
Port C Data Register *
$0003
Analog MUX Register
$0004
Port A Data Direction Register
$0005
Port B Data Direction Register
$0006
Port C Data Direction Register *
$0007
Unused
$0008
Core Timer Status & Control Register
$0009
Core Timer Counter
$000A
Serial Control Register
$000B
Serial Status Register
$000C
Serial Data Register
$000D
IRQ Status & Control Register
$000E
Personality EPROM Bit Select Register
$000F
Personality EPROM Status & Control Register
$0010
Port A and Port C Pulldown Register *
$0011
Port B Pulldown Register
$0012
Timer Control Register
$0013
Timer Status Register
$0014
Input Capture Register (MSB)
$0015
Input Capture Register (LSB)
$0016
Output Compare Register (MSB)
$0017
Output Compare Register (LSB)
$0018
Timer Counter Register (MSB)
$0019
Timer Counter Register (LSB)
$001A
Alternate Counter Register (MSB)
$001B
Alternate Counter Register (LSB)
$001C
EPROM Programming Register
$001D
Analog Control Register
$001E
Analog Status Register
$001F
Reserved
* Features related to port C are only available on the 28-pin
MC68HC705JP7 devices.
Figure 2-2. I/O Registers
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Memory
Addr.
$0000
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$0001
$0002
$0003
$0004
$0005
$0006
Register
Read:
Port A Data Register
(PORTA) Write:
See page 85.
Reset:
Read:
Port B Data Register
(PORTB) Write:
See page 90.
Reset:
Read:
Port C(1) Data Register
(PORTC) Write:
See page 102.
Reset:
Read:
Analog Multiplex Register
(AMUX) Write:
See page 110.
Reset:
Read:
Data Direction Register A
(DDRA) Write:
See page 86.
Reset:
$0009
6
0
0
5
4
3
2
1
Bit 0
PA5
PA4
PA3
PA2
PA1
PA0
PB2
PB1
PB0
PC2
PC1
PC0
Unaffected by reset
PB7
PB6
PB5
PB4
PB3
Unaffected by reset
PC7
PC6
PC5
PC4
PC3
Unaffected by reset
HOLD
DHOLD
INV
VREF
MUX4
MUX3
MUX2
MUX1
1
0
0
0
0
0
0
0
0
0
DDRA5
DDRA4
DDRA3
DDRA2
DDRA1
DDRA0
0
0
0
0
0
0
0
0
DDRB6
DDRB5
DDRB4
DDRB3
DDRB2
DDRB1
DDRB0
0
0
0
0
0
0
0
DDRC6
DDRC5
DDRC4
DDRC3
DDRC2
DDRC1
DDRC0
0
0
0
0
0
0
0
CTOFE
RTIE
0
0
CTOFR
RTIFR
RT1
RT0
Read:
Data Direction Register B
DDRB7
(DDRB) Write:
See page 91.
Reset:
0
Read:
Data Direction Register C
DDRC7
(DDRC) Write:
See page 103.
Reset:
0
$0007
$0008
Bit 7
Unimplemented
Core Timer Status and Control Read:
Register (CTSCR)
Write:
See page 153.
Reset:
CTOF
RTIF
0
0
0
0
0
0
1
1
Read:
Core Timer Counter Register
(CTCR) Write:
See page 155.
Reset:
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
0
0
0
0
= Unimplemented
R
= Reserved
U = Unaffected
1. Features related to port C are only available on the 28-pin MC68HC705JP7 devices.
Figure 2-3. Register Summary (Sheet 1 of 4)
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Memory
Input/Output Registers
Addr.
Register
Read:
SIOP Control Register
(SCR) Write:
See page 145.
Reset:
$000A
Read:
SIOP Status Register
(SSR) Write:
See page 148.
Reset:
$000B
Read:
SIOP Data Register
(SDR) Write:
See page 149.
Reset:
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$000C
Read:
$000D IRQ Status and Control Register
(ISCR) Write:
See page 58.
Reset:
$000E
$000F
$0010
Read:
PEPROM Bit Select Register
(PEBSR) Write:
See page 177.
Reset:
Bit 7
6
5
4
SPIE
SPE
LSBF
MSTR
0
0
0
0
SPIF
DCOL
0
0
0
Bit 7
2
1
Bit 0
CPHA
SPR1
SPR0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
6
5
4
3
2
1
Bit 0
IRQE
OM2
OM1
0
IRQF
0
0
0
1
1
0
0
0
0
U
0
PEB7
PEB6
PEB5
PEB4
PEB3
PEB2
PEB1
PEB0
0
0
0
0
0
0
0
0
0
0
0
0
PEPRZF
R
R
R
Read: PEDATA
PEPROM Status and Control
Register (PESCR) Write:
See page 178.
Reset:
U
0
PEPGM
3
0
SPIR
IRQR
R
0
0
0
0
0
0
1
Read:
Pulldown Register Port A and
Port C(1) (PDRA) Write: PDICH
See page 87.
Reset:
0
PDICL
PDIA5
PDIA4
PDIA3
PDIA2
PDIA1
PDIA0
0
0
0
0
0
0
0
Read:
Pulldown Register B
(PDRB) Write:
See page 92.
Reset:
PDIB7
PDIB6
PDIB5
PDIB4
PDIB3
PDIB2
PDIB1
PDIB0
0
0
0
0
0
0
0
0
ICIE
OCIE
TOIE
0
0
0
IEDG
OLVL
0
0
0
0
0
0
U
0
$0011
$0012
Read:
Timer Control Register
(TCR) Write:
See page 170.
Reset:
= Unimplemented
R
= Reserved
U = Unaffected
1. Features related to port C are only available on the 28-pin MC68HC705JP7 devices.
Figure 2-3. Register Summary (Sheet 2 of 4)
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Memory
Addr.
$0013
$0014
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$0015
$0016
$0017
$0018
$0019
$001A
$001B
Register
Bit 7
6
5
4
3
2
1
Bit 0
ICF
OCF
TOF
0
0
0
0
0
U
U
U
0
0
0
0
0
Read:
Input Capture Register High
(ICRH) Write:
See page 166.
Reset:
Bit 15
14
13
12
11
10
9
Bit 8
Read:
Input Capture Register Low
(ICRL) Write:
See page 166.
Reset:
Bit 7
2
1
Bit 0
10
9
Bit 8
2
1
Bit 0
Read:
Timer Status Register
(TSR) Write:
See page 172.
Reset:
Read:
Output Compare Register High
(OCRH) Write:
See page 168.
Reset:
Read:
Output Compare Register Low
(OCRL) Write:
See page 168.
Reset:
Unaffected by reset
6
5
4
3
Unaffected by reset
Bit 15
14
13
12
11
Unaffected by reset
Bit 7
6
5
4
3
Unaffected by reset
Read:
Programmable Timer Register
High (TMRH) Write:
See page 163.
Reset:
Bit 15
14
13
12
11
10
9
Bit 8
1
1
1
1
1
1
1
1
Read:
Programmable Timer Register
Low (TMRL) Write:
See page 163.
Reset:
Bit 7
6
5
4
3
2
1
Bit 0
1
1
1
1
1
1
0
0
Read:
Alternate Counter Register High
(ACRH) Write:
See page 165.
Reset:
Bit 15
14
13
12
11
10
9
Bit 8
1
1
1
1
1
1
1
1
Read:
Alternate Counter Register Low
(ACRL) Write:
See page 165.
Reset:
Bit 15
14
13
12
11
10
9
Bit 8
1
1
1
1
1
1
0
0
= Unimplemented
R
= Reserved
U = Unaffected
1. Features related to port C are only available on the 28-pin MC68HC705JP7 devices.
Figure 2-3. Register Summary (Sheet 3 of 4)
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Memory
Input/Output Registers
Addr.
$001C
Register
6
5
4
3
0
0
0
0
0
R
R
R
R
0
0
0
0
CHG
ATD2
ATD1
0
0
CPF2
CPF1
Read:
EPROM Programming Register
(EPROG) Write:
See page 184.
Reset:
Read:
Analog Counter Register
(ACR) Write:
See page 115.
Reset:
$001D
Read:
Analog Status Register
(ASR) Write:
See page 115.
Reset:
$001E
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Bit 7
$001F
2
1
Bit 0
ELAT
MPGM
EPGM
0
0
0
0
ICEN
CPIE
CP2EN
CP1EN
ISEN
0
0
0
0
0
0
0
0
CMP1
CPFR1
VOFF
CMP2
CPFR2
COE1
R
0
0
0
0
0
0
0
0
Reserved
R
R
R
R
R
R
R
R
Reserved
R
R
R
R
R
R
R
R
↓
$1FEF
$1FF0
Read:
COP and Security Register
(COPR) Write: EPMSEC
See pages 43, 137, 156, and 188.
Reset:
OPT
COPC
Unaffected by reset
= Unimplemented
R
= Reserved
U = Unaffected
1. Features related to port C are only available on the 28-pin MC68HC705JP7 devices.
Figure 2-3. Register Summary (Sheet 4 of 4)
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Memory
2.5 User and Interrupt Vector Mapping
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The interrupt vectors are contained in the upper memory addresses
above $1FF0 as shown in Figure 2-4.
Address
Register Name
$1FF0
COP Register and EPROM Security
$1FF1
Mask Option Register
$1FF2
Analog Interrupt Vector (MSB)
$1FF3
Analog Interrupt Vector (LSB)
$1FF4
Serial Interrupt Vector (MSB)
$1FF5
Serial Interrupt Vector ((LSB)
$1FF6
Timer Interrupt Vector (MSB)
$1FF7
Timer Interrupt Vector (LSB)
$1FF8
Core Timer Interrupt Vector (MSB)
$1FF9
Core Timer Interrupt Vector (LSB)
$1FFA
External IRQ Vector (MSB)
$1FFB
External IRQ Vector (LSB)
$1FFC
SWI Vector (MSB)
$1FFD
SWI Vector (LSB)
$1FFE
Reset Vector (MSB)
$1FFF
Reset Vector (LSB)
Figure 2-4. Vector Mapping
2.6 Random-Access Memory (RAM)
The 224 addresses from $0020 to $00FF serve as both the user RAM
and the stack RAM. The central processor unit (CPU) uses five RAM
bytes to save all CPU register contents before processing an interrupt.
During a subroutine call, the CPU uses two bytes to store the return
address. The stack pointer decrements during pushes and increments
during pulls.
NOTE:
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Be careful when using nested subroutines or multiple interrupt levels.
The CPU may overwrite data in the RAM during a subroutine or during
the interrupt stacking operation.
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Memory
Erasable Programmable Read-Only Memory (EPROM)
2.7 Erasable Programmable Read-Only Memory (EPROM)
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The EPROM is located in three areas of the memory map:
•
Addresses $0700–$1EFF contain 6144 bytes of user EPROM.
•
Addresses $1FF0–$1FF1 contain 2 bytes of EPROM reserved for
user vectors and COP and security register (COPR), and the mask
option register. Only bit 7 of $1FF0 is a programmable bit.
•
Addresses $1FF2–$1FFF contain 14 bytes of interrupt vectors.
2.8 COP Register
As shown in Figure 2-5, a register location is provided at $1FF0 to set
the EPROM security(1), select the optional features, and reset the COP
watchdog timer. The OPT bit controls the function of the PB4 port pin
and the availability to add an offset to any measured analog voltages.
See 8.5 Analog Status Register for more information
Address: $1FF0
$1FF0
Bit 7
6
5
4
3
2
1
Bit 0
Read:
OPT
Write: EPMSEC
COPC
Reset:
Unaffected by reset
= Unimplemented
Figure 2-5. COP and Security Register (COPR)
1. No security feature is absolutely secure. However, Motorola’s strategy is to make reading or
copying the EPROM/OTPROM difficult for unauthorized users.
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Memory
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Section 3. Central Processor Unit (CPU)
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3.1 Contents
3.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
3.3
Accumulator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
3.4
Index Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
3.5
Stack Pointer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
3.6
Program Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
3.7
Condition Code Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48
3.8
Arithmetic/Logic Unit (ALU) . . . . . . . . . . . . . . . . . . . . . . . . . . .50
3.2 Introduction
This section describes the central processor unit (CPU) registers.
Figure 3-1 shows the five CPU registers. CPU registers are not part of
the memory map.
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Central Processor Unit (CPU)
7
0
A
ACCUMULATOR (A)
7
0
X
15
0
6
0
0
0
15
Freescale Semiconductor, Inc...
1
0
0
0
10
1
0
1
8
7
5
0
1
SP
STACK POINTER (SP)
0
PCH
1
INDEX REGISTER (X)
PCL
7
1
1
5
4
1
H
PROGRAM COUNTER (PC)
0
I
N
Z
C
CONDITION CODE REGISTER (CCR)
HALF-CARRY FLAG
INTERRUPT MASK
NEGATIVE FLAG
ZERO FLAG
CARRY/BORROW FLAG
Figure 3-1. M68HC05 Programming Model
3.3 Accumulator
The accumulator is a general-purpose 8-bit register as shown in
Figure 3-2. The CPU uses the accumulator to hold operands and results
of arithmetic and non-arithmetic operations.
Bit 7
6
5
4
3
2
1
Bit 0
Read:
Write:
Reset:
Unaffected by reset
Figure 3-2. Accumulator (A)
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Central Processor Unit (CPU)
Index Register
3.4 Index Register
The index register is a general-purpose 8-bit register as shown in
Figure 3-3. In the indexed addressing modes, the CPU uses the byte in
the index register to determine the conditional address of the operand.
The 8-bit index register can also serve as a temporary data storage
location.
Freescale Semiconductor, Inc...
Bit 7
6
5
4
3
2
1
Bit 0
Read:
Write:
Reset:
Unaffected by reset
Figure 3-3. Index Register (X)
3.5 Stack Pointer
The stack pointer is a 16-bit register that contains the address of the next
location on the stack as shown in Figure 3-4. During a reset or after the
reset stack pointer (RSP) instruction, the stack pointer initializes to
$00FF. The address in the stack pointer decrements as data is pushed
onto the stack and increments as data is pulled from the stack.
Bit
15
14
13
12
11
10
9
8
7
6
0
0
0
0
0
0
0
0
1
1
0
0
0
0
0
0
0
0
1
1
5
4
3
2
1
Bit
0
1
1
1
1
1
1
Read:
Write:
Reset:
Figure 3-4. Stack Pointer (SP)
The 10 most significant bits of the stack pointer are permanently fixed at
0000000011, so the stack pointer produces addresses from $00C0 to
$00FF. If subroutines and interrupts use more than 64 stack locations,
the stack pointer wraps around to address $00FF and begins writing
over the previously stored data. A subroutine uses two stack locations;
an interrupt uses five locations.
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Central Processor Unit (CPU)
3.6 Program Counter
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The program counter is a 16-bit register that contains the address of the
next instruction or operand to be fetched as shown in Figure 3-5. The
three most significant bits of the program counter are ignored internally
and appear as 111 during stacking and subroutine calls.
Normally, the address in the program counter automatically increments
to the next sequential memory location every time an instruction or
operand is fetched. Jump, branch, and interrupt operations load the
program counter with an address other than that of the next sequential
location.
Bit
15
14
13
1
1
1
0
0
0
12
11
10
9
8
7
6
5
4
3
2
Bit
0
1
Read:
Write:
Reset:
Loaded with vector from $1FFE and $1FFF
Figure 3-5. Program Counter (PC)
3.7 Condition Code Register
The condition code register is an 8-bit register whose three most
significant bits are permanently fixed at 111 as shown in Figure 3-6. The
condition code register contains the interrupt mask and four flags that
indicate the results of the instruction just executed. The following
paragraphs describe the functions of the condition code register.
Bit 7
6
5
4
3
2
1
Bit 0
1
1
1
H
I
N
C
Z
1
1
1
U
1
U
U
U
Read:
Write:
Reset:
U = Unaffected
Figure 3-6. Condition Code Register (CCR)
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Central Processor Unit (CPU)
Condition Code Register
Half-Carry Flag (H)
The CPU sets the half-carry flag when a carry occurs between bits 3
and 4 of the accumulator during an ADD or ADC operation. The
half-carry flag is required for binary coded decimal (BCD) arithmetic
operations. Reset has no effect on the half-carry flag.
Interrupt Mask (I)
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Setting the interrupt mask disables interrupts. If an interrupt request
occurs while the interrupt mask is a logic 0, the CPU saves the CPU
registers on the stack, sets the interrupt mask, and then fetches the
interrupt vector. If an interrupt request occurs while the interrupt mask
is set, the interrupt request is latched. The CPU processes the latched
interrupt as soon as the interrupt mask is cleared again.
A return-from-interrupt (RTI) instruction pulls the CPU registers from
the stack, restoring the interrupt mask to its cleared state. After a
reset, the interrupt mask is set and can be cleared only by a CLI
instruction.
Negative Flag (N)
The CPU sets the negative flag when an arithmetic operation, logical
operation, or data manipulation produces a negative result. Reset has
no affect on the negative flag.
Zero Flag (Z)
The CPU sets the zero flag when an arithmetic operation, logical
operation, or data manipulation produces a result of $00. Reset has
no affect on the zero flag.
Carry/Borrow Flag (C)
The CPU sets the carry/borrow flag when an addition operation
produces a carry out of bit 7 of the accumulator or when a subtraction
operation requires a borrow. Some logical operations and data
manipulation instructions also clear or set the carry/borrow flag. Reset
has no effect on the carry/borrow flag.
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Central Processor Unit (CPU)
3.8 Arithmetic/Logic Unit (ALU)
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The ALU performs the arithmetic and logical operations defined by the
instruction set. The binary arithmetic circuits decode instructions and set
up the ALU for the selected operation. Most binary arithmetic is based
on the addition algorithm, carrying out subtraction as negative addition.
Multiplication is not performed as a discrete operation but as a chain of
addition and shift operations within the ALU. The multiply instruction
(MUL) requires 11 internal clock cycles to complete this chain of
operations.
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Section 4. Interrupts
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4.1 Contents
4.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
4.3
Interrupt Vectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
4.4
Interrupt Processing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
4.5
Software Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
4.6
External Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .55
4.6.1
IRQ/VPP Pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
4.6.2
PA0–PA3 Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
4.6.3
IRQ Status and Control Register (ISCR) . . . . . . . . . . . . . . . 58
4.7
Core Timer Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
4.7.1
Core Timer Overflow Interrupt . . . . . . . . . . . . . . . . . . . . . . . 60
4.7.2
Real-Time Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
4.8
Programmable Timer Interrupts . . . . . . . . . . . . . . . . . . . . . . . . 61
4.8.1
Input Capture Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
4.8.2
Output Compare Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . 61
4.8.3
Timer Overflow Interrupt. . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
4.9
Serial Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
4.10 Analog Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
4.10.1 Comparator Input Match Interrupt . . . . . . . . . . . . . . . . . . . .63
4.10.2 Input Capture Interrupt . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
4.2 Introduction
An interrupt temporarily stops normal program execution to process a
particular event. An interrupt does not stop the execution of the
instruction in progress, but takes effect when the current instruction
completes its execution. Interrupt processing automatically saves the
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central processor unit (CPU) registers on the stack and loads the
program counter with a user-defined vector address.
4.3 Interrupt Vectors
Table 4-1 summarizes the reset and interrupt sources and vector
assignments.
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NOTE:
If more than one interrupt request is pending, the CPU fetches the vector
of the higher priority interrupt first. A higher priority interrupt does not
actually interrupt a lower priority interrupt service routine unless the
lower priority interrupt service routine clears the I bit.
Table 4-1. Reset/Interrupt Vector Addresses
Source
MOR
Control
Bit
Power-on logic
RESET pin
Low-voltage reset
Illegal address reset
—
Function
Reset
COP watchdog
Software
interrupt (SWI)
Global
Hardware
Mask
Local
Software
Mask
Priority
(1 = Highest)
Vector
Address
—
—
1
$1FFE–$1FFF
—
—
Same priority
as instruction
$1FFC–$1FFD
I bit
IRQE bit
2
$1FFA–$1FFB
COPEN(1)
User code
—
IRQ/VPP pin
—
External
interrupt (IRQ)
PA3 pin
PA2 pin
PA1 pin
PA0 pin
PIRQ(2)
Core timer
interrupts
TOF bit
RTIF bit
—
I bit
TOFE bit
RTIE bit
3
$1FF8–$1FF9
Programmable
timer interrupts
ICF bit
OCF bit
TOF bit
—
I bit
ICIE bit
OCIE bit
TOIE bit
4
$1FF6–$1FF7
Serial interrupt
SPIF bit
—
I bit
SPIE bit
5
$1FF4–$1FF5
Analog interrupt
CPF1 bit
CPF2 bit
—
I bit
CPIE bit
6
$1FF2–$1FF3
1. COPEN enables the COP watchdog timer.
2. PIRQ enables port A external interrupts on PA0–PA3.
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Interrupt Processing
4.4 Interrupt Processing
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To begin servicing an interrupt, the CPU does these actions:
•
Stores the CPU registers on the stack in the order shown in
Figure 4-1
•
Sets the I bit in the condition code register to prevent further
interrupts
•
Loads the program counter with the contents of the appropriate
interrupt vector locations as shown in Table 4-1
The return-from-interrupt (RTI) instruction causes the CPU to recover its
register contents from the stack as shown in Figure 4-1. The sequence
of events caused by an interrupt is shown in the flowchart in Figure 4-2.
$0020
Bottom of RAM
$0021
$00BE
$00BF
$00C0
Bottom of Stack
$00C1
$00C2
Unstacking
Order
⇓
n
Condition Code Register
5
1
Accumulator
4
2
n+2
Index Register
3
3
n+3
Program Counter (High Byte)
2
4
n+4
Program Counter (Low Byte)
1
5
n+1
⇑
Stacking
Order
$00FD
$00FE
$00FF
Top of Stack (RAM)
Figure 4-1. Interrupt Stacking Order
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FROM
RESET
YES
I BIT SET?
NO
EXTERNAL
INTERRUPT?
YES
CLEAR IRQ LATCH
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NO
CORE TIMER
INTERRUPT?
YES
NO
TIMER
INTERRUPT?
YES
NO
SERIAL
INTERRUPT?
YES
NO
ANALOG
INTERRUPT?
YES
STACK PCL, PCH, X, A, CCR
SET I BIT
LOAD PC WITH INTERRUPT VECTOR
NO
FETCH NEXT
INSTRUCTION
SWI
INSTRUCTION?
YES
NO
RTI
INSTRUCTION?
YES
UNSTACK CCR, A, X, PCH, PCL
NO
EXECUTE INSTRUCTION
Figure 4-2. Interrupt Flowchart
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Software Interrupt
4.5 Software Interrupt
The software interrupt (SWI) instruction causes a non-maskable
interrupt.
4.6 External Interrupts
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These sources can generate external interrupts:
•
IRQ/VPP pin
•
PA3–PA0 pins
Setting the I bit in the condition code register or clearing the IRQE bit in
the interrupt status and control register disables these external
interrupts.
4.6.1 IRQ/VPP Pin
An interrupt signal on the IRQ/VPP pin latches an external interrupt
request. To help clean up slow edges, the input from the IRQ/VPP pin is
processed by a Schmitt trigger gate. When the CPU completes its
current instruction, it tests the IRQ latch. If the IRQ latch is set, the CPU
then tests the I bit in the condition code register and the IRQE bit in the
IRQ status and control register (ISCR). If the I bit is clear and the IRQE
bit is set, then the CPU begins the interrupt sequence. The CPU clears
the IRQ latch while it fetches the interrupt vector, so that another external
interrupt request can be latched during the interrupt service routine. As
soon as the I bit is cleared during the return from interrupt, the CPU can
recognize the new interrupt request. Figure 4-3 shows the logic for
external interrupts.
NOTE:
If the IRQ/VPP pin is not in use, it should be connected to the VDD pin.
The IRQ/VPP pin can be negative edge-triggered only or negative edgeand low level-triggered. External interrupt sensitivity is programmed with
the LEVEL bit in the mask option register (MOR).
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VPP TO
USER EPROM
AND PEPROM
TO BIH & BIL
INSTRUCTION
PROCESSING
IRQ/VPP
PA3
VDD
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PA2
IRQ
LATCH
EXTERNAL
INTERRUPT
REQUEST
R
PA1
PA0
IRQR
IRQF
IRQE
LEVEL
PIRQ
RST
IRQ VECTOR FETCH
IRQ STATUS/CONTROL REGISTER ($000D)
MASK OPTION REGISTER ($1FF1)
INTERNAL DATA BUS
Figure 4-3. External Interrupt Logic
With the edge- and level-sensitive trigger MOR option, a falling edge or
a low level on the IRQ/VPP pin latches an external interrupt request. The
edge- and level-sensitive trigger MOR option allows connection to the
IRQ/VPP pin of multiple wired-OR interrupt sources. As long as any
source is holding the IRQ low, an external interrupt request is present,
and the CPU continues to execute the interrupt service routine.
With the edge-sensitive-only trigger option, a falling edge on the
IRQ/VPP pin latches an external interrupt request. A subsequent
interrupt request can be latched only after the voltage level on the
IRQ/VPP pin returns to a logic 1 and then falls again to logic 0.
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External Interrupts
NOTE:
The response of the IRQ/VPP pin can be affected if the external interrupt
capability of the PA0 through PA3 pins is enabled. If the port A pins are
enabled as external interrupts, then any high level on a PA0–PA3 pin will
cause the IRQ changes and state to be ignored until all of the PA0–PA3
pins have returned to a low level.
4.6.2 PA0–PA3 Pins
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Programming the PIRQ bit in the MOR to a logic 1 enables the PA0–PA3
pins (PA0:3) to serve as additional external interrupt sources. A rising
edge on a PA0:3 pin latches an external interrupt request. After
completing the current instruction, the CPU tests the IRQ latch. If the
IRQ latch is set, the CPU then tests the I bit in the condition code register
and the IRQE bit in the ISCR. If the I bit is clear and the IRQE bit is set,
the CPU then begins the interrupt sequence. The CPU clears the IRQ
latch while it fetches the interrupt vector, so that another external
interrupt request can be latched during the interrupt service routine. As
soon as the I bit is cleared during the return from interrupt, the CPU can
recognize the new interrupt request.
The PA0:3 pins can be edge-triggered or edge- and level-triggered.
External interrupt triggering sensitivity is selected by the LEVEL bit in the
MOR.
With the edge- and level-sensitive trigger MOR option, a rising edge or
a high level on a PA0:3 pin latches an external interrupt request. The
edge- and level-sensitive trigger MOR option allows connection to a
PA0:3 pin of multiple wired-OR interrupt sources. As long as any source
is holding the pin high, an external interrupt request is present, and the
CPU continues to execute the interrupt service routine.
With the edge-sensitive only trigger MOR option, a rising edge on a
PA0:3 pin latches an external interrupt request. A subsequent external
interrupt request can be latched only after the voltage level of the
previous interrupt signal returns to a logic 0 and then rises again to a
logic 1.
NOTE:
If the port A pins are enabled as external interrupts, then a high level on
any PA0:3 pin will drive the state of the IRQ function such that the
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IRQ/VPP pin and other PA0:3 pins are to be ignored until ALL of the
PA0:3 pins have returned to a low level. Similarly, if the IRQ/VPP pin is
at a low level, the PA0:3 pins will be ignored until the IRQ/VPP pin returns
to a high state.
4.6.3 IRQ Status and Control Register (ISCR)
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The IRQ status and control register (ISCR), shown in Figure 4-4,
contains an external interrupt mask (IRQE), an external interrupt flag
(IRQF), and a flag reset bit (IRQR). Unused bits will read as logic 0s. The
ISCR also contains two control bits for the oscillators, external pin
oscillator, and internal low-power oscillator. Reset sets the IRQE and
OM2 bits and clears all the other bits.
Address:
$000D
Bit 7
6
5
IRQE
OM2
OM1
Read:
Write:
Reset:
4
3
2
1
Bit 0
0
IRQF
0
0
0
R
1
1
0
= Unimplemented
0
R
IRQR
0
= Reserved
0
U
0
U = Unaffected
Figure 4-4. IRQ Status and Control Register (ISCR)
IRQE — External Interrupt Request Enable Bit
This read/write bit enables external interrupts. Reset sets the IRQE
bit.
1 = External interrupt processing enabled
0 = External interrupt processing disabled
OM1 and OM2 — Oscillator Select Bits
These bits control the selection and enabling of the oscillator source
for the MCU. One choice is the internal low-power oscillator (LPO).
The other choice is the external pin oscillator (EPO) which is common
to most M68HC05 MCU devices. The EPO uses external components
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External Interrupts
like filter capacitors and a crystal or ceramic resonator and consumes
more power. The selection and enable conditions for these two
oscillators are shown in Table 4-2.
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Table 4-2. Oscillator Selection
Internal
Low-Power
Oscillator
(LPO)
External
Pin
Oscillator
(EPO)
Power
Consumption
OM2
OM1
Oscillator
Selected
by CPU
0
0
Internal
Enabled
Disabled
Lowest
0
1
External
Disabled
Enabled
Normal
1
0
Internal
Enabled
Disabled
Lowest
1
1
Internal
Enabled
Enabled
Normal
Therefore, the lowest power is consumed when OM1 is cleared. The
state with both OM1 and OM2 set is provided so that the EPO can be
started and allowed to stabilize while the LPO still clocks the MCU.
The reset state is for OM1 to be cleared and OM2 to be set, which
selects the LPO and disables the EPO.
IRQF — External Interrupt Request Flag
The IRQ flag is a clearable, read-only bit that is set when an external
interrupt request is pending. Writing to the IRQF bit has no effect.
Reset clears the IRQF bit.
1 = Interrupt request pending
0 = No interrupt request pending
The following conditions set the IRQ flag:
• An external interrupt signal on the IRQ/VPP pin
• An external interrupt signal on pin PA0, PA1, PA2, or PA3
when the PA0–PA3 pins are enabled by the PIRQ bit in the MOR
to serve as external interrupt sources.
The following conditions clear the IRQ flag:
• When the CPU fetches the interrupt vector
• When a logic 1 is written to the IRQR bit
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IRQR — Interrupt Request Reset Bit
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This write-only bit clears the IRQF flag bit and prevents redundant
execution of interrupt routines. Writing a logic 1 to IRQR clears the
IRQF. Writing a logic 0 to IRQR has no effect. IRQR always reads as
a logic 0. Reset has no effect on IRQR.
1 = Clear IRQF flag bit
0 = No effect
4.7 Core Timer Interrupts
The core timer can generate the following interrupts:
•
Timer overflow interrupt
•
Real-time interrupt
Setting the I bit in the condition code register disables core timer
interrupts. The controls and flags for these interrupts are in the core timer
status and control register (CTSCR) located at $0008.
4.7.1 Core Timer Overflow Interrupt
An overflow interrupt request occurs if the core timer overflow flag (TOF)
becomes set while the core timer overflow interrupt enable bit (TOFE) is
also set. The TOF flag bit can be reset by writing a logic 1 to the CTOFR
bit in the CTSCR or by a reset of the device.
4.7.2 Real-Time Interrupt
A real-time interrupt request occurs if the real-time interrupt flag (RTIF)
in the CTSCR becomes set while the real-time interrupt enable bit
(RTIE) is also set. The RTIF flag bit can be reset by writing a logical 1 to
the RTIFR bit in the CTSCR or by a reset of the device.
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Programmable Timer Interrupts
4.8 Programmable Timer Interrupts
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The 16-bit programmable timer can generate an interrupt whenever the
following events occur:
•
Input capture
•
Output compare
•
Timer counter overflow
Setting the I bit in the condition code register disables timer interrupts.
The controls for these interrupts are in the timer control register (TCR)
located at $0012 and in the status bits in the timer status register (TSR)
located at $0013.
4.8.1 Input Capture Interrupt
An input capture interrupt occurs if the input capture flag (ICF) becomes
set while the input capture interrupt enable bit (ICIE) is also set. The ICF
flag bit is in the TSR, and the ICIE enable bit is located in the TCR. The
ICF flag bit is cleared by a read of the TSR with the ICF flag bit set, and
then followed by a read of the LSB of the input capture register (ICRL)
or by reset. The ICIE enable bit is unaffected by reset.
4.8.2 Output Compare Interrupt
An output compare interrupt occurs if the output compare flag (OCF)
becomes set while the output compare interrupt enable bit (OCIE) is also
set. The OCF flag bit is in the TSR and the OCIE enable bit is in the TCR.
The OCF flag bit is cleared by a read of the TSR with the OCF flag bit
set, and then followed by an access to the LSB of the output compare
register (OCRL) or by reset. The OCIE enable bit is unaffected by reset.
4.8.3 Timer Overflow Interrupt
A timer overflow interrupt occurs if the timer overflow flag (TOF)
becomes set while the timer overflow interrupt enable bit (TOIE) is also
set. The TOF flag bit is in the TSR and the TOIE enable bit is in the TCR.
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The TOF flag bit is cleared by a read of the TSR with the TOF flag bit set,
and then followed by an access to the LSB of the timer registers (TMRL)
or by reset. The TOIE enable bit is unaffected by reset.
4.9 Serial Interrupts
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The simple serial interface can generate the following interrupts:
•
Receive sequence complete
•
Transmit sequence complete
Setting the I bit in the condition code register disables serial interrupts.
The controls for these interrupts are in the serial control register (SCR)
located at $000A and in the status bits in the serial status register (SSR)
located at $000B.
A transfer complete interrupt occurs if the serial interrupt flag (SPIF)
becomes set while the serial interrupt enable bit (SPIE) is also set. The
SPIF flag bit is in the serial status register (SSR) located at $000B, and
the SPIE enable bit is located in the serial control register (SCR) located
at $000A. The SPIF flag bit is cleared by a read of the SSR with the SPIF
flag bit set, and then followed by a read or write to the serial data register
(SDR) located at $000C. The SPIF flag bit can also be reset by writing a
one to the SPIR bit in the SCR.
4.10 Analog Interrupts
The analog subsystem can generate the following interrupts:
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•
Voltage on positive input of comparator 1 is greater than the
voltage on the negative input of comparator 1.
•
Voltage on positive input of comparator 2 is greater than the
voltage on the negative input of comparator 2.
•
Trigger of the input capture interrupt from the programmable timer
as described in 4.8.1 Input Capture Interrupt
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Analog Interrupts
Setting the I bit in the condition code register disables analog subsystem
interrupts. The controls for these interrupts are in the analog subsystem
control register (ACR) located at $001D, and the status bits are in the
analog subsystem status register (ASR) located at $001E.
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4.10.1 Comparator Input Match Interrupt
A comparator input match interrupt occurs if either compare flag bit
(CPF1 or CPF2) in the ASR becomes set while the comparator interrupt
enable bit (CPIE) in the ACR is also set. The CPF1 and CPF2 flag bits
can be reset by writing a one to the corresponding CPFR1 or CPFR2 bits
in the ASR. Reset clears these bits.
4.10.2 Input Capture Interrupt
The analog subsystem can also generate an input capture interrupt
through the 16-bit programmable timer. The input capture can be
triggered when there is a match in the input conditions for the voltage
comparator 2. If comparator 2 sets the CP2F flag bit in the ASR and the
input capture enable (ICEN) in the ACR is set, then an input capture will
be performed by the programmable timer. If the ICIE enable bit in the
TCR is also set, then an input compare interrupt will occur. Reset clears
these bits.
NOTE:
For the analog subsystem to generate an interrupt using the input
capture function of the programmable timer, the ICEN enable bit in the
ACR, and the ICIE and IEDG bits in the TCR must all be set.
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Section 5. Resets
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5.1 Contents
5.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
5.3
Power-On Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
5.4
External Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
5.5
Internal Resets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
5.5.1
Power-On Reset (POR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
5.5.2
Computer Operating Properly (COP) Reset. . . . . . . . . . . . . 68
5.5.3
Low-Voltage Reset (LVR). . . . . . . . . . . . . . . . . . . . . . . . . . . 70
5.5.4
Illegal Address Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70
5.6
Reset States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
5.6.1
CPU . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
5.6.2
I/O Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
5.6.3
Core Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
5.6.4
COP Watchdog . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .71
5.6.5
16-Bit Programmable Timer . . . . . . . . . . . . . . . . . . . . . . . . . 72
5.6.6
Serial Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
5.6.7
Analog Subsystem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
5.6.8
External Oscillator and Internal
Low-Power Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . .73
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Resets
5.2 Introduction
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This section describes the five reset sources and how they initialize the
microcontroller unit (MCU). A reset immediately stops the operation of
the instruction being executed, initializes certain control bits, and loads
the program counter with a user-defined reset vector address. These
conditions produce a reset:
•
Initial power-up of device (power-on reset)
•
A logic 0 applied to the RESET pin (external reset)
•
Timeout of the computer operating properly (COP) watchdog
(COP reset)
•
Low voltage applied to the device (LVR reset)
•
Fetch of an opcode from an address not in the memory map
(illegal address reset)
Figure 5-1 shows a block diagram of the reset sources and their
interaction.
MASK OPTION REGISTER ($1FF1)
LVREN
COPEN
INTERNAL DATA BUS
COP WATCHDOG
LOW-VOLTAGE RESET
VDD
POWER-ON RESET
ILLEGAL ADDRESS RESET
INTERNAL
ADDRESS BUS
S
D
RESET
LATCH
RESET
RST
TO CPU
AND
SUBSYSTEMS
R
3-CYCLE
CLOCKED
1-SHOT
INTERNAL
CLOCK
Figure 5-1. Reset Sources
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Resets
Power-On Reset
5.3 Power-On Reset
A positive transition on the VDD pin generates a power-on reset. The
power-on reset is strictly for conditions during powering up and cannot
be used to detect drops in power supply voltage.
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A delay of 16 or 4064 internal bus cycles (tcyc) after the oscillator
becomes active allows the clock generator to stabilize. If the RESET pin
is at logic 0 at the end of this multiple tcyc time, the MCU remains in the
reset condition until the signal on the RESET pin goes to a logic 1.
5.4 External Reset
A logic 0 applied to the RESET pin for a minimum of one and one half
tcyc generates an external reset. This pin is connected to a Schmitt
trigger input gate to provide an upper and lower threshold voltage
separated by a minimum amount of hysteresis. The external reset
occurs whenever the RESET pin is pulled below the lower threshold and
remains in reset until the RESET pin rises above the upper threshold.
This active low input will generate the internal RST signal that resets the
CPU and peripherals.
The RESET pin can also be pulled to a low state by an internal pulldown
device that is activated by three internal reset sources. This reset
pulldown device will only be asserted for three to four cycles of the
internal bus or as long as the internal reset source is asserted.
NOTE:
Do not connect the RESET pin directly to VDD, as this may overload
some power supply designs if the internal pulldown on the RESET pin
should activate. If an external reset function is not required, the RESET
pin should be left unconnected.
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Resets
5.5 Internal Resets
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The four internally generated resets are:
•
Initial power-on reset (POR) function
•
COP watchdog timer reset
•
Low-voltage reset (LVR)
•
Illegal address detector
Only the COP watchdog timer reset, low-voltage reset, and illegal
address detector will also assert the pulldown device on the RESET pin
for the duration of the reset function or for three to four internal bus
cycles, whichever is longer.
5.5.1 Power-On Reset (POR)
The internal POR is generated on power-up to allow the clock oscillator
to stabilize. The POR is strictly for power turn-on conditions and is not
able to detect a drop in the power supply voltage (brown-out); that
function can be performed by the LVR. Depending on the DELAY bit in
the mask option register (MOR), there is an oscillator stabilization delay
of 16 or 4064 internal bus cycles after the LPO becomes active.
The POR will generate the RST signal which will reset the CPU. If any
other reset function is active at the end of the 16- or 4064-cycle delay,
the RST signal will remain in the reset condition until the other reset
condition(s) end.
POR will not activate the pulldown device on the RESET pin. VDD must
drop below VPOR for the internal POR circuit to detect the next rise of
VDD.
5.5.2 Computer Operating Properly (COP) Reset
A timeout of the COP watchdog generates a COP reset. The COP
watchdog is part of a software error detection system and must be
cleared periodically to start a new timeout period. To clear the COP
watchdog and prevent a COP reset, write a logic 0 to the COPC bit of the
COPR register at location $1FF0. The COPC bit, shown in
Figure 5-2, is a write-only bit.
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Resets
Internal Resets
Address:
Read:
Write:
Reset:
$1FF0
Bit 7
6
EPMSEC
OPT
U
U
5
4
3
2
1
Bit 0
COPC
U
= Unimplemented
U
U
U
U
U
U = Unaffected
Figure 5-2. COP and Security Register (COPR)
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EPMSEC — EPROM Security(1) Bit
The EPMSEC bit is an EPROM, write-only security bit to protect the
contents of the user EPROM code stored in locations $0700–$1FFF.
OPT — Optional Features Bit
The OPT bit enables two additional features: direct drive by
comparator 1 output to PB4 and voltage offset capability to sample
capacitor in analog subsystem.
1 = Optional features enabled
0 = Optional features disabled
NOTE:
See 8.8.1 Voltage Comparator 1 and 8.11 Sample and Hold for further
descriptions of the OPT bit.
COPC — COP Clear Bit
COPC is a write-only bit. Periodically writing a logic 0 to COPC
prevents the COP watchdog from resetting the MCU. Reset clears the
COPC bit.
1 = No effect on COP watchdog timer
0 = Reset COP watchdog timer
The COP watchdog reset will assert the pulldown device to pull the
RESET pin low for three to four cycles of the internal bus.
The COP watchdog reset function can be enabled or disabled by
programming the COPEN bit in the MOR.
1. No security feature is absolutely secure. However, Motorola’s strategy is to make reading or
copying the EPROM/OTPROM difficult for unauthorized users.
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Resets
5.5.3 Low-Voltage Reset (LVR)
The LVR activates the RST reset signal to reset the device when the
voltage on the VDD pin falls below the LVR trip voltage. The LVR will
assert the pulldown device to pull the RESET pin low for three to four
cycles of the internal bus.
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The LVR reset function can be enabled or disabled by programming the
LVREN bit in the MOR.
NOTE:
The LVR is intended for applications where the VDD supply voltage
normally operates above 4.5 volts.
5.5.4 Illegal Address Reset
An opcode fetch (execution of an instruction) at an address that is not in
the EPROM (locations $0700–$1FFF) or the RAM (locations
$0020–$00FF) generates an illegal address reset. The illegal address
reset will assert the pulldown device to pull the RESET pin low for three
to four cycles of the internal bus.
5.6 Reset States
This subsection describe how the various resets initialize the MCU.
5.6.1 CPU
A reset has these effects on the CPU:
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•
Loads the stack pointer with $FF
•
Sets the I bit in the condition code register, inhibiting interrupts
•
Loads the program counter with the user-defined reset vector from
locations $1FFE and $1FFF
•
Clears the stop latch, enabling the CPU clock
•
Clears the wait latch, bringing the CPU out of the wait mode
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Reset States
5.6.2 I/O Registers
A reset has these effects on input/output (I/O) registers:
•
Clears bits in data direction registers configuring pins as inputs:
– DDRA5–DDRA0 in DDRA for port A
– DDRB7–DDRB0 in DDRB for port B
– DDRC7–DDRC0 in DDRC for port C(1)
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•
Clears bits in pulldown inhibit registers to enable pulldown
devices:
– PDIA5–PDIA0 in PDRA for port A
– PDIB7–PDIB0 in PDRB for port B
– PDICH and PDICL in PDRA for port C(1)
•
Has no effect on port A, B, or C(1) data registers
•
Sets the IRQE bit in the interrupt status and control register (ISCR)
5.6.3 Core Timer
A reset has these effects on the core timer:
•
Clears the core timer counter register (CTCR)
•
Clears the core timer interrupt flag and enable bits in the core timer
status and control register (CTSCR)
•
Sets the real-time interrupt (RTI) rate selection bits (RT0 and RT1)
such that the device will start with the longest real-time interrupt
and longest COP timeout delays
5.6.4 COP Watchdog
A reset clears the COP watchdog timeout counter.
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5.6.5 16-Bit Programmable Timer
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A reset has these effects on the 16-bit programmable timer:
•
Initializes the timer counter registers (TMRH and TMRL) to a value
of $FFFC
•
Initializes the alternate timer counter registers (ACRH and ACRL)
to a value of $FFFC
•
Clears all the interrupt enables and the output level bit (OLVL) in
the timer control register (TCR)
•
Does not affect the input capture edge bit (IEDG) in the TCR
•
Does not affect the interrupt flags in the timer status register (TSR)
•
Does not affect the input capture registers (ICRH and ICRL)
•
Does not affect the output compare registers (OCRH and OCRL)
5.6.6 Serial Interface
A reset has these effects on the serial interface:
•
Clears all bits in the SIOP control register (SCR)
•
Clears all bits in the SIOP status register (SSR)
•
Does not affect the contents of the SIOP data register (SDR)
A reset, therefore, disables the SIOP and leaves the shared port B pins
as general I/O. Any pending interrupt flag is cleared and the SIOP
interrupt is disabled. Also the baud rate defaults to the slowest rate.
5.6.7 Analog Subsystem
A reset has these effects on the analog subsystem:
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•
Clears all the bits in the multiplex register (AMUX) bits except the
hold switch bit (HOLD) which is set
•
Clears all the bits in the analog control register (ACR)
•
Clears all the bits in the analog status register (ASR)
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Reset States
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A reset, therefore, connects the negative input of comparator 2 to the
channel selection bus, which is switched to VSS. Both comparators are
set up as non-inverting (a higher positive voltage on the positive input
results in a positive output) and both are powered down. The current
source and discharge device on the PB0/AN0 pin is disabled and
powered down. Any analog subsystem interrupt flags are cleared and
the analog interrupt is disabled. Direct drive by comparator 1 to the PB4
pin and the voltage offset to the sample capacitor are disabled (if both
are enabled by the OPT bit being set in the COPR).
5.6.8 External Oscillator and Internal Low-Power Oscillator
A reset presets the oscillator select bits (OM1 and OM2) in the interrupt
status and control register (ISCR) such that the device runs from the
internal oscillator (OM1 = 0, OM2 = 1) which has these effects on the
oscillators:
•
The internal low-power oscillator is enabled and selected.
•
The external oscillator is disabled.
•
The CPU bus clock is driven from the internal low-power oscillator.
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Resets
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Section 6. Operating Modes
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6.1 Contents
6.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
6.3
Oscillator Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
6.4
Low-Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .77
6.4.1
Stop Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79
6.4.2
Wait Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
6.4.3
Halt Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
6.4.4
Data-Retention Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .82
6.2 Introduction
This section describes the operation of the device with respect to the
oscillator source and the low-power modes:
•
Stop mode
•
Wait mode
•
Halt mode
•
Data-retention mode
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6.3 Oscillator Source
The microcontroller unit (MCU) can be clocked by either an internal
low-power oscillator (LPO) without external components or by an
external pin oscillator (EPO) which uses external components. The
enable and selection of the clock source is determined by the state of the
oscillator select bits (OM1 and OM2) in the interrupt status and control
register (ISCR) as shown in Figure 6-1.
Freescale Semiconductor, Inc...
Address:
Read:
Write:
Reset:
$000D
Bit 7
6
5
IRQE
OM2
OM1
1
1
0
4
3
2
1
Bit 0
0
IRQF
0
0
0
R
0
= Unimplemented
IRQR
0
R
0
0
0
= Reserved
Figure 6-1. IRQ Status and Control Register (ISCR)
IRQE — External Interrupt Request Enable Bit
This read/write bit enables external interrupts. Refer to Section 4.
Interrupts for more details.
OM1 and OM2 — Oscillator Select Bits
These bits control the selection and enabling of the oscillator source
for the MCU. One choice is the internal LPO and the other oscillator
is the EPO which is common to most M68HC05 MCU devices. The
EPO uses external components like filter capacitors and a crystal or
ceramic resonator and consumes more power than the LPO. The
selection and enable conditions for these two oscillators are shown in
Table 6-1. Reset clears OM1 and sets OM2, which selects the LPO
and disables the EPO.
Therefore, the lowest power is consumed when OM1 is cleared. The
state with both OM1 and OM2 set is provided so that the EPO can be
started up and allowed to stabilize while the LPO still clocks the MCU.
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Operating Modes
Low-Power Modes
.
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Table 6-1. Oscillator Selection
NOTE:
Internal
Low-Power
Oscillator
(LPO)
External Pin
Oscillator
(EPO)
Power
Consumption
OM2
OM1
Oscillator
Selected
0
0
Internal
Enabled
Disabled
Lowest
0
1
External
Disabled
Enabled
Normal
1
0
Internal
Enabled
Disabled
Lowest
1
1
Internal
Enabled
Enabled
Normal
When switching from LPO to EPO, the user must be careful to ensure
that the EPO has been enabled and powered up long enough to stabilize
before shifting clock sources.
IRQF — External Interrupt Request Flag
The IRQF flag is a clearable, read-only bit that is set when an external
interrupt request is pending. Refer to Section 4. Interrupts for more
details.
IRQR — Interrupt Request Reset Bit
This write-only bit clears the IRQF flag bit and prevents redundant
execution of interrupt routines. Refer to Section 4. Interrupts for
more details.
6.4 Low-Power Modes
Four modes of operation reduce power consumption:
•
Stop mode
•
Wait mode
•
Halt mode
•
Data-retention mode
Figure 6-2 shows the sequence of events in stop, wait, and halt modes.
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STOP
HALT
SWAIT BIT
IN MOR SET?
YES
NO
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CLEAR I BIT IN CCR.
SET IRQE BIT IN ISCR.
CLEAR CTOF, RTIF, CTOFE, AND RTIE BITS IN TSCR.
CLEAR ICF, OCF, AND TOF BITS IN TSR.
CLEAR ICIE, OCIE, AND TOIE BITS IN TCR.
DISABLE EXTERNAL PIN OSCILLATOR.
TURN OFF INTERNAL LOW-POWER OSCILLATOR.
CLEAR I BIT IN CCR.
SET IRQE BIT IN ISCR.
TURN OFF CPU CLOCK.
KEEP OTHER MODULE
CLOCKS ACTIVE.
YES
EXTERNAL
RESET?
WAIT
CLEAR I BIT IN CCR.
SET IRQE BIT IN ISCR.
TURN OFF CPU CLOCK.
KEEP OTHER MODULE
CLOCKS ACTIVE.
YES
NO
NO
YES
EXTERNAL
RESET?
YES
YES
YES
EXTERNAL
INTERRUPT?
YES
CORE
TIMER
INTERRUPT?
YES
NO
NO
YES
TURN ON SELECTED OSCILLATOR.
RESET STABILIZATION DELAY TIMER.
SIOP
INTERRUPT?
YES
YES
ANALOG
INTERRUPT?
YES
YES
COP
RESET?
NO
SIOP
INTERRUPT?
NO
YES
NO
TURN ON CPU CLOCK.
PROG.
TIMER
INTERRUPT?
NO
NO
NO
CORE
TIMER
INTERRUPT?
NO
NO
YES
END OF
STABILIZATION
DELAY?
PROG.
TIMER
INTERRUPT?
EXTERNAL
INTERRUPT?
NO
NO
NO
YES
EXTERNAL
INTERRUPT?
EXTERNAL
RESET?
ANALOG
INTERRUPT?
NO
YES
COP
RESET?
NO
1. LOAD PC WITH RESET VECTOR
OR
2. SERVICE INTERRUPT.
a. SAVE CPU REGISTERS ON STACK.
b. SET I BIT IN CCR.
c. LOAD PC WITH INTERRUPT VECTOR.
Figure 6-2. Stop/Wait/Halt Flowchart
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6.4.1 Stop Mode
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The STOP instruction puts the MCU in a mode with the lowest power
consumption and affects the MCU as follows:
•
Turns off the central processor unit (CPU) clock and all internal
clocks by stopping both the external pin oscillator and the internal
low-power oscillator. The selection of the oscillator by the OM1
and OM2 bits in the ISCR is not affected. The stopped clocks turn
off the COP watchdog, the core timer, the programmable timer,
the analog subsystem, and the SIOP.
•
Removes any pending core timer interrupts by clearing the core
timer interrupt flags (CTOF and RTIF) in the core timer status and
control register (CTSCR)
•
Disables any further core timer interrupts by clearing the core
timer interrupt enable bits (CTOFE and RTIE) in the CTSCR
•
Removes any pending programmable timer interrupts by clearing
the timer interrupt flags (ICF, OCF, and TOF) in the timer status
register (TSR)
•
Disables any further programmable timer interrupts by clearing the
timer interrupt enable bits (ICIE, OCIE, and TOIE) in the timer
control register (TCR)
•
Enables external interrupts via the IRQ/VPP pin by setting the
IRQE bit in the IRQ status and control register (ISCR). External
interrupts are also enabled via the PA0 through PA3 pins, if the
port A interrupts are enabled by the PIRQ bit in the mask option
register (MOR).
•
Enables interrupts in general by clearing the I bit in the condition
code register
The STOP instruction does not affect any other bits, registers, or I/O
lines.
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The following conditions bring the MCU out of stop mode:
•
An external interrupt signal on the IRQ/VPP pin — A high-to-low
transition on the IRQ/VPP pin loads the program counter with the
contents of locations $1FFA and $1FFB.
•
An external interrupt signal on a port A external interrupt pin — If
selected by the PIRQ bit in the MOR, a low-to-high transition on a
PA3–PA0 pin loads the program counter with the contents of
locations $1FFA and $1FFB.
•
External reset — A logic 0 on the RESET pin resets the MCU and
loads the program counter with the contents of locations $1FFE
and $1FFF.
When the MCU exits stop mode, processing resumes after a
stabilization delay of 16 or 4064 internal bus cycles, depending on the
state of the DELAY bit in the MOR.
NOTE:
Execution of the STOP instruction without setting the SWAIT bit in the
MOR will cause the oscillators to stop, and, therefore, disable the COP
watchdog timer. If the COP watchdog timer is to be used, stop mode
should be changed to halt mode as described in 6.4.3 Halt Mode.
6.4.2 Wait Mode
The WAIT instruction puts the MCU in a low-power wait mode which
consumes more power than the stop mode and affects the MCU as
follows:
•
Enables interrupts by clearing the I bit in the condition code
register
•
Enables external interrupts by setting the IRQE bit in the IRQ
status and control register
•
Stops the CPU clock which drives the address and data buses, but
allows the selected oscillator to continue to clock the core timer,
programmable timer, analog subsystem, and SIOP
The WAIT instruction does not affect any other bits, registers, or I/O
lines.
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Low-Power Modes
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These conditions restart the CPU bus clock and bring the MCU out of
wait mode:
•
An external interrupt signal on the IRQ/VPP pin — A high-to-low
transition on the IRQ/VPP pin loads the program counter with the
contents of locations $1FFA and $1FFB.
•
An external interrupt signal on a port A external interrupt pin — If
selected by PIRQ bit in the MOR, a low-to-high transition on a
PA3–PA0 pin loads the program counter with the contents of
locations $1FFA and $1FFB.
•
A core timer interrupt — A core timer overflow or a real-time
interrupt loads the program counter with the contents of locations
$1FF8 and $1FF9.
•
A programmable timer interrupt — A programmable timer interrupt
driven by an input capture, output compare, or timer overflow
loads the program counter with the contents of locations $1FF6
and $1FF7.
•
An SIOP interrupt — An SIOP interrupt driven by the completion
of transmitted or received 8-bit data loads the program counter
with the contents of locations $1FF4 and $1FF5.
•
An analog subsystem interrupt — An analog subsystem interrupt
driven by a voltage comparison loads the program counter with
the contents of locations $1FF2 and $1FF3.
•
A COP watchdog reset — A timeout of the COP watchdog resets
the MCU and loads the program counter with the contents of
locations $1FFE and $1FFF. Software can enable real-time
interrupts so that the MCU can periodically exit the wait mode to
reset the COP watchdog.
•
An external reset — A logic 0 on the RESET pin resets the MCU
and loads the program counter with the contents of locations
$1FFE and $1FFF.
When the MCU exits the wait mode, there is no delay before code
executes like occurs when exiting the stop or halt modes.
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6.4.3 Halt Mode
The STOP instruction puts the MCU in halt mode if selected by the
SWAIT bit in the MOR. Halt mode is identical to wait mode, except that
a variable recovery delay occurs when the MCU exits halt mode. A
recovery time of from 1 to 16 or from 1 to 4064 internal bus cycles can
be selected by the DELAY bit in the MOR.
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If the SWAIT bit is set in the MOR to put the MCU in halt mode, the COP
watchdog cannot be turned off inadvertently by a STOP instruction.
6.4.4 Data-Retention Mode
In the data-retention mode, the MCU retains random-access memory
(RAM) contents and CPU register contents at VDD voltages as low as 2.0
Vdc. The data retention feature allows the MCU to remain in a low-power
consumption state during which it retains data, but the CPU cannot
execute instructions. Current consumption in this mode is not tested.
To put the MCU in the data retention mode:
1. Drive the RESET pin to a logic 0.
2. Lower the VDD voltage. The RESET pin must remain low
continuously during data retention mode.
To take the MCU out of the data retention mode:
1. Return VDD to normal operating voltage.
2. Return the RESET pin to a logic 1.
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Section 7. Parallel Input/Output
7.1 Contents
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7.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
7.3
Port A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
7.3.1
Port A Data Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
7.3.2
Data Direction Register A. . . . . . . . . . . . . . . . . . . . . . . . . . . 86
7.3.3
Pulldown Register A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
7.3.4
Port A External Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
7.3.5
Port A Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
7.4
Port B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
7.4.1
Port B Data Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
7.4.2
Data Direction Register B. . . . . . . . . . . . . . . . . . . . . . . . . . . 91
7.4.3
Pulldown Register B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
7.4.4
Port B Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
7.4.5
PB0, PBI, PB2, and PB3 Logic. . . . . . . . . . . . . . . . . . . . . . .93
7.4.6
PB4/AN4/TCMP/CMP1 Logic. . . . . . . . . . . . . . . . . . . . . . . . 94
7.4.7
PB5/SDO Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .96
7.4.8
PB6/SDI Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98
7.4.9
PB7/SCK Logic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
7.5
Port C (28-Pin Versions Only) . . . . . . . . . . . . . . . . . . . . . . . . 101
7.5.1
Port C Data Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
7.5.2
Data Direction Register C. . . . . . . . . . . . . . . . . . . . . . . . . . 102
7.5.3
Port C Pulldown Devices . . . . . . . . . . . . . . . . . . . . . . . . . .103
7.5.4
Port C Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
7.6
Port Transitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .105
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7.2 Introduction
Freescale Semiconductor, Inc...
The MC68HC705JJ7 has 14 bidirectional input/output (I/O) pins which
form two parallel I/O ports, A and B. The MC68HC705JP7 has
22 bidirectional I/O pins which form three parallel I/O ports, A, B and C.
Each I/O pin is programmable as an input or an output. The contents of
the data direction registers determine the data direction of each of the
I/O pins. All I/O pins have software programmable pulldown devices
which can be enabled or disabled globally by the SWPDI bit in the mask
option register (MOR).
7.3 Port A
Port A is a 6-bit, general-purpose, bidirectional I/O port with these
features:
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•
Individual programmable pulldown devices
•
High current sinking capability on all port A pins, with a maximum
total for port A
•
High current sourcing capability on all port A pins, with a maximum
total for port A
•
External interrupt capability (pins PA3–PA0)
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Port A
7.3.1 Port A Data Register
The port A data register (PORTA) contains a bit for each of the port A
pins. When a port A pin is programmed to be an output, the state of its
data register bit determines the state of the output pin. When a port A pin
is programmed to be an input, reading the port A data register returns
the logic state of the pin. The upper two bits of the port A data register
will always read as logic 0s.
Freescale Semiconductor, Inc...
Address:
Read:
$0000
Bit 7
6
0
0
5
4
3
2
1
Bit 0
PA5
PA4
PA3
PA2
PA1
PA0
KYBD2
KYBD1
KYBD0
Write:
Reset:
Unaffected by reset
Alternate:
KYBD3
= Unimplemented
Figure 7-1. Port A Data Register (PORTA)
PA5–PA0 — Port A Data Bits
These read/write bits are software programmable. Data direction of
each bit is under the control of the corresponding bit in the port A data
direction register (DDRA). Reset has no effect on port A data.
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7.3.2 Data Direction Register A
Freescale Semiconductor, Inc...
The contents of the port A data direction register (DDRA) determine
whether each port A pin is an input or an output. Writing a logic 1 to a
DDRA bit enables the output buffer for the associated port A pin. A
DDRA bit set to a logic 1 also disables the pulldown device for that pin.
Writing a logic 0 to a DDRA bit disables the output buffer for the
associated port A pin. The upper two bits always read as logic 0s. A reset
initializes all DDRA bits to logic 0s, configuring all port A pins as inputs
and disabling the voltage comparators from driving PA4 or PA5.
Address:
Read:
$0004
Bit 7
6
0
0
5
4
3
2
1
Bit 0
DDRA5
DDRA4
DDRA3
DDRA2
DDRA1
DDRA0
0
0
0
0
0
0
Write:
Reset:
0
0
= Unimplemented
Figure 7-2. Data Direction Register A (DDRA)
DDRA5–DDRA0 — Port A Data Direction Bits
These read/write bits control port A data direction. Reset clears the
DDRA5–DDRA0 bits.
1 = Corresponding port A pin configured as output and pulldown
device disabled
0 = Corresponding port A pin configured as input
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Port A
7.3.3 Pulldown Register A
Freescale Semiconductor, Inc...
All port A pins can have software programmable pulldown devices
enabled or disabled globally by SWPDI bit in the MOR. These pulldown
devices are controlled by the write-only pulldown register A (PDRA)
shown in Figure 7-3. Clearing the PDIA5–PDIA0 bits in the PDRA turns
on the pulldown devices if the port A pin is an input. Reading the PDRA
returns undefined results since it is a write-only register; therefore, do
not change the value in PDRA with read/modify/write instructions. On
the MC68HC705JP7 the PDRA contains two pulldown control bits
(PDICH and PDICL) for port C. Reset clears the PDIA5–PDIA0, PDICH,
and PDICL bits, which turns on all the port A and port C pulldown
devices.
Address:
$0010
Bit 7
6
5
4
3
2
1
Bit 0
Write:
PDICH
PDICL
PDIA5
PDIA4
PDIA3
PDIA2
PDIA1
PDIA0
Reset:
0
0
0
0
0
0
0
0
Read:
= Unimplemented
Figure 7-3. Pulldown Register A (PDRA)
PDICH — Upper Port C Pulldown Inhibit Bits (MC68HC705JP7)
Writing to this write-only bit controls the port C pulldown devices on
the upper four bits (PC4–PC7). Reading these pulldown register A
bits returns undefined data. Reset clears bit PDICH.
1 = Upper four port C pins pulldown devices turned off
0 = Upper four port C pins pulldown devices turned on if pin has
been programmed by the DDRC to be an input
PDICL — Lower Port C Pulldown Inhibit Bits (MC68HC705JP7)
Writing to this write-only bit controls the port C pulldown devices on
the lower four bits (PC0–PC3). Reading these pulldown register A bits
returns undefined data. Reset clears bit PDICL.
1 = Lower four port C pins pulldown devices turned off
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0 = Lower four port C pins pulldown devices turned on if pin has
been programmed by the DDRC to be an input
Freescale Semiconductor, Inc...
PDIA5–PDIA0 — Port A Pulldown Inhibit Bits
Writing to these write-only bits controls the port A pulldown devices.
Reading these pulldown register A bits returns undefined data. Reset
clears bits PDIA5–PDIA0.
1 = Corresponding port A pin pulldown device turned off
0 = Corresponding port A pin pulldown device turned on if pin has
been programmed by the DDRA to be an input
7.3.4 Port A External Interrupts
The PIRQ bit in the MOR enables the PA3–PA0 pins to serve as external
interrupt pins in addition to the IRQ/VPP pin. The active interrupt state for
the PA3–PA0 pins is a logic 1 or a rising edge. A state of the PIRQ bit in
the MOR determines whether external interrupt inputs are
edge-sensitive only or both edge- and level-sensitive. Port A interrupts
are also interactive with each other and the IRQ/VPP pin as described in
4.6 External Interrupts.
NOTE:
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When testing for external interrupts, the BIH and BIL instructions test the
voltage on the IRQ/VPP pin, not the state of the internal IRQ signal.
Therefore, BIH and BIL cannot test the port A external interrupt pins.
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Port A
7.3.5 Port A Logic
The data latch can always be written, regardless of the state of its DDR
bits. Table 7-1 summarizes the operations of the port A pins.
EXTERNAL
INTERRUPT
REQUEST
(PA0:3)
READ $0004
WRITE $0004
R
INTERNAL DATA BUS
DATA DIRECTION
REGISTER A
BIT DDRAx
PORT A DATA
REGISTER
BIT PAx
WRITE $0000
PAx
HIGH SINK/SOURCE
CURRENT
CAPABILITY
READ $0000
WRITE $0010
R
PULLDOWN
REGISTER A
BIT PDIAx
PULLDOWN
DEVICE
SWPDI
Freescale Semiconductor, Inc...
When a PA0:PA5 pin is programmed as an output, reading the port bit
actually reads the value of the data latch and not the voltage on the pin
itself. When a PA0:PA5 pin is programmed as an input, reading the port
bit reads the voltage level on the pin. The data latch can always be
written, regardless of the state of its DDR bit. Figure 7-4 shows the I/O
logic of PA0–PA5 pins of port A.
RESET
MASK OPTION REG. ($1FF1)
Figure 7-4. Port A I/O Circuit
Table 7-1. Port A Pin Functions
Port A
Pin(s)
SWPDI
(in MOR)
PA0
PA1
PA2
PA3
PA4
PA5
PORTA Access
(Pin or Data Register)
Port A
Result on
Port A Pins
PDIAx
DDRAx(1)
Read
Write
Pulldown
Pin
0
0
0
Pin
Data
On
PAx in
0
1
0
Pin
Data
Off
PAx in
1
X
0
Pin
Data
Off
PAx in
X(2)
X(2)
1
Data
Data
Off
PAx out
1. DDRA can always be read or written.
2. Don’t care
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7.4 Port B
Freescale Semiconductor, Inc...
Port B is an 8-bit, general-purpose, bidirectional I/O port with these
features:
•
Programmable pulldown devices
•
PB0–PB4 are shared with the analog subsystem.
•
PB3 and PB4 are shared with the 16-bit programmable timer.
•
PB4 can be driven directly by the output of comparator 1.
•
PB5–PB7 are shared with the simple serial interface (SIOP).
•
High current sinking capability on the PB4 pin
•
High current sourcing capability on the PB4 pin
7.4.1 Port B Data Register
The port B data register (PORTB) contains a bit for each of the port B
pins. When a port B pin is programmed to be an output, the state of its
data register bit determines the state of the output pin. When a port B pin
is programmed to be an input, reading the port B data register returns
the logic state of the pin. Reset has no effect on port B data.
Address:
Read:
Write:
$0001
Bit 7
6
5
4
3
2
1
Bit 0
PB7
PB6
PB5
PB4
PB3
PB2
PB1
PB0
Reset:
Unaffected by reset
Alternate:
SCK
SDI
SDO
AN4
AN3
AN2
AN1
AN0
Alternate:
SCK
SDI
SDO
TCMP
TCAP
AN2
AN1
AN0
Alternate:
SCK
SDI
SDO
CMP1
TCAP
AN2
AN1
AN0
Figure 7-5. Port B Data Register (PORTB)
PB0-PB7 — Port B Data Bits
These read/write bits are software programmable. Data direction of
each bit is under the control of the corresponding bit in data direction
register B. Reset has no effect on port B data.
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Port B
7.4.2 Data Direction Register B
The contents of the port B data direction register (DDRB) determine
whether each port B pin is an input or an output. Writing a logic 1 to a
DDRB bit enables the output buffer for the associated port B pin. A
DDRB bit set to a logic 1 also disables the pulldown device for that pin.
Writing a logic 0 to a DDRB bit disables the output buffer for the
associated port B pin. A reset initializes all DDRB bits to logic 0s,
configuring all port B pins as inputs.
Freescale Semiconductor, Inc...
Address:
$0005
Bit 7
6
5
4
3
2
1
Bit 0
DDRB7
DDRB6
DDRB5
DDRB4
DDRB3
DDRB2
DDRB1
DDRB0
0
0
0
0
0
0
0
0
Read:
Write:
Reset:
Figure 7-6. Data Direction Register B (DDRB)
DDRB7–DDRB0 — Port B Data Direction Bits
These read/write bits control port B data direction. Reset clears the
bits DDRB7–DDRB0.
1 = Corresponding port B pin configured as output and pulldown
device disabled
0 = Corresponding port B pin configured as input
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7.4.3 Pulldown Register B
Freescale Semiconductor, Inc...
All port B pins can have software programmable pulldown devices
enabled or disabled globally by the SWPDI bit in the MOR. These
pulldown devices are individually controlled by the write-only pulldown
register B (PDRB) shown in Figure 7-7. Clearing the PDIB7–PDIB0 bits
in the PDRB turns on the pulldown devices if the port B pin is an input.
Reading the PDRB returns undefined results since it is a write-only
register. Reset clears the PDIB7–PDIB0 bits, which turns on all the port
B pulldown devices.
Address:
$0011
Bit 7
6
5
4
3
2
1
Bit 0
Write:
PDIB7
PDIB6
PDIB5
PDIB4
PDIB3
PDIB2
PDIB1
DIB0
Reset:
0
0
0
0
0
0
0
0
Read:
= Unimplemented
Figure 7-7. Pulldown Register B (PDRB)
PDIB7–PDIB0 — Port B Pulldown Inhibit Bits
Writing to these write-only bits controls the port B pulldown devices.
Reading these pulldown register B bits returns undefined data. Reset
clears bits PDIB7–PDIB0.
1 = Corresponding port B pin pulldown device turned off
0 = Corresponding port B pin pulldown device turned on if pin has
been programmed by the DDRB to be an input
7.4.4 Port B Logic
All port B pins have the general I/O port logic similar to port A; but they
also share this function with inputs or outputs from other modules, which
are also attached to the pin itself or override the general I/O function.
PB0, PB1, PB2, and PB3 simply share their inputs with another module.
PB4, PB5, PB6, and PB7 will have their operation altered by outputs or
controls from other modules.
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Port B
7.4.5 PB0, PBI, PB2, and PB3 Logic
READ $0005
WRITE $0005
R
ANALOG SUBSYSTEM,
AND PROGRAMMABLE
TIMER INPUT CAPTURE
(PINS PB0, PB1, PB2, PB3)
DATA DIRECTION
REGISTER B
BIT DDRBx
PORT BDATA
REGISTER
BIT PBx
WRITE $0001
PBx
READ $0001
WRITE $0011
R
PULLDOWN
REGISTER B
BIT PDIBx
RESET
PULLDOWN
DEVICE
SWPDI
INTERNAL DATA BUS
Freescale Semiconductor, Inc...
The typical I/O logic shown in Figure 7-8 is used for PB0, PB1, PB2, and
PB3 pins of port B. When these port B pins are programmed as an
output, reading the port bit actually reads the value of the data latch and
not the voltage on the pin itself. When these port B pins are programmed
as an input, reading the port bit reads the voltage level on the pin. The
data latch can always be written, regardless of the state of its DDRB bit.
The operations of the PB0–PB3 pins are summarized in Table 7-2.
MASK OPTION REG. ($1FF1)
Figure 7-8. PB0–PB3 Pin I/O Circuit
The PB0–PB3 pins share their inputs with another module. When using
the other attached module, these conditions must be observed:
1. If the DDRB configures the pin as an output, then the port data
register can provide an output which may conflict with any external
input source to the other module. The pulldown device will be
disabled in this case.
2. If the DDRB configures the pin as an input, then reading the port
data register will return the state of the input in terms of the digital
threshold for that pin (analog inputs will default to logic states).
3. If DDRB configures the pin as an input and the pulldown device is
activated for a pin, it will also load the input to the other module.
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4. If interaction between the port logic and the other module is not
desired, the pin should be configured as an input by clearing the
appropriate DDRB bit. The input pulldown device is disabled by
clearing the appropriate PDRB bit (or by disabling programmable
pulldowns with the SWPDI bit in the MOR).
7.4.6 PB4/AN4/TCMP/CMP1 Logic
Freescale Semiconductor, Inc...
The PB4/AN4/TCMP/CMP1 pin can be used as a simple I/O port pin, be
controlled by the OLVL bit from the output compare function of the 16-bit
programmable timer, or be controlled directly by the output of
comparator 1 as shown in Figure 7-9. The PB4 data, the programmable
timer OLVL bit, and the output of comparator 1 are all logically ORed
together to drive the pin. Also, the analog subsystem input channel 4
multiplexer is connected directly to this pin. The operations of PB4 pin
are summarized in Table 7-2.
ANALOG SUBSYSTEM
INPUT AN4 AND
TIMER OUTPUT COMPARE
READ $0005
WRITE $0005
INTERNAL DATA BUS
R
DATA DIRECTION
REGISTER B
BIT DDRB4
PORT BDATA
REGISTER
BIT PB4
WRITE $0001
PB4
AN4
TCMP
OLVL
(TIMER OUTPUT COMPARE)
HIGH SINK/
SOURCE CURRENT
CAPABILITY
CMP1
(COMPARATOR 1 OUT)
READ $0001
R
PULLDOWN
REGISTER B
BIT PDIB4
PULLDOWN
DEVICE
SWPDI
WRITE $0011
RESET
OPT
MASK OPTION REG. ($1FF1)
COP REGISTER ($1FF0)
Figure 7-9. PB4/AN4/TCMP/CMP1 Pin I/O Circuit
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Port B
When using the PB4/AN4/TCMP/CMP1 pin, these interactions must be
noted:
Freescale Semiconductor, Inc...
1. If the OLVL timer output compare function is the required output
function, then the DDRB4 bit must be set, the PB4 data bit must
be cleared, and the OPT bit in the COPR must be cleared. The
PB4/AN4/TCMP/CMP1 pin becomes an output which follows the
state of the OLVL bit. The pulldown device will be disabled in this
case. The analog subsystem would not normally use this pin as an
analog input in this case.
2. If the PB4 data bit is the required output function, then the DDRB4
bit must be set, the OLVL bit in the TCR must be cleared, and the
OPT bit in the COPR must be cleared. The pulldown device will be
disabled in this case. The analog subsystem would not normally
use this pin as an analog input in this case.
3. If the comparator 1 output is the desired output function, then the
PB4 data bit must be cleared, the DDRB4 bit must be set, the
OLVL bit in the TCR must be cleared, and the OPT bit in the
COPR must be set. The PB4/AN4/TCMP/CMP1 pin becomes an
output which follows the state of the OLVL bit. The pulldown
device will be disabled in this case. The analog subsystem would
not normally use this pin as an analog input in this case.
4. If the PB4 pin is to be an input to the analog subsystem or a digital
input, then the DDRB4 bit must be cleared. In this case, the PB4
pin can still be read, but the voltage present will be returned as a
binary value. Depending on the external application, the PB4
pulldown may also be disabled by setting the PDIB4 pulldown
inhibit bit. In this case, both the digital and analog functions
connected to this pin can be utilized.
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.
Table 7-2. Port B Pin Functions — PB0–PB4
Control Bits
Port B
Pin
Comparator 1
Timer
CMP1 COE1 OPT in COPR OLVL
Freescale Semiconductor, Inc...
PB0
PB1
PB2
PB3
X(2)
X(2)
PB4
X(2)
X(2)
X(2)
X(2)
X(2)
X(2)
SWPDI
in MOR
Port B
PDIBx DDRBx(1)
PORTB Access
(Pin or Data
Register)
Read
Result on
Port B Pins
Write Pulldown
Pin
0
0
0
Pin
Data
On
PBx in
0
1
0
Pin
Data
Off
PBx in
1
X(2)
0
Pin
Data
Off
PBx in
X(2)
X(2)
1
Data
Data
Off
PBx out
0
0
0
Pin
Data
On
PB4 in
0
1
0
Pin
Data
Off
PB4 in
1
X(2)
0
Pin
Data
Off
PB4 in
X(2)
X(2)
0
0
X(2)
X(2)
1
Data
Data
Off
PB4 out
X(2)
0
1
0
X(2)
X(2)
1
Data
Data
Off
PB4 out
0
1
1
0
X(2)
X(2)
1
Data
Data
Off
PB4 out
X(2)
X(2)
X(2)
1
X(2)
X(2)
1
1
Data
Off
1
1
1
1
X(2)
X(2)
X(2)
1
1
Data
Off
1
1. DDRB can always be read or written.
2. Don’t care
7.4.7 PB5/SDO Logic
The PB5/SDO pin can be used as a simple I/O port pin or be controlled
by the SIOP serial interface as shown in Figure 7-10. The operations of
the PB5 pin are summarized in Table 7-3.
When using the PB5/SDO pin, these interactions must be noted:
1. If the SIOP function is required, then the SPE bit in the SCR must
be set. This causes the PB5/SDO pin buffer to be enabled and to
be driven by the serial data output (SDO) from the SIOP. The
pulldown device will be disabled in this case.
2. If the SIOP function is in control of the PB5/SDO pin, the DDRB5
and PB5 data register bits are still accessible to the CPU and can
be altered or read without affecting the SIOP functionality.
However, if the DDRB5 bit is cleared, reading the PB5 data
register will return the current state of the PB5/SDO pin.
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Port B
SERIAL DATA OUT (SDO)
SERIAL ENABLE (SPE)
VDD
READ $0005
WRITE $0005
INTERNAL DATA BUS
PORT B DATA
REGISTER
BIT PB5
WRITE $0001
PB5
SDO
READ $0001
WRITE $0011
R
PULLDOWN
REGISTER B
BIT PDIB5
RESET
PULLDOWN
DEVICE
SWPDI
Freescale Semiconductor, Inc...
R
DATA DIRECTION
REGISTER B
BIT DDRB5
MASK OPTION REG. ($1FF1)
Figure 7-10. PB5/SDO Pin I/O Circuit
3. If the SIOP function is terminated by clearing the SPE bit in the
SCR, then the last conditions stored in the DDRB5, PDIB5, and
PB5 register bits will then control the PB5/SDO pin.
4. If the PB5/SDO pin is to be a digital input, then both the SPE bit in
the SCR and the DDRB5 bit must be cleared. Depending on the
external application, the pulldown device may also be disabled by
setting the PDIB5 pulldown inhibit bit.
5. If the PB5/SDO pin is to be a digital output, then the SPE bit in the
SCR must be cleared and the PDIB5 bit must be set. The pulldown
device will be disabled in this case.
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7.4.8 PB6/SDI Logic
The PB6/SDI pin can be used as a simple I/O port pin or be controlled
by the SIOP serial interface as shown in Figure 7-11. The operations of
PB6/SDI pin are summarized in Table 7-3.
SERIAL DATA IN (SDI)
SERIAL ENABLE (SPE)
READ $0005
Freescale Semiconductor, Inc...
WRITE $0005
INTERNAL DATA BUS
R
DATA DIRECTION
REGISTER B
BIT DDRB6
PORT B DATA
REGISTER
BIT PB6
WRITE $0001
PB6
SDI
READ $0001
WRITE $0011
PULLDOWN
DEVICE
SWPDI
R
RESET
PULLDOWN
REGISTER B
BIT PDIB6
MASK OPTION REG. ($1FF1)
Figure 7-11. PB6/SDI Pin I/O Circuit
When using the PB6/SDI pin, these interactions must be noted:
1. If the SIOP function is required, then the SPE bit in the SCR must
be set. This causes the PB6/SDI pin buffer to be disabled to allow
the PB6/SDI pin to act as an input that feeds the serial data input
(SDI) of the SIOP. The pulldown device is disabled in this case.
2. If the SIOP function is in control of the PB6/SDI pin, the DDRB6
and PB6 data register bits are still accessible to the CPU and can
be altered or read without affecting the SIOP functionality.
However, if the DDRB6 bit is cleared, reading the PB6 data
register will return the current state of the PB6/SDI pin.
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Port B
3. If the SIOP function is terminated by clearing the SPE bit in the
SCR, then the last conditions stored in the DDRB6, PDIB6, and
PB6 register bits will then control the PB6/SDI pin.
5. If the PB6/SDI pin is to be a digital output, then the SPE bit in the
SCR must be cleared and the DDRB6 bit must be set. The
pulldown device will be disabled in this case.
7.4.9 PB7/SCK Logic
The PB7/SCK pin can be used as a simple I/O port pin or be controlled
by the SIOP serial interface as shown in Figure 7-12. The operations of
the PB7/SCK pin are summarized in Table 7-3.
SERIAL DATA CLOCK (SCK)
CLOCK SOURCE (MSTR)
SERIAL ENABLE (SPE)
READ $0005
WRITE $0005
INTERNAL DATA BUS
R
DATA DIRECTION
REGISTER B
BIT DDRB7
PORT B DATA
REGISTER
BIT PB7
WRITE $0001
PB7
SCK
READ $0001
WRITE $0011
R
PULLDOWN
REGISTER B
BIT PDIB7
RESET
PULLDOWN
DEVICE
SWPDI
Freescale Semiconductor, Inc...
4. If the PB6/SDI pin is to be a digital input, then both the SPE bit in
the SCR and the DDRB6 bit must be cleared. Depending on the
external application, the pulldown device may also be disabled by
setting the PDIB6 pulldown inhibit bit.
MASK OPTION REG. ($1FF1)
Figure 7-12. PB7/SCK Pin I/O Circuit
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When using the PB7/SCK pin, these interactions must be noted:
1. If the SIOP function is required, then the SPE bit in the SCR must
be set. This causes the PB7/SCK pin buffer to be controlled by the
MSTR control bit in the SCR. The pulldown device is disabled in
these cases.
a. If the MSTR bit is set, then the PB7/SCK pin buffer will be
enabled and driven by the serial data clock (SCK) from the
SIOP.
Freescale Semiconductor, Inc...
b. If the MSTR bit is clear, then the PB7/SCK pin buffer will be
disabled, allowing the PB7/SCK pin to drive the serial data
clock (SCK) into the SIOP.
2. If the SIOP function is in control of the PB7/SCK pin, the DDRB7
and PB7 data register bits are still accessible to the CPU and can
be altered or read without affecting the SIOP functionality.
However, if the DDRB7 bit is cleared, reading the PB7 data
register will return the current state of the PB7/SCK pin.
3. If the SIOP function is terminated by clearing the SPE bit in the
SCR, then the last conditions stored in the DDRB7, PDIB7, and
PB7 register bits will then control the PB7/SCK pin.
4. If the PB7/SCK pin is to be a digital input, then both the SPE bit in
the SCR and the DDRB7 bit must be cleared. Depending on the
external application, the pulldown device may also be disabled by
setting the PDIB7 pulldown inhibit bit.
5. If the PB7/SCK pin is to be a digital output, then the SPE bit in the
SCR must be cleared and the DDRB7 bit must be set. The
pulldown device will be disabled when the pin is set as an output.
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Parallel Input/Output
Port C (28-Pin Versions Only)
Table 7-3. Port B Pin Functions — PB5–PB7
Control Bits
Port B
Pin
SIOP
SPE
0
MSTR
X(2)
Freescale Semiconductor, Inc...
PB5
1
0
X(2)
X(2)
PB6
1
0
X(2)
X(2)
SWPDI
in MOR
Port B
Result on
Port B Pins
PDIBx
DDRBx(1)
Read
Write
Pulldown
Pin
0
0
0
Pin
Data
On
PB5 in
0
1
0
Pin
Data
Off
PB5 in
1
X
0
Pin
Data
Off
PB5 in
(2)
(2)
1
Data
Data
Off
PB5 out
0
SDO
Data
Off
SDO out
1
Data
Data
Off
SDO out
X
X
X(2)
X(2)
0
0
0
Pin
Data
On
PB6 in
0
1
0
Pin
Data
Off
PB6 in
1
(2)
0
Pin
Data
Off
PB6 in
X(2)
X(2)
1
Data
Data
Off
PB6 out
X(2))
X(2)
0
SDI
Data
Off
SDI in
1
Data
Data
Off
SDI in
0
0
0
Pin
Data
On
PB7 in
0
1
0
Pin
Data
Off
PB7 in
1
X(2)
0
Pin
Data
Off
PB7 in
(2)
1
Data
Data
Off
PB7 out
0
SCK
Data
Off
SCK in
1
Data
Data
Off
SCK in
0
SCK
Data
Off
SCK out
1
Data
Data
Off
SCK out
X
(2)
X
X
0
X(2)
X(2)
1
X(2)
X(2)
PB7
PORTB Access
(Pin or Data
Register)
1
1. DDRB can always be read or written.
2. Don’t care
7.5 Port C (28-Pin Versions Only)
Port C is an 8-bit, general-purpose, bidirectional I/O port with these
features:
•
Individual programmable pulldown devices
•
High current sinking capability on all port C pins, with a maximum
total for port C
•
High current sourcing capability on all port C pins, with a maximum
total for port C
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7.5.1 Port C Data Register
The port C data register (PORTC) contains a bit for each of the port C
pins. When a port C pin is programmed to be an output, the state of its
data register bit determines the state of the output pin. When a port C pin
is programmed to be an input, reading the port C data register returns
the logic state of the pin.
Freescale Semiconductor, Inc...
Address:
$0002
Bit 7
6
5
4
3
2
1
Bit 0
PC7
PC6
PC5
PC4
PC3
PC2
PC1
PC0
Read:
Write:
Reset:
Unaffected by reset
Figure 7-13. Port C Data Register (PORTC)
PC7–PC0 — Port C Data Bits
These read/write bits are software programmable. Data direction of
each bit is under the control of the corresponding bit in the port C data
direction register (DDRC). Reset has no effect on port C data.
7.5.2 Data Direction Register C
The contents of the port C data direction register (DDRC) determine
whether each port C pin is an input or an output. Writing a logic 1 to a
DDRC bit enables the output buffer for the associated port C pin. A
DDRC bit set to a logic 1 also disables the pulldown device for that pin.
Writing a logic 0 to a DDRC bit disables the output buffer for the
associated port C pin. A reset initializes all DDRC bits to logic 0s,
configuring all port C pins as inputs.
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Port C (28-Pin Versions Only)
Address:
$0006
Bit 7
6
5
4
3
2
1
Bit 0
DDRC7
DDRC6
DDRC5
DDRC4
DDRC3
DDRC2
DDRC1
DDRC0
0
0
0
0
0
0
0
0
Read:
Write:
Reset:
Figure 7-14. Data Direction Register C (DDRC)
Freescale Semiconductor, Inc...
DDRC7–DDRC0 — Port C Data Direction Bits
These read/write bits control port C data direction. Reset clears the
DDRC7–DDRC0 bits.
1 = Corresponding port C pin configured as output and pulldown
device disabled
0 = Corresponding port C pin configured as input
7.5.3 Port C Pulldown Devices
All port C pins can have software programmable pulldown devices
enabled or disabled globally by the SWPDI bit in the MOR. These
pulldown devices are individually controlled by the write-only pulldown
register A (PDRA) shown in Figure 7-3. PDICH controls the upper four
pins (PC7–PC4) and PDICL controls the lower four pins (PC3–PC0).
Clearing the PDICH or PDICL bits in the PDRA turns on the pulldown
devices if the port C pin is an input. Reading the PDRA returns undefined
results since it is a write-only register. Reset clears the PDICH and
PDICL bits, which turns on all the port C pulldown devices.
7.5.4 Port C Logic
Figure 7-15 shows the I/O logic of port C.
When a port C pin is programmed as an output, reading the port bit
actually reads the value of the data latch and not the voltage on the pin
itself. When a port C pin is programmed as an input, reading the port bit
reads the voltage level on the pin. The data latch can always be written,
regardless of the state of its DDR bit. Table 7-4 summarizes the
operations of the port C pins.
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Parallel Input/Output
READ $0006
WRITE $0006
DATA DIRECTION
REGISTER C
BIT DDRCx
INTERNAL DATA BUS
PORT C DATA
REGISTER
BIT PCx
WRITE $0002
PCx
HIGH SINK/SOURCE
CURRENT CAPABILITY
READ $0002
WRITE $0010
R
PULLDOWN
REGISTER A
BIT PDICx
PULLDOWN
DEVICE
SWPDI
Freescale Semiconductor, Inc...
R
RESET
MASK OPTION REGISTER ($1FF1)
Figure 7-15. Port C I/O Circuit
Table 7-4. Port C Pin Functions (28-Pin Versions Only)
Control Bits
Port C
Pin(s)
PC0
PC1
PC2
PC3
PC4
PC5
PC6
PC7
PORTC Access
(Pin or Data Register)
Port C
Result on
Port C Pins
SWPDI
in MOR
PDICH
PDICL
DDRCx(1)
Read
Write
Pulldown
Pin
0
X(2)
0
0
Pin
Data
On
PCx in
0
X(2)
1
0
Pin
Data
Off
PCx in
1
X
X(2)
0
Pin
Data
Off
PCx in
X(2)
X(2)
X(2)
1
Data
Data
Off
PCx out
0
0
X(2)
0
Pin
Data
On
PCx in
0
1
X(2)
0
Pin
Data
Off
PCx in
1
X
X(2)
0
Pin
Data
Off
PCx in
X(2)
X(2)
X(2)
1
Data
Data
Off
PCx out
1. DDRC can always be read or written.
2. Don’t care
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Port Transitions
7.6 Port Transitions
Freescale Semiconductor, Inc...
Glitches and temporary floating inputs can occur if the control bits
regarding each port I/O pin are not performed in the correct sequence.
•
Do not use read-modify-write instructions on pulldown register A
or B.
•
Avoid glitches on port pins by writing to the port data register
before changing data direction register bits from a logic 0 to a
logic 1.
•
Avoid a floating port input by clearing its pulldown register bit
before changing its data direction register bit from a logic 1 to a
logic 0.
•
The SWPDI bit in the MOR turns off all port pulldown devices and
disables software control of the pulldown devices. Reset has no
effect on the pulldown devices when the SWPDI bit is set.
•
Two or more output pins of the same port can be connected
electrically to provide output currents up to the sum of the
maximum specified drive currents as defined in 15.8 DC
Electrical Characteristics (5.0 Vdc) and 15.9 DC Electrical
Characteristics (3.0 Vdc). Care must be taken to ensure that all
ganged pins always maintain the same output logic value.
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Parallel Input/Output
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Section 8. Analog Subsystem
Freescale Semiconductor, Inc...
8.1 Contents
8.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 108
8.3
Analog Multiplex Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
8.4
Analog Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
8.5
Analog Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119
8.6
A/D Conversion Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
8.7
Voltage Measurement Methods . . . . . . . . . . . . . . . . . . . . . . . 132
8.7.1
Absolute Voltage Readings . . . . . . . . . . . . . . . . . . . . . . . . 133
8.7.1.1
Internal Absolute Reference . . . . . . . . . . . . . . . . . . . . . 133
8.7.1.2
External Absolute Reference . . . . . . . . . . . . . . . . . . . . . 134
8.7.2
Ratiometric Voltage Readings . . . . . . . . . . . . . . . . . . . . . . 134
8.7.2.1
Internal Ratiometric Reference . . . . . . . . . . . . . . . . . . .135
8.7.2.2
External Ratiometric Reference . . . . . . . . . . . . . . . . . . . 136
8.8
Voltage Comparator Features . . . . . . . . . . . . . . . . . . . . . . . . 136
8.8.1
Voltage Comparator 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 136
8.8.2
Voltage Comparator 2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . 137
8.9
Current Source Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
8.10
Internal Temperature Sensing Diode Features. . . . . . . . . . . . 138
8.11
Sample and Hold . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138
8.12
Port B Interaction with Analog Inputs . . . . . . . . . . . . . . . . . . .139
8.13
Port B Pins as Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
8.14
Port B Pulldowns . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 139
8.15
Noise Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140
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Analog Subsystem
8.2 Introduction
The analog subsystem of the MC68HC705JJ7/MC68HC705JP7 is
based on two on-chip voltage comparators and a selectable current
charge/discharge function as shown in Figure 8-1.
Freescale Semiconductor, Inc...
This configuration provides several features:
•
Two independent voltage comparators with external access to
both inverting and non-inverting inputs
•
One voltage comparator can be connected as a single-slope
analog-to-digital (A/D) and the other connected as a
single-voltage comparator. The possible single-slope A/D
connection provides these features:
– A/D conversions can use VDD or an external voltage as a
reference with software used to calculate ratiometric or
absolute results
– Channel access of up to four inputs via multiplexer control with
independent multiplexer control allowing mixed input
connections
– Access to VDD and VSS for calibration
– Divide by 2 to extend input voltage range
– Each comparator can be inverted to calculate input offsets.
– Internal sample and hold capacitor
– Direct digital output of comparator 1 to the PB4 pin
Voltages are resolved by measuring the time it takes an external
capacitor to charge up to the level of the unknown input voltage being
measured. The beginning of the A/D conversion time can be started by
several means:
Advance Information
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•
Output compare from the 16-bit programmable timer
•
Timer overflow from the 16-bit programmable timer
•
Direct software control via a register bit
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2 TO 1
MUX
ICF
VDD
OCF
TOF
PB3/AN3/TCAP
TCAP
ICHG
PORTB
LOGIC
CHG
CHARGE
CURRENT
CONTROL
LOGIC
ATD1
ATD2
IDISCHG
VDD
ISEN
CP2EN
+
ICEN
COMP2
–
INTERNAL
TEMPERATURE
DIODE
CP1EN
INV
CPIE
CPF1
CMP2
CMP1
VOFF
MUX1
100 MV
OFFSET
–+
PB1
AN1
$001E
PB2
AN2
CP1EN
MUX2
PORTB
LOGIC
MUX3
PB4
AN4
TCMP
MUX4
+
VSS
HOLD
COMP1
DHOLD
–
INV
VREF
INV
VREF
MUX4
MUX3
MUX2
OLVL
VAOFF
OPT (COPR)
–+
VSS
AVSS = VSS = VAOFF
PORT B
CONTROL
LOGIC
COE1
OPT (COPR)
MUX4
MUX3
MUX2
MUX1
MUX1
ANALOG
MUX REGISTER
(AMUX)
PB3
AN3
TCAP
INTERNAL HC05 BUS
SAMPLE
CAP
CPF2
ANALOG
STATUS REGISTER
(ASR)
80 kΩ
PORTB
LOGIC
COMPARATOR
INPUT SELECT AND
SAMPLE CONTROL
80 kΩ
VREF
PORTB
LOGIC
$001D
ANALOG
INTERRUPT
VDD
CHANNEL SELECT BUS
Freescale Semiconductor, Inc...
CP2EN
ANALOG
CONTROL REGISTER
(ACR)
PB0
AN0
PORTB
LOGIC
16-BIT PROG.
TIMER
Analog Subsystem
Introduction
$0003
DENOTES
INTERNAL
ANALOG VSS
Figure 8-1. Analog Subsystem Block Diagram
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Analog Subsystem
The end of the A/D conversion time can be captured by these means:
•
Input capture in the 16-bit programmable timer
•
Interrupt generated by the comparator output
•
Software polling of the comparator output using software loop time
8.3 Analog Multiplex Register
Freescale Semiconductor, Inc...
The analog multiplex register (AMUX) controls the general
interconnection and operation. The control bits in the AMUX are shown
in Figure 8-2.
Address:
$0003
Bit 7
6
5
4
3
2
1
Bit 0
HOLD
DHOLD
INV
VREF
MUX4
MUX3
MUX2
MUX1
1
0
0
0
0
0
0
0
Read:
Write:
Reset:
Figure 8-2. Analog Multiplex Register (AMUX)
HOLD, DHOLD
These read/write bits control the source connection to the negative
input of voltage comparator 2 shown in Figure 8-3. This allows the
voltage on the internal temperature sensing diode, the channel
selection bus, or the divide-by-two channel selection bus to charge
the internal sample capacitor and to also be presented to comparator
2. The decoding of these sources is given in Table 8-1.
During the hold case when both the HOLD and DHOLD bits are clear,
the VOFF bit in the analog status register (ASR) can offset the VSS
reference on the sample capacitor by approximately 100 mV. This
offset source is bypassed whenever the sample capacitor is being
charged with either the HOLD or DHOLD bit set. The VOFF bit must
be enabled by the OPT bit in the COPR at location $1FF0.
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Analog Subsystem
Analog Multiplex Register
VDD
PB0
COMP2
–
INTERNAL
TEMPERATURE
DIODE
CHANNEL
SELECTION
BUS
80 kΩ
SAMPLE
CAP
80 kΩ
VOFF
OPT (MOR)
HOLD
+
VSS
OFFSET
DHOLD
–
Freescale Semiconductor, Inc...
+
Figure 8-3. Comparator 2 Input Circuit
Table 8-1. Comparator 2 Input Sources
Case
HOLD
(AMUX)
DHOLD
(AMUX)
OPT
(MOR)
VOFF
(ASR)
0
X(1)
1
Hold
sample
voltage
0
Divide input
0
Direct input
Internal
temperature
diode
Voltage
Offset
Source To Negative Input
of Comparator 2
No
Sample capacitor connected to
comparator 2 negative input; very low leakage
current.
0
0
1
1
Yes
Sample capacitor connected to comparator 2
negative input; bottom of capacitor offset from
VSS by approximately 100 mV, very low
leakage current.
1
X(1)
X(1)
No
Signal on channel selection bus is divided
by 2 and connected to sample capacitor
and comparator 2 negative input
1
0
X(1)
X(1)
No
Signal on channel selection bus is connected
directly to sample capacitor and comparator 2
negative input.
1
1
X(1)
X(1)
No
Internal temperature sensing diode connected
directly to sample capacitor and comparator 2
negative input.
1. Don’t care
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During a reset, the HOLD bit is set and the DHOLD bit is cleared,
which connects the internal sample capacitor to the channel selection
bus. And since a reset also clears the MUX[1:4] bits, then the channel
selection bus will be connected to VSS and the internal sample
capacitor will be discharged to VSS following the reset.
Freescale Semiconductor, Inc...
NOTE:
When sampling a voltage for later conversion, the HOLD and DHOLD
bits should be cleared before making any changes in the MUX channel
selection. If the MUX channel and the HOLD/DHOLD are changed on
the same write cycle to the AMUX register, the sampled voltage may be
altered during the channel switching.
INV
This is a read/write bit that controls the relative polarity of the inherent
input offset voltage of the voltage comparators. This bit allows voltage
comparisons to be made with both polarities and then averaged
together by taking the sum of the two readings and then dividing by 2
(logical shift right).
The polarity of the input offset is reversed by interchanging the
internal voltage comparator inputs while also inverting the comparator
output. This interchange does not alter the action of the voltage
comparator output with respect to its port pins. That is, the output will
only go high if the voltage on the positive input (PB2 pin for
comparator 1 and PB0 pin for comparator 2) is above the voltage on
the respective negative input (PB3 pin for comparator 1 and PB1 pin
for comparator 2). This is shown schematically in Figure 8-4. This bit
is cleared by a reset of the device.
1 = The voltage comparators are internally inverted.
0 = The voltage comparators are not internally inverted.
NOTE:
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The effect of changing the state of the INV bit is to only change the
polarity of the input offset voltage. It does not change the output phase
of the CPF1 or CPF2 flags with respect to the external port pins.
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Analog Multiplex Register
RISE
WHEN
V+ > V–
V+
VIO
V+
+
COMP
–
VIO
+
COMP
–
V–
V–
INV = 0
Freescale Semiconductor, Inc...
RISE
WHEN
V+ > V–
INV = 1
Figure 8-4. INV Bit Action
NOTE:
Either comparator may generate an output flag when the inputs are
exchanged due to a change in the state of the INV bit. It is therefore
recommended that the INV bit not be changed while waiting for a
comparator flag. Further, any changes to the state of the INV bit should
be followed by writing a logic 1 to both the CPFR1 and CPFR2 bits to
clear any extraneous CPF1 or CPF2 flags that may have occurred.
VREF
This read/write bit connects the channel select bus to VDD for making
a reference voltage measurement. It cannot be selected if any of the
other input sources to the channel select bus are selected as shown
in Table 8-2. This bit is cleared by a reset of the device.
1 = Channel select bus connected to VDD if all MUX1:4 are cleared.
0 = Channel select bus cannot be connected to VDD.
MUX1:4
These are read/write bits that connect the analog subsystem pins to
the channel select bus and voltage comparator 2 for purposes of
making a voltage measurement. They can be selected individually or
combined with any of the other input sources to the channel select
bus as shown in Table 8-2.
NOTE:
The VAOFF voltage source shown in Figure 8-1 depicts a small offset
voltage generated by the total chip current passing through the package
bond wires and lead frame that are attached to the single VSS pin. This
offset raises the internal VSS reference (AVSS) in the analog subsystem
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with respect to the external VSS pin. Turning on the VSS MUX to the
channel select bus connects it to this internal AVSS reference line.
Freescale Semiconductor, Inc...
When making A/D conversions, this AVSS offset gets placed on the
external ramping capacitor since the discharge device on the PB0/AN0
pin discharges the external capacitor to the internal AVSS line. Under
these circumstances, the positive input (+) to comparator 2 will always
be higher than the negative input (–) until the negative input reaches the
AVSS offset voltage plus any offset in comparator 2.
Therefore, input voltages cannot be resolved if they are less than the
sum of the AVSS offset and the comparator offset, because they will
always yield a low output from the comparator.
Table 8-2. Channel Select Bus Combinations
Analog Multiplex Register
Channel Select Bus Connected to:
VREF
MUX4
MUX3
MUX2
MUX1
VDD
PB4/AN4/
TCMP
PB3/AN3/
TCAP
PB2/AN2
PB1/AN1
VSS
0
0
0
0
0
Hi-Z
Hi-Z
Hi-Z
Hi-Z
Hi-Z
On
X(1)
0
0
0
1
Hi-Z
Hi-Z
Hi-Z
Hi-Z
On
Hi-Z
X(1)
0
0
1
0
Hi-Z
Hi-Z
Hi-Z
On
Hi-Z
Hi-Z
X(1)
0
0
1
1
Hi-Z
Hi-Z
Hi-Z
On
On
Hi-Z
X(1)
0
1
0
0
Hi-Z
Hi-Z
On
Hi-Z
Hi-Z
Hi-Z
X(1)
0
1
0
1
Hi-Z
Hi-Z
On
Hi-Z
On
Hi-Z
X(1)
0
1
1
0
Hi-Z
Hi-Z
On
On
Hi-Z
Hi-Z
X(1)
0
1
1
1
Hi-Z
Hi-Z
On
On
On
Hi-Z
X(1)
1
0
0
0
Hi-Z
On
Hi-Z
Hi-Z
Hi-Z
Hi-Z
X(1)
1
0
0
1
Hi-Z
On
Hi-Z
Hi-Z
On
Hi-Z
X(1)
1
0
1
0
Hi-Z
On
Hi-Z
On
Hi-Z
Hi-Z
X(1)
1
0
1
1
Hi-Z
On
Hi-Z
On
On
Hi-Z
X(1)
1
1
0
0
Hi-Z
On
On
Hi-Z
Hi-Z
Hi-Z
X(1)
1
1
0
1
Hi-Z
On
On
Hi-Z
On
Hi-Z
X(1)
1
1
1
0
Hi-Z
On
On
On
Hi-Z
Hi-Z
X(1)
1
1
1
1
Hi Z
On
On
On
On
Hi Z
1. Don/t care
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Analog Subsystem
Analog Control Register
8.4 Analog Control Register
Freescale Semiconductor, Inc...
The analog control register (ACR) controls the power-up, interrupt, and
flag operation. The analog subsystem draws current while it is operating.
The resulting power consumption can be reduced by powering down the
analog subsystem when not in use (refer to 15.6 Supply Current
Characteristics (VDD = 4.5 to 5.5 Vdc)). This can be done by clearing
three enable bits (ISEN, CP1EN, and CP2EN) in the ACR at $001D.
Since these bits are cleared following a reset, the voltage comparators
and the charge current source will be powered down following a reset of
the device.
The control bits in the ACR are shown in Figure 8-5. All the bits in this
register are cleared by a reset of the device.
Address:
Read:
Write:
Reset:
$001D
Bit 7
6
5
4
3
2
1
Bit 0
CHG
ATD2
ATD1
ICEN
CPIE
CP2EN
CP1EN
ISEN
0
0
0
0
0
0
0
0
Figure 8-5. Analog Control Register (ACR)
CHG
The CHG enable bit allows direct control of the charge current source
and the discharge device and also reflects the state of the discharge
device. This bit is cleared by a reset of the device.
1 = If the ISEN bit is also set, the charge current source is sourcing
current out of the PB0/AN0 pin. Writing a logic 1 enables the
charging current out of the PB0/AN0 pin.
0 = The discharge device is sinking current into the PB0/AN0 pin.
Writing a logic 0 disables the charging current and enables the
discharging current into the PB0/AN0 pin, if the ISEN bit is also
set.
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ATD1–ATD2
The ATD1–ATD2 enable bits select one of the four operating modes
used for making A/D conversions via the single-slope method.These
four modes are given in Table 8-3. These bits have no effect if the
ISEN enable bit is cleared. These bits are cleared by a reset of the
device and thereby return the analog subsystem to the manual A/D
conversion method.
Freescale Semiconductor, Inc...
Table 8-3. A/D Conversion Options
A/D
Option
Mode
Charge
Control
Disabled
Current
source and
discharge
disabled
3
Automatic
charge and
discharge
(OCF–ICF)
synchronized
to timer
A/D Options
ISEN
0
ATD2 ATD1
X
CHG
X
Current Flow
to/from PB0/AN0
X
Current control disabled,
no source or sink current
1
0
0
1
Begin sourcing current
when the CHG bit is set
and continue to source
current until the CHG bit
is cleared.
1
1
0
1
The CHG bit remains set
until the next time ICF
occurs.
1
1
1
0
The CHG bit remains
cleared until the next
time OCF occurs.
1
1
1
1
The CHG bit remains set
until the next time ICF
occurs.
ICEN
This is a read/write bit that enables a voltage comparison to trigger the
input capture register of the programmable timer when the CPF2 flag
bit is set. Therefore, an A/D conversion could be started by receiving
an OCF or TOF from the programmable timer and then terminated
when the voltage on the external ramping capacitor reaches the level
of the unknown voltage. The time of termination will be stored in the
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Analog Subsystem
Analog Control Register
16-bit buffer located at $0014 and $0015. This bit is automatically set
whenever mode 2 or 3 is selected by setting the ATD2 control bit. This
bit is cleared by a reset of the device.
1 = Connects the CPF2 flag bit to the timer input capture register
0 = Connects the PB3/AN3 pin to the timer input capture register
NOTE:
For the input capture to occur when the output of comparator 2 goes
high, the IEDG bit in the TCR must also be set.
Freescale Semiconductor, Inc...
When the ICEN bit is set, the input capture function of the programmable
timer is not connected to the PB3/AN3/TCAP pin but is driven by the
CPF2 output flag from comparator 2. To return to capturing times from
external events, the ICEN bit must first be cleared before the timed event
occurs.
CPIE
This is a read/write bit that enables an analog interrupt when either of
the CPF1 or CPF2 flag bits is set to a logic 1. This bit is cleared by a
reset of the device.
1 = Enables analog interrupts when comparator flag bits are set
0 = Disables analog interrupts when comparator flag bits are set
NOTE:
If both the ICEN and CPIE bits are set, they will both generate an
interrupt by different paths. One will be the programmable timer interrupt
due to the input capture and the other will be the analog interrupt due to
the output of comparator 2 going high. In this case, the input capture
interrupt will be entered first due to its higher priority. The analog
interrupt will then need to be serviced even if the comparator 2 output
has been reset or the input capture flag (ICF) has been cleared.
CP2EN
The CP2EN enable bit controls power to voltage comparator 2 in the
analog subsystem. Powering down a comparator will drop the supply
current. This bit is cleared by a reset of the device.
1 = Writing a logic 1 powers up voltage comparator 2.
0 = Writing a logic 0 powers down voltage comparator 2.
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NOTE:
Voltage comparators power up slower than digital logic and their outputs
may go through indeterminate states which might set their respective
flags (CPF1, CPF2). It is therefore recommended to power up the
charge current source first (ISEN), then to power up any comparators,
and finally clear the flag bits by writing a logic 1 to the respective CPFR1
or CPFR2 bits in the ACR.
CP1EN
Freescale Semiconductor, Inc...
The CP1EN enable bit will power down the voltage comparator 1 in
the analog subsystem. Powering down a comparator will drop the
supply current. This bit is cleared by a reset of the device.
1 = Writing a logic 1 powers up voltage comparator 1
0 = Writing a logic 0 powers down voltage comparator 1
ISEN
The ISEN enable bit will power down the charge current source and
disable the discharge device in the analog subsystem. Powering
down the current source will drop the supply current by about 200 µA.
This bit is cleared by a reset of the device.
1 = Writing a logic 1 powers up the ramping current source and
enables the discharge device on the PB0/AN0 pin.
0 = Writing a logic 0 powers down the ramping current source and
disables the discharge device on the PB0/AN0 pin.
NOTE:
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The analog subsystem has support circuitry which draws current. This
current will be powered down if both comparators and the charge current
source are powered down (ISEN, CP1EN, and CP2EN all cleared).
Powering up either comparator or the charge current source will activate
the support circuitry.
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Analog Status Register
8.5 Analog Status Register
The analog status register (ASR) contains status and control of the
comparator flag bits. These bits in the ASR are shown in Figure 8-6. All
the bits in this register are cleared by a reset of the device.
Address:
Read:
$001E
Bit 7
6
5
4
CPF2
CPF1
0
0
CPFR2
CPFR1
0
0
Freescale Semiconductor, Inc...
Write:
Reset:
0
0
= Unimplemented
3
2
COE1
VOFF
0
0
R
1
Bit 0
CMP2
CMP1
R
0
0
= Reserved
Figure 8-6. Analog Status Register (ASR)
CPF2
This read-only flag bit is edge sensitive to the rising output of
comparator 2. It is set when the voltage on the PB0/AN0 pin rises
above the voltage on a sample capacitor which creates a positive
edge on the output of comparator 2, regardless of the state of the INV
bit in the AMUX register. This bit is reset by writing a logic 1 to the
CPFR2 reset bit in the ASR. This bit is cleared by a reset of the
device.
1 = A positive transition on the output of comparator 2 has occurred
since the last time the CPF2 flag has been cleared.
0 = A positive transition on the output of comparator 2 has not
occurred since the last time the CPF2 flag has been cleared.
CPF1
This read-only flag bit is edge sensitive to the rising output of
comparator 1. It is set when the voltage on the PB2/AN2 pin rises
above the voltage on the PN3/AN3/TCAP pin which creates a positive
edge on the output of comparator 1, regardless of the state of the INV
bit in the AMUX register. This bit is reset by writing a logic 1 to the
CPFR1 reset bit in the ASR. This bit is cleared by a reset of the
device.
1 = A positive transition on the output of comparator 1 has occurred
since the last time the CPF1 flag has been cleared.
0 = A positive transition on the output of comparator 1 has not
occurred since the last time the CPF1 flag has been cleared.
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CPFR2
Writing a logic 1 to this write-only flag clears the CPF2 flag in the ASR.
Writing a logic 0 to this bit has no effect. Reading the CPFR2 bit will
return a logic 0. By default, this bit looks cleared following a reset of
the device.
1 = Clears the CPF2 flag bit
0 = No effect
CPFR1
Freescale Semiconductor, Inc...
Writing a logic 1 to this write-only flag clears the CPF1 flag in the ASR.
Writing a logic 0 to this bit has no effect. Reading the CPFR1 bit will
return a logic 0. By default, this bit looks cleared after a reset of the
device.
1 = Clears the CPF1 flag bit
0 = No effect
NOTE:
The CPFR1 and CPFR2 bits should be written with logic 1s following a
power-up of either comparator. This will clear out any latched CPF1 or
CPF2 flag bits which might have been set during the slower power-up
sequence of the analog circuitry.
If both inputs to a comparator are above the maximum common-mode
input voltage (VDD –1.5 V), the output of the comparator is indeterminate
and may set the comparator flag. Applying a reset to the device may only
temporarily clear this flag as long as both inputs of a comparator remain
above the maximum common-mode input voltages.
VOFF
This read-write bit controls the addition of an offset voltage to the
bottom of the sample capacitor. It is not active unless the OPT bit in
the COPR at location $1FF0 is set. Any reads of the VOFF bit location
return a logic 0 if the OPT bit is clear. During the time that the sample
capacitor is connected to an input (either HOLD or DHOLD set), the
bottom of the sample capacitor is connected to VSS. The VOFF bit is
cleared by a reset of the device. For more information, see 8.11
Sample and Hold.
1 = Enables approximately 100 mV offset to be added to the
sample voltage when both the HOLD and DHOLD control bits
are cleared
0 = Connects the bottom of the sample capacitor to VSS
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Analog Status Register
COE1
This read-write bit controls the output of comparator 1 to the PB4 pin.
It is not active unless the OPT bit in the COPR at location $1FF0 is
set. Any reads of the COE1 bit location return a logic 0 if the OPT bit
is clear. The COE1 bit is cleared by a reset of the device.
1 = Enables the output of comparator 1 to be ORed with the PB4
data bit and OLVL bit, if the DDRB4 bit is also set
0 = Disables the output of comparator 1 from affecting the PB4 pin
Freescale Semiconductor, Inc...
CMP2
This read-only bit shows the state of comparator 2 during the time that
the bit is read. This bit is therefore the current state of the comparator
without any latched history. The CMP2 bit will be high if the voltage
on the PB0/AN0 pin is greater than the voltage on the PB1/AN1 pin,
regardless of the state of the INV bit in the AMUX register. Since a
reset disables comparator 2, this bit returns a logic 0 following a reset
of the device.
1 = The voltage on the positive input on comparator 2 is higher than
the voltage on the negative input of comparator 2.
0 = The voltage on the positive input on comparator 2 is lower than
the voltage on the negative input of comparator 2.
CMP1
This read-only bit shows the state of comparator 1 during the time that
the bit is read. This bit is therefore the current state of the comparator
without any latched history. The CMP1 bit will be high if the voltage
on the PB2/AN2 pin is greater than the voltage on the PB3/AN3/TCAP
pin, regardless of the state of the INV bit in the AMUX register. Since
a reset disables comparator 1, this bit returns a logic 0 following a
reset of the device.
1 = The voltage on the positive input on comparator 1 is higher than
the voltage on the negative input of comparator 1.
0 = The voltage on the positive input on comparator 1 is lower than
the voltage on the negative input of comparator 1.
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8.6 A/D Conversion Methods
The control bits in the ACR provide various options to charge or
discharge current through the PB0/AN0 pin to perform single-slope A/D
conversions using an external capacitor from the PB0/AN0 pin to VSS as
shown in Figure 8-7. The various A/D conversion triggering options are
given in Table 8-3.
Freescale Semiconductor, Inc...
Charge Time =
C x VX
I
VDD –1.5 Vdc
UNKNOWN VOLTAGE ON (–) INPUT
VOLTAGE ON
CAPACITOR
CONNECTED
TO (+) INPUT
CHARGE TIME
TO MATCH UNKNOWN
DISCHARGE TIME
TO RESET CAPACITOR
MAXIMUM CHARGE TIME
TO VDD –1.5 Vdc
+5V
PB4/AN4
VDD
PB3/AN3
UNKNOWN
OR REFERENCE
SIGNALS
PB2/AN2
PB1/AN1
RAMP
CAP
PB0/AN0
MC68HC705JJ7
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VSS
Figure 8-7. Single-Slope A/D Conversion Method
The top three bits of the ACR control the charging and discharging
current into or out of the PB0/AN0 pin. These three bits will have no
effect on the PB0/AN0 pin if the ISEN enable bit is cleared. Any clearing
of the ISEN bit will immediately disable both the charge current source
and the discharge device. Since all these bits and the ISEN bit are
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A/D Conversion Methods
cleared when the device is reset, the MC68HC705JJ7/MC68HC705JP7
starts with the charge and discharge function disabled.
Freescale Semiconductor, Inc...
The length of time required to reach the maximum voltage to be
measured and the speed of the time counting mechanism will determine
the resolution of the reading. The time to ramp the external capacitor
voltage to match the maximum voltage is dependent on:
•
Charging current to external capacitor
•
Value of the external capacitor
•
Clock rate for timing function
•
Any prescaling of the clock to the timing function
•
Desired resolution
The charging behavior is described by the general equation:
tCHG = CEXT x VX / ICHG
Where:
tCHG
= Charge time (seconds)
CEXT = Capacitance (µF)
VX
= Unknown voltage (volts)
ICHG
= Charge current (µA)
Since the MCU can measure time in a variety of ways, the resolution of
the conversion will depend on the length of the time keeping function and
its prescaling to the oscillator frequency (fOSC). Therefore, the charge
time also equals:
tCHG = P x N / fOSC
Where:
P
= Prescaler value (÷ 2, ÷ 4, ÷ 8, etc.)
N
= Number of counts during charge time
fOSC
= Oscillator clock frequency (Hz)
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NOTE:
Noise on the system ground or the external ramping capacitor can cause
the comparator to trip prematurely. Therefore, in any given application it
is best to use the fastest possible ramp rate (shortest charge time).
The previous two equations for the charge time, tCHG, can be combined
to form the following expression for the full scale count (NFS) of the
measured time versus the full scale unknown voltage (VFS):
NFS = CEXT x VFS x fOSC / (P x ICHG)
Freescale Semiconductor, Inc...
Since a given timing method has a fixed charge current and prescaler,
then the variation in the resultant count for a given unknown voltage is
mainly dependent on the operating frequency and the capacitance value
used. The desired external capacitance for a given voltage range, fOSC,
conversion method, and resolution is defined as:
CEXT = NFS x P x ICHG / (VFS x fOSC)
NOTE:
The value of any capacitor connected directly to the PB0/AN0 pin should
be limited to less than 2 microfarads. Larger capacitances will create
high discharge currents which may damage the device or create signal
noise.
The full scale voltage range for a given capacitance, fOSC, conversion
method, and resolution is defined as:
VFS = NFS x P x ICHG / (CEXT x fOSC)
Once charged to a given voltage, a finite amount of time will be required
to discharge the capacitor back to its start voltage at VSS. This discharge
time will be solely based on the value of capacitance used and the
sinking current of the internal discharge device. To allow a reasonable
time for the capacitor to return to VSS levels, the discharge time should
last about 10 milliseconds per microfarad of capacitance attached to the
PB0 pin. If the total charge/discharge cycle time is critical, then the
discharge time should be at least 1/10 of the most recent charge time.
Shorter discharge times may be used if lesser accuracy in the voltage
measurement is acceptable.
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Analog Subsystem
A/D Conversion Methods
NOTE:
Sufficient time should be allowed to discharge the external capacitor or
subsequent charge times will be shortened with resultant errors in timing
conversion.
Table 8-4 gives the range of values of each parameter in the A/D timing
conversion and Table 8-5 gives some A/D conversion examples for
several bit resolutions.
Freescale Semiconductor, Inc...
The mode selection bits in the ACR allow four methods of single-slope
A/D conversion. Each of these methods is shown in Figure 8-8 through
Figure 8-11 using the signal names and parameters given in Table 8-4.
•
Manual start and stop (mode 0) Figure 8-8
•
Manual start and automatic discharge (mode 1) Figure 8-9
•
Automatic start and stop from TOF to ICF (mode 2) Figure 8-10
•
Automatic start and stop from OCF to ICF (mode 3) Figure 8-11
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Table 8-4. A/D Conversion Parameters
Name
Freescale Semiconductor, Inc...
VX
Function
Unknown voltage on channel selection bus
Min
Typ
Max
Units
VSS
—
VDD –1.5
V
—
—
VDD –1.5
V
VMAX
Maximum charging voltage on external capacitor
ICHG
Charging current on external ramping capacitor
VDD = 3 Vdc
VDD = 5 Vdc
Refer to 15.10 Analog Subsystem
Characteristics (5.0 Vdc) and 15.11 Analog
Subsystem Characteristics (3.0 Vdc)
IDIS
Discharge current on external ramping capacitor
Refer to 15.10 Analog Subsystem
Characteristics (5.0 Vdc) and 15.11 Analog
Subsystem Characteristics (3.0 Vdc)
tCHG
Time to charge external capacitor
(100 kHz < fOSC < 4.0 MHz)
4-bit result
6-bit result
8-bit result
10-bit result
12-bit result
tDIS
CEXT
0.032
0.128
0.512
2.048
8.192
0.128
0.512
2.048
8.196
32.768
2.56
10.24
40.96
120(1)
120(1)
Time to discharge external capacitor, CEXT
—
5
10
ms/ µF
Capacitance of external ramping capacitor
0.0001
0.1
2.0
µF
1024
65536
Counts
N
Number of counts for ICHG to charge CEXT to VX
1
P
Prescaler into timing function (÷ P)
Using core timer
Using 16-bit programmable timer
Using software loops
8
8
24
fOSC
Clock source frequency (excluding any prescaling)
ms
8
8
8
8
User defined User defined
÷P
Refer to 15.12 Control Timing (5.0 Vdc)
and 15.13 Control Timing (3.0 Vdc)
1. Limited by requirement for CEXT to be less than 2.0 µF
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A/D Conversion Methods
Table 8-5. Sample Conversion Timing (VDD = 5.0 Vdc)
Bits Counts
4
Freescale Semiconductor, Inc...
4
6
6
8
8
10
12
16
16
64
64
256
256
1024
4096
VX
(Vdc)
A/D Method
3.5
Software loop
(12 bus cycles)
(24 fOSC cycles)
Mode 0 or 1 (manual)
3.5
3.5
3.5
3.5
3.5
3.5
3.5
Programmable timer
(prescaler = 8)
Mode 2 or 3
(TOF ≥ ICF or OCF ≥ ICF)
Software loop
(12 bus cycles)
(24 fOSC cycles)
Mode 0 or 1 (manual)
Programmable timer
(prescaler = 8)
Mode 2 or 3
(TOF ≥ CF or OCF ≥ ICF)
Software loop
(12 bus cycles)
(24 fOSC cycles)
Mode 0 or 1 (manual)
Programmable timer
(prescaler = 8)
Mode 2 or 3
(TOF ≥ CF or OCF ≥ ICF)
Programmable timer
(prescaler = 8)
Mode 2 or 3
(TOF ≥ ICF or OCF ≥ ICF)
Programmable timer
(prescaler = 8)
Mode 2 or 3
(TOF ≥ ICF or OCF ≥ ICF)
Clock Source
fOSC
(MHz)
tCHG
(ms)
CEXT
(µF)
Low-power oscillator
0.1
3.840
0.110
1.0
0.384
0.011
2.0
0.192
0.006
4.0
0.096
0.003
0.1
1.280
0.037
1.0
0.128
0.004
2.0
0.064
0.002
4.0
0.032
0.001
0.1
15.36
0.439
1.0
1.536
0.044
2.0
0.768
0.022
4.0
0.384
0.011
0.1
5.120
0.585
1.0
0.512
0.059
2.0
0.256
0.029
4.0
0.128
0.015
0.1
61.44
1.755
1.0
6.144
0.176
2.0
3.072
0.088
4.0
1.536
0.044
0.1
20.48
0.585
1.0
2.048
0.059
2.0
1.024
0.029
4.0
0.512
0.015
0.1
Note 1
Note 1
1.0
8.192
0.234
2.0
4.096
0.117
4.0
2.048
0.059
0.1
Note 1
Note 1
1.0
32.768
0.936
2.0
16.384
0.468
4.0
8.192
0.234
External pin oscillator
Low-power oscillator
External pin oscillator
Low-power oscillator
External pin oscillator
Low-power oscillator
External pin oscillator
Low-power oscillator
External pin oscillator
Low-power oscillator
External pin oscillator
Low-power oscillator
External pin oscillator
Low-power oscillator
External pin oscillator
1. Not usable as the value of CEXT would be greater than 2.0 µF
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tDIS
tDIS
tDIS
tMAX
(MIN)
(MIN)
VCAP
VMAX
tCHG
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VX
VX =
tCHG x ICHG
CEXT
CHG
COMP2
TOF
OCF
ICF
0
2
3
4
5
1
1
Point
Action
Software/Hardware Action
Dependent Variable(s)
0
Begin initial discharge and select mode 0
by clearing the CHG, ATD2, and ATD1
control bits in the ACR.
Software write
Software
1
VCAP falls to VSS.
Wait out minimum tDIS time.
VMAX, IDIS, CEXT
2
Stop discharge and begin charge by setting
CHG control bit in ACR.
Software write
Software
3
VCAP rises to VX and comparator 2 output
trips, setting CPF2 and CMP2.
Wait out tCHG time.
VX, ICHG, CEXT
4
VCAP reaches VMAX.
None
VMAX, ICHG, CEXT
5
Begin next discharge by clearing the CHG
control bit in the ACR. Reset CPF2 by
writing a 1 to CPFR2.
Software write
Software
Figure 8-8. A/D Conversion — Full Manual Control (Mode 0)
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A/D Conversion Methods
tDIS
tDIS
tDIS
(MIN)
(MIN)
VCAP
VMAX
tCHG
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VX
VX =
tCHG x ICHG
CEXT
CHG
COMP2
TOF
OCF
ICF
0
1
2
3
1
Software/Hardware Action
2
Point
Action
Dependent Variable(s)
0
Begin initial discharge and select
mode 1 by clearing CHG and ATD2
and setting ATD1 in the ACR.
Software write
Software
1
VCAP falls to VSS.
Wait out minimum tDIS time.
VMAX, IDIS, CEXT
2
Stop discharge and begin charge by
setting CHG control bit in ACR.
Software write
Software
3
VCAP rises to VX and comparator 2
output trips, setting CPF2 and
CMP2, which clears CHG control bit
in the ACR. Reset CPF2 by writing a
1 to CPFR2.
Wait out tCHG time.
CPF2 clears CHG control bit.
VX, ICHG, CEXT
Figure 8-9. A/D Conversion — Manual/Auto Discharge Control (Mode 1)
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tDIS
tDIS
tDIS
(MIN)
(MIN)
VCAP
VMAX
tCHG
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VX
VX =
tCHG x ICHG
CEXT
CHG
COMP2
(TCAP)
TOF
OCF
ICF
0
1
2
3
1
Software/Hardware Action
2
Point
Action
Dependent Variable(s)
0
Begin initial discharge and select mode 2
by clearing CHG and ATD1 and setting
ATD2 in the ACR. Also set ICEN bit in
ACR and IEDG bit in TCR.
Software write
Software
1
VCAP falls to VSS.
Wait out minimum tDIS time.
VMAX, IDIS, CEXT
2
Stop discharge and begin charge when
the next TOF sets the CHG control bit in
ACR.
Timer TOF sets the CHG control
bit in the ACR.
Free-running timer
counter overflow, fOSC
3
VCAP rises to VX and comparator 2
output trips, setting CPF2 and CMP2,
which causes an ICF from the timer and
clears the CHG control bit in ACR. Must
clear CPF2 to trap next CPF2 flag.
Wait out tCHG time.
Timer ICF clears the CHG control
bit in the ACR.
VX, ICHG, CEXT
Figure 8-10. A/D Conversion — TOF/ICF Control (Mode 2)
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Analog Subsystem
A/D Conversion Methods
tDIS
tDIS
tDIS
(MIN)
(MIN)
VCAP
VMAX
tCHG
Freescale Semiconductor, Inc...
VX
tCHG x ICHG
VX =
CEXT
CHG
COMP2
(TCAP)
TOF
OCF
ICF
0
1
2
3
1
2
Point
Action
Software/Hardware Action
Dependent Variable(s)
0
Begin initial discharge and select mode 3
by clearing CHG and setting ATD2 and
ATD1 in the ACR. Also set ICEN bit in
ACR and IEDG bit in TCR.
Software write
Software
1
VCAP falls to VSS. Set timer output
compare registers (OCRH and OCRL) to
desired charge start time.
Wait out minimum tDIS time.
Software write to OCRH, OCRL
VMAX, IDIS, CEXT,
software
2
Stop discharge and begin charge when
the next OCF sets the CHG control bit in
ACR.
Timer OCF sets the CHG control
bit in the ACR.
Free-running timer
output compare, fOSC
3
VCAP rises to VX and comparator 2
output trips, setting CPF2 and CMP2,
which causes an ICF from the timer and
clears the CHG control bit in ACR. Must
clear CPF2 to trap next CPF2 flag. Load
next OCF.
Wait out tCHG time.
Timer ICF clears the CHG control
bit in the ACR.
VX, ICHG, CEXT
Figure 8-11. A/D Conversion — OCF/ICF Control (Mode 3)
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Analog Subsystem
8.7 Voltage Measurement Methods
The methods for obtaining a voltage measurement can use software
techniques to express these voltages as absolute or ratiometric
readings.
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In most applications the external capacitor, the clock source, the
reference voltage, and the charging current may vary between devices
and with changes in supply voltage or ambient temperature. All of these
variations must be considered when determining the desired resolution
of the measurement. The maximum and minimum extremes for the full
scale count will be:
NFSMIN = CEXTMIN x VFSMIN x fOSCMIN / (P x ICHGMAX)
NFSMAX = CEXTMAX x VFSMAX x fOSCMAX / (P x ICHGMIN)
The minimum count should be the desired resolution, and the counting
mechanism must be capable of counting to the maximum. The final
scaling of the count will be by a math routine which calculates:
VX = VREF x (NX – NOFF) / (NREF – NOFF)
Where:
VREF = Known reference voltage
VX
= Unknown voltage between VSS and VREF
NX
= Conversion count for unknown voltage
NREF = Conversion count for known reference voltage (VREF)
NOFF = Conversion count for minimum reference voltage (VSS)
When VREF is a stable voltage source such as a zener or other reference
source, then the unknown voltage will be determined as an absolute
reading. If VREF is the supply source to the device (VDD), then the
unknown voltage will be determined as a ratio of VDD, or a ratiometric
reading.
If the unknown voltage applied to the comparator is greater than its
common-mode range (VDD –1.5 volts), then the external capacitor will
try to charge to the same level. This will cause both comparator inputs to
be above the common-mode range and the output of the comparator will
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Voltage Measurement Methods
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be indeterminate. In this case the comparator output flags may also be
set even if the actual voltage on the positive input (+) is less than the
voltage on the negative input (–). All A/D conversion methods should
have a maximum time check to determine if this case is occurring.
Once the maximum timeout detection has been made, the state of the
comparator outputs can be tested to determine the situation. However,
such tests should be carefully designed when using modes 1, 2, or 3 as
these modes cause the immediate automatic discharge of the external
ramping capacitor before any software check can be made of the output
state of comparator 2.
NOTE:
All A/D conversion methods should include a test for a maximum
elapsed time to detect error cases where the inputs may be outside of
the design specification.
8.7.1 Absolute Voltage Readings
The absolute value of a voltage measurement can be calculated in
software by first taking a reference reading from a fixed source and then
comparing subsequent unknown voltages to that reading as a
percentage of the reference voltage multiplied times the known
reference value.
The accuracy of absolute readings will depend on the error sources
taken into account using the features of the analog subsystem and
appropriate software as described in Table 8-6. As can be seen from this
table, most of the errors can be reduced by frequent comparisons to a
known voltage, use of the inverted comparator inputs, and averaging of
multiple samples.
8.7.1.1 Internal Absolute Reference
If a stable source of VDD is provided, the reference measurement point
can be internally selected. In this case, the reference reading can be
taken by setting the VREF bit and clearing the MUX1:4 bits in the AMUX
register. This connects the channel selection bus to the VDD pin. To stay
within the VMAX range, the DHOLD bit should be used to select the 1/2
divided input.
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8.7.1.2 External Absolute Reference
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If a stable external source is provided, the reference measurement point
can be any one of the channel selected pins from PB1–PB4. In this case
the reference reading can be taken by setting the MUX bit in the AMUX
which connects channel selection bus to the pin connected to the
external reference source. If the external reference is greater than
VDD –1.5 volts, then the DHOLD bit should be used to select the 1/2
divided input.
Table 8-6. Absolute Voltage Reading Errors
Error Source
Accuracy Improvements Possible
In Hardware
In Software
Change in reference
voltage
Provide closer tolerance reference
Calibration and storage of reference source
over temperature and supply voltage
Change in magnitude of
ramp current source
Not adjustable
Compare unknown with recent
measurement from reference
Non-linearity of ramp
current source vs.
voltage
Not adjustable
Calibration and storage of voltages at 1/4,
1/2, 3/4, and FS
Frequency shift in
internal low-power
oscillator
Use external oscillator with crystal
Compare unknown with recent
measurement from reference
Sampling capacitor
leakage
Use faster conversion times
Compare unknown with recent
measurement from reference
Internal voltage divider
ratio
Not adjustable
Compare unknown with recent
measurement from reference OR avoid use
of divided input
Input offset voltage of
comparator 2
Not adjustable
Sum two readings on reference or
unknown using INV and INV control bit and
divide by 2 (average of both)
Noise internal to MCU
Close decoupling at VDD and VSS pins
and reduce supply source impedance
Average multiple readings on both the
reference and the unknown voltage
8.7.2 Ratiometric Voltage Readings
The ratiometric value of a voltage measurement can be calculated in
software by first taking a reference reading from a reference source and
then comparing subsequent unknown voltages to that reading as a
percentage of the reference value. The accuracy of ratiometric readings
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Voltage Measurement Methods
will depend on the variety of sources, but will generally be better than for
absolute readings. Many of these error sources can be taken into
account using the features of the analog subsystem and appropriate
software as described in Table 8-7. As with absolute measurements,
most of the errors can be reduced by frequent comparisons to the
reference voltage, use of the inverted comparator inputs, and averaging
of multiple samples.
Freescale Semiconductor, Inc...
Table 8-7. Ratiometric Voltage Reading Errors
Error Source
Accuracy Improvements Possible
In Hardware
In Software
Change in reference
voltage
Not required for ratiometric
Compare unknown with recent
measurement from reference
Change in magnitude of
ramp current source
Not adjustable
Compare unknown with recent
measurement from reference
Non-linearity of ramp
current source vs. voltage
Not adjustable
Calibration and storage of voltages at
1/4, 1/2, 3/4, and FS
Frequency shift in internal
low-power oscillator
Not required for ratiometric
Compare unknown with recent
measurement from reference
Sampling capacitor leakage Use faster conversion times
Compare unknown with recent
measurement from reference
Internal voltage divider ratio Not adjustable
Compare unknown with recent
measurement from reference
Input offset voltage of
comparator 2
Not adjustable
Sum two readings on reference or
unknown using INV and INV control bit
and divide by 2 (average of both)
Noise internal to MCU
Close decoupling at VDD and VSS pins
and reduce supply source impedance
Average multiple readings on both the
reference and the unknown voltage
8.7.2.1 Internal Ratiometric Reference
If readings are to be ratiometric to VDD, the reference measurement
point can be internally selected. In this case the reference reading can
be taken by setting the VREF bit and clearing the MUX1:4 bits in the
AMUX register which connects the channel selection bus to the VDD pin.
In order to stay within the VMAX range, the DHOLD bit should be used to
select the 1/2 divided input.
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8.7.2.2 External Ratiometric Reference
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If readings are to be ratiometric to some external source, the reference
measurement point can be connected to any one of the channel selected
pins from PB1–PB4. In this case, the reference reading can be taken by
setting the MUX bit in the AMUX which connects channel selection bus
to the pin connected to the external reference source. If the external
reference is greater than VDD –1.5 volts, then the DHOLD bit should be
used to select the 1/2 divided input.
8.8 Voltage Comparator Features
The two internal comparators can be used as simple voltage
comparators if set up as described in Table 8-8. Both comparators can
be active in the wait mode and can directly restart the part by means of
the analog interrupt. Both comparators can also be active in the stop
mode, but cannot directly restart the part. However, the comparators can
directly drive PB4 which can then be connected externally to activate
either a port interrupt on the PA0:3 pins or the IRQ/VPP pin.
Table 8-8. Voltage Comparator Setup Conditions
Comparator
Current
Source
Enable
Discharge
Device
Disable
Port B Pin
as Inputs
Port B Pin
Pulldowns
Disabled
Prog. Timer
Input
Capture
Source
1
Not
affected
Not
affected
DDRB2 = 0
DDRB3 = 0
PDIB2 = 1
PDIB3 = 1
Not
affected
2
ISEN = 0
ISEN = 0
DDRB0 = 0
DDRB1 = 0
PDIB0 = 1
PDIB1 = 1
ICEN = 0
IEDG = 1
8.8.1 Voltage Comparator 1
Voltage comparator 1 is always connected to two of the port B I/O pins.
These pins should be configured as inputs and have their software
programmable pulldowns disabled. Also, the negative input of voltage
comparator 1 is connected to the PB3/AN3/TCAP and shared with the
input capture function of the 16-bit programmable timer. Therefore, the
timer input capture interrupt should be disabled so that changes in the
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Voltage Comparator Features
voltage on the PB3/AN3/TCAP pin do not cause unwanted input capture
interrupts.
The output of comparator 1 can be connected to the port logic driving the
PB4/AN4/TCMP/CMP1 pin such that the output of the comparator is
ORed with the PB4 data bit and the OLVL bit from the 16-bit timer. This
capability requires that the OPT bit is set in the COPR at location $1FF0
as in Figure 8-12, and the COE1 bit is set in the ASR at location $001E.
Freescale Semiconductor, Inc...
Address:
$1FF0
Read:
Write:
Reset:
Bit 7
6
EPMSEC
OPT
U
U
5
4
3
2
1
Bit 0
COPC
U
= Unimplemented
U
U
U
U
U
U = Unaffected
Figure 8-12. COP and Security Register (COPR)
OPT — Optional Features Bit
The OPT bit enables two additional features: direct drive by
comparator 1 output to PB4 and voltage offset capability to sample
capacitor in analog subsystem.
1 = Optional features enabled
0 = Optional features disabled
8.8.2 Voltage Comparator 2
Voltage comparator 2 can be used as a simple comparator if its charge
current source and discharge device are disabled by clearing the ISEN
bit in the ACR. If the ISEN bit is set, the internal ramp discharge device
connected to PB0/AN0 may become active and try to pull down any
voltage source that may be connected to that pin. Also, since voltage
comparator 2 is always connected to two of the port B I/O pins, these
pins should be configured as inputs and have their software
programmable pulldowns disabled.
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8.9 Current Source Features
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The internal current source connected to the PB0/AN0 pin supplies
about 100 µA of current when the discharge device is disabled and the
current source is active. Therefore, this current source can be used in an
application if the ISEN enable bit is set to power up the current source
and by setting the A/D conversion method to manual mode 0 (ATD1 and
ATD2 cleared) and the charge current enabled (CHG set).
8.10 Internal Temperature Sensing Diode Features
An internal diode is forward biased to VSS and will have its voltage
change, VD, for each degree centigrade rise in the temperature of the
device. This temperature sensing diode is powered up from a current
source only during the time that the diode is selected. When on, this
current source typically adds about 30 µA to the IDD current.
The temperature sensing diode can be selected by setting both the
HOLD and DHOLD bits in the AMUX register (see 8.3 Analog Multiplex
Register).
8.11 Sample and Hold
When using the internal sample capacitor to capture a voltage for later
conversion, the HOLD or DHOLD bit must be cleared first before
changing any channel selection. If both the HOLD (or DHOLD) bit and
the channel selection are changed on the same write cycle, the sample
may be corrupted during the switching transitions.
NOTE:
The sample capacitor can be affected by excessive noise created with
respect to the device’s VSS pin such that it may appear to leak down or
charge up depending on the voltage level stored on the sample
capacitor. It is recommended to avoid switching large currents through
the port pins while a voltage is to remain stored on the sample capacitor.
The additional option of adding an offset voltage to the bottom of the
sample capacitor allows unknown voltages near VSS to be sampled and
then shifted up past the comparator offset and the device offset caused
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Port B Interaction with Analog Inputs
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by a single VSS return pin. This offset also provides a means to measure
the internal VSS level regardless of the comparator offset to determine
NOFF as described in 8.7 Voltage Measurement Methods. In either
case the OPT bit must be set in the COPR located at $1FF0 as in
Figure 8-12 and the VOFF bit must be set in the ASR. It is not necessary
to switch the VOFF bit during conversions, since the offset is controlled
by the HOLD and DHOLD bits when the VOFF is active. Refer to
8.3 Analog Multiplex Register for more details on the design and
decoding of the sample and hold circuit.
8.12 Port B Interaction with Analog Inputs
The analog subsystem is connected directly to the port B I/O pins without
any intervening gates. It is, therefore, possible to measure the voltages
on port B pins set as inputs or to have the analog voltage measurements
corrupted by port B pins set as outputs.
8.13 Port B Pins as Inputs
All the port B pins will power up as inputs or return to inputs after a reset
of the device since the bits in the port B data direction register will be
reset.
If any port B pins are to be used for analog voltage measurements, they
should be left as inputs. In this case, not only can the voltage on the pin
be measured, but the logic state of the port B pins can be read from
location $0002.
8.14 Port B Pulldowns
All the port B pins have internal software programmable pulldown
devices available dependent on the state of the SWPDI bit in the mask
option register (MOR).
If the pulldowns are enabled, they will create an approximate 100 µA
load to any analog source connected to the pin. In some cases, the
analog source may be able to supply this current without causing any
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error due to the analog source output impedance. Since this may not
always be true, it is therefore best to disable port B pulldowns on those
pins used for analog input sources.
8.15 Noise Sensitivity
Freescale Semiconductor, Inc...
In addition to the normal effects of electrical noise on the analog input
signal there can also be other noise-related effects caused by the
digital-to-analog interface. Since there is only one VSS return for both the
digital and the analog subsystems on the device, currents in the digital
section may affect the analog ground reference within the device. This
can add voltage offsets to measured inputs or cause channel-to-channel
crosstalk.
To reduce the impact of these effects, there should be no switching of
heavy I/O currents to or from the device while there is a critical analog
conversion or voltage comparison in process. Limiting switched I/O
currents to 2–4 mA during these times is recommended.
A noise reduction benefit can be gained with 0.1-µF bypass capacitors
from each analog input (PB4:1) to the VSS pin. Also, try to keep all the
digital power supply or load currents from passing through any
conductors which are the return paths for an analog signal.
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Section 9. Simple Synchronous Serial Interface
9.1 Contents
Freescale Semiconductor, Inc...
9.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 141
9.3
SIOP Signal Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
9.3.1
Serial Clock (SCK) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143
9.3.2
Serial Data Input (SDI) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 144
9.3.3
Serial Data Output (SDO). . . . . . . . . . . . . . . . . . . . . . . . . . 144
9.4
SIOP Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .145
9.4.1
SIOP Control Register (SCR). . . . . . . . . . . . . . . . . . . . . . . 145
9.4.2
SIOP Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . .148
9.4.3
SIOP Data Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 149
9.2 Introduction
The simple synchronous serial I/O port (SIOP) subsystem is designed to
provide efficient serial communications with peripheral devices or other
MCUs. SIOP is implemented as a 3-wire master/slave system with serial
clock (SCK), serial data input (SDI), and serial data output (SDO). A
block diagram of the SIOP is shown in Figure 9-1.
The SIOP subsystem shares its input/output pins with port B. When the
SIOP is enabled (SPE bit set in the SCR), the port B data direction and
data registers are bypassed by the SIOP. The port B data direction and
data registers will remain accessible and can be altered by the
application software, but these actions will not affect the SIOP
transmitted or received data.
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PORTB LOGIC
OSCILLATOR
CLOCK
÷2
SPR0
SIOP
CONTROL REGISTER
(SCR)
SPR1
CLOCK
DIVIDER
AND
SELECT
CLOCK
CONTROL
PB7
SCK
CPHA
PORTB LOGIC
MSTR
SPE
LSBF
PB6
SDI
SPIE
PORTB LOGIC
$000A
DIN
Q
SPIF
DOUT
CLK
LATCH
SIOP
INTERRUPT
S
8-BIT SHIFT
REGISTER
COMP
PB5
SDO
ERROR
R
D6
D5
D4
D3
D2
D1
D7
SDR7
SDR6
SDR5
SDR4
SDR3
SDR2
FORMAT CONTROL
(LSB OR MSB FIRST)
SDR1
$000B
D0
DCOL
SDR0
SIOP
STATUS REGISTER
(SSR)
INTERNAL M68HC05 BUS
Freescale Semiconductor, Inc...
SPIR
SIOP
DATA REGISTER
(SDR)
$000C
INTERNAL M68HC05 BUS
Figure 9-1. SIOP Block Diagram
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SIOP Signal Format
9.3 SIOP Signal Format
The SIOP subsystem can be software configured for master or slave
operation. No external mode selection inputs are available (for instance,
no slave select pin).
9.3.1 Serial Clock (SCK)
Freescale Semiconductor, Inc...
The state of the SCK output remains a fixed logic level during idle
periods between data transfers. The edges of SCK indicate the
beginning of each output data transfer and latch any incoming data
received. The first bit of transmitted data is output from the SDO pin on
the first falling edge of SCK. The first bit of received data is accepted at
the SDI pin on the first rising edge of SCK after the first falling edge. The
transfer is terminated upon the eighth rising edge of SCK.
The idle state of the SCK is determined by the state of the CPHA bit in
the SCR. When the CPHA is clear, SCK will remain idle at a logic 1 as
shown in Figure 9-2. When the CPHA is set, SCK will remain idle at a
logic 0 as shown in Figure 9-3. In both cases, the SDO changes data on
the falling edge of the SCK, and the SDI latches data in on the rising
edge of SCK.
BIT 1
BIT 2
BIT 3
BIT 4
BIT 5
BIT 6
BIT 7
BIT 8
SDO
SCK
(CPHA = 0)
(IDLE = 1)
100 ns
100 ns
SDI
BIT 1
BIT 2
BIT 3
BIT 4
BIT 5
BIT 6
BIT 7
BIT 8
Figure 9-2. SIOP Timing Diagram (CPHA = 0)
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BIT 1
BIT 2
BIT 3
BIT 4
BIT 5
BIT 6
BIT 7
BIT 8
SDO
SCK
(CPHA = 1)
(IDLE = 0)
100 ns
100 ns
SDI
BIT 1
BIT 2
BIT 3
BIT 4
BIT 5
BIT 6
BIT 7
BIT 8
Freescale Semiconductor, Inc...
Figure 9-3. SIOP Timing Diagram (CPHA = 1)
The only difference in the master and slave modes of operation is the
sourcing of the SCK. In master mode, SCK is driven from an internal
source within the MCU. In slave mode, SCK is driven from a source
external to the MCU. The SCK frequency is based on one of four
divisions of the oscillator clock that is selected by the SPR0 and SPR1
bits in the SCR.
9.3.2 Serial Data Input (SDI)
The SDI pin becomes an input as soon as the SIOP subsystem is
enabled. New data is presented to the SDI pin on the falling edge of
SCK. Valid data must be present at least 100 nanoseconds before the
rising edge of SCK and remain valid for 100 nanoseconds after the rising
edge of SCK. See Figure 9-3.
9.3.3 Serial Data Output (SDO)
The SDO pin becomes an output as soon as the SIOP subsystem is
enabled. The state of the PB5/SDO pin reflects the value of the first bit
received on the previous transmission. Prior to enabling the SIOP, the
PB5/SDO can be initialized to determine the beginning state. While
SIOP is enabled, the port B logic cannot be used as a standard output
since that pin is connected to the last stage of the SIOP serial shift
register. A control bit (LSBF) is included in the SCR to allow the data to
be transmitted in either the MSB first format or the LSB first format.
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SIOP Registers
The first data bit will be shifted out to the SDO pin on the first falling edge
of the SCK. The remaining data bits will be shifted out to the SDI pin on
subsequent falling edges of SCK. The SDO pin will present valid data at
least 100 nanoseconds before the rising edge of the SCK and remain
valid for 100 nanoseconds after the rising edge of SCK. See Figure 9-3.
Freescale Semiconductor, Inc...
9.4 SIOP Registers
The SIOP is programmed and controlled by the SIOP control register
(SCR) located at address $000A, the SIOP status register (SSR) located
at address $000B, and the SIOP data register (SDR) located at address
$000C.
9.4.1 SIOP Control Register (SCR)
The SIOP control register (SCR) is located at address $000A and
contains seven control bits and a write-only reset of the interrupt flag.
Figure 9-4 shows the position of each bit in the register and indicates the
value of each bit after reset.
Address:
$000A
Bit 7
6
5
4
SPIE
SPE
LSBF
MSTR
Read:
2
1
Bit 0
CPHA
SPR1
SPR0
0
0
0
0
Write:
Reset:
3
SPIR
0
0
0
0
0
Figure 9-4. SIOP Control Register (SCR)
SPIE — Serial Peripheral Interrupt Enable Bit
The SPIE bit enables the SIOP to generate an interrupt whenever the
SPIF flag bit in the SSR is set. Clearing the SPIE bit will not affect the
state of the SPIF flag bit and will not terminate a serial interrupt once
the interrupt sequence has started. Reset clears the SPIE bit.
1 = Serial interrupt enabled
0 = Serial interrupt disabled
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NOTE:
If the SPIE bit is cleared just after the serial interrupt sequence has
started (for instance, the CPU status is being stacked), then the CPU will
be unable to determine the source of the interrupt and will vector to the
reset vector as a default.
SPE — Serial Peripheral Enable Bit
Freescale Semiconductor, Inc...
The SPE bit switches the port B interface such that SDO/PB5 is the
serial data output, SDI/PB6 is the serial data input, and SCK/PB7 is a
serial clock input in the slave mode or a serial clock output in the
master mode. The port B DDR and data registers can be manipulated
as usual, but these actions will not affect the transmitted or received
data. The SPE bit is readable and writable at any time, but clearing
the SPE bit while a transmission is in progress will 1) abort the
transmission, 2) reset the serial bit counter, and 3) convert port B to a
general-purpose I/O port. Reset clears the SPE bit.
1 = Serial peripheral enabled (port B I/O disabled)
0 = Serial peripheral disabled (port B I/O enabled)
LSBF — Least Significant Bit First Bit
The LSBF bit controls the format of the transmitted and received data
to be transferred LSB or MSB first. Reset clears this bit.
1 = LSB transferred first
0 = MSB transferred first
MSTR — Master Mode Select Bit
The MSTR bit configures the serial I/O port for master mode. A
transfer is initiated by writing to the SDR. Also, the SCK pin becomes
an output providing a synchronous data clock dependent upon the
divider of the oscillator frequency selected by the SPR0:1 bits. When
the device is in master mode, the SDO and SDI pins do not change
function. These pins behave exactly the same in both the master and
slave modes. The MSTR bit is readable and writable at any time
regardless of the state of the SPE bit. Clearing the MSTR bit will abort
any transfers that may have been in progress. Reset clears the MSTR
bit, placing the SIOP subsystem in slave mode.
1 = SIOP set up as master, SCK is an output
0 = SIOP set up as slave, SCK is an input
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Simple Synchronous Serial Interface
SIOP Registers
SPIR — Serial Peripheral Interrupt Reset Bit
The SPIR bit is a write-only control to reset the SPIF flag bit in the
SSR. Reading the SPIR bit will return a logic 0.
1 = Reset the SPIF flag bit
0 = No effect
CPHA — Clock Phase Bit
Freescale Semiconductor, Inc...
The CPHA bit controls the clock timing and phase in the SIOP. Data
is changed on the falling edge of SCK and data is captured (read) on
the rising edge of SCK. This bit is cleared by reset.
1 = SCK is idle low
0 = SCK is idle high
SPR0:1 — Serial Peripheral Clock Rate Select Bits
The SPR0 and SPR1 bits select one of four clock rates given in
Table 9-1 to be supplied on the PB7/SCK pin when the device is
configured with the SIOP as a master (MSTR = 1). The fastest rate is
when both SPR0 and SPR1 are set. Both the SPR0 and SPR1 bits
are cleared by reset, which places the SIOP clock selection at the
slowest rate.
Table 9-1. SIOP Clock Rate Selection
SPR1
SPR0
SIOP Clock Rate
Oscillator Frequency
Divided by:
0
0
64
0
1
32
1
0
16
1
1
8
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9.4.2 SIOP Status Register
The SIOP status register (SSR) is located at address $000B and
contains two read-only bits. Figure 9-5 shows the position of each bit in
the register and indicates the value of each bit after reset.
Address:
Read:
$000B
Bit 7
6
5
4
3
2
1
Bit 0
SPIF
DCOL
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Freescale Semiconductor, Inc...
Write:
Reset:
= Unimplemented
Figure 9-5. SIOP Status Register (SSR)
SPIF — Serial Port Interrupt Flag
The SPIF is a read-only status bit that is set on the last rising edge of
SCK and indicates that a data transfer has been completed. It has no
effect on any future data transfers and can be ignored. The SPIF bit
can be cleared by reading the SSR followed by a read or write of the
SDR or by writing a logic 1 to the SPIR bit in the SCR. If the SPIF is
cleared before the last rising edge of SCK it will be set again on the
last rising edge of SCK. Reset clears the SPIF bit.
1 = Serial transfer complete, serial interrupt if the SPIE bit in SCR
is set
0 = Serial transfer in progress or serial interface idle
DCOL — Data Collision Bit
The DCOL is a read-only status bit which indicates that an illegal
access of the SDR has occurred. The DCOL bit will be set when
reading or writing the SDR after the first falling edge of SCK and
before SPIF is set. Reading or writing the SDR during this time will
result in invalid data being transmitted or received. The DCOL bit is
cleared by reading the SSR (when the SPIF bit is set) followed by a
read or write of the SDR. If the last part of the clearing sequence is
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SIOP Registers
done after another transfer has started, the DCOL bit will be set again.
Reset clears the DCOL bit.
1 = Illegal access of the SDR occurred
0 = No illegal access of the SDR detected
9.4.3 SIOP Data Register
Freescale Semiconductor, Inc...
The SIOP data register (SDR) is located at address $000C and serves
as both the transmit and receive data register. Writing to this register will
initiate a message transmission if the node is in master mode. The SIOP
subsystem is not double buffered and any write to this register will
destroy the previous contents. The SDR can be read at any time.
However, if a transfer is in progress the results may be ambiguous.
Writing to the SDR while a transfer is in progress can cause invalid data
to be transmitted and/or received. Figure 9-6 shows the position of each
bit in the register. This register is not affected by reset.
Address:
$000C
Bit 7
6
5
4
3
2
1
Bit 0
Bit 7
6
5
4
3
2
1
Bit 0
Read:
Write:
Reset:
Unaffected by reset
Figure 9-6. SIOP Data Register (SDR)
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Section 10. Core Timer
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10.1 Contents
10.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 151
10.3
Core Timer Status and Control Register. . . . . . . . . . . . . . . . . 153
10.4
Core Timer Counter Register . . . . . . . . . . . . . . . . . . . . . . . . . 155
10.5
COP Watchdog. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .156
10.2 Introduction
This section describes the operation of the core timer and the computer
operating properly (COP) watchdog as shown by the block diagram in
Figure 10-1.
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Core Timer
RESET
INTERNAL
CLOCK
OVERFLOW
$0009
÷2
÷4
CORE TIMER COUNTER REGISTER
BITS 0–7 OF 15-STAGE
RIPPLE COUNTER
INTERNAL CLOCK ÷ 1024
RTIFR
RTIE
CTOFR
RTIF
CTOF
CTOFE
CORE TIMER
INTERRUPT
REQUEST
INTERNAL DATA BUS
Freescale Semiconductor, Inc...
OSC1
$0008
RESET
RT0
RT1
CORE TIMER STATUS/CONTROL REGISTER
RTI RATE SELECT
$1FF0
COPR REGISTER
÷2
÷2
÷2
÷2
COPC
÷2
÷2
÷2
POWER-ON
RESET
÷2
÷2
÷2
÷2
COP
WATCHDOG
RESET
RESET
Figure 10-1. Core Timer Block Diagram
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Core Timer
Core Timer Status and Control Register
10.3 Core Timer Status and Control Register
The read/write core timer status and control register (CTSCR) contains
the interrupt flag bits, interrupt enable bits, interrupt flag bit resets, and
the rate selects for the real-time interrupt as shown in Figure 10-2.
Address:
Freescale Semiconductor, Inc...
Read:
$0008
Bit 7
6
CTOF
RTIF
5
4
CTOFE
RTIE
Write:
Reset:
0
0
0
0
3
2
0
0
CTOFR
RTIFR
0
0
1
Bit 0
RT1
RT0
1
1
= Unimplemented
Figure 10-2. Core Timer Status and Control Register (CTSCR)
CTOF — Core Timer Overflow Flag
This read-only flag becomes set when the first eight stages of the core
timer counter roll over from $FF to $00. The CTOF flag bit generates
a timer overflow interrupt request if CTOFE is also set. The CTOF flag
bit is cleared by writing a logic 1 to the CTOFR bit. Writing to CTOF
has no effect. Reset clears CTOF.
1 = Overflow in core timer has occurred.
0 = No overflow of core timer since CTOF last cleared
RTIF — Real-Time Interrupt Flag
This read-only flag becomes set when the selected real-time interrupt
(RTI) output becomes active. RTIF generates a real-time interrupt
request if RTIE is also set. The RTIF enable bit is cleared by writing a
logic 1 to the RTIFR bit. Writing to RTIF has no effect. Reset clears
RTIF.
1 = Overflow in real-time counter has occurred.
0 = No overflow of real-time counter since RTIF last cleared
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Core Timer
CTOFE — Core Timer Overflow Interrupt Enable Bit
This read/write bit enables core timer overflow interrupts. Reset
clears CTOFE.
1 = Core timer overflow interrupts enabled
0 = Core timer overflow interrupts disabled
RTIE — Real-Time Interrupt Enable Bit
Freescale Semiconductor, Inc...
This read/write bit enables real-time interrupts. Reset clears RTIE.
1 = Real-time interrupts enabled
0 = Real-time interrupts disabled
CTOFR — Core Timer Overflow Flag Reset Bit
Writing a logic 1 to this write-only bit clears the CTOF bit. CTOFR
always reads as a logic 0. Reset does not affect CTOFR.
1 = Clear CTOF flag bit
0 = No effect on CTOF flag bit
RTIFR — Real-Time Interrupt Flag Reset Bit
Writing a logic 1 to this write-only bit clears the RTIF bit. RTIFR
always reads as a logic 0. Reset does not affect RTIFR.
1 = Clear RTIF flag bit
0 = No effect on RTIF flag bit
RT1 and RT0 — Real-Time Interrupt Select Bits 1 and 0
These read/write bits select one of four real-time interrupt rates, as
shown in Table 10-1. Because the selected RTI output drives the
COP watchdog, changing the real -time interrupt rate also changes
the counting rate of the COP watchdog. Reset sets RT1 and RT0,
selecting the longest COP timeout period and longest real-time
interrupt period.
NOTE:
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Changing RT1 and RT0 when a COP timeout is imminent or uncertain
may cause a real-time interrupt request to be missed or an additional
real-time interrupt request to be generated. Clear the COP timer just
before changing RT1 and RT0.
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Core Timer
Core Timer Counter Register
Table 10-1. Core Timer Interrupt Rates and COP Timeout Selection
Timer Overflow
Interrupt Period
TOF = 1/(fOSC ÷ 211)
(Microseconds)
@ fOSC (MHz)
Freescale Semiconductor, Inc...
4.2
MHz
488
2.0
MHz
1024
1.0
MHz
RTI
Rate
RT1 RT0 = fOSC
divided
by:
Real-Time
Interrupt Period
(RTI)
(Milliseconds)
COP Timeout Period
COP = 7-to-8 RTI Periods
(Milliseconds)
@ fOSC (MHz)
@ fOSC (MHz)
4.2 MHz
2.0 MHz
1.0 MHz
4.2
MHz
2.0
MHz
1.0
MHz
Min
Max
Min
Max
Min
Max
0
0
215
7.80
16.4
32.8
54.6
62.4
115
131
229
262
0
1
216
15.6
32.8
65.5
109
125
229
262
459
524
1
0
217
31.2
65.5
131
218
250
459
524
918
1049
1
1
218
62.4
131
262
437
499
918
1049
1835
2097
2048
10.4 Core Timer Counter Register
A 15-stage ripple counter driven by a divide-by-eight prescaler is the
basis of the core timer. The value of the first eight stages is readable at
any time from the read-only timer counter register as shown in
Figure 10-3.
Address:
Read:
$0009
Bit 7
6
5
4
3
2
1
Bit 0
Bit 7
6
5
4
3
2
1
Bit 0
0
0
0
0
0
0
0
0
Write:
Reset:
= Unimplemented
Figure 10-3. Core Timer Counter Register (CTCR)
Power-on clears the entire counter chain and begins clocking the
counter. After the startup delay (16 or 4064 internal bus cycles
depending on the DELAY bit in the mask option register (MOR)), the
power-on reset circuit is released, clearing the counter again and
allowing the MCU to come out of reset.
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Each count of the timer counter register takes eight oscillator cycles or
four cycles of the internal bus. A timer overflow function at the eighth
counter stage allows a timer interrupt every 2048 oscillator clock cycles
or every 1024 internal bus cycles.
10.5 COP Watchdog
Freescale Semiconductor, Inc...
Four counter stages at the end of the core timer make up the computer
operating properly (COP) watchdog which can be enabled by the
COPEN bit in the MOR. The COP watchdog is a software error detection
system that automatically times out and resets the MCU if the COP
watchdog is not cleared periodically by a program sequence. Writing a
logic 0 to COPC bit in the COPR register clears the COP watchdog and
prevents a COP reset.
Address:
$1FF0
Bit 7
6
5
4
3
2
1
Bit 0
Read:
OPT
Write:
EPMSEC
COPC
Reset:
Unaffected by reset
= Unimplemented
Figure 10-4. COP and Security Register (COPR)
EPMSEC — EPROM Security(1) Bit
The EPMSEC bit is a write-only security bit to protect the contents of
the user EPROM code stored in locations $0700–$1FFF.
OPT — Optional Features Bit
The OPT bit enables two additional features: direct drive by
comparator outputs to port A and voltage offset capability to sample
capacitor in analog subsystem.
1 = Optional features enabled
0 = Optional features disabled
1. No security feature is absolutely secure. However, Motorola’s strategy is to make reading or
copying the EPROM/OTPROM difficult for unauthorized users.
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Core Timer
COP Watchdog
COPC — COP Clear Bit
This write-only bit resets the COP watchdog. The COP watchdog is
active in the run, wait, and halt modes of operation if the COP is
enabled by setting the COPEN bit in the MOR. The STOP instruction
disables the COP watchdog by clearing the counter and turning off its
clock source.
Freescale Semiconductor, Inc...
In applications that depend on the COP watchdog, the STOP
instruction can be disabled by setting the SWAIT bit in the MOR. In
applications that have wait cycles longer than the COP timeout
period, the COP watchdog can be disabled by clearing the COPEN
bit. Table 10-2 summarizes recommended conditions for enabling
and disabling the COP watchdog.
NOTE:
If the voltage on the IRQ/VPP pin exceeds 1.5 × VDD, the COP watchdog
turns off and remains off until the IRQ/VPP pin voltage falls below
1.5 × VDD.
Table 10-2. COP Watchdog Recommendations
SWAIT
(in MOR)(1)
Wait/Halt Time
Recommended COP
Watchdog Condition
Less than 1.5 × VDD
1
Less than COP
timeout period
Enabled(2)
Less than 1.5 × VDD
1
Greater than COP
timeout period
Disabled
Less than 1.5 × VDD
0
X(3)
Disabled
More than 1.5 × VDD
X
X(3)
Disabled
Voltage on
IRQ/VPP Pin
1. The SWAIT bit in the MOR converts STOP instructions to HALT instructions.
2. Reset the COP watchdog immediately before executing the WAIT/HALT instruction.
3. Don’t care
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Core Timer
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Freescale Semiconductor, Inc.
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Section 11. Programmable Timer
Freescale Semiconductor, Inc...
11.1 Contents
11.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160
11.3
Timer Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 162
11.4
Alternate Counter Registers . . . . . . . . . . . . . . . . . . . . . . . . . . 163
11.5
Input Capture Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165
11.6
Output Compare Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . 167
11.7
Timer Control Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 170
11.8
Timer Status Register . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 171
11.9
Timer Operation during Wait Mode. . . . . . . . . . . . . . . . . . . . . 173
11.10 Timer Operation during Stop Mode . . . . . . . . . . . . . . . . . . . . 173
11.11 Timer Operation during Halt Mode . . . . . . . . . . . . . . . . . . . . . 173
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11.2 Introduction
The MC68HC705JJ7/MC68HC705JP7 MCU contains a 16-bit
programmable timer with an input capture function and an output
compare function as shown by the block diagram in Figure 11-1.
Freescale Semiconductor, Inc...
The basis of the capture/compare timer is a 16-bit free-running counter
which increases in count with every four internal bus clock cycles. The
counter is the timing reference for the input capture and output compare
functions. The input capture and output compare functions provide a
means to latch the times at which external events occur, to measure
input waveforms, and to generate output waveforms and timing delays.
Software can read the value in the 16-bit free-running counter at any
time without affecting the counter sequence.
The input/output (I/O) registers for the input capture and output compare
functions are pairs of 8-bit registers, because of the 16-bit timer
architecture used. Each register pair contains the high and low bytes of
that function. Generally, accessing the low byte of a specific timer
function allows full control of that function; however, an access of the
high byte inhibits that specific timer function until the low byte is also
accessed.
Because the counter is 16 bits long and preceded by a fixed
divide-by-four prescaler, the counter rolls over every 262,144 internal
clock cycles (every 524,288 oscillator clock cycles). Timer resolution
with a 4-MHz crystal oscillator is 2 microseconds/count.
The interrupt capability, the input capture edge, and the output compare
state are controlled by the timer control register (TCR) located at $0012,
and the status of the interrupt flags can be read from the timer status
register (TSR) located at $0013.
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Programmable Timer
Introduction
PB3
AN3
TCAP
EDGE
SELECT
& DETECT
LOGIC
ICRH ($0014)
ICRL ($0015)
TMRH ($0018)
TMRL ($0019)
ICF
INPUT
SELECT
MUX
ACRH ($001A)
ACRL ($001B)
IEDG
CPF2
FLAG
BIT
INTERNAL
CLOCK
(OSC ÷ 2)
÷4
16-BIT COUNTER
ICEN
CONTROL
BIT
OVERFLOW (TOF)
16-BIT COMPARATOR
D Q
OCRL ($0017)
OLVL
C
OCF
OCRH ($0016)
PB4
AN4
TCMP
PIN I/O
LOGIC
ANALOG
COMP 1
TIMER
INTERRUPT
REQUEST
TIMER CONTROL REGISTER
TOF
OCF
ICF
OLVL
IEDG
TOIE
OCIE
RESET
ICIE
Freescale Semiconductor, Inc...
FROM
ANALOG
SUBSYSTEM
TIMER STATUS REGISTER
$0012
$0013
INTERNAL DATA BUS
Figure 11-1. Programmable Timer Overall Block Diagram
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Programmable Timer
11.3 Timer Registers
The functional block diagram of the 16-bit free-running timer counter and
timer registers is shown in Figure 11-2. The timer registers include a
transparent buffer latch on the LSB of the 16-bit timer counter.
Freescale Semiconductor, Inc...
LATCH
READ
TMRH
READ
RESET
$FFFC
READ
TMRL
TMRL ($0019)
TMRH ($0018)
TMR LSB
INTERNAL
CLOCK
(OSC ÷ 2)
÷4
16-BIT COUNTER
TIMER CONTROL REG.
TIMER
INTERRUPT
REQUEST
TOF
TOIE
OVERFLOW (TOF)
TIMER STATUS REG.
$0012
$0013
INTERNAL
DATA
BUS
Figure 11-2. Programmable Timer Block Diagram
The timer registers (TMRH and TMRL) shown in Figure 11-3 are
read-only locations which contain the current high and low bytes of the
16-bit free-running counter. Writing to the timer registers has no effect.
Reset of the device presets the timer counter to $FFFC.
The TMRL latch is a transparent read of the LSB until a read of the
TMRH takes place. A read of the TMRH latches the LSB into the TMRL
location until the TMRL is again read. The latched value remains fixed
even if multiple reads of the TMRH take place before the next read of the
TMRL. Therefore, when reading the MSB of the timer at TMRH, the LSB
of the timer at TMRL must also be read to complete the read sequence.
During power-on reset (POR), the counter is initialized to $FFFC and
begins counting after the oscillator startup delay. Because the counter is
16 bits and preceded by a fixed prescaler, the value in the counter
repeats every 262,144 internal bus clock cycles (524,288 oscillator
cycles).
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Programmable Timer
Alternate Counter Registers
Address:
Read:
$0018
Bit 7
6
5
4
3
2
1
Bit 0
Bit 15
14
13
12
11
10
9
Bit 8
1
1
1
1
1
1
1
1
Bit 7
6
5
4
3
2
1
Bit 0
Bit 7
6
5
4
3
2
1
Bit 0
1
1
1
1
1
1
0
0
Write:
Reset:
Freescale Semiconductor, Inc...
Address:
Read:
$0018
Write:
Reset:
= Unimplemented
Figure 11-3. Programmable Timer Registers (TMRH and TMRL)
When the free-running counter rolls over from $FFFF to $0000, the timer
overflow flag bit (TOF) is set in the TSR. When the TOF is set, it can
generate an interrupt if the timer overflow interrupt enable bit (TOIE) is
also set in the TCR. The TOF flag bit can only be reset by reading the
TMRL after reading the TSR.
Other than clearing any possible TOF flags, reading the TMRH and
TMRL in any order or any number of times does not have any effect on
the 16-bit free-running counter.
NOTE:
To prevent interrupts from occurring between readings of the TMRH and
TMRL, set the I bit in the condition code register (CCR) before reading
TMRH and clear the I bit after reading TMRL.
11.4 Alternate Counter Registers
The functional block diagram of the 16-bit free-running timer counter and
alternate counter registers is shown in Figure 11-4. The alternate
counter registers behave the same as the timer registers, except that
any reads of the alternate counter will not have any effect on the TOF
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flag bit and timer interrupts. The alternate counter registers include a
transparent buffer latch on the LSB of the 16-bit timer counter.
INTERNAL
DATA
BUS
Freescale Semiconductor, Inc...
LATCH
READ
ACRH
READ
RESET
$FFFC
READ
ACRL
ACRL ($001B)
ACRH ($001A)
TMR LSB
16-BIT COUNTER
÷4
INTERNAL
CLOCK
(OSC ÷ 2)
Figure 11-4. Alternate Counter Block Diagram
The alternate counter registers (ACRH and ACRL) shown in
Figure 11-5 are read-only locations which contain the current high and
low bytes of the 16-bit free-running counter. Writing to the alternate
counter registers has no effect. Reset of the device presets the timer
counter to $FFFC.
The ACRL latch is a transparent read of the LSB until a read of the
ACRH takes place. A read of the ACRH latches the LSB into the ACRL
location until the ACRL is again read. The latched value remains fixed
even if multiple reads of the ACRH take place before the next read of the
ACRL. Therefore, when reading the MSB of the timer at ACRH, the LSB
of the timer at ACRL must also be read to complete the read sequence.
During power-on reset (POR), the counter is initialized to $FFFC and
begins counting after the oscillator startup delay. Because the counter is
16 bits and preceded by a fixed prescaler, the value in the counter
repeats every 262,144 internal bus clock cycles (524,288 oscillator
cycles).
Reading the ACRH and ACRL in any order or any number of times does
not have any effect on the 16-bit free-running counter or the TOF flag bit.
NOTE:
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To prevent interrupts from occurring between readings of the ACRH and
ACRL, set the I bit in the condition code register (CCR) before reading
ACRH and clear the I bit after reading ACRL.
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Programmable Timer
Input Capture Registers
Address:
Read:
$001A
Bit 7
6
5
4
3
2
1
Bit 0
Bit 15
14
13
12
11
10
9
Bit 8
1
1
1
1
1
1
1
1
Bit 7
6
5
4
3
2
1
Bit 0
Bit 7
6
5
4
3
2
1
Bit 0
1
1
1
1
1
1
0
0
Write:
Reset:
Freescale Semiconductor, Inc...
Address:
Read:
$001B
Write:
Reset:
= Unimplemented
Figure 11-5. Alternate Counter Registers (ACRH and ACRL)
11.5 Input Capture Registers
The input capture function is a means to record the time at which an
event occurs. The source of the event can be the change on an external
pin (PB3/AN3/TCAP) or the CPF2 flag bit of voltage comparator 2 in the
analog subsystem. The ICEN bit in the analog subsystem control
register (ACR) at $001D selects which source is the input signal. When
the input capture circuitry detects an active edge on the selected source,
it latches the contents of the free-running timer counter registers into the
input capture registers as shown in Figure 11-6.
NOTE:
Both the ICEN bit in the ACR and the IEDG bit in the TCR must be set
when using voltage comparator 2 to trigger the input capture function.
Latching values into the input capture registers at successive edges of
the same polarity measures the period of the selected input signal.
Latching the counter values at successive edges of opposite polarity
measures the pulse width of the signal.
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Programmable Timer
INTERNAL
DATA
BUS
READ
ICRH
EDGE
SELECT
& DETECT
LOGIC
Freescale Semiconductor, Inc...
RESET
READ
ICRL
ICRL ($0015)
INTERNAL
CLOCK
(OSC ÷ 2)
÷4
16-BIT COUNTER
INPUT CAPTURE (ICF)
TIMER
INTERRUPT
REQUEST
ICIE
ICEN
CONTROL
BIT
ICRH ($0014)
IEDG
IEDG
CPF2
FLAG
BIT
FROM
ANALOG
SUBSYSTEM
LATCH
ICF
INPUT
SELECT
MUX
$FFFC
PB3
AN3
TCAP
TIMER CONTROL REG.
TIMER STATUS REG.
$0012
$0013
INTERNAL
DATA
BUS
Figure 11-6. Timer Input Capture Block Diagram
The input capture registers are made up of two 8-bit read-only registers
(ICRH and ICRL) as shown in Figure 11-7. The input capture edge
detector contains a Schmitt trigger to improve noise immunity. The edge
that triggers the counter transfer is defined by the input edge bit (IEDG)
in the TCR. Reset does not affect the contents of the input capture
registers.
Address:
Read:
$0014
Bit 7
6
5
4
3
2
1
Bit 0
Bit 15
14
13
12
11
10
9
Bit 8
Write:
Reset:
Address:
Read:
Unaffected by reset
$0015
Bit 7
6
5
4
3
2
1
Bit 0
Bit 7
6
5
4
3
2
1
Bit 0
Write:
Reset:
Unaffected by reset
= Unimplemented
Figure 11-7. Input Capture Registers (ICRH and ICRL)
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Programmable Timer
Output Compare Registers
Freescale Semiconductor, Inc...
The result obtained by an input capture will be one count higher than the
value of the free-running timer counter preceding the external transition.
This delay is required for internal synchronization. Resolution is affected
by the prescaler, allowing the free-running timer counter to increment
once every four internal clock cycles (eight oscillator clock cycles).
Reading the ICRH inhibits future captures until the ICRL is also read.
Reading the ICRL after reading the timer status register (TSR) clears the
ICF flag bit. There is no conflict between reading the ICRL and transfers
from the free-running timer counters. The input capture registers always
contain the free-running timer counter value which corresponds to the
most recent input capture.
NOTE:
To prevent interrupts from occurring between readings of the ICRH and
ICRL, set the I bit in the condition code register (CCR) before reading
ICRH and clear the I bit after reading ICRL.
11.6 Output Compare Registers
The output compare function is a means of generating an output signal
when the 16-bit timer counter reaches a selected value as shown in
Figure 11-8. Software writes the selected value into the output compare
registers. On every fourth internal clock cycle (every eight oscillator
clock cycles) the output compare circuitry compares the value of the
free-running timer counter to the value written in the output compare
registers. When a match occurs, the timer transfers the output level
(OLVL) from the timer control register (TCR) to the PB4/AN4/TCMP pin.
Software can use the output compare register to measure time periods,
to generate timing delays, or to generate a pulse of specific duration
or a pulse train of specific frequency and duty cycle on the
PB4/AN4/TCMP pin.
The planned action on the PB4/AN4/TCMP pin depends on the value
stored in the OLVL bit in the TCR, and it occurs when the value of the
16-bit free-running timer counter matches the value in the output
compare registers shown in Figure 11-9. These registers are read/write
bits and are unaffected by reset.
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Programmable Timer
R/W
OCRH
OCRH ($0016)
R/W
OCRL
OCRL ($0017)
EDGE
SELECT
DETECT
LOGIC
OLVL
16-BIT COMPARATOR
$FFFC
INTERNAL
CLOCK
(OSC ÷ 2)
÷4
16-BIT COUNTER
TIMER
INTERRUPT
REQUEST
OCF
OLVL
OCIE
Freescale Semiconductor, Inc...
OUTPUT COMPARE
(OCF)
RESET
PB4
AN4
TCMP
TIMER CONTROL REG.
TIMER STATUS REG.
$0012
$0013
INTERNAL
DATA
BUS
Figure 11-8. Timer Output Compare Block Diagram
Address:
$0016
Bit 7
6
5
4
3
2
1
Bit 0
Bit 15
14
13
12
11
10
9
Bit 8
Read:
Write:
Reset:
Address:
Unaffected by reset
$0017
Bit 7
6
5
4
3
2
1
Bit 0
Bit 7
6
5
4
3
2
1
Bit 0
Read:
Write:
Reset:
Unaffected by reset
Figure 11-9. Output Compare Registers (OCRH and OCRL)
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Programmable Timer
Output Compare Registers
Writing to the OCRH before writing to the OCRL inhibits timer compares
until the OCRL is written. Reading or writing to the OCRL after reading
the TCR will clear the output compare flag bit (OCF). The output
compare OLVL state will be clocked to its output latch regardless of the
state of the OCF.
To prevent OCF from being set between the time it is read and the time
the output compare registers are updated, use this procedure:
Freescale Semiconductor, Inc...
1. Disable interrupts by setting the I bit in the condition code register.
2. Write to the OCRH. Compares are now inhibited until OCRL is
written.
3. Read the TSR to arm the OCF for clearing.
4. Enable the output compare registers by writing to the OCRL. This
also clears the OCF flag bit in the TSR.
5. Enable interrupts by clearing the I bit in the condition code register.
A software example of this procedure is shown in Table 11-1.
Table 11-1. Output Compare Initialization Example
9B
...
...
B7
B6
BF
...
...
9A
16
13
17
SEI
...
...
STA
LDA
STX
...
...
CLI
OCRH
TSR
OCRL
DISABLE INTERRUPTS
.....
.....
INHIBIT OUTPUT COMPARE
ARM OCF FLAG FOR CLEARING
READY FOR NEXT COMPARE, OCF CLEARED
.....
.....
ENABLE INTERRUPTS
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11.7 Timer Control Register
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The timer control register (TCR) shown in Figure 11-10, performs the
following functions:
•
Enables input capture interrupts
•
Enables output compare interrupts
•
Enables timer overflow interrupts
•
Controls the active edge polarity of the TCAP signal
•
Controls the active level of the TCMP output
Reset clears all the bits in the TCR with the exception of the IEDG bit
which is unaffected.
Address:
$0012
Bit 7
6
5
ICIE
OCIE
TOIE
0
0
0
Read:
4
3
2
0
0
0
1
Bit 0
IEDG
OLVL
U
0
Write:
Reset:
= Unimplemented
0
0
0
U = Unaffected
Figure 11-10. Timer Control Register (TCR)
ICIE — Input Capture Interrupt Enable Bit
This read/write bit enables interrupts caused by an active signal on
the TCAP pin or from CPF2 flag bit of the analog subsystem voltage
comparator 2. Reset clears the ICIE bit.
1 = Input capture interrupts enabled
0 = Input capture interrupts disabled
OCIE — Output Compare Interrupt Enable Bit
This read/write bit enables interrupts caused by an active match of the
output compare function. Reset clears the OCIE bit.
1 = Output compare interrupts enabled
0 = Output compare interrupts disabled
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Programmable Timer
Timer Status Register
TOIE — Timer Overflow Interrupt Enable
This read/write bit enables interrupts caused by a timer overflow.
Reset clears the TOIE bit.
1 = Timer overflow interrupts enabled
0 = Timer overflow interrupts disabled
Freescale Semiconductor, Inc...
IEDG — Input Capture Edge Select
The state of this read/write bit determines whether a positive or
negative transition triggers a transfer of the contents of the timer
register to the input capture register. This transfer can occur due to
transitions on the TCAP pin or the CPF2 flag bit of voltage comparator
2. Resets have no effect on the IEDG bit.
1 = Positive edge (low-to-high transition) triggers input capture
0 = Negative edge (high-to-low transition) triggers input capture
NOTE:
The IEDG bit must be set when either mode 2 or 3 of the analog
subsystem is being used for A/D conversions. Otherwise, the input
capture will not occur on the rising edge of the comparator 2 flag.
OLVL — Output Compare Output Level Select
The state of this read/write bit determines whether a logic 1 or a logic
0 is transferred to the TCMP pin when a successful output compare
occurs. Reset clears the OLVL bit.
1 = Signal to TCMP pin goes high on output compare.
0 = Signal to TCMP pin goes low on output compare.
11.8 Timer Status Register
The timer status register (TSR) shown in Figure 11-11 contains flags for
these events:
•
An active signal on the TCAP pin or the CPF2 flag bit of voltage
comparator 2 in the analog subsystem, transferring the contents
of the timer registers to the input capture registers
•
A match between the 16-bit counter and the output compare
registers, transferring the OLVL bit to the PB4/AN4/TCMP pin if
that pin is set as an output
•
An overflow of the timer registers from $FFFF to $0000
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Writing to any of the bits in the TSR has no effect. Reset does not
change the state of any of the flag bits in the TSR.
Address:
Read:
$0013
Bit 7
6
5
4
3
2
1
Bit 0
ICF
OCF
TOF
0
0
0
0
0
U
U
U
0
0
0
0
0
Write:
Reset:
Freescale Semiconductor, Inc...
= Unimplemented
U = Unaffected
Figure 11-11. Timer Status Register (TSR)
ICF — Input Capture Flag
The ICF bit is automatically set when an edge of the selected polarity
occurs on the TCAP pin. Clear the ICF bit by reading the timer status
register with the ICF set, and then reading the low byte (ICRL, $0015)
of the input capture registers. Resets have no effect on ICF.
OCF — Output Compare Flag
The OCF bit is automatically set when the value of the timer registers
matches the contents of the output compare registers. Clear the OCF
bit by reading the timer status register with the OCF set and then
accessing the low byte (OCRL, $0017) of the output compare
registers. Resets have no effect on OCF.
TOF — Timer Overflow Flag
The TOF bit is automatically set when the 16-bit timer counter rolls
over from $FFFF to $0000. Clear the TOF bit by reading the timer
status register with the TOF set and then accessing the low byte
(TMRL, $0019) of the timer registers. Resets have no effect on TOF.
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Programmable Timer
Timer Operation during Wait Mode
11.9 Timer Operation during Wait Mode
During wait mode, the 16-bit timer continues to operate normally and
may generate an interrupt to trigger the MCU out of wait mode.
Freescale Semiconductor, Inc...
11.10 Timer Operation during Stop Mode
When the MCU enters stop mode, the free-running counter stops
counting (the internal processor clock is stopped). It remains at that
particular count value until stop mode is exited by applying a low signal
to the IRQ/VPP pin, at which time the counter resumes from its stopped
value as if nothing had happened. If stop mode is exited via an external
reset (logic low applied to the RESET pin), the counter is forced to
$FFFC.
If a valid input capture edge occurs during stop mode, the input capture
detect circuitry will be armed. This action does not set any flags or wake
up the MCU, but when the MCU does wake up there will be an active
input capture flag (and data) from the first valid edge. If the stop mode is
exited by an external reset, no input capture flag or data will be present
even if a valid input capture edge was detected during stop mode.
11.11 Timer Operation during Halt Mode
When the MCU enters halt mode, the functions and states of the 16-bit
programmable timer are the same as for wait mode described in
11.9 Timer Operation during Wait Mode.
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Programmable Timer
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Section 12. Personality EPROM (PEPROM)
12.1 Contents
Freescale Semiconductor, Inc...
12.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 175
12.3 PEPROM Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 177
12.3.1 PEPROM Bit Select Register . . . . . . . . . . . . . . . . . . . . . . . 177
12.3.2 PEPROM Status and Control Register. . . . . . . . . . . . . . . . 178
12.4
PEPROM Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 179
12.5
PEPROM Reading . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .180
12.6
PEPROM Erasing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 181
12.2 Introduction
This section describes how to program the 64-bit personality erasable
programmable read-only memory (PEPROM). Figure 12-1 shows the
structure of the PEPROM subsystem.
NOTE:
In packages with no quartz window, the PEPROM functions as one-time
programmable ROM (OTPROM).
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Personality EPROM (PEPROM)
INTERNAL DATA BUS
$000F
0
0
0
0
RESET
PEPRZF
PEDATA
SINGLE
SENSE
AMPLIFIER
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PEPGM
0
PEPROM STATUS/CONTROL REGISTER
VPP
ROW 0
ROW 1
ROW 2
ROW 3
ROW 4
ROW 5
ROW 6
COL 7
COL 6
COL 5
COL 4
COL 3
COL 2
COL 1
COL 0
ROW 7
8-TO-1 COLUMN DECODER
AND MULTIPLEXER
VPP SWITCH
8-TO-1 ROW DECODER
AND MULTIPLEXER
VPP SWITCH
PEB0
PEB1
PEB2
PEB3
PEB4
PEB5
0
0
ROW ZERO
DECODER
PEPROM BIT SELECT REGISTER
RESET
$000E
INTERNAL DATA BUS
Figure 12-1. Personality EPROM Block Diagram
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Personality EPROM (PEPROM)
PEPROM Registers
12.3 PEPROM Registers
Two I/O registers control programming and reading of the PEPROM:
•
The PEPROM bit select register (PEBSR)
•
The PEPROM status and control register (PESCR)
12.3.1 PEPROM Bit Select Register
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The PEPROM bit select register (PEBSR) selects one of 64 bits in the
PEPROM array. Reset clears all the bits in the PEPROM bit select
register.
Address:
$000E
Bit 7
6
5
4
3
2
1
Bit 0
PEB7
PEB6
PEB5
PEB4
PEB3
PEB2
PEB1
PEB0
0
0
0
0
0
0
0
0
Read:
Write:
Reset:
Figure 12-2. PEPROM Bit Select Register (PEBSR)
PEB7 and PEB6 — Not connected to the PEPROM array
These read/write bits are available as storage locations. Reset clears
PEB7 and PEB6.
PEB5–PEB0 — PEPROM Bit Selects
These read/write bits select one of 64 bits in the PEPROM as shown
in Table 12-1. Bits PEB2–0 select the PEPROM row, and bits
PEB5–PEB3 select the PEPROM column. Reset clears PEB5–PEB0,
selecting the PEPROM bit in row zero, column zero.
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Personality EPROM (PEPROM)
12.3.2 PEPROM Status and Control Register
The PEPROM status and control register (PESCR) controls the
PEPROM programming voltage. This register also transfers the
PEPROM bits to the internal data bus and contains a flag bit when row
zero is selected.
Freescale Semiconductor, Inc...
Address:
Read:
$000F
Bit 7
6
PEDATA
0
5
4
3
2
1
Bit 0
0
0
0
0
PEPRZF
R
R
R
0
0
0
PEPGM
Write:
Reset:
U
0
0
= Unimplemented
0
R
= Reserved
1
U = Unaffected
Figure 12-3. PEPROM Status and Control Register (PESCR)
PEDATA — PEPROM Data Bit
This read-only bit is the output state of the PEPROM sense amplifier
and shows the state of the currently selected bit. The state of the
PEDATA bit does not affect the programming of the bit selected by the
PEBSR. Reset does not affect the PEDATA bit.
1 = PEPROM data is a logic 1.
0 = PEPROM data is a logic 0.
PEPGM — PEPROM Program Control Bit
This read/write bit controls the switches that apply the programming
voltage from the IRQ/VPP pin to the selected PEPROM bit cell. When
the PEPGM bit is set, the selected bit cell will be programmed to a
logic 1, regardless of the state of the PEDATA bit. Reset clears the
PEPGM bit.
1 = Programming voltage applied to array bit
0 = Programming voltage not applied to array bit
PEPRZF — PEPROM Row Zero Flag
This read-only bit is set when the PEPROM bit select register selects
the first row (row zero) of the PEPROM array. Selecting any other row
clears PEPRZF. Monitoring PEPRZF can reduce the code needed to
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Personality EPROM (PEPROM)
PEPROM Programming
access one byte of eight PEPROM locations. Reset clears the
PEPROM bit select register, thereby setting the PEPRZF bit by
default.
1 = Row zero selected
0 = Row zero not selected
Table 12-1. PEPROM Bit Selection
Freescale Semiconductor, Inc...
PEBSR
$00
$01
|
V
$07
$08
$09
|
V
$37
$38
$39
|
V
$3E
$3F
PEPROM Bit Selected
Row 0
Row 1
|
V
Row 7
Row 0
Row 1
|
V
Row 7
Row 0
Row 1
|
V
Row 6
Row 7
Column 0
Column 0
|
V
Column 0
Column 1
Column 1
|
V
Column 6
Column 7
Column 7
|
V
Column 7
Column 7
12.4 PEPROM Programming
Factory-provided software for programming the PEPROM is available on
the World Wide Web at:
http://www.motorola.com/mcu/
NOTE:
While the PEPGM bit is set and the VPP voltage level is applied to the
IRQ/VPP pin, do not access bits that are to be left unprogrammed
(erased).
To program the PEPROM bits properly, the VDD voltage must be greater
than 4.5 Vdc.
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Personality EPROM (PEPROM)
The PEPROM can also be programmed by user software with the VPP
voltage level applied to the IRQ/VPP pin. This sequence shows how to
program each PEPROM bit:
1. Select a PEPROM bit by writing to the PEBSR.
2. Set the PEPGM bit in the PESCR.
3. Wait for the programming time, tEPGM.
Freescale Semiconductor, Inc...
4. Clear the PEPGM bit.
5. Move to next PEPROM bit to be programmed in step 1.
12.5 PEPROM Reading
This sequence shows how to read the PEPROM:
1. Select a bit by writing to the PEBSR.
2. Read the PEDATA bit in the PESCR.
3. Store the PEDATA bit in RAM or in a register.
4. Select another bit by changing the PEBSR.
5. Continue reading and storing the PEDATA bits until the required
personality EPROM data is retrieved and stored.
Reading the PEPROM is easiest when each PEPROM column contains
one byte. Selecting a row 0 bit selects the first bit, and incrementing the
PEPROM bit select register (PEBSR) selects the next bit in row 1 from
the same column. Incrementing PEBSR seven more times selects the
remaining bits of the column and ends up selecting the bit in row 0 of the
next column, thereby setting the row 0 flag, PEPRZF.
NOTE:
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A PEPROM byte that has been read can be transferred to the personality
EPROM bit select register (PEBSR) as a temporary storage location
such that subsequent reads of the PEBSR quickly yield that PEPROM
byte.
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Personality EPROM (PEPROM)
PEPROM Erasing
12.6 PEPROM Erasing
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MCUs with windowed packages permit PEPROM erasing with ultraviolet
light. Erase the PEPROM by exposing it to 15 Ws/cm2 of ultraviolet light
with a wavelength of 2537 angstroms. Position the ultraviolet light
source 1 inch from the window. Do not use a shortwave filter. The erased
state of a PEPROM bit is a logic 0.
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Personality EPROM (PEPROM)
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Section 13. EPROM/OTPROM
13.1 Contents
Freescale Semiconductor, Inc...
13.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 183
13.3 EPROM Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .184
13.3.1 EPROM Programming Register . . . . . . . . . . . . . . . . . . . . . 184
13.3.2 Mask Option Register. . . . . . . . . . . . . . . . . . . . . . . . . . . . .185
13.3.3 EPROM Security Bit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 188
13.4 EPROM Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189
13.4.1 MOR Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 189
13.4.2 EPMSEC Programming . . . . . . . . . . . . . . . . . . . . . . . . . . . 190
13.5
EPROM Erasing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 190
13.2 Introduction
This section describes how to program the 6160-byte erasable
programmable read-only memory/one-time programmable read-only
memory (EPROM/OTPROM), the mask option register (MOR), and the
EPROM security bit (EPMSEC).
NOTE:
In packages with no quartz window, the EPROM functions as one-time
programmable ROM (OTPROM).
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EPROM/OTPROM
13.3 EPROM Registers
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The EPROM programming register (EPROG) controls the actual
programming of the EPROM bytes and the mask option register (MOR).
The MOR controls eight mask options found on the read-only memory
(ROM) version of this microcontroller unit (MCU). There is an additional
EPROM bit (EPMSEC) located at the computer operating properly
(COP) address to provide EPROM array security.
13.3.1 EPROM Programming Register
The EPROM programming register (EPROG) shown in Figure 13-1
contains the control bits for programming the EPROM. In normal
operation, the EPROM programming register contains all logic 0s.
Address:
Read:
$001C
Bit 7
6
5
4
3
0
0
0
0
0
R
R
R
R
0
0
0
0
Write:
Reset:
0
= Unimplemented
R
2
1
Bit 0
ELAT
MPGM
EPGM
0
0
0
= Reserved for test
Figure 13-1. EPROM Programming Register (EPROG)
EPGM — EPROM Programming Bit
This read/write bit applies the voltage from the IRQ/VPP pin to the
EPROM. To write the EPGM bit, the ELAT bit must already be set.
Clearing the ELAT bit also clears the EPGM bit. Reset clears EPGM.
1 = EPROM programming power switched on
0 = EPROM programming power switched off
MPGM — Mask Option Register (MOR) Programming Bit
This read/write bit applies programming power from the IRQ/VPP pin
to the MOR. Reset clears MPGM.
1 = MOR programming power switched on
0 = MOR programming power switched off
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EPROM/OTPROM
EPROM Registers
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ELAT — EPROM Bus Latch Bit
This read/write bit configures address and data buses for
programming the EPROM array. EPROM data cannot be read when
ELAT is set. Clearing the ELAT bit also clears the EPGM bit. Reset
clears ELAT.
1 = Address and data buses configured for EPROM programming
of the array. The address and data buses are latched in the
EPROM array when a subsequent write to the array is made.
Data in the EPROM array cannot be read.
0 = Address and data buses configured for normal operation
Whenever the ELAT bit is cleared, the EPGM bit is also cleared. Both the
EPGM and the ELAT bit cannot be set using the same write instruction.
Any attempt to set both the ELAT and EPGM bit on the same write
instruction cycle will result in the ELAT bit being set and the EPGM bit
being cleared. To program a byte of EPROM, manipulate the EPROG
register as follows:
1. Set the ELAT bit in the EPROG register.
2. Write the desired data to the desired EPROM address.
3. Set the EPGM bit in the EPROG register for the specified
programming time, tEPGM.
4. Clear the ELAT and EPGM bits in the EPROG register.
13.3.2 Mask Option Register
The mask option register (MOR) shown in Figure 13-2 is an EPROM
byte that controls eight mask options. The MOR is unaffected by reset.
The erased state of the MOR is $00. The options that can be
programmed by the MOR are:
1. Port software programmable pulldown devices (enable or disable)
2. Startup delay after stop (16 or 4064 cycles)
3. Oscillator shunt resistor (2 MΩ or open)
4. STOP instruction (enable or disable)
5. Low-voltage reset (enable or disable)
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EPROM/OTPROM
6. Port A external interrupt function (enable or disable)
7. IRQ trigger sensitivity (edge-triggered only or both edge- and
level-triggered)
8. COP watchdog (enable or disable)
Address:
$1FF1
Bit 7
6
5
4
3
2
1
Bit 0
SWPDI
DELAY
OSCRES
SWAIT
LVREN
PIRQ
LEVEL
COPEN
0
0
0
Read:
Freescale Semiconductor, Inc...
Write:
Reset:
Erased:
Unaffected by reset
0
0
0
0
0
Figure 13-2. Mask Option Register (MOR)
SWPDI — Software Pulldown Inhibit Bit
This EPROM bit inhibits software control of the port A and port B
pulldown devices.
1 = Software pulldown inhibited
0 = Software pulldown enabled
DELAY — Stop Startup Delay Bit
This EPROM bit selects the number of bus cycles that must elapse
before bus activity begins following a restart from the stop mode.
1 = Startup delay is 4064 bus cycles.
0 = Startup delay is 16 bus cycles.
CAUTION:
The 16-cycle delay option will work properly in devices with the internal
low-power oscillator or with a steady external clock source. Check
crystal/ceramic resonator specifications carefully before using the
16-cycle delay option with a crystal or ceramic resonator.
OSCRES — Oscillator Resistor Bit
This EPROM bit configures the internal shunt resistor.
1 = Oscillator configured with 2 M¾ shunt resistor
0 = Oscillator configured without a shunt resistor
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EPROM/OTPROM
EPROM Registers
NOTE:
The optional oscillator resistor is NOT recommended for devices that
use an external RC oscillator. For such devices, this bit should be left
erased as a 0.
SWAIT — STOP Conversion to WAIT Bit
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This EPROM bit disables the STOP instruction and prevents
inadvertently turning off the COP watchdog with a STOP instruction.
When the SWAIT bit is set, a STOP instruction puts the MCU in halt
mode. Halt mode is a wait-like low-power state. The internal oscillator
and timer clock continue to run, but the CPU clock stops. When the
SWAIT bit is clear, a STOP instruction stops the internal oscillator, the
internal clock, the CPU clock, the timer clock, and the COP watchdog
timer.
1 = STOP instruction converted to WAIT instruction
0 = STOP instruction not converted to WAIT instruction
LVREN — Low-Voltage Reset Enable Bit
This EPROM bit enables the low-voltage reset (LVR) function.
1 = LVR function enabled
0 = LVR function disabled
PIRQ — Port A IRQ Enable Bit
This EPROM bit enables the PA3–PA0 pins to function as external
interrupt sources.
1 = PA3–PA0 enabled as external interrupt sources
0 = PA3–PA0 not enabled as external interrupt sources
LEVEL — External Interrupt Sensitivity Bit
This EPROM bit makes the external interrupt inputs level-triggered as
well as edge-triggered
1 = IRQ/VPP pin negative-edge triggered and low-level triggered;
PA3–PA0 pins positive-edge triggered and high-level triggered
0 = IRQ/VPP pin negative-edge triggered only; PA3–PA0 pins
positive-edge triggered only
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EPROM/OTPROM
COPEN — COP Watchdog Enable Bit
This EPROM bit enables the COP watchdog.
1 = COP watchdog enabled
0 = COP watchdog disabled
13.3.3 EPROM Security Bit
Freescale Semiconductor, Inc...
An EPROM programmable bit is provided at the location of the COP
watchdog register at $1FF0 as shown in Figure 13-3. This bit allows
control of access to the EPROM array. Any accesses of the EPROM
locations will return undefined results when the EPMSEC bit is set. Refer
to 13.4.2 EPMSEC Programming for programming instructions.
Address:
$1FF0
Bit 7
6
5
4
3
2
1
Bit 0
Read:
OPT
Write:
EPMSEC
COPC
Reset:
Erased:
Unaffected by reset
0
—
—
—
—
—
—
—
= Unimplemented
Figure 13-3. EPROM Security in COP and Security Register (COPR)
EPMSEC — EPROM Security1
This EPROM write-only bit enables the access to the EPROM array.
1 = Access to the EPROM array in non-user modes is denied.
0 = Access to the EPROM array in non-user modes is enabled.
1. No security feature is absolutely secure. However, Motorola’s strategy is to make reading or
copying the EPROM/OTPROM difficult for unauthorized users.
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EPROM/OTPROM
EPROM Programming
13.4 EPROM Programming
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A programming board is available from Motorola to download to the
on-chip EPROM/OTPROM using the factory-provided programming
software. Factory-provided software for programming the PEPROM is
available on the World Wide Web at:
http://www.motorola.com/mcu/
The programming software copies to the 6144-byte space located at
EPROM addresses $0700–$1EFF and to the 16-byte space at
addresses $1FF0–$1FFF which includes the mask option register at
address $1FF1, and the security bit at address $1FF0.
NOTE:
To program the EPROM/OTPROM, MOR, or EPMSEC bits properly, the
VDD voltage must be greater than 4.5 volts.
13.4.1 MOR Programming
The contents of the MOR should be programmed using the programmer
board. To program any bits in the MOR, the desired bit states must be
written to the MOR address and then the MPGM bit in the EPROG
register must be used. The following sequence will program the MOR:
1. Write the desired data to the MOR location ($1FF1).
2. Apply the programming voltage to the IRQ/VPP pin.
3. Set the MPGM bit in the EPROG.
4. Wait for the programming time, tMPGM.
5. Clear the MPGM bit in the EPROG.
6. Remove the programming voltage from the IRQ/VPP pin.
Once the MOR bits have been programmed, some of the options may
experience glitches in operation after removal of the programming
voltage. It is recommended that the part be reset before trying to verify
the contents of the user EPROM or the MOR itself.
NOTE:
The contents of the EPROM or the MOR cannot be accessed if the
EPMSEC bit in the COPR register has been set.
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EPROM/OTPROM
13.4.2 EPMSEC Programming
The EPMSEC bit is programmable. To program the EPMSEC bit, the
desired state must be written to the COP address and then the MPGM
bit in the EPROG register must be used. The following sequence will
program the EPMSEC bit:
1. Write the desired data to bit 7 of the COPR location ($1FF0).
Freescale Semiconductor, Inc...
2. Apply the programming voltage to the IRQ/VPP pin.
3. Set the MPGM bit in the EPROG.
4. Wait for the programming time, tMPGM.
5. Clear the MPGM bit in the EPROG.
6. Remove the programming voltage from the IRQ/VPP pin.
Once the EPMSEC bit has been programmed to a logic 1, access to the
contents of the EPROM and MOR in the expanded non-user modes will
be denied. It is therefore recommended that the user EPROM and MOR
in the part first be programmed and fully verified before setting the
EPMSEC bit.
13.5 EPROM Erasing
MCUs with windowed packages permit EPROM erasing with ultraviolet
light. Erase the EPROM by exposing it to 15 Ws/cm2 of ultraviolet light
with a wavelength of 2537 angstroms. Position the ultraviolet light
source 1 inch from the window. Do not use a shortwave filter. The erased
state of an EPROM bit is a logic 0.
NOTE:
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Unlike many commercial EPROMs, an erased EPROM byte in the MCU
will read as $00. All unused locations should be programmed as 0s.
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Section 14. Instruction Set
14.1 Contents
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14.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 191
14.3 Addressing Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .192
14.3.1 Inherent . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192
14.3.2 Immediate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192
14.3.3 Direct . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
14.3.4 Extended . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
14.3.5 Indexed, No Offset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
14.3.6 Indexed, 8-Bit Offset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 193
14.3.7 Indexed, 16-Bit Offset. . . . . . . . . . . . . . . . . . . . . . . . . . . . .194
14.3.8 Relative . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 194
14.4 Instruction Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 195
14.4.1 Register/Memory Instructions. . . . . . . . . . . . . . . . . . . . . . . 195
14.4.2 Read-Modify-Write Instructions . . . . . . . . . . . . . . . . . . . . . 196
14.4.3 Jump/Branch Instructions. . . . . . . . . . . . . . . . . . . . . . . . . . 197
14.4.4 Bit Manipulation Instructions . . . . . . . . . . . . . . . . . . . . . . . 199
14.4.5 Control Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200
14.5
Instruction Set Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . 201
14.6
Opcode Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 207
14.2 Introduction
The microcontroller unit (MCU) instruction set has 62 instructions and
uses eight addressing modes. The instructions include all those of the
M146805 CMOS Family plus one more: the unsigned multiply (MUL)
instruction. The MUL instruction allows unsigned multiplication of the
contents of the accumulator (A) and the index register (X). The
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high-order product is stored in the index register, and the low-order
product is stored in the accumulator.
14.3 Addressing Modes
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The CPU uses eight addressing modes for flexibility in accessing data.
The addressing modes provide eight different ways for the CPU to find
the data required to execute an instruction. The eight addressing modes
are:
•
Inherent
•
Immediate
•
Direct
•
Extended
•
Indexed, no offset
•
Indexed, 8-bit offset
•
Indexed, 16-bit offset
•
Relative
14.3.1 Inherent
Inherent instructions are those that have no operand, such as return
from interrupt (RTI) and stop (STOP). Some of the inherent instructions
act on data in the CPU registers, such as set carry flag (SEC) and
increment accumulator (INCA). Inherent instructions require no operand
address and are one byte long.
14.3.2 Immediate
Immediate instructions are those that contain a value to be used in an
operation with the value in the accumulator or index register. Immediate
instructions require no operand address and are two bytes long. The
opcode is the first byte, and the immediate data value is the second byte.
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Addressing Modes
14.3.3 Direct
Direct instructions can access any of the first 256 memory locations with
two bytes. The first byte is the opcode, and the second is the low byte of
the operand address. In direct addressing, the CPU automatically uses
$00 as the high byte of the operand address.
Freescale Semiconductor, Inc...
14.3.4 Extended
Extended instructions use three bytes and can access any address in
memory. The first byte is the opcode; the second and third bytes are the
high and low bytes of the operand address.
When using the Motorola assembler, the programmer does not need to
specify whether an instruction is direct or extended. The assembler
automatically selects the shortest form of the instruction.
14.3.5 Indexed, No Offset
Indexed instructions with no offset are 1-byte instructions that can
access data with variable addresses within the first 256 memory
locations. The index register contains the low byte of the effective
address of the operand. The CPU automatically uses $00 as the high
byte, so these instructions can address locations $0000–$00FF.
Indexed, no offset instructions are often used to move a pointer through
a table or to hold the address of a frequently used random-access
memory (RAM) or input/output (I/O) location.
14.3.6 Indexed, 8-Bit Offset
Indexed, 8-bit offset instructions are 2-byte instructions that can access
data with variable addresses within the first 511 memory locations. The
CPU adds the unsigned byte in the index register to the unsigned byte
following the opcode. The sum is the effective address of the operand.
These instructions can access locations $0000–$01FE.
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Indexed 8-bit offset instructions are useful for selecting the kth element
in an n-element table. The table can begin anywhere within the first 256
memory locations and could extend as far as location 510 ($01FE). The
k value is typically in the index register, and the address of the beginning
of the table is in the byte following the opcode.
Freescale Semiconductor, Inc...
14.3.7 Indexed, 16-Bit Offset
Indexed, 16-bit offset instructions are 3-byte instructions that can access
data with variable addresses at any location in memory. The CPU adds
the unsigned byte in the index register to the two unsigned bytes
following the opcode. The sum is the effective address of the operand.
The first byte after the opcode is the high byte of the 16-bit offset; the
second byte is the low byte of the offset.
Indexed, 16-bit offset instructions are useful for selecting the kth element
in an n-element table anywhere in memory.
As with direct and extended addressing, the Motorola assembler
determines the shortest form of indexed addressing.
14.3.8 Relative
Relative addressing is only for branch instructions. If the branch
condition is true, the CPU finds the effective branch destination by
adding the signed byte following the opcode to the contents of the
program counter. If the branch condition is not true, the CPU goes to the
next instruction. The offset is a signed, two’s complement byte that gives
a branching range of –128 to +127 bytes from the address of the next
location after the branch instruction.
When using the Motorola assembler, the programmer does not need to
calculate the offset, because the assembler determines the proper offset
and verifies that it is within the span of the branch.
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Instruction Set
Instruction Types
14.4 Instruction Types
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The MCU instructions fall into the following five categories:
•
Register/memory instructions
•
Read-modify-write instructions
•
Jump/branch instructions
•
Bit manipulation instructions
•
Control instructions
14.4.1 Register/Memory Instructions
These instructions operate on CPU registers and memory locations.
Most of them use two operands. One operand is in either the
accumulator or the index register. The CPU finds the other operand in
memory.
Table 14-1. Register/Memory Instructions
Instruction
Add Memory Byte and Carry Bit to Accumulator
ADC
Add Memory Byte to Accumulator
ADD
AND Memory Byte with Accumulator
AND
Bit Test Accumulator
BIT
Compare Accumulator
CMP
Compare Index Register with Memory Byte
CPX
EXCLUSIVE OR Accumulator with Memory Byte
EOR
Load Accumulator with Memory Byte
LDA
Load Index Register with Memory Byte
LDX
Multiply
MUL
OR Accumulator with Memory Byte
ORA
Subtract Memory Byte and Carry Bit from Accumulator
SBC
Store Accumulator in Memory
STA
Store Index Register in Memory
STX
Subtract Memory Byte from Accumulator
SUB
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14.4.2 Read-Modify-Write Instructions
These instructions read a memory location or a register, modify its
contents, and write the modified value back to the memory location or to
the register.
NOTE:
Do not use read-modify-write operations on write-only registers.
Table 14-2. Read-Modify-Write Instructions
Freescale Semiconductor, Inc...
Instruction
Mnemonic
Arithmetic Shift Left (Same as LSL)
ASL
Arithmetic Shift Right
ASR
Bit Clear
BCLR(1)
Bit Set
BSET(1)
Clear Register
CLR
Complement (One’s Complement)
COM
Decrement
DEC
Increment
INC
Logical Shift Left (Same as ASL)
LSL
Logical Shift Right
LSR
Negate (Two’s Complement)
NEG
Rotate Left through Carry Bit
ROL
Rotate Right through Carry Bit
ROR
TST(2)
Test for Negative or Zero
1. Unlike other read-modify-write instructions, BCLR and
BSET use only direct addressing.
2. TST is an exception to the read-modify-write sequence because it does not write a replacement value.
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Instruction Set
Instruction Types
14.4.3 Jump/Branch Instructions
Jump instructions allow the CPU to interrupt the normal sequence of the
program counter. The unconditional jump instruction (JMP) and the
jump-to-subroutine instruction (JSR) have no register operand. Branch
instructions allow the CPU to interrupt the normal sequence of the
program counter when a test condition is met. If the test condition is not
met, the branch is not performed.
Freescale Semiconductor, Inc...
The BRCLR and BRSET instructions cause a branch based on the state
of any readable bit in the first 256 memory locations. These 3-byte
instructions use a combination of direct addressing and relative
addressing. The direct address of the byte to be tested is in the byte
following the opcode. The third byte is the signed offset byte. The CPU
finds the effective branch destination by adding the third byte to the
program counter if the specified bit tests true. The bit to be tested and its
condition (set or clear) is part of the opcode. The span of branching is
from –128 to +127 from the address of the next location after the branch
instruction. The CPU also transfers the tested bit to the carry/borrow bit
of the condition code register.
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Table 14-3. Jump and Branch Instructions
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Instruction
Branch if Carry Bit Clear
BCC
Branch if Carry Bit Set
BCS
Branch if Equal
BEQ
Branch if Half-Carry Bit Clear
BHCC
Branch if Half-Carry Bit Set
BHCS
Branch if Higher
BHI
Branch if Higher or Same
BHS
Branch if IRQ/VPP Pin High
BIH
Branch if IRQ/VPP Pin Low
BIL
Branch if Lower
BLO
Branch if Lower or Same
BLS
Branch if Interrupt Mask Clear
BMC
Branch if Minus
BMI
Branch if Interrupt Mask Set
BMS
Branch if Not Equal
BNE
Branch if Plus
BPL
Branch Always
BRA
Branch if Bit Clear
BRCLR
Branch Never
BRN
Branch if Bit Set
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Mnemonic
BRSET
Branch to Subroutine
BSR
Unconditional Jump
JMP
Jump to Subroutine
JSR
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Instruction Types
14.4.4 Bit Manipulation Instructions
The CPU can set or clear any writable bit in the first 256 bytes of
memory, which includes I/O registers and on-chip RAM locations. The
CPU can also test and branch based on the state of any bit in any of the
first 256 memory locations.
Table 14-4. Bit Manipulation Instructions
Instruction
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Bit Clear
BCLR
Branch if Bit Clear
BRCLR
Branch if Bit Set
BRSET
Bit Set
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Instruction Set
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BSET
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Instruction Set
14.4.5 Control Instructions
These instructions act on central processor unit (CPU) registers and
control CPU operation during program execution.
Table 14-5. Control Instructions
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Instruction
Clear Carry Bit
CLC
Clear Interrupt Mask
CLI
No Operation
NOP
Reset Stack Pointer
RSP
Return from Interrupt
RTI
Return from Subroutine
RTS
Set Carry Bit
SEC
Set Interrupt Mask
SEI
Stop Oscillator and Enable IRQ/VPP Pin
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Mnemonic
STOP
Software Interrupt
SWI
Transfer Accumulator to Index Register
TAX
Transfer Index Register to Accumulator
TXA
Stop CPU Clock and Enable Interrupts
WAIT
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Instruction Set
Instruction Set Summary
14.5 Instruction Set Summary
.
ADD #opr
ADD opr
ADD opr
ADD opr,X
ADD opr,X
ADD ,X
AND #opr
AND opr
AND opr
AND opr,X
AND opr,X
AND ,X
ASL opr
ASLA
ASLX
ASL opr,X
ASL ,X
— IMM
DIR
EXT
IX2
IX1
IX
A9
ii
B9 dd
C9 hh ll
D9 ee ff
E9
ff
F9
2
3
4
5
4
3
— IMM
DIR
EXT
IX2
IX1
IX
AB
ii
BB dd
CB hh ll
DB ee ff
EB
ff
FB
2
3
4
5
4
3
— — —
IMM
DIR
EXT
IX2
IX1
IX
A4
ii
B4 dd
C4 hh ll
D4 ee ff
E4
ff
F4
2
3
4
5
4
3
38
48
58
68
78
dd
— — DIR
INH
INH
IX1
IX
5
3
3
6
5
DIR
INH
INH
IX1
IX
37
47
57
67
77
dd
REL
24
rr
3
DIR (b0)
DIR (b1)
DIR (b2)
DIR (b3)
— — — — —
DIR (b4)
DIR (b5)
DIR (b6)
DIR (b7)
11
13
15
17
19
1B
1D
1F
dd
dd
dd
dd
dd
dd
dd
dd
5
5
5
5
5
5
5
5
Effect
on CCR
Description
H I N Z C
A ←(A) + (M) + (C)
Add with Carry
A ←(A) + (M)
Add without Carry
A ←(A) ∧ (M)
Logical AND
Arithmetic Shift Left
(Same as LSL)
ASR opr
ASRA
ASRX
ASR opr,X
ASR ,X
Arithmetic Shift Right
BCC rel
Branch if Carry Bit
Clear
C
0
b7
b0
C
b7
b0
PC ←(PC) + 2 + rel ? C = 0
Mn ←0
— — — — — — —
ff
ff
Cycles
Opcode
ADC #opr
ADC opr
ADC opr
ADC opr,X
ADC opr,X
ADC ,X
Operation
Address
Mode
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Source
Form
Operand
Table 14-6. Instruction Set Summary (Sheet 1 of 7)
5
3
3
6
5
BCLR n opr
Clear Bit n
BCS rel
Branch if Carry Bit Set
(Same as BLO)
PC ←(PC) + 2 + rel ? C = 1
— — — — —
REL
25
rr
3
BEQ rel
Branch if Equal
PC ←(PC) + 2 + rel ? Z = 1
— — — — —
REL
27
rr
3
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Instruction Set
Address
Mode
Opcode
Operand
Cycles
Table 14-6. Instruction Set Summary (Sheet 2 of 7)
BHCC rel
Branch if Half-Carry
Bit Clear
PC ←(PC) + 2 + rel ? H = 0
— — — — —
REL
28
rr
3
BHCS rel
Branch if Half-Carry
Bit Set
PC ←(PC) + 2 + rel ? H = 1
— — — — —
REL
29
rr
3
BHI rel
Branch if Higher
PC ←(PC) + 2 + rel ? C ∨ Z = 0
— — — — —
REL
22
rr
3
BHS rel
Branch if Higher or
Same
PC ←(PC) + 2 + rel ? C = 0
— — — — —
REL
24
rr
3
BIH rel
Branch if IRQ Pin High
PC ←(PC) + 2 + rel ? IRQ = 1
— — — — —
REL
2F
rr
3
BIL rel
Branch if IRQ Pin Low
PC ←(PC) + 2 + rel ? IRQ = 0
— — — — —
REL
2E
rr
3
(A) ∧ (M)
— — —
IMM
DIR
EXT
IX2
IX1
IX
A5
ii
B5 dd
C5 hh ll
D5 ee ff
E5
ff
F5
p
2
3
4
5
4
3
PC ←(PC) + 2 + rel ? C = 1
— — — — —
REL
25
rr
3
Freescale Semiconductor, Inc...
Source
Form
Operation
Effect
on CCR
Description
H I N Z C
BIT #opr
BIT opr
BIT opr
BIT opr,X
BIT opr,X
BIT ,X
Bit Test
Accumulator with
Memory Byte
BLO rel
Branch if Lower
(Same as BCS)
BLS rel
Branch if Lower or
Same
PC ←(PC) + 2 + rel ? C ∨ Z = 1
— — — — —
REL
23
rr
3
BMC rel
Branch if Interrupt
Mask Clear
PC ←(PC) + 2 + rel ? I = 0
— — — — —
REL
2C
rr
3
BMI rel
Branch if Minus
PC ←(PC) + 2 + rel ? N = 1
— — — — —
REL
2B
rr
3
BMS rel
Branch if Interrupt
Mask Set
PC ←(PC) + 2 + rel ? I = 1
— — — — —
REL
2D
rr
3
BNE rel
Branch if Not Equal
PC ←(PC) + 2 + rel ? Z = 0
— — — — —
REL
26
rr
3
BPL rel
Branch if Plus
PC ←(PC) + 2 + rel ? N = 0
— — — — —
REL
2A
rr
3
BRA rel
Branch Always
PC ←(PC) + 2 + rel ? 1 = 1
— — — — —
REL
20
rr
3
01
03
05
07
09
0B
0D
0F
dd rr
dd rr
dd rr
dd rr
dd rr
dd rr
dd rr
dd rr
5
5
5
5
5
5
5
5
BRCLR n opr rel
Branch if bit n clear
Advance Information
202
PC ←(PC) + 2 + rel ? Mn = 0
DIR (b0)
DIR (b1)
DIR (b2)
DIR (b3)
— — — — DIR (b4)
DIR (b5)
DIR (b6)
DIR (b7)
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Instruction Set Summary
Cycles
DIR (b0)
DIR (b1)
DIR (b2)
DIR (b3)
— — — — DIR (b4)
DIR (b5)
DIR (b6)
DIR (b7)
00
02
04
06
08
0A
0C
0E
dd rr
dd rr
dd rr
dd rr
dd rr
dd rr
dd rr
dd rr
5
5
5
5
5
5
5
5
— — — — —
21
rr
3
DIR (b0)
DIR (b1)
DIR (b2)
DIR (b3)
— — — — —
DIR (b4)
DIR (b5)
DIR (b6)
DIR (b7)
10
12
14
16
18
1A
1C
1E
dd
dd
dd
dd
dd
dd
dd
dd
5
5
5
5
5
5
5
5
PC ←(PC) + 2; push (PCL)
SP ←(SP) – 1; push (PCH)
SP ←(SP) – 1
PC ←(PC) + rel
— — — — —
REL
AD
rr
6
Operation
Description
Effect
on CCR
H I N Z C
BRSET n opr rel
Branch if Bit n Set
BRN rel
Branch Never
PC ←(PC) + 2 + rel ? Mn = 1
PC ←(PC) + 2 + rel ? 1 = 0
Mn ←1
Address
Mode
Operand
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Source
Form
Opcode
Table 14-6. Instruction Set Summary (Sheet 3 of 7)
REL
BSET n opr
Set Bit n
BSR rel
Branch to
Subroutine
CLC
Clear Carry Bit
C ←0
— — — — 0
INH
98
2
CLI
Clear Interrupt Mask
I ←0
— 0 — — —
INH
9A
2
— — 0
DIR
INH
INH
IX1
IX
3F
4F
5F
6F
7F
— — IMM
DIR
EXT
IX2
IX1
IX
A1
ii
B1 dd
C1 hh ll
D1 ee ff
E1
ff
F1
2
3
4
5
4
3
— — DIR
INH
INH
IX1
IX
33
43
53
63
73
5
3
3
6
5
CLR opr
CLRA
CLRX
CLR opr,X
CLR ,X
CMP #opr
CMP opr
CMP opr
CMP opr,X
CMP opr,X
CMP ,X
COM opr
COMA
COMX
COM opr,X
COM ,X
M ←$00
A ←$00
X ←$00
M ←$00
M ←$00
Clear Byte
Compare
Accumulator with
Memory Byte
(A) – (M)
Complement Byte
(One’s Complement)
M ←(M) = $FF – (M)
A ←(A) = $FF – (M)
X ←(X) = $FF – (M)
M ←(M) = $FF – (M)
M ←(M) = $FF – (M)
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1
dd
ff
dd
ff
5
3
3
6
5
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Instruction Set
DEC opr
DECA
DECX
DEC opr,X
DEC ,X
EOR #opr
EOR opr
EOR opr
EOR opr,X
EOR opr,X
EOR ,X
INC opr
INCA
INCX
INC opr,X
INC ,X
JMP opr
JMP opr
JMP opr,X
JMP opr,X
JMP ,X
JSR opr
JSR opr
JSR opr,X
JSR opr,X
JSR ,X
LDA #opr
LDA opr
LDA opr
LDA opr,X
LDA opr,X
LDA ,X
Description
A3
ii
B3 dd
C3 hh ll
D3 ee ff
E3
ff
F3
2
3
4
5
4
3
Compare Index
Register with
Memory Byte
(X) – (M)
Decrement Byte
M ←(M) – 1
A ←(A) – 1
X ←(X) – 1
M ←(M) – 1
M ←(M) – 1
— — —
DIR
INH
INH
IX1
IX
3A
4A
5A
6A
7A
5
3
3
6
5
— — —
IMM
DIR
EXT
IX2
IX1
IX
A8
ii
B8 dd
C8 hh ll
D8 ee ff
E8
ff
F8
2
3
4
5
4
3
EXCLUSIVE OR
Accumulator with
Memory Byte
— — —
DIR
INH
INH
IX1
IX
3C
4C
5C
6C
7C
5
3
3
6
5
— — — — —
DIR
EXT
IX2
IX1
IX
BC dd
CC hh ll
DC ee ff
EC ff
FC
2
3
4
3
2
— — — — —
DIR
EXT
IX2
IX1
IX
BD dd
CD hh ll
DD ee ff
ED ff
FD
5
6
7
6
5
— — —
IMM
DIR
EXT
IX2
IX1
IX
A6
ii
B6 dd
C6 hh ll
D6 ee ff
E6
ff
F6
2
3
4
5
4
3
— — A ←(A) ⊕ (M)
M ←(M) + 1
A ←(A) + 1
X ←(X) + 1
M ←(M) + 1
M ←(M) + 1
Increment Byte
Unconditional Jump
PC ←Jump Address
Jump to Subroutine
PC ←(PC) + n (n = 1, 2, or 3)
Push (PCL); SP ←(SP) – 1
Push (PCH); SP ←(SP) – 1
PC ←Conditional Address
Load Accumulator with
Memory Byte
A ←(M)
dd
ff
dd
ff
Cycles
1
IMM
DIR
EXT
IX2
IX1
IX
Effect
on CCR
H I N Z C
Advance Information
204
Opcode
Freescale Semiconductor, Inc...
CPX #opr
CPX opr
CPX opr
CPX opr,X
CPX opr,X
CPX ,X
Operation
Address
Mode
Source
Form
Operand
Table 14-6. Instruction Set Summary (Sheet 4 of 7)
MC68HC705JJ7 • MC68HC705JP7 — REV 4
Instruction Set
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MOTOROLA
Freescale Semiconductor, Inc.
Instruction Set
Instruction Set Summary
LSL opr
LSLA
LSLX
LSL opr,X
LSL ,X
AE
ii
BE dd
CE hh ll
DE ee ff
EE
ff
FE
2
3
4
5
4
3
Logical Shift Left
(Same as ASL)
MUL
Unsigned Multiply
X ←(M)
38
48
58
68
78
dd
— — ⋅
DIR
INH
INH
IX1
IX
5
3
3
6
5
C
0
b7
DIR
INH
INH
IX1
IX
34
44
54
64
74
dd
0 — — — 0
INH
42
— — DIR
INH
INH
IX1
IX
30
40
50
60
70
— — — — —
INH
9D
2
— — —
IMM
DIR
EXT
IX2
IX1
IX
AA
ii
BA dd
CA hh ll
DA ee ff
EA
ff
FA
2
3
4
5
4
3
39
49
59
69
79
dd
— — DIR
INH
INH
IX1
IX
5
3
3
6
5
DIR
INH
INH
IX1
IX
36
46
56
66
76
dd
INH
9C
b0
0
C
b7
X : A ←(X) × (A)
NEG opr
NEGA
NEGX
NEG opr,X
NEG ,X
Negate Byte
(Two’s Complement)
NOP
No Operation
M ←–(M) = $00 – (M)
A ←–(A) = $00 – (A)
X ←–(X) = $00 – (X)
M ←–(M) = $00 – (M)
M ←–(M) = $00 – (M)
Logical OR
Accumulator with
Memory
A ←(A) ∨ (M)
Rotate Byte Left
through Carry Bit
C
b7
ROR opr
RORA
RORX
ROR opr,X
ROR ,X
Rotate Byte Right
through Carry Bit
RSP
Reset Stack Pointer
— — b0
SP ←$00FF
— — — — —
MC68HC705JJ7 • MC68HC705JP7 — REV 4
MOTOROLA
b0
C
b7
— — 0
b0
Instruction Set
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ff
ff
Cycles
Description
Load Index Register
with Memory Byte
Logical Shift Right
ROL opr
ROLA
ROLX
ROL opr,X
ROL ,X
— — —
IMM
DIR
EXT
IX2
IX1
IX
Effect
on CCR
H I N Z C
LSR opr
LSRA
LSRX
LSR opr,X
LSR ,X
ORA #opr
ORA opr
ORA opr
ORA opr,X
ORA opr,X
ORA ,X
Opcode
Freescale Semiconductor, Inc...
LDX #opr
LDX opr
LDX opr
LDX opr,X
LDX opr,X
LDX ,X
Operation
Address
Mode
Source
Form
Operand
Table 14-6. Instruction Set Summary (Sheet 5 of 7)
5
3
3
6
5
11
ii
ff
ff
ff
5
3
3
6
5
5
3
3
6
5
2
Advance Information
205
Freescale Semiconductor, Inc.
Instruction Set
INH
80
6
— — IMM
DIR
EXT
IX2
IX1
IX
A2
ii
B2 dd
C2 hh ll
D2 ee ff
E2
ff
F2
2
3
4
5
4
3
Effect
on CCR
Description
H I N Z C
↕
RTI
Return from Interrupt
SP ←(SP) + 1; Pull (CCR)
SP ←(SP) + 1; Pull (A)
SP ←(SP) + 1; Pull (X)
SP ←(SP) + 1; Pull (PCH)
SP ←(SP) + 1; Pull (PCL)
RTS
Return from
Subroutine
SP ←(SP) + 1; Pull (PCH)
SP ←(SP) + 1; Pull (PCL)
INH
A ←(A) – (M) – (C)
Cycles
Opcode
Operation
Address
Mode
Freescale Semiconductor, Inc...
Source
Form
Operand
Table 14-6. Instruction Set Summary (Sheet 6 of 7)
SBC #opr
SBC opr
SBC opr
SBC opr,X
SBC opr,X
SBC ,X
Subtract Memory Byte
and Carry Bit from
Accumulator
SEC
Set Carry Bit
C ←1
— — — — 1
INH
99
2
SEI
Set Interrupt Mask
I ←1
— 1 — — —
INH
9B
2
— — —
DIR
EXT
IX2
IX1
IX
B7 dd
C7 hh ll
D7 ee ff
E7
ff
F7
4
5
6
5
4
— 0 — — —
INH
8E
2
— — —
DIR
EXT
IX2
IX1
IX
BF dd
CF hh ll
DF ee ff
EF
ff
FF
4
5
6
5
4
A ←(A) – (M)
— — IMM
DIR
EXT
IX2
IX1
IX
A0
ii
B0 dd
C0 hh ll
D0 ee ff
E0
ff
F0
2
3
4
5
4
3
PC ←(PC) + 1; Push (PCL)
SP ←(SP) – 1; Push (PCH)
SP ←(SP) – 1; Push (X)
SP ←(SP) – 1; Push (A)
SP ←(SP) – 1; Push (CCR)
SP ←(SP) – 1; I ←1
PCH ←Interrupt Vector High Byte
PCL ←Interrupt Vector Low Byte
— 1 — — —
INH
83
10
STA opr
STA opr
STA opr,X
STA opr,X
STA ,X
Store Accumulator in
Memory
STOP
Stop Oscillator and
Enable IRQ Pin
STX opr
STX opr
STX opr,X
STX opr,X
STX ,X
SUB #opr
SUB opr
SUB opr
SUB opr,X
SUB opr,X
SUB ,X
SWI
Store Index
Register In Memory
Subtract Memory Byte
from
Accumulator
Software Interrupt
Advance Information
206
M ←(A)
M ←(X)
MC68HC705JJ7 • MC68HC705JP7 — REV 4
Instruction Set
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MOTOROLA
Freescale Semiconductor, Inc.
Instruction Set
Opcode Map
TST opr
TSTA
TSTX
TST opr,X
TST ,X
Test Memory Byte for
Negative or Zero
TXA
Transfer Index
Register to
Accumulator
WAIT
Stop CPU Clock and
Enable
Interrupts
A
C
CCR
dd
dd rr
DIR
ee ff
EXT
ff
H
hh ll
I
ii
IMM
INH
IX
IX1
IX2
M
N
n
X ←(A)
(M) – $00
A ←(X)
Accumulator
Carry/borrow flag
Condition code register
Direct address of operand
Direct address of operand and relative offset of branch instruction
Direct addressing mode
High and low bytes of offset in indexed, 16-bit offset addressing
Extended addressing mode
Offset byte in indexed, 8-bit offset addressing
Half-carry flag
High and low bytes of operand address in extended addressing
Interrupt mask
Immediate operand byte
Immediate addressing mode
Inherent addressing mode
Indexed, no offset addressing mode
Indexed, 8-bit offset addressing mode
Indexed, 16-bit offset addressing mode
Memory location
Negative flag
Any bit
— — — — —
INH
97
— — — — —
DIR
INH
INH
IX1
IX
3D
4D
5D
6D
7D
— — — — —
INH
9F
2
— — — —
INH
8F
2
Effect
on CCR
opr
PC
PCH
PCL
REL
rel
rr
SP
X
Z
#
∧
∨
⊕
()
–( )
←
?
:
—
Cycles
H I N Z C
Opcode
Description
Transfer
Accumulator to Index
Register
TAX
Freescale Semiconductor, Inc...
Operation
Address
Mode
Source
Form
Operand
Table 14-6. Instruction Set Summary (Sheet 7 of 7)
2
dd
ff
4
3
3
5
4
Operand (one or two bytes)
Program counter
Program counter high byte
Program counter low byte
Relative addressing mode
Relative program counter offset byte
Relative program counter offset byte
Stack pointer
Index register
Zero flag
Immediate value
Logical AND
Logical OR
Logical EXCLUSIVE OR
Contents of
Negation (two’s complement)
Loaded with
If
Concatenated with
Set or cleared
Not affected
14.6 Opcode Map
See Table 14-7.
MC68HC705JJ7 • MC68HC705JP7 — REV 4
MOTOROLA
Instruction Set
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Advance Information
207
208
Advance Information
5
Instruction Set
For More Information On This Product,
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F
E
D
C
B
A
9
8
7
6
5
4
3
2
1
DIR 2
5
DIR 2
5
DIR 2
5
DIR 2
5
DIR 2
5
DIR 2
5
DIR 2
5
DIR 2
5
DIR 2
5
DIR 2
5
DIR 2
5
DIR 2
5
DIR 2
5
DIR 2
5
DIR 2
5
DIR 2
BCLR7
DIR 2
5
BSET7
DIR 2
5
BCLR6
DIR 2
5
BSET6
DIR 2
5
BCLR5
DIR 2
5
BSET5
DIR 2
5
BCLR4
DIR 2
5
BSET4
DIR 2
5
BCLR3
DIR 2
5
BSET3
3
REL 2
3
BCC
REL 2
3
BLS
REL
3
BHI
REL
3
BRN
REL 2
3
BRA
2
REL
5
5
DIR 1
5
ASR
DIR 1
5
ROR
DIR 1
LSR
DIR 1
5
COM
1
3
11
3
INH 1
3
ASRA
INH 1
3
RORA
INH 1
LSRA
INH 1
3
COMA
INH
3
MUL
INH 1
NEGA
4
3
3
3
INH 2
3
ASRX
INH 2
3
RORX
INH 2
LSRX
INH 2
3
COMX
INH 2
NEGX
5
INH
6
6
5
DIR 1
CLR
DIR 1
TST
DIR 1
4
INC
5
DIR 1
DEC
DIR 1
5
ROL
DIR 1
5
3
INH 1
CLRA
INH 1
TSTA
INH 1
3
INCA
3
INH 1
DECA
INH 1
3
ROLA
INH 1
3
3
INH 2
CLRX
INH 2
TSTX
INH 2
3
INCX
3
INH 2
DECX
INH 2
3
ROLX
INH 2
3
IX1 1
6
IX1 1
6
IX1 1
IX1 1
5
CLR
TST
INC
6
IX1 1
DEC
IX1 1
6
ROL
ASR
ROR
LSR
COM
NEG
7
IX
5
5
IX
5
IX
5
5
IX
IX 1
5
IX
IX
4
5
IX
IX
5
9
10
2
1
1
1
1
1
1
1
INH 1
WAIT
INH
2
STOP
INH
SWI
INH
RTS
INH
6
RTI
8
2
2
2
2
2
2
2
2
INH
TXA
2
2
MSB
0
4
EXT 3
STX
EXT 3
5
LDX
EXT 3
4
JSR
EXT 3
6
JMP
EXT 3
3
ADD
EXT 3
4
ORA
EXT 3
4
ADC
EXT 3
4
EOR
EXT 3
4
STA
EXT 3
5
LDA
EXT 3
4
BIT
EXT 3
4
AND
EXT 3
4
CPX
EXT 3
4
SBC
EXT 3
4
CMP
EXT 3
4
SUB
3
IX2 2
5
IX2 2
6
STX
LDX
JSR
JMP
IX2 2
IX2 2
6
IX2 2
5
IX2 2
7
IX2 2
4
ADD
IX2 2
5
ORA
IX2 2
5
ADC
IX2 2
5
EOR
STA
LDA
IX2 2
5
IX2 2
5
AND
IX2 2
5
CPX
IX2 2
5
SBC
IX2 2
5
CMP
BIT
5
IX2 2
5
SUB
D
IX2
IX1 1
4
IX1 1
5
STX
LDX
JSR
IX1 1
IX1 1
5
IX1 1
4
IX1 1
6
JMP
IX1 1
3
ADD
IX1 1
4
ORA
IX1 1
4
ADC
IX1 1
4
EOR
STA
LDA
IX1 1
4
IX1 1
4
AND
IX1 1
4
CPX
IX1 1
4
SBC
IX1 1
4
CMP
BIT
5 Number of Cycles
DIR Number of Bytes/Addressing Mode
4
IX1 1
4
SUB
E
IX1
MSB of Opcode in Hexadecimal
DIR 3
STX
DIR 3
4
LDX
DIR 3
3
JSR
DIR 3
5
JMP
DIR 3
2
ADD
DIR 3
3
ORA
DIR 3
3
ADC
DIR 3
3
EOR
DIR 3
3
STA
DIR 3
4
LDA
DIR 3
3
DIR 3
3
AND
DIR 3
3
CPX
DIR 3
3
SBC
DIR 3
3
CMP
BIT
3
C
EXT
Register/Memory
DIR 3
3
SUB
B
DIR
BRSET0 Opcode Mnemonic
2
IMM 2
LDX
REL 2
2
BSR
6
IMM 2
ADD
IMM 2
2
ORA
IMM 2
2
ADC
0
2
IMM 2
2
EOR
2
IMM 2
LDA
IMM 2
2
BIT
IMM 2
2
AND
IMM 2
2
CPX
IMM 2
2
SBC
IMM 2
2
CMP
IMM 2
2
SUB
A
IMM
LSB
2
INH 2
NOP
INH
2
RSP
INH 2
2
SEI
INH 2
2
INH 2
2
SEC
INH 2
2
CLC
CLI
2
INH
2
TAX
9
INH
Control
INH
LSB of Opcode in Hexadecimal
CLR
TST
INC
DEC
ROL
IX
5
1
IX 1
5
1
IX 1
ASL/LSL
IX1 1
6
ASR
IX1 1
6
ROR
IX1 1
IX1 1
6
COM
LSR
6
IX1 1
NEG
6
IX1
Read-Modify-Write
INH
REL = Relative
IX = Indexed, No Offset
IX1 = Indexed, 8-Bit Offset
IX2 = Indexed, 16-Bit Offset
REL 2
BIH
REL
3
BIL
REL 2
3
BMS
REL 2
3
BMC
REL
3
BMI
REL 2
3
BPL
REL 2
3
BHCS
5
DIR 1
NEG
3
DIR
ASL/LSL ASLA/LSLA ASLX/LSLX ASL/LSL
REL 2
3
BHCC
REL 2
3
BEQ
REL 2
3
BNE
REL
3
BCS/BLO
DIR 2
5
BCLR2
DIR 2
5
BSET2
DIR 2
5
BCLR1
DIR 2
5
BSET1
DIR 2
5
BCLR0
DIR 2
5
BSET0
1
DIR
INH = Inherent
IMM = Immediate
DIR = Direct
EXT = Extended
3
BRCLR7
3
BRSET7
3
BRCLR6
3
BRSET6
3
BRCLR5
3
BRSET5
3
BRCLR4
3
BRSET4
3
BRCLR3
3
BRSET3
3
BRCLR2
3
BRSET2
3
BRCLR1
3
BRSET1
3
BRCLR0
DIR 2
5
BRSET0
0
3
0
MSB
LSB
DIR
Bit Manipulation Branch
Table 14-7. Opcode Map
Freescale Semiconductor, Inc...
STX
LDX
JSR
JMP
ADD
ORA
ADC
EOR
STA
LDA
BIT
AND
CPX
SBC
CMP
SUB
F
IX
3
IX
IX
4
IX
3
IX
5
IX
2
IX
3
IX
3
IX
3
IX
3
IX
4
IX
3
IX
3
IX
3
IX
3
IX
3
IX
3
F
E
D
C
B
A
9
8
7
6
5
4
3
2
1
0
MSB
LSB
Freescale Semiconductor, Inc.
Instruction Set
MC68HC705JJ7 • MC68HC705JP7 — REV 4
MOTOROLA
Freescale Semiconductor, Inc.
Advance Information — MC68HC705JJ7/MC68HC705JP7
Section 15. Electrical Specifications
Freescale Semiconductor, Inc...
15.1 Contents
15.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
15.3
Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210
15.4
Operating Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . 211
15.5
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211
15.6
Supply Current Characteristics
(VDD = 4.5 to 5.5 Vdc) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 211
15.7
Supply Current Characteristics
(VDD = 2.7 to 3.3 Vdc) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 212
15.8
DC Electrical Characteristics (5.0 Vdc). . . . . . . . . . . . . . . . . . 215
15.9
DC Electrical Characteristics (3.0 Vdc). . . . . . . . . . . . . . . . . . 216
15.10 Analog Subsystem Characteristics (5.0 Vdc) . . . . . . . . . . . . . 217
15.11 Analog Subsystem Characteristics (3.0 Vdc) . . . . . . . . . . . . . 218
15.12 Control Timing (5.0 Vdc). . . . . . . . . . . . . . . . . . . . . . . . . . . . .220
15.13 Control Timing (3.0 Vdc). . . . . . . . . . . . . . . . . . . . . . . . . . . . .221
15.14 PEPROM and EPROM Programming
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 224
15.15 SIOP Timing (VDD = 5.0 Vdc) . . . . . . . . . . . . . . . . . . . . . . . . . 225
15.16 SIOP Timing (VDD = 3.0 Vdc) . . . . . . . . . . . . . . . . . . . . . . . . . 226
15.17 Reset Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 227
MC68HC705JJ7 • MC68HC705JP7 — REV 4
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Freescale Semiconductor, Inc.
Electrical Specifications
15.2 Introduction
This section contains the electrical and timing specifications.
15.3 Maximum Ratings
Maximum ratings are the extreme limits to which the MCU can be
exposed without permanently damaging it.
Freescale Semiconductor, Inc...
The MCU contains circuitry to protect the inputs against damage from
high static voltages; however, do not apply voltages higher than those
shown in the table below. Keep VIn and VOut within the range
VSS ≤(VIn or VOut) ≤VDD. Connect unused inputs to the appropriate
voltage level, either VSS or VDD.
Rating
Symbol
Value
Unit
Supply voltage
VDD
–0.3 to +7.0
V
Bootloader/self-check mode
(IRQ/VPP pin only)
VIn
VSS –0.3 to 17
V
I
25
mA
TJ
+150
°C
Tstg
–65 to +150
°C
Current drain per pin excluding VDD and VSS
Operating junction temperature
Storage temperature range
NOTE:
Advance Information
210
This device is not guaranteed to operate properly at the maximum
ratings. Refer to 15.8 DC Electrical Characteristics (5.0 Vdc) and 15.9
DC Electrical Characteristics (3.0 Vdc) for guaranteed operating
conditions.
MC68HC705JJ7 • MC68HC705JP7 — REV 4
Electrical Specifications
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Freescale Semiconductor, Inc.
Electrical Specifications
Operating Temperature Range
15.4 Operating Temperature Range
Characteristic
Symbol
Value
Unit
TA
TL to TH
–40 to +85
°C
Symbol
Value
Unit
θ JA
60
° C/W
Operating temperature range
Extended
15.5 Thermal Characteristics
Freescale Semiconductor, Inc...
Characteristic
Thermal resistance
Plastic DIP
SOIC
15.6 Supply Current Characteristics (VDD = 4.5 to 5.5 Vdc)
Characteristic(1)
Symbol
Min
Typ(2)
Max
Unit
—
—
—
150
375
3.00
568
1100
5.20
µA
µA
mA
—
—
—
45
75
1.00
85
375
2.20
µA
µA
mA
RUN(3) (analog and LVR disabled)
Internal low-power oscillator at 100 kHz
Internal low-power oscillator at 500 kHz
External oscillator running at 4.2 MHz
IDD
WAIT(4) (analog and LVR disabled)
Internal low-power oscillator at 100 kHz
Internal low-power oscillator at 500 kHz
External oscillator running at 4.2 MHz
IDD
STOP(5) (analog and LVR disabled)
Typical
–40° C to 85° C
IDD
—
—
2
4
10
20
µA
Incremental IDD for enabled modules
LVR
Analog subsystem
IDD
—
—
5
380
15
475
µA
1. VDD = 4.5 to 5.5 Vdc, VSS = 0 V, TL ≤TA ≤TH, unless otherwise noted. All values shown reflect average measurements.
2. Typical values at midpoint of voltage range, 25° C only
3. Run (Operating) IDD, Wait IDD: Measured using external square wave clock source to OSC1 pin or internal oscillator, all
inputs 0.2 Vdc from either supply rail (VDD or VSS); no dc loads, less than 50 pF on all outputs, CL = 20 pF on OSC2.
4. Wait IDD is affected linearly by the OSC2 capacitance.
5. Stop IDD: All ports configured as inputs, VIL = 0.2 Vdc, VIH = VDD –0.2 Vdc, OSC1 = VDD.
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Electrical Specifications
15.7 Supply Current Characteristics (VDD = 2.7 to 3.3 Vdc)
Freescale Semiconductor, Inc...
Characteristic(1)
Symbol
Min
Typ(2)
Max
Unit
—
—
—
70
320
1.25
320
800
2.60
µA
µA
mA
—
—
—
20
40
0.50
65
250
1.10
µA
µA
mA
RUN(3) (analog and LVR disabled)
Internal low-power oscillator at 100 kHz
Internal low-power oscillator at 500 kHz
External oscillator running at 2.1 MHz
IDD
WAIT(4) (analog and LVR disabled)
Internal low-power oscillator at 100 kHz
Internal low-power oscillator at 500 kHz
External oscillator running at 2.1 MHz
IDD
STOP(5) (analog and LVR disabled)
25° C
–40° C to 85° C
IDD
—
—
1
2
5
10
µA
Incremental IDD for enabled modules
LVR
Analog subsystem
IDD
—
—
5
380
15
475
µA
1. VDD = 2.7 to 3.3 Vdc, VSS = 0 V, TL ≤TA ≤TH, unless otherwise noted. All values shown reflect average measurements.
2. Typical values at midpoint of voltage range, 25° C only.
3. Run (Operating) IDD, Wait IDD: Measured using external square wave clock source to OSC1 pin or internal oscillator, all
inputs 0.2 Vdc from either supply rail (VDD or VSS); no dc loads, less than 50 pF on all outputs, CL = 20 pF on OSC2.
4. Wait IDD is affected linearly by the OSC2 capacitance.
5. Stop IDD: All ports configured as inputs, VIL = 0.2 Vdc, VIH = VDD –0.2 Vdc, OSC1 = VDD.
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Freescale Semiconductor, Inc.
Electrical Specifications
Supply Current Characteristics (VDD = 2.7 to 3.3 Vdc)
3.50E–03
SUPPLY CURRENT IN AMPS
3.00E–03
2.50E–03
5.5 V
2.00E–03
4.5 V
1.50E–03
3.3 V
2.7 V
1.00E–03
5.00E–04
Freescale Semiconductor, Inc...
0.00E+00
0
0.5
1
1.5
2
2.5
FREQUENCY IN MHz
Figure 15-1. Typical Run IDD versus Internal
Clock Frequency at 25° C
1.60E–03
SUPPLY CURRENT IN AMPS
1.40E–03
1.20E–03
1.00E–03
5.5 V
8.00E–04
4.5 V
6.00E–04
3.3 V
2.7 V
4.00E–04
2.00E–04
0.00E+00
0
0.5
1
1.5
2
2.5
FREQUENCY IN MHz
Figure 15-2. Typical Wait IDD versus Internal
Clock Frequency at 25° C
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Electrical Specifications
3.50E–03
SUPPLY CURRENT IN AMPS
3.00E–03
2.50E–03
1.50E–03
1.00E–03
5.00E–04
2.5
Freescale Semiconductor, Inc...
–40° C
25° C
85° C
2.00E–03
3
3.5
4
4.5
5
5.5
6
SUPPLY VOLTAGE IN VOLTS
Figure 15-3. Typical Run IDD with External Oscillator
1.80E–03
SUPPLY CURRENT IN AMPS
1.60E–03
1.40E–03
1.20E–03
–40° C
25° C
85° C
1.00E–03
8.00E–04
6.00E–04
4.00E–04
2.00E–04
2.5
3
3.5
4
4.5
5
5.5
6
SUPPLY VOLTAGE IN VOLTS
SUPPLY CURRENT IN AMPS
Figure 15-4. Typical Wait IDD with External Oscillator
4.50E–06
4.00E–06
3.50E–06
3.00E–06
2.50E–06
2.00E–06
1.50E–06
1.00E–06
5.00E–07
0.00E+00
2.5
–40° C
25° C
85° C
3
3.5
4
4.5
5
SUPPLY VOLTAGE IN VOLTS
5.5
6
Figure 15-5. Typical Stop IDD with Analog and LVR Disabled
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Freescale Semiconductor, Inc.
Electrical Specifications
DC Electrical Characteristics (5.0 Vdc)
15.8 DC Electrical Characteristics (5.0 Vdc)
Characteristic(1),
(2)
Output voltage
ILoad = 10.0 µA
ILoad = –10.0 µA
Output high voltage
(ILoad = –0.8 mA) PB0–PB7
Symbol
Min
Typ(3)
Max
Unit
VOL
VOH
—
VDD –0.1
—
—
0.1
—
V
VOH
VDD –0.8
—
—
—
—
V
VDD –0.8
—
—
—
—
—
—
0.4
0.4
1.5
(4)
Freescale Semiconductor, Inc...
(ILoad = –4.0 mA) PA0–PA5, PB4, PC0–PC7
Output low voltage
(ILoad = 1.6 mA) PB0–PB7, RESET
(ILoad = 10 mA) PA0–PA5, PB4, PC0–PC7(4)
(ILoad = 15 mA) PA0–PA5, PB4, PC0–PC7(4)
VOL
V
High source current
Total for all (6) PA0–PA5 pins and PB4
Total for all (8) PC0–PC7(4) pins
IOH
—
—
—
—
20
30
mA
High sink current
Total for all (6) PA0–PA5 pins and PB4
Total for all (8) PC0–PC7(4) pins
IOL
—
—
—
—
40
60
mA
Input high voltage
PA0–PA5, PB0–PB7, PC0–PC7(4), RESET, OSC1, IRQ/VPP
VIH
0.7 x VDD
—
VDD
V
Input low voltage
PA0–PA5, PB0–PB7, PC0–PC7(4), RESET, OSC1, IRQ/VPP
VIL
VSS
—
0.3 x VDD
V
Input current
OSC1, IRQ/VPP
IIn
–1
—
1
µA
Input current
RESET (pullup, source)
RESET (pulldown, sink)
IIn
10
–6
—
—
—
—
µA
mA
I/O ports hi-Z leakage current (pulldowns off)
PA0–PA6, PB0–PB7, PC0–PC7(4)
IOZ
–2
—
2
µA
IIL
40
25
100
65
280
190
µA
Input pulldown current
PA0–PA5, PB0–PB7, PC0–PC7(4) (VIn ; VIH = 0.7 x VDD)
(4)
PA0–PA5, PB0–PB7, PC0–PC7
(VIn ; VIL = 0.3 x VDD)
1. +4.5 ≤VDD ≤+5.5 V, VSS = 0 V, TL ≤TA ≤TH, unless otherwise noted
2. All values shown reflect average measurements.
3. Typical values at midpoint of voltage range, 25° C only.
4. PC0–PC7 parameters only apply to MC68HC705JP7.
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Electrical Specifications
15.9 DC Electrical Characteristics (3.0 Vdc)
Characteristic(1),
(2)
Symbol
Min
Typ(3)
Max
Unit
VOL
VOH
—
VDD –0.1
—
—
0.1
—
V
VOH
VDD –0.8
—
—
—
—
V
VDD –0.8
VOL
—
—
—
—
0.3
0.3
V
High source current
Total for all (6) PA0–PA5 pins and PB4
Total for all (8) PC0–PC7(4) pins
IOH
—
—
—
—
20
30
mA
High sink current
Total for all (6) PA0–PA5 pins and PB4
Total for all (8) PC0–PC7(4) pins
IOL
—
—
—
—
40
60
mA
Input high voltage
PA0–PA5, PB0–PB7, PC0–PC7(4), RESET, OSC1, IRQ/VPP
VIH
0.7 x VDD
—
VDD
V
Input low voltage
PA0–PA5, PB0–PB7, PC0–PC7(4), RESET, OSC1, IRQ/VPP
VIL
VSS
—
0.2 x VDD
V
Input current
OSC1, IRQ/VPP
IIn
–1
—
1
µA
Input current
RESET (pullup, source)
RESET (pulldown, sink)
IIn
5
–3
—
—
—
—
µA
mA
I/O ports hi-Z leakage current (pulldowns off)
PA0–PA6, PB0–PB7, PC0–PC7(4)
IOZ
–2
—
2
µA
IIL
10
4
25
20
75
40
µA
Output voltage
ILoad = 10.0 µA
ILoad = –10.0 µA
Output high voltage
(ILoad = –0.2 mA) PB0–PB7
(4)
Freescale Semiconductor, Inc...
(ILoad = –2.0 mA) PA0–PA5, PB4, PC0–PC7
Output low voltage
(ILoad = 1.6 mA) PB0–PB7, RESET
(ILoad = 5 mA) PA0–PA5, PB4, PC0–PC7
(4)
Input pulldown current
PA0–PA5, PB0–PB7, PC0–PC7(4) (VIn ; VIH = 0.7 x VDD)
PA0–PA5, PB0–PB7,
PC0–PC7(4)
(VIn ; VIL = 0.3 x VDD)
1. +2.7 ≤VDD ≤+3.3 V, VSS = 0 V, TL ≤TA ≤TH, unless otherwise noted
2. All values shown reflect average measurements.
3. Typical values at midpoint of voltage range, 25° C only.
4. PC0–PC7 parameters only apply to MC68HC705JP7.
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Freescale Semiconductor, Inc.
Electrical Specifications
Analog Subsystem Characteristics (5.0 Vdc)
15.10 Analog Subsystem Characteristics (5.0 Vdc)
NOTE:
See Figure 15-6.
Freescale Semiconductor, Inc...
Characteristic(1)
Symbol
Min
Max
Unit
VIO
VCMR
ZIn
—
—
800
15
VDD –1.5
—
mV
V
kΩ
ZIn
ZIn
800
80
—
—
kΩ
kΩ
RDIV
0.49
0.51
Analog subsystem internal VSS offset
Sum of comparator offset and IR drop through VSS
VAOFF
20
40
mV
Channel selection multiplexer switch resistance
RMUX
—
3
kΩ
External current source (PB0/AN0)
Source current (VOut = VDD/2)
Source current linearity (VOut = 0 to VDD –1.5 Vdc)
Discharge sink current (VOut = 0.4 V)
ICHG
ICHG
IDIS
85
—
1.1
113
±1
—
µA
%FS
mA
External capacitor (connected to PB0/AN0)
Voltage range
Discharge time
Value of external ramping capacitor
VCAP
tDIS
CEXT
VSS
VDD –1.5
5
—
10
2
V
ms/µF
µF
CSH
8
13
pF
tSHCHG
tSHDCHG
tSHTCHG
CSHDIS
1
2
1
—
—
—
—
0.2
µs
µs
µs
V/sec
VD
TCD
0.65
1.8
0.71
2.0
V
mV/° C
Voltage comparators
Input offset voltage
Common-mode range
Comparator 1 input impedance
Comparator 2 input impedance
Direct input to comparator 2 (HOLD = 1, DHOLD = 0)
Divider input to comparator 2 (HOLD = 0, DHOLD = 1)
Input divider ratio (comparator 2, HOLD = 0, DHOLD =1)
VIn = 0 to VDD –1.5 V
Internal sample and hold capacitor
Capacitance
Charge/discharge time (0 to 3.5 Vdc)
Direct connection (HOLD = 1, DHOLD = 0)
Divided connection (HOLD = 0, DHOLD = 1)
Temperature diode connection (HOLD = 1, DHOLD = 1)
Leakage discharge rate
Internal temperature sensing diode
Voltage at TJ = 25° C
Temperature change in voltage
1. +4.5 ≤VDD ≤+5.5 V, VSS = 0 V, TL ≤TA ≤TH, unless otherwise noted
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Electrical Specifications
15.11 Analog Subsystem Characteristics (3.0 Vdc)
NOTE:
See Figure 15-6.
Freescale Semiconductor, Inc...
Characteristic(1)
Symbol
Min
Max
Unit
VIO
VCMR
ZIn
—
—
800
15
VDD –1.5
—
mV
V
kΩ
ZIn
ZIn
800
80
—
—
kΩ
kΩ
RDIV
0.49
0.51
Analog subsystem internal VSS offset
VAOFF
10
30
mV
Multiplexer switch resistance
RMUX
—
5
kΩ
External current source (PB0/AN0)
Source current (VOut = VDD/2)
Source current linearity (VOut = 0 to VDD –1.5 Vdc)
Discharge sink current (VOut = 0.4 V)
ICHG
ICHG
IDIS
75
—
1
104
±1
—
µA
%FS
mA
External capacitor (connected to PB0/AN0)
Voltage range
Discharge time
Value of external ramping capacitor
VCAP
tDIS
CEXT
VSS
5
—
VDD –1.5
10
2
V
ms/µF
µF
CSH
8
13
pF
tSHCHG
tSHDCHG
tSHTCHG
CSHDIS
1
2
1
—
—
—
—
0.1
µs
µs
µs
V/sec
VD
TCD
0.65
1.8
0.71
2.0
V
mV/° C
Voltage comparators
Input offset voltage
Common-mode range
Comparator 1 input impedance
Comparator 2 input impedance
Direct input to comparator 2 (HOLD = 1, DHOLD = 0)
Divider input to comparator 2 (HOLD = 0, DHOLD = 1)
Input divider ratio (comparator 2, HOLD = 0, DHOLD =1)
VIn = 0 to VDD –1.5 V
Internal sample and hold capacitor
Capacitance
Charge/discharge time (0 to 3.5 Vdc)
Direct connection (HOLD = 1, DHOLD = 0)
Divided connection (HOLD = 0, DHOLD = 1)
Temperature diode connection (HOLD = 1, DHOLD = 1)
Leakage discharge rate
Internal temperature sensing diode
Voltage at TJ = 25° C
Temperature change in voltage
1. +2.7 ≤VDD ≤+3.3 V, VSS = 0 V, TL ≤TA ≤TH, unless otherwise noted
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Freescale Semiconductor, Inc.
T DIODE IN mV
Electrical Specifications
Analog Subsystem Characteristics (3.0 Vdc)
820
800
780
760
740
720
700
680
660
640
620
600
580
560
Freescale Semiconductor, Inc...
–45
–35
–25
–15
–5
5
15
25
35
45
55
65
75
85
95
TEMPERATURE IN ° C
Figure 15-6. Typical Temperature Diode Performance
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Electrical Specifications
15.12 Control Timing (5.0 Vdc)
Characteristic(1)
Symbol
Min
Max
Unit
fOSC
—
0.1
dc
4.2
4.2
4.2
MHz
MHz
MHz
60
300
140
700
kHz
kHz
—
0.05
dc
2.1
2.1
2.1
MHz
MHz
MHz
30
150
75
350
kHz
kHz
476
—
ns
14.29
2.86
33.33
6.67
µs
µs
tRESL
tTH, tTL
4.0
284
—
—
tcyc
ns
Interrupt pulse width low (edge-triggered)
tILIH
284
—
ns
Interrupt pulse period
tILIL
(3)
—
tcyc
tOH, tOL
110
—
ns
tCPROP
tCDELAY
—
—
2
2
µs
µs
tISTART
tIDELAY
tBDELAY
—
—
—
1
2
2
µs
µs
µs
Freescale Semiconductor, Inc...
Frequency of oscillation (OSC)
RC oscillator option
Crystal oscillator option
External clock source
Internal low-power oscillator
Standard product (100 kHz nominal)
Mask option (500 kHz nominal, see Note 3)
Internal operating frequency, crystal, or external clock (fOSC/2)
RC oscillator option
Crystal oscillator option
External clock source
Internal low-power oscillator
Standard product (100 kHz nominal)
Mask option (500 kHz nominal(2))
fOP
Cycle time (1/fOP)
External oscillator or clock source
Internal low-power oscillator
Standard product (100 kHz nominal)
Mask option (500 kHz nominal(2))
tcyc
16-bit timer
Resolution
Input capture (TCAP) pulse width
OSC1 pulse width (external clock input)
Analog subsystem response
Voltage comparators
Switching time (10 mV overdrive, either input)
Comparator power-up delay (bias circuit already powered up)
External current source (PB0/AN0)
Switching time (IDIS to IRAMP)
Power-up delay (bias circuit already powered up)
Bias circuit power-up delay
1. VDD = 4.5 to 5.5 Vdc, VSS = 0 V, TL ≤TA ≤TH, unless otherwise noted
2. The 500-kHz nominal mask option is available through special order only. Contact your local Motorola sales representative
for detailed ordering information. Not offered with the RC oscillator.
3. The minimum period, tILIL, should not be less than the number of cycle times it takes to execute the interrupt service routine
plus 21 tcyc.
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Freescale Semiconductor, Inc.
Electrical Specifications
Control Timing (3.0 Vdc)
15.13 Control Timing (3.0 Vdc)
Characteristic(1)
Symbol
Min
Max
Unit
fOSC
—
0.1
dc
2.1
2.1
2.1
MHz
MHz
MHz
60
300
140
700
kHz
kHz
—
0.05
dc
1.05
1.05
1.05
MHz
MHz
MHz
30
150
70
350
kHz
kHz
952
—
ns
14.29
2.86
33.33
6.67
µs
µs
tRESL
tTH, tTL
4.0
284
—
—
tcyc
ns
Interrupt pulse width low (edge-triggered)
tILIH
284
—
ns
Interrupt pulse period
tILIL
(3)
—
tcyc
tOH, tOL
110
—
ns
tCPROP
tCDELAY
—
—
2
2
µs
µs
tISTART
tIDELAY
tBDELAY
—
—
—
1
2
2
µs
µs
µs
Freescale Semiconductor, Inc...
Frequency of oscillation (OSC)
RC oscillator option
Crystal oscillator option
External clock source
Internal low-power oscillator
Standard product (100 kHz nominal)
Mask option (500 kHz nominal, see Note 3))
Internal operating frequency, crystal, or external clock (fOSC/2)
RC oscillator option
Crystal oscillator option
External clock source
Internal low-power oscillator
Standard product (100 kHz nominal)
Mask option (500 kHz nominal(2))
fOP
Cycle time (1/fOP)
External oscillator or clock source
Internal low-power oscillator
Standard product (100 kHz nominal)
Mask option (500 kHz nominal(2))
tcyc
16-bit timer
Resolution
Input capture (TCAP) pulse width
OSC1 pulse width (external clock input)
Analog subsystem response
Voltage comparators
Switching time (10 mV overdrive, either input)
Comparator power-up delay (bias circuit already powered up)
External current source (PB0/AN0)
Switching time (IDIS to IRAMP)
Power-up delay (bias circuit already powered up)
Bias circuit power-up delay
1. +2.7 ≤VDD ≤+3.3 V, VSS = 0 V, TL ≤TA ≤TH, unless otherwise noted
2. The 500 kHz nominal mask option is available through special order only. Contact your local Motorola sales representative
for detailed ordering information. Not offered with the RC oscillator option.
3. The minimum period, tILIL, should not be less than the number of cycle times it takes to execute the interrupt service routine
plus 21 tcyc.
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Electrical Specifications
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Electrical Specifications
510000
500000
FREQUENCY IN Hz
490000
480000
470000
460000
450000
440000
430000
420000
–45
–35
–25
–15
–5
5
15
25
35
45
55
65
75
85
95
85
95
Freescale Semiconductor, Inc...
TEMPERATURE IN ° C
Figure 15-7. Typical 500 kHz External Low-Power
Oscillator Frequency
114000
FREQUENCY IN Hz
113500
113000
112500
112000
111500
111000
110500
110000
109500
–45
–35
–25
–15
–5
5
15
25
35
45
55
65
75
TEMPERATURE IN ° C
Figure 15-8. Typical 100 kHz External Low-Power
Oscillator Frequency
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Freescale Semiconductor, Inc.
Electrical Specifications
Control Timing (3.0 Vdc)
INTERNAL BUS FREQUENCY (MHz)
2.5
2
1.5
VDD = 5.5 V
VDD = 4.5 V
1
0.5
Freescale Semiconductor, Inc...
0
12.1
24.9
49.9
EXTERNAL RESISTOR VALUE (kΩ)
Figure 15-9. Typical RC Oscillator Internal Operating
Frequency Range versus Resistance for High VDD
Operating Range at T = 25° C
INTERNAL BUS FREQUENCY (MHz)
2
1.5
VDD = 3.3 V
VDD = 2.7 V
1
0.5
0
12.1
24.9
49.9
EXTERNAL RESISTOR VALUE (kΩ)
Figure 15-10. Typical RC Oscillator Internal Operating
Frequency Range versus Resistance for Low VDD
Operating Range at T = 25° C
MC68HC705JJ7 • MC68HC705JP7 — REV 4
MOTOROLA
Electrical Specifications
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Freescale Semiconductor, Inc.
Electrical Specifications
15.14 PEPROM and EPROM Programming Characteristics
Characteristic(1)
Symbol
Min
Typ
Max
Unit
PEPROM programming voltage (IRQ/VPP)
VPP
16.0
16.5
17.0
V
PEPROM programming voltage (IRQ/VPP)
IPP
—
3.0
5.0
mA
tEPGM
4.0
—
—
ms
EPROM/MOR programming voltage (IRQ/VPP)
VPP
16.0
16.5
17.0
V
EPROM/MOR programming current (IRQ/VPP)
IPP
—
3.0
5.0
mA
EPROM programming time per byte
tEPGM
4.0
—
—
ms
MOR programming time
tMPGM
10.0
—
—
ms
Freescale Semiconductor, Inc...
PEPROM programming time per bit
1. +4.5 ≤VDD ≤+5.5 V, VSS = 0 V, TL ≤TA ≤TH, unless otherwise noted
NOTE:
Advance Information
224
To program the EPROM/OTPROM, MOR, or EPMSEC bits, the voltage
on VDD must be greater than 4.5 volts.
MC68HC705JJ7 • MC68HC705JP7 — REV 4
Electrical Specifications
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MOTOROLA
Freescale Semiconductor, Inc.
Electrical Specifications
SIOP Timing (VDD = 5.0 Vdc)
15.15 SIOP Timing (VDD = 5.0 Vdc)
Freescale Semiconductor, Inc...
Characteristic(1)
Symbol
Min
Typ
Max
Unit
Frequency of operation
Master
Slave
fSIOP(M)
fSIOP(S)
0.25 x fOP
dc
0.25 x fOP
—
0.25 x fOP
1050
kHz
Cycle time
Master
Slave
tSCK(M)
tSCK(M)
4.0 x tcyc
—
4.0 x tcyc
—
4.0 x tcyc
3.8
µs
tSCKL
952
—
—
ns
tV
—
—
200
ns
SDO hold time
tHO
0
—
—
ns
SDI setup time
tS
100
—
—
ns
SDI hold time
tH
100
—
—
ns
Clock (SCK) low time (fOP = 4.2 MHz)
SDO data valid time
1. +4.5 ≤VDD ≤+5.5 V, VSS = 0 V, TL ≤TA ≤TH, unless otherwise noted
tSCK
tSCKL
SCK
tV
SDO
tHO
MSB
BIT 1
LSB
tS
SDI
MSB
VALID DATA
LSB
tH
Figure 15-11. SIOP Timing Diagram
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Electrical Specifications
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Freescale Semiconductor, Inc.
Electrical Specifications
15.16 SIOP Timing (VDD = 3.0 Vdc)
Freescale Semiconductor, Inc...
Characteristic(1)
Symbol
Min
Typ
Max
Unit
Frequency of operation
Master
Slave
fSIOP(M)
fSIOP(S)
0.25 x fOP
dc
0.25 x fOP
—
0.25 x fOP
525
kHz
Cycle time
Master
Slave
tSCK(M)
tSCK(M)
4.0 x tcyc
—
4.0 x tcyc
—
4.0 x tcyc
1.9
µs
tSCKL
1905
—
—
ns
tV
—
—
400
ns
SDO hold time
tHO
0
—
—
ns
SDI setup time
tS
200
—
—
ns
SDI hold time
tH
200
—
—
ns
Clock (SCK) low time (fOP = 2.1 MHz)
SDO data valid time
1. +2.7 ≤VDD ≤+3.3 V, VSS = 0 V, TL ≤TA ≤TH, unless otherwise noted
Advance Information
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Freescale Semiconductor, Inc.
Electrical Specifications
Reset Characteristics
15.17 Reset Characteristics
Characteristic(1)
Symbol
Min
Typ
Max
Unit
Low-voltage reset
Rising recovery voltage
Falling reset voltage
LVR hysteresis
VLVRR
VLVRF
VLVRH
2.4
2.3
30
3.4
3.3
70
4.4
4.3
—
V
V
mV
POR recovery voltage(2)
VPOR
0
—
100
mV
SVDDR
SVDDF
—
—
—
—
0.1
0.05
V/µs
RESET pulse width (when bus clock active)
tRL
1.5
—
—
tCYC
RESET pulldown pulse width from internal
reset
tRPD
3
—
4
tCYC
Rising(2)
Falling(2)
1. +2.7 ≤VDD ≤+3.3 V, VSS = 0 V, TL ≤TA ≤TH, unless otherwise noted
2. By design, not tested
RESET VOLTAGE IN VOLTS
Freescale Semiconductor, Inc...
POR VDD slew rate(2)
4.5
4
3.5
3
2.5
–45
–35
–25
–15
–5
5
15
25
35
45
55
65
75
85
95
TEMPERATURE IN ° C
Figure 15-12. Typical Falling Low Voltage Reset
MC68HC705JJ7 • MC68HC705JP7 — REV 4
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Electrical Specifications
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Freescale Semiconductor, Inc.
Electrical Specifications
1
OSC1
t
RL
RESET
4064 or 16 t (2)
cyc
INTERNAL
CLOCK(3)
Freescale Semiconductor, Inc...
INTERNAL
ADDRESS
BUS(3)
1FFE
INTERNAL
DATA
BUS(3)
NEW
PCH
1FFF
NEW PCH
NEW PCL
NEW
PCL
Op
code
Notes:
1. Represents the internal gating of the OSC1 pin
2. Normal delay of 4064 tcyc or short delay option of 16 tcyc
3. Internal timing signal and data information not available externally
Figure 15-13. Stop Recovery Timing Diagram
INTERNAL
RESET1
RESET
PIN
t
RPD
4064 or 16 t (2)
cyc
INTERNAL
CLOCK(3)
INTERNAL
ADDRESS
BUS(3)
INTERNAL
DATA
BUS(3)
1FFE
NEW
PCH
1FFF
NEW PCH
NEW PCL
NEW
PCL
Notes:
1.Represents the internal reset from low-voltage reset, illegal opcode fetch or COP watchdog timeout
2.Only if reset occurs during normal delay of 4064 tCYC or short delay option of 16 tCYC for initial power-up
or stop recovery.
3.Internal timing signal and data information not available externally
Figure 15-14. Internal Reset Timing Diagram
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Freescale Semiconductor, Inc.
Electrical Specifications
Reset Characteristics
VDD
VLVRF
V
LVRR
LOW
VOLTAGE
RESET
RESET
PIN1
tRPD
4064 or 16 t
(2)
cyc
Freescale Semiconductor, Inc...
INTERNAL
CLOCK3
INTERNAL
ADDRESS
BUS(3)
1FFE
INTERNAL
DATA
BUS(3)
1FFF
NEW
PCH
NEW PCH
NEW PCL
NEW
PCL
Notes:
1. RESET pin pulled down by internal device
2 Only if LVR occurs during normal delay of 4064 tcyc or short delay option of 16 tcyc for initial power-up
or stop recovery.
3 Internal timing signal and data information not available externally
Figure 15-15. Low-Voltage Reset Timing Diagram
MC68HC705JJ7 • MC68HC705JP7 — REV 4
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Electrical Specifications
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Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc...
Electrical Specifications
Advance Information
230
MC68HC705JJ7 • MC68HC705JP7 — REV 4
Electrical Specifications
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Freescale Semiconductor, Inc.
Advance Information — MC68HC705JJ7/MC68HC705JP7
Section 16. Mechanical Specifications
Freescale Semiconductor, Inc...
16.1 Contents
16.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 231
16.3
20-Pin Plastic Dual In-Line Package (Case 738) . . . . . . . . . . 232
16.4
20-Pin Small Outline Integrated Circuit (Case 751D) . . . . . . . 233
16.5
28-Pin Plastic Dual In-Line Package (Case 710) . . . . . . . . . . 233
16.6
28-Pin Small Outline Integrated Circuit (Case 751F) . . . . . . . 234
16.7
20-Pin Windowed Ceramic Integrated Circuit
(Case 732) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 234
16.8
28-Pin Windowed Ceramic Integrated Circuit
(Case 733A). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .235
16.2 Introduction
The MC68HC705JJ7 is available in:
•
20-pin plastic dual in-line package (PDIP)
•
20-pin small outline integrated circuit (SOIC) package
•
20-pin windowed ceramic package
The MC68HC705JP7 is available in:
•
28-pin plastic dual in-line package (PDIP)
•
28-pin small outline integrated circuit (SOIC) package
•
28-pin windowed ceramic package
MC68HC705JJ7 • MC68HC705JP7 — REV 4
MOTOROLA
Mechanical Specifications
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Freescale Semiconductor, Inc.
Mechanical Specifications
The following figures show the latest packages at the time of this
publication. To make sure that you have the latest case outline
specifications, contact one of the following:
•
Local Motorola Sales Office
•
World Wide Web at:
http://www.motorola.com/mcu/
Freescale Semiconductor, Inc...
Follow World Wide Web on-line instructions to retrieve the current
mechanical specifications.
16.3 20-Pin Plastic Dual In-Line Package (Case 738)
-A20
11
1
10
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
B
C
-T-
L
K
SEATING
PLANE
M
E
G
N
F
J 20 PL
0.25 (0.010)
D 20 PL
0.25 (0.010)
Advance Information
232
M
T A
M
T B
M
M
DIM
A
B
C
D
E
F
G
J
K
L
M
N
INCHES
MIN
MAX
1.010 1.070
0.240 0.260
0.150 0.180
0.015 0.022
0.050 BSC
0.050 0.070
0.100 BSC
0.008 0.015
0.110 0.140
0.300 BSC
0°
15°
0.020 0.040
MILLIMETERS
MIN
MAX
25.66 27.17
6.10
6.60
3.81
4.57
0.39
0.55
1.27 BSC
1.27
1.77
2.54 BSC
0.21
0.38
2.80
3.55
7.62 BSC
0°
15°
0.51
1.01
MC68HC705JJ7 • MC68HC705JP7 — REV 4
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Freescale Semiconductor, Inc.
Mechanical Specifications
20-Pin Small Outline Integrated Circuit (Case 751D)
16.4 20-Pin Small Outline Integrated Circuit (Case 751D)
-A20
-B-
P 10 PL
0.010 (0.25)
1
M
B
M
10
D
Freescale Semiconductor, Inc...
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.150
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
11
20 PL
0.010 (0.25)
M
T A
B
S
J
S
DIM
A
B
C
D
F
G
J
K
M
P
R
F
R X 45°
C
-TG
K
18 PL
M
SEATING
PLANE
MILLIMETERS
MIN
MAX
12.65 12.95
7.40
7.60
2.35
2.65
0.35
0.49
0.50
0.90
1.27 BSC
0.25
0.32
0.10
0.25
0°
7°
10.05 10.55
0.25
0.75
INCHES
MIN
MAX
0.499 0.510
0.292 0.299
0.093 0.104
0.014 0.019
0.020 0.035
0.050 BSC
0.010 0.012
0.004 0.009
0°
7°
0.395 0.415
0.010 0.029
16.5 28-Pin Plastic Dual In-Line Package (Case 710)
28
NOTES:
1. POSITIONAL TOLERANCE OF LEADS (D),
SHALL BE WITHIN 0.25mm (0.010) AT
MAXIMUM MATERIAL CONDITION, IN
RELATION TO SEATING PLANE AND
EACH OTHER.
2. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
15
B
1
14
A
L
C
N
H
G
F
D
K
SEATING
PLANE
M
J
DIM
A
B
C
D
F
G
H
J
K
L
M
N
MC68HC705JJ7 • MC68HC705JP7 — REV 4
MOTOROLA
Mechanical Specifications
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MILLIMETERS
MIN
MAX
36.45 37.21
13.72 14.22
3.94
5.08
0.36
0.56
1.02
1.52
2.54 BSC
1.65
2.16
0.20
0.38
2.92
3.43
15.24 BSC
0°
15°
0.51
1.02
INCHES
MIN
MAX
1.435 1.465
0.540 0.560
0.155 0.200
0.014 0.022
0.040 0.060
0.100 BSC
0.065 0.085
0.008 0.015
0.115 0.135
0.600 BSC
0°
15°
0.020 0.040
Advance Information
233
Freescale Semiconductor, Inc.
Mechanical Specifications
16.6 28-Pin Small Outline Integrated Circuit (Case 751F)
-A28
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15
(0.006) PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.13
(0.005) TOTAL IN EXCESS OF D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
15
14X
-B1
P
0.010 (0.25)
M
B
M
14
28X D
0.010 (0.25)
M
T
A
B
S
M
S
Freescale Semiconductor, Inc...
R X 45°
DIM
A
B
C
D
F
G
J
K
M
P
R
C
-T26X
-T-
G
SEATING
PLANE
K
F
J
MILLIMETERS
MIN
MAX
17.80 18.05
7.40
7.60
2.35
2.65
0.35
0.49
0.41
0.90
1.27 BSC
0.23
0.32
0.13
0.29
0°
8°
10.05 10.55
0.25
0.75
INCHES
MIN
MAX
0.701 0.711
0.292 0.299
0.093 0.104
0.014 0.019
0.016 0.035
0.050 BSC
0.009 0.013
0.005 0.011
0°
8°
0.395 0.415
0.010 0.029
16.7 20-Pin Windowed Ceramic Integrated Circuit (Case 732)
20
11
1
10
NOTES:
1. LEADS WITHIN 0.010 DIAMETER, TRUE
POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONS A AND B INCLUDE MENISCUS.
B
A
L
C
F
N
H
D
G
K
J
M
DIM
A
B
C
D
F
G
H
J
K
L
M
N
INCHES
MIN
MAX
0.940
0.990
0.260
0.295
0.150
0.200
0.015
0.022
0.055
0.065
0.100 BSC
0.020
0.050
0.008
0.012
0.125
0.160
0.300 BSC
0_
15_
0.010
0.040
SEATING
PLANE
Advance Information
234
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Mechanical Specifications
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Freescale Semiconductor, Inc.
Mechanical Specifications
28-Pin Windowed Ceramic Integrated Circuit (Case 733A)
16.8 28-Pin Windowed Ceramic Integrated Circuit (Case 733A)
28
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B INCLUDE MENISCUS.
4. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
15
B
1
14
M
–A–
L
Freescale Semiconductor, Inc...
N
C
–T–
SEATING
PLANE
J
K
G
F
D 28 PL
0.25 (0.010)
M
T A
INCHES
MIN
MAX
1.435
1.490
0.500
0.605
0.160
0.240
0.015
0.022
0.050
0.065
0.100 BSC
0.008
0.012
0.125
0.160
0.600 BSC
0_
15 _
0.020
0.050
MILLIMETERS
MIN
MAX
36.45
37.84
12.70
15.36
4.06
6.09
0.38
0.55
1.27
1.65
2.54 BSC
0.20
0.30
3.17
4.06
15.24 BSC
0_
15 _
0.51
1.27
M
MC68HC705JJ7 • MC68HC705JP7 — REV 4
MOTOROLA
DIM
A
B
C
D
F
G
J
K
L
M
N
Mechanical Specifications
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235
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc...
Mechanical Specifications
Advance Information
236
MC68HC705JJ7 • MC68HC705JP7 — REV 4
Mechanical Specifications
For More Information On This Product,
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Freescale Semiconductor, Inc.
Advance Information — MC68HC705JJ7/MC68HC705JP7
Section 17. Ordering Information
Freescale Semiconductor, Inc...
17.1 Contents
17.2
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 237
17.3
MC68HC705JJ7 Order Numbers . . . . . . . . . . . . . . . . . . . . . . 238
17.4
MC68HC705JP7 Order Numbers . . . . . . . . . . . . . . . . . . . . . .239
17.2 Introduction
This section contains instructions for ordering the various erasable
programmable read-only memory (EPROM) versions of the
MC68HC05JJ/JP Family of microcontrollers.
MC68HC705JJ7 • MC68HC705JP7 — REV 4
MOTOROLA
Ordering Information
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237
Freescale Semiconductor, Inc.
Ordering Information
17.3 MC68HC705JJ7 Order Numbers
MC order numbers for the available 20-pin package types are shown
here.
EPO
Oscill.
Type(1)
LPO Freq.
(kHz)
Operating
Temperature
Range
Plastic DIP(2)
XTAL
100
–40 to 85° C
MC68HC705JJ7CP
SOIC(3)
XTAL
100
–40 to 85° C
MC68HC705JJ7CDW
CERDIP(4), (5)
XTAL
100
–40 to 85° C
MC68HC705JJ7S
Plastic DIP
RC
100
–40 to 85° C
MC68HRC705JJ7CP
SOIC
RC
100
–40 to 85° C
MC68HRC705JJ7CDW
CERDIP(5)
RC
100
–40 to 85° C
MC68HRC705JJ7S
Plastic DIP
XTAL
500
–40 to 85° C
MC68HC705SJ7CP
SOIC
XTAL
500
–40 to 85° C
MC68HC705SJ7CDW
CERDIP(5)
XTAL
500
–40 to 85° C
MC68HC705SJ7S
Freescale Semiconductor, Inc...
Package
Type
Order Number
1. Crystal/ceramic resonator or RC oscillator
2. Plastic dual in-line package (P, case outline 738)
3. Small outline integrated circuit package (DW, case outline 751D)
4. Windowed ceramic dual in-line package (S, case outline 732)
5. CERDIP parts are only guaranteed at room temperature and are for evoluation purposes
only.
Advance Information
238
MC68HC705JJ7 • MC68HC705JP7 — REV 4
Ordering Information
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Freescale Semiconductor, Inc.
Ordering Information
MC68HC705JP7 Order Numbers
17.4 MC68HC705JP7 Order Numbers
Freescale Semiconductor, Inc...
MC order numbers for the available 28-pin package types are shown
here.
Package
Type
EPO
Oscill.
Type(1)
LPO Freq.
(kHz)
Operating
Temperature
Range
Plastic DIP(2)
XTAL
100
–40 to 85° C
MC68HC705JP7CP
SOIC(3)
XTAL
100
–40 to 85° C
MC68HC705JP7CDW
CERDIP(4), (5)
XTAL
100
–40 to 85° C
MC68HC705JP7S
Plastic DIP
RC
100
–40 to 85° C
MC68HRC705JP7CP
SOIC
RC
100
–40 to 85° C
MC68HRC705JP7CDW
CERDIP(5)
RC
100
–40 to 85° C
MC68HRC705JP7S
Plastic DIP
XTAL
500
–40 to 85° C
MC68HC705SP7CP
SOIC
XTAL
500
–40 to 85° C
MC68HC705SP7CDW
CERDIP(5)
XTAL
500
–40 to 85° C
MC68HC705SP7S
Order Number
1. Crystal/ceramic resonator or RC oscillator
2. Plastic dual in-line package (P, case outline 710)
3. Small outline integrated circuit package (DW, case outline 751F)
4. Windowed ceramic dual in-line package (S, case outline 733A)
5. CERDIP parts are only guaranteed at room temperature and are for evoluation purposes
only.
MC68HC705JJ7 • MC68HC705JP7 — REV 4
MOTOROLA
Ordering Information
For More Information On This Product,
Go to: www.freescale.com
Advance Information
239
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc...
Ordering Information
Advance Information
240
MC68HC705JJ7 • MC68HC705JP7 — REV 4
Ordering Information
For More Information On This Product,
Go to: www.freescale.com
MOTOROLA
Freescale Semiconductor, Inc.
Freescale Semiconductor, Inc...
blank
For More Information On This Product,
Go to: www.freescale.com
Freescale Semiconductor, Inc.
USA/EUROPE/LOCATIONS NOT LISTED:
Motorola Literature Distribution
P.O. Box 5405
Denver, Colorado 80217
1-303-675-2140
1-800-441-2447
TECHNICAL INFORMATION CENTER:
1-800-521-6274
MC68HC05P6 Technical Data
How to Reach Us:
JAPAN:
Motorola Japan Ltd.
SPS, Technical Information Center
3-20-1, Minami-Azabu, Minato-ku
Tokyo 106-8573 Japan
81-3-3440-3569
ASIA/PACIFIC:
Motorola Semiconductors H.K. Ltd.
Silicon Harbour Centre
2 Dai King Street
Tai Po Industrial Estate
Tai Po, N.T., Hong Kong
852-26668334
HOME PAGE:
http://www.motorola.com/semiconductors/
MC68HC705JJ7/D
REV 4
Q4/00
REV 1