Material Content Data Sheet Sales Product Name TLE4269GM Issued MA# MA000969912 Package PG-DSO-14-30 29. August 2013 Weight* 143.20 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver acrylic resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 2.966 2.07 0.015 0.01 0.060 0.04 421 1.207 0.84 8428 49.007 34.22 35.11 342219 351173 0.266 0.19 0.19 1860 1860 0.172 0.12 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 2.07 20709 20709 105 1201 7.911 5.52 77.906 54.41 60.05 544024 600468 1.226 0.86 0.86 8562 8562 1.030 0.72 0.72 7191 7191 0.316 0.22 1.121 0.78 55243 2208 1.00 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 7829 10037 1000000