ASM3P1819N August 2005 rev 0.2 Low Power Mobile VGA EMI Reduction IC Features The ASM3P1819N reduces electromagnetic interference FCC approved method of EMI attenuation (EMI) at the clock source, allowing a system wide EMI Provides up to 15dB EMI reduction reduction for all the down stream clocks and data Generates a low EMI spread spectrum clock dependent signals. The ASM3P1819N allows significant and a non-spread Reference Clock of the input system cost savings by reducing the number of circuit frequency board layers, ferrite beads, shielding, and other passive Optimized for frequency range from 20MHz to components that are traditionally required to pass EMI 40MHz regulations. Internal loop filter minimizes external components The ASM3P1819N modulates the output of a single PLL in and board space order to “spread” the bandwidth of a synthesized clock, Down Spread Deviation: -1.25% thereby decreasing the peak amplitude of its harmonics. Low inherent Cycle-to-Cycle jitter This result in significantly lower system EMI compared to 3.3V Operating Voltage the typical narrow band signal produced by oscillators and CMOS/TTL compatible inputs and outputs most clock generators. Low power CMOS design Supports notebook VGA and other LCD timing Lowering EMI by increasing a signal’s bandwidth is called “spread spectrum clock generation”. The ASM3P1819N controller applications uses the most efficient and optimized modulation profile Power Down function for mobile application Products are available for industrial temperature range. Available in 8 pin SOIC and TSSOP Packages ASM3P1819N is a proprietary all digital method Applications Functional Description The approved by the FCC and is implemented by using a The ASM3P1819N is targeted towards EMI management versatile spread spectrum for memory and LVDS interfaces in mobile graphic chipsets frequency modulator designed specifically for a wide range and high-speed digital applications such as PC peripheral of input clock frequencies from 20 to 40MHz. The devices, consumer electronics and embedded controller ASM3P1819N can generate an EMI reduced clock from system. crystal, ceramic resonator, or system clock. Block Diagram PD# PLL Modulation XIN Crystal Oscillator XOUT VDD Frequency Divider Feedback Divider Phase Detector Loop Filter VCO Output Divider ModOUT REF VSS Alliance Semiconductor 2575 Augustine Drive • Santa Clara, CA • Tel: 408.855.4900 • Fax: 408.855.4999 • www.alsc.com Notice: The information in this document is subject to change without notice. ASM3P1819N August 2005 rev 0.2 Pin Configuration 8 XOUT 7 VDD 3 6 PD# 4 5 REF XIN 1 VSS 2 NC ModOUT ASM3P1819N Pin Description Pin# Pin Name Type Description 1 XIN I Connect to externally generated Clock signal or Crystal. 2 VSS P Ground Connection. Connect to system ground. 3 NC - No Connect. 4 ModOUT O Spread spectrum clock output. 5 REF O Non-modulated Reference clock output of the input frequency. 6 PD# I Power down control pin. Pull LOW to enable Power-Down mode. This pin has an internal pull-up resistor. 7 VDD P Connect to +3.3V. 8 XOUT I Connect to crystal. No connect if externally generated clock signal is used. Absolute Maximum Ratings Symbol VDD, VIN TSTG Parameter Rating Unit Voltage on any pin with respect to Ground -0.5 to +7.0 V Storage temperature -65 to +125 °C TA Operating temperature 0 to 70 °C Ts Max. Soldering Temperature (10 sec) 260 °C TJ Junction Temperature 150 °C 2 KV TDV Static Discharge Voltage (As per JEDEC STD22- A114-B) Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. Output Frequency and Modulation Rate Input Frequency Range (MHz) Output Frequency Range (MHz) Modulation Rate Spread Deviation (%) 20 to 40 20 to 40 Input Frequency / 512 -1.25 Low Power Mobile VGA EMI Reduction IC Notice: The information in this document is subject to change without notice. 2 of 7 ASM3P1819N August 2005 rev 0.2 DC Electrical Characteristics (Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated) Symbol Parameter Min Typ Max Unit VIL Input Low voltage VSS – 0.3 - 0.8 V VIH Input High voltage 2.0 - VDD + 0.3 V IIL Input Low current - - -20.0 µA IIH Input High current - - 1.0 µA IXOL XOUT Output low current @ 0.4V, VDD = 3.3V - 3 - mA IXOH XOUT Output high current @ 2.5V, VDD = 3.3V - 3 - mA VOL Output Low voltage VDD = 3.3V, IOL = 20mA - - 0.4 V VOH Output High voltage VDD = 3.3V, IOH = 20mA 2.5 - - V ICC Dynamic Supply current 3.3V and 10pF probe loading 7.1 fIN - min - 26.9 fIN - max mA IDD Static Supply current - 4.5 - mA VDD Operating Voltage - 3.3 - V tON Power up time (First locked clock cycle after power up) - 0.18 - mS ZOUT Clock Output impedance - 50 - Ω AC Electrical Characteristics Symbol Min Typ Max Unit fIN Input Frequency Parameter 20 - 40 MHz fOUT Output Frequency 20 - 40 MHz tLH1 Output Rise time ( Measured from 0.8V to 2.0V ) - 0.69 - nS tHL1 Output Fall time ( Measured from 2.0V to 0.8V ) - 0.66 - nS tJC Jitter (Cycle to Cycle) -200 - 200 pS tD Output Duty cycle 45 50 55 % Note:1. tLH and tHL are measured into a capacitive load of 15pF Low Power Mobile VGA EMI Reduction IC Notice: The information in this document is subject to change without notice. 3 of 7 ASM3P1819N August 2005 rev 0.2 Package Information 8-Pin (150-mil) SOIC Package H E D A2 A C A1 D θ e L B Dimensions Symbol Inches Min Max Millimeters Min Max A1 0.004 0.010 0.10 0.25 A 0.053 0.069 1.35 1.75 A2 0.049 0.059 1.25 1.50 B 0.012 0.020 0.31 0.51 C 0.007 0.010 0.18 0.25 D 0.193 BSC 4.90 BSC E 0.154 BSC 3.91 BSC e 0.050 BSC 1.27 BSC H 0.236 BSC 6.00 BSC L 0.016 0.050 0.41 1.27 θ 0° 8° 0° 8° Note: Controlling dimensions are millimeters SOIC – 0.074 grams unit weight Low Power Mobile VGA EMI Reduction IC Notice: The information in this document is subject to change without notice. 4 of 7 ASM3P1819N August 2005 rev 0.2 8-lead Thin Shrunk Small Outline Package (4.40-MM Body) H E D A2 A C θ e A1 L B Dimensions Symbol Inches Min Millimeters Max A Min Max 0.043 1.10 A1 0.002 0.006 0.05 0.15 A2 0.033 0.037 0.85 0.95 B 0.008 0.012 0.19 0.30 c 0.004 0.008 0.09 0.20 D 0.114 0.122 2.90 3.10 E 0.169 0.177 4.30 4.50 e 0.026 BSC 0.65 BSC H 0.252 BSC 6.40 BSC L 0.020 0.028 0.50 0.70 θ 0° 8° 0° 8° Note: Controlling dimensions are millimeters TSSOP – 0.0325 grams unit weight Low Power Mobile VGA EMI Reduction IC Notice: The information in this document is subject to change without notice. 5 of 7 ASM3P1819N August 2005 rev 0.2 Ordering Information Part number ASM3P1819N -08-ST ASM3P1819N -08-SR ASM3P1819NF-08-ST ASM3P1819NF-08-SR ASM3P1819NG-08-ST ASM3P1819NG-08-SR ASM3I1819N -08-ST ASM3I1819N -08-SR ASM3I1819NF-08-ST ASM3I1819NF-08-SR ASM3I1819NG-08-ST ASM3I1819NG-08-SR ASM3P1819N -08-TT ASM3P1819N -08-TR ASM3P1819NF-08-TT ASM3P1819NF-08-TR ASM3P1819NG-08-TT ASM3P1819NG-08-TR ASM3I1819N -08-TT ASM3I1819N -08-TR ASM3I1819NF-08-TT ASM3I1819NF-08-TR ASM3I1819NG-08-TT ASM3I1819NG-08-TR Marking 3P1819N 3P1819N 3P1819NF 3P1819NF 3P1819NG 3P1819NG 3I1819N 3I1819N 3I1819NF 3I1819NF 3I1819NG 3I1819NG 3P1819N 3P1819N 3P1819NF 3P1819NF 3P1819NG 3P1819NG 3I1819N 3I1819N 3I1819NF 3I1819NF 3I1819NG 3I1819NG Package Configuration Temperature Range 8-Pin SOIC,Tube 8-Pin SOIC, Tape and Reel 8-Pin SOIC, Tube, Pb Free 8-Pin SOIC, Tape and Reel, Pb Free 8-Pin SOIC, Tube, Green 8-Pin SOIC, Tape and Reel, Green 8-Pin SOIC, Tube 8-Pin SOIC, Tape and Reel 8-Pin SOIC, Tube, Pb Free 8-Pin SOIC, Tape and Reel, Pb Free 8-Pin SOIC, Tube, Green 8-Pin SOIC, Tape and Reel, Green 8-Pin TSSOP, Tube 8-Pin TSSOP, Tape and Reel 8-Pin TSSOP, Tube, Pb Free 8-Pin TSSOP, Tape and Reel, Pb Free 8-Pin TSSOP, Tube, Green 8-Pin TSSOP, Tape and Reel, Green 8-Pin TSSOP, Tube 8-Pin TSSOP, Tape and Reel 8-Pin TSSOP, Tube, Pb Free 8-Pin TSSOP, Tape and Reel, Pb Free 8-Pin TSSOP, Tube, Green 8-Pin TSSOP, Tape and Reel, Green Commercial Commercial Commercial Commercial Commercial Commercial Industrial Industrial Industrial Industrial Industrial Industrial Commercial Commercial Commercial Commercial Commercial Commercial Industrial Industrial Industrial Industrial Industrial Industrial Device Ordering Information A S M 3 P 1 8 1 9 N F - 0 8 - S R R = Tape & reel, T = Tube or Tray O = SOT S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70 DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved ALLIANCE SEMICONDUCTOR MIXED SIGNAL PRODUCT Licensed under US patent #5,488,627, #6,646,463 and #5,631,920 Low Power Mobile VGA EMI Reduction IC Notice: The information in this document is subject to change without notice. 6 of 7 ASM3P1819N August 2005 rev 0.2 Alliance Semiconductor Corporation 2575 Augustine Drive, Santa Clara, CA 95054 Tel# 408-855-4900 Fax: 408-855-4999 www.alsc.com Copyright © Alliance Semiconductor All Rights Reserved Part Number: ASM3P1819N Document Version: 0.2 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to Alliance Semiconductor, dated 11-11-2003 © Copyright 2003 Alliance Semiconductor Corporation. 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Alliance does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of Alliance products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify Alliance against all claims arising from such use. Low Power Mobile VGA EMI Reduction IC Notice: The information in this document is subject to change without notice. 7 of 7