TI1 LM2937ES-5.0 Lm2937 500 ma low dropout regulator Datasheet

LM2937
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SNVS100E – MARCH 2000 – REVISED APRIL 2013
LM2937 500 mA Low Dropout Regulator
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FEATURES
DESCRIPTION
1
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2
•
•
•
•
•
•
•
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Fully Specified for Operation Over −40°C to
+125°C
Output Current in Excess of 500 mA
Output Trimmed for 5% Tolerance Under all
Operating Conditions
Typical Dropout Voltage of 0.5V at Full Rated
Load Current
Wide Output Capacitor ESR Range, up to 3Ω
Internal Short Circuit and Thermal Overload
Protection
Reverse Battery Protection
60V Input Transient Protection
Mirror Image Insertion Protection
The LM2937 is a positive voltage regulator capable of
supplying up to 500 mA of load current. The use of a
PNP power transistor provides a low dropout voltage
characteristic. With a load current of 500 mA the
minimum input to output voltage differential required
for the output to remain in regulation is typically 0.5V
(1V ensured maximum over the full operating
temperature range). Special circuitry has been
incorporated to minimize the quiescent current to
typically only 10 mA with a full 500 mA load current
when the input to output voltage differential is greater
than 3V.
The LM2937 requires an output bypass capacitor for
stability. As with most low dropout regulators, the
ESR of this capacitor remains a critical design
parameter, but the LM2937 includes special
compensation
circuitry
that
relaxes
ESR
requirements. The LM2937 is stable for all ESR
below 3Ω. This allows the use of low ESR chip
capacitors.
Ideally suited for automotive applications, the LM2937
will protect itself and any load circuitry from reverse
battery connections, two-battery jumps and up to
+60V/−50V load dump transients. Familiar regulator
features such as short circuit and thermal shutdown
protection are also built in.
Connection Diagrams
Front View
Figure 1. TO-220 Plastic Package
See Package Number NDE0003B
Top View
Figure 3. DDPAK/TO-263 Surface-Mount Package
See Package Number KTT0003B
Front View
Figure 2. SOT-223 Plastic Package
See Package Number DCY0004A
Side View
Figure 4. DDPAK/TO-263 Surface-Mount Package
See Package Number KTT0003B
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2013, Texas Instruments Incorporated
LM2937
SNVS100E – MARCH 2000 – REVISED APRIL 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1) (2)
Continuous
Input Voltage
Transient (t ≤ 100 ms)
Internal Power Dissipation (3)
26V
60V
Internally Limited
Maximum Junction Temperature
150°C
−65°C to +150°C
Storage Temperature Range
TO-220 (10 seconds)
260°C
DDPAK/TO-263 (10 seconds)
230°C
SOT-223 (Vapor Phase, 60 seconds)
215°C
SOT-223 (Infared, 15 seconds)
220°C
ESD Susceptibility
(1)
(2)
(3)
(4)
(4)
2 kV
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when
operating the device outside of its rated Operating Conditions.
If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
The maximum allowable power dissipation at any ambient temperature is PMAX = (125 − TA)/θJA, where 125 is the maximum junction
temperature for operation, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is
exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above
150°C, the LM2937 will go into thermal shutdown. For the LM2937, the junction-to-ambient thermal resistance θJA is 65°C/W, for the
TO-220 package, 73°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. When used with a heatsink, θJA is
the sum of the LM2937 junction-to-case thermal resistance θJC of 3°C/W and the heatsink case-to-ambient thermal resistance. If the
DDPAK/TO-263 or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area
thermally connected to the package (see Application Hints for more information on heatsinking).
ESD rating is based on the human body model, 100 pF discharged through 1.5 kΩ.
Operating Conditions (1)
Temperature Range (2)
LM2937ET, LM2937ES
LM2937IMP
Maximum Input Voltage
(1)
(2)
2
−40°C ≤ TJ ≤125°C
−40°C ≤ TJ ≤85°C
26V
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Electrical specifications do not apply when
operating the device outside of its rated Operating Conditions.
The maximum allowable power dissipation at any ambient temperature is PMAX = (125 − TA)/θJA, where 125 is the maximum junction
temperature for operation, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is
exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above
150°C, the LM2937 will go into thermal shutdown. For the LM2937, the junction-to-ambient thermal resistance θJA is 65°C/W, for the
TO-220 package, 73°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. When used with a heatsink, θJA is
the sum of the LM2937 junction-to-case thermal resistance θJC of 3°C/W and the heatsink case-to-ambient thermal resistance. If the
DDPAK/TO-263 or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area
thermally connected to the package (see Application Hints for more information on heatsinking).
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Electrical Characteristics
VIN = VNOM + 5V (1) IOUTmax = 500 mA for the TO-220 and DDPAK/TO-263 packages, IOUTmax=400mA for the SOT-223 package,
COUT = 10 μF unless otherwise indicated. Boldface limits apply over the entire operating temperature range of the
indicated device., all other specifications are for TA = TJ = 25°C.
Output Voltage (VOUT)
Parameter
5V
Conditions
Typ
Output Voltage
8V
Limit
Typ
4.85
5.00
5 mA ≤ IOUT ≤ IOUTmax
4.75
10V
Limit
Typ
7.76
8.00
7.60
Limit
9.70
10.00
Units
V(Min)
9.50
V(Min)
5.15
8.24
10.30
V(Max)
5.25
8.40
10.50
V(Max)
Line Regulation
(VOUT + 2V) ≤ VIN ≤ 26V,
IOUT = 5 mA
15
50
24
80
30
100
mV(Max)
Load Regulation
5 mA ≤ IOUT ≤ IOUTmax
5
50
8
80
10
100
mV(Max)
Quiescent Current
(VOUT + 2V) ≤ VIN ≤ 26V,
IOUT = 5 mA
2
10
2
10
2
10
mA(Max)
VIN = (VOUT + 5V),
IOUT = IOUTmax
10
20
10
20
10
20
mA(Max)
Output Noise Voltage
10 Hz–100 kHz, IOUT = 5 mA
150
Long Term Stability
1000 Hrs.
20
Dropout Voltage
IOUT = IOUTmax
0.5
1.0
0.5
1.0
0.5
1.0
V(Max)
IOUT = 50 mA
110
250
110
250
110
250
mV(Max)
Short-Circuit Current
1.0
0.6
1.0
0.6
1.0
0.6
A(Min)
Peak Line Transient Voltage tf < 100 ms, RL = 100Ω
75
60
75
60
75
60
V(Min)
26
V(Min)
Maximum Operational Input
Voltage
240
32
26
μVrms
300
40
26
mV
Reverse DC Input Voltage
VOUT ≥ −0.6V, RL = 100Ω
−30
−15
−30
−15
−30
−15
V(Min)
Reverse Transient Input
Voltage
tr < 1 ms, RL = 100Ω
−75
−50
−75
−50
−75
−50
V(Min)
(1)
Typicals are at TJ = 25°C and represent the most likely parametric norm.
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Electrical Characteristics
VIN = VNOM + 5V (1) IOUTmax = 500 mA for the TO-220 and DDPAK/TO-263 packages, IOUTmax=400mA for the SOT-223 package,
COUT = 10 μF unless otherwise indicated. Boldface limits apply over the entire operating temperature range of the
indicted device., all other specifications are for TA = TJ = 25°C.
Output Voltage (VOUT)
Parameter
12V
Conditions
Typ
Output Voltage
15V
Limit
Typ
11.64
5 mA ≤ IOUT ≤ IOUTmax
12.00
11.40
Limit
14.55
15.00
Units
V (Min)
14.25
V(Min)
12.36
15.45
V(Max)
12.60
15.75
V(Max)
Line Regulation
(VOUT + 2V) ≤ VIN ≤ 26V,
IOUT = 5 mA
36
120
45
150
mV(Max)
Load Regulation
5 mA ≤ IOUT ≤ IOUTmax
12
120
15
150
mV(Max)
Quiescent Current
(VOUT + 2V) ≤ VIN ≤ 26V,
IOUT = 5 mA
2
10
2
10
mA(Max)
VIN = (VOUT + 5V),
IOUT = IOUTmax
10
20
10
20
mA(Max)
Output Noise Voltage
10 Hz–100 kHz, IOUT = 5 mA
360
Long Term Stability
1000 Hrs
44
Dropout Voltage
IOUT = IOUTmax
0.5
1.0
0.5
1.0
V(Max)
IOUT = 50 mA
110
250
110
250
mV(Max)
1.0
0.6
1.0
0.6
A(Min)
75
60
75
60
V(Min)
26
V(Min)
Short-Circuit Current
Peak Line Transient Voltage
tf < 100 ms, RL = 100Ω
Maximum Operational Input
Voltage
μVrms
450
56
26
mV
Reverse DC Input Voltage
VOUT ≥ −0.6V, RL = 100Ω
−30
−15
−30
−15
V(Min)
Reverse Transient Input
Voltage
tr < 1 ms, RL = 100Ω
−75
−50
−75
−50
V(Min)
(1)
4
Typicals are at TJ = 25°C and represent the most likely parametric norm.
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Typical Performance Characteristics
Dropout Voltage vs. Output Current
Dropout Voltage vs. Temperature
Figure 5.
Figure 6.
Output Voltage vs. Temperature
Quiescent Current vs. Temperature
Figure 7.
Figure 8.
Quiescent Current vs. Input Voltage
Quiescent Current vs. Output Current
Figure 9.
Figure 10.
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Typical Performance Characteristics (continued)
(1)
6
Line Transient Response
Load Transient Response
Figure 11.
Figure 12.
Ripple Rejection
Output Impedance
Figure 13.
Figure 14.
Maximum Power Dissipation (TO-220)
Maximum Power Dissipation (DDPAK/TO-263) (1)
Figure 15.
Figure 16.
The maximum allowable power dissipation at any ambient temperature is PMAX = (125 − TA)/θJA, where 125 is the maximum junction
temperature for operation, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. If this dissipation is
exceeded, the die temperature will rise above 125°C and the electrical specifications do not apply. If the die temperature rises above
150°C, the LM2937 will go into thermal shutdown. For the LM2937, the junction-to-ambient thermal resistance θJA is 65°C/W, for the
TO-220 package, 73°C/W for the DDPAK/TO-263 package, and 174°C/W for the SOT-223 package. When used with a heatsink, θJA is
the sum of the LM2937 junction-to-case thermal resistance θJC of 3°C/W and the heatsink case-to-ambient thermal resistance. If the
DDPAK/TO-263 or SOT-223 packages are used, the thermal resistance can be reduced by increasing the P.C. board copper area
thermally connected to the package (see Application Hints for more information on heatsinking).
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Typical Performance Characteristics (continued)
Low Voltage Behavior
Low Voltage Behavior
Figure 17.
Figure 18.
Low Voltage Behavior
Output at Voltage Extremes
Figure 19.
Figure 20.
Output at Voltage Extremes
Figure 21.
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Typical Performance Characteristics (continued)
8
Output Capacitor ESR
Peak Output Current
Figure 22.
Figure 23.
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Typical Application
* Required if the regulator is located more than 3 inches from the power supply filter capacitors.
** Required for stability. Cout must be at least 10 μF (over the full expected operating temperature range) and located
as close as possible to the regulator. The equivalent series resistance, ESR, of this capacitor may be as high as 3Ω.
APPLICATION HINTS
EXTERNAL CAPACITORS
The output capacitor is critical to maintaining regulator stability, and must meet the required conditions for both
ESR (Equivalent Series Resistance) and minimum amount of capacitance.
MINIMUM CAPACITANCE:
The minimum output capacitance required to maintain stability is 10 μF (this value may be increased without
limit). Larger values of output capacitance will give improved transient response.
ESR LIMITS:
The ESR of the output capacitor will cause loop instability if it is too high or too low. The acceptable range of
ESR plotted versus load current is shown in the graph below. It is essential that the output capacitor meet
these requirements, or oscillations can result.
Output Capacitor ESR
Figure 24. ESR Limits
It is important to note that for most capacitors, ESR is specified only at room temperature. However, the designer
must ensure that the ESR will stay inside the limits shown over the entire operating temperature range for the
design.
For aluminum electrolytic capacitors, ESR will increase by about 30X as the temperature is reduced from 25°C to
−40°C. This type of capacitor is not well-suited for low temperature operation.
Solid tantalum capacitors have a more stable ESR over temperature, but are more expensive than aluminum
electrolytics. A cost-effective approach sometimes used is to parallel an aluminum electrolytic with a solid
Tantalum, with the total capacitance split about 75/25% with the Aluminum being the larger value.
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If two capacitors are paralleled, the effective ESR is the parallel of the two individual values. The “flatter” ESR of
the Tantalum will keep the effective ESR from rising as quickly at low temperatures.
HEATSINKING
A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of
the application. Under all possible operating conditions, the junction temperature must be within the range
specified under Absolute Maximum Ratings.
To determine if a heatsink is required, the power dissipated by the regulator, PD, must be calculated.
The figure below shows the voltages and currents which are present in the circuit, as well as the formula for
calculating the power dissipated in the regulator:
IIN = IL + IG
PD = (VIN − VOUT) IL + (VIN) IG
Figure 25. Power Dissipation Diagram
The next parameter which must be calculated is the maximum allowable temperature rise, TR (max). This is
calculated by using the formula:
TR (max) = TJ(max) − TA (max)
where
•
•
TJ (max) is the maximum allowable junction temperature, which is 125°C for commercial grade parts
TA (max) is the maximum ambient temperature which will be encountered in the application
(1)
Using the calculated values for TR(max) and PD, the maximum allowable value for the junction-to-ambient
thermal resistance, θ(J−A), can now be found:
θ(J−A) = TR (max)/PD
(2)
IMPORTANT: If the maximum allowable value for θ(J−A) is found to be ≥ 53°C/W for the TO-220 package, ≥
80°C/W for the DDPAK/TO-263 package, or ≥174°C/W for the SOT-223 package, no heatsink is needed since
the package alone will dissipate enough heat to satisfy these requirements.
If the calculated value for θ(J−A) falls below these limits, a heatsink is required.
10
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HEATSINKING TO-220 PACKAGE PARTS
The TO-220 can be attached to a typical heatsink, or secured to a copper plane on a PC board. If a copper plane
is to be used, the values of θ(J−A) will be the same as shown in the next section for the DDPAK/TO-263.
If a manufactured heatsink is to be selected, the value of heatsink-to-ambient thermal resistance, θ(H−A), must
first be calculated:
θ(H−A) = θ(J−A) − θ(C−H) − θ(J−C)
where
•
•
θ(J−C) is defined as the thermal resistance from the junction to the surface of the case. A value of 3°C/W can be
assumed for θ(J−C) for this calculation
θ(C−H) is defined as the thermal resistance between the case and the surface of the heatsink. The value of
θ(C−H) will vary from about 1.5°C/W to about 2.5°C/W (depending on method of attachment, insulator, etc.). If
the exact value is unknown, 2°C/W should be assumed for θ(C−H)
(3)
When a value for θ(H−A) is found using the equation shown, a heatsink must be selected that has a value that is
less than or equal to this number.
θ(H−A) is specified numerically by the heatsink manufacturer in the catalog, or shown in a curve that plots
temperature rise vs power dissipation for the heatsink.
HEATSINKING DDPAK/TO-263 AND SOT-223 PACKAGE PARTS
Both the DDPAK/TO-263 (“S”) and SOT-223 (“MP”) packages use a copper plane on the PCB and the PCB itself
as a heatsink. To optimize the heat sinking ability of the plane and PCB, solder the tab of the package to the
plane.
Figure 26 shows for the DDPAK/TO-263 the measured values of θ(J−A) for different copper area sizes using a
typical PCB with 1 ounce copper and no solder mask over the copper area used for heatsinking.
Figure 26. θ(J−A) vs. Copper (1 ounce) Area for the DDPAK/TO-263 Package
As shown in the figure, increasing the copper area beyond 1 square inch produces very little improvement. It
should also be observed that the minimum value of θ(J−A) for the DDPAK/TO-263 package mounted to a PCB is
32°C/W.
As a design aid, Figure 27 shows the maximum allowable power dissipation compared to ambient temperature
for the DDPAK/TO-263 device (assuming θ(J−A) is 35°C/W and the maximum junction temperature is 125°C).
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Figure 27. Maximum Power Dissipation vs. TAMB for the DDPAK/TO-263 Package
Figure 28 and Figure 29 show the information for the SOT-223 package. Figure 29 assumes a θ(J−A) of 74°C/W
for 1 ounce copper and 51°C/W for 2 ounce copper and a maximum junction temperature of +85°C.
Figure 28. θ(J−A) vs Copper (2 ounce) Area for the
SOT-223 Package
Figure 29. Maximum Power Dissipation vs TAMB for
the SOT-223 Package
SOT-223 SOLDERING RECOMMENDATIONS
It is not recommended to use hand soldering or wave soldering to attach the small SOT-223 package to a printed
circuit board. The excessive temperatures involved may cause package cracking.
Either vapor phase or infrared reflow techniques are preferred soldering attachment methods for the SOT-223
package.
12
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REVISION HISTORY
Changes from Revision D (April 2013) to Revision E
•
Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 12
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PACKAGE OPTION ADDENDUM
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11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LM2937ES-10
ACTIVE
DDPAK/
TO-263
KTT
3
45
TBD
Call TI
Call TI
-40 to 125
LM2937ES
-10
LM2937ES-10/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM2937ES
-10
LM2937ES-12
ACTIVE
DDPAK/
TO-263
KTT
3
45
TBD
Call TI
Call TI
-40 to 125
LM2937ES
-12
LM2937ES-12/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM2937ES
-12
LM2937ES-15
ACTIVE
DDPAK/
TO-263
KTT
3
45
TBD
Call TI
Call TI
-40 to 125
LM2937ES
-15
LM2937ES-15/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM2937ES
-15
LM2937ES-5.0
ACTIVE
DDPAK/
TO-263
KTT
3
45
TBD
Call TI
Call TI
-40 to 125
LM2937ES
-5.0
LM2937ES-5.0/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM2937ES
-5.0
LM2937ES-8.0
ACTIVE
DDPAK/
TO-263
KTT
3
45
TBD
Call TI
Call TI
-40 to 125
LM2937ES
-8.0
LM2937ES-8.0/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
45
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM2937ES
-8.0
LM2937ESX-12
ACTIVE
DDPAK/
TO-263
KTT
3
500
TBD
Call TI
Call TI
-40 to 125
LM2937ES
-12
LM2937ESX-12/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM2937ES
-12
LM2937ESX-15
ACTIVE
DDPAK/
TO-263
KTT
3
500
TBD
Call TI
Call TI
-40 to 125
LM2937ES
-15
LM2937ESX-15/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM2937ES
-15
LM2937ESX-5.0
ACTIVE
DDPAK/
TO-263
KTT
3
500
TBD
Call TI
Call TI
-40 to 125
LM2937ES
-5.0
LM2937ESX-5.0/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM2937ES
-5.0
LM2937ESX-8.0
ACTIVE
DDPAK/
TO-263
KTT
3
500
TBD
Call TI
Call TI
-40 to 125
LM2937ES
-8.0
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
11-Apr-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LM2937ESX-8.0/NOPB
ACTIVE
DDPAK/
TO-263
KTT
3
500
Pb-Free (RoHS
Exempt)
CU SN
Level-3-245C-168 HR
-40 to 125
LM2937ES
-8.0
LM2937ET-10
ACTIVE
TO-220
NDE
3
45
TBD
Call TI
Call TI
-40 to 125
LM2937ET
-10
LM2937ET-10/NOPB
ACTIVE
TO-220
NDE
3
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM2937ET
-10
LM2937ET-12
ACTIVE
TO-220
NDE
3
45
TBD
Call TI
Call TI
-40 to 125
LM2937ET
-12
LM2937ET-12/NOPB
ACTIVE
TO-220
NDE
3
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM2937ET
-12
LM2937ET-15
ACTIVE
TO-220
NDE
3
45
TBD
Call TI
Call TI
-40 to 125
LM2937ET
-15
LM2937ET-15/NOPB
ACTIVE
TO-220
NDE
3
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM2937ET
-15
LM2937ET-5.0
ACTIVE
TO-220
NDE
3
45
TBD
Call TI
Call TI
-40 to 125
LM2937ET
-5.0
LM2937ET-5.0/NOPB
ACTIVE
TO-220
NDE
3
45
Pb-Free (RoHS
Exempt)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM2937ET
-5.0
LM2937ET-8.0
ACTIVE
TO-220
NDE
3
45
TBD
Call TI
Call TI
-40 to 125
LM2937ET
-8.0
LM2937ET-8.0/NOPB
ACTIVE
TO-220
NDE
3
45
Green (RoHS
& no Sb/Br)
CU SN
Level-1-NA-UNLIM
-40 to 125
LM2937ET
-8.0
LM2937IMP-10
ACTIVE
SOT-223
DCY
4
1000
TBD
Call TI
Call TI
-40 to 125
L73B
LM2937IMP-10/NOPB
ACTIVE
SOT-223
DCY
4
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L73B
LM2937IMP-12
ACTIVE
SOT-223
DCY
4
1000
TBD
Call TI
Call TI
-40 to 125
L74B
LM2937IMP-12/NOPB
ACTIVE
SOT-223
DCY
4
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L74B
LM2937IMP-5.0
ACTIVE
SOT-223
DCY
4
1000
TBD
Call TI
Call TI
-40 to 125
L71B
LM2937IMP-5.0/NOPB
ACTIVE
SOT-223
DCY
4
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L71B
LM2937IMP-8.0
ACTIVE
SOT-223
DCY
4
1000
TBD
Call TI
Call TI
-40 to 125
L72B
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
Orderable Device
11-Apr-2013
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LM2937IMP-8.0/NOPB
ACTIVE
SOT-223
DCY
4
1000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L72B
LM2937IMPX-10
ACTIVE
SOT-223
DCY
4
2000
TBD
Call TI
Call TI
-40 to 125
L73B
LM2937IMPX-10/NOPB
ACTIVE
SOT-223
DCY
4
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L73B
LM2937IMPX-12
ACTIVE
SOT-223
DCY
4
2000
TBD
Call TI
Call TI
-40 to 125
L74B
LM2937IMPX-12/NOPB
ACTIVE
SOT-223
DCY
4
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L74B
LM2937IMPX-15
ACTIVE
SOT-223
DCY
4
2000
TBD
Call TI
Call TI
-40 to 125
L75B
LM2937IMPX-15/NOPB
ACTIVE
SOT-223
DCY
4
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L75B
LM2937IMPX-5.0
ACTIVE
SOT-223
DCY
4
2000
TBD
Call TI
Call TI
-40 to 125
L71B
LM2937IMPX-5.0/NOPB
ACTIVE
SOT-223
DCY
4
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L71B
LM2937IMPX-8.0
ACTIVE
SOT-223
DCY
4
2000
TBD
Call TI
Call TI
-40 to 125
L72B
LM2937IMPX-8.0/NOPB
ACTIVE
SOT-223
DCY
4
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L72B
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
(3)
11-Apr-2013
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM2937ESX-12
DDPAK/
TO-263
KTT
3
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LM2937ESX-12/NOPB
DDPAK/
TO-263
KTT
3
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LM2937ESX-15
DDPAK/
TO-263
KTT
3
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LM2937ESX-15/NOPB
DDPAK/
TO-263
KTT
3
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LM2937ESX-5.0
DDPAK/
TO-263
KTT
3
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LM2937ESX-5.0/NOPB
DDPAK/
TO-263
KTT
3
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LM2937ESX-8.0
DDPAK/
TO-263
KTT
3
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LM2937ESX-8.0/NOPB
DDPAK/
TO-263
KTT
3
500
330.0
24.4
10.75
14.85
5.0
16.0
24.0
Q2
LM2937IMP-10
SOT-223
DCY
4
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM2937IMP-10/NOPB
SOT-223
DCY
4
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM2937IMP-12
SOT-223
DCY
4
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM2937IMP-12/NOPB
SOT-223
DCY
4
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM2937IMP-5.0
SOT-223
DCY
4
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM2937IMP-5.0/NOPB
SOT-223
DCY
4
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM2937IMP-8.0
SOT-223
DCY
4
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM2937IMP-8.0/NOPB
SOT-223
DCY
4
1000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM2937IMPX-10
SOT-223
DCY
4
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM2937IMPX-10/NOPB SOT-223
DCY
4
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
SOT-223
DCY
4
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM2937IMPX-12/NOPB SOT-223
DCY
4
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
SOT-223
DCY
4
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM2937IMPX-15/NOPB SOT-223
DCY
4
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
SOT-223
DCY
4
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM2937IMPX-5.0/NOPB SOT-223
LM2937IMPX-12
LM2937IMPX-15
LM2937IMPX-5.0
DCY
4
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
SOT-223
DCY
4
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM2937IMPX-8.0/NOPB SOT-223
DCY
4
2000
330.0
16.4
7.0
7.5
2.2
12.0
16.0
Q3
LM2937IMPX-8.0
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM2937ESX-12
DDPAK/TO-263
KTT
3
500
367.0
367.0
45.0
LM2937ESX-12/NOPB
DDPAK/TO-263
KTT
3
500
367.0
367.0
45.0
LM2937ESX-15
DDPAK/TO-263
KTT
3
500
367.0
367.0
45.0
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM2937ESX-15/NOPB
DDPAK/TO-263
KTT
3
500
367.0
367.0
45.0
LM2937ESX-5.0
DDPAK/TO-263
KTT
3
500
367.0
367.0
45.0
LM2937ESX-5.0/NOPB
DDPAK/TO-263
KTT
3
500
367.0
367.0
45.0
LM2937ESX-8.0
DDPAK/TO-263
KTT
3
500
367.0
367.0
45.0
LM2937ESX-8.0/NOPB
DDPAK/TO-263
KTT
3
500
367.0
367.0
45.0
LM2937IMP-10
SOT-223
DCY
4
1000
367.0
367.0
35.0
LM2937IMP-10/NOPB
SOT-223
DCY
4
1000
367.0
367.0
35.0
LM2937IMP-12
SOT-223
DCY
4
1000
367.0
367.0
35.0
LM2937IMP-12/NOPB
SOT-223
DCY
4
1000
367.0
367.0
35.0
LM2937IMP-5.0
SOT-223
DCY
4
1000
367.0
367.0
35.0
LM2937IMP-5.0/NOPB
SOT-223
DCY
4
1000
367.0
367.0
35.0
LM2937IMP-8.0
SOT-223
DCY
4
1000
367.0
367.0
35.0
LM2937IMP-8.0/NOPB
SOT-223
DCY
4
1000
367.0
367.0
35.0
LM2937IMPX-10
SOT-223
DCY
4
2000
367.0
367.0
35.0
LM2937IMPX-10/NOPB
SOT-223
DCY
4
2000
367.0
367.0
35.0
LM2937IMPX-12
SOT-223
DCY
4
2000
367.0
367.0
35.0
LM2937IMPX-12/NOPB
SOT-223
DCY
4
2000
367.0
367.0
35.0
LM2937IMPX-15
SOT-223
DCY
4
2000
367.0
367.0
35.0
LM2937IMPX-15/NOPB
SOT-223
DCY
4
2000
367.0
367.0
35.0
LM2937IMPX-5.0
SOT-223
DCY
4
2000
367.0
367.0
35.0
LM2937IMPX-5.0/NOPB
SOT-223
DCY
4
2000
367.0
367.0
35.0
LM2937IMPX-8.0
SOT-223
DCY
4
2000
367.0
367.0
35.0
LM2937IMPX-8.0/NOPB
SOT-223
DCY
4
2000
367.0
367.0
35.0
Pack Materials-Page 3
MECHANICAL DATA
NDE0003B
www.ti.com
MECHANICAL DATA
MPDS094A – APRIL 2001 – REVISED JUNE 2002
DCY (R-PDSO-G4)
PLASTIC SMALL-OUTLINE
6,70 (0.264)
6,30 (0.248)
3,10 (0.122)
2,90 (0.114)
4
0,10 (0.004) M
3,70 (0.146)
3,30 (0.130)
7,30 (0.287)
6,70 (0.264)
Gauge Plane
1
2
0,84 (0.033)
0,66 (0.026)
2,30 (0.091)
4,60 (0.181)
1,80 (0.071) MAX
3
0°–10°
0,10 (0.004) M
0,25 (0.010)
0,75 (0.030) MIN
1,70 (0.067)
1,50 (0.059)
0,35 (0.014)
0,23 (0.009)
Seating Plane
0,08 (0.003)
0,10 (0.0040)
0,02 (0.0008)
4202506/B 06/2002
NOTES: A.
B.
C.
D.
All linear dimensions are in millimeters (inches).
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion.
Falls within JEDEC TO-261 Variation AA.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
MECHANICAL DATA
KTT0003B
TS3B (Rev F)
BOTTOM SIDE OF PACKAGE
www.ti.com
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