ON AR0130CSSC00SPCA0-DRBR Cmos digital image sensor Datasheet

‡
AR0130: 1/3-Inch CMOS Digital Image Sensor
Features
1/3-Inch CMOS Digital Image Sensor
AR0130 Datasheet, Rev. L
For the latest datasheet, please visit www.onsemi.com
Features
Table 1:
• Superior low-light performance both in VGA mode
and HD mode
• Excellent Near IR performance
• HD video (720p60)
• On-chip AE and statistics engine
• Auto black level calibration
• Context switching
• Progressive Scan
• Supports 2:1 scaling
• Internal master clock generated by on-chip phase
locked loop (PLL) oscillator.
• Parallel output
Parameter
• Gaming systems
• Video surveillance
• 720p60 video applications
General Description
ON Semiconductor's AR0130 is a 1/3-inch CMOS digital image sensor with an active-pixel array of 1280H x
960V. It captures images with a rolling-shutter readout.
It includes sophisticated camera functions such as
auto exposure control, windowing, and both video and
single frame modes. It is programmable through a simple two-wire serial interface. The AR0130 produces
extraordinarily clear, sharp digital pictures, and its
ability to capture both continuous video and single
frames makes it the perfect choice for a wide range of
applications, including gaming systems, surveillance,
and HD video.
1/3-inch (6 mm)
Active pixels
1280 x 960 = 1.2 Mp
Pixel size
3.75 m
Color filter array
Monochrome, RGB Bayer
Shutter type
Electronic rolling shutter
Input clock range
6 – 50 MHz
Output clock maximum
74.25 MHz
Output
Parallel
12-bit
1.2 Mp (full FOV)
45 fps
720pHD (reduced FOV)
60 fps
VGA (full FOV)
45 fps
VGA (reduced FOV)
60 fps
800 x 800 (reduced
FOV)
60 fps
Responsivity at 550 nm (Mono)
6.5 V/lux-sec
Responsivity at 550 nm (RGB
green)
5.6 V/lux-sec
SNRMAX
44 dB
Dynamic range
82 dB
Supply
voltage
1
Typical Value
Optical format
Max.
Frame
rates
Applications
AR0130 DS Rev. L Pub. 6/15 EN
Key Parameters
I/O
1.8 or 2.8 V
Digital
1.8 V
Analog
2.8 V
Power consumption
270 mW (1280x720 60
fps)
Operating temperature
–30°C to + 70°C (ambient)
–30°C to + 80°C ( junction)
Package option
Bare die, iLCC, PLCC
©Semiconductor Components Industries, LLC 2015,
AR0130: 1/3-Inch CMOS Digital Image Sensor
Ordering Information
Ordering Information
Table 2:
Available Part Numbers
Part Number
Base Description
Variant Description
AR0130CSSC00SPBA0-DP
RGB Bayer 48-Pin PLCC
Dry Pack with Protective Film
AR0130CSSC00SPBA0-DR
RGB Bayer 48-Pin PLCC
Dry Pack without Protective Film
AR0130CSSC00SPCA0-DPBR
RGB Bayer 48-Pin iLCC
Dry Pack with Protective Film, Double Side BBAR Glass
AR0130CSSC00SPCA0-DRBR
RGB Bayer 48-Pin iLCC
Dry Pack without Protective Film, Double Side BBAR Glass
AR0130CSSC00SPCAD3-GEVK
RGB Bayer demo kit iLCC
AR0130CSSC00SPCAD3-S115-GEVK
RGB Bayer demo kit iLCC
AR0130CSSC00SPCAD3-S213A-GEVK
RGB Bayer demo kit iLCC
AR0130CSSC00SPCAD-GEVK
RGB Bayer demo kit iLCC
AR0130CSSC00SPCAD-S115-GEVK
RGB Bayer demo kit iLCC
AR0130CSSC00SPCAD-S213A-GEVK
RGB Bayer demo kit iLCC
AR0130CSSC00SPCAH-GEVB
RGB Bayer headboard iLCC
AR0130CSSC00SPCAH-S115-GEVB
RGB Bayer headboard iLCC
AR0130CSSC00SPCAH-S213A-GEVB
RGB Bayer headboard iLCC
AR0130CSSC00SPCAW-GEVB
RGB Bayer headboard iLCC
AR0130CSSM00SPCA0-DRBR
Monochrome 48-Pin iLCC
AR0130CSSM00SPCAD-S213A-GEVK
Monochrome demo kit iLCC
AR0130CSSM00SPCAH-S213A-GEVB
Monochrome headboard iLCC
Dry Pack without Protective Film, Double Side BBAR Glass
See the ON Semiconductor Device Nomenclature document (TND310/D) for a full
description of the naming convention used for image sensors. For reference documentation, including information on evaluation kits, please visit our web site at
www.onsemi.com.
AR0130 DS Rev. L Pub. 6/15 EN
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©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Table of Contents
Table of Contents
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Functional Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Pixel Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Output Data Format . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Real-Time Context Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Two-Wire Serial Register Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .32
Spectral Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
Power-On Reset and Standby Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48
Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
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©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
List of Figures
List of Figures
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Figure 30:
Figure 31:
Figure 32:
Figure 33:
Figure 34:
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Typical Configuration: Parallel Pixel Data Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
48-Pin iLCC Pinout Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
48-Pin PLCC Pinout Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
Pixel Array Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Pixel Color Pattern Detail (Top Right Corner) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Imaging a Scene . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
Spatial Illustration of Image Readout. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13
Default Pixel Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
LV Format Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Line Timing and FRAME_VALID/LINE_VALID Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
PLL-Generated Master Clock PLL Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Enter Standby Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Exit Standby Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
Six Pixels in Normal and Column Mirror Readout Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22
Six Rows in Normal and Row Mirror Readout Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23
Frame Format with Embedded Data Lines Enabled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Format of Embedded Data Output within a Frame . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
Format of Embedded Statistics Output within a Frame. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
Single READ from Random Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
Single READ from Current Location. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
Sequential READ, Start from Random Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .34
Sequential READ, Start from Current Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Single WRITE to Random Location. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Sequential WRITE, Start at Random Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Quantum Efficiency – Monochrome Sensor. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .36
Quantum Efficiency – Color Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37
48 iLCC Package Outline Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .38
48 PLCC Package Outline Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .39
Two-Wire Serial Bus Timing Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .40
I/O Timing Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
Power Supply Rejection Ratio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
Power Up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48
Power Down. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
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©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
List of Tables
List of Tables
Table 1:
Table 2:
Table 3:
Table 4:
Table 5:
Table 6:
Table 7:
Table 8:
Table 9:
Table 10:
Table 11:
Table 12:
Table 13:
Table 14:
Table 15:
Table 16:
Table 17:
Table 18:
Table 19:
Table 20:
Key Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
Available Part Numbers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Pad Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Frame Time (Example Based on 1280 x 960, 45 Frames Per Second) . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Frame Time: Long Integration Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Real-Time Context-Switchable Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Test Pattern Modes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
Two-Wire Serial Bus Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
I/O Timing Characteristics (2.8V VDD_IO)1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42
I/O Timing Characteristics (1.8V VDD_IO)1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .43
I/O Rise Slew Rate (2.8V VDD_IO)1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
I/O Fall Slew Rate (2.8V VDD_IO)1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
I/O Rise Slew Rate (1.8V VDD_IO)1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44
I/O Fall Slew Rate (1.8V VDD_IO)1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .45
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
Operating Current Consumption in Parallel Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .46
Standby Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .47
Power-Up Sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .49
Power-Down Sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
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©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
General Description
General Description
The ON Semiconductor AR0130 can be operated in its default mode or programmed for
frame size, exposure, gain, and other parameters. The default mode output is a 960presolution image at 45 frames per second (fps). It outputs 12-bit raw data over the
parallel port. The device may be operated in video (master) mode or in single frame
trigger mode.
FRAME_VALID and LINE_VALID signals are output on dedicated pins, along with a
synchronized pixel clock in parallel mode.
The AR0130 includes additional features to allow application-specific tuning:
windowing and offset, adjustable auto-exposure control, and auto black level correction.
Optional register information and histogram statistic information can be embedded in
first and last 2 lines of the image frame.
Functional Overview
The AR0130 is a progressive-scan sensor that generates a stream of pixel data at a
constant frame rate. It uses an on-chip, phase-locked loop (PLL) that can be optionally
enabled to generate all internal clocks from a single master input clock running between
6 and 50 MHz The maximum output pixel rate is 74.25 Mp/s, corresponding to a clock
rate of 74.25 MHz. Figure 1 shows a block diagram of the sensor.
Figure 1:
Block Diagram
OTPM
Active Pixel Sensor
(APS)
Array
Timing and Control
(Sequencer)
Power
Memory
External
Clock
Auto Exposure
and Stats Engine
Pixel Data Path
(Signal Processing)
Analog Processing and
A/D Conversion
PLL
Parallel
Output
Trigger
Two-Wire
Serial
Interface
Control Registers
User interaction with the sensor is through the two-wire serial bus, which communicates with the array control, analog signal chain, and digital signal chain. The core of the
sensor is a 1.2 Mp Active- Pixel Sensor array. The timing and control circuitry sequences
through the rows of the array, resetting and then reading each row in turn. In the time
interval between resetting a row and reading that row, the pixels in the row integrate
incident light. The exposure is controlled by varying the time interval between reset and
readout. Once a row has been read, the data from the columns is sequenced through an
analog signal chain (providing offset correction and gain), and then through an analogto-digital converter (ADC). The output from the ADC is a 12-bit value for each pixel in
the array. The ADC output passes through a digital processing signal chain (which
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©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Functional Overview
provides further data path corrections and applies digital gain). The pixel data are
output at a rate of up to 74.25 Mp/s, in parallel to frame and line synchronization
signals.
Figure 2:
Typical Configuration: Parallel Pixel Data Interface
1.5kΩ2, 3
1.5kΩ2
Digital Digital
core
I/O
power1 power1
VDD_IO
PLL Analog Analog
power1 power1 power1
VDD
Master clock
(6–50 MHz)
EXTCLK
From
Controller
SADDR
SDATA
SCLK
TRIGGER
OE_BAR
STANDBY
RESET_BAR
VDD_PLL VAA
VAA_PIX
DOUT [11:0]
PIXCLK
LINE_VALID
FRAME_VALID
To
controller
Reserved
DGND
VDD_IO
VDD
VDD_PLL
VAA
VAA_PIX
Digital
ground
Notes:
AR0130 DS Rev. L Pub. 6/15 EN
AGND
Analog
ground
1. All power supplies must be adequately decoupled.
2. ON Semiconductor recommends a resistor value of 1.5k, but a greater value may be used for
slower two-wire speed.
3. This pull-up resistor is not required if the controller drives a valid logic level on SCLK at all times.
4. ON Semiconductor recommends that VDD_SLVS pad (only available in bare die) is left unconnected.
5. ON Semiconductor recommends that 0.1μF and 10μF decoupling capacitors for each power supply
are mounted as close as possible to the pad. Actual values and results may vary depending on layout and design considerations. Check the AR0130 demo headboard schematics for circuit recommendations.
6. ON Semiconductor recommends that analog power planes are placed in a manner such that coupling with the digital power planes is minimized.
7. I/O signals voltage must be configured to match VDD_IO voltage to minimize any leakage currents.
7
©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Functional Overview
Table 3:
Pad Descriptions
Name
Type
Description
STANDBY
Input
Standby-mode enable pin (active HIGH).
VDD_PLL
Power
PLL power.
VAA
Power
Analog power.
EXTCLK
Input
External input clock.
VDD_SLVS
Power
Digital power (do not connect).
DGND
Power
Digital ground.
VDD
Power
Digital power.
AGND
Power
Analog ground.
SADDR
Input
Two-Wire Serial Interface address select.
SCLK
Input
Two-Wire Serial Interface clock input.
SDATA
I/O
Two-Wire Serial Interface data I/O.
VAA_PIX
Power
Pixel power.
Asserted when DOUT line data is valid.
LINE_VALID
Output
FRAME_VALID
Output
Asserted when DOUT frame data is valid.
PIXCLK
Output
Pixel clock out. DOUT is valid on rising edge of this clock.
VDD_IO
Power
I/O supply power.
DOUT8
Output
Parallel pixel data output.
DOUT9
Output
Parallel pixel data output.
DOUT10
Output
Parallel pixel data output.
DOUT11
Output
Parallel pixel data output (MSB)
Reserved
Input
Connect to DGND.
DOUT4
Output
Parallel pixel data output.
DOUT5
Output
Parallel pixel data output.
DOUT6
Output
Parallel pixel data output.
DOUT7
Output
Parallel pixel data output.
TRIGGER
Input
Exposure synchronization input.
OE_BAR
Input
Output enable (active LOW).
DOUT0
Output
Parallel pixel data output (LSB)
DOUT1
Output
Parallel pixel data output.
DOUT2
Output
Parallel pixel data output.
DOUT3
Output
Parallel pixel data output.
RESET_BAR
FLASH
NC
AR0130 DS Rev. L Pub. 6/15 EN
Input
Asynchronous reset (active LOW). All settings are restored to factory default.
Output
Flash control output.
Input
Do not connect.
8
©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Functional Overview
AR0130 DS Rev. L Pub. 6/15 EN
VDD_PLL
DOUT6
DOUT5
DOUT4
DOUT3
DOUT2
DOUT1
DOUT0
DGND
NC
6
EXTCLK
48-Pin iLCC Pinout Diagram
DGND
5
4
3
2
1
48
47
46
45
44
43
VAA
DOUT10
10
39
AGND
DOUT11
11
38
VAA_PIX
VDD_IO
12
37
VAA_PIX
PIXCLK
13
36
VAA
VDD
14
35
AGND
SCLK
15
34
VAA
SDATA
16
33
NC
RESET_BAR
17
32
NC
VDD_IO
18
31
NC
19
20
21
22
9
23
24
25
26
27
28
29
30
DGND
40
LINE_VALID
9
FRAME_VALID
DOUT9
TRIGGER
NC
FLASH
41
RESERVED
8
SADDR
DOUT8
STANDBY
NC
NC
42
NC
7
VDD
DOUT7
OE_BAR
Figure 3:
©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Functional Overview
AGND
VAA
VAA
VAA
AGND
AGND
VDD_PLL
DGND
VDD
VDD
DGND
48-Pin PLCC Pinout Diagram
DGND
Figure 4:
VDD_IO
AGND
VDD_IO
VAA_PIX
SCLK
VAA_PIX
SADDR
AGND
EXTCLK
AGND
PIXCLK
NC
FLASH
NC
SDATA
NC
FRAME_VALID
VDD
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10
STANDBY
DOUT0
DOUT1
RESET_BAR
Top View
DOUT2
DOUT3
DOUT4
Reserved
DOUT5
DOUT10
DOUT6
OE_BAR
DOUT7
DOUT11
DOUT8
TRIGGER
DOUT9
LINE_VALID
©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Pixel Data Format
Pixel Data Format
Pixel Array Structure
The AR0130 pixel array is configured as 1412 columns by 1028 rows, (see Figure 5). The
dark pixels are optically black and are used internally to monitor black level. Of the right
108 columns, 64 are dark pixels used for row noise correction. Of the top 24 rows of
pixels, 12 of the dark rows are used for black level correction. There are 1296 columns by
976 rows of optically active pixels. While the sensor's format is 1280 x 960, the additional
active columns and active rows are included for use when horizontal or vertical mirrored
readout is enabled, to allow readout to start on the same pixel. The pixel adjustment is
always performed for monochrome or color versions. The active area is surrounded with
optically transparent dummy pixels to improve image uniformity within the active area.
Not all dummy pixels or barrier pixels can be read out.
Figure 5:
Pixel Array Description
1412
2 light dummy + 4 barrier + 24 dark + 4 barrier + 6 dark dummy
1296 x 976 (1288 x 968 active)
4.86 x 3.66 mm2 (4.83 x 3.63 mm2)
1028
2 light dummy + 4 barrier + 100 dark + 4 barrier
2 light dummy + 4 barrier
2 light dummy + 4 barrier + 6 dark dummy
Dark pixel
AR0130 DS Rev. L Pub. 6/15 EN
Barrier pixel
11
Light dummy
pixel
Active pixel
©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Pixel Data Format
Figure 6:
Pixel Color Pattern Detail (Top Right Corner)
Column Readout Direction
Row Readout Direction
Active Pixel (0,0)
Array Pixel (112, 44)
R G
R
G R
G R
G
G B
G
B G
B G
B
R G
R
G R
G R
G
G B
G
B G
B G
B
R G
R
G R
G R
G
G B
G
B G
B G
B
Default Readout Order
By convention, the sensor core pixel array is shown with pixel (0,0) in the top right
corner (see Figure 6). This reflects the actual layout of the array on the die. Also, the first
pixel data read out of the sensor in default condition is that of pixel (112, 44).
When the sensor is imaging, the active surface of the sensor faces the scene as shown in
Figure 7. When the image is read out of the sensor, it is read one row at a time, with the
rows and columns sequenced as shown in Figure 7 on page 12.
Figure 7:
Imaging a Scene
Lens
Scene
Sensor (rear view)
Row
Readout
Order
Column Readout Order
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Pixel (0,0)
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AR0130: 1/3-Inch CMOS Digital Image Sensor
Output Data Format
Output Data Format
The AR0130 image data is read out in a progressive scan. Valid image data is surrounded
by horizontal and vertical blanking (see Figure 8). The amount of horizontal row time (in
clocks) is programmable through R0x300C. The amount of vertical frame time (in rows)
is programmable through R0x300A. LINE_VALID (LV) is HIGH during the shaded region
of Figure 8. Optional Embedded Register setup information and Histogram statistic
information are available in first 2 and last row of image data.
Figure 8:
Spatial Illustration of Image Readout
P0,0 P0,1 P0,2.....................................P0,n-1 P0,n
P1,0 P1,1 P1,2.....................................P1,n-1 P1,n
00 00 00 .................. 00 00 00
00 00 00 .................. 00 00 00
HORIZONTAL
BLANKING
VALID IMAGE
Pm-1,0 Pm-1,1.....................................Pm-1,n-1 Pm-1,n
Pm,0 Pm,1.....................................Pm,n-1 Pm,n
00 00 00 .................. 00 00 00
00 00 00 .................. 00 00 00
00 00 00 ..................................... 00 00 00
00 00 00 ..................................... 00 00 00
00 00 00 .................. 00 00 00
00 00 00 .................. 00 00 00
VERTICAL/HORIZONTAL
BLANKING
VERTICAL BLANKING
00 00 00 ..................................... 00 00 00
00 00 00 ..................................... 00 00 00
00 00 00 .................. 00 00 00
00 00 00 .................. 00 00 00
Readout Sequence
Typically, the readout window is set to a region including only active pixels. The user has
the option of reading out dark regions of the array, but if this is done, consideration must
be given to how the sensor reads the dark regions for its own purposes.
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AR0130: 1/3-Inch CMOS Digital Image Sensor
Output Data Format
Parallel Output Data Timing
The output images are divided into frames, which are further divided into lines. By
default, the sensor produces 968 rows of 1288 columns each. The FV and LV signals indicate the boundaries between frames and lines, respectively. PIXCLK can be used as a
clock to latch the data. For each PIXCLK cycle, with respect to the falling edge, one 12-bit
pixel datum outputs on the DOUT pins. When both FV and LV are asserted, the pixel is
valid. PIXCLK cycles that occur when FV is de-asserted are called vertical blanking.
PIXCLK cycles that occur when only LV is de-asserted are called horizontal blanking.
Figure 9:
Default Pixel Output Timing
PIXCLK
FV
LV
DOUT[11:0]
P0
Vertical Blanking
P1
Horiz Blanking
P2
P3
P4
Valid Image Data
Pn
Horiz Blanking
Vertical Blanking
LV and FV
The timing of the FV and LV outputs is closely related to the row time and the frame time.
FV will be asserted for an integral number of row times, which will normally be equal to
the height of the output image.
LV will be asserted during the valid pixels of each row. The leading edge of LV will be
offset from the leading edge of FV by 6 PIXCLKs. Normally, LV will only be asserted if FV
is asserted; this is configurable as described below.
LV Format Options
The default situation is for LV to be de-asserted when FV is de-asserted. By configuring
R0x306E[1:0], the LV signal can take two different output formats. The formats for
reading out four lines and two vertical blanking lines are shown in Figure 10.
Figure 10:
LV Format Options
FV
Default
LV
FV
Continuous LV
LV
The timing of an entire frame is shown in Figure 11: “Line Timing and FRAME_VALID/
LINE_VALID Signals,” on page 15.
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AR0130: 1/3-Inch CMOS Digital Image Sensor
Output Data Format
Frame Time
The pixel clock (PIXCLK) represents the time needed to sample 1 pixel from the array.
The sensor outputs data at the maximum rate of 1 pixel per PIXCLK. One row time
(tROW) is the period from the first pixel output in a row to the first pixel output in the
next row. The row time and frame time are defined by equations in Table 4.
Figure 11:
Line Timing and FRAME_VALID/LINE_VALID Signals
...
FRAME_VALID
...
LINE_VALID
...
Number of pixel clocks
Table 4:
P1
A
Q
A
Q
A
P2
Frame Time (Example Based on 1280 x 960, 45 Frames Per Second)
Parameter
Name
Equation
Timing at 74.25 MHz
A
Active data time
Context A: R0x3008 - R0x3004 + 1
Context B: R0x308E - R0x308A + 1
1280 pixel clocks
= 17.23s
P1
Frame start blanking
6 (fixed)
6 pixel clocks
= 0.08s
P2
Frame end blanking
6 (fixed)
6 pixel clocks
= 0.08s
Q
Horizontal blanking
R0x300C - A
370 pixel clocks
= 4.98s
A+Q (tROW)
Line (Row) time
R0x300C
1650 pixel clocks
= 22.22s
V
Vertical blanking
Context A: (R0x300A-(R0x3006-R0x3002+1)) x (A + Q)
Context B: ((R0x30AA-(R0x3090-R0x308C+1)) x (A + Q)
49,500 pixel clocks
= 666.66s
Nrows x (tROW)
Frame valid time
Context A: ((R0x3006-R0x3002+1)*(A+Q))-Q+P1+P2
Context B: ((R0x3090-R0x308C+1)*(A+Q))-Q+P1+P2
1,583,642 pixel clocks
= 21.33ms
F
Total frame time
V + (Nrows x (A + Q))
1,633,500 pixel clocks
= 22.22ms
Sensor timing is shown in terms of pixel clock cycles (see Figure 8 on page 13). The
recommended pixel clock frequency is 74.25 MHz. The vertical blanking and the total
frame time equations assume that the integration time (coarse integration time plus fine
integration time) is less than the number of active lines plus the blanking lines:
Window Height + Vertical Blanking
(EQ 1)
If this is not the case, the number of integration lines must be used instead to determine
the frame time, (see Table 5). In this example, it is assumed that the coarse integration
time control is programmed with 2000 rows and the fine shutter width total is zero.
For Master mode, if the integration time registers exceed the total readout time, then the
vertical blanking time is internally extended automatically to adjust for the additional
integration time required. This extended value is not written back to the
frame_length_lines register. The frame_length_lines register can be used to adjust
frame-to-frame readout time. This register does not affect the exposure time but it may
extend the readout time.
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©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Output Data Format
Table 5:
Parameter
F’
Frame Time: Long Integration Time
Name
Equation
(Number of Pixel Clock Cycles)
Default Timing
at 74.25 MHz
Total frame time (long
integration time)
Context A: (R0x3012 x (A + Q)) + R0x3014 + P1 + P2
Context B: (R0x3016 x (A + Q)) + V R0x3018 + P1 + P2
3,300,012 pixel clocks
= 44.44ms
Note:
The AR0130 uses column parallel analog-digital converters; thus short line timing is not possible.
The minimum total line time is 1390 columns (horizontal width + horizontal blanking). The minimum horizontal blanking is 110.
Exposure
Total integration time is the result of Coarse_Integration_Time and Fine_Integration_Time registers, and depends also on whether manual or automatic exposure is selected.
The actual total integration time, tINT is defined as:
tINT = tINTCoarse - 410 - tINTFine
(EQ 2)
= (number of lines of integration x line time) - (410 pixel clocks of conversion time overhead) - (number of pixels of integration x pixel time)
where:
– Number of Lines of Integration (Auto Exposure Control: Enabled)
When automatic exposure control (AEC) is enabled, the number of lines of integration may vary from frame to frame, with the limits controlled by R0x311E (minimum auto exposure time) and R0x311C (maximum auto exposure time).
– Number of Lines of Integration (Auto Exposure Control: Disabled)
If AEC is disabled, the number of lines of integration equals the value in R0x3012
(context A) or R0x3016 (context B).
– Number of Pixels of Integration
The number of fine shutter width pixels is independent of AEC mode (enabled or
disabled):
• Context A: the number of pixels of integration equals the value in R0x3014.
• Context B: the number of pixels of integration equals the value in R0x3018.
Typically, the value of the Coarse_Integration_Time register is limited to the number of
lines per frame (which includes vertical blanking lines), such that the frame rate is not
affected by the integration time. For more information on coarse and fine integration
time settings limits, please refer to the Register Reference document.
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AR0130: 1/3-Inch CMOS Digital Image Sensor
Real-Time Context Switching
Real-Time Context Switching
In the AR0130, the user may switch between two full register sets (listed in Table 6) by
writing to a context switch change bit in R0x30B0[13]. This context switch will change all
registers (no shadowing) at the frame start time and have the new values apply to the
immediate next exposure and readout time.
Table 6:
Real-Time Context-Switchable Registers
Register Number
Register Description
Context A
Context B
Y_Addr_Start
R0x3002
R0x308C
X_Addr_Start
R0x3004
R0x308A
Y_Addr_End
R0x3006
R0x3090
X_Addr_End
R0x3008
R0x308E
Coarse_Integration_Time
R0x3012
R0x3016
Fine_Integration_Time
R0x3014
R0x3018
Y_Odd_Inc
R0x30A6
R0x30A8
Green1_Gain (GreenR)
R0x3056
R0x30BC
Blue_Gain
R0x3058
R0x30BE
Red_Gain
R0x305A
R0x30C0
Green2_Gain (GreenB)
R0x305C
R0x30C2
Global_Gain
R0x305E
R0x30C4
Analog Gain
R0x30B0[5:4]
R0x30B0[9:8]
R0x300A
R0x30AA
R0x3032[1:0]
R0x3032[5:4]
Frame_Length_Lines
Digital_Binning
Features
See the AR0130 Register Reference for additional details.
Reset
The AR0130 may be reset by using RESET_BAR (active LOW) or the reset register.
Hard Reset of Logic
The RESET_BAR pin can be connected to an external RC circuit for simplicity. The
recommended RC circuit uses a 10k resistor and a 0.1F capacitor. The rise time for the
RC circuit is 1s maximum.
Soft Reset of Logic
Soft reset of logic is controlled by the R0x301A Reset register. Bit 0 is used to reset the
digital logic of the sensor while preserving the existing two-wire serial interface configuration. Furthermore, by asserting the soft reset, the sensor aborts the current frame it is
processing and starts a new frame. This bit is a self-resetting bit and also returns to “0”
during two-wire serial interface reads.
Clocks
The AR0130 requires one clock input (EXTCLK).
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©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Features
PLL-Generated Master Clock
The PLL contains a prescaler to divide the input clock applied on EXTCLK, a VCO to
multiply the prescaler output, and two divider stages to generate the output clock. The
clocking structure is shown in Figure 12. PLL control registers can be programmed to
generate desired master clock frequency.
Note:
Figure 12:
The PLL control registers must be programmed while the sensor is in the software
Standby state. The effect of programming the PLL divisors while the sensor is in the
streaming state is undefined.
PLL-Generated Master Clock PLL Setup
PLL Input
Clock
EXTCLK
Pre PLL
Div
(PFD)
Pre_pll_clk_div
PLL Output
Clock
SYSCLK
PLL
Multiplier
(VCO)
PLL Output
Div 1
PLL Output
Div 2
pll_multiplier
vt_sys_clk_div
vt_pix_clk_div
PIXCLK
The PLL is enabled by default on the AR0130.
To Configure and Use the PLL:
1. Bring the AR0130 up as normal; make sure that fEXTCLK is between 6 and 50MHz and
ensure the sensor is in software standby (R0x301A[2]= 0). PLL control registers must
be set in software standby.
2. Set pll_multiplier, pre_pll_clk_div, vt_sys_clk_div, and vt_pix_clk_div based on the
desired input (fEXTCLK) and output (fPIXCLK) frequencies. Determine the M, N, P1, and
P2 values to achieve the desired fPIXCLK using this formula:
fPIXCLK= (fEXTCLK × M) / (N × P1 x P2)
where
M = PLL_Multiplier (R0x3030)
N = Pre_PLL_Clk_Div (R0x302E)
P1 = Vt_Sys_Clk_Div (R0x302C)
P2 = Vt_PIX_Clk_Div (R0x302A)
3. Wait 1ms to ensure that the VCO has locked.
4. Set R0x301A[2]=1 to enable streaming and to switch from EXTCLK to the PLL-generated clock.
Notes:
1. The PLL can be bypassed at any time (sensor will run directly off EXTCLK) by setting
R0x30B0[14]=1. However, only the parallel data interface is supported with the PLL
bypassed. The PLL is always bypassed in software standby mode. To disable the PLL,
the sensor must be in standby mode (R0x301A[2] = 0)
2. The following restrictions apply to the PLL tuning parameters:
32  M  255
1  N  63
1  P1  16
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AR0130: 1/3-Inch CMOS Digital Image Sensor
Features
4  P2  16
Additionally, the VCO frequency, defined as f VCO = f EXTCLK  M  N must be within
384-768MHz and the EXTCLK must be within 2MHz =< fEXTCLK /N <= 24MHz
The user can utilize the Register Wizard tool accompanying DevWare to generate PLL
settings given a supplied input clock and desired output frequency.
Spread-Spectrum Clocking
To facilitate improved EMI performance, the external clock input allows for spread spectrum sources, with no impact on image quality. Limits of the spread spectrum input
clock are:
• 5% maximum clock modulation
• 35 KHz maximum modulation frequency
• Accepts triangle wave modulation, as well as sine or modified triangle modulations.
Stream/Standby Control
The sensor supports two standby modes: Hard Standby and Soft Standby. In both
modes, external clock can be optionally disabled to further minimize power consumption. If this is done, then the “Power-Up Sequence” on page 48 must be followed.
Soft Standby
Soft Standby is a low power state that is controlled through register R0x301A[2].
Depending on the value of R0x301A[4], the sensor will go to standby after completion of
the current frame readout (default behavior) or after the completion of the current row
readout. When the sensor comes back from Soft Standby, previously written register
settings are still maintained.
A specific sequence needs to be followed to enter and exit from Soft Standby.
To Enter Soft Standby:
1. R0x301A[12] = 1 if serial mode was used
2. Set R0x301A[2] = 0
3. External clock can be turned off to further minimize power consumption (Optional)
To Exit Soft Standby:
1. Enable external clock if it was turned off
2. R0x301A[2] = 1
3. R0x301A[12] = 0 if serial mode is used
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AR0130: 1/3-Inch CMOS Digital Image Sensor
Features
Figure 13:
Enter Standby Timing
FV
E XTC L K
50 E XTC L Ks
S DATA
R egister Writes Valid
R egister Writes Not Valid
750 E XTC L Ks
S TANDBY
Figure 14:
Exit Standby Timing
28 rows + C IT
FV
E XTC L K
S DATA
R egister Writes Not Valid
R egister Writes Valid
10 E XTC L Ks
S TANDBY
1ms
TR IGGE R
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©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Features
Hard Standby
Hard Standby puts the sensor in lower power state; previously written register settings
are still maintained.
A specific sequence needs to be followed to enter and exit from Hard Standby.
To Enter Hard Standby:
1. R0x301A[8] = 1
2. R0x301A[12] = 1 if serial mode was used
3. Assert STANDBY pin
4. External clock can be turned off to further minimize power consumption (Optional)
To Exit Hard Standby:
1. Enable external clock if it was turned off
2. De-assert STANDBY pin
3. Set R0x301A[8] = 0
Window Control
Registers x_addr_start, x_addr_end, y_addr_start, and y_addr_end control the size and
starting coordinates of the image window.
The exact window height and width out of the sensor is determined by the difference
between the Y address start and end registers or the X address start and end registers,
respectively.
The AR0130 allows different window sizes for context A and context B.
Blanking Control
Horizontal blank and vertical blank times are controlled by the line_length_pck and
frame_length_lines registers, respectively.
• Horizontal blanking is specified in terms of pixel clocks. It is calculated by subtracting
the X window size from the line_length_pck register. The minimum horizontal
blanking is 110 pixel clocks.
• Vertical blanking is specified in terms of numbers of lines. It is calculated by
subtracting the Y window size from the frame_length_lines register. The minimum
vertical blanking is 26 lines.
The actual imager timing can be calculated using Table 4 on page 15 and Table 5 on
page 16, which describe the Line Timing and FV/LV signals.
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AR0130: 1/3-Inch CMOS Digital Image Sensor
Features
Readout Modes
Digital Binning
By default, the resolution of the output image is the full width and height of the FOV as
defined above. The output resolution can be reduced by digital binning. For RGB and
monochrome mode, this is set by the register R0x3032. For Context A, use bits [1:0], for
Context B, use bits [5:4]. Available settings are:
00 = No binning
01 = Horizontal binning
10 = Horizontal and vertical binning
Binning gives the advantage of reducing noise at the cost of reduced resolution. When
both horizontal and vertical binning are used, a 2x improvement in SNR is achieved
therefore improving low light performance
Bayer Space Resampling
All of the pixels in the FOV contribute to the output image in digital binning mode. This
can result in a more pleasing output image with reduced subsampling artifacts. It also
improves low-light performance. For RGB mode, resampling can be enabled by setting
of register 0x306E[4] = 1.
Mirror
Column Mirror Image
By setting R0x3040[14] = 1, the readout order of the columns is reversed, as shown in
Figure 15. The starting color, and therefore the Bayer pattern, is preserved when
mirroring the columns.
When using horizontal mirror mode, the user must retrigger column correction. Please
refer to the column correction section to see the procedure for column correction retriggering. Bayer resampling must be enabled, by setting bit 4 of register 0 x 306E[4] = 1.
Figure 15:
Six Pixels in Normal and Column Mirror Readout Modes
LV
Normal readout
DOUT[11:0]
G0[11:0] R0[11:0] G1[11:0] R1[11:0] G2[11:0] R2[11:0]
Reverse readout
DOUT[11:0]
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AR0130: 1/3-Inch CMOS Digital Image Sensor
Features
Row Mirror Image
By setting R0x3040[15] = 1, the readout order of the rows is reversed as shown in
Figure 16. The starting Bayer color pixel is maintained in this mode by a 1-pixel shift in
the imaging array. When using horizontal mirror mode, the user must retrigger column
correction. Please refer to the column correction section to see the procedure for
column correction retriggering.
Figure 16:
Six Rows in Normal and Row Mirror Readout Modes
FV
Normal readout
Row0 [11:0] Row1 [11:0] Row2 [11:0] Row3 [11:0] Row4 [11:0] Row5 [11:0]
DOUT[11:0]
Reverse readout
DOUT[11:0]
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Row5 [11:0] Row4 [11:0] Row3 [11:0] Row2 [11:0] Row1 [11:0]
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Row0[11:0]
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AR0130: 1/3-Inch CMOS Digital Image Sensor
Features
Maintaining a Constant Frame Rate
Maintaining a constant frame rate while continuing to have the ability to adjust certain
parameters is the desired scenario. This is not always possible, however, because register
updates are synchronized to the read pointer, and the shutter pointer for a frame is
usually active during the readout of the previous frame. Therefore, any register changes
that could affect the row time or the set of rows sampled causes the shutter pointer to
start over at the beginning of the next frame.
By default, the following register fields cause a “bubble” in the output rate (that is, the
vertical blank increases for one frame) if they are written in video mode, even if the new
value would not change the resulting frame rate. The following list shows only a few
examples of such registers; a full listing can be seen in the AR0130 Register Reference.
• x_addr_start
• x_addr_end
• y_addr_start
• y_addr_end
• frame_length_lines
• line_length_pclk
• coarse_integration_time
• fine_integration_time
• read_mode
The size of this bubble is (Integration_Time × tROW ), calculating the row time according
to the new settings.
The Coarse_Integration_Time and Fine_Integration_Time fields may be written to
without causing a bubble in the output rate under certain circumstances. Because the
shutter sequence for the next frame often is active during the output of the current
frame, this would not be possible without special provisions in the hardware. Writes to
these registers take effect two frames after the frame they are written, which allows the
integration time to increase without interrupting the output or producing a corrupt
frame (as long as the change in integration time does not affect the frame time).
Synchronizing Register Writes to Frame Boundaries
Changes to most register fields that affect the size or brightness of an image take effect
on the frame after the one during which they are written. These fields are noted as
“synchronized to frame boundaries” in the AR0130 Register Reference. To ensure that a
register update takes effect on the next frame, the write operation must be completed
after the leading edge of FV and before the trailing edge of FV.
As a special case, in single frame mode, register writes that occur after FV but before the
next trigger will take effect immediately on the next frame, as if there had been a Restart.
However, if the trigger for the next frame occurs during FV, register writes take effect as
with video mode.
Fields not identified as being frame-synchronized are updated immediately after the
register write is completed. The effect of these registers on the next frame can be difficult
to predict if they affect the shutter pointer.
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AR0130: 1/3-Inch CMOS Digital Image Sensor
Features
Restart
To restart the AR0130 at any time during the operation of the sensor, write a “1” to the
Restart register (R0x301A[1] = 1). This has two effects: first, the current frame is interrupted immediately. Second, any writes to frame-synchronized registers and the shutter
width registers take effect immediately, and a new frame starts (in video mode). The
current row completes before the new frame is started, so the time between issuing the
Restart and the beginning of the next frame can vary by about tROW.
Image Acquisition Modes
The AR0130 supports two image acquisition modes: video (also known as master) and
single frame.
Video
The video mode takes pictures by scanning the rows of the sensor twice. On the first
scan, each row is released from reset, starting the exposure. On the second scan, the row
is sampled, processed, and returned to the reset state. The exposure for any row is therefore the time between the first and second scans. Each row is exposed for the same duration, but at slightly different point in time, which can cause a shear in moving subjects as
is typical with electronic rolling shutter sensors.
Single Frame
The single-frame mode operates similar to the video mode. It also scans the rows of the
sensor twice, first to reset the rows and second to read the rows. Unlike video mode
where a continuous stream of images are output from the image sensor, the single-frame
mode outputs a single frame in response to a high state placed on the TRIGGER input
pin. As long as the TRIGGER pin is held in a high state, new images will be read out. After
the TRIGGER pin is returned to a low state, the image sensor will not output any new
images and will wait for the next high state on the TRIGGER pin.
The TRIGGER pin state is detected during the vertical blanking period (i.e. the FV signal
is low). The pin is level sensitive rather than edge sensitive. As such, image integration
will only begin when the sensor detects that the TRIGGER pin has been held high for 3
consecutive clock cycles.
During integration time of single-frame mode and video mode, the FLASH output pin is
at high.
Continuous Trigger
In certain applications, multiple sensors need to have their video streams synchronized
(E.g. surround view or panorama view applications). The TRIGGER pin can also be used
to synchronize output of multiple image sensors together and still get a video stream.
This is called continuous trigger mode. Continuous trigger is enabled by holding the
TRIGGER pin high. Alternatively, the TRIGGER pin can be held high until the stream bit
is enabled (R0x301A[2]=1) then can be released for continuous synchronized video
streaming.
If the TRIGGER pins for all connected AR0130 sensors are connected to the same control
signal, all sensors will receive the trigger pulse at the same time. If they are configured to
have the same frame timing, then the usage of the TRIGGER pin guarantees that all
sensors will be synchronized within 1 PIXCLK cycle if PLL is disabled, or 2 PIXCLK cycles
if PLL is enabled.
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AR0130: 1/3-Inch CMOS Digital Image Sensor
Features
With continuous trigger mode, the application can now make use of the video streaming
mode while guaranteeing that all sensor outputs are synchronized. As long as the initial
trigger for the sensors takes place at the same time, all subsequent video streams will be
synchronous.
Automatic Exposure Control
The integrated automatic exposure control (AEC) is responsible for ensuring that
optimal settings of exposure and gain are computed and updated every other frame.
AEC can be enabled or disabled by R0x3100[0].
When AEC is disabled (R0x3100[0] = 0), the sensor uses the manual exposure value in
coarse and fine shutter width registers and the manual gain value in the gain registers.
When AEC is enabled (R0x3100[0]=1), the target luma value is set by R0x3102. For the
AR0130 this target luma has a default value of 0x0800 or about half scale.
The exposure control measures current scene luminosity by accumulating a histogram
of pixel values while reading out a frame. It then compares the current luminosity to the
desired output luminosity. Finally, the appropriate adjustments are made to the exposure time and gain. All pixels are used, regardless of color or mono mode.
AEC does not work if digital binning is enabled.
Embedded Data and Statistics
The AR0130 has the capability to output image data and statistics embedded within the
frame timing. There are two types of information embedded within the frame readout:
1. Embedded Data: If enabled, these are displayed on the two rows immediately before
the first active pixel row is displayed.
2. Embedded Statistics: If enabled, these are displayed on the two rows immediately
after the last active pixel row is displayed.
Note:
Figure 17:
Both embedded statistics and data must be enabled and disabled together.
Frame Format with Embedded Data Lines Enabled
Register Data
Image
HBlank
Status & Statistics Data
VBlank
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AR0130: 1/3-Inch CMOS Digital Image Sensor
Features
Embedded Data
The embedded data contains the configuration of the image being displayed. This
includes all register settings used to capture the current frame. The registers embedded
in these rows are as follows:
Line 1: Registers R0x3000 to R0x312F
Line 2: Registers R0x3136 to R0x31BF, R0x31D0 to R0x31FF
Note:
All undefined registers will have a value of 0.
In parallel mode, since the pixel word depth is 12-bits/pixel, the sensor 16-bit register
data will be transferred over 2 pixels where the register data will be broken up into 8 MSB
and 8 LSB. The alignment of the 8-bit data will be on the 8 MSB bits of the 12-bit pixel
word. For example, of a register value of 0x1234 is to be transmitted, it will be transmitted over 2, 12-bit pixels as follows: 0x120, 0x340.
The first pixel of each line in the embedded data is a tag value of 0x0A0. This signifies
that all subsequent data is 8 bit data aligned to the MSB of the 12-bit pixel.
The figure below summarizes how the embedded data transmission looks like. It should
be noted that data, as shown in Figure 18, is aligned to the MSB of each word:
Figure 18:
Format of Embedded Data Output within a Frame
data_format_
code =8'h0A
8'hAA
{register_
address_MSB}
8'hA5
{register_
address_LSB}
8'h5A
{register_
value_MSB}
8'h5A
Data line 1
data_format_
code =8'h0A
Data line 2
8'hAA
{register_
value_LSB}
8'h5A
{register_
address_MSB}
8'hA5
{register_
value_LSB}
{register_
address_LSB}
8'h5A
{register_
value_MSB}
8'h5A
8'h5A
The data embedded in these rows are as follows:
• 0x0A0 - identifier
• 0xAA0
• Register Address MSB of the first register
• 0xA50
• Register Address LSB of the first register
• 0x5A0
• Register Value MSB of the first register addressed
• 0x5A0
• Register Value LSB of the first register addressed
• 0x5A0
• Register Value MSB of the register at first address + 2
• 0x5A0
• Register Value LSB of the register at first address + 2
• 0x5A0
• etc.
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AR0130: 1/3-Inch CMOS Digital Image Sensor
Features
Embedded Statistics
The embedded statistics contain frame identifiers and histogram information of the
image in the frame. This can be used by downstream auto-exposure algorithm blocks to
make decisions about exposure adjustment.
This histogram is divided into 244 bins with a bin spacing of 64 evenly spaced bins for
digital code values 0 to 212, 120 evenly spaced bins for values 212 to 216, 60 evenly spaced
bins for values 216 to 220.
The first pixel of each line in the embedded statistics is a tag value of 0x0B0. This signifies that all subsequent statistics data is 10 bit data aligned to the MSB of the 12-bit pixel.
The figure below summarizes how the embedded statistics transmission looks like. It
should be noted that data, as shown in Figure 19, is aligned to the msb of each word:
Figure 19:
Format of Embedded Statistics Output within a Frame
data_format_
code =8'h0B
#words =
10’h1EC
{2’b00, frame
_count MSB}
{2’b00, frame
_count LSB}
{2’b00, frame
_ID MSB}
{2’b00, frame histogram
bin0 [19:10]
_ID LSB}
histogram
bin0 [9:0]
stats line 1
histogram
bin1 [19:10]
data_format_
code =8'h0B
stats line 2
#words =
10’h1C
histogram
bin1 [9:0]
histogram
bin243 [19:10]
mean [ 19:10]
mean [9:0]
hist_begin
[19:10]
hist_begin
[9:10]
lowEndMean
[19:10]
lowEndMean
[9:0]
perc_lowEnd
[19:10]
perc_lowEnd
[9:0]
histogram
bin243 [9:0]
hist_end
[19:10]
8'h07
8'h07
hist_end
[9:10]
norm_abs_dev lnorm_abs_dev
[9:0]
[19:10]
8'h07
The statistics embedded in these rows are as follows:
Line 1:
• 0x0B0 - identifier
• Register 0x303A - frame_count
• Register 0x31D2 - frame ID
• Histogram data - histogram bins 0-243
Line 2:
• 0x0B0 (identifier)
• Mean
• Histogram Begin
• Histogram End
• Low End Histogram Mean
• Percentage of Pixels Below Low End Mean
• Normal Absolute Deviation
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AR0130: 1/3-Inch CMOS Digital Image Sensor
Features
Gain
Digital Gain
Digital gain can be controlled globally by R0x305E (Context A) or R0x30C4 (Context B).
There are also registers that allow individual control over each Bayer color (GreenR,
GreenB, Red, Blue).
The format for digital gain setting is xxx.yyyyy where 0b00100000 represents a 1x gain
setting and 0b00110000 represents a 1.5x gain setting. The step size for yyyyy is 0.03125
while the step size for xxx is 1. Therefore to set a gain of 2.09375 one would set digital
gain to 01000011.
Analog Gain
The AR0130 has a column parallel architecture and therefore has an Analog gain stage
per column.
There are two stages of analog gain, the first stage can be set to 1x, 2x, 4x or 8x. This is can
be set in R0x30B0[5:4](Context A) or R0x30B0[9:8] (Context B). The second stage is
capable of setting an additional 1x or 1.25x gain which can be set in R0x3EE4[8].
This allows the maximum possible analog gain to be set to 10x.
Black Level Correction
Black level correction is handled automatically by the image sensor. No adjustments are
provided except to enable or disable this feature. Setting R0x30EA[15] disables the automatic black level correction. Default setting is for automatic black level calibration to be
enabled.
The automatic black level correction measures the average value of pixels from a set of
optically black lines in the image sensor. The pixels are averaged as if they were lightsensitive and passed through the appropriate gain. This line average is then digitally
low-pass filtered over many frames to remove temporal noise and random instabilities
associated with this measurement. The new filtered average is then compared to a
minimum acceptable level, low threshold, and a maximum acceptable level, high
threshold. If the average is lower than the minimum acceptable level, the offset correction value is increased by a predetermined amount. If it is above the maximum level, the
offset correction value is decreased by a predetermined amount. The high and low
thresholds have been calculated to avoid oscillation of the black level from below to
above the targeted black level. At high gain, long exposure, and high temperature conditions, the performance of this function can degrade.
Row-wise Noise Correction
Row (Line)-wise Noise Correction is handled automatically by the image sensor. No
adjustments are provided except to enable or disable this feature. Clearing R0x3044[10]
disables the row noise correction. Default setting is for row noise correction to be
enabled.
Row-wise noise correction is performed by calculating an average from a set of optically
black pixels at the start of each line and then applying each average to all the active
pixels of the line.
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AR0130: 1/3-Inch CMOS Digital Image Sensor
Features
Column Correction
The AR0130 uses column parallel readout architecture to achieve fast frame rate.
Without any corrections, the consequence of this architecture is that different column
signal paths have slightly different offsets that might show up on the final image as
structured fixed pattern noise.
AR0130 has column correction circuitry that measures this offset and removes it from
the image before output. This is done by sampling dark rows containing tied pixels and
measuring an offset coefficient per column to be corrected later in the signal path.
Column correction can be enabled/disabled via R0x30D4[15]. Additionally, the number
of rows used for this offset coefficient measurement is set in R0x30D4[3:0]. By default
this register is set to 0x7, which means that 8 rows are used. This is the recommended
value. Other control features regarding column correction can be viewed in the AR0130
Register reference. Any changes to column correction settings need to be done when the
sensor streaming is disabled and the appropriate triggering sequence must be followed
as described below.
Column Correction Triggering
Column correction requires a special procedure to trigger depending on which state the
sensor is in.
Column Triggering on Startup
When streaming the sensor for the first time after power-up, a special sequence needs to
be followed to make sure that the column correction coefficients are internally calculated properly.
1. Follow proper power up sequence for power supplies and clocks
2. Apply sequencer settings if needed
3. Apply frame timing and PLL settings as required by application
4. Set analog gain to 1x and low conversion gain
5. Enable column correction and settings
6. Disable auto re-trigger for change in conversion gain or col_gain, and enable column
correction always. (R0x30BA = 0x0008).
7. Enable streaming (R0x301A[2] = 1) or drive the TRIGGER pin HIGH.
8. Wait 9 frames to settle. (First frame after coming up from standby is internally column
correction disabled.)
9. Disable streaming (R0x301A[2] = 0) or drive the TRIGGER pin LOW.
After this, the sensor has calculated the proper column correction coefficients and the
sensor is ready for streaming. Any other settings (including gain, integration time and
conversion gain etc.) can be done afterwards without affecting column correction.
Column Correction Retriggering Due to Mode Change
Since column offsets is sensitive to changes in the analog signal path, such changes
require column correction circuitry to be retriggered for the new path. Examples of such
mode changes include: horizontal mirror, vertical mirror, changes to column correction
settings.
When such changes take place, the following sequence needs to take place:
1. Disable streaming (R0x301A[2]=0) or drive the TRIGGER pin LOW.
2. Enable streaming (R0x301A[2]=1) or drive the TRIGGER pin HIGH.
3. Wait 9 frames to settle.
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AR0130: 1/3-Inch CMOS Digital Image Sensor
Features
Note:
The above steps are not needed if the sensor is being reset (soft or hard reset) upon
the mode change.
Test Patterns
The AR0130 has the capability of injecting a number of test patterns into the top of the
datapath to debug the digital logic. With one of the test patterns activated, any of the
datapath functions can be enabled to exercise it in a deterministic fashion. Test patterns
are selected by Test_Pattern_Mode register (R0x3070). Only one of the test patterns can
be enabled at a given point in time by setting the Test_Pattern_Mode register according
to Table 7. When test patterns are enabled the active area will receive the value specified
by the selected test pattern and the dark pixels will receive the value in Test_Pattern_Green (R0x3074 and R0x3078) for green pixels, Test_Pattern_Blue (R0x3076) for
blue pixels, and Test_Pattern_Red (R0x3072) for red pixels.
Note:
Table 7:
Turn off black level calibration (BLC) when Test Pattern is enabled.
Test Pattern Modes
Test_Pattern_Mode
Test Pattern Output
0
1
2
3
256
No test pattern (normal operation)
Solid color test pattern
100% color bar test pattern
Fade-to-gray color bar test pattern
Walking 1s test pattern (12-bit)
Color Field
When the color field mode is selected, the value for each pixel is determined by its color.
Green pixels will receive the value in Test_Pattern_Green, red pixels will receive the value
in Test_Pattern_Red, and blue pixels will receive the value in Test_Pattern_Blue.
Vertical Color Bars
When the vertical color bars mode is selected, a typical color bar pattern will be sent
through the digital pipeline.
Walking 1s
When the walking 1s mode is selected, a walking 1s pattern will be sent through the
digital pipeline. The first value in each row is 1.
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AR0130: 1/3-Inch CMOS Digital Image Sensor
Two-Wire Serial Register Interface
Two-Wire Serial Register Interface
The two-wire serial interface bus enables read/write access to control and status registers within the AR0130. This interface is designed to be compatible with the electrical
characteristics and transfer protocols of the two-wire serial interface specification.
The interface protocol uses a master/slave model in which a master controls one or
more slave devices. The sensor acts as a slave device. The master generates a clock (SCLK)
that is an input to the sensor and is used to synchronize transfers. Data is transferred
between the master and the slave on a bidirectional signal (SDATA). SDATA is pulled up to
VDD_IO off-chip by a 1.5k resistor. Either the slave or master device can drive SDATA
LOW—the interface protocol determines which device is allowed to drive SDATA at any
given time.
The protocols described in the two-wire serial interface specification allow the slave
device to drive SCLK LOW; the AR0130 uses SCLK as an input only and therefore never
drives it LOW.
Protocol
Data transfers on the two-wire serial interface bus are performed by a sequence of lowlevel protocol elements:
1. a (repeated) start condition
2. a slave address/data direction byte
3. an (a no) acknowledge bit
4. a message byte
5. a stop condition
The bus is idle when both SCLK and SDATA are HIGH. Control of the bus is initiated with a
start condition, and the bus is released with a stop condition. Only the master can
generate the start and stop conditions.
Start Condition
A start condition is defined as a HIGH-to-LOW transition on SDATA while SCLK is HIGH.
At the end of a transfer, the master can generate a start condition without previously
generating a stop condition; this is known as a “repeated start” or “restart” condition.
Stop Condition
A stop condition is defined as a LOW-to-HIGH transition on SDATA while SCLK is HIGH.
Data Transfer
Data is transferred serially, 8 bits at a time, with the MSB transmitted first. Each byte of
data is followed by an acknowledge bit or a no-acknowledge bit. This data transfer
mechanism is used for the slave address/data direction byte and for message bytes.
One data bit is transferred during each SCLK clock period. SDATA can change when SCLK
is LOW and must be stable while SCLK is HIGH.
Slave Address/Data Direction Byte
Bits [7:1] of this byte represent the device slave address and bit [0] indicates the data
transfer direction. A “0” in bit [0] indicates a WRITE, and a “1” indicates a READ. The
default slave addresses used by the AR0130 are 0x20 (write address) and 0x21 (read
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AR0130: 1/3-Inch CMOS Digital Image Sensor
Two-Wire Serial Register Interface
address) in accordance with the specification. Alternate slave addresses of 0x30 (write
address) and 0x31 (read address) can be selected by enabling and asserting the SADDR
input.
An alternate slave address can also be programmed through R0x31FC.
Message Byte
Message bytes are used for sending register addresses and register write data to the slave
device and for retrieving register read data.
Acknowledge Bit
Each 8-bit data transfer is followed by an acknowledge bit or a no-acknowledge bit in the
SCLK clock period following the data transfer. The transmitter (which is the master when
writing, or the slave when reading) releases SDATA. The receiver indicates an acknowledge bit by driving SDATA LOW. As for data transfers, SDATA can change when SCLK is
LOW and must be stable while SCLK is HIGH.
No-Acknowledge Bit
The no-acknowledge bit is generated when the receiver does not drive SDATA LOW
during the SCLK clock period following a data transfer. A no-acknowledge bit is used to
terminate a read sequence.
Typical Sequence
A typical READ or WRITE sequence begins by the master generating a start condition on
the bus. After the start condition, the master sends the 8-bit slave address/data direction
byte. The last bit indicates whether the request is for a read or a write, where a “0” indicates a write and a “1” indicates a read. If the address matches the address of the slave
device, the slave device acknowledges receipt of the address by generating an acknowledge bit on the bus.
If the request was a WRITE, the master then transfers the 16-bit register address to which
the WRITE should take place. This transfer takes place as two 8-bit sequences and the
slave sends an acknowledge bit after each sequence to indicate that the byte has been
received. The master then transfers the data as an 8-bit sequence; the slave sends an
acknowledge bit at the end of the sequence. The master stops writing by generating a
(re)start or stop condition.
If the request was a READ, the master sends the 8-bit write slave address/data direction
byte and 16-bit register address, the same way as with a WRITE request. The master then
generates a (re)start condition and the 8-bit read slave address/data direction byte, and
clocks out the register data, eight bits at a time. The master generates an acknowledge
bit after each 8-bit transfer. The slave’s internal register address is automatically incremented after every 8 bits are transferred. The data transfer is stopped when the master
sends a no-acknowledge bit.
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AR0130: 1/3-Inch CMOS Digital Image Sensor
Two-Wire Serial Register Interface
Single READ from Random Location
This sequence (Figure 20) starts with a dummy WRITE to the 16-bit address that is to be
used for the READ. The master terminates the WRITE by generating a restart condition.
The master then sends the 8-bit read slave address/data direction byte and clocks out
one byte of register data. The master terminates the READ by generating a no-acknowledge bit followed by a stop condition. Figure 20 shows how the internal register address
maintained by the AR0130 is loaded and incremented as the sequence proceeds.
Figure 20:
Single READ from Random Location
Previous Reg Address, N
S
Slave Address
0 A Reg Address[15:8]
S = start condition
P = stop condition
Sr = restart condition
A = acknowledge
A = no-acknowledge
A
Reg Address, M
Reg Address[7:0]
A Sr
Slave Address
1 A
M+1
Read Data
A P
slave to master
master to slave
Single READ from Current Location
This sequence (Figure 21) performs a read using the current value of the AR0130 internal
register address. The master terminates the READ by generating a no-acknowledge bit
followed by a stop condition. The figure shows two independent READ sequences.
Figure 21:
Single READ from Current Location
Previous Reg Address, N
S
Slave Address
1 A
Reg Address, N+1
Read Data
A P
S
Slave Address
N+2
1 A
Read Data
A P
Sequential READ, Start from Random Location
This sequence (Figure 22) starts in the same way as the single READ from random location (Figure 20). Instead of generating a no-acknowledge bit after the first byte of data
has been transferred, the master generates an acknowledge bit and continues to
perform byte READs until “L” bytes have been read.
Figure 22:
Sequential READ, Start from Random Location
Previous Reg Address, N
S
Slave Address
0 A Reg Address[15:8]
M+1
Read Data
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M+2
A
A
Reg Address, M
Reg Address[7:0] A Sr
M+3
Read Data
A
34
Slave Address
M+L-2
Read Data
1 A
M+L-1
A
Read Data
M+1
Read Data
A
M+L
A P
©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Two-Wire Serial Register Interface
Sequential READ, Start from Current Location
This sequence (Figure 23) starts in the same way as the single READ from current location (Figure 21). Instead of generating a no-acknowledge bit after the first byte of data
has been transferred, the master generates an acknowledge bit and continues to
perform byte READs until “L” bytes have been read.
Figure 23:
Sequential READ, Start from Current Location
Previous Reg Address, N
S
Slave Address
1 A
N+1
Read Data
A
N+2
Read Data
A
N+L-1
Read Data
A
Read Data
N+L
A P
Single WRITE to Random Location
This sequence (Figure 24) begins with the master generating a start condition. The slave
address/data direction byte signals a WRITE and is followed by the HIGH then LOW
bytes of the register address that is to be written. The master follows this with the byte of
write data. The WRITE is terminated by the master generating a stop condition.
Figure 24:
Single WRITE to Random Location
Previous Reg Address, N
S
0 A Reg Address[15:8]
Slave Address
A
Reg Address, M
Reg Address[7:0]
Write Data
A
M+1
A P
A
Sequential WRITE, Start at Random Location
This sequence (Figure 25) starts in the same way as the single WRITE to random location
(Figure 24). Instead of generating a no-acknowledge bit after the first byte of data has
been transferred, the master generates an acknowledge bit and continues to perform
byte WRITEs until “L” bytes have been written. The WRITE is terminated by the master
generating a stop condition.
Figure 25:
Sequential WRITE, Start at Random Location
Previous Reg Address, N
S
Slave Address
0 A Reg Address[15:8]
M+1
Write Data
AR0130 DS Rev. L Pub. 6/15 EN
M+2
A
A
Reg Address, M
Reg Address[7:0]
M+3
Write Data
35
A
A
Write Data
M+L-2
Write Data
M+1
A
M+L-1
A
Write Data
M+L
A
P
A
©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Spectral Characteristics
Spectral Characteristics
Figure 26:
Quantum Efficiency – Monochrome Sensor
90
80
Quantum Efficiency (% )
70
60
50
40
30
20
10
0
350
450
550
650
750
850
950
1050
1150
Wavelength (nm)
AR0130 DS Rev. L Pub. 6/15 EN
36
©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Spectral Characteristics
Figure 27:
Quantum Efficiency – Color Sensor
80
re d
g re e n
b lu e
70
Quantum Efficiency (%)
60
50
40
30
20
10
0
350 400 450 500 550 600 650 700 750 800 850 900 950 1000 1050 1100 1150
Wavelength (nm)
AR0130 DS Rev. L Pub. 6/15 EN
37
©Semiconductor Components Industries, LLC, 2015.
AR0130 DS Rev. L Pub. 6/15 EN
Package Dimensions
Figure 28:
48 iLCC Package Outline Drawing
NOTES
DIMENSIONS IN MM. DIMENSIONS IN () ARE FOR REFERENCE ONLY.
DO NOT MEASURE PRINTED DRAWING.
ENCAPSULANT: EPOXY
0.2±0.1
SUBSTRATE MATERIAL: PLASTIC LAMINATE
0.50 THICKNESS
LID MATERIAL: BOROSILICATE GLASS 0.4 THICKNESS
REFRACTIVE INDEX AT 20°C = 1.5255 @ 546nm & 1.5231 @ 588nm
DOUBLE SIDE AR COATING: 530-570nm R<1%; 420-700nm R<2%
1.250±0.125
LEAD FINISH: GOLD PLATING, 0.5 MICRONS MINIMUM THICKNESS
IMAGE SENSOR DIE
A
MAXIMUM ROTATION OF OPTICAL AREA RELATIVE TO PACKAGE EDGES: 1°
MAXIMUM TILT OF OPTICAL AREA RELATIVE TO SEATING PLANE A: 35 MICRONS
MAXIMUM TILT OF OPTICAL AREA RELATIVE TO TOP OF COVER GLASS: 50 MICRONS
OPTICAL CENTER = PACKAGE CENTER. DIE CENTER OFFSET FROM PACKAGE CENTER:
X = 0.018, Y = -0.277MM
10±0.075
7.7
0.7 TYP
5±0.075
1.35±0.05
0.15 A B C
3.85
0.725 TYP
First
Clear
Pixel
2
3
0.15 A B C
4.15
5±0.075
4.45
38
7.7
10±0.075
(3.67 CTR)
4
0.7 TYP
5.2 CTR
Optical
Area
7
6
8
48X 0.4±0.05
0.15 A B C
4.45
5
8.9
0.525 TYP
0.125 TYP
Optical
Center
Die
Center
(4.87 CTR)
6.40 CTR CTR
7.28 = 0.10 CTR
©Semiconductor Components Industries, LLC, 2015
AR0130: 1/3-Inch CMOS Digital Image Sensor
Package Dimensions
3.85
6.227 CTR
48 PLCC Package Outline Drawing
AR0130 DS Rev. L Pub. 6/15 EN
Figure 29:
39
AR0130: 1/3-Inch CMOS Digital Image Sensor
Package Dimensions
©Semiconductor Components Industries, LLC, 2015
AR0130: 1/3-Inch CMOS Digital Image Sensor
Electrical Specifications
Electrical Specifications
Unless otherwise stated, the following specifications apply to the following conditions:
VDD = 1.8V – 0.10/+0.15; VDD_IO = VDD_PLL = VAA = VAA_PIX = 2.8V ± 0.3V;
VDD_SLVS = 0.4V – 0.1/+0.2; TA = -30°C to +70°C; output load = 10pF;
frequency = 74.25 MHz.
Two-Wire Serial Register Interface
The electrical characteristics of the two-wire serial register interface (SCLK, SDATA) are
shown in Figure 30 and Table 8.
Figure 30:
Two-Wire Serial Bus Timing Parameters
SDATA
tLOW
tf
tSU;DAT
tr
tf
tHD;STA
tr
tBUF
SCLK
S
tHD;STA
tHD;DAT
Note:
AR0130 DS Rev. L Pub. 6/15 EN
tHIGH
tSU;STA
Sr
tSU;STO
P
S
Read sequence: For an 8-bit READ, read waveforms start after READ command and register
address are issued.
40
©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Electrical Specifications
Table 8:
Two-Wire Serial Bus Characteristics
f
EXTCLK = 27 MHz; VDD = 1.8V; VDD_IO = 2.8V; VAA = 2.8V; VAA_PIX = 2.8V;
VDD_PLL = 2.8V; TA = 25°C
Standard-Mode
Parameter
Symbol
Min
Max
Min
Max
Unit
SCL
0
100
0
400
KHz
HD;STA
4.0
-
0.6
-
s
4.7
-
1.3
-
s
f
SCLK Clock Frequency
After this period, the first clock pulse is
generated
Fast-Mode
t
LOW period of the SCLK clock
t
HIGH period of the SCLK clock
t
LOW
HIGH
4.0
-
0.6
-
s
Set-up time for a repeated START
condition
tSU;STA
4.7
-
0.6
-
s
Data hold time:
t
04
3.455
06
0.95
s
Data set-up time
tSU;DAT
250
-
1006
-
ns
Rise time of both SDATA and SCLK signals
tr
-
1000
20 + 0.1Cb7
300
ns
Fall time of both SDATA and SCLK signals
tf
-
300
20 + 0.1Cb7
300
ns
tSU;STO
4.0
-
0.6
-
s
tBUF
4.7
-
1.3
-
s
Cb
-
400
-
400
pF
HD;DAT
Set-up time for STOP condition
Bus free time between a STOP and START
condition
Capacitive load for each bus line
Serial interface input pin capacitance
SDATA max load capacitance
SDATA pull-up resistor
Notes:
AR0130 DS Rev. L Pub. 6/15 EN
CIN_SI
-
3.3
-
3.3
pF
CLOAD_SD
-
30
-
30
pF
RSD
1.5
4.7
1.5
4.7
K
This table is based on I2C standard (v2.1 January 2000). Philips Semiconductor.
1.
2. Two-wire control is I2C-compatible.
3. All values referred to VIHmin = 0.9 VDD and VILmax = 0.1VDD levels. Sensor EXTCLK = 27 MHz.
4. A device must internally provide a hold time of at least 300 ns for the SDATA signal to bridge the
undefined region of the falling edge of SCLK.
5. The maximum tHD;DAT has only to be met if the device does not stretch the LOW period (tLOW) of
the SCLK signal.
6. A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement
tSU;DAT 250 ns must then be met. This will automatically be the case if the device does not stretch
the LOW period of the SCLK signal. If such a device does stretch the LOW period of the SCLK signal, it
must output the next data bit to the SDATA line tr max + tSU;DAT = 1000 + 250 = 1250 ns (according
to the Standard-mode I2C-bus specification) before the SCLK line is released.
7. Cb = total capacitance of one bus line in pF.
41
©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Electrical Specifications
I/O Timing
By default, the AR0130 launches pixel data, FV, and LV with the falling edge of PIXCLK.
The expectation is that the user captures DOUT[11:0], FV, and LV using the rising edge of
PIXCLK.
See Figure 31 and Table 9 below and Table 10 on page 43 for I/O timing (AC) characteristics.
Figure 31:
I/O Timing Diagram
tR
t RP
tF
t FP
90%
90%
10%
10%
t EXTCLK
EXTCLK
PIXCLK
t PD
Data[11:0]
Pxl _0
Pxl _1
Pxl _2
Pxl _n
t PLH
LINE_VALID/
FRAME_VALID
Table 9:
t PFL
t PFH
t PLL
FRAME_VALID leads LINE_VALID by 6 PIXCLKs.
FRAME_VALID trails
LINE_VALID by 6 PIXCLKs.
I/O Timing Characteristics (2.8V VDD_IO)1
Conditions: fPIXCLK=74.25MHz (720P60fps) VDD_IO=2.8V;
slew rate setting = 4 for PIXCLK; slew rate setting = 7 for parallel ports
Symbol
Definition
Condition
fEXTCLK
Input clock frequency
PLL enabled
6
PLL enabled
20
tEXTCLK
Input clock period
t
R
Input clock rise time
tF
Input clock fall time
Min
tJITTER2
Input clock jitter at 27 MHz
EXTCLK to PIXCLK propagation delay Nominal voltages, PLL Disabled, slew setting =4
tPIXCLK
PIXCLK rise time
tFP
Unit
50
MHz
166
50
ns
55
600
12
%
ps
20
6
ns
ns
3
45
tCP
tRP
Max
3
Input clock duty cycle
PIXCLK frequency2
Typ
ns
74.25
ns
Slew rate setting = 4
1.60
2.70
7.50
ns
PIXCLK fall time
Slew rate setting = 4
1.50
2.60
7.20
ns
PIXCLK duty cycle
PLL enabled
45
50
55
%
-2.5
3.5
ns
tPIXJITTER Jitter on PIXCLK
1
ns
tPD
PIXCLK to Data[11:0]
PIXCLK slew rate = 4
Parallel slew rate = 7
tPFH
PIXCLK to FV HIGH
PIXCLK slew rate = 4
Parallel slew rate = 7
-2.5
0.5
ns
tPLH
PIXCLK to LV HIGH
PIXCLK slew rate = 4
Parallel slew rate = 7
-3.0
0.0
ns
AR0130 DS Rev. L Pub. 6/15 EN
42
©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Electrical Specifications
Table 9:
I/O Timing Characteristics (2.8V VDD_IO)1 (continued)
Conditions: fPIXCLK=74.25MHz (720P60fps) VDD_IO=2.8V;
slew rate setting = 4 for PIXCLK; slew rate setting = 7 for parallel ports
Symbol
Definition
Condition
Min
tPFL
PIXCLK to FV LOW
PIXCLK slew rate = 4
Parallel slew rate = 7
tPLL
PIXCLK to LV LOW
PIXCLK slew rate = 4
Parallel slew rate = 7
CLOAD
Output load capacitance
10
pF
CIN
Input pin capacitance
2.5
pF
Notes:
Table 10:
Typ
Max
Unit
-2.5
0.5
ns
-3.0
0.0
ns
1. Minimum and maximum values are for the spec limits: 3.1V, -30C and 2.50V, 70C. All values are
taken at the 50% transition point.
2. Jitter from PIXCLK is already taken into account as the data of all the output parameters.
I/O Timing Characteristics (1.8V VDD_IO)1
Conditions: fPIXCLK=74.25MHz (720P60fps) VDD_IO=1.8V;
slew rate setting = 4 for PIXCLK; slew rate setting = 7 for parallel ports
Symbol
Definition
Condition
Min
fEXTCLK
Input clock frequency
PLL enabled
6
tEXTCLK
Input clock period
PLL enabled
20
tR
Input clock rise time
-
tF
Input clock fall time
-
Typ
Max
Unit
-
50
MHz
-
166
ns
3
-
ns
3
-
ns
Input clock duty cycle
45
50
55
%
tJITTER2
Input clock jitter at 27 MHz
–
600
–
ps
tCP
EXTCLK to PIXCLK propagation
delay
12
20
ns
fPIXCLK
PIXCLK frequency2
6
74.25
MHz
tRP
Pixel rise time
Slew rate setting = 4
2.50
4.30
7.10
ns
tFP
Pixel fall time
Slew rate setting = 4
2.20
3.80
6.50
ns
PIXCLK duty cycle
PLL enabled
45
50
55
Nominal voltages, PLL Disabled,
slew setting =4
%
tPIXJITTER
Jitter on PIXCLK
tPD
PIXCLK to data valid
PIXCLK slew rate = 4
Parallel slew rate = 7
–4.5
–
2.0
ns
tPFH
PIXCLK to FV HIGH
PIXCLK slew rate = 4
Parallel slew rate = 7
–4.0
–
–0.5
ns
tPLH
PIXCLK to LV HIGH
PIXCLK slew rate = 4
Parallel slew rate = 7
–4.0
–
–0.5
ns
tPFL
PIXCLK to FV LOW
PIXCLK slew rate = 4
Parallel slew rate = 7
–4.0
–
–0.5
ns
tPLL
PIXCLK to LV LOW
PIXCLK slew rate = 4
Parallel slew rate = 7
–4.0
–
–0.5
ns
CLOAD
Output load capacitance
10
pF
CIN
Input pin capacitance
2.5
pF
Notes:
AR0130 DS Rev. L Pub. 6/15 EN
1
ns
1. Minimum and maximum values are for the spec limits: 1.95V, -30C and 1.70V, 70C. All values are
taken at the 50% transition point.
2. Jitter from PIXCLK is already taken into account as the data of all the output parameters.
43
©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Electrical Specifications
I/O Rise Slew Rate (2.8V VDD_IO)1
Table 11:
Parallel Slew Rate
Conditions
Min
Typ
Max
Units
7
6
5
4
3
2
1
0
Default
Default
Default
Default
Default
Default
Default
Default
1.50
0.98
0.71
0.52
0.37
0.26
0.17
0.10
2.50
1.62
1.12
0.82
0.58
0.40
0.27
0.16
3.90
2.52
1.79
1.26
0.88
0.61
0.40
0.23
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
Note:
1. Minimum and maximum values are taken at 70°C, 2.5V, and -30°C, 3.1V. The loading used is 10pF.
I/O Fall Slew Rate (2.8V VDD_IO)1
Table 12:
Parallel Slew Rate
Conditions
Min
Typ
Max
Units
7
6
5
4
3
2
1
0
Default
Default
Default
Default
Default
Default
Default
Default
1.40
0.97
0.73
0.54
0.39
0.27
0.18
0.11
2.30
1.61
1.21
0.88
0.63
0.43
0.29
0.17
3.50
2.48
1.86
1.36
0.88
0.66
0.44
0.25
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
Note:
1. Minimum and maximum values are taken at 70°C, 2.5V, and -30°C, 3.1V. The loading used is 10pF.
I/O Rise Slew Rate (1.8V VDD_IO)1
Table 13:
Parallel Slew Rate
Conditions
Min
Typ
Max
Units
7
6
5
4
3
2
1
0
Default
Default
Default
Default
Default
Default
Default
Default
0.57
0.39
0.29
0.22
0.16
0.12
0.08
0.05
0.91
0.61
0.46
0.34
0.24
0.17
0.11
0.07
1.55
1.02
0.75
0.54
0.39
0.27
0.18
0.10
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
Note:
AR0130 DS Rev. L Pub. 6/15 EN
1. Minimum and maximum values are taken at 70°C, 1.7V, and -30°C, 1.95V. The loading used is 10pF.
44
©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Electrical Specifications
I/O Fall Slew Rate (1.8V VDD_IO)1
Table 14:
Parallel Slew Rate
Conditions
Min
Typ
Max
Units
7
6
5
4
3
2
1
0
Default
Default
Default
Default
Default
Default
Default
Default
0.57
0.40
0.31
0.24
0.18
0.13
0.09
0.05
0.92
0.64
0.50
0.38
0.27
0.19
0.13
0.08
1.55
1.08
0.82
0.61
0.44
0.31
0.20
0.12
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
V/ns
Note:
1. Minimum and maximum values are taken at 70°C, 1.7V, and -30°C, 1.95V. The loading used is 10pF.
DC Electrical Characteristics
The DC electrical characteristics are shown in the tables below.
Table 15:
DC Electrical Characteristics
Symbol
Definition
Condition
Min
Typ
Max
Unit
VDD
Core digital voltage
1.7
1.8
1.95
V
VDD_IO
I/O digital voltage
1.7/2.5
1.8/2.8
1.9/3.1
V
VAA
Analog voltage
2.5
2.8
3.1
V
VAA_PIX
Pixel supply voltage
2.5
2.8
3.1
V
2.5
2.8
3.1
V
–
–
–
V
VDD_PLL
PLL supply voltage
VDD_SLVS
Digital supply voltage
VIH
Input HIGH voltage
VDD_IO*0.7
–
–
V
VIL
Input LOW voltage
–
–
VDD_IO*0.3
V
IIN
Input leakage current
20
–
–
A
VOH
Output HIGH voltage
VDD_IO-0.3
–
–
V
VOL
Output LOW voltage
–
–
0.4
V
IOH
Output HIGH current
At specified VOH
-22
–
–
mA
IOL
Output LOW current
At specified VOL
–
–
22
mA
AR0130 DS Rev. L Pub. 6/15 EN
Do not connect.
No pull-up resistor; VIN = VDD_IO or
DGND
45
©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Electrical Specifications
Caution
Table 16:
Stresses greater than those listed in Table 16 may cause permanent damage to the device.
This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Absolute Maximum Ratings
Symbol
Parameter
VSUPPLY
Power supply voltage (VDD and VAA
supplies)
Minimum
Maximum
Unit
–0.3
4.5
V
ISUPPLY
Total power supply current
–
200
mA
IGND
Total ground current
–
200
mA
VIN
DC input voltage
–0.3
VDD_IO + 0.3
V
VOUT
DC output voltage
–0.3
VDD_IO + 0.3
V
TSTG1
Storage temperature
–40
+85
°C
Notes:
Table 17:
1. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
2. To keep dark current and shot noise artifacts from impacting image quality, keep operating temperature at a minimum.
Operating Current Consumption in Parallel Output
Definition
Condition
Digital operating current
Streaming, 1280x960 45fps
I/O digital operating current
Streaming, 1280x960 45fps
Analog operating current
Streaming, 1280x960 45fps
Symbol
Min
Typ
Max
Unit
IDD1
–
40
65
mA
IDD_IO
–
35
–
mA
IAA
–
30
55
mA
Pixel supply current
Streaming, 1280x960 45fps
IAA_PIX
–
10
15
mA
PLL supply current
Streaming, 1280x960 45fps
IDD_PLL
–
7
–
mA
Digital operating current
Streaming, 720p 60fps
IDD1
–
40
–
mA
IDD_IO
-
35
–
mA
I/O digital operating current
Streaming, 720p 60fps
Analog operating current
Streaming, 720p 60fps
IAA
–
30
–
mA
Pixel supply current
Streaming, 720p 60fps
IAA_PIX
–
10
15
mA
PLL supply current
Streaming, 720p 60fps
IDD_PLL
–
7
–
mA
Notes:
AR0130 DS Rev. L Pub. 6/15 EN
1. Operating currents are measured at the following conditions:
VAA=VAA_PIX=VDD_IO=VDD_PLL=2.8V
VDD=1.8V
PLL Enabled and PIXCLK=74.25MHz
TA = 25°C
46
©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Electrical Specifications
Table 18:
Standby Current Consumption
Definition
Condition
Hard standby (clock off)
Hard standby (clock on)
Soft standby (clock off)
Soft standby (clock on)
Symbol
Min
Typ
Max
Analog, 2.8V
-
Digital, 1.8V
-
Analog, 2.8V
–
70
200
μA
–
640
900
μA
-
–
275
–
μA
Digital, 1.8V
-
–
1.55
–
mA
Analog, 2.8V
-
–
70
200
μA
Digital, 1.8V
-
–
640
900
μA
Analog, 2.8V
-
–
275
–
μA
Digital, 1.8V
-
–
1.55
–
mA
Notes:
Figure 32:
Unit
1. Analog – VAA + VAA_PIX + VDD_PLL
2. Digital – VDD + VDD_IO + VDD_SLVS
Power Supply Rejection Ratio
Power Supply Rejection Ratio
70
60
50
)
B40
d
(
R
R
S 30
P
20
10
0
1000
10000
100000
1000000
Frequency (Hz)
AR0130 DS Rev. L Pub. 6/15 EN
47
©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Power-On Reset and Standby Timing
Power-On Reset and Standby Timing
Power-Up Sequence
The recommended power-up sequence for the AR0130 is shown in Figure 33. The available power supplies (VDD_IO, VDD, VDD_SLVS, VDD_PLL, VAA, VAA_PIX) must have the
separation specified below.
1. Turn on VDD_PLL power supply.
2. After 0–10s, turn on VAA and VAA_PIX power supply.
3. After 0–10s, turn on VDD power supply.
4. After 0–10s, turn on VDD_IO power supply.
5. After the last power supply is stable, enable EXTCLK.
6. Assert RESET_BAR for at least 1ms.
7. Wait 150000 EXTCLKs (for internal initialization into software standby.
8. Configure PLL, output, and image settings to desired values.
9. Wait 1ms for the PLL to lock.
10. Set streaming mode (R0x301a[2] = 1).
Figure 33:
Power Up
VDD_PLL (2.8)
VAA_PIX
VAA (2.8)
VDD (1.8)
VDD_IO (1.8/2.8)
t0
t1
t2
t3
VDD_SLVS
EXTCLK
t4
RESET_BAR
tx
t5
Hard Reset
AR0130 DS Rev. L Pub. 6/15 EN
48
Internal
Initialization
t6
Software
Standby
PLL Lock
Streaming
©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Power-On Reset and Standby Timing
Table 19:
Power-Up Sequence
Definition
VDD_PLL to VAA/VAA_PIX
VAA/VAA_PIX to VDD
VDD to VDD_IO
VDD_IO to VDD_SLVS
Xtal settle time
Hard Reset
Internal Initialization
PLL Lock Time
Notes:
AR0130 DS Rev. L Pub. 6/15 EN
3
Symbol
Minimum
Typical
Maximum
Unit
t0
t1
t2
t3
tx
t4
t5
t6
0
0
04
0
–
12
150000
1
10
10
10
10
301
–
–
–
–
–
–
–
–
–
–
–
s
s
s
s
ms
ms
EXTCLKs
ms
1. Xtal settling time is component-dependent, usually taking about 10 – 100 mS.
2. Hard reset time is the minimum time required after power rails are settled. In a circuit where Hard
reset is held down by RC circuit, then the RC time must include the all power rail settle time and
Xtal settle time.
3. It is critical that VDD_PLL is not powered up after the other power supplies. It must be powered
before or at least at the same time as the others. If the case happens that VDD_PLL is powered after
other supplies then sensor may have functionality issues and will experience high current draw on
this supply.
4. For the case where VDD_IO is 2.8V and VDD is 1.8V, it is recommended that the minimum time be
5s.
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©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Power-On Reset and Standby Timing
Power-Down Sequence
The recommended power-down sequence for the AR0130 is shown in Figure 34. The
available power supplies (VDD_IO, VDD, VDD_SLVS, VDD_PLL, VAA, VAA_PIX) must have
the separation specified below.
1. Disable streaming if output is active by setting standby R0x301a[2] = 0
2. The soft standby state is reached after the current row or frame, depending on configuration, has ended.
3. Turn off VDD_SLVS, if used.
4. Turn off VDD_IO.
5. Turn off VDD.
6. Turn off VAA/VAA_PIX.
7. Turn off VDD_PLL.
Figure 34:
Power Down
VDD_SLVS
t0
V DD_IO (1.8/2.8)
t1
VDD (1.8)
t2
VAA_PIX
VAA (2.8)
t3
VDD_PLL (2.8)
EXTCLK
t4
Power Down until next Power up cycle
Table 20:
Power-Down Sequence
Definition
Symbol
Minimum
Typical
Maximum
Unit
VDD_SLVS to VDD_IO
VDD_IO to VDD
VDD to VAA/VAA_PIX
VAA/VAA_PIX to VDD_PLL
PwrDn until Next PwrUp Time
t0
t1
t2
t3
t4
0
0
0
0
100
–
–
–
–
–
–
–
–
–
–
s
s
s
s
ms
Note:
AR0130 DS Rev. L Pub. 6/15 EN
t4 is required between power down and next power up time; all decoupling caps from regulators
must be completely discharged.
50
©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Revision History
Revision History
Rev. L . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6/9/15
• Updated “Ordering Information” on page 2
Rev. K . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4/13/15
• Updated “Ordering Information” on page 2
Rev. J. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3/25/15
• Removed Confidential marking
• Updated Table of Contents format
Rev. H . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11/11/14
• Updated to ON Semiconductor template
Rev. G . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2/25/14
• Updated Table 1, “Key Parameters,” on page 1
• Updated Table 3, “,” on page 2
• Updated Figure 6, Pixel Color Pattern Detail (Top Right Corner)
• Updated “Default Readout Order” on page 12
• Updated note to Table 5, “Frame Time: Long Integration Time,” on page 16
• Updated Equation 2 on page 16
• Updated “Hard Standby” on page 21
• Updated “I/O Timing” on page 42
• Replaced Table 9, “I/O Timing Characteristics with Table 9, “I/O Timing Characteristics (2.8V Vdd_IO)1,” on page 42 and Table 10, “I/O Timing Characteristics (1.8V
Vdd_IO)1,” on page 43
• Added Table 11, “I/O Rise Slew Rate (2.8V Vdd_IO)1,” on page 44
• Added Table 12, “I/O Fall Slew Rate (2.8V Vdd_IO)1,” on page 44
• Added Table 13, “I/O Rise Slew Rate (1.8V Vdd_IO)1,” on page 44
• Added Table 14, “I/O Fall Slew Rate (1.8V Vdd_IO)1,” on page 45
• Added Figure 32: “Power Supply Rejection Ratio,” on page 47
Rev. F . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3/14/13
• Updated Table 1, “Key Parameters,” on page 1
• Updated Table 2, “Available Part Numbers,” on page 1
• Updated Note 1 in “General Description” on page 6
• Updated “PLL-Generated Master Clock” on page 18
• Added Figure 13, Enter Standby Timing and Figure 14: “Exit Standby Timing,” on
page 20
• Updated “Bayer Space Resampling” on page 22
• Updated Figure 15: “Six Pixels in Normal and Column Mirror Readout Modes,” on
page 22
• Updated Figure 16: “Six Rows in Normal and Row Mirror Readout Modes,” on page 23
• Updated “Image Acquisition Modes” on page 25
• Updated “Automatic Exposure Control” on page 26
• Updated “Embedded Data and Statistics” on page 26
• Updated “Analog Gain” on page 29
• Updated “Black Level Correction” on page 29
• Updated “Column Triggering on Startup” on page 30
AR0130 DS Rev. L Pub. 6/15 EN
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©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Revision History
• Updated “Column Correction Retriggering Due to Mode Change” on page 30
• Updated Figure 26: “Quantum Efficiency – Monochrome Sensor,” on page 36
• Updated Note 4 in Figure 28: “48 iLCC Package Outline Drawing,” on page 38
Rev. E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6/5/12
• Updated Table 2, “Available Part Numbers,” on page 1
• Updated “General Description” on page 6
Rev. D . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3/19/12
• Updated to Production
• Removed section “Defective Pixel Correction
• Updated Table 9, “I/O Timing Characteristics,” on page 41
• Updated Table 17, “Operating Current Consumption in Parallel Output ,” on page 46
• Updated Table 18, “Standby Current Consumption ,” on page 47
Rev. C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2/16/12
• Updated “Features” on page 17
• Updated Table 1, “Key Parameters,” on page 1
• Updated Table 2, “Available Part Numbers,” on page 1
• Updated “General Description” on page 6
• Updated Figure 1: “Block Diagram,” on page 6
• Deleted Figure 2: “Typical Configuration: Serial Four-Lane HiSPi Interface” from p.6
and renumbered remaining figures.
• Updated notes for Figure 2: “Typical Configuration: Parallel Pixel Data Interface,” on
page 7
• Updated Table 3, “Pad Descriptions,” on page 8
• Updated Figure 3: “48-Pin iLCC Pinout Diagram,” on page 9
• Added Figure 4: “48-Pin PLCC Pinout Diagram,” on page 10
• Deleted section “Serial Output Data Timing”
• Updated title of Figure 26: “Quantum Efficiency – Monochrome Sensor,” on page 36
• Updated Figure 27: “Quantum Efficiency – Color Sensor,” on page 37
• Added Figure 29: “48 PLCC Package Outline Drawing,” on page 39
• Updated “Electrical Specifications” on page 40
• Updated Table 8, “Two-Wire Serial Bus Characteristics,” on page 41
• Updated Table 15, “DC Electrical Characteristics,” on page 45
• Updated Table 16, “Absolute Maximum Ratings,” on page 46
• Deleted Table 13: Operating Currents in HiSPi Output and renumbered succeeding
tables
• Deleted section “HiSPi Electrical Specifications”
• Updated Figure 33: “Power Up,” on page 48
• Updated “Power-Down Sequence” on page 50
• Updated Figure 34: “Power Down,” on page 50
Rev. B . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9/12/11
• Updated “Features” on page 17
• Updated Table 1, “Key Parameters,” on page 1
• Updated Table 2, “Available Part Numbers,” on page 1
• Added note to Figure 2: “Typical Configuration: Parallel Pixel Data Interface,” on
page 7
AR0130 DS Rev. L Pub. 6/15 EN
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©Semiconductor Components Industries, LLC, 2015.
AR0130: 1/3-Inch CMOS Digital Image Sensor
Revision History
• Updated note 4 in Figure 2: “Typical Configuration: Parallel Pixel Data Interface,” on
page 7
• Added Figure 3: “48-Pin iLCC Pinout Diagram,” on page 9
• Updated “Parallel Output Data Timing” on page 14
• Updated Figure 12: “Timing Diagram,” on page 15
• Updated Table 4, “Frame Time (Example Based on 1280 x 960, 45 Frames Per
Second),” on page 15
• Updated Table 6, “Real-Time Context-Switchable Registers,” on page 17
• Updated “To Configure and Use the PLL:” on page 18
• Updated “To Enter Soft Standby:” on page 19
• Updated “Single Frame” on page 25
• Deleted “Temperature Sensor”
• Updated “Embedded Statistics” on page 27
• Updated “Column Correction Retriggering Due to Mode Change” on page 30
• Added Figure 28: “48 iLCC Package Outline Drawing,” on page 38
• Updated Figure 30: “Two-Wire Serial Bus Timing Parameters,” on page 40
• Updated Table 8, “Two-Wire Serial Bus Characteristics,” on page 41
• Updated note 1 in Table 18, “Standby Current Consumption ,” on page 47
• Updated “Power-Up Sequence” on page 48
• Updated Figure 33: “Power Up,” on page 48
• Updated Table 19, “Power-Up Sequence,” on page 49
• Updated “Power-Down Sequence” on page 50
• Updated Figure 34: “Power Down,” on page 50
• Updated Table 20, “Power-Down Sequence,” on page 50
Rev. A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3/1/11
• Initial release
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