ON FAN7371M High-current high-side gate drive ic Datasheet

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FAN7371
High-Current High-Side Gate Drive IC
Features
Description
! Floating Channel for Bootstrap Operation to +600V
The FAN7371 is a monolithic high-side gate drive IC,
which can drive high-speed MOSFETs and IGBTs that
operate up to +600V. It has a buffered output stage with
all NMOS transistors designed for high pulse current
driving capability and minimum cross-conduction.
! 4A/4A Sourcing/Sinking Current Driving Capability
! Common-Mode dv/dt Noise Canceling Circuit
! 3.3V and 5V Input Logic Compatible
! Output In-phase with Input Signal
! 8-Lead Small Outline Package (SOP)
Fairchild’s high-voltage process and common-mode
noise canceling techniques provide stable operation of
the high-side driver under high dv/dt noise circumstances. An advanced level-shift circuit offers high-side
gate driver operation up to VS=-9.8V (typical) for
VBS=15V.
Applications
The UVLO circuit prevents malfunction when VBS is
lower than the specified threshold voltage.
! Under- Voltage Lockout for VBS
! 25V Shunt Regulator on VDD and VBS
! High-Speed Gate Driver
! Sustaine Switch Driver in PDP Application
! Energy-Recovery Circuit Switch Driver in
PDP Application
! High-Power Buck Converter
The high-current and low-output voltage drop feature
makes this device suitable for sustaine switch driver and
energy recovery switch driver in the Plasma Display
Panel application, motor drive inverter, switching power
supply, and high-power DC-DC converter applications.
! Motor Drive Inverter
8-SOP
Ordering Information
Part Number
FAN7371M(1)
FAN7371MX(1)
Package
Operating
Temperature Range
8-SOP
-40°C ~ 125°C
Eco Status
RoHS
Packing Method
Tube
Tape & Reel
Note:
1. These devices passed wave soldering test by JESD22A-111.
For Fairchild’s definition of Eco Status, please visit: http://www.fairchildsemi.com/company/green/rohs_green.html.
© 2008 Fairchild Semiconductor Corporation
FAN7371 Rev. 1.0.2
www.fairchildsemi.com
FAN7371 — High-Current High-Side Gate Drive IC
November 2009
15V
DBOOT3
VS
15V
FAN7371
RBOOT1
DBOOT1
8 VB
Q3
1
VDD
2
IN
4 GND
VB
8
HO
7
VS
6
NC
5
NC 3
5
NC
2
IN3
8
IN
HO
7
3 NC
VS
6
NC
5
GND 4
D4
To Pannel
R2
Q1
VB
2
IN
VS
R1
FAN7371
8 VB
Q2
R5
IN2
HO
6
D2
D1
FAN7371
VDD
7
L1
DBOOT2
1
VDD 1
CBOOT3
R4
CBOOT1
3 NC
R3
D3
FAN7371
IN1
RBOOT3
Q4
VDD 1
R7
7
HO
6
VS
5
NC
IN
2
IN4
CBOOT2
C1
R6
NC 3
C3
R8
4 GND
GND 4
C2
Energy Recovery Circuit Part
Sustain Drive Part
FAN7371 Rev.03
Figure 1. Floated Bidirectional Switch and Half-Bridge Driver: PDP application
VIN
15V
RBOOT
DBOOT
FAN7371
1 VDD
VB 8
R1
2 IN
PWM
HO
7
CBOOT
C1
3 NC
4 GND
L1
R2
VS 6
NC
5
D1
C2
VOUT
FAN7371 Rev.01
Figure 2. Step-Down (Buck) DC-DC Converter Application
© 2008 Fairchild Semiconductor Corporation
FAN7371 Rev. 1.0.2
www.fairchildsemi.com
2
FAN7371 — High-Current High-Side Gate Drive IC
Typical Application Diagrams
1
VDD
25V
UVLO
4
GND
PULSE
GENERATOR
2
IN
110K
NOISE
CANCELLER
R
R
S
Q
Shoot-through current
compensated gate driver
VDD
8
VB
7
HO
6
VS
25V
Pins 3 and 5 are no connection.
FAN7371 Rev.04
Figure 3. Functional Block Diagram
Pin Configuration
VDD
1
IN
2
8
VB
7
HO
FAN7371
NC
3
6
VS
GND
4
5
NC
FAN7371 Rev.01
Figure 4. Pin Configuration (Top View)
Pin Definitions
Pin #
Name
1
VDD
2
IN
Description
Supply Voltage
Logic Input for High-Side Gate Driver Output
3
NC
4
GND
No Connection
5
NC
No Connection
6
VS
High-Voltage Floating Supply Return
7
HO
High-Side Driver Output
8
VB
High-Side Floating Supply
Ground
© 2008 Fairchild Semiconductor Corporation
FAN7371 Rev. 1.0.2
www.fairchildsemi.com
3
FAN7371 — High-Current High-Side Gate Drive IC
Internal Block Diagram
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The
absolute maximum ratings are stress ratings only. TA=25°C unless otherwise specified.
Symbol
Characteristics
VS
High-Side Floating Offset Voltage
VB
High-Side Floating Supply Voltage(2)
VHO
VDD
VIN
High-Side Floating Output Voltage
Low-Side and Logic Supply Voltage
(2)
Max.
Unit
VB-VSHUNT
VB+0.3
V
-0.3
625.0
V
VS-0.3
VB+0.3
V
-0.3
VSHUNT
V
-0.3
VDD+0.3
V
Allowable Offset Voltage Slew Rate
± 50
V/ns
PD
Power Dissipation(3, 4, 5)
0.625
W
θJA
Thermal Resistance
200
°C/W
TJ
Junction Temperature
-55
+150
°C
TSTG
Storage Temperature
-55
+150
°C
Operating Ambient Temperature
-40
+125
°C
dVS/dt
TA
Logic Input Voltage
Min.
Notes:
2
3
4
5
This IC contains a shunt regulator on VDD and VBS with a normal breakdown voltage of 25V. Please note that this
supply pin should not be driven by a low-impedance voltage source greater than the VSHUNT specified in the
Electrical Characteristics section
Mounted on 76.2 x 114.3 x 1.6mm PCB (FR-4 glass epoxy material).
Refer to the following standards:
JESD51-2: Integral circuits thermal test method environmental conditions, natural convection, and
JESD51-3: Low effective thermal conductivity test board for leaded surface mount packages.
Do not exceed power dissipation (PD) under any circumstances.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Symbol
Parameter
Min.
Max.
Unit
VBS
High-Side Floating Supply Voltage
VS+10
VS+20
V
VS
High-Side Floating Supply Offset Voltage
6-VDD
600
V
VS
VB
V
GND
VDD
V
10
20
V
VHO
High-Side Output Voltage
VIN
Logic Input Voltage
VDD
Supply Voltage
© 2008 Fairchild Semiconductor Corporation
FAN7371 Rev. 1.0.2
www.fairchildsemi.com
4
FAN7371 — High-Current High-Side Gate Drive IC
Absolute Maximum Ratings
VBIAS(VDD, VBS)=15.0V, TA = 25°C, unless otherwise specified. The VIN and IIN parameters are referenced to GND.
The VO and IO parameters are relative to VS and are applicable to the respective output HO.
Symbol
Characteristics
Test Condition
POWER SUPPLY SECTION
IQDD Quiescent VDD Supply Current
IPDD
Operating VDD Supply Current
Min. Typ. Max. Unit
VIN=0V or 5V
25
70
μA
fIN=20KHz, No Load
35
100
μA
BOOTSTRAPPED SUPPLY SECTION
VBS Supply Under-Voltage Positive Going
Threshold Voltage
VBS Supply Under-Voltage Negative Going
VBSUVThreshold Voltage
VBS Supply Under-Voltage Lockout
VBSHYS
Hysteresis Voltage
ILK
Offset Supply Leakage Current
VBSUV+
IQBS
IPBS
VBS=Sweep
8.2
9.2
10.2
V
VBS=Sweep
7.5
8.5
9.5
V
VBS=Sweep
0.7
VB=VS=600V
V
10
μA
Quiescent VBS Supply Current
VIN=0V or 5V
60
120
μA
Operating VBS Supply Current
CLOAD=1nF, fIN=20KHz, rms
Value
1.0
2.8
mA
SHUNT REGULATOR SECTION
V and VBS Shunt Regulator Clamping
VSHUNT DD
Voltage
INPUT LOGIC SECTION
VIH
Logic “1” Input Voltage
ISHUNT=5mA
25
V
2.5
VIL
Logic “0” Input Voltage
IIN+
Logic Input High Bias Current
VIN=5V
IIN-
Logic Input Low Bias Current
VIN=0V
RIN
Input Pull-down Resistance
GATE DRIVER OUTPUT SECTION
VOH
High Level Output Voltage (VBIAS - VO)
24
V
45
70
0.8
V
70
μA
2
μA
110
KΩ
No Load
1.2
V
30
mV
VOL
Low Level Output Voltage
No Load
IO+
Output High, Short-Circuit Pulsed Current(6)
VHO=0V, VIN=5V, PW ≤10µs
3.0
4.0
A
IO-
Current(6)
VHO=15V,VIN=0V, PW ≤10µs
3.0
4.0
A
VS
Output Low, Short-Circuit Pulsed
Allowable Negative VS pin Voltage for IN
Signal Propagation to HO
-9.8
-7.0
V
Note:
6
These parameters guaranteed by design.
Dynamic Electrical Characteristics
VDD=VBS=15V, GND=0V, CLOAD=1000pF, TA=25°C, unless otherwise specified.
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
ton
Turn-on Propagation Delay Time
VS=0V
150
210
ns
toff
Turn-off Propagation Delay Time
VS=0V
150
210
ns
tr
Turn-on Rise Time
25
50
ns
tf
Turn-off Fall Time
15
40
ns
.
© 2008 Fairchild Semiconductor Corporation
FAN7371 Rev. 1.0.2
www.fairchildsemi.com
5
FAN7371 — High-Current High-Side Gate Drive IC
Electrical Characteristics
250
200
200
tOFF [ns]
tON [ns]
250
150
100
150
100
50
50
0
-40
-20
0
20
40
60
80
100
0
-40
120
-20
0
Temperature [°C]
50
50
40
40
30
20
10
10
0
20
40
60
80
100
0
-40
120
-20
0
Temperature [°C]
80
100
120
20
40
60
80
100
120
Temperature [°C]
Figure 7. Turn-on Rise Time vs. Temperature
Figure 8. Turn-off Fall Time vs. Temperature
2.0
100
80
1.5
IPBS [mA]
IPDD [μA]
60
30
20
-20
40
Figure 6. Turn-off Propagation Delay
vs. Temperature
tF [ns]
tR [ns]
Figure 5. Turn-on Propagation Delay
vs. Temperature
0
-40
20
Temperature [°C]
60
1.0
40
0.5
20
0
-40
-20
0
20
40
60
80
100
0.0
-40
120
Temperature [°C]
-20
0
20
40
60
80
100
120
Temperature [°C]
Figure 9. Operating VDD Supply Current
Figure 10. Operating VBS Supply Current
vs. Temperature
vs. Temperature
© 2008 Fairchild Semiconductor Corporation
FAN7371 Rev. 1.0.2
www.fairchildsemi.com
6
FAN7371 — High-Current High-Side Gate Drive IC
Typical Characteristics
9.5
9.5
9.0
VBSUV- [V]
VBSUV+ [V]
10.0
9.0
8.0
8.5
8.0
-40
8.5
-20
0
20
40
60
80
100
7.5
-40
120
-20
0
Temperature [°C]
3.0
3.0
2.5
2.5
2.0
2.0
1.5
1.0
0.5
0.5
0
20
40
60
60
80
100
120
1.5
1.0
-20
40
Figure 12. VBS UVLO- vs. Temperature
VIL [V]
VIH [V]
Figure 11. VBS UVLO+ vs. Temperature
0.0
-40
20
Temperature [°C]
80
100
0.0
-40
120
-20
0
Temperature [°C]
20
40
60
80
100
120
Temperature [°C]
Figure 13. Logic High Input Voltage vs. Temperature
Figure 14. Logic Low Input Voltage vs. Temperature
280
1.50
240
1.25
VOH [V]
RIN [kΩ]
200
160
120
1.00
0.75
80
0.50
40
0.25
0
-40
-20
0
20
40
60
80
100
0.00
-40
120
Temperature [°C]
0
20
40
60
80
100
120
Temperature [°C]
Figure 15. Input Pull-Down Resistance
vs.Temperature.
Figure 16. High-Level Output Voltage
vs. Temperature
© 2008 Fairchild Semiconductor Corporation
FAN7371 Rev. 1.0.2
-20
www.fairchildsemi.com
7
FAN7371 — High-Current High-Side Gate Drive IC
Typical Characteristics (Continued)
6.5
6.0
6.0
5.5
5.5
5.0
5.0
IO- [A]
IO+ [A]
6.5
4.5
4.5
4.0
4.0
3.5
3.5
3.0
3.0
2.5
-40
-20
0
20
40
60
80
100
2.5
-40
120
-20
0
Temperature [°C]
7
7
6
6
5
5
4
4
3
3
12
14
16
40
60
80
100
120
Figure 18. Output Low, Short-Circuit Pulsed Current
vs. Temperature
IO- [A]
IO+ [A]
Figure 17. Output High, Short-Circuit Pulsed Current
vs. Temperature
2
10
20
Temperature [°C]
18
2
10
20
12
14
VBS [V]
16
18
20
VBS [V]
Figure 19. Output High, Short-Circuit Pulsed Current
vs. Supply Voltage
Figure 20. Output Low, Short-Circuit Pulsed Current
vs. Supply Voltage
80
120
100
-40°C
80
-40°C
IQBS [μA]
IQDD [μA]
60
40
25°C
25°C
60
125°C
40
125°C
20
20
0
10
12
14
16
18
0
10
20
Supply Voltage [V]
14
16
18
20
Supply Voltage [V]
Figure 21. Quiescent VDD Supply Current
vs. Supply Voltage
Figure 22. Quiescent VBS Supply Current
vs. Supply Voltage
© 2008 Fairchild Semiconductor Corporation
FAN7371 Rev. 1.0.2
12
www.fairchildsemi.com
8
FAN7371 — High-Current High-Side Gate Drive IC
Typical Characteristics (Continued)
Timing Diagram
15V
50%
VDD
10nF
VB
10µF
10µF
0.1µF
50%
IN
15V
VS
GND
ton
tr
toff
tf
FAN7371
1000pF
90%
90%
HO
IN
OUT
(A)
10%
10%
(B)
Figure 23. Switching Time Test Circuit and Waveform Definitions
© 2008 Fairchild Semiconductor Corporation
FAN7371 Rev. 1.0.2
www.fairchildsemi.com
9
FAN7371 — High-Current High-Side Gate Drive IC
Switching Time Definitions
5.00
4.80
A
0.65
3.81
5
8
B
6.20
5.80
PIN ONE
INDICATOR
1.75
4.00
3.80
1
5.60
4
1.27
(0.33)
0.25
M
1.27
C B A
LAND PATTERN RECOMMENDATION
SEE DETAIL A
0.25
0.10
1.75 MAX
R0.10
0.25
0.19
C
0.10
0.51
0.33
0.50 x 45°
0.25
C
OPTION A - BEVEL EDGE
GAGE PLANE
R0.10
0.36
OPTION B - NO BEVEL EDGE
NOTES: UNLESS OTHERWISE SPECIFIED
8°
0°
0.90
0.406
SEATING PLANE
(1.04)
DETAIL A
SCALE: 2:1
A) THIS PACKAGE CONFORMS TO JEDEC
MS-012, VARIATION AA, ISSUE C,
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS DO NOT INCLUDE MOLD
FLASH OR BURRS.
D) LANDPATTERN STANDARD: SOIC127P600X175-8M.
E) DRAWING FILENAME: M08AREV13
Figure 24. 8-Lead Small Outline Package (SOP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/.
© 2008 Fairchild Semiconductor Corporation
FAN7371 Rev. 1.0.2
www.fairchildsemi.com
10
FAN7371 — High-Current High-Side Gate Drive IC
Physical Dimensions
FAN7371 — High-Current High-Side Gate Drive IC
© 2008 Fairchild Semiconductor Corporation
FAN7371 Rev. 1.0.2
www.fairchildsemi.com
12
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are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
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ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
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