DS26F32MQML www.ti.com SNOSAS5A – MARCH 2006 – REVISED APRIL 2013 DS26F32MQML Quad Differential Line Receivers Check for Samples: DS26F32MQML FEATURES DESCRIPTION • The DS26F32 is a quad differential line receiver designed to meet the requirements of EIA Standards RS-422 and RS-423, and Federal Standards 1020 and 1030 for balanced and unbalanced digital data transmission. 1 2 • • • • Input Voltage Range of ±7.0V (Differential or Common Mode) ±0.2V Sensitivity over the Input Voltage Range High Input Impedance Operation from Single +5.0V Supply Input Pull-Down Resistor Prevents Output Oscillation on Unused Channels TRI-STATE Outputs, with Choice of Complementary Enables, for Receiving Directly onto a Data Bus The DS26F32 offers improved performance due to the use of state-of-the-art L-FAST bipolar technology. The L-FAST technology allows for higher speeds and lower currents by utilizing extremely short gate delay times. Thus, the DS26F32 features lower power, extended temperature range, and improved specifications. The device features an input sensitivity of 200 mV over the input common mode range of ±7.0V. The DS26F32 provides an enable function common to all four receivers and TRI-STATE outputs with 8.0 mA sink capability. Also, a fail-safe input/output relationship keeps the outputs high when the inputs are open. The DS26F32 offers optimum performance when used with the DS26F31 Quad Differential Line Driver. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2006–2013, Texas Instruments Incorporated DS26F32MQML SNOSAS5A – MARCH 2006 – REVISED APRIL 2013 www.ti.com Connection Diagrams Figure 2. 20-Lead LCCC Package-Top View See Package Number NAJ0020A Figure 1. 16-Lead CDIP Package-Top View See Package Number NAC0016A, NFE0016A, or NAD0016A Table 1. Function Table (Each Receiver) (1) Differential Inputs Outputs VID = (V I+) − (VI−) E E OUT VID ≥ 0.2V H X H X L H H X L X L L L H Z VID ≤ −0.2V X (1) Enables H = High Level L = Low Level X = Immaterial These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 2 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: DS26F32MQML DS26F32MQML www.ti.com SNOSAS5A – MARCH 2006 – REVISED APRIL 2013 Absolute Maximum Ratings (1) Storage Temperature Range −65°C ≤ TA ≤ +150°C Operating Temperature Range −55°C ≤ TA ≤ +125°C Lead Temperature (soldering, 60 sec) 300°C Supply Voltage 7.0V Common Mode Voltage Range ±25V Differential Input Voltage ±25V Enable Voltage 7.0V Output Sink Current 50 mA Maximum Power Dissipation (PD maxat 25°C) (2) (3) , 500 mW Thermal Resistance θJA NFE0016A package 100°C/W NAD0016A package 142°C/W NAJ0020A package 87°C/W θJC Junction-to- case (1) (2) (3) See MIL-STD-1835 Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is functional, but do not verify specific performance limits. For verified specifications and test conditions, see the Electrical Characteristics. The verified specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test conditions. Derate J package 10.0mW/°C above +25°C, derate W package 7.1mW/°C above +25°C, derate E package 11.5mW/°C above +25°C. Power dissipation must be externally controlled at elevated temperatures. Recommended Operating Range −55°C ≤ TA ≤ +125°C Operating Temperature Supply Voltage 4.5V to 5.5V Table 2. Radiation Features DS26F32MJRQMLV 100 krads (Si) DS26F32MWRQMLV 100 krads (Si) DS26F32MWGRQMLV 100 krads (Si) Table 3. Quality Conformance Inspection Mil-Std-883, Method 5005 - Group A Subgroup Description Temp °C 1 Static tests at 25 2 Static tests at 125 3 Static tests at -55 4 Dynamic tests at 25 5 Dynamic tests at 125 6 Dynamic tests at -55 7 Functional tests at 25 8A Functional tests at 125 8B Functional tests at -55 9 Switching tests at 25 10 Switching tests at 125 11 Switching tests at -55 12 Settling time at 25 13 Settling time at 125 14 Settling time at -55 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: DS26F32MQML 3 DS26F32MQML SNOSAS5A – MARCH 2006 – REVISED APRIL 2013 www.ti.com DS26F32 Electrical Characteristics DC Parameters The following conditions apply, unless otherwise specified. DC: VCC = 5V (1) Parameter IIn Input Current Max Units Subgroups Pin under test VCC = 4.5V, VI = 15V Other inputs -15V ≤ VI ≤ +15V 2.3 mA 1, 2, 3 Pin under test VCC = 5.5V, VI = -15V Other inputs -15V ≤ VI ≤ +15V -2.8 mA 1, 2, 3 -360 µA 1, 2, 3 10 µA 1, 2, 3 Test Conditions Notes Min IIL Logical "0" Enable Current VCC = 5.5V, VEn = 0.4V IIH Logical "1" Enable Current VCC = 5.5V, VI = 2.7V II Logical "1" Enable Current VCC = 5.5V, VI = 5.5V 50 µA 1, 2, 3 VIK Input Clamp Voltage (Enable) VCC = 4.5V, II = -18mA -1.5 V 1, 2, 3 VOH Logical "1" Output Voltage VCC = 4.5V, IOH = -440µA, ΔVI = 1V, VEn = .8 = VEn V 1, 2, 3 VOL Logical "0" Output Voltage VCC = 4.5V, VEn =0.8V = VEn, IOL = 4mA, ΔVI = -1V 0.4 V 1, 2, 3 VCC = 4.5V, VEn = 8V = VEn, IOL = 8mA, ΔVI = -1V .45 V 1, 2, 3 2.5 ICC Supply Current VCC = 5.5V, All VI = Gnd, VEn = 0V, VEn = 2V 50 mA 1, 2, 3 IOZ Off-State Output Current VCC = 5.5V, VO = 0.4V, VEn = 0.8V, VEn = 2V -20 µA 1, 2, 3 VCC = 5.5V, VO = 2.4V, VEn = 0.8V, VEn = 2V 20 µA 1, 2, 3 RI Input Resistance -15 ≤ VCM ≤ 15V KΩ 1, 2, 3 VTh Differential Input Voltage VCC = 4.5V, VOUT = VOL or VOH -7V ≤ VCM ≤ 7V, VEn = VEn = 2.5V (2) -0.2 0.2 V 1, 2, 3 VCC = 5.5V, VOUT = VOL or VOH -7V ≤ VCM ≤ 7V, VEn = VEn = 2.5V (2) -0.2 0.2 V 1, 2, 3 0.8 14 VIL Logical "0" Input Voltage (Enable) VCC = 5.5V (2) VIH Logical "1" Input Voltage (Enable) VCC = 4.5V (2) ISC Min Output Short Circuit Current VCC = 4.5V, VO = 0V, ΔVI = 1V ISC Max Output Short Circuit Current VCC = 5.5V, VO = 0V, ΔVI = 1V (1) (2) 4 V 1, 2, 3 2.0 V 1, 2, 3 -15 mA 1, 2, 3 mA 1, 2, 3 -85 Pre and post irradiation limits are identical to those listed under AC and DC electrical characteristics. These parts may be dose rate sensitive in a space environment and demonstrate enhanced low dose rate effect. Radiation end point limits for the noted parameters are specified only for the conditions as specified in Mil-Std-883, Method 1019.5, Condition A Parameter tested go-no-go only. Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: DS26F32MQML DS26F32MQML www.ti.com SNOSAS5A – MARCH 2006 – REVISED APRIL 2013 DS26F32 Electrical Characteristics AC Parameters The following conditions apply, unless otherwise specified. AC: VCC = 5V (1) Parameter tPLH Test Conditions CL = 50pF CL = 15pF tPHL CL = 50pF CL = 15pF tPZH Enable Time CL = 50pF CL = 15pF tPZL Enable Time CL = 50pF CL = 15pF tPHZ Disable Time CL = 50pF CL = 5pF tPLZ Disable Time CL = 50pF CL = 5pF (1) (2) (3) Notes Min Subgroups Max Units (2) 23 nS 9 (2) 31 nS 10, 11 (3) 22 nS 9 (3) 30 nS 10, 11 (2) 23 nS 9 (2) 31 nS 10, 11 (3) 22 nS 9 (3) 30 nS 10, 11 (2) 18 nS 9 (2) 29 nS 10, 11 (3) 16 nS 9 (3) 27 nS 10, 11 (2) 20 nS 9 (2) 29 nS 10, 11 (3) 18 nS 9 (3) 27 nS 10, 11 (2) 55 nS 9 (2) 62 nS 10, 11 (3) 20 nS 9 (3) 27 nS 10, 11 (2) 30 nS 9 (2) 42 nS 10, 11 (3) 18 nS 9 (3) 30 nS 10, 11 Pre and post irradiation limits are identical to those listed under AC and DC electrical characteristics. These parts may be dose rate sensitive in a space environment and demonstrate enhanced low dose rate effect. Radiation end point limits for the noted parameters are specified only for the conditions as specified in Mil-Std-883, Method 1019.5, Condition A Tested at 50pF, system capacitance exceeds 5pF to 15pF. Tested at 50pF specifies limit at 15pF & 5pF. DS26F32 Electrical Characteristics DC Drift Parameters This section applies to -QMLV devices only. Devices shall be read & recorded at TA = 25°C before and after each burn-in and shall not change by more than the limits indicated. The delta rejects shall be included in the PDA calculation. Parameter Test Conditions Notes Min Max Units Subgroups VOH Logical "1" Output Voltage VCC = 4.5V, IOH = -440µA, ΔVI = 1V, VEn = 0.8V = VEn -250 250 mV 1 VOL Logical "0" Output Voltage VCC = 4.5V, IOL = 4mA, ΔVI = -1V, VEn = 0.8V = VEn -45 45 mV 1 VCC = 4.5V, IOL = 8mA, Δ VI = -1V, VEn = 0.8V = VEn -45 45 mV 1 Pin under test VCC = 4.5V, VI = 15V Other inputs -15V ≤ VI ≤ +15V -0.28 0.28 mA 1 Pin under test VCC = 5.5V, VI = -15V Other inputs -15V ≤ VI ≤ +15V -0.28 0.28 mA 1 II Input Current Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: DS26F32MQML 5 DS26F32MQML SNOSAS5A – MARCH 2006 – REVISED APRIL 2013 www.ti.com Figure 3. Logic Symbol (A) (B) C L includes probe and jig capacitance. A. Parameter tested go-no-go only. B. Tested at 50pF specifies limit at 15pF and 5pF. Figure 4. Load Test Circuit for Three-State Outputs Diagram shown for ENABLE Low. S1 and S2 of Load Circuit are closed except where shown. Pulse Generator of all Pulses: Rate ≤ 1.0 MHz, ZO = 50Ω, tr ≤ 6.0 ns, tf ≤ 6.0 ns. Figure 5. Propagation Delay 6 Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: DS26F32MQML DS26F32MQML www.ti.com SNOSAS5A – MARCH 2006 – REVISED APRIL 2013 Diagram shown for ENABLE Low. S1 and S2 of Load Circuit are closed except where shown. Pulse Generator of all Pulses: Rate ≤ 1.0 MHz, ZO = 50Ω, tr ≤ 6.0 ns, tf ≤ 6.0 ns. All diodes are IN916 or IN3064. Figure 6. Enable and Disable Times TYPICAL APPLICATION Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: DS26F32MQML 7 DS26F32MQML SNOSAS5A – MARCH 2006 – REVISED APRIL 2013 www.ti.com REVISION HISTORY Released 8 Revision 3/01/06 * 4/15/2013 A Section New Release, Corporate format Originator Changes L. Lytle 1 MDS data sheet converted into one Corp. data sheet format. MNDS26F32M-X-RH Rev 0C0 will be archived. TIS Changed layout of National Data Sheet to TI format Submit Documentation Feedback Copyright © 2006–2013, Texas Instruments Incorporated Product Folder Links: DS26F32MQML PACKAGE OPTION ADDENDUM www.ti.com 19-Jul-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) 5962-7802005M2A ACTIVE LCCC NAJ 20 50 TBD Call TI Call TI -55 to 125 DS26F32ME/ 883 Q 5962-78020 05M2A ACO 05M2A >T 5962-7802005MFA ACTIVE CFP NAD 16 19 TBD Call TI Call TI -55 to 125 DS26F32MW /883 Q 5962-78020 05MFA ACO 05MFA >T 5962R7802005VEA ACTIVE CDIP NFE 16 25 TBD Call TI Call TI -55 to 125 DS26F32MJRQMLV 5962R7802005VEA Q 5962R7802005VFA ACTIVE CFP NAD 16 19 TBD Call TI Call TI -55 to 125 DS26F32MWR QMLV Q 5962R78020 05VFA ACO 05VFA >T DS26F32 MW8 ACTIVE WAFERSALE YS 0 1 Green (RoHS & no Sb/Br) Call TI Level-1-NA-UNLIM -55 to 125 DS26F32ME/883 ACTIVE LCCC NAJ 20 50 TBD Call TI Call TI -55 to 125 DS26F32ME/ 883 Q 5962-78020 05M2A ACO 05M2A >T DS26F32MJRQMLV ACTIVE CDIP NFE 16 25 TBD Call TI Call TI -55 to 125 DS26F32MJRQMLV 5962R7802005VEA Q DS26F32MW/883 ACTIVE CFP NAD 16 19 TBD Call TI Call TI -55 to 125 DS26F32MW /883 Q 5962-78020 05MFA ACO 05MFA >T DS26F32MWRQMLV ACTIVE CFP NAD 16 19 TBD Call TI Call TI -55 to 125 DS26F32MWR QMLV Q 5962R78020 05VFA ACO 05VFA >T Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 19-Jul-2016 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF DS26F32MQML, DS26F32MQML-SP : • Military: DS26F32MQML • Space: DS26F32MQML-SP Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 19-Jul-2016 NOTE: Qualified Version Definitions: • Military - QML certified for Military and Defense Applications • Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application Addendum-Page 3 MECHANICAL DATA NFE0016A J0016A J16A (REV L) www.ti.com MECHANICAL DATA NAJ0020A E20A (Rev F) www.ti.com MECHANICAL DATA NAD0016A W16A (Rev T) www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2016, Texas Instruments Incorporated