LM45 www.ti.com SNIS117C – AUGUST 1999 – REVISED FEBRUARY 2013 LM45 SOT-23 Precision Centigrade Temperature Sensors Check for Samples: LM45 FEATURES DESCRIPTION • • • • • • • • • • • The LM45 series are precision integrated-circuit temperature sensors, whose output voltage is linearly proportional to the Celsius (Centigrade) temperature. The LM45 does not require any external calibration or trimming to provide accuracies of ±2°C at room temperature and ±3°C over a full −20 to +100°C temperature range. Low cost is assured by trimming and calibration at the wafer level. The LM45's low output impedance, linear output, and precise inherent calibration make interfacing to readout or control circuitry especially easy. It can be used with a single power supply, or with plus and minus supplies. As it draws only 120 μA from its supply, it has very low self-heating, less than 0.2°C in still air. The LM45 is rated to operate over a −20° to +100°C temperature range. 1 2 Calibrated Directly in ° Celsius (Centigrade) Linear + 10.0 mV/°C Scale Factor ±3°C Accuracy Guaranteed Rated for Full −20° to +100°C Range Suitable for Remote Applications Low Cost Due to Wafer-Llevel Trimming Operates from 4.0V to 10V Less than 120 μA Current Drain Low Self-Heating, 0.20°C in Still Air Nonlinearity Only ±0.8°C Max Over Temp Low Impedance Output, 20Ω for 1 mA Load APPLICATIONS • • • • • • • • • Battery Management FAX Machines Printers Portable Medical Instruments HVAC Power Supply Modules Disk Drives Computers Automotive Connection Diagram Figure 1. SOT-23 Top View Package Number DBZ0003A 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 1999–2013, Texas Instruments Incorporated LM45 SNIS117C – AUGUST 1999 – REVISED FEBRUARY 2013 www.ti.com Typical Applications Figure 2. Basic Centigrade Temperature Sensor (+2.5°C to +100°C) Choose R1 = −VS/50 μA VOUT = (10 mV/°C × Temp °C) VOUT = +1,000 mV at +100°C = +250 mV at +25°C = −200 mV at −20°C Figure 3. Full-Range Centigrade Temperature Sensor (−20°C to +100°C) These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) Supply Voltage +12V to −0.2V Output Voltage +V S + 0.6V to −1.0V Output Current 10 mA −65°C to +150°C Storage Temperature ESD Susceptibility (2) Human Body Model Machine Model (1) (2) 2000V 250V Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its rated operating conditions. Human body model, 100 pF discharged through a 1.5 kΩ resistor. Machine model, 200 pF discharged directly into each pin. Operating Ratings (1) (2) (3) Specified Temperature Range (4) TMIN to TMAX −20°C to +100°C LM45B, LM45C Operating Temperature Range −40°C to +125°C LM45B, LM45C Supply Voltage Range (+VS) (1) (2) (3) (4) 2 +4.0V to +10V Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its rated operating conditions. Soldering process must comply with Reflow Temperature Profile specifications. Refer to http://www.ti.com/packaging. Reflow temperature profiles are different for lead-free and non-lead-free packages. Thermal resistance of the SOT-23 package is 260°C/W, junction to ambient when attached to a printed circuit board with 2 oz. foil as shown in Figure 15. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM45 LM45 www.ti.com SNIS117C – AUGUST 1999 – REVISED FEBRUARY 2013 Electrical Characteristics Unless otherwise noted, these specifications apply for +VS = +5Vdc and ILOAD = +50 μA, in the circuit of Figure 3. These specifications also apply from +2.5°C to TMAX in the circuit of Figure 2 for +VS = +5Vdc. Boldface limits apply for TA = T J = TMIN to TMAX ; all other limits TA = TJ = +25°C, unless otherwise noted. Parameter Conditions LM45B Typical Accuracy (2) LM45C Limit (1) Typical Limit (1) T A=+25°C ±2.0 ±3.0 T A=TMAX ±3.0 ±4.0 T A=TMIN ±3.0 ±4.0 Nonlinearity (3) T MIN≤TA≤TMAX ±0.8 ±0.8 Sensor Gain (Average Slope) T MIN≤TA≤TMAX Load Regulation (4) 0≤I L≤ +1 mA Line Regulation (4) +4.0V≤+V S≤+10V Quiescent Current (5) Change of Quiescent Current (5) Minimum Temperature for Rated Accuracy Long Term Stability (1) (2) (3) (4) (5) (6) (6) +9.7 mV/°C (min) +10.3 mV/°C (max) mV/mA (max) ±35 ±0.80 ±1.2 ±1.2 +4.0V≤+V S≤+10V, +25°C 120 120 +4.0V≤+V S≤+10V 160 160 4.0V≤+V S≤10V 2.0 2.0 +2.0 T J=TMAX, for 1000 hours +2.5 ±0.12 mV/V (max) μA (max) μA (max) μA/°C +2.0 +2.5 ±0.12 °C (max) +9.7 ±35 In circuit of Figure 2, IL=0 °C (max) +10.3 ±0.80 Temperature Coefficient of Quiescent Current Units (Limit) °C (min) °C Limits are guaranteed to TI's AOQL (Average Outgoing Quality Level). Accuracy is defined as the error between the output voltage and 10 mv/°C times the device's case temperature, at specified conditions of voltage, current, and temperature (expressed in °C). Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device's rated temperature range. Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be computed by multiplying the internal dissipation by the thermal resistance. Quiescent current is measured using the circuit of Figure 2. For best long-term stability, any precision circuit will give best results if the unit is aged at a warm temperature, and/or temperature cycled for at least 46 hours before long-term life test begins. This is especially true when a small (Surface-Mount) part is wave-soldered; allow time for stress relaxation to occur. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM45 3 LM45 SNIS117C – AUGUST 1999 – REVISED FEBRUARY 2013 www.ti.com Typical Performance Characteristics To generate these curves the LM45 was mounted to a printed circuit board as shown in Figure 15. 4 Thermal Resistance Junction to Air Thermal Time Constant Figure 4. Figure 5. Thermal Response in Still Air with Heat Sink (Figure 15) Thermal Response in Stirred Oil Bath with Heat Sink Figure 6. Figure 7. Start-Up Voltage vs Temperature Quiescent Current vs Temperature (In Circuit of Figure 2) Figure 8. Figure 9. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM45 LM45 www.ti.com SNIS117C – AUGUST 1999 – REVISED FEBRUARY 2013 Typical Performance Characteristics (continued) To generate these curves the LM45 was mounted to a printed circuit board as shown in Figure 15. Quiescent Current vs Temperature (In Circuit of Figure 3) Accuracy vs Temperature (Guaranteed) Figure 10. Figure 11. Noise Voltage Supply Voltage vs Supply Current Figure 12. Figure 13. Start-Up Response Figure 14. Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM45 5 LM45 SNIS117C – AUGUST 1999 – REVISED FEBRUARY 2013 www.ti.com PRINTED CIRCUIT BOARD Printed Circuit Board Used for Heat Sink to Generate All Curves. Figure 15. ½″ Square Printed Circuit Board with 2 oz. Foil or Similar APPLICATIONS The LM45 can be applied easily in the same way as other integrated-circuit temperature sensors. It can be glued or cemented to a surface and its temperature will be within about 0.2°C of the surface temperature. This presumes that the ambient air temperature is almost the same as the surface temperature; if the air temperature were much higher or lower than the surface temperature, the actual temperature of the LM45 die would be at an intermediate temperature between the surface temperature and the air temperature. To ensure good thermal conductivity the backside of the LM45 die is directly attached to the GND pin. The lands and traces to the LM45 will, of course, be part of the printed circuit board, which is the object whose temperature is being measured. These printed circuit board lands and traces will not cause the LM45s temperature to deviate from the desired temperature. Alternatively, the LM45 can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM45 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as Humiseal and epoxy paints or dips are often used to insure that moisture cannot corrode the LM45 or its connections. Temperature Rise of LM45 Due to Self-Heating (Thermal Resistance) Still air SOT-23 SOT-23 no heat sink* small heat fin** 450°C/W 260°C/W Moving air 180°C/W Typical Applications CAPACITIVE LOADS Like most micropower circuits, the LM45 has a limited ability to drive heavy capacitive loads. The LM45 by itself is able to drive 500 pF without special precautions. If heavier loads are anticipated, it is easy to isolate or decouple the load with a resistor; see Figure 16. Or you can improve the tolerance of capacitance with a series R-C damper from output to ground; see Figure 17. Any linear circuit connected to wires in a hostile environment can have its performance affected adversely by intense electromagnetic sources such as relays, radio transmitters, motors with arcing brushes, SCR transients, etc, as its wiring can act as a receiving antenna and its internal junctions can act as rectifiers. For best results in such cases, a bypass capacitor from VIN to ground and a series R-C damper such as 75Ω in series with 0.2 or 1 μF from output to ground, as shown in Figure 17, are often useful. 6 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM45 LM45 www.ti.com SNIS117C – AUGUST 1999 – REVISED FEBRUARY 2013 Figure 16. LM45 with Decoupling from Capacitive Load Figure 17. LM45 with R-C Damper Figure 18. Temperature Sensor, Single Supply, −20°C to +100°C Figure 19. 4-to-20 mA Current Source (0°C to +100°C) Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM45 7 LM45 SNIS117C – AUGUST 1999 – REVISED FEBRUARY 2013 www.ti.com Figure 20. Fahrenheit Thermometer Figure 21. Centigrade Thermometer (Analog Meter) Figure 22. Expanded Scale Thermometer (50° to 80° Fahrenheit, for Example Shown) 8 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM45 LM45 www.ti.com SNIS117C – AUGUST 1999 – REVISED FEBRUARY 2013 Figure 23. Temperature To Digital Converter (Serial Output) (+128°C Full Scale) Figure 24. Temperature To Digital Converter (Parallel Outputs for Standard Data Bus to μP Interface) (128°C Full Scale) Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM45 9 LM45 SNIS117C – AUGUST 1999 – REVISED FEBRUARY 2013 www.ti.com * =1% or 2% film resistor -Trim RB for VB=3.075V -Trim RC for VC=1.955V -Trim RA for VA=0.075V + 100mV/°C × Tambient -Example, VA=2.275V at 22°C Figure 25. Bar-Graph Temperature Display (Dot Mode) Figure 26. LM45 With Voltage-To-Frequency Converter And Isolated Output (2.5°C to +100°C; 25 Hz to 1000 Hz) 10 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM45 LM45 www.ti.com SNIS117C – AUGUST 1999 – REVISED FEBRUARY 2013 Block Diagram Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM45 11 LM45 SNIS117C – AUGUST 1999 – REVISED FEBRUARY 2013 www.ti.com REVISION HISTORY Changes from Revision B (February 2013) to Revision C • 12 Page Changed layout of National Data Sheet to TI format .......................................................................................................... 11 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM45 PACKAGE OPTION ADDENDUM www.ti.com 4-Aug-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM45BIM3 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -20 to 100 T4B LM45BIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -20 to 100 T4B LM45BIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -20 to 100 T4B LM45CIM3 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -20 to 100 T4C LM45CIM3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -20 to 100 T4C LM45CIM3X NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI -20 to 100 T4C LM45CIM3X/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -20 to 100 T4C (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 4-Aug-2015 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 5-Dec-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) LM45BIM3 SOT-23 DBZ 3 1000 178.0 8.4 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.3 2.9 1.22 4.0 8.0 Q3 LM45BIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM45BIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM45CIM3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM45CIM3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM45CIM3X SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 LM45CIM3X/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 5-Dec-2014 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM45BIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM45BIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM45BIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM45CIM3 SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM45CIM3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0 LM45CIM3X SOT-23 DBZ 3 3000 210.0 185.0 35.0 LM45CIM3X/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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