Material Content Data Sheet Sales Product Name BC 818K-16W H6327 MA# MA000854894 Package PG-SOT323-3-1 Issued Weight* Construction Element Material Group Substances CAS# if applicable chip non noble metal noble metal inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal < 10% arsenic gold silicon silicon titanium chromium copper copper carbon black epoxy resin silicondioxide tin silver 7440-38-2 7440-57-5 7440-21-3 7440-21-3 7440-32-6 7440-47-3 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 leadframe wire encapsulation leadfinish plating *deviation 29. August 2013 Weight [mg] 5.97 mg Average Mass [%] Sum [%] Average Mass [ppm] 0.000 0.00 12 0.007 0.12 1184 0.060 1.01 0.001 0.01 0.003 0.04 441 0.008 0.13 1322 2.617 43.88 44.06 438683 440534 0.006 0.09 0.09 924 924 0.031 0.52 0.671 11.25 2.419 40.56 52.33 405567 523312 0.133 2.22 2.22 22245 22245 0.010 0.17 0.17 1678 1.13 10111 2. 3. 5233 112512 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 11307 88 Important Remarks: 1. Sum [ppm] 1678 1000000