SEMICONDUCTOR TECHNICAL DATA %,%#) )# *' #%, !'%* ! "$%*) ")! %#'$) $&*)( $ *)&*)( )) %$$+')"$ The MC74LCX541 is a high performance, non–inverting octal buffer operating from a 2.7 to 3.6V supply. This device is similar in function to the MC74LCX244, while providing flow through architecture. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5V allows MC74LCX541 inputs to be safely driven from 5V devices. The MC74LCX541 is suitable for memory address driving and all TTL level bus oriented transceiver applications. LOW–VOLTAGE CMOS OCTAL BUFFER Current drive capability is 24mA at the outputs. The Output Enable (OE1. OE2) inputs, when HIGH, disables the output by placing them in a HIGH Z condition. DW SUFFIX PLASTIC SOIC CASE 751D–04 20 • • • • • • • • Designed for 2.7 to 3.6V VCC Operation 1 5V Tolerant — Interface Capability With 5V TTL Logic Supports Live Insertion and Withdrawal IOFF Specification Guarantees High Impedance When VCC = 0V LVTTL Compatible M SUFFIX PLASTIC SOIC EIAJ CASE 967–01 20 1 LVCMOS Compatible 24mA Balanced Output Sink and Source Capability Near Zero Static Supply Current in All Three Logic States (10µA) Substantially Reduces System Power Requirements SD SUFFIX PLASTIC SSOP CASE 940C–03 20 • Latchup Performance Exceeds 500mA • ESD Performance: Human Body Model >2000V; Machine Model >200V 1 DT SUFFIX PLASTIC TSSOP CASE 948E–02 20 1 Pinout: 20–Lead (Top View) VCC OE2 O0 O1 O2 O3 O4 O5 O6 O7 20 19 18 17 16 15 14 13 12 11 1 2 3 4 5 6 7 8 9 10 OE1 D0 D1 D2 D3 D4 D5 D6 D7 GND PIN NAMES Pins Function OEn Dn On Output Enable Inputs Data Inputs 3–State Outputs 8/95 Motorola, Inc. 1996 1 REV 1 MC74LCX541 LOGIC DIAGRAM OE1 OE2 1 19 D0 D1 D2 D3 D4 D5 D6 D7 2 18 3 17 4 16 5 15 6 14 7 13 8 12 9 11 INPUTS O0 O1 O2 O3 O4 O5 O6 O7 OUTPUTS OE1 OE2 Dn On L L L L L L H H X H X Z H X X Z H = High Voltage Level; L = Low Voltage Level; Z = High Impedance State; X = High or Low Voltage Level and Transitions Are Acceptable, for ICC reasons, DO NOT FLOAT Inputs MOTOROLA 2 LCX DATA BR1339 — REV 3 MC74LCX541 ABSOLUTE MAXIMUM RATINGS* Symbol Parameter VCC DC Supply Voltage VI DC Input Voltage VO DC Output Voltage Value Condition Unit –0.5 to +7.0 V –0.5 ≤ VI ≤ +7.0 V –0.5 ≤ VO ≤ +7.0 Output in 3–State V –0.5 ≤ VO ≤ VCC + 0.5 Note 1. V IIK DC Input Diode Current –50 VI < GND mA IOK DC Output Diode Current –50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current ±50 mA ICC DC Supply Current Per Supply Pin ±100 mA IGND DC Ground Current Per Ground Pin ±100 mA TSTG Storage Temperature Range –65 to +150 °C * Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. 1. Output in HIGH or LOW State. IO absolute maximum rating must be observed. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Operating Data Retention Only Min Typ Max Unit 2.0 1.5 3.3 3.3 3.6 3.6 V 0 5.5 V 0 0 VCC 5.5 V VCC Supply Voltage VI Input Voltage VO Output Voltage IOH HIGH Level Output Current, VCC = 3.0V – 3.6V –24 mA IOL LOW Level Output Current, VCC = 3.0V – 3.6V 24 mA IOH HIGH Level Output Current, VCC = 2.7V – 3.0V –12 mA IOL LOW Level Output Current, VCC = 2.7V – 3.0V 12 mA TA Operating Free–Air Temperature ∆t/∆V Input Transition Rise or Fall Rate, VIN from 0.8V to 2.0V, VCC = 3.0V (HIGH or LOW State) (3–State) –40 +85 °C 0 10 ns/V DC ELECTRICAL CHARACTERISTICS TA = –40°C to +85°C Symbol Characteristic VIH HIGH Level Input Voltage (Note 2.) VIL LOW Level Input Voltage (Note 2.) VOH HIGH Level Output Voltage VOL LOW Level Output Voltage Condition Min 2.7V ≤ VCC ≤ 3.6V 2.0 2.7V ≤ VCC ≤ 3.6V Max V 0.8 2.7V ≤ VCC ≤ 3.6V; IOH = –100µA VCC – 0.2 VCC = 2.7V; IOH = –12mA 2.2 VCC = 3.0V; IOH = –18mA 2.4 VCC = 3.0V; IOH = –24mA 2.2 Unit V V 2.7V ≤ VCC ≤ 3.6V; IOL = 100µA 0.2 VCC = 2.7V; IOL= 12mA 0.4 VCC = 3.0V; IOL = 16mA 0.4 VCC = 3.0V; IOL = 24mA 0.55 V 2. These values of VI are used to test DC electrical characteristics only. LCX DATA BR1339 — REV 3 3 MOTOROLA MC74LCX541 DC ELECTRICAL CHARACTERISTICS (continued) TA = –40°C to +85°C Symbol Characteristic Condition Min Max Unit II Input Leakage Current 2.7V ≤ VCC ≤ 3.6V; 0V ≤ VI ≤ 5.5V ±5.0 µA IOZ 3–State Output Current 2.7 ≤ VCC ≤ 3.6V; 0V ≤ VO ≤ 5.5V; VI = VIH or V IL ±5.0 µA IOFF Power–Off Leakage Current VCC = 0V; VI or VO = 5.5V 10 µA ICC Quiescent Supply Current 2.7 ≤ VCC ≤ 3.6V; VI = GND or VCC 10 µA 2.7 ≤ VCC ≤ 3.6V; 3.6 ≤ VI or VO ≤ 5.5V ±10 µA 2.7 ≤ VCC ≤ 3.6V; VIH = VCC – 0.6V 500 µA ∆ICC Increase in ICC per Input AC CHARACTERISTICS (tR = tF = 2.5ns; CL = 50pF; RL = 500Ω) Limits TA = –40°C to +85°C VCC = 3.0V to 3.6V Symbol Parameter VCC = 2.7V Waveform Min Max Max Unit tPLH tPHL Propagation Delay Input to Output 1 1.5 1.5 6.5 6.5 7.5 7.5 ns tPZH tPZL Output Enable Time to High and Low Level 2 1.5 1.5 8.5 8.5 9.5 9.5 ns tPHZ tPLZ Output Disable Time From High and Low Level 2 1.5 1.5 7.5 7.5 8.5 8.5 ns tOSHL tOSLH Output–to–Output Skew (Note 3.) 1.0 1.0 ns 3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (tOSHL) or LOW–to–HIGH (tOSLH); parameter guaranteed by design. DYNAMIC SWITCHING CHARACTERISTICS TA = +25°C Symbol Characteristic Condition VOLP Dynamic LOW Peak Voltage (Note 4.) VCC = 3.3V, CL = 50pF, VIH = 3.3V, VIL = 0V Min Typ 0.8 Max Unit V VOLV Dynamic LOW Valley Voltage (Note 4.) VCC = 3.3V, CL = 50pF, VIH = 3.3V, VIL = 0V 0.8 V 4. Number of outputs defined as “n”. Measured with “n–1” outputs switching from HIGH–to–LOW or LOW–to–HIGH. The remaining output is measured in the LOW state. CAPACITIVE CHARACTERISTICS Symbol Parameter Condition Typical Unit CIN Input Capacitance VCC = 3.3V, VI = 0V or VCC 7 pF COUT Output Capacitance VCC = 3.3V, VI = 0V or VCC 8 pF CPD Power Dissipation Capacitance 10MHz, VCC = 3.3V, VI = 0V or VCC 25 pF MOTOROLA 4 LCX DATA BR1339 — REV 3 MC74LCX541 2.7V Dn 1.5V 1.5V 0V tPLH tPHL VOH 1.5V On 1.5V VOL WAVEFORM 1 – PROPAGATION DELAYS tR = tF = 2.5ns, 10% to 90%; f = 1MHz; tW = 500ns 2.7V 1.5V OEn 0V tPZH tPHZ VCC VOH – 0.3V 1.5V On ≈ 0V tPZL tPLZ ≈ 3.0V 1.5V On VOL + 0.3V GND WAVEFORM 2 – OUTPUT ENABLE AND DISABLE TIMES tR = tF = 2.5ns, 10% to 90%; f = 1MHz; tW = 500ns Figure 1. AC Waveforms VCC PULSE GENERATOR R1 DUT CL RT TEST 6V OPEN GND RL SWITCH tPLH, tPHL Open tPZL, tPLZ 6V Open Collector/Drain tPLH and tPHL 6V tPZH, tPHZ GND CL = 50pF or equivalent (Includes jig and probe capacitance) RL = R1 = 500Ω or equivalent RT = ZOUT of pulse generator (typically 50Ω) Figure 2. Test Circuit LCX DATA BR1339 — REV 3 5 MOTOROLA MC74LCX541 OUTLINE DIMENSIONS DW SUFFIX PLASTIC SOIC PACKAGE CASE 751D–04 ISSUE E –A – 20 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.150 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 1 –B – P 10 PL A B 0.010 (0.25) B M M 10 D 20 PL J 0.010 (0.25) M T S S DIM A B C D F G J K M P R F R X 45° C –T G 18 PL M SEATING – PLANE K MILLIMETERS MIN MAX 12.65 12.95 7.40 7.60 2.35 2.65 0.35 0.49 0.50 0.90 1.27 BSC 0.25 0.32 0.10 0.25 0° 7° 10.05 10.55 0.25 0.75 INCHES MIN MAX 0.499 0.510 0.292 0.299 0.093 0.104 0.014 0.019 0.020 0.035 0.050 BSC 0.010 0.012 0.004 0.009 0° 7° 0.395 0.415 0.010 0.029 M SUFFIX PLASTIC SOIC EIAJ PACKAGE CASE 967–01 ISSUE O 20 NOTES: 1 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2 CONTROLLING DIMENSION: MILLIMETER. 3 DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS AND ARE MEASURED AT THE PARTING LINE. MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4 TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 5 THE LEAD WIDTH DIMENSION (b) DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE LEAD WIDTH DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON THE LOWER RADIUS OR THE FOOT. MINIMUM SPACE BETWEEN PROTRUSIONS AND ADJACENT LEAD TO BE 0.46 ( 0.018). LE 11 Q1 E HE M_ L 10 1 DETAIL P Z D e VIEW P A c A1 b 0.13 (0.005) MOTOROLA M 0.10 (0.004) 6 DIM A A1 b c D E e HE L LE M Q1 Z MILLIMETERS MIN MAX --2.05 0.05 0.20 0.35 0.50 0.18 0.27 12.35 12.80 5.10 5.45 1.27 BSC 7.40 8.20 0.50 0.85 1.10 1.50 10 _ 0_ 0.70 0.90 --0.81 INCHES MIN MAX --0.081 0.002 0.008 0.014 0.020 0.007 0.011 0.486 0.504 0.201 0.215 0.050 BSC 0.291 0.323 0.020 0.033 0.043 0.059 10 _ 0_ 0.028 0.035 --0.032 LCX DATA BR1339 — REV 3 MC74LCX541 OUTLINE DIMENSIONS SD SUFFIX PLASTIC SSOP PACKAGE CASE 940C–03 ISSUE B 20X K REF 0.12 (0.005) T U M V S S NOTES: 13 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 14 CONTROLLING DIMENSION: MILLIMETER. 15 DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 16 DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 17 DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION/INTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF K DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR INTRUSION SHALL NOT REDUCE DIMENSION K BY MORE THAN 0.07 (0.002) AT LEAST MATERIAL CONDITION. 18 TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 19 DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–. 0.25 (0.010) N 20 L/2 11 M N B L F PIN 1 IDENT 1 10 DETAIL E ÉÉÉ ÇÇÇ ÇÇÇ ÉÉÉ K –U– A –V– 0.20 (0.008) M T U J S J1 DIM A B C D F G H J J1 K K1 L M K1 SECTION N–N –T– –W– C 0.076 (0.003) SEATING PLANE D G DETAIL E H 20X 0.15 (0.006) T U K REF M T U S V S ÍÍÍÍ ÍÍÍÍ ÍÍÍÍ K K1 2X L/2 20 11 B L J J1 –U– PIN 1 IDENT SECTION N–N 1 10 0.25 (0.010) N 0.15 (0.006) T U S NOTES: 6 DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 7 CONTROLLING DIMENSION: MILLIMETER. 8 DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 9 DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 10 DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 11 TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 12 DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE –W–. M A –V– N F DETAIL E –W– C D G INCHES MIN MAX 0.278 0.288 0.205 0.212 0.068 0.078 0.002 0.008 0.024 0.037 0.026 BSC 0.023 0.030 0.003 0.008 0.003 0.006 0.010 0.015 0.010 0.013 0.301 0.311 0_ 8_ DT SUFFIX PLASTIC TSSOP PACKAGE CASE 948E–02 ISSUE A 0.10 (0.004) S MILLIMETERS MIN MAX 7.07 7.33 5.20 5.38 1.73 1.99 0.05 0.21 0.63 0.95 0.65 BSC 0.59 0.75 0.09 0.20 0.09 0.16 0.25 0.38 0.25 0.33 7.65 7.90 0_ 8_ H DETAIL E 0.100 (0.004) –T– SEATING DIM A B C D F G H J J1 K K1 L M MILLIMETERS MIN MAX 6.40 6.60 4.30 4.50 ––– 1.20 0.05 0.15 0.50 0.75 0.65 BSC 0.27 0.37 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 BSC 0_ 8_ INCHES MIN MAX 0.252 0.260 0.169 0.177 ––– 0.047 0.002 0.006 0.020 0.030 0.026 BSC 0.011 0.015 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 BSC 0_ 8_ PLANE LCX DATA BR1339 — REV 3 7 MOTOROLA MC74LCX541 Motorola reserves the right to make changes without further notice to any products herein. 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