Datasheet D/A Converter Series for Electronic Adjustment 10bit 4ch/6ch D/A Converters BU2507FV BU2508FV General Description Key Specifications The BU2507FV and BU2508FV ICs are 10bit R-2R type D/A converters with 6ch and 4ch outputs, respectively. Each channel incorporates a full swing output-type buffer amplifier with high speed output response characteristics, resulting in a greatly shortened D/A output settling time. The ICs also have digital input pins compatible with TTL levels, and the maximum value of the data transfer frequency is 10MHz. With the variable output range function, the upper and lower limits of the output voltage can be set separately from the power supply voltage. ■ Operating Supply Voltage Range： ■ Number of Channels： BU2507FV： BU2508FV： ■ Differential Non Linearity Error： ■ Integral Non Linearity Error： ■ Data Transfer Frequency： Packages 6ch 4ch ±1.0LSB(Max) ±3.5LSB(Max) 10MHz(Max) W(Typ) x D(Typ) x H(Max) 5.00mm x 6.40mm x 1.35mm SSOP-B14 Features 4.5V to 5.5V ■ Built-in Multi-channel R-2R Type 10bit D/A Converter (BU2508FV: 4 Channels, BU2507FV: 6 Channels) ■ Built-in Full Swing Output Buffer Amplifier for All Channels ■ RESET Terminal to fix the Output Voltage to the Lower Reference Level for All Channels ■ Digital Inputs Compatible with TTL Levels ■ 3-wire Serial Interface and RESET Signal to send a 14bit Format Word (4bit Address and 10bit Data) Applications SSOP-B14 ■ Control of the Various Types of Consumer and Industrial Equipment Typical Application Circuit VCC VCC VDD VrefH (VrefH) VSS VrefL (VrefL) AO1 AO1 CH1 CH1 AO2 AO2 CH2 CH2 AO3 AO3 CH3 CH3 AO6 AO6 CH6 CH6 RESET Reset Controller Controller ○Product structure：Silicon monolithic integrated circuit www.rohm.com © 2015 ROHM Co., Ltd. All rights reserved. p TSZ22111・14・001 LD LD CLK CLK DI DI GND GND ○This product has no designed protection against radioactive rays. 1/17 TSZ02201-0RLR0GZ10150-1-2 11.Dec.2015 Rev.001 BU2507FV BU2508FV Pin Configurations SSOP-B14 (TOP VIEW) 14 13 12 11 10 9 8 1 2 3 4 5 6 7 Pin Descriptions Description of terminal No. Terminal name Analog / Digital I/O 1 VSS Analog - D/A converter lower side reference voltage (VrefL) input terminal 5 2 AO2 Analog O 10bit D/A output (CH2) 3 3 AO3(TEST1) Analog O 10bit D/A output (CH3) 4 RESET Digital I Fixes the output voltage to the lower reference level for all channels. 5 AO4(TEST2) Digital I 10bit D/A output (CH4) test terminal 6 AO5 (AO3) Analog O 10bit D/A output (CH5) 10bit D/A output (CH3) 7 VDD Analog - D/A converter upper reference voltage (VrefH) input terminal 4 8 VCC - - Power supply - 9 AO6 (AO4) Analog O 10bit D/A output (CH6) 10 LD Digital I 11 CLK Digital I 12 DI Digital I 13 AO1 Analog O 10bit D/A output (CH1) 3 14 GND - - GND terminal - BU2507FV BU2508FV test terminal (Note 1) (Note 1) 10bit D/A output (CH4) When the LD terminal is set to the high level voltage, 14bit data in the shift register is loaded on to the address decoder and a specified D/A output register. Shift clock input terminal. At the rising edge of the CLK input, an input value on the DI terminal is input to the 14bit shift register. Serial data input terminal. Serial data length is 14bit (4bit address and 10bit data). Equivalent circuit No. 3 2 3 3 3 1 1 1 (Note 1) The TEST1 and TEST2 terminals of the BU2508FV should be left open. These terminals are used for testing. www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 2/17 TSZ02201-0RLR0GZ10150-1-2 11.Dec.2015 Rev.001 BU2507FV BU2508FV Block Diagrams VDD (VrefH) 7 6 AO3 TEST2 5 4 Reset RESET 10bit R-2R converter DA D/Aｺﾝﾊﾞｰﾀ 10bit R-2R 10bit Latch 3 converter DA D/Aｺﾝﾊﾞｰﾀ Address ｱﾄﾞﾚｽ decoder ﾃﾞｺｰﾀﾞ ・・・ 10bit Latch 4 10bit R-2R converter DA D/Aｺﾝﾊﾞｰﾀ D13 12 11 D10 D9 8 6 4 14bit 7 5 2 3 3 2 AO2 1 VSS (VrefL) Buffer ﾊﾞｯﾌｧ operation ｵﾍﾟｱﾝﾌﾟ amplifier 10bit Latch CH2 10bit Latch CH1 TEST1 D0 1 10bit R-2R converter DA D/Aｺﾝﾊﾞｰﾀ DI 13 14 12 AO1 GND 3 AO3 2 AO2 1 VSS (VrefL) Buffer ﾊﾞｯﾌｧ operation amplifier ｵﾍﾟｱﾝﾌﾟ 10bit Latch 10bit Latch 10bit Latch CH1 CH2 D0 10bit R-2R converter DA D/Aｺﾝﾊﾞｰﾀ DI 13 14 12 AO1 GND register Shift シフトレジスタ VCC 8 9 AO4 LD 10 11 CLK 7 6 AO5 AO4 5 4 Reset RESET 10bit R-2R converter DA D/Aｺﾝﾊﾞｰﾀ 10bit R-2R converter DA D/Aｺﾝﾊﾞｰﾀ 10bit R-2R converter DA D/Aｺﾝﾊﾞｰﾀ 10bit R-2R converter DA D/Aｺﾝﾊﾞｰﾀ 5 10bit Latch 10bit Latch 4 3 Address ｱﾄﾞﾚｽ decoder ﾃﾞｺｰﾀﾞ ・・・ 10bit Latch 6 10bit R-2R converter DA D/Aｺﾝﾊﾞｰﾀ D13 12 11 D10 D9 8 7 6 1 2 3 4 5 VDD (VrefH) BU2508FV 8 14bit Shift register シフトレジスタ AO6 9 10 LD CLK 11 VCC BU2507FV Absolute Maximum Ratings(TA=25°C) Parameter Symbol Rating Unit Supply voltage VCC 6.0 V D/A converter upper reference voltage VDD 6.0 V Input voltage VIN 6.0 V VOUT 6.0 V Output voltage Power dissipation PD Storage temperature range Tstg 0.70 (Note 2) -55 to +125 W °C (Note 2) Derate by 7.0mW/°C when operating above TA=25°C (when mounted on ROHM’s standard board). Mounted on a FR4 glass epoxy PCB 70mm x 70mm x 1.6mm (copper foil area less than 3%). Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions Parameter Symbol Limit Unit Power supply voltage range VCC 4.5 to 5.5 V Operating temperature range Topr -30 to +85 °C www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 3/17 TSZ02201-0RLR0GZ10150-1-2 11.Dec.2015 Rev.001 BU2507FV BU2508FV Electrical Characteristics(Unless otherwise specified, VCC=5V, VrefH=5V, VrefL=0V, TA=25°C) Parameter Symbol Limit Min Typ Max Unit Conditions <Digital unit> Supply current ICC - 0.85 2.8 mA At CLK=10MHz, IAO=0μA Input leak current IILK -5 - +5 μA VIN=0V to VCC Input voltage L VIL - - 0.8 V - Input voltage H VIH 2.0 - - V - Output voltage L VOL 0 - 0.4 V IOL=+2.5mA Output voltage H VOH 4.6 - 5 V IOH=-2.5mA - 4.5 7.5 mA Data condition : at maximum current - 2.0 3.4 mA (Note 3) VrefH 3.0 - 5 V VrefL 0 - 1.5 V 0.1 - 4.9 0.2 - 4.75 <Analog unit> Consumption current D/A converter upper reference voltage setting range D/A converter lower reference voltage setting range Buffer amplifier output voltage range Buffer amplifier output drive range Precision IrefH - VO V IO -2 - +2 Differential non-linearity error DNL -1.0 - +1.0 Integral non-linearity error INL -3.5 - +3.5 Zero point error SZERO -25 - +25 Full scale error SFULL -25 - +25 RO - 5 15 Ω Rup 12.5 25 37.5 kΩ Buffer amplifier output impedance Pull-up I/O internal resistance value (Note 4) mA LSB mV IO=±100μA IO=±1.0mA High side saturation voltage =0.35V (on full scale setting, current sourcing) Low side saturation voltage =0.23V (on zero scale setting, current sinking) VrefH =4.796V VrefL=0.7V VCC=5.5V (4mV/LSB) At no load (IO=+0mA ) Input voltage = 0V (The resistance value has input voltage dependence) (Note 3) Under the condition that CH1 to CH4 are set to maximum current (Note 4) The specification is applied to pin 4 (RESET) www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 4/17 TSZ02201-0RLR0GZ10150-1-2 11.Dec.2015 Rev.001 BU2507FV BU2508FV Timing Characteristics(Unless otherwise specified, VCC=5V, VrefH=5V, VrefL=0V, TA=25°C) Limits Parameter Symbol Min Typ Max Unit Conditions The voltage levels of the measured time points are 20% or 80% of VCC. Reset L pulse width tRTL 50 - - - Clock L pulse width tCKL 50 - - - Clock H pulse width tCKH 50 - - - Clock rise time tcr - - 50 - Clock fall time tcf - - 50 Data setup time tDCH 20 - - Data hold time tCHD 40 - - - Load setup time tCHL 50 - - - Load hold time tLDC 50 - - - Load H pulse width tLDH 50 - - - ns - (Note 5) D/A output settling time tLDD - 7 20 μs CL≤100pF , VO: 0.5V↔4.5V The time interval from the start time to change an output voltage to the time at which the output voltage reaches to its final value within 1/2 LSB. (Note 5) A capacitor should be placed between the analog output and ground in order to eliminate noise. A capacitance up to 100pF is recommended (including the capacitance of the wire). RESET tRTL tcr tCKH tcf CLK tCKL tLDC DI tLDH tDCH LD tCHD tCHL tLDD Output Applicational information LD input The LD input is a level trigger signal. When LD=H, an internal shift register value is loaded into a latch. It doesn’t have to be cared whether CLK is H or L when LD changes to H. However CLK must not be changed while LD is H. The shift register values pass through the latches if LD=H and CLK is toggled. Power-on operation The BU2507FV and the BU2508FV does not have a power-on reset function. Therefore, after power-on, data in the internal registers are unknown. When RESET changes from H to L, all latch outputs turn into L, although the shift registers are not reset. Pull-down resister Pin 4 is pulled up internally. If putting the external pull-down resister on it, the recommended value is less than 1kΩ. Truth Table Pin 4: RESET www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 L H Reset Normal 5/17 TSZ02201-0RLR0GZ10150-1-2 11.Dec.2015 Rev.001 BU2507FV BU2508FV D/A Converter Variable Output Range Function BU2507FV and BU2508FV have terminals with which the upper and lower limits of the output voltage range can be changed separately. The upper limit of the output voltage range is set with the VrefH terminal and the lower limit is set with VrefL terminal. In general usage, the VrefH terminal is connected to the VCC terminal and the V refL terminal is connected to the GND terminal. When the power supply voltage on the VCC terminal is 5V, 1LSB is almost 5mV. In other cases, it is possible to achieve a finer resolution. For example, if VrefH = 3.5V and VrefL = 1.5V, then 1LSB is almost 2mV. VOUT VOUT 5V 5V 3.5V 1024 step ステップ 1024 step ステップ 0V 000h 1.5V 0V 3FFh Input Code 000h 1LSB≈5.0mV www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 VrefH VrefL 3FFh Input Code 1LSB≈2.0mV 6/17 TSZ02201-0RLR0GZ10150-1-2 11.Dec.2015 Rev.001 BU2507FV BU2508FV Command Transmission 1) In the case of BU2507FV (1) Data format [data : LSB first] D13 D12 D11 D/ D10 D9 D8 D7 D6 D5 D4 D3 A converter output setting DATA D2 D1 D3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 D0 address select (2) Data timing diagram ADDRESS LSB D0 DI ADDRESS MSB D1 D2 DATA LSB D3 DATA MSB D4 D11 D12 D13 CLK LD DACOUT D2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 D1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 D0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Address selection n/a n/a AO1 AO2 n/a AO3 AO4 n/a AO5 AO6 n/a n/a n/a n/a n/a n/a D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D/A output (VrefH=VDD, VrefL=VSS) 0 0 0 0 ： 1 1 0 0 0 0 ： 1 1 0 0 0 0 ： 1 1 0 0 0 0 ： 1 1 0 0 0 0 ： 1 1 0 0 0 0 ： 1 1 0 0 0 0 ： 1 1 0 0 0 0 ： 1 1 0 0 1 1 ： 1 1 0 1 0 1 ： 0 1 VrefL (VrefH-VrefL)/1024×1+VrefL (VrefH-VrefL)/1024×2+VrefL (VrefH-VrefL)/1024×3+VrefL : (VrefH-VrefL)/1024×1022+VrefL (VrefH-VrefL)/1024×1023+VrefL 2) In the case of BU2508FV (1) Data format [Data: LSB first ] D13 D12 D11 D/ D10 D9 D8 D7 D6 D5 D4 A converter output setting DATA D3 D2 D1 D3 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 D0 address select (2) Data timing diagram ADDRESS LSB DI D0 ADDRESS MSB D1 D2 DATA LSB D3 DATA MSB D4 D11 D12 D13 CLK LD DACOUT D13 0 0 0 0 ： 1 1 D12 0 0 0 0 ： 1 1 D11 0 0 0 0 ： 1 1 D10 0 0 0 0 ： 1 1 www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 D9 0 0 0 0 ： 1 1 D8 0 0 0 0 ： 1 1 D7 0 0 0 0 ： 1 1 D6 0 0 0 0 ： 1 1 7/17 D5 0 0 1 1 ： 1 1 D2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 D4 0 1 0 1 ： 0 1 D1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1 D0 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Address selection n/a n/a AO1 AO2 n/a n/a n/a n/a AO3 AO4 n/a n/a n/a n/a n/a n/a D/A output (VrefH=VDD, VrefL=VSS) VrefL (VrefH-VrefL)/1024×1+VrefL (VrefH-VrefL)/1024×2+VrefL (VrefH-VrefL)/1024×3+VrefL : (VrefH-VrefL)/1024×1022+VrefL (VrefH-VrefL)/1024×1023+VrefL TSZ02201-0RLR0GZ10150-1-2 11.Dec.2015 Rev.001 BU2507FV BU2508FV 6 6 5 5 4 4 VOUT [V] VOUT [V] Typical Performance Curves (reference data) 3 3 2 2 1 1 0 0 0 200 400 600 800 1000 1200 0 200 400 600 800 1000 1200 Input Code [decimal] Input Code [decimal] Figure 2. VOUT vs Input Code (Output voltage linearity, TA=+25°C) Figure 1. VOUT vs Input Code (Output voltage linearity, TA=-30°C) 6 5 VOUT [V] 4 3 2 1 0 0 200 400 600 800 1000 1200 Input Code [decimal] Figure 3. VOUT vs Input Code (Output voltage linearity, TA=+85°C) www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 8/17 TSZ02201-0RLR0GZ10150-1-2 11.Dec.2015 Rev.001 BU2507FV BU2508FV 1.5 1.5 1 1 0.5 0.5 DNL [LSB] DNL [LSB] Typical Performance Curves(reference data) - continued 0 0 -0.5 -0.5 -1 -1 -1.5 -1.5 0 200 400 600 800 1000 0 1200 Input Code [decimal] 200 400 600 800 1000 1200 Input Code [decimal] Figure 4. DNL vs Input Code (Differential linearity error, TA=-30°C) Figure 5. DNL vs Input Code (Differential linearity error, TA=+25°C) 1.5 1 DNL [LSB] 0.5 0 -0.5 -1 -1.5 0 200 400 600 800 1000 1200 Input Code [decimal] Figure 6. DNL vs Input Code (Differential linearity error, TA=+85°C) www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 9/17 TSZ02201-0RLR0GZ10150-1-2 11.Dec.2015 Rev.001 BU2507FV BU2508FV Typical Performance Curves(reference data) - continued 1 1 0.5 0.5 INL [LSB] 1.5 INL [LSB] 1.5 0 0 -0.5 -0.5 -1 -1 -1.5 -1.5 0 200 400 600 800 1000 1200 0 Input Code [decimal] 200 400 600 800 1000 1200 Input Code [decimal] Figure 7. INL vs Input Code (Integral linearity error, TA=-30°C) Figure 8. INL vs Input Code (Integral linearity error, TA=+25°C) 1.5 1 INL [LSB] 0.5 0 -0.5 -1 -1.5 0 200 400 600 800 1000 1200 Input Code [decimal] Figure 9. INL vs Input Code (Integral linearity error, TA=+85°C) www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 10/17 TSZ02201-0RLR0GZ10150-1-2 11.Dec.2015 Rev.001 BU2507FV BU2508FV Typical Performance Curves(reference data) - continued 6 2.52 5 2.51 TA=25°C VOUT [V] ICC [mA] 4 code=1FFh 3 TA=-30°C 2.5 TA=85°C 2 2.49 code=000h 1 code=3FFh 0 2.48 -40 10 60 -2.5 Temp. [°C] -1.5 -0.5 0.5 1.5 2.5 IOUT [mA] Figure 11. VOUT vs IOUT (Output load fluctuation characteristic(input code: 1FFh)) Figure 10. ICC vs Temp (Circuit current temperature characteristic) 40 35 TA=85°C RUP [kΩ] 30 TA=25°C 25 20 TA=-30°C 15 10 4 4.2 4.4 4.6 4.8 5 5.2 5.4 5.6 5.8 6 VIN [V] Figure 12. RUP vs VIN (Built-in Pull-up resistance characteristic) www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 11/17 TSZ02201-0RLR0GZ10150-1-2 11.Dec.2015 Rev.001 BU2507FV BU2508FV Power Dissipation Power dissipation(total loss) indicates the power that can be consumed by IC at TA=25°C (normal temperature).IC is heated when it consumed power, and the temperature of IC chip becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the package. The parameter which indicates this heat dissipation capability(hardness of heat release)is called thermal resistance, represented by the symbol θJA°C/W. The temperature of IC inside the package can be estimated by this thermal resistance. Figure 13(a) shows the model of thermal resistance of the package. Thermal resistance θJA, ambient temperature TA, junction temperature TJmax, and power dissipation PD can be calculated by the equation below θJA = (TJmax - TA) / PD °C /W Derating curve in Figure 13(b) indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θJA. Thermal resistance θJA depends on chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 14(a) show a derating curve for an example of BU2507FV and BU2508FV. Power dissipation Power of LSI LSI [W] の消 LSIのdissipation 消 費 電 力 [W] 費電力 θJA =(TJmax-TA)/P PPd D(max) (max) °C /W θ JA2 < JA1 θja2 < θθja1 P2 Ambient temperature TA[°C] 周囲温度 Ta [℃] θ’ θ'JA2 ja2 P1 θ’θ'JA1 ja1 0 表面温度 Tj Chip surfaceチップ temperature TJ[℃] [°C] 消費電力 P [W] (a) Thermal Resistance θθJA2 ja2 T’Jmax TJmax Tj ' (max) Tj (max) θθJA1 ja1 25 50 75 100 125 Ambient TA [℃ [ °C][°C ] ] 周 囲 温 度 Ta Ambient temperature T A temperature 周囲温度 150 (b) Derating Curve Figure 13. Thermal resistance and derating curve (a) BU2507FV・BU2508FV Derating curve UNIT 7.0 mW/°C When using the IC above TA=25°C, subtract the value above per °C Mounted on a FR4 glass epoxy board 70mm x 70mm x 1.6mm (cooper foil area less than 3%). Figure 14. Derating curve www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 12/17 TSZ02201-0RLR0GZ10150-1-2 11.Dec.2015 Rev.001 BU2507FV BU2508FV I/O Equivalent Circuit No. (Note 6) Equivalent circuit 1 (Note 7) *1 2 3 ・ 4 3 4 ・ 5 5 (Note 6) Please refer to the equivalent circuit number in the Pin Descriptions table. (Note 7) 25kΩ at VCC = 5.0V (changes according to the applied voltage) www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 13/17 TSZ02201-0RLR0GZ10150-1-2 11.Dec.2015 Rev.001 BU2507FV BU2508FV Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 14/17 TSZ02201-0RLR0GZ10150-1-2 11.Dec.2015 Rev.001 BU2507FV BU2508FV Operational Notes – continued 12. Regarding the Input Pin of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC. 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. 14. Area of Safe Operation (ASO) Operate the IC such that the output voltage, output current, and power dissipation are all within the Area of Safe Operation (ASO). Ordering Information B U 2 Part Number 5 0 5:BU2507FV 6:BU2508FV x F V - Package FV:SSOP-B14 E2 Packaging and forming specification E2: Embossed tape and reel Marking Diagrams SSOP-B14(TOP VIEW) SSOP-B14(TOP VIEW) Part Number Marking 2 5 0 7 F V LOT Number 2 5 0 8 F V 1PIN MARK www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 Part Number Marking LOT Number 1PIN MARK 15/17 TSZ02201-0RLR0GZ10150-1-2 11.Dec.2015 Rev.001 BU2507FV BU2508FV Physical Dimension, Tape and Reel Information Package Name www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 SSOP-B14 16/17 TSZ02201-0RLR0GZ10150-1-2 11.Dec.2015 Rev.001 BU2507FV BU2508FV Revision History Date Revision 11.Dec.2015 001 Changes New Release www.rohm.co.jp © 2015 ROHM Co., Ltd. All rights reserved. TSZ22111・15・001 17/17 TSZ02201-0RLR0GZ10150-1-2 11.Dec.2015 Rev.001 Datasheet Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) , transport intend to use our Products in devices requiring extremely high reliability (such as medical equipment equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label QR code printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BU2507FV - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BU2507FV SSOP-B14 2500 2500 Taping inquiry Yes