Product Folder Sample & Buy Support & Community Tools & Software Technical Documents LMH3404 SBOS739 – MAY 2016 1 Features 3 Description • • • • • • • • The LMH3404 is a very high-performance, dual, differential amplifier optimized for radio frequency (RF), intermediate frequency (IF), or high-speed timedomain applications. The device is ideal for dc- or accoupled applications that use differential-to-differential (Diff-Diff) or single-ended-to-differential (SE-Diff) conversion when driving an analog-to-digital converter (ADC). The LMH3404 generates very low levels of second- and third-order distortion when operating in SE-Diff or Diff-Diff mode. 1 • • • • • 3-dB Bandwidth: 7 GHz Excellent Linearity Performance: DC to 2 GHz Fixed Differential-to-Differential Gain: 20 dB Channel Gain Matching: 0.04 dB Channel Phase Matching: TBD Crosstalk at 1 GHz: –60 dBc Slew Rate: 17,500 V/µs Low Harmonic Distortion (2-VPP, 200-Ω, Diff-Diff Configuration): – 500 MHz: HD2 at –78 dBc, HD3 at –78 dBc – 1 GHz: HD2 at –65 dBc, HD3 at –72 dBc – 2 GHz: HD2 at –55 dBc, HD3 at –40 dBc Low Intermodulation Distortion (2-VPP, 200-Ω, Diff-Diff Configuration): – 500 MHz: IMD2 at –85 dBc, IMD3 at –88 dBc – 1 GHz: IMD2 at –65 dBc, IMD3 at –71 dBc – 2 GHz: IMD2 at –46 dBc, IMD3 at –60 dBc Input Voltage Noise: 1.3 nV/√Hz Supports Single- and Dual-Supply Operation Power Consumption: 56 mA per Channel Power-Down Feature 2 Applications • • • • • • • • • GSPS ADC Drivers IQ Demodulation Receiver Dual ADC Drivers ADC Drivers for Ultra Wide-Band or Narrow-Band Data Acquisition Single-Ended to Differential Signal Conversions DAC Buffers IF, RF, and Baseband Gain Blocks SAW Filter Buffers and Drivers Balun Replacement DC to 2 GHz Level Shifters The device has unprecedented usable bandwidth from dc to 2 GHz. The LMH3404 can be used as a very wide-band ADC driver and also for SE-Diff conversions in the signal chain without external baluns. The performance is ideal for a wide range of applications such as test and measurement, broadband communications, and high-speed data acquisition. A common-mode reference input pin is provided to align the amplifier output common-mode with the ADC input requirements. Power supplies between 3.15 V and 5.25 V can be selected and dual-supply operation is supported when required by the application. A power-down feature is also available for power saving. This level of performance is achieved at a very low power level of 280 mW per channel when a 5.0-V supply is used. The device is fabricated in Texas Instruments' advanced complementary BiCMOS process and is available in a space-saving, 24-pin, VQFN package for higher performance. Device Information(1) DEVICE NAME LMH3404 PACKAGE VQFN (24) BODY SIZE 4.00 mm × 4.00 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. LMH3404 Differential Small-Signal Frequency Response 30 Voltage Gain (dB) 20 10 0 -10 -20 -30 -40 10M 100M 1G Frequency (Hz) 10G D001 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCT PREVIEW Information. Product in design phase of development. Subject to change or discontinuance without notice. PRODUCT PREVIEW LMH3404 Dual, 7-GHz, Low-Noise, Low-Power, Fully-Differential Amplifier LMH3404 SBOS739 – MAY 2016 www.ti.com 4 Device and Documentation Support 4.1 Device Support 4.1.1 Device Nomenclature LMH3404 IRGE TI YMS = Pin 1 Designator LMH3403 = Device Name TI = TI LETTERS YM = YEAR MONTH DATE CODE LLLL = ASSY LOT CODE LLLL S = ASSEMBLY SITE CODES Figure 1. Device Marking Information 4.2 Documentation Support PRODUCT PREVIEW 4.2.1 Related Documentation For related documentation see the following: • LMH3401 Data Sheet, SBOS695 • LMH5401 Data Sheet, SBOS710 • LMH6552 Data Sheet, SNOSAX9 • LMH6554 Data Sheet, SNOSB30 • ADS12D1800RF Data Sheet, SNAS518 • ADS5424 Data Sheet, SLWS157 • ADS5485 Data Sheet, SLAS610 • ADS6149 Data Sheet, SLWS211 • ADS4149 Data Sheet, SBAS483 • LMH3404EVM Evaluation Module, SBOU124 • AN-2188 Between the Amplifier and the ADC: Managing Filter Loss in Communications Systems, SNOA567 • AN-2235 Circuit Board Design for LMH6517/21/22 and Other High-Speed IF/RF Feedback Amplifiers, SNOA869 • LMH3404 TINA model, SBOM920 4.3 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 2 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: LMH3404 LMH3404 www.ti.com SBOS739 – MAY 2016 4.4 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 4.5 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 4.6 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 5 Mechanical, Packaging, and Orderable Information PRODUCT PREVIEW The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: LMH3404 3 PACKAGE OPTION ADDENDUM www.ti.com 16-May-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LMH3404IRGER PREVIEW VQFN RGE 24 3000 TBD Call TI Call TI -40 to 85 LMH3404 IRGE LMH3404IRGET PREVIEW VQFN RGE 24 250 TBD Call TI Call TI -40 to 85 LMH3404 IRGE (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. 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