Product Line Card Intel Embedded Solutions ® Intel in Embedded. Roadmap to your Future. www.intel.com/ go/embedded Intel is expanding its commitment to embedded developers with a range of leading-edge processors, flash memory, building blocks, tools, and technologies to help you meet stringent platform requirements and competitive development schedules. Wherever your embedded designs take you, from industrial control and automation to handheld transaction terminals or innovative medical imaging devices, Intel provides an embedded product roadmap to help you deliver innovative solutions while overcoming development challenges. Embedded Intel® Architecture Platforms Low Power ICH Features MCH Features CPU Features Intel® Pentium® M Processor, Intel® Pentium® M Processor Low Voltage, Intel® 855GME Chipset, Intel® 6300ESB ICH Intel® Pentium® M Processor, Intel® Pentium® M Processor Low Voltage, Intel® 915GM Express Chipset, Intel® ICH6-M Intel® Pentium® M Processor, Intel® E7520 Chipset, Intel® 6300ESB ICH Intel® Pentium® M Processor, Intel® Pentium® M Processor Low Voltage, Intel® E7320 Chipset, Intel® 6300ESB ICH Intel® Celeron® M Processor, Ultra Low Voltage Intel® Celeron® M Processor, Intel® 915GM Express Chipset, Intel® ICH6-M Process 0.13µ / 90nm1 90nm 90nm 90nm 90nm Performance Freqency 1.6/400, 1.8/4001 1.8/400, 2.0/533 2.0/533, 1.8/400 1.8/400 1.5/400 LV Frequency 1.1/400, 1.4/4001 1.4/400 1.4/400 1.4/400 1.0/400 Performance TDP 24.5W, 21W1 27W1 27W, 21W 21W 21W LV TDP 12W, 10W1 10W 10W 10W 5.5W Intel® Extended Memory 64 Technology Support3 No No No No No L2 Cache 1M, 2M1 2M 2M 2M 1M, 512k Performance Vcc 1.484V, 1.276 – 1.340V1 1.260 – 1.356V 1.260 – 1.356V 1.260 – 1.356V 1.26V LV Vcc 1.18V, 1.116V1 1.116V 1.116V 1.116V 0.94V1 TjMax 100˚C, 100˚C1 100˚C 100˚C 100˚C 100˚C Package(s) µFC-BGA, µFC-PGA (LV 1.1 and 1.41 GHz µFC-BGA only) SSE Support SSE2 SSE2 SSE2 SSE2 SSE2 Enhanced Intel SpeedStep® Technology Yes Yes Yes Yes No µFC-BGA, µFC-PGA µFC-BGA, µFC-PGA µFC-BGA, µFC-PGA (LV 1.4 GHz µFC-BGA only) (LV 1.4 GHz µFC-BGA only) (LV 1.4 GHz µFC-BGA only) µFC-BGA, µFC-PGA, (LV µFC-BGA only) FSB Parity No No No No No TDP 2.6 – 4.3W 4.6 – 13.7W 6W – 9W 6W – 9W 4.6 – 13.7W DDR 200, 266, 333 MHz 333 MHz 266 MHz 266 MHz 333 MHz DDR2 No 400, 533 MHz 400 MHz 400 MHz 400, 533 MHz Max Memory Size 2 GB 2 GB 4 GB 4 GB 2 GB Channel Memory Single Single or Dual Single or Dual Single or Dual Single or Dual ECC Memory Yes with no GFX enabled or using int GFX No Yes Yes No Integrated Graphics Yes Yes No No Yes Graphic Output Type VGA, DVO,4 LVDS VGA, SDVO,4 LVDS, TV Out No No VGA, SDVO,4 LVDS, TV Out AGP Port Yes (4x) No No No No Dual Independent Display Support Yes Yes No No Yes Interconnect Hub Interface 1.5 DMI Hub Interface 1.5 Hub Interface 1.5 DMI PCI Express* No (1) x 16 graphics port (3) x 8 ports (1) x 8 ports (1) x 16 graphics ports TDP (max) 3.9W 2.3W 3.9W 3.9W 2.3W AC’ 97 Yes Yes Yes Yes Yes Intel® High Definition Audio No Yes No No Yes ATA/100 ATA 100 (2 channels) ATA 100 (1 channel) ATA 100 (2 channels) ATA 100 (2 channels) ATA 100 (1 channel) SATA/150 SATA 150 (2 ports) SATA 150 (2 ports) SATA 150 (2 ports) SATA 150 (2 ports) SATA 150 (2 ports) RAID No No No No No USB Yes 2.0 (4 ports) Yes 2.0 (8 ports) Yes 2.0 (4 ports) Yes 2.0 (4 ports) Yes 2.0 (8 ports) 32/33 PCI 32/33 32/33 32/33 32/33 PCI-X* 64/66 No 64/66 64/66 No PCI Express No (4) x 1 ports No No (4) x 1 ports GPIO 37 (23 dedicated) 34 (14 dedicated) 37 (23 dedicated) 37 (23 dedicated) 34 (14 dedicated) Green = Ultra Low Voltage Intel® Celeron® M processor; Red = Intel® Celeron® D processor. Intel® Pentium® M and Intel® Celeron® M processors on 90nm Technology. 2 Thermal specs for Intel® XeonTM processsors and Intel® Pentium® 4 processor with Hyper-Threading Technology on 90nm are subject to the new Thermal Profile Specification Methodology. Please refer to individual product Electrical, Mechanical, and Thermal Specifications (EMTS) at developer.intel.com/design/intarch/ for details. 1 Low Power Intel® Celeron® M Processor, Ultra Low Voltage Intel® Celeron® M Processor Intel® E7520 Chipset, Intel® 6300ESB ICH Scalable Intel® Pentium® 4 Processor with Hyper-Threading Technology,∆ Intel® Celeron® D Processor, Intel® 875P Chipset, Intel® 6300ESB ICH Intel® Pentium® 4 Processor with Hyper-Threading Technology, Intel® Celeron® D Processor, Intel® 915GV Express Chipset, Intel® ICH6 Performance Intel® Pentium® 4 Processor with Hyper-Threading Technology, Intel® Celeron® D Processor, Intel® 945G Express Chipset, Intel® ICH7/ ICH7R TM Intel® Xeon Processor with 800 MHz FSB, Low Voltage Intel® Xeon Processor, Intel® E7520 Chipset, Intel® 6300ESB ICH TM 90nm 90nm 90nm 90nm 90nm 1.5/400 3.0/800, 3.4/800, 2.8/533 3.4/800, 2.93/533 3.4/800, 2.93/533 3.2/800 1.0/400 No No No 2.8/800 21W 1032/73, see below 115W,2 84W 115W,2 84W 103W 5.5W No No No 55W No No Yes Yes Yes 1M, 512k 1M, 256k 1M, 256k 1M, 256k 1M 1.26V 1.25V – 1.40V, 1.25V – 1.40V (optimized VID) 1.2V – 1.425V, 1.25V – 1.40V (optimized VID) 1.2V – 1.425V, 1.25V – 1.40V (optimized VID) 1.2875 – 1.4V (optimized VID) 0.94V1 No No No 1.1125 – 1.20V (optimized VID) 100˚C Tc MAX = 69.1– 73.2˚C,2 Tc MAX = 67.0˚C Tc MAX = 67.7– 72.8˚C,2 Tc MAX = 67.7˚C Tc MAX = 67.7– 72.8˚C,2 Tc MAX = 67.7˚C Tc MAX = 72˚C,2 LV Tc MAX = 86˚C2 µFC-BGA, µFC-PGA, (ULV µFC-BGA only) FC-µPGA4 LGA-775 LGA-775 FC-µPGA4 SSE2 SSE3 SSE3 SSE3 SSE3 No No No No Yes, No No Yes Yes Yes Yes 6W – 9W 10 – 10.1W 16.8 – 18.7W 22W 8 – 10W 266 MHz 266, 333, 400 MHz 333, 400 MHz No 266, 333 MHz 400 MHz No 400, 533 MHz 533, 667 MHz 400 MHz 4 GB 4 GB 4 GB 4 GB 32 GB Dual-Channel DDR 266, 24 GB DualChannel DDR2-333, 16 GB Dual-Channel DDR2-400 Single or Dual Single or Dual Single or Dual Single or Dual Single or Dual Yes Yes No No Yes No No Yes Yes No No No VGA, SDVO4 VGA, SDVO4 No No Yes (8x) No No No No No No Yes No Hub Interface 1.5 Hub Interface 1.5 x4 DMI x4 DMI Hub Interface 1.5 (3) x 8 ports No No x16 (graphics or I/O) (3) x 8 ports 3.9W 3.9W 3.8W 2.9 – 3.3W 3.9W Yes Yes Yes Yes Yes No No Yes Yes No ATA 100 (2 channels) ATA 100 (2 channels) ATA 100 (1 channel) ATA 100 (1 channel) ATA 100 (2 channels) SATA 150 (2 ports) SATA 150 (2 ports) SATA 150 (4 ports) SATA-2 300 (4 ports) SATA 150 (2 ports) No No No No, Yes (0,1, 5,10) No Yes 2.0 (4 ports) Yes 2.0 (4 ports) Yes 2.0 (8 ports) Yes 2.0 (8 ports) Yes 2.0 (4 ports) 32/33 32/33 32/33 32/33 32/33 64/66 64/66 No No 64/66 No No (4) x 1 ports (4) x 1 ports configurable, (6) x 1 ports configurable No 37 (23 dedicated) 37 (23 dedicated) 38 (14 dedicated) 39 (14 dedicated) 37 (23 dedicated) Intel® EM64T requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications enabled for Intel EM64T. Processor will not operate (including 32-bit operation) without an Intel EM64T-enabled BIOS. Performance will vary depending on your hardware and software configurations. See www.intel.com/info/em64t for more information including details on which processors support Intel EM64T or consult with your system vendor for more information. 4 DVO/SDVO connections are dual pipe. ∆ Hyper-Threading Technology requires a computer system with an Intel® Pentium® 4 processor supporting Hyper-Threading Technology and an HT Technology-enabled chipset, BIOS and operating system. Performance will vary depending on the specific hardware and software you use. See http://www.intel.com/info/hyperthreading for more information including details on which processors support HT Technology. 3 Intel® Flash Memory Intel StrataFlash® Embedded Memory (P30) 1, 2 Density Product Organization Access Time (ns) Package 1 Gb2 48F4444PPV 64M x 16 85[25]b [20]c RD/PF 88 512 Mb 48F4400P0V 32M x 16 85[25]b [20]c RD/PF/RC/PC 88/64 56/64 256 Mb 128 Mb 64 Mb Pin/Ball Count 28F256P30 16M X 16 85[25]b [20]c TE/JS/RC/PC 48F4000P0Z 16M X 16 85[25]b [20]c RD/PF 88 28F128P30 8M X 16 85[25]b [20]c TE/JS/RC/PC 56/64 48F3000P0Z 8M X 16 85[25]b [20]c RD/PF 88 28F640P30 4M X 16 85[25]b [20]c TE/JS/RC/PC 56/64 48F2000P0Z 4M X 16 85[25]b [20]c RD/PF 88 Intel® Advanced+ Boot Block Flash Memory2 Density 32 Mb 16 Mb 8 Mb Product 28F320C3 28F320B3 28F160C3 28F160B3 28F800C3 Organization 2M x 16 2M x 16 1M x 16 1M x 16 512K x 16 Access Time (ns) 70, 90 70, 90 70, 90 70, 90 70 Package TE/JS/GE/PH/RC/PC TE/JS/GE/PH TE/JS/GE/PH/RC/PC TE/JS/GE/PH TE/JS/RC/PC Pin/Ball Count 48/64 48 48/64 48 48/64 VCC 2.7–3.6V 2.7–3.6V 2.7–3.6V 2.7–3.6V 2.7–3.6V VPP/VPEN 1.65–3.6V or 12V 2.7–3.6V or 12V 1.65–3.6V or 12V 2.7–3.6V or 12V 1.65–3.6V or 12V I/O 1.65–2.5V or 1.65–2.5V or 1.65–2.5V or 1.65–2.5V or 1.65–2.5V or 2.7–3.6V 2.7–3.6V 2.7–3.6V 2.7–3.6V 2.7–3.6V Intel StrataFlash® Memory (J3)2 Density 256 Mb 128 Mb 64 Mb 32 Mb Product 28F256J3 28F128J3 28F640J3 28F320J3 Organization 32M x 8 or 16M x 16 16M x 8 or 8M x 16 8M x 8 or 4M x 16 4M x 8 or 2M x 16 Access Time (ns) 125[30]b 120[25]b 115[25]b 110[25]b Package TE/JS/RC/PC TE/JS/RC/PC TE/JS/RC/PC TE/JS/RC/PC Pin/Ball Count 56/64 56/64 56/64 56/64 VCC 2.7–3.6V 2.7–3.6V 2.7–3.6V 2.7–3.6V VPP/VPEN 3V 3V 3V 3V I/O 2.7–3.6V 2.7–3.6V 2.7–3.6V 2.7–3.6V Intel® Wireless Flash Memory (W18/W30)2 Density 128 Mb 64 Mb 32 Mb 1 2 3 Product 28F128W18 Organization 8M x 16 28F128W30 8M x 16 28F640W18 4M x 16 28F640W30 4M x 16 28F320W18 2M x 16 28F320W30 2M x 16 Access Time (ns) 65[20]b [11]c 80[25]b [14]c 70[25]b [20]c 85[25]b [22]c 60[20]b [11]c 80[25]b [14]c 70[25]b [20]c 85[25]b [22]c 60[20]b [11]c 80[25]b [18]c 70[25]b [20]c 85[30]b [20]c Package GE, PH Pin/Ball Count 56 VCC 1.7–1.95V GE, PH 56 1.7–1.95V GE, PH 56 1.7–1.95V GE, PH 56 1.7–1.95V GE, PH 56 1.7–1.95V GE, PH 56 1.7–1.95V Vcc range = 1.7–2.0V; Vpp range = 0.9 –3.6V or 9V; I/O range = 1.7–3.6V Extended Temperature Range: –40˚C to +85˚C Expanded Temperature Range: –25˚C to +85˚C VPP/VPEN 0.9–1.95V or 12V 0.9–1.95V or 12V 0.9–1.95V or 12V 0.9–1.95V or 12V 0.9–1.95V or 12V 0.9–1.95V or 12V I/O 1.7–2.24V 2.2–3.3V 1.7–2.24V 2.2–3.3V 1.7–2.24V 2.2–3.3V Access Time Footnotes: b = Page Mode Access c = Synchronous Burst Mode Intel® PCI Bridges Primary and Secondary PCI Interface Features Transparent Model Number PCI Bus Write Buffer Read Buffer Delayed Transaction Queue CLK, REQ #, GNT # Pins No 21555 64-bit 256 Bytes 256 Bytes 4 entries 9 sets @ 33 MHz, 4 sets @ 66 MHz Yes 41210 64-bit 1 KByte 1 KByte 4 entries 6 sets per PCI-X bus Yes 31154 64-bit 8 KBytes 8 KBytes 9 – 24 9 sets PCI-X Yes 21154 64-bit 152 Bytes 152 Bytes 3 entries 9 sets @ 33 MHz, 4 sets @ 66 MHz Yes 21152 32-bit 88 Bytes 72 Bytes 3 entries 4 sets Other Product Features Transparent Model Number JTAG GPIO Package PCI Revision Max. Clock No 21555 Yes No 304 2.3 33 MHz/66 MHz Yes 41210 Yes No 521 FC3BGA PCI Express*1.0a, PCI-X* v1.0b 133 MHz Yes 31154 Yes Yes 421 PBGA PCI-X 1.0b, PCI 2.3 133 MHz Yes 21154 Yes Yes 304 PBGA 2.3 33 MHz/66 MHz Yes 21152 No No 160 PQFP 2.3 33 MHz Intel Ethernet Transceivers (10/100 Mbps) ® Primary PCI Interface Features Product LXT971A LXT972A LXT972M LXT973 LXT9785 LXT9785E LXT9785M Package 64-pin QFP, 64-ball BGA 64-pin QFP 48-pin LQFP 100-pin PQFP 208-pin PQFP, 241-ball PBGA 208-pin PQFP, 241-ball PBGA 196-ball PBGA Ports 1 Voltage 2.5V/3.3V Power 380mW Interface MII 1 1 2 8 2.5V/3.3V 2.5V/3.3V 2.5V/3.3V 2.5V/3.3V 380mW 380mW 250mW 250mW 8 2.5V/3.3V 250mW 8 2.5V/3.3V 250mW MII MII MII SMII, SS-SMII, RMII (QFP) SMII, SS-SMII (BGA) SMII, SS-SMII, RMII (QFP) SMII, SS-SMII (BGA) SMII, SS-SMII Extended Temp (–40°C to 85°C) Yes Fiber Yes Sleep Mode Yes No No Yes No No No Yes Yes No No No No Yes Yes No No No No Intel PRO/100 Ethernet Controllers ® Intel® 82551QM, Intel® 82551ER Intel® 82551IT Intel® 82562ET, Intel® 82562GT Intel® 82562EZ, Intel® 82562GZ Brand Name Intel® PRO/100 M Network Connection Intel® PRO/100 M Network Connection Intel® PRO/100 VE Network Connection Intel® PRO/100 VE Network Connection Intel® 82559, Intel® 82559C, Intel® 82559ER Intel® PRO/100 Network Connection Device Single-port MAC/PHY Single-port MAC/PHY Single-port PHY Single-port PHY Single-Port MAC/PHY 15x15mm 15x15mm 15.85x7.5mm 15x15mm 15x15mm 196-pin BGA 196-pin BGA 48-pin SSOP 196-pin BGA 196-pin BGA PCI PCI LCI LCI PCI 33 MHz 33 MHz –– –– 33 MHz Product Name Package Size Physical Package Bus Type Bus Speed Bus Width 32-bit 32-bit –– –– 32-bit Power (Typical) 0.61W 0.61W 0.3W 0.3W 0.675W 0.05W @ 3.3V 0.05W @ 3.3V 0.05W @ 3.3V 0.05W @ 3.3V 0/05W @ 3.3V 0 – 85°C –40 – 85°C 0 – 85°C 0 – 85°C 0 – 85°C 3.3V 3.3V 3.3V 3.3V 3.3V Order Code GD82551QM, GD82551ER GD82551IT DA82562ET, DA82562GT GD82562EZ, GD82562GZ GD82559, GD82559C, GD82559ER RoHS SKU LU82551QM, LU82551ER LU82551IT EP82562ET, EP82562GT LU82562E2, LU82562GZ Footprint Compatible GD82562EZ, GD82540EM/EP, GD82541PI/ER GD82562EZ, GD82540EM/EP, GD82541PI/ER Power (Standby) Operating Temperature Power Supply GD82562EZ, GD82540EM/EP, GD82541PI/ER, GD82547GI Intel PRO/1000 Gigabit Ethernet Controllers ® Product Name Brand Name Device Package Size Physical Package Bus Type Intel® 82545GM Intel® 82546GB Intel® 82540EP, Intel® 82540EM Intel® 82541PI, Intel® 82541ER Intel® PRO/1000 MT Intel® PRO/1000 MT Intel® PRO/1000 MT Intel® PRO/1000 MT Single-port MAC/PHY/ SerDes Dual-port MAC/PHY/ SerDes Single-port MAC/PHY Single-port MAC/PHY Intel® 82547GI Intel® 82573E/ V, Intel® 82573L Intel® 82571EB Intel® PRO/1000 CT Intel® PRO/1000 PM Intel® PRO/1000 PM Single-port MAC/PHY Single-Port MAC/PHY Dual-port MAC/PHY/ SerDes 21x21mm 21x21mm 15x15mm 15x15mm 15x15mm 15x15mm 17x17mm 364-pin TFBGA 364-pin PBGA 196-pin TFBGA 196-pin PBGA 196-pin PBGA 196-pin TFBGA 256-pin FCBGA PCI/PCI-X* PCI/PCI-X PCI PCI CSA PCI Express* PCI Express Bus Speed 33/66/133 MHz 33/66/133 MHz 33/66 MHz 33/66 MHz –– x1 x1/x4 Bus Width 32/64-bit 32/64-bit 32-bit 32-bit –– –– –– Power (Typical) ~1.8W/~1.5W ~2.6W ~1.4W ~1.0W ~1.0W ~1.5W ~3.1W –1.5W (SerDes) Power (Standby) 125mA @ 3.3V 220mA @ 3.3V 60mA @ 3.3V 45mA @ 3.3V 105mA @ 3.3V 11mA @ 3.3V 220 mA @ 3.3 V Operating Temp 0 – 70°C 0 – 55°C 0 – 70°C 0 – 70°C 0 – 70°C 0 – 70°C 0 – 55°C Power Supply 1.5, 2.5, 3.3V 1.5, 2.5, 3.3V 1.5, 2.5, 3.3V 1.2, 1.8, 3.3V 1.2, 1.8, 3.3V 1.2, 2.5, 3.3V 1.1, 1.8, 3.3 V Order Code RC82545GM FW82546GB RC82540EP, RC82540EM GD82541PI, GD82541ER GD82547GI RC 82573E, RC82573V, RC82573L HL82571EB RoHA SKU PC82545GM NH82546B PC82573E, PC82573V, PC82573L JL82571EB Footprint Compatible LU82541PI, LU82541ER Intel® 82551QM, Intel® 82551ER, Intel® 82562EZ, Intel® 82562EX Intel® 82551QM, Intel® 82551ER, Intel® 82562EZ, Intel® 82562EX Intel® 82551QM, Intel® 82562EX Intel® 82562EZ, Intel® 82562EX, Intel® 82562GZ Intel XScale® Technology-Based Processors PXA255 PXA270 IXP420 IXP421 IXP422 Core Speed (MHz) 200/300/400 312/416/520/624 266/400/533 266 266 IXP423 266 PCMCIA PCI bridge needed PCI bridge needed PCI bridge needed PCI bridge needed CompactFlash* expansion bus expansion bus expansion bus expansion bus Dynamic Memory 16/32-bit wide 16/32-bit wide 16/32-bit wide 16/32-bit wide 16/32-bit wide 16/32-bit wide SDRAM 100 MHz 100 MHz 133 MHz 133 MHz 133 MHz 133 MHz Static Memory 16/32-bit wide 16/32-bit wide 16-bit wide 16-bit wide 16-bit wide 16-bit wide ROM SRAM FLASH UART Standard, Hardware, Full Function, Bluetooth* Standard, Hardware, Full Function, Bluetooth 2 2 2 2 I2C via GPIO via GPIO via GPIO via GPIO via GPIO via GPIO via GPIO via GPIO ECC DDR DDR2 SPI SSP NSSP Audio SSP HSS-Voice HSS-WAN UTOPIA 2 CSIX Ethernet MII/SMII GPIO Number 85 119 DMA Controller LCD Controller USB Client USB Host/OTG (2 MII) (1 MII) (2 MII) (2 MII) 16 16 16 16 32-bit, 33/66 MHz 32-bit, 33/66 MHz 32-bit, 33/66 MHz 32-bit, 33/66 MHz PCI 2.2 Host I/F PCI-X PCI-express AES/DES/DES3 SHA-1/MD-5 SHA-256/-384/-512/EAU HW RNG HDLC Channels MMC Expansion Bus 16-bit, 66 MHz 16-bit, 66 MHz 16-bit, 66 MHz 16-bit, 66 MHz At MHz, Power Dissipation (typical for PXA; all others MAX) at 200 MHz, 1637mW; at 300 MHz, 2057mW; at 400 MHz, 2598mW at 200 MHz, 279mW; at 312 MHz, 390mW; at 416 MHz, 570mW; at 520 MHz, 747mW at 266 MHz, 1.9W; at 400 MHz, 2.0W; at 533 MHz, 2.3W at 266 MHz, 1.9W at 266 MHz, 1.9W at 266 MHz, 1.9W Win CE.NET PocketPC* 2002/ SmartPhone* 2002 VxWorks* Linux* Other OS Palm OS,* Symbian Palm OS, Symbian SDK Available Development Platform Extended Temperature –40˚C to 85˚C –40˚C to 85˚C –40˚C to 85˚C Package Type 256-pin 17x17x1.75mm PBGA 360-pin 22x22x2.38mm, 356-pin 13x13mm VF BGA 492-pin 35x35x1.27 PBGA 492-pin 35x35x1.27 PBGA 492-pin 35x35x1.27 PBGA 492-pin 35x35x1.27 PBGA Pb-Free IXP425 IXP455 IXP460 IXP465 80219 IOP331 IOP332 266/400/533 266/400/533 266/400/533/667 266/400/533/667 400/600 500/667/800 500/667/800 PCI bridge needed PCI bridge needed PCI bridge needed PCI bridge needed expansion bus expansion bus expansion bus expansion bus 16/32-bit wide 32-bit wide 32-bit wide 32-bit wide 32/64-bit wide 32/64-bit wide 266 MHz 266 MHz 266 MHz 200 MHz 32/64-bit wide 133 MHz 333 MHz 333 MHz 400 MHZ 400 MHZ 16-bit wide 16/32-bit-wide 16/32-bit wide 16/32-bit wide 16/32-bit wide 16-bit wide 16-bit wide 2 2 2 2 0 2 2 via GPIO via GPIO 8 8 8 (2 MII) (3 MII or 3 SMII) 16 (2 MII or 2 SMII) 16 32-bit, 33/66 MHz (no OTG) 32-bit, 33/66 MHz (3 MII or 6 SMII) 16 16 (no OTG) 32-bit, 33/66 MHz (no OTG) 32-bit, 33/66 MHz 64-bit, 66 MHz/133 MHz 64-bit, 66 MHz/133 MHz 64-bit, 66 MHz/133 MHz 16-bit, 66 MHz 16/32-bit, 80 MHz (w/ external mastering) 16/32-bit, 80 MHz (w/ external mastering) 16/32-bit, 80 MHz (w/ external mastering) 32-bit, 33/66/100/133 MHz 8/16-bit, 33/66/100/133 MHz 8/16-bit, 33/66/100/133 MHz at 266 MHz, 1.9W; at 400 MHz, 2.0W; at 533 MHz, 2.3W at 266 MHz, 2.9W; at 400 MHz, 3.0W; at 533 MHz, 3.1W; at 266 MHz, 2.9W; at 400 MHz, 3.0W; at 533 MHz, 3.1W; at 667 MHz, 3.6W at 266 MHz, 2.9W; at 400 MHz, 3.0W; at 533 MHz, 3.1W; at 667 MHz, 3.6W at 400 MHz, 2.9W at 600 MHz, 3.5W at 500 MHz, 7.9W; at 667 MHz, 8.1W; at 800 MHz, 8.2W at 500 MHz, 7.9W; at 667 MHz, 8.1W; at 800 MHz, 8.2W Wasabi, ECOS, Express Logic, Timesys Timesys Timesys –40˚C to 85˚C –40˚C to 85˚C –40˚C to 85˚C –40˚C to 85˚C 0˚C to 85˚C 492-pin 35x35x1.27 PBGA 544-pin 35x35x127 PBGA 544-pin 35x35x127 PBGA 544-pin 35x35x127 PBGA 544-pin 35x35x1.27 LPBGA 829-ball 37.5x27.5 FCBGA 829-ball 37.5x27.5 FCBGA When it comes to embedded solutions, the future starts here. Reliable solutions, now and for the future. Intel and its ecosystem of hardware and software providers, including members of the Intel® Communications Alliance, offer embedded solutions at all levels of integration to meet your needs for performance, functionality, and cost. With Intel, you have a single vendor that offers multiple architectures, product lines, price points, and feature sets to meet a complete range of mainstream requirements. Intel Access Intel® Architecture Processors intel.com/design/intarch Intel® Network Processors intel.com/design/network/products/npfamily Intel® I/O Processors intel.com/design/iio Intel® PCA Processors intel.com/design/pca/applicationsprocessors/ Intel® Ethernet Controllers intel.com/design/network/products/ethernet Intel® Bridges intel.com/design/bridge Intel® Ethernet Transceivers intel.com/design/network/products/ethernet Intel® Flash Memory intel.com/design/flash Intel® Communications Alliance intel.com/go/ica Intel® Technical Documentation Center (800) 548-4725 7 a.m. to 7 p.m. CST (USA and Canada) International locations please contact your local sales office. General Information Hotline 800-628-8686 or 916-356-3104 5 a.m. to 5 p.m. PST For more information, contact your local Intel representative. INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. 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Intel, the Intel logo, Pentium, Celeron, Intel Xeon, Intel SpeedStep, Intel StrataFlash, and Intel XScale are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries. Printed in USA 0705/DLC/OCG/PP/5K Please Recycle 306105-002US