AD ADG719 Cmos 1.8 v to 5.5 v, 2.5 î© 2:1 mux/spdt switch in sot-23 Datasheet

CMOS 1.8 V to 5.5 V, 2.5 Ω
2:1 Mux/SPDT Switch in SOT-23
ADG719
FEATURES
FUNCTIONAL BLOCK DIAGRAM
1.8 V to 5.5 V single supply
4 Ω (max) on resistance
0.75 Ω (typ) on resistance flatness
−3 dB bandwidth > 200 MHz
Rail-to-rail operation
6-Lead SOT-23 package and 8-Lead MSOP package
Fast switching times:
tON = 12 ns
tOFF = 6 ns
Typical power consumption: (< 0.01 μW)
TTL/CMOS compatible
ADG719
S2
D
S1
NOTES
1. SWITCHES SHOWN FOR A LOGIC 1 INPUT.
08708-001
IN
Figure 1.
APPLICATIONS
Battery-powered systems
Communication systems
Sample-and-hold systems
Audio signal routing
Video switching
Mechanical reed relay replacement
GENERAL DESCRIPTION
PRODUCT HIGHLIGHTS
The ADG719 is a monolithic CMOS SPDT switch. This switch
is designed on a submicron process that provides low power
dissipation yet gives high switching speed, low on resistance,
and low leakage currents.
1.
1.8 V to 5.5 V Single-Supply Operation. The ADG719
offers high performance, including low on resistance and
fast switching times, and is fully specified and guaranteed
with 3 V and 5 V supply rails.
The ADG719 can operate from a single-supply range of 1.8 V
to 5.5 V, making it ideal for use in battery-powered instruments
and with the new generation of DACs and ADCs from Analog
Devices, Inc.
2.
Very Low RON (4 Ω Max at 5 V and 10 Ω Max at 3 V). At 1.8 V
operation, RON is typically 40 Ω over the temperature range.
3.
Automotive Temperature Range: −40°C to +125°C.
4.
On Resistance Flatness (RFLAT(ON)) (0.75 Ω typ).
5.
−3 dB Bandwidth > 200 MHz.
6.
Low Power Dissipation. CMOS construction ensures low
power dissipation.
7.
Fast tON/tOFF.
8.
Tiny, 6-lead SOT-23 and 8-lead MSOP packages.
Each switch of the ADG719 conducts equally well in both
directions when on. The ADG719 exhibits break-before-make
switching action.
Because of the advanced submicron process, −3 dB bandwidths
of greater than 200 MHz can be achieved.
The ADG719 is available in a 6-lead SOT-23 package and an
8-lead MSOP package.
Rev. D
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2002–2010 Analog Devices, Inc. All rights reserved.
ADG719
TABLE OF CONTENTS
Features .............................................................................................. 1
Typical Performance Characteristics ..............................................7
Applications ....................................................................................... 1
Test Circuits ........................................................................................9
Functional Block Diagram .............................................................. 1
Terminology .................................................................................... 11
General Description ......................................................................... 1
Applications Information .............................................................. 12
Product Highlights ........................................................................... 1
ADG719 Supply Voltages .......................................................... 12
Revision History ............................................................................... 2
On Response vs. Frequency ...................................................... 12
Specifications..................................................................................... 3
Off Isolation ................................................................................ 12
Absolute Maximum Ratings............................................................ 5
Outline Dimensions ....................................................................... 13
ESD Caution .................................................................................. 5
Ordering Guide .......................................................................... 14
Pin Configuration and Function Descriptions ............................. 6
REVISION HISTORY
3/10—Rev. C to Rev. D
Removed B Version Text............................................... Throughout
Changes to Figure 1 .......................................................................... 1
Deleted Endnote 1 (Table 1)............................................................ 3
Deleted Endnote 1 (Table 2)............................................................ 4
Changes to Figure 2 .......................................................................... 6
Changes to Ordering Guide .......................................................... 14
12/09—Rev. B to Rev. C
Updated Format .................................................................. Universal
Changes to Table 3 ............................................................................ 5
Added Table 4.................................................................................... 6
Changes to Terminology Section.................................................. 11
Updated Outline Dimensions ....................................................... 13
Changes to Ordering Guide .......................................................... 14
7/02—Rev. A to Rev. B.
Changes to Product Name ............................................................... 1
Changes to Features.......................................................................... 1
Additions to Product Highlights .................................................... 1
Changes to Specifications ................................................................ 2
Edits to Absolute Maximum Ratings ............................................. 4
Changes to Terminology.................................................................. 4
Edits to Ordering Guide .................................................................. 4
Added New TPCs 4 and 5 ............................................................... 5
Replaced TPC 10............................................................................... 6
Test Circuits 6, 7, and 8 Replaced ................................................... 7
Updated RM-8 and RT-6 Package Outlines ................................. 9
Rev. D | Page 2 of 16
ADG719
SPECIFICATIONS
VDD = 5 V ± 10%, GND = 0 V.
Table 1.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
+25°C
2.5
4
On Resistance Match Between
Channels (ΔRON)
On Resistance Flatness (RFLAT(ON))
LEAKAGE CURRENTS IS (Off )
Source Off Leakage
Channel On Leakage ID, IS (On)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
IINL or IINH
DYNAMIC CHARACTERISTICS 1
tON
−40°C to +85°C
−40°C to +125°C
Unit
0 V to VDD
V
5
7
Ω typ
Ω max
0.1
0.4
0.4
1.2
1.5
0.75
±0.01
±0.25
±0.01
±0.25
VS = 0 V to VDD, IS = −10 mA
VDD = 5.5 V
VS = 4.5 V/1 V, VD = 1 V/4.5 V;
See Figure 15
VS = VD = 1 V or VS = VD = 4.5 V;
See Figure 16
1
±0.35
5
2.4
0.8
V min
V max
μA typ
μA max
VIN = VINL or VINH
±0.1
RL = 300 Ω, CL = 35 pF
VS = 3 V; See Figure 17
RL = 300 Ω, CL = 35 pF
VS = 3 V; See Figure 17
RL = 300 Ω, CL = 35 pF,
VS1 = VS2 = 3 V; See Figure 18
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
See Figure 19
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
See Figure 20
RL = 50 Ω, CL = 5 pF; See Figure 21
0.005
tOFF
3
Break-Before-Make Time Delay, tD
8
7
Off Isolation
−67
−87
Channel-to-Channel Crosstalk
−62
−82
dB typ
dB typ
200
7
27
MHz typ
pF typ
pF typ
6
1
IDD
VS = 0 V to VDD, IS = −10 mA
±0.35
ns typ
ns max
ns typ
ns max
ns typ
ns min
dB typ
dB typ
Bandwidth −3 dB
CS (Off )
CD, CS (On)
POWER REQUIREMENTS
VS = 0 V to VDD, IS = −10 mA;
See Figure 14
nA typ
nA max
nA typ
nA max
12
VDD = 5.5 V
Digital inputs = 0 V or 5.5 V
0.001
1.0
1
Ω typ
Ω max
Ω typ
Ω max
Test Conditions/Comments
Guaranteed by design, not subject to production test.
Rev. D | Page 3 of 16
μA typ
μA max
ADG719
VDD = 3 V ± 10%, GND = 0 V.
Table 2.
Parameter
ANALOG SWITCH
Analog Signal Range
On Resistance (RON)
+25°C
−40°C to +85°C
6
7
10
On Resistance Match Between
Channels (ΔRON)
On Resistance Flatness (RFLAT(ON))
LEAKAGE CURRENTS
Source Off Leakage IS (Off )
Channel On Leakage ID, IS (On)
DIGITAL INPUTS
Input High Voltage, VINH
Input Low Voltage, VINL
Input Current
IINL or IINH
DYNAMIC CHARACTERISTICS 1
tON
±0.01
±0.25
±0.01
±0.25
−40°C to +125°C
0 V to VDD
Unit
V
Test Conditions/Comments
12
Ω typ
Ω max
VS = 0 V to VDD, IS = −10 mA;
See Figure 14
Ω typ
Ω max
Ω typ
VS = 0 V to VDD, IS = −10 mA
0.1
0.4
2.5
0.4
±0.35
1
±0.35
5
nA typ
nA max
nA typ
nA max
2.0
0.8
V min
V max
μA typ
μA max
VIN = VINL or VINH
±0.1
RL = 300 Ω, CL = 35 pF
VS = 2 V; See Figure 17
RL = 300 Ω, CL = 35 pF
VS = 2 V; See Figure 17
RL = 300 Ω, CL = 35 pF
VS1 = VS2 = 2 V; See Figure 18
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
See Figure 19
RL = 50 Ω, CL = 5 pF, f = 10 MHz
RL = 50 Ω, CL = 5 pF, f = 1 MHz;
See Figure 20
RL = 50 Ω, CL = 5 pF; See Figure 21
0.005
10
Break-Before-Make Time Delay, tD
8
Off Isolation
−67
−87
ns typ
ns max
ns typ
ns max
ns typ
ns min
dB typ
dB typ
Channel-to-Channel Crosstalk
−62
−82
dB typ
dB typ
Bandwidth −3 dB
CS (Off )
CD, CS (On)
200
7
27
MHz typ
pF typ
pF typ
15
tOFF
4
8
1
POWER REQUIREMENTS
IDD
1
VS = 0 V to VDD, IS = −10 mA
VDD = 3.3 V
VS = 3 V/1 V, VD = 1 V/3 V;
See Figure 15
VS = VD = 1 V or VS = VD = 3 V;
See Figure 16
VDD = 3.3 V
Digital inputs = 0 V or 3.3 V
0.001
1.0
μA typ
μA max
Guaranteed by design, not subject to production test.
Rev. D | Page 4 of 16
ADG719
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter
VDD to GND
Analog, Digital Inputs1
Peak Current, S or D
Continuous Current, S or D
Operating Temperature Range
Storage Temperature Range
Junction Temperature
MSOP Package, Power Dissipation
θJA Thermal Impedance
θJC Thermal Impedance
SOT-23 Package, Power Dissipation
θJA Thermal Impedance
θJC Thermal Impedance
Lead Soldering
Lead Temperature, Soldering
(10 sec)
IR Reflow, Peak Temperature
(<20 sec)
Soldering (Pb-Free)
Reflow, Peak Temperature
Time at Peak Temperature
ESD
1
Rating
−0.3 V to +7 V
−0.3 V to VDD + 0.3 V or
30 mA, whichever occurs
first
100 mA
(Pulsed at 1 ms, 10% duty
cycle max)
30 mA
−40°C to +125°C
−65°C to +150°C
150°C
315 mW
206°C/W
44°C/W
282 mW
229.6°C/W
91.99°C/W
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one maximum rating may be applied at any one time.
ESD CAUTION
300°C
220°C
260(+0/−5)°C
20 sec to 40 sec
1 kV
Overvoltages at IN, S, or D will be clamped by internal diodes. Current
should be limited to the maximum ratings given
Rev. D | Page 5 of 16
ADG719
IN 1
6
D
1
S1
2
GND
3
VDD
4
S2
ADG719
5 D
TOP VIEW
(Not to Scale)
GND 3
4
S1
08708-002
VDD 2
ADG719
TOP VIEW
(Not to Scale)
Description
Drain Terminal. Can be used as an input or output.
Source Terminal. Can be used as an input or output.
Ground (0 V) Reference Pin.
Most Positive Power Supply Pin.
Not Internally Connected.
Digital Switch Control Pin.
Not Internally Connected.
Source Terminal. Can be used as an input or output.
Table 5. Truth Table
ADG719 IN
0
1
NC
6
IN
5
NC
Figure 3. 8-Lead MSOP
Table 4. Pin description
Mnemonic
D
S1
GND
VDD
NC
IN
NC
S2
S2
7
NC = NO CONNECT
Figure 2. 6-Lead SOT-23
Pin Number
MSOP
SOT-23
1
5
2
4
3
3
4
2
5
–
6
1
7
–
8
6
8
Switch S1
ON
OFF
Switch S2
OFF
ON
Rev. D | Page 6 of 16
08708-003
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
ADG719
TYPICAL PERFORMANCE CHARACTERISTICS
0.15
6.0
5.5
VDD = 2.7V
VDD = 5V
VD = 4.5V/1V
VS = 1V/4.5V
TA = 25°C
5.0
0.10
RON (Ω)
4.0
VDD = 4.5V
VDD = 3.0V
3.5
CURRENT (nA)
4.5
3.0
2.5
VDD = 5.0V
2.0
ID, IS (ON)
0.05
1.5
0
1.0
0.5
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
DRAIN OR SOURCE VOLTAGE (V)
08708-004
0
–0.05
0
Figure 4. On Resistance vs. VD (VS), Single Supplies
20
30
40
50
60
TEMPERATURE (°C)
70
80
90
Figure 7. Leakage Currents vs. Temperature
0.15
6.0
VDD = 3V
VD = 3V/1V
VS = 1V/3V
VDD = 3V
5.5
5.0
+85°C
4.5
0.10
+25°C
CURRENT (nA)
4.0
–40°C
RON (Ω)
10
08708-007
IS (OFF)
0
3.5
3.0
2.5
0.05
ID, IS (ON)
2.0
1.5
0
1.0
0.5
0.5
0
1.0
1.5
2.0
DRAIN OR SOURCE VOLTAGE (V)
2.5
3.0
–0.05
0
10
20
30
40
50
60
TEMPERATURE (°C)
70
80
90
08708-008
IS (OFF)
08708-005
0
Figure 8. Leakage Currents vs. Temperature
Figure 5. On Resistance vs. VD (VS) for Different Temperatures, VDD = 3 V
10m
6.0
VDD = 5V
VDD = 3V
5.5
1m
5.0
4.5
100µ
3.5
ISUPPLY (A)
RON (Ω)
4.0
+85°C
3.0
+25°C
2.5
–40°C
2.0
10µ
1µ
100n
1.5
1.0
10n
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
DRAIN OR SOURCE VOLTAGE (V)
4.5
5.0
1n
08708-006
0
Figure 6. On Resistance vs. VD (VS) for Different Temperatures, VDD = 5 V
Rev. D | Page 7 of 16
1
10
100
1k
10k
100k
FREQUENCY (Hz)
1M
10M
Figure 9. Supply Current vs. Input Switching Frequency
100M
08708-009
0.5
ADG719
–30
0
VDD = 5V, 3V
VDD = 5V
–40
–60
ON RESPONSE (dB)
OFF ISOLATION (dB)
–50
–70
–80
–90
–100
–2
–4
–110
100k
1M
10M
FREQUENCY (Hz)
100M
–6
10k
08708-010
–130
10k
Figure 10. Off Isolation vs. Frequency
100k
1M
10M
FREQUENCY (Hz)
08708-012
–120
100M
Figure 12. On Response vs. Frequency
–30
12
VDD = 5V, 3V
–40
10
–50
8
6
QINJ (pC)
–70
–80
–90
VDD = 5V
4
2
–100
0
VDD = 5V
–110
–130
10k
100k
1M
10M
FREQUENCY (Hz)
100M
–4
0
1
2
3
4
VS (V)
Figure 13. Charge Injection vs. Source Voltage
Figure 11. Crosstalk vs. Frequency
Rev. D | Page 8 of 16
5
08708-013
–2
–120
08708-011
CROSSTALK (dB)
–60
ADG719
TEST CIRCUITS
ID (OFF)
S
A
D
ID (ON)
S
A
VS
VD
V1
A
VS
VD
D
08708-014
RON = V1/IDS
Figure 16. On Leakage
Figure 15. Off Leakage
Figure 14. On Resistance
0.1µF
VDD
VIN
50%
50%
VDD
D
RL
300Ω
GND
VOUT
90%
90%
VOUT
CL
35pF
tON
tOFF
08708-017
S
IN
VS
Figure 17. Switching Times
0.1µF
S1
VS1
VDD
VIN
VDD
D
S2
VS2
VIN
D2
RL2
300Ω
IN
50%
0V
CL2
35pF
VOUT
50%
VOUT
50%
0V
tD
GND
Figure 18. Break-Before-Make Time Delay, tD
Rev. D | Page 9 of 16
50%
tD
08708-018
S
VS
D
08708-016
IS (OFF)
08708-015
IDS
ADG719
VDD
0.1µF
NETWORK
ANALYZER
VDD
S
50Ω
IN
VS
50Ω
D
VIN
RL
VOUT
GND
OFF ISOLATION = 20 LOG
VOUT
VS
08708-019
50Ω
Figure 19. Off Isolation
VDD
0.1µF
NETWORK
ANALYZER
VOUT
VDD
S1
RL
50Ω
D
S2
50Ω
R
50Ω
IN
VS
CHANNEL-TO-CHANNEL
VOUT
CROSSTALK = 20 LOG
VS
08708-020
GND
Figure 20. Channel-to-Channel Crosstalk
VDD
0.1µF
NETWORK
ANALYZER
VDD
S
50Ω
IN
VS
D
GND
INSERTION LOSS= 20 LOG
RL
50Ω
VOUT
VOUT WITH SWITCH
VOUT WITHOUT SWITCH
Figure 21. Bandwidth
Rev. D | Page 10 of 16
08708-021
VIN
ADG719
TERMINOLOGY
tOFF
Delay between Applying the Digital Control Input and the
Output Switching Off.
RON
Ohmic Resistance between D and S.
ΔRON
On Resistance Match between Any Two Channels
that is, RON max − RON min.
RFLAT(ON)
Flatness is defined as the difference between the maximum and
minimum value of on resistance, as measured over the specified
analog signal range.
IS (Off)
Source Leakage Current with the Switch Off.
ID, IS (On)
Channel Leakage Current with the Switch On.
VD (VS)
Analog Voltage on Terminals D and S.
CS (Off)
Off Switch Source Capacitance.
CD, CS (On)
On Switch Capacitance.
tD
Off Time or On Time Measured between the 90% Points of
Both Switches, when Switching From One Address State to
Another.
Crosstalk
A Measure of Unwanted Signal That Is Coupled through from
One Channel to Another as a Result of Parasitic Capacitance.
Off Isolation
A Measure of Unwanted Signal Coupling through an Off Switch.
Bandwidth
The Frequency at Which the Output is Attenuated by −3 dBs.
On Response
The Frequency Response of the On Switch.
Insertion Loss
Loss due to On Resistance of Switch.
tON
Delay between Applying the Digital Control Input and the
Output Switching On.
Rev. D | Page 11 of 16
ADG719
APPLICATIONS INFORMATION
The ADG719 belongs to Analog Devices’ new family of CMOS
switches. This series of general-purpose switches has improved
switching times, lower on resistance, higher bandwidths, low
power consumption, and low leakage currents.
ADG719 SUPPLY VOLTAGES
Functionality of the ADG719 extends from 1.8 V to 5.5 V single
supply, which makes it ideal for battery-powered instruments
where power efficiency and performance are important design
parameters.
It is important to note that the supply voltage effects the input
signal range, the on resistance, and the switching times of the
part. By taking a look at the Typical Performance Characteristics
and the Specifications, the effects of the power supplies can be
clearly seen.
For VDD = 1.8 V operation, RON is typically 40 Ω over the
temperature range.
switch on resistance is small, this zero usually occurs at high
frequencies. The bandwidth is a function of the switch output
capacitance combined with CDS and the load capacitance. The
frequency pole corresponding to these capacitances appears in
the denominator of A(s).
The dominant effect of the output capacitance, CD, causes the
pole breakpoint frequency to occur first. Therefore, in order to
maximize bandwidth, a switch must have a low input and output
capacitance and low on resistance. The On Response vs.
Frequency plot for the ADG719 can be seen in Figure 12.
OFF ISOLATION
Off isolation is a measure of the input signal coupled through
an off switch to the switch output. The capacitance, CDS, couples
the input signal to the output load when the switch is off, as
shown in Figure 23.
CDS
ON RESPONSE VS. FREQUENCY
CDS
D
VIN
CD
CLOAD
RLOAD
08708-022
VOUT
RON
Figure 22. Switch Represented by Equivalent Parasitic Components
The transfer function that describes the equivalent diagram of
the switch (Figure 22) is of the form A(s) shown below:
⎡ s(RON C DS ) + 1 ⎤
A(s) = RT ⎢
⎥
⎣⎢ s(RT R ON C T ) + 1 ⎦⎥
VIN
CD
CLOAD
RLOAD
08708-023
VOUT
Figure 22 illustrates the parasitic components that affect the ac
performance of CMOS switches (the switch is shown surrounded
by a box). Additional external capacitances will further degrade
some performance. These capacitances affect feedthrough,
crosstalk, and system bandwidth.
S
D
S
Figure 23. Off Isolation Is Affected by External Load Resistance and
Capacitance
The larger the value of CDS, the larger the values of feedthrough
that will be produced. Figure 10 illustrates the drop in off
isolation as a function of frequency. From dc to roughly 200 kHz,
the switch shows better than −95 dB isolation. Up to frequencies of
10 MHz, the off isolation remains better than −67 dB. As the
frequency increases, more and more of the input signal is coupled
through to the output. Off isolation can be maximized by choosing
a switch with the smallest CDS possible. The values of load resistance
and capacitance also affect off isolation, since they contribute to
the coefficients of the poles and zeros in the transfer function of
the switch when open.
⎤
⎡
s(R LOAD C DS )
A(s) = ⎢
⎥
s
R
C
C
C
(
)
(
+
+
)
+
1
D
LOAD
DS
⎦⎥
⎣⎢ LOAD
where:
RT = RLOAD/(RLOAD + RON)
CT = CLOAD + CD + CDS
The signal transfer characteristic is dependent on the switch
channel capacitance, CDS. This capacitance creates a frequency
zero in the numerator of the transfer function A(s). Because the
Rev. D | Page 12 of 16
ADG719
OUTLINE DIMENSIONS
3.20
3.00
2.80
8
3.20
3.00
2.80
5.15
4.90
4.65
5
1
4
PIN 1
IDENTIFIER
0.65 BSC
0.95
0.85
0.75
15° MAX
1.10 MAX
0.80
0.55
0.40
0.23
0.09
6°
0°
0.40
0.25
100709-B
0.15
0.05
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-187-AA
Figure 24. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
3.00
2.90
2.80
1.70
1.60
1.50
6
5
4
1
2
3
3.00
2.80
2.60
PIN 1
INDICATOR
0.95 BSC
1.90
BSC
1.45 MAX
0.95 MIN
0.15 MAX
0.05 MIN
0.50 MAX
0.30 MIN
0.20 MAX
0.08 MIN
SEATING
PLANE
10°
4°
0°
0.60
BSC
COMPLIANT TO JEDEC STANDARDS MO-178-AB
Figure 25. 6-Lead Small Outline Transistor Package [SOT-23]
(RJ-6)
Dimensions shown in millimeters
Rev. D | Page 13 of 16
0.55
0.45
0.35
121608-A
1.30
1.15
0.90
ADG719
ORDERING GUIDE
Model 1
ADG719BRM
ADG719BRM-REEL
ADG719BRM-REEL7
ADG719BRMZ
ADG719BRMZ-REEL
ADG719BRMZ-REEL7
ADG719BRT-REEL
ADG719BRT-REEL7
ADG719BRT -500RL7
ADG719BRTZ -500RL7
ADG719BRTZ-R2
ADG719BRTZ-REEL
ADG719BRTZ-REEL7
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package Description
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
8-Lead MSOP
6-Lead SOT-23
6-Lead SOT-23
6-Lead SOT-23
6-Lead SOT-23
6-Lead SOT-23
6-Lead SOT-23
6-Lead SOT-23
Z = RoHS Compliant Part.
Rev. D | Page 14 of 16
Package Option
RM-8
RM-8
RM-8
RM-8
RM-8
RM-8
RJ-6
RJ-6
RJ-6
RJ-6
RJ-6
RJ-6
RJ-6
Branding
S5B
S5B
S5B
S5B#
S5B#
S5B#
S5B
S5B
S5B
S5B#
S5B#
S5B#
S5B#
ADG719
NOTES
Rev. D | Page 15 of 16
ADG719
NOTES
©2002–2010 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D08708-0-3/10(D)
Rev. D | Page 16 of 16