Material Content Data Sheet Sales Product Name IDP30E120 MA# MA000763576 Package PG-TO220-2-1 Issued 29. August 2013 Weight* 1964.47 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material non noble metal noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus antimony silver tin 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-36-0 7440-22-4 7440-31-5 4.037 0.21 1.343 0.07 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.21 2055 2055 684 0.403 0.02 1341.263 68.27 68.36 682761 205 683649 2.664 0.14 0.14 1356 1356 5.990 0.30 3049 113.804 5.79 479.177 24.39 30.48 243921 57931 304902 14.487 0.74 0.74 7374 7374 0.198 0.01 0.000 0.00 0.111 0.01 0.277 0.01 0.720 0.04 101 0.01 2. 3. Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 101 141 0.06 Important Remarks: 1. 0 56 366 564 1000000