ISSI IS64C6416-20KA2 High-speed, 1,048,576-bit static ram Datasheet

ISSI
IS64C6416
®
ADVANCED INFORMATION
JANUARY 2003
FEATURES
•
•
•
•
•
High-speed access time: 15 and 20 ns
CMOS low power operation
TTL compatible interface levels
Single 5V ± 10% power supply
Fully static operation: no clock or refresh
required
• Three state outputs
• Industrial temperature available
• Available in 44-pin SOJ package and
44-pin TSOP (Type II)
DESCRIPTION
The ISSI IS64C6416 is a high-speed, 1,048,576-bit static RAM
organized as 65,536 words by 16 bits. It is fabricated using
ISSI's high-performance CMOS technology. This highly reliable
process coupled with innovative circuit design techniques,
yields access times as fast as 10 ns with low power consumption.
When CE is HIGH (deselected), the device assumes a standby
mode at which the power dissipation can be reduced down
with CMOS input levels.
Easy memory expansion is provided by using Chip Enable
and Output Enable inputs, CE and OE. The active LOW Write
Enable (WE) controls both writing and reading of the memory.
A data byte allows Upper Byte (UB) and Lower Byte (LB)
access.
The IS64C6416 is packaged in the JEDEC standard 44-pin
400-mil SOJ and 44-pin TSOP (Type II).
FUNCTIONAL BLOCK DIAGRAM
A0-A15
DECODER
64K x 16
MEMORY ARRAY
I/O
DATA
CIRCUIT
COLUMN I/O
VCC
GND
I/O0-I/O7
Lower Byte
I/O8-I/O15
Upper Byte
CE
OE
WE
CONTROL
CIRCUIT
UB
LB
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any
time without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are
advised to obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00A
01/07/03
1
ISSI
IS64C6416
®
PIN CONFIGURATIONS
44-Pin SOJ
44-Pin TSOP (Type II)
A15
1
44
A0
A14
2
43
A1
A13
3
42
A2
A12
4
41
OE
A11
5
40
UB
CE
6
39
LB
I/O0
7
38
I/O15
I/O1
8
37
I/O14
I/O2
9
36
I/O13
I/O3
10
35
I/O12
Vcc
11
34
GND
GND
12
33
Vcc
I/O4
13
32
I/O11
I/O5
14
31
I/O10
I/O6
15
30
I/O9
I/O7
16
29
I/O8
WE
17
28
NC
A10
18
27
A3
A9
19
26
A4
A8
20
25
A5
A7
21
24
A6
NC
22
23
NC
A15
A14
A13
A12
A11
CE
I/O0
I/O1
I/O2
I/O3
Vcc
GND
I/O4
I/O5
I/O6
I/O7
WE
A10
A9
A8
A7
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
A0
A1
A2
OE
UB
LB
I/O15
I/O14
I/O13
I/O12
GND
Vcc
I/O11
I/O10
I/O9
I/O8
NC
A3
A4
A5
A6
NC
PIN DESCRIPTIONS
A0-A15
Address Inputs
I/O0-I/O15
Data Inputs/Outputs
CE
Chip Enable Input
OE
Output Enable Input
WE
Write Enable Input
LB
Lower-byte Control (I/O0-I/O7)
UB
Upper-byte Control (I/O8-I/O15)
NC
No Connection
Vcc
Power
GND
Ground
2
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00A
01/07/03
ISSI
IS64C6416
®
TRUTH TABLE
Mode
Not Selected
Output Disabled
Read
Write
WE
CE
OE
LB
UB
X
H
X
H
H
H
L
L
L
H
L
L
L
L
L
L
L
L
X
H
X
L
L
L
X
X
X
X
X
H
L
H
L
L
H
L
X
X
H
H
L
L
H
L
L
I/O PIN
I/O0-I/O7
I/O8-I/O15
High-Z
High-Z
High-Z
DOUT
High-Z
DOUT
DIN
High-Z
DIN
High-Z
High-Z
High-Z
High-Z
DOUT
DOUT
High-Z
DIN
DIN
Vcc Current
ISB1, ISB2
ICC1, ICC2
ICC1, ICC2
ICC1, ICC2
1
2
3
4
ABSOLUTE MAXIMUM RATINGS(1)
Symbol
VTERM
TSTG
PT
IOUT
Parameter
Terminal Voltage with Respect to GND
Storage Temperature
Power Dissipation
DC Output Current (LOW)
Value
–0.5 to +7.0
–65 to +150
1.5
20
5
Unit
V
°C
W
mA
6
Note:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause
permanent damage to the device. This is a stress rating only and functional operation of the
device at these or any other conditions above those indicated in the operational sections
of this specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect reliability.
7
8
OPERATING RANGE
Options
A1
A2
A3
Ambient Temperature
–40°C to +85°C
–40°C to +105°C
–40°C to +125°C
9
VCC
5V ± 10%
5V ± 10%
5V ± 10%
10
11
12
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00A
01/07/03
3
ISSI
IS64C6416
®
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Symbol
Parameter
Test Conditions
Min.
Max.
Unit
VOH
Output HIGH Voltage
VCC = Min., IOH = –4.0 mA
2.4
—
V
VOL
Output LOW Voltage
VCC = Min., IOL = 8.0 mA
—
0.4
V
VIH
Input HIGH Voltage
2.5
VCC + 0.5
V
VIL
Input LOW Voltage(1)
–0.5
0.8
V
ILI
Input Leakage
GND ≤ VIN ≤ VCC
–2
2
µA
ILO
Output Leakage
GND ≤ VOUT ≤ VCC, Outputs Disabled
–2
2
µA
Notes:
1. VIL (min.) = –3.0V for pulse width less than 10 ns.
POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)
-15
Min. Max.
-20
Min. Max.
Symbol Parameter
Test Conditions
Unit
ICC
Vcc Dynamic Operating
Supply Current
VCC = Max.,
IOUT = 0 mA, f = MAX
A1
A2
A3
—
—
—
250
—
—
—
—
—
—
255
260
mA
ISB1
TTL Standby Current
(TTL Inputs)
VCC = Max.,
VIN = VIH or VIL
CE > VIH , f = max
A1
A2
A3
—
—
—
50
—
—
—
—
—
—
55
55
mA
ISB2
CMOS Standby
Current (CMOS Inputs)
VCC = Max.,
CE > VCC – 0.2V,
VIN > VCC – 0.2V, or
VIN ≤ 0.2V, f = 0
A1
A2
A3
—
—
—
5
—
—
—
—
—
—
10
15
mA
Note:
1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
CAPACITANCE(1)
Symbol
Parameter
CIN
Input Capacitance
COUT
Input/Output Capacitance
Conditions
Max.
Unit
VIN = 0V
6
pF
VOUT = 0V
8
pF
Note:
1. Tested initially and after any design or process changes that may affect these parameters.
4
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Rev. 00A
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ISSI
IS64C6416
®
AC TEST CONDITIONS
Parameter
Input Pulse Level
Input Rise and Fall Times
Input and Output Timing
and Reference Level
Output Load
Unit
0V to 3.0V
3 ns
1.5V
1
2
See Figures 1 and 2
3
AC TEST LOADS
480 Ω
4
480 Ω
5V
5V
OUTPUT
5
OUTPUT
30 pF
Including
jig and
scope
255 Ω
5 pF
Including
jig and
scope
255 Ω
6
7
Figure 1
Figure 1
8
9
10
11
12
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00A
01/07/03
5
ISSI
IS64C6416
®
READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range)
Symbol
tRC
tAA
tOHA
tACE
tDOE
tHZOE(2)
tLZOE(2)
tHZCE(2
tLZCE(2)
tBA
tHZB
tLZB
Parameter
-15
Min. Max.
-20
Min. Max.
Unit
Read Cycle Time
15
—
20
—
ns
Address Access Time
—
15
—
20
ns
Output Hold Time
3
—
3
—
ns
CE Access Time
—
15
—
20
ns
OE Access Time
—
7
—
9
ns
OE to High-Z Output
0
6
0
8
ns
OE to Low-Z Output
0
—
0
—
ns
CE to High-Z Output
0
6
0
8
ns
CE to Low-Z Output
3
—
3
—
ns
LB, UB Access Time
—
7
—
9
ns
LB, UB to High-Z Output
0
6
0
8
ns
LB, UB to Low-Z Output
0
—
0
—
ns
Notes:
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input
pulse levels of 0 to 3.0V and output loading specified in Figure 1.
2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not
100% tested.
3. Not 100% tested.
6
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00A
01/07/03
ISSI
IS64C6416
®
AC WAVEFORMS
1
READ CYCLE NO. 1(1,2) (Address Controlled) (CE = OE = VIL, UB or LB = VIL)
t RC
2
ADDRESS
t AA
t OHA
t OHA
DOUT
3
DATA VALID
PREVIOUS DATA VALID
READ1.eps
4
READ CYCLE NO. 2(1,3)
5
t RC
ADDRESS
t AA
t OHA
6
t HZOE
7
OE
t DOE
t LZOE
CE
t ACE
8
t HZCE
t LZCE
LB, UB
DOUT
HIGH-Z
t LZB
t BA
t HZB
9
DATA VALID
UB_CEDR2.eps
10
Notes:
1. WE is HIGH for a Read Cycle.
2. The device is continuously selected. OE, CE, UB, or LB = VIL.
3. Address is valid prior to or coincident with CE LOW transition.
11
12
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00A
01/07/03
7
ISSI
IS64C6416
®
WRITE CYCLE SWITCHING CHARACTERISTICS(1,3) (Over Operating Range)
Symbol Parameter
-15
Min. Max.
-20
Min. Max.
Unit
tWC
Write Cycle Time
15
—
20
—
ns
tSCE
CE to Write End
10
—
12
—
ns
tAW
Address Setup Time
to Write End
10
—
12
—
ns
tHA
Address Hold from Write End
0
—
0
—
ns
tSA
Address Setup Time
0
—
0
—
ns
tPWB
LB, UB Valid to End of Write
10
—
12
—
ns
tPWE1
WE Pulse Width (OE =High)
10
—
12
—
ns
tPWE2
WE Pulse Width (OE=Low)
10
—
12
—
ns
tSD
Data Setup to Write End
7
—
9
—
ns
tHD
Data Hold from Write End
0
—
0
—
ns
(2)
tHZWE
WE LOW to High-Z Output
—
7
—
9
ns
(2)
tLZWE
WE HIGH to Low-Z Output
3
—
3
—
ns
Notes:
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input
pulse levels of 0 to 3.0V and output loading specified in Figure 1.
2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not
100% tested.
3. The internal write time is defined by the overlap of CE LOW and UB or LB, and WE LOW. All signals
must be in valid states to initiate a Write, but any one can go inactive to terminate the Write. The
Data Input Setup and Hold timing are referenced to the rising or falling edge of the signal that
terminates the write.
8
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Rev. 00A
01/07/03
ISSI
IS64C6416
®
AC WAVEFORMS
WE Controlled)(1,2)
WRITE CYCLE NO. 1 (WE
1
2
t WC
VALID ADDRESS
ADDRESS
t SA
t SCE
3
t HA
CE
t AW
t PWE1
t PWE2
WE
4
t PBW
5
UB, LB
t HZWE
DOUT
DATA UNDEFINED
t LZWE
6
HIGH-Z
t SD
DIN
t HD
7
DATAIN VALID
UB_CEWR1.eps
Notes:
1. WRITE is an internally generated signal asserted during an overlap of the LOW states on the CE and WE inputs and at
least one of the LB and UB inputs being in the LOW state.
2. WRITE = (CE) [ (LB) = (UB) ] (WE).
8
9
10
11
12
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00A
01/07/03
9
ISSI
IS64C6416
®
WRITE CYCLE NO. 2 (OE is HIGH During Write Cycle) (1,2)
t WC
ADDRESS
VALID ADDRESS
t HA
OE
CE
LOW
t AW
t PWE1
WE
t SA
t PBW
UB, LB
t HZWE
DOUT
t LZWE
HIGH-Z
DATA UNDEFINED
t SD
t HD
DATAIN VALID
DIN
UB_CEWR2.eps
WRITE CYCLE NO. 3 (OE is LOW During Write Cycle) (1)
t WC
ADDRESS
VALID ADDRESS
OE
LOW
CE
LOW
t HA
t AW
t PWE2
WE
t SA
t PBW
UB, LB
t HZWE
DOUT
DATA UNDEFINED
t LZWE
HIGH-Z
t SD
DIN
t HD
DATAIN VALID
UB_CEWR3.eps
Notes:
1. The internal write time is defined by the overlap of CE LOW and WE LOW. All signals must be in valid states to initiate a
Write, but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the
rising or falling edge of the signal that terminates the Write.
2. I/O will assume the High-Z state if OE > VIH.
10
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Rev. 00A
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ISSI
IS64C6416
®
WRITE CYCLE NO. 4 (UB/LB Back to Back Write)
t WC
ADDRESS
1
t WC
ADDRESS 1
ADDRESS 2
2
OE
t SA
CE
t HA
t SA
WE
UB, LB
t HA
t PBW
t PBW
WORD 1
WORD 2
t HZWE
DOUT
4
t LZWE
5
HIGH-Z
DATA UNDEFINED
t HD
t SD
DIN
3
LOW
t HD
t SD
DATAIN
VALID
DATAIN
VALID
6
UB_CEWR4.eps
7
8
9
10
11
12
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Rev. 00A
01/07/03
11
ISSI
IS64C6416
®
ORDERING INFORMATION
Temperature Range (A1): –40°C to +85°C
Speed (ns)
15
Order Part No.
Package
IS64C6416-15TA1
IS64C6416-15KA1
44-pin TSOP (Type II)
44-pin 400-mil Plastic SOJ
Temperature Range (A2): –40°C to +105°C
Speed (ns)
20
Order Part No.
Package
IS64C6416-20TA2
IS64C6416-20KA2
44-pin TSOP (Type II)
44-pin 400-mil Plastic SOJ
Temperature Range (A3): –40°C to +125°C
Speed (ns)
20
12
Order Part No.
Package
IS64C6416-20TA3
IS64C6416-20KA3
44-pin TSOP (Type II)
44-pin 400-mil Plastic SOJ
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. 00A
01/07/03
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