55 Commerce Way Woburn, MA 01801 (781) 935 - 4442 (781) 938 - 5867 www.gilway.com GHB-0805-O Description Features !2.0mmx1.25mm SMTLED, 1.1mm THICKNESS. The Super Bright Orange source color devices are !LOW POWER CONSUMPTION. made with DH InGaAlP !WIDE VIEWING ANGLE. Emitting Diode. !IDEAL on GaAs substrate Light FOR BACKLIGHT AND INDICATOR. !VARIOUS COLORS AND LENS TYPES 2.0x1.25mm SMD CHIP LED LAMP AVAILABLE. !PACKAGE : 2000PCS / REEL. Package Dimensions Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is 0.1(0.004") unless otherwise noted. 3. Specifications are subject to change without notice. REV NO: V.1 DATE:DEC/05/2002 PAGE: 1 OF 4 Selection Guide o.. P Pa a art rt N No. No ce D iic SUPER BRIGHT ORANGE (InGaAlP) GHB-0805-O IIv v ((mcd m c dd) (mcd) @ 20 mA L Lens e ens nss T Typ Tyyp pe WATER CLEAR V Viewin Viiiewing ew i n g Angle in n. Miin. T Typ Tyyyp pp.. 70 200 120 ° Note: 1. 1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value. Electrical / Optical Characteristics at TA=25 C S Syym ymbo ymbol mb o l P Pa a aramete r am et er De evic ev ic e TTyyyp pp.. Ma ax xx... Un nit itss T Test e est sstt C Conditio o n d it io nsss peak P eak Wavelength S uper Bright Orange 610 nm I F =20mA D D ominate Wavelength S uper Bright Orange 601 nm I F =20mA S pectral Line Half-width S uper Bright Orange 29 nm I F =20mA pF VF =0V;f=1MHz 2.5 V I F =20mA 10 uA VR = 5V 1/2 C C apacitance Super Bright Orange 30 VF Forward Voltage Super Bright Orange 2 .0 IR Reverse Current S uper Bright Orange Absolute Maximum Ratings at TA=25 C P Paramet Pa a arameter r am e t er S Su up u uper p er er Bri B Bright B Brr igh g h t Orang O Orang r an g e U Unit n nit itss Power dissipation 75 mW DC Forward Current 30 mA Peak Forward Current [1] 1 95 mA Reverse Voltage 5 V Operating/Storage Temperature -40 C To +85 C Note: 1. 1/10 Duty Cycle, 0.1ms Pulse Width. REV NO: V.1 DATE:DEC/05/2002 PAGE: 2 OF 4 REV NO: V.1 DATE:DEC/05/2002 PAGE: 3 OF 4 SMT Reflow Soldering Instructions Number of reflow process shall be less than 2 times and cooling process to normal temperature is required between first and second soldering process. Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm) REV NO: V.1 DATE:DEC/05/2002 PAGE: 4 OF 4