AH215 / ECP100G 1 Watt, High Gain HBT Amplifier Product Features Product Information Product Description • 400 – 2300 MHz • +31.5 dBm P1dB • +46 dBm Output IP3 • 18 dB Gain @ 900 MHz • Single Positive Supply (+5 V) • Lead-free/green/RoHS-compliant SOIC-8 SMT Pkg. Applications • Final stage amplifiers for Repeaters • Mobile Infrastructure • Defense / Homeland Security The AH215 / ECP100 is a high dynamic range driver amplifier in a low-cost surface mount package. The InGaP/GaAs HBT is able to achieve superior performance for various narrowband-tuned application circuits with up to +46 dBm OIP3 and +31.5 dBm of compressed 1-dB power. The part is housed in a lead-free/green/RoHScompliant SOIC-8 package. All devices are 100% RF and DC tested. Operational Bandwidth Test Frequency Gain Input Return Loss Output Return Loss Output P1dB Output IP3 (2) Noise Figure IS-95 Channel Power Units Min MHz MHz dB dB dB dBm dBm dB Typ 400 2 7 3 6 4 5 Pin No. 1 3 6, 7 8 Backside Paddle 2, 4, 5 10 +29 +43.8 W-CDMA Channel Power dBm +23 Operating Current Range , Icc (3) Device Voltage, Vcc mA V 400 Max Parameters 2300 Frequency S21 – Gain S11 S22 Output P1dB Output IP3 IS-95A Channel Power MHz dB dB dB dBm dBm 900 18 -13 -7 +31 +46 1960 12 -11 -10 +32 +46 dBm +25.5 +25.5 W-CDMA Channel Power dBm 2140 11 18 8 +31.5 +45 6.3 +25.5 @ -45 dBc ACPR, 2140 MHz 8 Typical Performance (4) dBm @ -45 dBc ACPR, 1960MHz 1 Function Vref Input Output Vbias GND N/C or GND The product is targeted for use as driver amplifier for various current and next generation wireless technologies such as GPRS, GSM, CDMA, W-CDMA, and UMTS, where high linearity and high power is required. The internal active bias allows the AH215 / ECP100 to maintain high linearity over temperature and operate directly off a +5 V supply. Specifications (1) Parameters Functional Diagram 450 5 Units @ -45 dBc ACPR @ -45 dBc ACPR Noise Figure Supply Bias 500 Typical dB 2140 11 -18 -8 +31.5 +45 +23 7.0 5.5 6.2 +5 V @ 450 mA 4. Typical parameters reflect performance in a tuned application circuit at +25° C. 1. Test conditions unless otherwise noted: 25ºC, +5V Vsupply, 2140 MHz, in tuned application circuit. 2. 3OIP measured with two tones at an output power of +15 dBm/tone separated by 1 MHz. The suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule. 3. This corresponds to the quiescent current or operating current under small-signal conditions into pins 6, 7, and 8. It is expected that the current can increase by an additional 90 mA at P1dB. Pin 1 is used as a reference voltage for the internal biasing circuitry. It is expected that Pin 1 will pull 10.8 mA of current when used with a series bias resistor of R1=51 Ω. (ie. total device current typically will be 461 mA.) Absolute Maximum Rating Parameter Rating Operating Case Temperature Storage Temperature RF Input Power (continuous) Device Voltage Device Current Device Power Junction Temperature -40 to +85 °C -65 to +150 °C +26 dBm +8 V 900 mA 5W +250 °C Operation of this device above any of these parameters may cause permanent damage. Ordering Information Part No. Description 1 Watt, High Linearity InGaP HBT Amplifier AH215-S8* (lead-tin SOIC-8 Pkg) 1 Watt, High Linearity InGaP HBT Amplifier ECP100G* (lead-tin SOIC-8 Pkg) 1 Watt, High Linearity InGaP HBT Amplifier AH215-S8G (lead-free/green/RoHS-compliant SOIC-8 Pkg) AH215-S8PCB900 AH215-S8PCB1960 AH215-S8PCB2140 900 MHz Evaluation Board 1960 MHz Evaluation Board 2140 MHz Evaluation Board * This package is being phased out in favor of the green package type which is backwards compatible for existing designs. Refer to Product Change Notification WJPCN06MAY05TC1 on the WJ website. Specifications and information are subject to change without notice. WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com Page 1 of 9 June 2005 AH215 / ECP100G 1 Watt, High Gain HBT Amplifier Product Information Typical Device Data S-Parameters (Vcc = +5 V, Icc = 450 mA, T = 25°C, calibrated to device leads) S22 0. 4 0.8 6 0. 0 3. 25 3. 0 0 4. 0 4. 0 5. 0. 2 20 5.0 0.2 10.0 5 10.0 5.0 4.0 3.0 2.0 1.0 0.8 0.6 0.4 0 10.0 5.0 4.0 3.0 2.0 1.0 0.8 0.6 0.4 0 10 0.2 15 0.2 10.0 -10. 0 -10. 0 2 -0. 2 -0. -4 .0 -5. 0 .0 -2 Swp Min 0.05GHz -1.0 Swp Min 0.05GHz -0.8 .6 2.5 4 -0 2 . -0 .0 -2 1 1.5 Frequency (GHz) -0.8 0.5 -0 .6 0 .4 -1.0 -0 -3 .0 -10 0 -5 -3 . 0 -4 .0 -5. 0 Gain (dB) 2. 0 DB(GMax) 4 DB(|S[2,1]|) 30 Swp Max 5.05GHz 0. 35 2. 0 6 0. 0.8 1.0 Swp Max 5.05GHz 1.0 S11 Gain and Maximum Stable Gain 40 Notes: The gain for the unmatched device in 50 ohm system is shown as the trace in black color. For a tuned circuit for a particular frequency, it is expected that actual gain will be higher, up to the maximum stable gain. The maximum stable gain is shown in the dashed red line. The impedance loss plots are shown from 0.05 – 5.05 GHz, with markers placed in 0.5 GHz increments. S-Parameters (Vcc = +5 V, Icc = 450 mA, T = 25°C, unmatched 50 ohm system, calibrated to device leads) Freq (MHz) 50 100 200 400 600 800 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 S11 (dB) S11 (ang) S21 (dB) S21 (ang) S12 (dB) S12 (ang) S22 (dB) S22 (ang) -1.23 -1.01 -1.01 -1.03 -1.21 -1.34 -1.52 -2.00 -2.65 -3.86 -6.72 -14.09 -9.98 -4.27 -2.13 -1.24 -0.82 -177.95 178.17 172.63 163.72 155.20 146.17 136.69 126.65 115.04 97.52 86.05 94.99 166.89 157.68 142.95 130.88 120.68 24.07 19.55 15.55 12.03 9.86 8.11 6.92 6.13 5.80 6.01 6.17 6.15 4.98 2.52 -0.42 -3.40 -6.09 122.55 116.55 112.97 98.68 85.80 73.18 61.43 49.60 37.55 21.48 1.700 -23.83 -52.92 -80.08 -100.8 -116.44 -128.99 -40.25 -39.49 -40.13 -38.83 -39.30 -37.70 -37.73 -37.14 -36.23 -36.45 -34.63 -35.91 -36.75 -39.10 -37.80 -38.58 -39.37 17.32 10.63 15.98 10.31 -4.249 -2.398 -16.27 -14.34 -28.50 -46.08 -68.99 -100.68 -147.66 171.86 123.26 89.55 67.22 -1.26 -1.33 -1.17 -0.93 -0.66 -0.83 -0.95 -1.05 -1.04 -1.11 -1.10 -1.00 -0.77 -0.79 -0.81 -0.84 -0.92 -130.4 -155.43 -169.92 179.61 173.43 168.67 166.34 165.13 164.55 166.24 164.44 162.35 158.42 154.12 149.03 144.09 138.4 Application Circuit PC Board Layout Circuit Board Material: Top RF layer is .014” Getek, 4 total layers (0.062” thick) for mechanical rigidity 1 oz copper, Microstrip line details: width = .026”, spacing = .026” The silk screen markers ‘A’, ‘B’, ‘C’, etc. and ‘1’, ‘2’, ‘3’, etc. are used as placemarkers for the input and output tuning shunt capacitors – C8 and C9. The markers and vias are spaced in .050” increments. Specifications and information are subject to change without notice. WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com Page 2 of 9 June 2005 AH215 / ECP100G 1 Watt, High Gain HBT Amplifier Product Information 900 MHz Application Circuit (AH215-S8PCB900) Typical RF Performance at 25°°C Frequency S21 – Gain S11 – Input Return Loss S22 – Output Return Loss Output P1dB Output IP3 900 MHz 18 dB -13 dB -7.0 dB +31 dBm Channel Power +25.5 dBm +46 dBm (+15 dBm / tone, 1 MHz spacing) (@-45 dBc ACPR, IS-95 9 channels fwd) Noise Figure Device / Supply Voltage Quiescent Current (1) 7.0 dB +5 V 450 mA 1. This corresponds to the quiescent current or operating current under small-signal conditions into pins 6, 7, and 8. S11 vs. Frequency 18 -4 -4 16 14 +25°C +85°C 860 880 -12 -16 -40°C 8 840 -8 900 920 -20 840 940 +25°C +85°C 860 Frequency (MHz) 9 32 8 +25°C +85°C 860 880 900 920 940 860 880 900 920 940 Frequency (MHz) ACPR vs. Channel Power 30 +25°C 28 +85°C -40°C -45 +25°C -50 +85°C -40°C -55 -60 -65 880 900 920 24 840 940 860 OIP3 vs. Output Power 880 900 Frequency (MHz) 920 940 47 47 44 41 38 20 21 22 23 24 25 Output Channel Power (dBm) 35 25 26 27 OIP3 vs. Frequency freq. = 900, 901 MHz, +15 dBm +25°C, +15 dBm / tone 50 47 44 41 44 41 38 38 22 19 OIP3 (dBm) 50 OIP3 (dBm) 50 16 19 Output Power (dBm) -70 OIP3 vs. Temperature freq. = 900, 901 MHz, +25°C 13 -40°C -20 840 -40 Frequency (MHz) 10 +85°C IS-95, 9 Ch. Fwd, ±885 KHz offset, 30 KHz Meas BW, 900 MHz 26 -40°C 5 840 +25°C P1 dB vs. Frequency 34 P1 dB (dBm) NF (dB) Noise Figure vs. Frequency 6 -12 Frequency (MHz) 10 7 -8 -16 -40°C ACPR (dBc) 12 S22 (dB) 0 10 OIP3 (dBm) S22 vs. Frequency 0 S11 (dB) S21 (dB) S21 vs. Frequency (MHz) 20 35 -40 -15 10 35 Temperature (°C ) 60 85 35 840 860 880 900 Frequency (MHz) 920 940 Specifications and information are subject to change without notice. WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com Page 3 of 9 June 2005 AH215 / ECP100G 1 Watt, High Gain HBT Amplifier Product Information 1960 MHz Application Circuit (AH215-S8PCB1960) Typical RF Performance at 25°°C Frequency S21 – Gain S11 – Input Return Loss S22 – Output Return Loss Output P1dB Output IP3 1960 MHz 12 dB -11 dB -10 dB +32 dBm Channel Power +25.5 dBm +46 dBm (+17 dBm / tone, 1 MHz spacing) (@-45 dBc ACPR, IS-95 9 channels fwd) Noise Figure Device / Supply Voltage Quiescent Current (1) 5.5 dB +5 V 450 mA 1. This corresponds to the quiescent current or operating current under small-signal conditions into pins 6, 7, and 8. S11 vs. Frequency S22 vs. Frequency 0 16 -5 -5 14 12 +25°C +85°C 10 1940 -15 1950 1960 1970 1980 -25 1930 1990 +25°C +85°C -40°C 1940 1950 Frequency (MHz) 7 P1 dB (dBm) NF (dB) 1980 5 4 2 1 -40°C 1940 1950 -25 1930 1990 1970 29 1980 +85°C -40°C 25 1930 1990 1940 1950 1960 1970 1980 1990 freq. = 1960, 1961 MHz, +25°C 46 OIP3 (dBm) 51 OIP3 (dBm) 50 47 43 39 1970 Frequency (MHz) -40°C OIP3 vs. Output Power 50 1960 1980 1990 1990 +85°C freq. = 1960, 1961 MHz, +15 dBm 55 1950 1980 15 16 17 18 19 20 21 22 23 24 25 26 27 Output Channel Power (dBm) 55 1940 1970 +25°C OIP3 vs. Temperature +25°C, 15 dBm / tone 40 1960 -40 -45 -50 -55 -60 -65 -70 -75 -80 -85 Frequency (MHz) 45 1950 ACPR vs. Channel Power +25°C OIP3 vs. Frequency 35 1930 1940 Frequency (MHz) 31 27 1960 -40°C IS-95, 9 Ch. Fwd. ±885 KHz offset, 30 KHz Meas BW, 1960 MHz Frequency (MHz) OIP3 (dBm) 1970 33 6 0 1930 1960 35 +85°C +85 °C P1 dB vs. Frequency Noise Figure vs. Frequency +25°C +25 °C -15 Frequency (MHz) 8 3 -10 -20 ACPR (dBc) 8 1930 -10 -20 -40°C S22 (dB) 0 S11 (dB) S21 (dB) S21 vs. Frequency 18 42 38 34 35 30 -40 -15 10 35 Temperature ( °C) 60 85 10 12 14 16 18 Output Power (dBm) 20 22 Specifications and information are subject to change without notice. WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com Page 4 of 9 June 2005 AH215 / ECP100G 1 Watt, High Gain HBT Amplifier Product Information 2140 MHz Application Circuit (AH215-S8PCB2140) Typical RF Performance at 25°°C Frequency S21 – Gain S11 – Input Return Loss S22 – Output Return Loss Output P1dB Output IP3 2140 MHz 11 dB -18 dB -8.0 dB +31.5 dBm +45 dBm (+15 dBm / tone, 1 MHz spacing) Channel Power +23 dBm Noise Figure Device / Supply Voltage Quiescent Current (1) 6.2 dB +5 V 450 mA (@-45 dBc ACPR, IS-95 9 channels fwd) 1. This corresponds to the quiescent current or operating current under small-signal conditions into pins 6, 7, and 8. 12 -14 9 +25°C +85°C 3 2120 2130 -5 -18 +25°C -22 +85°C -26 -40°C 2140 2150 2160 -30 2110 2170 2120 2130 2160 2170 +25°C +85°C 2150 2160 2170 +25°C +85°C -40°C 2120 2130 2140 2150 2160 2170 10 35 Temperature (°C ) -65 19 60 20 21 22 23 Output Channel Power (dBm) 85 freq. = 2140, 2141 MHz, 25°C 50 50 47 47 44 41 35 2110 24 OIP3 vs. Output Power OIP3 (dBm) OIP3 (dBm) 35 -15 -40°C -60 38 38 -40 +85°C +25°C, +15 dBm / tone 41 2170 +25°C -55 OIP3 vs. Frequency 44 2160 -50 Frequency (MHz) 47 2150 -45 28 freq. = 2140, 2141 MHz, +15 dBm / tone 2140 ACPR vs. Channel Power 30 24 2110 2130 -40 26 -40°C 2140 2120 Frequency (MHz) 32 P1 dB (dBm) NF (dB) 2150 3GPP W-CDMA, Test Model 1+64 DPCH, ±5MHz offset, 2140 MHz OIP3 vs. Temperature OIP3 (dBm) 2140 P1 dB vs. Frequency Frequency (MHz) 50 -40°C -20 2110 34 2130 +85°C Frequency (MHz) Noise Figure vs. Frequency 2120 +25°C -40°C Frequency (MHz) 9 8 7 6 5 4 3 2 1 0 2110 -10 -15 ACPR (dBc) 0 2110 0 S22 (dB) -10 S11 (dB) S21 (dB) 15 6 S22 vs. Frequency S11 vs. Frequency S21 vs. Frequency 44 41 38 35 2120 2130 2140 2150 Frequency (MHz) 2160 2170 10 12 14 16 18 Output Power (dBm) 20 22 Specifications and information are subject to change without notice. WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com Page 5 of 9 June 2005 AH215 / ECP100G 1 Watt, High Gain HBT Amplifier Product Information Application Note: Reduced Bias Configurations The AH215 / ECP100 can be configured to be operated with lower bias current by varying the bias-adjust resistor – R1. The recommended circuit configurations shown previously in this datasheet have the device operating in Class A operation. Lowering the current has little effect on the gain, OIP3, and P1dB performance of the device, but will slightly lower the ACLR/ACPR performance of the device as shown below. An example of the measured data below represents the AH215 / ECP100 measured and configured for 2.14 GHz applications. It is expected that variation of the bias current for other frequency applications will produce similar performance results. AH215-PCB2140 Performance Data R1 (ohms) 51 68 100 130 180 Icq (mA) 450 400 350 300 250 Pdiss (W) 2.25 2.00 1.75 1.50 1.25 P1dB (dBm) +31.0 +30.9 +30.8 +30.6 +30.5 OIP3 (dBm) +47.1 +46.4 +46.4 +45.5 +43.6 2.14GHz Gain vs. Output Power 11.5 2.14GHz OIP3 vs. Output Power per Tone 50 11 10 OIP3 (dBm) Gain (dB) 45 10.5 Idq=450mA 'Class A' Idq=400mA 9.5 Idq=350mA 9 40 Idq=450mA 'Class A' Idq=400mA Idq=350mA 35 Idq=300mA Idq=300mA Idq=250mA Idq=250mA 8.5 30 16 18 20 22 24 26 28 30 32 10 12 14 Output Power (dBm) W-CDMA ACLR vs. Output Channel Power 18 20 22 24 CW PAE vs. Output Power 100 3GPP W-CDMA, Test Model 1 + 64 DPCH, ±5 MHz offset Idq=450mA 'Class A' -35 Idq=450mA 'Class A' Idq=400mA Idq=400mA -40 Idq=350mA -45 PAE (%) Idq=350mA ACLR (dBc) 16 Power Out per Tone (dBm) Idq=300mA Idq=250mA -50 Idq=300mA Idq=250mA 10 -55 -60 1 -65 12 14 16 18 20 22 24 16 18 20 22 24 26 28 30 32 CW Tone Power Out (dBm) W-CDMA Channel Power Out (dBm) Specifications and information are subject to change without notice. WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com Page 6 of 9 June 2005 AH215 / ECP100G 1 Watt, High Gain HBT Amplifier Product Information AH215-S8 (SOIC-8 Package) Mechanical Information This package may contain lead-bearing materials. The plating material on the leads is SnPb. Outline Drawing Product Marking The component will be marked with an “AH215-S8” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Value: Test: Standard: Class 1B Passes /500V to <1000V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +235° C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. A heatsink underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the device can occur without the use of one. 2. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 3. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 4. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 5. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 6. RF trace width depends upon the PC board material and construction. 7. Use 1 oz. Copper minimum. 8 All dimensions are in millimeters (inches). Angles are in degrees. Land Pattern Thermal Specifications Rating Operating Case Temperature Thermal Resistance (1), Rth Junction Temperature (2), Tjc -40 to +85° C 33° C / W 159° C Notes: 1. The thermal resistance is referenced from the junction-tocase at a case temperature of 85° C. Tjc is a function of the voltage at pins 6 and 7 and the current applied to pins 6, 7, and 8 and can be calculated by: Tjc = Tcase + Rth * Vcc * Icc 2. This corresponds to the typical biasing condition of +5V, 450 mA at an 85° C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247° C. MTTF vs. GND Tab Temperature 1000000 MTTF (million hrs) Parameter 100000 10000 1000 100 50 60 70 80 90 100 Tab temperature (° C) Specifications and information are subject to change without notice. WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com Page 7 of 9 June 2005 AH215 / ECP100G 1 Watt, High Gain HBT Amplifier Product Information AH215-S8G (Lead-Free Package) Mechanical Information This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free (maximum 260°C reflow temperature) and lead (maximum 245°C reflow temperature) soldering processes. Product Marking Outline Drawing The component will be marked with an “AH215-S8G” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Value: Test: Standard: Class 1B Passes /500V to <1000V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 2 at +260° C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. A heatsink underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the device can occur without the use of one. 2. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 3. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 4. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 5. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 6. RF trace width depends upon the PC board material and construction. 7. Use 1 oz. Copper minimum. 8. All dimensions are in millimeters (inches). Angles are in degrees. Mounting Configuration / Land Pattern Thermal Specifications Rating Operating Case Temperature Thermal Resistance (1), Rth Junction Temperature (2), Tjc -40 to +85° C 33° C / W 159° C Notes: 1. The thermal resistance is referenced from the junction-tocase at a case temperature of 85° C. Tjc is a function of the voltage at pins 6 and 7 and the current applied to pins 6, 7, and 8 and can be calculated by: Tjc = Tcase + Rth * Vcc * Icc 2. This corresponds to the typical biasing condition of +5V, 450 mA at an 85° C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247° C. MTTF vs. GND Tab Temperature 1000000 MTTF (million hrs) Parameter 100000 10000 1000 100 50 60 70 80 90 100 Tab temperature (° C) Specifications and information are subject to change without notice. WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com Page 8 of 9 June 2005 AH215 / ECP100G 1 Watt, High Gain HBT Amplifier Product Information ECP100G (SOIC-8 Package) Mechanical Information This package may contain lead-bearing materials. The plating material on the leads is SnPb. Outline Drawing Product Marking The component will be marked with an “ECP100G” designator with an alphanumeric lot code on the top surface of the package. Tape and reel specifications for this part are located on the website in the “Application Notes” section. ESD / MSL Information ESD Rating: Value: Test: Standard: Class 1B Passes between 500 and 1000V Human Body Model (HBM) JEDEC Standard JESD22-A114 MSL Rating: Level 3 at +235° C convection reflow Standard: JEDEC Standard J-STD-020 Mounting Config. Notes 1. A heatsink underneath the area of the PCB for the mounted device is strictly required for proper thermal operation. Damage to the device can occur without the use of one. 2. Ground / thermal vias are critical for the proper performance of this device. Vias should use a .35mm (#80 / .0135”) diameter drill and have a final plated thru diameter of .25 mm (.010”). 3. Add as much copper as possible to inner and outer layers near the part to ensure optimal thermal performance. 4. Mounting screws can be added near the part to fasten the board to a heatsink. Ensure that the ground / thermal via region contacts the heatsink. 5. Do not put solder mask on the backside of the PC board in the region where the board contacts the heatsink. 6. RF trace width depends upon the PC board material and construction. 7. Use 1 oz. Copper minimum. 8. All dimensions are in millimeters (inches). Angles are in degrees. Land Pattern Thermal Specifications Rating Operating Case Temperature Thermal Resistance, Rth (1) Junction Temperature, Tjc (2) -40 to +85° C 33° C / W 159° C Notes: 1. The thermal resistance is referenced from the junctionto-case at a case temperature of 85° C. Tjc is a function of the voltage at pins 6 and 7 and the current applied to pins 6, 7, and 8 and can be calculated by: Tjc = Tcase + Rth * Vcc * Icc 2. This corresponds to the typical biasing condition of +5V, 450 mA at an 85° C case temperature. A minimum MTTF of 1 million hours is achieved for junction temperatures below 247° C. MTTF vs. GND Tab Temperature 1000000 MTTF (million hrs) Parameter 100000 10000 1000 100 50 60 70 80 90 100 Tab temperature (° C) Specifications and information are subject to change without notice. WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: 408-577-6621 • e-mail: [email protected] • Web site: www.wj.com Page 9 of 9 June 2005