plerowTM APM0837-P29 High OIP3 Medium Power Amplifier Module Features Description · S21 = 33.3 dB @ 824 MHz = 32.7 dB @ 849 MHz · NF of 6.6 dB over Frequency · Unconditionally Stable · High OIP3 @ Low Current C o u pl er C o u pl er · Single 5V Supply The plerowTM APM-Series is an internally matched amplifier mini-module for such application band in SMD package with the output P1dB of 29 dBm. It is compactly designed for low current consumption and high OIP3. Integrating all the components for biasing and matching within the module enhances production yield and throughput as well. It passes through the stringent DC, RF, and reliability tests. Not sample test but 100% quality control test is made before packing. Specifications (in Production) Typ. @ T = 25C, Vs = 5 V, Freq. = 837 MHz, Zo.sys = 50 ohm Parameter Unit Frequency Range Min MHz 824 Gain dB 32 Gain Flatness dB Noise Figure dB Output IP3 (1) dBm S11 / S22 (2) dB Output P1dB dBm Typ Max 849 33 44 0.3 0.5 6.6 7.0 More Information Website: www.asb.co.kr E-mail: [email protected] 47 Tel: (82) 42-528-7223 Fax: (82) 42-528-7222 -15 / -9 28 29 sec - Supply Current mA 370 Supply Voltage V 5 Impedance 50 Switching Time (3) 1-stage Single Type Specifications 400 Max. RF Input Power dBm C.W 23 ~ 25 (before fail) Package Type & Size mm Surface Mount Type, 10Wx10Lx3.8H Operating temperature is -40C to +85C. 1) OIP3 is measured with two tones at an output power of 12 dBm / tone separated by 1 MHz. 2) S11/S22 (max) is the worst value within the frequency band. 3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS. Outline Drawing (Unit: mm) plerow Pin Number Function APM0837-P29 2 RF In ASB Inc. 5 RF Out 6 Vs Others Ground (Top View) (Bottom View) Solder Stencil Area Note: 1. The number and size of ground via holes in a circuit board is critical for thermal RF grounding considerations. 2. We recommend that the ground via holes be placed on the bottom of all ground pins for better RF and thermal performance, as shown in the drawing at the left side. (Side View) Ø 0.3 plated thru holes to ground plane 2 x Ø 2.0 plated thru holes to screw on heat sinker (Recommended Footprint) 1/5 www.asb.co.kr February 2009 plerowTM APM0837-P29 High OIP3 Medium Power Amplifier Module S-parameters Typical Performance (Measured) Rx 824~849 MHz +5 V Stability Factor (K) Noise Figure OIP3 2/5 P1dB www.asb.co.kr February 2009 plerowTM APM0837-P29 High OIP3 Medium Power Amplifier Module Output Channel Power (@ ACLR=-45dBc, +/-5MHz Offset) ACLR vs Channel Power OIP3 vs Output Power (@ 1MHz offset, 1-tone power) ** Test Source : Agilent E4433B (3GPP W-CDMA Test Model-1 64DPCH) 3/5 www.asb.co.kr February 2009 plerowTM APM0837-P29 High OIP3 Medium Power Amplifier Module Application Circuit VS + - Tantal or MLC (Multi Layer Ceramic) Capacitor C1 C2 APM IN OUT 1) The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced from the DC supply. The capacitance value may be determined by customer’s DC supply status. The capacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for the best electrical performance. 2) DC blocking capacitors are always necessarily placed at the input and output port for allowing only the RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are included inside the APM module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just in case that the customer wants. The value of C1 & C2 is determined by considering the application frequency. Recommended Soldering Reflow Process Evaluation Board Layout Vs 20~40 sec 260C Ramp-up (3˚C/sec) 200C Ramp-down (6C/sec) OUT IN 150C 60~180 sec 4/5 Size 40x40mm (for APM Series – 10x10mm) www.asb.co.kr February 2009 plerowTM APM0837-P29 High OIP3 Medium Power Amplifier Module Channel Power vs. ACLR Test Configuration APM0837 – P29 Evaluation Board attached with Heat Sink Evaluation Board * In order to prevent damage of D.U.T (APM-Series) from heating, you must to use a properly sized heat sink for testing a module. 5/5 www.asb.co.kr February 2009