Anaren C18A50Z4 Surface mount termination 18 watts, 50î© Datasheet

Model C18A50Z4
Surface Mount Termination
18 Watts, 50Ω
Description
The C18A50Z4 is a high performance RoHS compliant Alumina (Al2O3)
surface mount termination intended as a lower cost alternative to
Aluminum Nitride (AIN) and Beryllium Oxide (BeO). The SMD termination
is well suited to all cellular frequency bands such as: AMPS, GSM, DCS,
PCS, PHS and UMTS. The high power handling makes the part ideal for
terminating 90º hybrids, directional couplers, and for use in isolators.
General Specifications
Resistive Element
Substrate
Terminal Finish
Operating Temperature
Features:
• 18 Watts
• Lowest Cost
Thick film
Alumina Ceramic
Tin over Nickel
-55 to +125°C (see chart)
Tolerance is ±0.010”, unless otherwise specified. Designed to meet of exceed
applicable portions of MIL-E-5400. All dimensions in inches.
• RoHS Compliant
Electrical Specifications
• Alumina Ceramic
• Non-Nichrome Resistive
Element
• Low VSWR
50 ohms, ± 2%
18 Watts
1KHz – 2.3GHz
<1.20:1
Resistance Value:
Power:
Frequency Range:
V.S.W.R.:
Specification based on unit properly installed using suggested mounting instructions
and a 50 ohm nominal impedance. Specifications subject to change without notice
• 100% Tested
Outline Drawing
C18
A50Z4
HATCHED AREA INDICATES
LOCATION OF PROTECTIVE
GLASS COATING
BACK VIEW
0.0600 [1.52]
0.0030 [0.08]
TYP.
0.1130 [2.87]
0.0495 [1.26]
0.0300 [0.76]
0.3750 [9.52]
0.3750 [9.52]
SIDE VIEW
0.0700 [1.78]
TOP VIEW
RF IN
0.0500 [1.27]
DIMENSIONS IN INCHES [MILLIMETERS]
Rev. 5/09/05
Available on Tape
and Reel For Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 544-2414
+44 2392-232392
Model C18A50Z4
Typical Performance:
Power De-rating:
Tape & Reel:
.472
[11.99]
.069
[1.75]
RF IN
.079
[2.01]
Ø.059
[Ø1.50]
.157
[3.99]
.013
[0.33]
.453
[11.51]
.945
[24.00]
.413
[10.49]
C18
A50Z4
.413
[10.49]
.080
[2.03]
DESPOOLING DIRECTION
DIMENSIONS IN INCHES [MILLIMETERS]
Mounting Footprint and Procedure:
0.255 [6.48]
50 ohm line
0.067 [1.70]
0.040 [1.02]
SCREW
(2 PLS.)
SOLDER
PASTE
PC BOARD
HEATSINK
MOUNTING PROCEDURE
Ø0.020 [Ø0.51]
0.450 [11.43]
Dimension given in inches [millimeters]
For best thermal performance the PCB should be soldered to
the heat sink.
USA/Canada:
Toll Free:
Europe:
SOLDER
FILLED VIA
C18
A50Z4
0.040 [1.02]
0.040 [1.02]
Ø0.101 [Ø2.57]
2x 4-40 Screw Hole
(315) 432-8909
(800) 544-2414
+44 2392-232392
Available on Tape and
Reel For Pick and Place
Manufacturing.
1.
Drill thermal vias through PCB and fill with solder.
2.
To ensure good thermal connectivity to heat sink, which is critical for proper
operation drill and tap heatsink and mount PCB to heat sink using screws.
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