Material Content Data Sheet Sales Product Name IPB027N10N3 G MA# MA000801042 Package PG-TO263-3-2 Issued 29. August 2013 Weight* 1564.99 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material non noble metal noble metal non noble metal inorganic material non noble metal non noble metal < 10% silicon phosphorus iron copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus tin silver lead phosphorus iron copper 7440-21-3 7723-14-0 7439-89-6 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-31-5 7440-22-4 7439-92-1 7723-14-0 7439-89-6 7440-50-8 15.455 0.99 0.091 0.01 wire encapsulation leadfinish plating solder heatspreader *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.99 9875 9875 58 0.304 0.02 304.026 19.43 19.46 194266 194 194519 10.857 0.69 0.69 6938 6938 10.030 0.64 6409 110.330 7.05 548.305 35.03 42.72 350359 427264 9.657 0.62 0.62 6170 6170 0.228 0.01 0.001 0.00 0.147 0.01 0.183 0.01 7.001 0.45 0.165 0.01 0.548 0.04 547.666 34.99 70498 146 0.01 0 117 0.47 4474 2. 3. 350 35.04 349947 Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 4684 105 Important Remarks: 1. 146 94 350403 1000000