LXA20T600 Qspeed™ Family 600 V, 20 A X-Series PFC Diode Product Summary IF(AVG) VRRM QRR (Typ at 125 °C) IRRM (Typ at 125 °C) Softness tb/ta (Typ at 125 °C) 20 600 140 5.0 0.4 General Description A V nC A This device has the lowest QRR of any 600V Silicon diode. Its recovery characteristics increase efficiency, reduce EMI and eliminate snubbers. Applications • Power Factor Correction (PFC) Boost Diode • Motor drive circuits • DC-AC Inverters Pin Assignment Features • Low QRR, Low IRRM, Low tRR • High dIF/dt capable (1000A/µs) • Soft recovery Benefits A • Increases efficiency • Eliminates need for snubber circuits • Reduces EMI filter component size & count • Enables extremely fast switching C TO-220AC RoHS Compliant Package uses Lead-free plating and Green mold compound. Halogen free per IEC 61249-2-21. Absolute Maximum Ratings Absolute maximum ratings are the values beyond which the device may be damaged or have its useful life impaired. Functional operation under these conditions is not implied. Symbol Parameter VRRM IF(AVG) IFSM IFSM TJ(MAX) TSTG Peak repetitive reverse voltage Average forward current Non-repetitive peak surge current Non-repetitive peak surge current Maximum junction temperature Storage temperature Lead soldering temperature Power dissipation Peak repetitive reverse voltage PD VRRM Conditions TJ = 150 °C, TC = 100 °C 60 Hz, ½ cycle ½ cycle of t=28 µs Sinusoid, TC=25 °C Leads at 1.6 mm from case, 10 sec TC = 25 °C Rating Units 600 20 105 350 150 –55 to 150 300 125 600 V A A A °C °C °C W V Thermal Resistance Symbol Resistance from: Conditions RθJA RθJC Junction to ambient Junction to case TO-220 TO-220 www.powerint.com Rating Units 62 1.0 °C/W °C/W January 2011 LXA20T600 Electrical Specifications at TJ= 25 °C (unless otherwise specified) Symbol Parameter Conditions Min Typ Max Units - 2.0 2.5 2.3 92 250 3.1 - µA mA V V pF DC Characteristics IR Reverse current VF Forward voltage CJ Junction capacitance VR = 600V, TJ = 25 °C VR = 600V, TJ = 125 °C IF = 20A, TJ = 25 °C IF = 20A, TJ = 150 °C VR = 10V, 1 MHz Dynamic Characteristics tRR Reverse recovery time dI/dt =200 A/µs VR=400 V, IF=20 A QRR Reverse recovery charge dI/dt =200 A/µs VR=400 V, IF=20 A IRRM Maximum reverse recovery current dI/dt =200 A/µs VR=400 V, IF=20 A S t Softness factor = b dI/dt =200 A/µs VR=400 V, IF=20 A ta TJ=25 °C TJ=125 °C TJ=25 °C TJ =125 °C TJ =25 °C TJ=125 °C TJ =25 °C TJ=125 °C - 26.5 41.3 51 140 3.0 5.0 0.7 0.4 80 4.0 - ns ns nC nC A A Note to component engineers: X-Series diodes employ Schottky technologies in their design and construction. Therefore, Component Engineers should plan their test setups to be similar to those for traditional Schottky test setups. (For additional details, see Application Note AN-300.) VR D1 DUT L1 tRR IF dIF/dt ta 15V Pulse generator tb + Rg Q1 0 0.1xIRRM IRRM Figure 1. Reverse Recovery Definitions Figure 2. Reverse Recovery Test Circuit 2 www.powerint.com Rev 1.1 01/11 LXA20T600 400 60 55 50 45 40 35 30 25 20 15 10 5 0 350 Tj=125C 300 250 Tj=25C Cj (pF) IF (A) Electrical Specifications at TJ= 25 °C (unless otherwise specified) 200 150 100 50 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 20 40 60 80 250 140 160 180 50 dIF /dt=500A/us 225 dIF /dt=200A/us 45 200 40 175 tR R (ns) Q R R (nC) 120 Figure 4. Typical Cj vs VR Figure 3. Typical IF vs VF 150 125 35 30 dIF /dt=500A/us 25 dIF /dt=200A/us 100 20 75 15 50 0 5 10 15 20 25 30 0 35 5 10 15 20 25 30 35 IF (A) IF (A) Figure 6. Typical tRR vs IF at TJ = 125 °C Figure 5. Typical QRR vs IF at TJ = 125 °C 40 140 35 120 30 100 25 P (W) IF(AV) (A) 100 VR (V) VF (V) 20 80 60 15 40 10 20 5 0 0 25 50 75 100 125 o Case Temperature, TC ( C) Figure 7. DC Current Derating Curve 150 25 50 75 100 125 150 o Case Temperature, TC ( C) Figure 8. Power Derating Curve 3 Rev 1.1 01/11 www.powerint.com IF(PEAK) (A) LXA20T600 duty cycle=10% 60 55 50 45 40 35 30 25 20 15 10 5 0 duty cycle=30% duty cycle=50% DC 25 50 75 100 T C(°C) 125 150 Figure 9. IF(PEAK) vs TC, f=70 kHz LXA20T600 1 D= 0.5 D = 0.3 D= 0.1 0.1 Zth(j-c)/Rth(j-c) D= 0.05 D= 0.02 D= 0.01 0.01 D=0.005 D=0.002 Single Pulse 0.001 1.E-06 1.E-05 1.E-04 1.E-03 1.E-02 1.E-01 1.E+00 t1(sec) Figure 10. Normalized Maximum Transient Thermal Impedance 4 www.powerint.com Rev 1.1 01/11 LXA20T600 Dimensional Outline Drawings Millimeters Dim MIN MAX A 4.32 4.70 A1 1.14 1.40 A2 2.03 2.79 C 0.34 0.610 D 9.65 10.67 E 2.49 2.59 E1 4.98 5.18 F 0.508 1.016 F1 1.14 1.78 H 14.71 16.51 H1 5.84 6.55 H2 8.51 9.25 H3 3.53 3.96 H4 2.54 3.05 L 12.70 14.22 L1 - 6.35 Mechanical Mounting Method Maximum Torque / Pressure specification Screw through hole in package tab Clamp against package body 1 Newton Meter (nm) or 8.8 inch-pounds (lb-in) 12.3 kilogram-force per square centimeter (kgf/cm2) or 175 lbf/in2 Soldering time and temperature: This product has been designed for use with hightemperature, lead-free solder. The component leads can be subjected to a maximum temperature of 300 °C, for up to 10 seconds. See Application Note AN-303, for more details. Ordering Information Part Number Package Packing LXA20T600 TO-220AC 50 units/tube The information contained in this document is subject to change without notice. 5 Rev 1.1 01/11 www.powerint.com LXA20T600 Revision 1.0 1.1 Notes Released by Qspeed Converted to Power Integrations Document Date 09/09 01/11 6 www.powerint.com Rev 1.1 01/11 LXA20T600 For the latest updates, visit our website: www.powerint.com Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. 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